Electrical connection structure of a micro speaker

Abstract

The present invention relates to an electrical connection structure of a micro-speaker, comprising a diaphragm, a circuit board, a first voice coil and a second voice coil. The diaphragm has a central portion and a setting hole, the circuit board is arranged at the central portion and corresponding to the setting hole, the first voice coil is arranged at the central portion and its lead is electrically connected to the circuit board, and the second voice coil is arranged at the central portion and its lead is electrically connected to the circuit board. Therefore, the electrical connection structure of the micro-speaker of the present invention can simplify the circuit connection method of the voice coil, and can facilitate the electrical connection operation with the external sound source signal, and can also avoid the situation where the lead is disconnected during assembly and use.

Description

Technical Field

[0001] The present invention provides an electrical connection structure of a micro speaker, and more particularly, relates to an electrical connection structure of a micro speaker that can simplify the circuit connection method of a voice coil, facilitate electrical connection operations with external sound source signals, and avoid lead wire disconnection during assembly and use. Background Art

[0002] In order to facilitate the electrical connection between the voice coil leads and the external sound source signal, a general dual-drive unit micro speaker usually has a circuit board installed on the speaker body to solder the leads of the two voice coils, and further electrically connects the electronic wires connected to the external sound source through the wiring design on the circuit board.

[0003] However, the conventional method will cause the voice coil lead to extend too far to the circuit board contact point, which not only increases the difficulty of welding, but also causes the lead length to be too long, resulting in excessive swing amplitude of the lead when the speaker vibrates, causing the lead to hit other components and produce abnormal sound distortion, and there is also a risk of breakage.

[0004] Therefore, how to invent an electrical connection structure of a micro speaker to simplify the circuit connection method of the voice coil and facilitate the electrical connection operation with the external sound source signal, while avoiding the situation where the lead wire is broken during assembly and use, will be the active disclosure of the present invention. Summary of the invention

[0005] In view of the above-mentioned technical defects, the inventor felt that it was not perfect, so he exhausted his mind to carefully study and overcome them, and then developed an electrical connection structure of a micro speaker, in order to simplify the circuit connection method of the voice coil, and facilitate the electrical connection operation with the external sound source signal, while avoiding the situation where the lead wires are broken during assembly and use.

[0006] To achieve the above-mentioned and other purposes, the present invention provides a micro-speaker electrical connection structure, comprising: a diaphragm, a circuit board, a first voice coil and a second voice coil. The diaphragm includes a central portion and a setting hole, and the setting hole is provided in the central portion; the circuit board is provided in the central portion, and the circuit board includes a first wiring area and a second wiring area, and the first wiring area and the second wiring area are located in the setting hole, and the first wiring area is provided with a first voice coil contact, a second voice coil contact and a first conductive contact, and the second wiring area is provided with a third voice coil contact, a fourth voice coil contact and a second conductive contact; the first voice coil is provided in the central portion, and the first voice coil includes a first lead and a second lead, and the first lead is electrically connected to the first voice coil contact, and the second lead is electrically connected to the third voice coil contact; the second voice coil is provided in the central portion, and the second voice coil includes a third lead and a fourth lead, and the third lead is electrically connected to the second voice coil contact, and the fourth lead is electrically connected to the fourth voice coil contact.

[0007] In the electrical connection structure of the micro speaker described above, the first lead line may be parallel to the second lead line, and the third lead line may be parallel to the fourth lead line.

[0008] In the electrical connection structure of the above-mentioned micro-speaker, the diaphragm may include a suspension portion and an assembly portion, the suspension portion is arranged around the central portion, the assembly portion is arranged around the suspension portion, the assembly portion is arranged on a speaker seat, a hollow area is arranged in the center of the speaker seat, the hollow area corresponds to the setting hole and the circuit board, the speaker seat is provided with a first conductive sheet and a second conductive sheet, the first conductive sheet and the second conductive sheet are located at diagonally opposite corners of the hollow area, the first conductive sheet is electrically connected to the first conductive contact through a first silk thread, and the second conductive sheet is electrically connected to the second conductive contact through a second silk thread.

[0009] In the electrical connection structure of the above-mentioned micro-speaker, the speaker seat may be provided with a first voice coil setting area and a second voice coil setting area, the first voice coil setting area is connected and arranged on one side of the hollow area, the second voice coil setting area is connected and arranged on the other side of the hollow area, the first voice coil is arranged in the first voice coil setting area, and the second voice coil is arranged in the second voice coil setting area.

[0010] In the electrical connection structure of the micro speaker described above, the first voice coil setting area may further be provided with a first magnetic loop component, the first voice coil is movably provided in the first magnetic loop component, and the second voice coil setting area may further be provided with a second magnetic loop component, the second voice coil is movably provided in the second magnetic loop component.

[0011] In the electrical connection structure of the above-mentioned micro-speaker, the speaker seat may be provided with a first damper setting area and a second damper setting area, the first damper setting area is connected to one side of the first voice coil setting area, and the second damper setting area is connected to one side of the second voice coil setting area, the first damper setting area is provided with a first damper, and the first damper is connected to the center of the diaphragm through a first damper fixing piece; the second damper setting area is provided with a second damper, and the second damper is connected to the center of the diaphragm through a second damper fixing piece.

[0012] In the electrical connection structure of the micro speaker, the first damper and the second damper may have a first hanging edge portion and a second hanging edge portion respectively.

[0013] In the electrical connection structure of the micro speaker, the first wiring area is disposed on the top and bottom surfaces of the circuit board, or the second wiring area is disposed on the top and bottom surfaces of the circuit board.

[0014] In the electrical connection structure of the micro speaker, the first conductive contact and the second conductive contact are disposed on the same side of the circuit board.

[0015] To achieve the above-mentioned and other purposes, the present invention further provides an electrical connection structure of a micro-speaker, comprising: a diaphragm, a circuit board, a first voice coil, and a second voice coil. The diaphragm includes a central portion and a setting hole, and the setting hole is provided in the central portion; the circuit board is provided in the central portion, and the circuit board includes a first wiring area and a second wiring area, and the first wiring area and the second wiring area are located in the setting hole, and the first wiring area is provided with a first voice coil contact and a first conductive contact, and the second wiring area is provided with a second voice coil contact and a second conductive contact; the first voice coil is provided in the central portion, and the first voice coil includes a first lead and a second lead, and the first lead is electrically connected to the first voice coil contact; the second voice coil is provided in the central portion, and the second voice coil includes a third lead and a fourth lead, and the fourth lead is electrically connected to the second voice coil contact, and the third lead is electrically connected to the second lead.

[0016] In the electrical connection structure of the micro speaker, the first wiring area is disposed on the top and bottom surfaces of the circuit board, or the second wiring area is disposed on the top and bottom surfaces of the circuit board.

[0017] In the electrical connection structure of the micro speaker, the third lead is electrically connected to the second lead via at least one voice coil contact, and the voice coil contact is provided on the circuit board.

[0018] In the electrical connection structure of the micro speaker, the third lead is directly electrically connected to the second lead.

[0019] Therefore, the electrical connection structure of the micro speaker of the present invention can simplify the circuit connection method of the voice coil, and can facilitate the electrical connection operation with the external sound source signal, and can also avoid the situation where the lead wire is broken during assembly and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the combination of a diaphragm and a circuit board according to an embodiment of the present invention;

[0021] Figure 2 It is an exploded schematic diagram of a diaphragm, a circuit board, a first voice coil and a second voice coil according to an embodiment of the present invention;

[0022] Figure 3 It is a schematic diagram of the combination of a diaphragm, a circuit board, a first voice coil and a second voice coil according to an embodiment of the present invention;

[0023] Figure 4 It is an exploded schematic diagram of a diaphragm, a circuit board, a first voice coil, a second voice coil and a speaker seat according to an embodiment of the present invention;

[0024] Figure 5 It is a schematic diagram of the combination of a diaphragm, a circuit board, a first voice coil, a second voice coil and a speaker seat according to an embodiment of the present invention;

[0025] Figure 6 It is an exploded schematic diagram of an embodiment of the present invention without the first magnetic return component and the second magnetic return component;

[0026] Figure 7 It is a schematic diagram of a combination of an embodiment of the present invention without the first magnetic return component and the second magnetic return component;

[0027] Figure 8 It is a cross-sectional schematic diagram of an embodiment of the present invention without the first magnetic return component and the second magnetic return component;

[0028] Fig. 9 is an exploded schematic diagram of a micro speaker according to an embodiment of the present invention;

[0029] Fig.10 A schematic diagram of a micro speaker assembly according to an embodiment of the present invention;

[0030] Fig.11 is another exploded schematic diagram of a micro-speaker according to an embodiment of the present invention;

[0031] Fig.12 Another schematic diagram of a micro-speaker assembly according to an embodiment of the present invention;

[0032] Fig.13 is a schematic cross-sectional view of a micro-speaker according to an embodiment of the present invention;

[0033] Fig.14 Schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil according to the embodiment of the present invention Figure 1 ;

[0034] Fig.15 Schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil according to the embodiment of the present invention Figure 2 ;

[0035] Fig.16 Schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil according to the embodiment of the present invention Figure 3 ;

[0036] Fig.17 Schematic diagram of the connection between the circuit board, the first voice coil and the second voice coil according to the embodiment of the present invention Figure 4 .

[0037] Description of reference numerals:

[0038] 10 Micro speakers

[0039] 1 Diaphragm

[0040] 11Center

[0041] 12 Setting holes

[0042] 13 Suspended edge

[0043] 14 joints

[0044] 15 Setting slots

[0045] 2 Circuit Board

[0046] 21 First wiring area

[0047] 21' First wiring area

[0048] 211'First voice coil contact

[0049] 212' first conductive contact

[0050] 22 Second wiring area

[0051] 22' Second wiring area

[0052] 221' Second voice coil contact

[0053] 222' second conductive contact

[0054] 23 First voice coil contact

[0055] 24 Second voice coil contact

[0056] 25 first conductive contact

[0057] 26Third voice coil contact

[0058] 27 Fourth voice coil contact

[0059] 28 second conductive contact

[0060] 3First voice coil

[0061] 31 First Lead

[0062] 32 Second lead

[0063] 321 Voice Coil Contact

[0064] 4 Second voice coil

[0065] 41 Third Lead

[0066] 411 Voice Coil Contact

[0067] 42 Fourth Lead

[0068] 5 Speaker Seat

[0069] 51 Hollow Area

[0070] 52 first conductive sheet

[0071] 521 First Silk Thread

[0072] 522 Show up

[0073] 523 Show up

[0074] 53 second conductive sheet

[0075] 531 The Second Silk Thread

[0076] 532 Show up

[0077] 533 Show up

[0078] 54First voice coil setting area

[0079] 55 Second voice coil setting area

[0080] 56First wave setting area

[0081] 57 Second wave setting area

[0082] 6The First Wave

[0083] 61 First spring wave fixing piece

[0084] 62 first hanging edge

[0085] 7 The Second Wave

[0086] 71 Second spring wave fixing piece

[0087] 72 Second hanging edge

[0088] 8First magnetic return assembly

[0089] 9 Second magnetic return assembly DETAILED DESCRIPTION

[0090] In order to fully understand the purpose, features and effects of the present invention, the present invention is described in detail through the following specific embodiments and the accompanying drawings, as follows:

[0091] Please refer to Figures 1 to 3 As shown in the figure, the present invention provides an electrical connection structure 1 of a micro speaker, comprising: a diaphragm 1, a circuit board 2, a first voice coil 3 and a second voice coil 4.

[0092] The diaphragm 1 includes a central portion 11 and a setting hole 12. The setting hole 12 is formed in a setting groove 15 (such as Fig. 9 shown).

[0093] The circuit board 2 is disposed in the setting groove 15 of the central portion 11. The circuit board 2 can be a single-sided circuit board. The bottom surface of the circuit board 2 includes a first wiring area 21 and a second wiring area 22. The first wiring area 21 and the second wiring area 22 are located in the setting hole 12. The first wiring area 21 is provided with a first voice coil contact 23, a second voice coil contact 24 and a first conductive contact 25. The first conductive contact 25 is located between the first voice coil contact 23 and the second voice coil contact 24. The second wiring area 22 is provided with a third voice coil contact 26, a fourth voice coil contact 27 and a second conductive contact 28. The third voice coil contact 26 is located between the fourth voice coil contact 27 and the second conductive contact 28.

[0094] The top surface of the first voice coil 3 is disposed on the bottom surface of the center portion 11 . The first voice coil 3 includes a first lead 31 and a second lead 32 . The first lead 31 is electrically connected to the first voice coil contact 23 , and the second lead 32 is electrically connected to the third voice coil contact 26 .

[0095] The top surface of the second voice coil 4 is disposed on the bottom surface of the center portion 11 . The second voice coil 4 includes a third lead 41 and a fourth lead 42 . The third lead 41 is electrically connected to the second voice coil contact 24 , and the fourth lead 42 is electrically connected to the fourth voice coil contact 27 .

[0096] When actually used, the circuit board 2 can be attached to the setting groove 15 of the central portion 11, and the first lead 31 and the second lead 32 are extended from the top surface of the first voice coil 3 and are respectively directly electrically connected to the first voice coil contact 23 and the third voice coil contact 26 on the bottom surface of the circuit board 2, and the third lead 41 and the fourth lead 42 are also extended from the top surface of the second voice coil 4 and are respectively directly electrically connected to the second voice coil contact 24 and the fourth voice coil contact 27 on the bottom surface of the circuit board 2. Therefore, the extension lengths of the first lead 31, the second lead 32, the third lead 41 and the fourth lead 42 are shorter than the extension lengths of the conventional leads. Through the wiring method of the first wiring area 21, the second wiring area 22, the first voice coil contact 23, the second voice coil contact 24, the third voice coil contact 26 and the fourth voice coil contact 27 of the circuit board 2, the first voice coil 3 and the second voice coil 4 can be connected in parallel.

[0097] In addition, in the embodiment of the present invention, due to the wiring method of the first wiring area 21, the second wiring area 22, the first voice coil contact 23, the second voice coil contact 24, the third voice coil contact 26 and the fourth voice coil contact 27 of the circuit board 2, the first lead 31 and the second lead 32 are parallel (or substantially parallel), the third lead 41 and the fourth lead 42 are parallel (or substantially parallel), and the circuit board 2 is arranged in the arrangement groove 15 of the central portion 11 of the diaphragm 1, so that the first lead 31, the second lead 32, the third lead 41 and the fourth lead 42 are respectively connected from the first voice coil 3 and the second voice coil 42. 4, it can be electrically connected to the bottom surface of the circuit board 2, reducing some problems caused by the lengthening of the lead wires in the general conventional operation. Moreover, since the suspended parts of the first lead wire 31, the second lead wire 32, the third lead wire 41 and the fourth lead wire 42 are less than those in the general conventional technology, and the first lead wire 31, the second lead wire 32, the third lead wire 41 and the fourth lead wire 42 are almost flat with the bottom surface of the central part 11 of the diaphragm 1, it can avoid various problems and risks in the use of the speaker caused by the excessive swing amplitude of the first lead wire 31, the second lead wire 32, the third lead wire 41 and the fourth lead wire 42. In this way, the circuit connection method of the first voice coil 3 and the second voice coil 4 can be simplified, and the electrical connection operation with the external sound source signal can be facilitated. At the same time, the first lead wire 31, the second lead wire 32, the third lead wire 41 and the fourth lead wire 42 can be prevented from being disconnected during assembly and use.

[0098] Please refer to Figure 4 and Figure 5As shown in the figure, in an embodiment of the present invention, the diaphragm 1 may include a hanging edge portion 13 and an assembly portion 14, the hanging edge portion 13 is arranged around the central portion 11, and the assembly portion 14 is arranged around the hanging edge portion 13. The assembly portion 14 can be arranged on the top surface of the speaker seat 5, and a hollow area 51 is provided in the center of the speaker seat 5. The hollow area 51 corresponds to the hole 12 and the circuit board 2. The speaker seat 5 can be buried with a partially exposed first conductive sheet 52 and a second conductive sheet 53. The first conductive sheet 52 and the second conductive sheet 53 are located at diagonally opposite corners of the hollow area 51. The first conductive sheet 52 is electrically connected to the first conductive contact 25 through a first silk thread 521, and the second conductive sheet 53 is electrically connected to the second conductive contact 28 through a second silk thread 531.

[0099] In an embodiment of the present invention, the speaker seat 5 may be provided with a first voice coil setting area 54 and a second voice coil setting area 55. The first voice coil setting area 54 is connected to one side of the hollow area 51, and the second voice coil setting area 55 is connected to the other side of the hollow area 51. The first voice coil 3 is provided in the first voice coil setting area 54, and the second voice coil 4 is provided in the second voice coil setting area 55.

[0100] In the above-mentioned embodiment, the hollow area 51 can facilitate the welding operation of the first silk thread 521 and the second silk thread 531. When assembling, the diaphragm 1, the first voice coil 3 and the second voice coil 4 can be assembled into a semi-finished product, and after the assembly part 14 of the diaphragm 1 is combined with the speaker seat 5, the two ends of the first silk thread 521 are respectively electrically connected to the first conductive sheet 52 and the first conductive contact 25 by welding, and the two ends of the second silk thread 531 are also respectively electrically connected to the second conductive sheet 53 and the second conductive contact 28 by welding, and finally the electronic wire (not shown in the figure) connected to the external sound source signal is electrically connected to the first conductive sheet 52 and the second conductive sheet 53. In this way, it is convenient to perform electrical connection operation with the external sound source signal.

[0101] The first conductive sheet 52 and the second conductive sheet 53 can be made of metal (e.g., stainless steel), and can be integrally formed with the speaker seat 5; the first conductive sheet 52 and the second conductive sheet 53 are both disposed in the middle section of the speaker seat 5 (i.e., between the first voice coil 3 and the second voice coil 4) so ​​as to be electrically connected to the first conductive contact 25 and the second conductive contact 28 of the circuit board 2. The first conductive sheet 52 has two exposed surfaces 522 and 523, and the second conductive sheet 53 has two exposed surfaces 532 and 533. The exposed surfaces 522 and 532 adjacent to the circuit board 2 are used to connect the first silk thread 521 and the second silk thread 531, while the other exposed surfaces 523 and 533 are larger in area and are located on the bottom surface of the speaker seat 5 so as to be electrically connected to the electronic wire (not shown in the figure) of the external audio signal.

[0102] Based on the above embodiments, it can be known that the first lead 31, the second lead 32, the third lead 41 and the fourth lead 42 in the present invention are substantially attached to the bottom surface of the diaphragm 1 and then extend to the bottom surface of the circuit board 2, so that the diaphragm 1, the first voice coil 3 and the second voice coil 4 will not swing greatly when vibrating. In addition, when the first silk thread 521 and the second silk thread 531 are assembled, they can be respectively extended to the first conductive sheet 52 and the second conductive sheet 53 after winding an arc, and through the arc of the first silk thread 521 and the second silk thread 531, when the diaphragm 1, the first voice coil 3 and the second voice coil 4 vibrate, the first silk thread 521 and the second silk thread 531 will not be broken at the welding point due to excessive amplitude.

[0103] Please refer to Figures 4 to 13 As shown in the figure, in the embodiment of the present invention, the speaker seat 5 can be provided with a first damper setting area 56 and a second damper setting area 57. The first damper setting area 56 is connected to one side of the first voice coil setting area 54, and the second damper setting area 57 is connected to one side of the second voice coil setting area 55. The first damper setting area 56 is provided with a first damper 6, and the first damper 6 is connected to the bottom surface of the central portion 11 of the diaphragm 1 through a first damper fixing member 61; the second damper setting area 57 is provided with a second damper 7, and the second damper 7 is connected to the bottom surface of the central portion 11 of the diaphragm 1 through a second damper fixing member 71 (as shown in FIG. Figures 6 to 8 shown).

[0104] In the embodiment of the present invention, the first voice coil setting area 54 may further be provided with a first magnetic loop assembly 8, and the first voice coil 3 may be movably arranged on the first magnetic loop assembly 8. The second voice coil setting area 55 may further be provided with a second magnetic loop assembly 9, and the second voice coil 4 may be movably arranged on the second magnetic loop assembly 9 (such as Figures 9 to 13 In addition, the first voice coil setting area 54 may have two C-shaped fixing frames to set the first magnetic return assembly 8, and the second voice coil setting area 55 may have two C-shaped fixing frames to set the second magnetic return assembly 9.

[0105] Thus, the diaphragm 1, the circuit board 2, the first voice coil 3, the second voice coil 4, the speaker seat 5, the first magnetic return component 8, the second magnetic return component 9, the first elastic wave 6 and the second elastic wave 7 mentioned in the above embodiment can constitute a micro speaker 10 (such as Figures 9 to 13 When in use, the micro speaker 10 can be combined with a sound box (not shown in the figure), and the first conductive sheet 52 and the second conductive sheet 53 receive external sound source signals to the circuit board 2, so that the first voice coil 3 and the second voice coil 4 respectively drive the diaphragm 1 to vibrate through the electromagnetic action of the first magnetic return component 8 and the second magnetic return component 9.

[0106] In the embodiment of the present invention, in order to increase the power handling capacity of the micro speaker 10, the present invention can respectively set the first damper 6 and the second damper 7 at the two ends of the long side of the speaker base 5 as required, and respectively connect the diaphragm, the first damper 6 and the second damper 7 through the first damper fixing member 61 and the second damper fixing member 71, so that the first damper 6 and the second damper 7 can play a damping function.

[0107] In the embodiment of the present invention, the hanging edge portion 13, the first damping wave 6 and the second damping wave 7 can be made of the same material, and to enhance the damping function, the first damping wave 6 and the second damping wave 7 can respectively have a first hanging edge portion 62 and a second hanging edge portion 72. The first hanging edge portion 62 and the second hanging edge portion 72 have the same shape as the hanging edge portion 13 but bulge in opposite directions to obtain a better damping effect.

[0108] Please refer to Fig.14 As shown in the figure, in an embodiment of the present invention, the circuit board 2 can be a double-sided circuit board, and a portion of the first wiring area 21 can be arranged on the top surface of the circuit board 2 (such as Fig.14 The dotted line portion of the first wiring area 21 shown in FIG. 1 ), the remaining portion of the first wiring area 21 may be disposed on the bottom surface of the circuit board 2 (eg Fig.14 Similarly, a portion of the second wiring area 22 may be disposed on the top surface of the circuit board 2, and the remaining portion of the second wiring area 22 may be disposed on the bottom surface of the circuit board 2. In addition, when a portion of the first wiring area 21 or a portion of the second wiring area 22 is disposed on the top surface of the circuit board 2, a black plastic sheet may be attached to the top surface of the circuit board 2 to prevent the first wiring area 21 or the second wiring area 22 from being exposed and causing a poor appearance. As described above, by disposing the first wiring area 21 or the second wiring area 22 on both the top and bottom surfaces of the circuit board 2, the electrical connection structure of the micro speaker of the present invention can be set in a suitable parallel mode according to actual needs.

[0109] Please refer to Fig.15 As shown in the figure, in the embodiment of the present invention, the first conductive contact 25 and the second conductive contact 28 can be disposed on the same side of the circuit board 2, such as the short side of the circuit board 2. Figures 4 to 7 , Fig.11 and Fig.12 The first conductive sheet 52 and the second conductive sheet 53 shown can be changed from being disposed at diagonally opposite corners of the hollow area 51 of the speaker seat 5 to being disposed on the same side of the hollow area 51 of the speaker seat 5, such as the short side of the hollow area 51 (the long side of the speaker seat 5), to meet different installation requirements.

[0110] Please refer to Fig.16 and Fig.17As shown in the figure, the present invention further provides an electrical connection structure of a micro speaker, which is different from the electrical connection structure of the above-mentioned micro speaker in that: the circuit board 2 includes a first wiring area 21' and a second wiring area 22', the first wiring area 21' is provided with a first voice coil contact 211' and a first conductive contact 212', the first conductive contact 212' can be electrically connected to the first conductive sheet, the second wiring area 22' is provided with a second voice coil contact 221' and a second conductive contact 222', the second conductive contact 222' can be electrically connected to the second conductive sheet; the first voice coil 3 includes a first lead 31 and a second lead 32, the first lead 31 is electrically connected to the first voice coil contact 211'; the second voice coil 4 includes a third lead 41 and a fourth lead 42, the fourth lead 42 is electrically connected to the second voice coil contact 221', and the third lead 41 is electrically connected to the second lead 32. Therefore, the electrical connection structure of the micro speaker of this embodiment can realize a series connection mode between the first voice coil 3 and the second voice coil 4.

[0111] Please refer to Fig.16 As shown in the figure, in the embodiment of the present invention, the circuit board 2 can be a double-sided circuit board, and a portion of the second wiring area 22' can be arranged on the top surface of the circuit board 2 (such as Fig.16 The second wiring area 22' is a dotted line portion shown in FIG. 1 ), and the rest of the second wiring area 22' can be disposed on the bottom surface of the circuit board 2 (eg Fig.16 Similarly, a portion of the first wiring area 21' may be disposed on the top surface of the circuit board 2, and the remaining portion of the first wiring area 21' may be disposed on the bottom surface of the circuit board 2. In addition, when a portion of the first wiring area 21' or a portion of the second wiring area 22' is disposed on the top surface of the circuit board 2, a black plastic sheet may be attached to the top surface of the circuit board 2 to prevent the first wiring area 21' or the second wiring area 22' from being exposed and causing a poor appearance. As described above, by disposing the first wiring area 21' or the second wiring area 22' on both the top and bottom surfaces of the circuit board 2, the electrical connection structure of the micro-speaker of the present invention can be set in a suitable series connection mode according to actual needs.

[0112] Please refer to Fig.16 As shown in the figure, in the embodiment of the present invention, the third lead 41 can be electrically connected to the second lead 32 ( Fig.16 Taking two voice coil contacts 411 and 321 electrically connected to each other as an example, the voice coil contacts 411 and 321 are disposed on the circuit board 2 .

[0113] Also, please refer to Fig.17 As shown in the figure, in the embodiment of the present invention, the third lead 41 can be directly electrically connected to the second lead 32. As described above, through the different electrical connection methods between the third lead 41 and the second lead 32, the electrical connection structure of the micro speaker of the present invention can be set to a suitable series connection method according to actual needs.

[0114] The present invention has been disclosed in the above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to the embodiments should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be based on the scope of the patent application.

Claims

1. An electrical connection structure of a micro speaker, characterized in that: Include: A diaphragm, comprising a central portion and a setting hole, wherein the setting hole is arranged in the central portion; A circuit board is arranged in the central part, the circuit board includes a first wiring area and a second wiring area, the first wiring area and the second wiring area are located in the setting hole, the first wiring area is provided with a first voice coil contact, a second voice coil contact and a first conductive contact, and the second wiring area is provided with a third voice coil contact, a fourth voice coil contact and a second conductive contact; A first voice coil is disposed at the central portion, the first voice coil comprises a first lead and a second lead, the first lead is electrically connected to the first voice coil contact, and the second lead is electrically connected to the third voice coil contact; as well as The second voice coil is disposed at the center portion. The second voice coil includes a third lead and a fourth lead. The third lead is electrically connected to a contact point of the second voice coil, and the fourth lead is electrically connected to a contact point of the fourth voice coil.

2. The electrical connection structure of the micro-speaker according to claim 1, characterized in that: The first lead is parallel to the second lead, and the third lead is parallel to the fourth lead.

3. The electrical connection structure of the micro-speaker according to claim 1, characterized in that: The diaphragm includes a suspension portion and an assembly portion, the suspension portion is wound around the central portion, the assembly portion is wound around the suspension portion, the assembly portion is set on a speaker seat, a hollow area is set in the center of the speaker seat, the hollow area corresponds to the setting hole and the circuit board, the speaker seat is provided with a first conductive sheet and a second conductive sheet, the first conductive sheet and the second conductive sheet are located at diagonally opposite corners of the hollow area, the first conductive sheet is electrically connected to the first conductive contact through a first brocade wire, and the second conductive sheet is electrically connected to the second conductive contact through a second brocade wire.

4. The electrical connection structure of the micro-speaker according to claim 3, characterized in that: The speaker seat is provided with a first voice coil setting area and a second voice coil setting area, the first voice coil setting area is connected and arranged on one side of the hollow area, the second voice coil setting area is connected and arranged on the other side of the hollow area, the first voice coil is arranged in the first voice coil setting area, and the second voice coil is arranged in the second voice coil setting area.

5. The electrical connection structure of the micro-speaker according to claim 4, characterized in that: The speaker seat is provided with a first elastic wave setting area and a second elastic wave setting area. The first elastic wave setting area is connected to one side of the first voice coil setting area, and the second elastic wave setting area is connected to one side of the second voice coil setting area. The first elastic wave setting area is provided with a first elastic wave, and the first elastic wave is connected to the center of the diaphragm through a first elastic wave fixing component; the second elastic wave setting area is provided with a second elastic wave, and the second elastic wave is connected to the center of the diaphragm through a second elastic wave fixing component.

6. The electrical connection structure of the micro-speaker according to claim 1, characterized in that: The first conductive contact and the second conductive contact are disposed on the same side of the circuit board.

7. An electrical connection structure of a micro speaker, characterized in that: Include: A diaphragm, comprising a central portion and a setting hole, wherein the setting hole is arranged in the central portion; A circuit board is arranged in the central part, the circuit board includes a first wiring area and a second wiring area, the first wiring area and the second wiring area are located in the setting hole, the first wiring area is provided with a first voice coil contact and a first conductive contact, and the second wiring area is provided with a second voice coil contact and a second conductive contact; A first voice coil, disposed at the central portion, the first voice coil comprising a first lead and a second lead, the first lead being electrically connected to the first voice coil contact; as well as The second voice coil is arranged at the center portion. The second voice coil includes a third lead and a fourth lead. The fourth lead is electrically connected to the second voice coil contact point. The third lead is directly electrically connected to the second lead.

8. The electrical connection structure of the micro-speaker according to any one of claims 1 or 7, characterized in that: The first wiring area is arranged on the top and bottom surfaces of the circuit board, or the second wiring area is arranged on the top and bottom surfaces of the circuit board.

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