Display panel, manufacturing method thereof and display device

Abstract

This invention provides a display panel, its manufacturing method, and a display device, relating to the field of display technology. The display panel includes a display area and a non-display area, the non-display area being located around the display area. The display panel includes: a substrate; a first insulating film layer located between the display area and the non-display area, situated on one side of the substrate, with the edge of the first insulating film layer located at a first cutoff position in the non-display area; and a second insulating film layer located between the display area and the non-display area, situated on the side of the first insulating film layer away from the substrate, with the edge of the second insulating film layer located at the first cutoff position. This invention provides a display panel, its manufacturing method, and a display device to reduce the number of process steps in the display panel manufacturing process, increase the production capacity of the display panel, and reduce the manufacturing cost of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Flat panel displays have numerous advantages, including thinness, energy efficiency, and no radiation, leading to their widespread application. Existing flat panel displays mainly include liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs). The display panel is the primary component responsible for the display function in a flat panel display.

[0003] In the fabrication of display panels, a mask exposure process is typically used to form each film layer one by one. Summary of the Invention

[0004] This invention provides a display panel, a method for manufacturing the same, and a display device, to reduce the number of processes involved in the manufacturing of the display panel, increase the production capacity of the display panel, and reduce the manufacturing cost of the display panel.

[0005] In a first aspect, embodiments of the present invention provide a display panel, including a display area and a non-display area, wherein the non-display area is located around the display area, and the display panel includes:

[0006] Substrate;

[0007] A first insulating film layer is located in the display area and the non-display area, on one side of the substrate, and the edge of the first insulating film layer is located at a first cutoff position in the non-display area;

[0008] The second insulating film layer is located in the display area and the non-display area, on the side of the first insulating film layer away from the substrate, and the edge of the second insulating film layer is located at the first cutoff position.

[0009] Secondly, embodiments of the present invention provide a method for manufacturing a display panel, the display panel including a display area and a non-display area, the non-display area being located around the display area, the manufacturing method including:

[0010] Provide substrate;

[0011] A first initial film layer is formed covering the display area and the non-display area;

[0012] A second insulating film layer is formed that covers the display area and the non-display area, with its edge located at a first cutoff position in the non-display area;

[0013] Using the second insulating film layer as a mask, at least a portion of the first initial film layer in the non-display area is etched away to form a first insulating film layer with its edge located at the first cutoff position.

[0014] Thirdly, embodiments of the present invention provide a display device, including the display panel described in the first aspect.

[0015] In the display panel provided by the embodiments of the present invention, both the first insulating film layer and the second insulating film layer terminate at a first termination position in the non-display area, and the edges of the first insulating film layer and the second insulating film layer are flush. Therefore, during the manufacturing process of the display panel, when the first insulating film layer is formed by etching the first initial film layer, the second insulating film layer can be used as a mask when etching the first initial film layer, thus eliminating the need to specially make a mask when etching the first initial film layer, saving a process step, reducing the process flow in the manufacturing process of the display panel, increasing the production capacity of the display panel, and reducing the manufacturing cost of the display panel. Attached Figure Description

[0016] Figure 1 This is a top view structural diagram of a display panel provided in an embodiment of the present invention;

[0017] Figure 2 For along Figure 1 A schematic diagram of the cross-sectional structure along the AA' direction;

[0018] Figure 3 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0019] Figure 4 For along Figure 3 Schematic diagram of the cross-sectional structure in the middle BB' direction;

[0020] Figure 5 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0021] Figure 6 For along Figure 5 A schematic diagram of the cross-sectional structure along the CC' direction;

[0022] Figure 7 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0023] Figure 8 For along Figure 7 A schematic diagram of the cross-sectional structure along the DD' direction;

[0024] Figure 9 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0025] Figure 10 For along Figure 9 A schematic diagram of the cross-sectional structure along the EE' direction;

[0026] Figure 11This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0027] Figure 12 For along Figure 11 Schematic diagram of the cross-sectional structure in the FF' direction;

[0028] Figure 13 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention;

[0029] Figure 14 For along Figure 13 Schematic diagram of the cross-sectional structure in the GG' direction;

[0030] Figure 15 A cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0031] Figure 16 A cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0032] Figure 17 A cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0033] Figure 18 A cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0034] Figure 19 A cross-sectional structural diagram of another display panel provided in an embodiment of the present invention;

[0035] Figure 20 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0036] Figure 21 A flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;

[0037] Figures 22-30 A schematic diagram illustrating the manufacturing process of a display panel according to an embodiment of the present invention;

[0038] Figure 31 A flowchart illustrating another method for manufacturing a display panel according to an embodiment of the present invention;

[0039] Figures 32-40 A schematic diagram illustrating the manufacturing process of another display panel provided in an embodiment of the present invention;

[0040] Figure 41 This is a schematic diagram of a display device provided in an embodiment of the present invention. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0042] Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of the present invention. Figure 2 This is a schematic diagram of the cross-sectional structure along the AA' direction in Figure 1, with reference to... Figure 1 and Figure 2 The display panel includes display area 01 (the area within the dashed box in Figure 1) and non-display area 02 (…). Figure 1 The area outside the dashed box (the non-display area 02) is located around the display area 01. The display panel includes a substrate 10, a first insulating film layer 11, and a second insulating film layer 12. The first insulating film layer 11 is located in both the display area 01 and the non-display area 02. The first insulating film layer 11 is located on one side of the substrate 10. The edge of the first insulating film layer 11 is located at a first cutoff position L1 in the non-display area 02. That is, the first insulating film layer 11 extends from the display area 01 to the non-display area 02 and ends at the first cutoff position L1 in the non-display area 02. The second insulating film layer 12 is located in both the display area 01 and the non-display area 02. The second insulating film layer 12 is located on the side of the first insulating film layer 11 away from the substrate 10. The edge of the second insulating film layer 12 is located at the first cutoff position. That is, the second insulating film layer 12 covers the first insulating film layer 11, extends from the display area 01 to the non-display area 02, and also ends at the first cutoff position L1 in the non-display area 02.

[0043] In the display panel provided by the embodiments of the present invention, the first insulating film layer 11 and the second insulating film layer 12 both terminate at the first termination position L1 in the non-display area 02. The edges of the first insulating film layer 11 and the second insulating film layer 12 are flush. Therefore, during the manufacturing process of the display panel, when etching the first initial film layer to form the first insulating film layer 11, the second insulating film layer 12 can be used as a mask when etching the first initial film layer. This eliminates the need to specially make a mask when etching the first initial film layer, saving a process step, reducing the process flow in the manufacturing process of the display panel, increasing the production capacity of the display panel, and reducing the manufacturing cost of the display panel.

[0044] Figure 3 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 4 For along Figure 3 A schematic diagram of the cross-sectional structure along the BB' direction, for reference. Figure 3 and Figure 4The display panel also includes a third insulating film layer 13 and a fourth insulating film layer 14. The third insulating film layer 13 is located in the display area 01 and the non-display area 02. The third insulating film layer 13 is located between the first insulating film layer 11 and the substrate 10. The edge of the third insulating film layer 13 is located at a second cutoff position L2 in the non-display area 02. That is, the third insulating film layer 13 extends from the display area 01 to the non-display area 02 and terminates at the second cutoff position L2 in the non-display area 02. The fourth insulating film layer 14 is located in the display area 01 and the non-display area 02, between the third insulating film layer 13 and the first insulating film layer 11. The edge of the fourth insulating film layer 14 is located at the second cutoff position L2. That is, the fourth insulating film layer 14 covers the third insulating film layer 13, extends from the display area 01 to the non-display area 02, and also terminates at the second cutoff position L2 in the non-display area 02. In this embodiment of the invention, the third insulating film layer 13 and the fourth insulating film layer 14 are both terminated at the second termination position L2 in the non-display area 02. The edges of the third insulating film layer 13 and the fourth insulating film layer 14 are flush. Therefore, when etching the second initial film layer to form the third insulating film layer 13 during the manufacturing process of the display panel, the fourth insulating film layer 14 can be used as a mask when etching the second initial film layer, thereby saving process steps.

[0045] For example, refer to Figure 3 and Figure 4 The second cutoff position L2 is located between the first cutoff position L1 and the display area 01. The edges of the first insulating film layer 11 and the second insulating film layer 12 are further away from the display area 01 than the edges of the third insulating film layer 13 and the fourth insulating film layer 14. Therefore, the upper first insulating film layer 11 and the second insulating film layer 12 can cover the edges of the lower third insulating film layer 13 and the fourth insulating film layer 14, forming a seal on the edges of the third insulating film layer 13 and the fourth insulating film layer 14, preventing moisture and oxygen from entering the display area 01 of the display panel from the edges of the third insulating film layer 13 and the fourth insulating film layer 14.

[0046] Optionally, refer to Figures 1-4 The first insulating film layer 11 includes an inorganic layer. The first insulating film layer 11 contains inorganic materials. The second insulating film layer 12 includes an organic layer. The second insulating film layer 12 contains organic materials. In this embodiment of the invention, the first insulating film layer 11, which includes inorganic materials, is etched to form using the second insulating film layer 12, which includes organic materials, as a mask.

[0047] In another embodiment, the first insulating film layer 11 may include an organic layer, and the second insulating film layer 12 may include an organic layer.

[0048] In another embodiment, the first insulating film layer 11 may include an organic layer, and the second insulating film layer 12 may include an inorganic layer.

[0049] In another embodiment, the first insulating film layer 11 may include an inorganic layer, and the second insulating film layer 12 may include an inorganic layer.

[0050] For example, refer to Figure 3 and Figure 4 Both the third insulating layer 13 and the fourth insulating layer 14 include inorganic layers, or both include organic layers. During the fabrication of the display panel, the same etching method can be used for the third insulating layer 13 and the fourth insulating layer 14, which are of the same material type. For example, dry etching can be used for the inorganic layer, and exposure and development can be used for the organic layer. Therefore, during the fabrication of the display panel, the third insulating layer 13 and the fourth insulating layer 14 can be formed simultaneously using the same mask and in the same process, thus saving on process steps.

[0051] Optionally, refer to Figure 2 and Figure 4 The display panel also includes a black matrix 21 and multiple color resists 22. The black matrix 21 is located in the display area 01 and the non-display area 02. The black matrix 21 has multiple openings 23 ( Figure 2 and Figure 4 (Using an opening 23 as an example), the opening 23 is located in the display area 01. A color resist 22 is located within the opening 23. Multiple color resists 22 are located in multiple openings 23, and all of the multiple color resists 22 are located in the display area 01. The black matrix 21 includes an opaque material for blocking light transmission. The color resists 22 are used to selectively filter the light that passes through them. Exemplarily, the multiple color resists 22 may include a red color resist, a green color resist, and a blue color resist, whereby the red color resist filters the light passing through it to red, the green color resist filters the light passing through it to green, and the blue color resist filters the light passing through it to blue. Both the black matrix 21 and the color resists 22 are located between the first insulating film layer 11 and the second insulating film layer 12. The second insulating film layer 12 covers the black matrix 21 and the color resist 22. Thus, when the first initial film layer is etched to form the first insulating film layer 11 using the second insulating film layer 12 as a mask, the second insulating film layer 12 can protect the black matrix 21 and the color resist 22 and prevent the black matrix 21 and the color resist 22 from being etched thinner.

[0052] For example, refer to Figure 2 and Figure 4The display panel includes a planarization layer 24, which covers and protects the black matrix 21 and multiple color resists 22. The second insulating film layer 12 is the planarization layer 24 in the display panel. It should be noted that the planarization layer 24 indicates that the film layer is an organic layer with a certain planarization effect, and the material of the planarization layer 24 is not limited; optionally, the planarization layer includes an adhesive layer.

[0053] Figure 5 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 6 For along Figure 5 Schematic diagram of cross-sectional structure in the CC' direction, see reference. Figure 5 and Figure 6 The second insulating film layer 12 includes a black matrix 21 and a plurality of color resists 22. The black matrix 21 is located in the display area 01 and the non-display area 02. The black matrix 21 has a plurality of openings 23, which are located in the display area 01. The color resists 22 are located in the openings 23. In this embodiment of the invention, the combined structure formed by the black matrix 21 and the plurality of color resists 22 is used as the second insulating film layer 12, such that the edge of the black matrix 21 is located at a first cutoff position L1 in the non-display area 02. The edge of the black matrix 21 is flush with the edge of the first insulating film layer 11.

[0054] Optionally, refer to Figure 5 and Figure 6 The display panel also includes a planarization layer 24, which is located in the display area 01 and the non-display area 02. The planarization layer 24 is located on the side of the second insulating film layer 12 away from the substrate 10, and is used to cover and protect the black matrix 21 and multiple color resists 22.

[0055] Optionally, refer to Figure 5 and Figure 6 The edge of the planarization layer 24 is located at the third cutoff position L3 in the non-display area 02. The first cutoff position L1 is located between the third cutoff position L3 and the display area 01. The edge of the planarization layer 24 is further away from the display area 01 than the edge of the first insulating film layer 11. Therefore, the planarization layer 24 located on the upper layer can cover the edge of the first insulating film layer 11 located on the lower layer, forming a seal on the edge of the first insulating film layer 11, preventing moisture and oxygen from entering the display area 01 of the display panel from the edge of the first insulating film layer 11.

[0056] Figure 7 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 8 For along Figure 7 Schematic diagram of cross-sectional structure in the DD' direction, see reference. Figure 7 and Figure 8The display panel also includes a third insulating film layer 13 and a fourth insulating film layer 14. The third insulating film layer 13 is located between the first insulating film layer 11 and the substrate 10, and the fourth insulating film layer 14 is located between the first insulating film layer 11 and the third insulating film layer 13. The edges of the third insulating film layer 13 and the edges of the fourth insulating film layer 14 are both located at the second cutoff position L2 in the non-display area 02. The second cutoff position L2 is located between the first cutoff position L1 and the display area 01. The first cutoff position L1 is located between the second cutoff position L2 and the third cutoff position L3.

[0057] Figure 9 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 10 For along Figure 9 A schematic diagram of the cross-sectional structure along the EE' direction, for reference. Figure 9 and Figure 10 The display panel also includes a display functional layer 25 and a thin-film encapsulation layer 26. The display functional layer 25 is located within the display area 01, between the substrate 10 and the third insulating film layer 13. The thin-film encapsulation layer 26 is located between the display area 01 and the non-display area 02, between the display functional layer 25 and the third insulating film layer 13. The thin-film encapsulation layer 26 covers and seals the display functional layer 25 to prevent moisture and oxygen from corroding it. The edge of the inorganic layer in the thin-film encapsulation layer 26 (typically, the edge of the inorganic layer in the thin-film encapsulation layer 26 is the edge of the thin-film encapsulation layer 26) is located at a fourth cutoff position L4 in the non-display area 02. The thin-film encapsulation layer 26 includes at least one inorganic layer, and the fourth cutoff position L4 is the farthest cutoff position extended by the inorganic layer in the thin-film encapsulation layer 26. The fourth cutoff position L4 is located between the second cutoff position L2 and the display area 01. The edges of the third insulating film layer 13 and the fourth insulating film layer 14 are further away from the display area 01 relative to the edges of the inorganic layers in the thin film encapsulation layer 26. Therefore, the upper third insulating film layer 13 and the fourth insulating film layer 14 can cover the edges of the inorganic layers in the lower thin film encapsulation layer 26, forming a seal against the edges of the inorganic layers in the thin film encapsulation layer 26, preventing moisture and oxygen from entering the display area 01 of the display panel from the edges of the inorganic layers in the thin film encapsulation layer 26.

[0058] For example, refer to Figure 9 and Figure 10 The second cutoff position L2 is located between the first cutoff position L1 and the fourth cutoff position L4. The fourth cutoff position L4 is located between the second cutoff position L2 and the display area 01. The first insulating film layer 11 and the second insulating film layer 12 cover the edges of the third insulating film layer 13 and the fourth insulating film layer 14, and the third insulating film layer 13 and the fourth insulating film layer 14 cover the edges of the inorganic layer in the thin film encapsulation layer 26.

[0059] Figure 11 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 12 For along Figure 11 A schematic diagram of the cross-sectional structure along the FF' direction, for reference. Figure 11 and Figure 12 The second cutoff position L2 is located between the first cutoff position L1 and the fourth cutoff position L4. The fourth cutoff position L4 is located between the second cutoff position L2 and the display area 01. The first cutoff position L1 is located between the second cutoff position L2 and the third cutoff position L3. The planarization layer 24 covers the edge of the first insulating film layer 11 and the edge of the second insulating film layer 12. The first insulating film layer 11 and the second insulating film layer 12 cover the edge of the third insulating film layer 13 and the edge of the fourth insulating film layer 14, and the third insulating film layer 13 and the fourth insulating film layer 14 cover the edge of the inorganic layer in the thin film encapsulation layer 26.

[0060] Figure 13 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention. Figure 14 For along Figure 11 Schematic diagram of cross-sectional structure in the GG' direction, for reference. Figure 13 and Figure 14 The first cutoff position L1 is located between the second cutoff position L2 and the display area 01. The edges of the third insulating film layer 13 and the fourth insulating film layer 14 are further away from the display area 01 than the edges of the first insulating film layer 11 and the second insulating film layer 12. Thus, the upper first insulating film layer 11 and the second insulating film layer 12 expose the lower third insulating film layer 13 and the fourth insulating film layer 14. The exposed third insulating film layer 13 and the fourth insulating film layer 14 can serve as a protective layer to prevent damage to the film layer located between the first cutoff position L1 and the second cutoff position L2 and below the third insulating film layer 13 during the etching process of forming the first insulating film layer 11.

[0061] Figure 15Referring to FIG15, the region between the first cutoff position L1 and the second cutoff position L2 is an over-etched region, which is a cross-sectional structural schematic diagram of another display panel provided in an embodiment of the present invention. In the over-etched region, perpendicular to the plane of the substrate 10, the sum of the thicknesses of the third insulating layer 13 and the fourth insulating layer 14 is D1. In the display region, perpendicular to the plane of the substrate 10, the sum of the thicknesses of the third insulating layer 13 and the fourth insulating layer 14 is D2. D1 is less than D2. In this embodiment of the present invention, due to the over-etching of the first initial film layer during the formation of the first insulating layer 11, a portion of the thickness of the fourth insulating layer 14 in the over-etched region is etched away, or the entire thickness of the fourth insulating layer 14 is etched away, or both the entire thickness of the fourth insulating layer 14 and a portion of the thickness of the third insulating layer 13 are etched away.

[0062] Figure 16 Referring to FIG16, which is a cross-sectional structural diagram of another display panel provided in an embodiment of the present invention, the display panel further includes a first touch metal layer 31 and a second touch metal layer 32. The first touch metal layer 31 is located between the third insulating film layer 13 and the fourth insulating film layer 14. The second touch metal layer 32 is located between the fourth insulating film layer 14 and the first insulating film layer 11.

[0063] For example, refer to Figure 16 The third insulating film layer 13 is a buffer layer, used to prevent moisture from entering the display device during the manufacturing process and to match the stress of the thin-film encapsulation. The fourth insulating film layer 14 is a touch insulating layer, used to separate the first touch metal layer 31 and the second touch metal layer 32. The first insulating film layer 11 is a touch insulating layer covering the second touch metal layer 32. Optionally, refer to... Figure 16 The second insulating film layer 12 is an organic layer, and the first insulating film layer 11 is an inorganic layer. The second insulating film layer 12 can protect the black matrix 21 and multiple color resists 22 on the one hand; on the other hand, the first initial film layer is etched using the second insulating film layer 12 as a mask to form the first insulating film layer 11. That is, the protective layer (second insulating film layer 12) on the side of the black matrix 21 and multiple color resists 22 away from the substrate is used as a mask to etch and form the touch insulating layer (first insulating film layer 11). Therefore, it is not necessary to make a mask specifically when etching the first initial film layer 110, saving a process step, reducing the process flow in the manufacturing process of the display panel, increasing the production capacity of the display panel, and reducing the manufacturing cost of the display panel.

[0064] For example, refer to Figure 16The second touch metal layer 32 may include multiple touch electrodes, which may be self-capacitive or mutual-capacitive touch electrodes. The first touch metal layer 31 may include touch electrode lines connected to the touch electrodes. When multiple touch electrodes are mutual-capacitive touch electrodes, the first touch metal layer 31 may include bridges for connecting adjacent touch electrodes.

[0065] Figure 17 Referring to FIG17, which is a cross-sectional structural schematic diagram of another display panel provided in an embodiment of the present invention, the display panel includes a display functional layer 25 and a driving circuit layer 27. The display functional layer 25 is located within the display area 01, between the substrate 10 and the first insulating film layer 11. The driving circuit layer 27 is located in the display area 01 and the non-display area 02. The inorganic layer in the driving circuit layer 27 also forms multiple grooves 28 in the non-display area 02, and the area where the grooves 28 are located is called the groove area 021. The grooves 28 can prevent cutting cracks generated in the inorganic layer of the driving circuit layer 27 during the cutting of the display panel from propagating towards the display area 01. The second insulating film layer 12 is a planarization layer 24. The groove area 021 is located between the first cutoff position L1 and the display area 01, and the second insulating film layer 12 covers the entire area of ​​the groove area 021. Optionally, the grooves 28 can be filled with an organic layer (not shown in the figure).

[0066] Figure 18 This is a cross-sectional structural diagram of another display panel provided in an embodiment of the present invention, with reference to... Figure 18 The display panel includes a display functional layer 25 and a driving circuit layer 27. The display functional layer 25 is located within the display area 01, between the substrate 10 and the first insulating film layer 11. The driving circuit layer 27 is located in the display area 01 and the non-display area 02. The inorganic layer in the driving circuit layer 27 also forms multiple grooves 28 in the non-display area 02, and the area where the grooves 28 are located is called the groove area 021. The second insulating film layer 12 is a combination structure formed by a black matrix 21 and multiple color resists 22, with a first cutoff position L1 located within the groove area 021. The second insulating film layer 12 covers a portion of the groove area 021.

[0067] For example, refer to Figure 17 and Figure 18 The driving circuit layer 27 includes multiple thin-film transistors 274 (Figure 17 and 18). Figure 18 Only one thin-film transistor 274 is shown in the diagram. The thin-film transistor 274 may include a source, a gate, a drain, and a semiconductor layer. The driving circuit layer 27 may also include a gate insulating layer 271, an interlayer insulating layer 272, and a source / drain passivation layer 273 stacked sequentially in the direction perpendicular to the substrate 10. The recess 28 is formed in the non-display area 02 by the gate insulating layer 271, the interlayer insulating layer 272, and the source / drain passivation layer 273.

[0068] For example, refer to Figure 17 and Figure 18 The thin-film encapsulation layer 26 includes a first inorganic encapsulation layer 261, an organic encapsulation layer 262, and a second inorganic encapsulation layer 263. The organic encapsulation layer 262 is located between the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263. The second inorganic encapsulation layer 263 covers the edge of the organic encapsulation layer 262 to prevent moisture and oxygen from entering the organic encapsulation layer 262. The edges of both the first inorganic encapsulation layer 261 and the second inorganic encapsulation layer 263 are located at a fourth cutoff position L4. The edge of the thin-film encapsulation layer 26 is also located at a fourth cutoff position L4.

[0069] Figure 19 Referring to FIG19, which is a cross-sectional structural schematic diagram of another display panel provided in an embodiment of the present invention, the planarization layer 24 includes an organic layer and an organic material. In one embodiment, the planarization layer 24 includes a negative organic material, that is, the planarization layer 24 is a negative photoresist. The thickness of the planarization layer 24 is approximately 2 μm in the direction perpendicular to the substrate 10, and it has a tangential structure, forming a slope angle θ that satisfies the following condition: θ is greater than 0° and less than 90°. Typically, θ is between 70° and 90°. The thickness of the first insulating film layer 11 is approximately 0.15 μm in the direction perpendicular to the substrate 10, and typically, the thickness is between 0.1 μm and 1 μm. It should be noted that the surface of the planarization layer near the cut edge can be curved or planar. Figure 19 The planar diagram only shows the surface of the planarization layer closest to the cut edge.

[0070] Figure 20 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Figures 22-30 This is a schematic diagram illustrating the manufacturing process of a display panel according to an embodiment of the present invention. (Refer to...) Figure 20 as well as Figure 22 - Figure 30 The manufacturing method includes:

[0071] S101, Provide substrate 10.

[0072] refer to Figure 22 Substrate 10 is provided.

[0073] S102, forming a first initial film layer 110 covering the display area 01 and the non-display area 02.

[0074] refer to Figure 26 A first initial film layer 110 is formed on the substrate 10. The first initial film layer 110 is located in the display area 01 and the non-display area 02.

[0075] S103, a second insulating film layer 12 is formed that covers the display area 01 and the non-display area 02, and whose edge is located at the first cutoff position L1 in the non-display area 02.

[0076] refer to Figure 29 A second insulating film layer 12 is formed on the first initial film layer 110. The second insulating film layer 12 is located in the display area 01 and the non-display area 02, and the edge of the second insulating film layer 12 is located at the first cutoff position L1. The second insulating film layer 12 exposes the first initial film layer 110 located below it.

[0077] S104. Using the second insulating film layer 12 as a mask, at least a portion of the first initial film layer 110 in the non-display area 02 is etched away to form a first insulating film layer 11 with its edge located at the first cutoff position L1.

[0078] refer to Figure 30 Using the second insulating film layer 12 as a mask, the first initial film layer 110 is etched to remove the first initial film layer 110 that is not covered by the second insulating film layer 12, forming a first insulating film layer 11 with its edge located at the first cutoff position L1.

[0079] The method for manufacturing a display panel provided in this embodiment of the invention is used to form the display panel in the above embodiment. After forming a first initial film layer 110 covering the display area 01 and the non-display area 02, the first initial film layer 110 is not etched. Instead, a second insulating film layer 12 is formed on the first initial film layer 110. The second insulating film layer 12 is used as a mask when etching the first initial film layer 110, thereby eliminating the need to specifically make a mask when etching the first initial film layer 110, saving a process step, reducing the process flow in the manufacturing process of the display panel, increasing the production capacity of the display panel, and reducing the manufacturing cost of the display panel.

[0080] Figure 21 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Figures 22-30 This is a schematic diagram illustrating the manufacturing process of a display panel according to an embodiment of the present invention. (Refer to...) Figures 21-30 The manufacturing method includes:

[0081] S201, Provide substrate 10.

[0082] S202, forming a second initial film layer 130 covering the display area 01 and the non-display area 02.

[0083] refer to Figure 23 A second initial film layer 130 is formed on the substrate 10. The second initial film layer 130 is located in the display area 01 and the non-display area 02.

[0084] S203, forming a third initial film layer 140 covering the display area 01 and the non-display area 02.

[0085] refer to Figure 24 A third initial film layer 140 is formed on the substrate 10. The third initial film layer 140 is located in the display area 01 and the non-display area 02.

[0086] S204, etch away at least a portion of the second initial film layer 130 and at least a portion of the third initial film layer 140 in the non-display area 02, form a third insulating film layer 13 with its edge located at the second cutoff position L2 from the second initial film layer 130, and form a fourth insulating film layer 14 with its edge located at the second cutoff position L2 from the third initial film layer 140.

[0087] refer to Figure 25 The second initial film layer 130 is etched to form the third insulating film layer 13, and the third initial film layer 140 is etched to form the fourth insulating film layer 14. The edges of the third insulating film layer 13 and the fourth insulating film layer 14 are both located at the second cutoff position L2.

[0088] Optionally, both the third insulating layer 13 and the fourth insulating layer 14 include inorganic layers, or both include organic layers. During the fabrication of the display panel, the same etching method can be used for the third insulating layer 13 and the fourth insulating layer 14, which are of the same material type. For example, dry etching can be used for the inorganic layer, and wet etching can be used for the organic layer. Thus, during the fabrication of the display panel, the third insulating layer 13 and the fourth insulating layer 14 can be formed simultaneously using the same mask and in the same process, thereby saving on process steps.

[0089] S205, forming a first initial film layer 110 covering the display area 01 and the non-display area 02.

[0090] S206. A black matrix 21 is formed in the display area 01 and the non-display area 02, wherein the black matrix 21 has multiple openings 23, and the openings 23 are located in the display area 01.

[0091] refer to Figure 27 This forms a black matrix 21. The black matrix 21 has an opening 23 in the display area 01.

[0092] S207, Color resist 22 is formed in opening 23.

[0093] refer to Figure 28 Color resist 22 is formed in opening 23.

[0094] S208, a second insulating film layer 12 is formed that covers the display area 01 and the non-display area 02, and whose edge is located at the first cutoff position L1 in the non-display area 02.

[0095] refer to Figure 29 A second insulating film layer 12 is formed on the black matrix 21 and the color resist 22. The edge of the second insulating film layer 12 is located at the first cutoff position L1. The second insulating film layer 12 is a planarization layer 24. The second insulating film layer 12 covers the edge of the black matrix 21 to prevent water vapor and oxygen from entering the display area 01 of the display panel from the edge of the black matrix 21.

[0096] Optionally, the second cutoff position L2 is located between the first cutoff position L1 and the display area 01.

[0097] S209. Using the second insulating film layer 12 as a mask, at least a portion of the first initial film layer 110 in the non-display area 02 is etched away to form a first insulating film layer 11 with its edge located at the first cutoff position L1.

[0098] The method for manufacturing a display panel provided in this embodiment of the invention, based on the above embodiment, involves forming a black matrix 21 and a color resist 22 between a first insulating film layer 11 and a second insulating film layer 12, using a planarization layer 24 as the second insulating film layer 12, and using the second insulating film layer 12 as a mask to etch the first initial film layer 110 to form the first insulating film layer 11. Furthermore, in this embodiment of the invention, after forming the second initial film layer 130 covering the display area 01 and the non-display area 02, the second initial film layer 130 is not etched. Instead, a third initial film layer 140 is formed on the second initial film layer 130, and then both the second initial film layer 130 and the third initial film layer 140 are etched. Thus, there is no need to specifically create a mask when etching the second initial film layer 130, saving a process step, reducing the number of processes in the display panel manufacturing process, increasing the production capacity of the display panel, and reducing the manufacturing cost of the display panel.

[0099] Understandably, when etching the second initial film layer 130 and the third initial film layer 140, since the third initial film layer 140 covers the second initial film layer 130, the third initial film layer 140 is etched first to form the fourth insulating film layer 14. Then the second initial film layer 130 is etched to form the third insulating film layer 13.

[0100] Optionally, the first insulating layer 11 is an inorganic layer, and the second insulating layer 12 is an organic layer. The organic layer can be considered as photoresist, and the etching process of the organic layer is the same as the development process of the organic layer. The patterning process of the organic layer includes: exposure under a mask, followed by etching (i.e., development). The patterning process of the inorganic layer includes: dry etching under a mask, such as ion etching.

[0101] Figure 31 This is a flowchart illustrating another method for manufacturing a display panel according to an embodiment of the present invention. Figure 32 Figure 40 is a schematic diagram illustrating the manufacturing process of another display panel provided in an embodiment of the present invention. (Refer to...) Figures 31-40 The manufacturing method includes:

[0102] S301, Provide substrate 10.

[0103] refer to Figure 32 Substrate 10 is provided.

[0104] S302, forming a second initial film layer 130 covering the display area 01 and the non-display area 02.

[0105] refer to Figure 33 A second initial film layer 130 is formed on the substrate 10. The second initial film layer 130 is located in the display area 01 and the non-display area 02.

[0106] S303, forming a third initial film layer 140 covering the display area 01 and the non-display area 02.

[0107] refer to Figure 34 A third initial film layer 140 is formed on the substrate 10. The third initial film layer 140 is located in the display area 01 and the non-display area 02.

[0108] S304, etch away at least a portion of the second initial film layer 130 and at least a portion of the third initial film layer 140 in the non-display area 02, form a third insulating film layer 13 with its edge located at the second cutoff position L2 from the second initial film layer 130, and form a fourth insulating film layer 14 with its edge located at the second cutoff position L2 from the third initial film layer 140.

[0109] refer to Figure 35 The second initial film layer 130 is etched to form the third insulating film layer 13, and the third initial film layer 140 is etched to form the fourth insulating film layer 14. The edges of the third insulating film layer 13 and the fourth insulating film layer 14 are both located at the second cutoff position L2.

[0110] S305, forming a first initial film layer 110 covering the display area 01 and the non-display area 02.

[0111] refer to Figure 36 A first initial film layer 110 is formed on the substrate 10. The first initial film layer 110 is located in the display area 01 and the non-display area 02.

[0112] S306. A black matrix 21 is formed in the display area 01 and the non-display area 02, wherein the black matrix 21 has multiple openings 23, and the openings 23 are located in the display area 01.

[0113] refer to Figure 37This forms a black matrix 21. The black matrix 21 has an opening 23 in the display area 01.

[0114] S307, Color resist 22 is formed in opening 23.

[0115] refer to Figure 38 Color resist 22 is formed in opening 23.

[0116] S308. Using the second insulating film layer 12 as a mask, at least a portion of the first initial film layer 110 in the non-display area 02 is etched away to form a first insulating film layer 11 with its edge located at the first cutoff position L1.

[0117] The combined structure formed by the black matrix 21 and multiple color resists 22 is used as the second insulating film layer 12. The first initial film layer 110 is etched to form the first insulating film layer 11 using the second insulating film layer 12 as a mask.

[0118] S309, Form a planarization layer 24 located in display area 01 and non-display area 02.

[0119] refer to Figure 40 A planarization layer 24 is formed on the black matrix 21 and the color resist 22.

[0120] Optionally, the edge of the planarization layer 24 is located at the third cutoff position L3 in the non-display area 02, and the first cutoff position L1 is located between the third cutoff position L3 and the display area 01.

[0121] The method for manufacturing a display panel provided in this embodiment of the invention, based on the above embodiment, involves forming a black matrix 21 and color resist 22 on a first initial film layer 110, and using the combined structure formed by the black matrix 21 and multiple color resists 22 as a mask to etch the first initial film layer 110 to form a first insulating film layer 11.

[0122] Optionally, in conjunction with reference Figure 10 , Figure 12 , Figures 22-30 ,as well as Figures 32-40 Before forming the second initial film layer 130 covering the display area 01 and the non-display area 02, the fabrication method further includes:

[0123] A display function layer 25 is formed in the display area 01.

[0124] A thin film encapsulation layer 26 is formed in the display area 01 and the non-display area 02.

[0125] In the thin film encapsulation layer 26, the edge of the inorganic layer is located at the fourth cutoff position L4 in the non-display area 02, and the fourth cutoff position L4 is located between the second cutoff position L2 and the display area 01.

[0126] Optionally, in conjunction with reference Figure 16 , Figures 22-30 ,as well as Figures 32-40 Before forming the third initial film layer 140 covering the display area 01 and the non-display area 02, the fabrication method further includes:

[0127] The first touch metal layer 31 is formed.

[0128] After etching away at least a portion of the second initial film layer 130 and at least a portion of the third initial film layer 140 in the non-display area 02, forming a third insulating film layer 13 with its edge located at the second cutoff position L2 from the second initial film layer 130, and forming a fourth insulating film layer 14 with its edge located at the second cutoff position L2 from the third initial film layer 140, the fabrication method further includes:

[0129] A second touch metal layer 32 is formed.

[0130] This invention also provides a display device. Figure 41 This is a schematic diagram of a display device provided in an embodiment of the present invention. See also: Figure 41 The display device includes any of the display panels provided in the embodiments of the present invention. Specifically, the display device can be a mobile phone, a tablet computer, or a smart wearable device, etc.

[0131] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel comprising a display area and a non-display area, the non-display area being located at a periphery of the display area, characterized in that, The display panel includes: Substrate; A first insulating film layer is located in the display area and the non-display area, on one side of the substrate, and the edge of the first insulating film layer is located at a first cutoff position in the non-display area; The second insulating film layer is located in the display area and the non-display area, and is located on the side of the first insulating film layer away from the substrate, with the edge of the second insulating film layer located at the first cutoff position; The display panel further includes: a black matrix located in the display area and the non-display area, with multiple openings, the openings being located in the display area; multiple color resists located in the openings; the black matrix and the color resists are both located between the first insulating film layer and the second insulating film layer; or, The second insulating film layer includes a black matrix and multiple color resists; the black matrix is ​​located in the display area and the non-display area, and has multiple openings, the openings being located in the display area; the color resists are located in the openings.

2. The display panel of claim 1, wherein, Also includes: A third insulating film layer is located between the display area and the non-display area, between the first insulating film layer and the substrate, and the edge of the third insulating film layer is located at a second cutoff position in the non-display area. The fourth insulating film layer is located between the display area and the non-display area, between the third insulating film layer and the first insulating film layer, and the edge of the fourth insulating film layer is located at the second cutoff position.

3. The display panel of claim 2, wherein, The second cutoff position is located between the first cutoff position and the display area.

4. The display panel of claim 1, wherein, The first insulating film layer includes an inorganic layer, and the second insulating film layer includes an organic layer.

5. The display panel of claim 1, wherein, When both the black matrix and the color resist are located between the first insulating film layer and the second insulating film layer, the method further includes: The display functional layer is located within the display area and between the substrate and the first insulating film layer; A driving circuit layer is located in the display area and the non-display area. The inorganic layer in the driving circuit layer also forms multiple grooves in the non-display area. The area where the grooves are located is called the groove area. The recessed area is located between the first cutoff position and the display area.

6. The display panel according to claim 1, wherein when the second insulating film layer comprises a black matrix and a plurality of color resists, it is characterized in that, Also includes: A planarization layer is located in the display area and the non-display area, on the side of the second insulating film layer away from the substrate.

7. The display panel of claim 6, wherein, The edge of the planarization layer is located at the third cutoff position in the non-display area; The first cutoff position is located between the third cutoff position and the display area.

8. The display panel of claim 1, wherein, When the second insulating film layer includes a black matrix and multiple color resists, it also includes: The display functional layer is located within the display area and between the substrate and the first insulating film layer; A driving circuit layer is located in the display area and the non-display area. The inorganic layer in the driving circuit layer also forms multiple grooves in the non-display area. The area where the grooves are located is called the groove area. The first cutoff position is located within the groove area.

9. The display panel of claim 2, wherein, Also includes: The display functional layer is located within the display area and between the substrate and the third insulating film layer; A thin-film encapsulation layer is located between the display area and the non-display area, between the display functional layer and the third insulating film layer, and the edge of the inorganic layer in the thin-film encapsulation layer is located at the fourth cutoff position in the non-display area; The fourth cutoff position is located between the second cutoff position and the display area.

10. The display panel of claim 2, wherein, The first cutoff position is located between the second cutoff position and the display area.

11. The display panel of claim 10, wherein, The region between the first cutoff position and the second cutoff position is an over-etched region; In the direction perpendicular to the plane of the substrate, in the over-etched area, the sum of the thicknesses of the third insulating layer and the fourth insulating layer is D1, and in the display area, the sum of the thicknesses of the third insulating layer and the fourth insulating layer is D2, where D1 is less than D2.

12. The display panel of claim 2, wherein, Also includes: The first touch metal layer is located between the third insulating film layer and the fourth insulating film layer; The second touch metal layer is located between the fourth insulating film layer and the first insulating film layer.

13. A manufacturing method of a display panel, the display panel comprising a display area and a non-display area, the non-display area being located at a periphery of the display area, characterized in that, The manufacturing method includes: Provide substrate; A first initial film layer is formed covering the display area and the non-display area; A second insulating film layer is formed that covers the display area and the non-display area, with its edge located at a first cutoff position in the non-display area; Using the second insulating film layer as a mask, at least a portion of the first initial film layer in the non-display area is etched away to form a first insulating film layer with its edge located at the first cutoff position; The method further includes, before forming a second insulating film layer covering the display area and the non-display area, with its edge located at a first cutoff position in the non-display area, the method further includes: forming a black matrix located in the display area and the non-display area, wherein the black matrix has multiple openings located in the display area; and forming a color resist in the openings. or, Forming a second insulating film layer covering the display area and the non-display area, with its edge located at a first cutoff position in the non-display area, includes: forming a black matrix located in the display area and the non-display area, wherein the black matrix has a plurality of openings located in the display area; and forming a color resist in the openings.

14. The method of manufacturing according to claim 13, wherein, Before forming the first initial film layer covering the display area and the non-display area, the method further includes: A second initial film layer is formed covering the display area and the non-display area; A third initial film layer is formed covering the display area and the non-display area; Etching removes at least a portion of the second initial film layer and at least a portion of the third initial film layer in the non-display area, forming a third insulating film layer with its edge located at a second cutoff position from the second initial film layer, and forming a fourth insulating film layer with its edge located at the second cutoff position from the third initial film layer.

15. The method of manufacturing according to claim 14, wherein, The second cutoff position is located between the first cutoff position and the display area.

16. The method of manufacturing of claim 13, wherein, The first insulating film layer is an inorganic layer, and the second insulating film layer is an organic layer.

17. The method of manufacturing of claim 13, wherein, When forming a second insulating film layer covering the display area and the non-display area, with its edge located at a first cutoff position in the non-display area, the method includes: forming a black matrix located in the display area and the non-display area, the black matrix having multiple openings, the openings being located in the display area; and when forming a color resist in the openings, after using the second insulating film layer as a mask to etch away at least a portion of the first initial film layer in the non-display area to form the first insulating film layer with its edge located at the first cutoff position, the method further includes: A planarization layer is formed in the display area and the non-display area.

18. The method of manufacturing according to claim 17, wherein, The edge of the planarization layer is located at the third cutoff position in the non-display area; The first cutoff position is located between the third cutoff position and the display area.

19. The method of making of claim 14, wherein, Before forming the second initial film layer covering the display area and the non-display area, the method further includes: Form a display function layer located in the display area; A thin-film encapsulation layer is formed in the display area and the non-display area; Wherein, the edge of the inorganic layer in the thin film encapsulation layer is located at the fourth cutoff position in the non-display area; the fourth cutoff position is located between the second cutoff position and the display area.

20. The method of manufacturing of claim 14, wherein, Before forming the third initial film layer covering the display area and the non-display area, the method further includes: Forming the first touch-sensitive metal layer; After etching away at least a portion of the second initial film layer and at least a portion of the third initial film layer in the non-display area, forming a third insulating film layer with its edge located at a second cutoff position from the second initial film layer, and forming a fourth insulating film layer with its edge located at the second cutoff position from the third initial film layer, the process further includes: A second touch metal layer is formed.

21. A display device comprising: Includes the display panel as described in any one of claims 1-12.

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