Thermal storage equipment

Abstract

The present invention relates to a heat storage device (100) using a metal phase change material as a heat storage material (10), comprising: at least one accommodating chamber (12) having an accommodating space (14) for the heat storage material (10) and a housing (16) for the accommodating space (14); at least one heat input device (30) for inputting heat into the at least one accommodating chamber (12); and at least one heat output device (40) for outputting heat from the at least one accommodating chamber (12). A coupling region (32) of the heat input device (30) that is pre-set for thermal coupling with the heat storage material (10) and / or a coupling region (42) of the heat output device (40) that is pre-set for thermal coupling with the heat storage material (10) are arranged to be separated from the heat storage material (10) in at least a portion of the region.

Description

Technical Field

[0001] The invention relates to a heat storage device using a metal phase change material as a heat storage material. Background Art

[0002] The use of heat storage devices based on metallic phase-change materials is known from the literature. These energy storage devices are primarily used in solar thermal power plants. Other applications include regenerative furnaces for building heating, conventional steam power plants (coal-fired, nuclear), catalytic converters for internal combustion vehicles, thermoelectric generators in internal combustion vehicles, and heat recovery in steelmaking. The concepts presented in the literature are generally experimental laboratory-scale configurations. Applications in vehicles, particularly battery-electric buses and cars, are also described. Summary of the Invention

[0003] The object of the present invention is to provide a heat storage device using a metal phase change material as a heat storage material, which enables efficient heat storage with efficient heat input and efficient heat output.

[0004] This object is achieved by the features of the independent claims. Advantageous embodiments and advantages of the invention are apparent from the other claims, the description and the drawings.

[0005] A heat storage device using a metal phase change material as a heat storage material is proposed, comprising: at least one accommodating chamber having a space for accommodating the heat storage material and a housing for the accommodating space; at least one heat input device for inputting heat into the at least one accommodating chamber; and at least one heat output device for outputting heat from the at least one accommodating chamber.

[0006] According to the invention, the coupling region of the heat input device provided for thermal coupling with the heat storage material and / or the coupling region of the heat output device provided for thermal coupling with the heat storage material are arranged at least partially spaced apart from the heat storage material.

[0007] The thermal storage device according to the present invention enables high-temperature thermal storage. Specifically, using a metal phase change material (also known as an mPCM), thermal storage is achieved through latent heat and sensible heat. During the phase transition process, the mPCM can absorb thermal energy in the solid phase without a temperature change until the metal phase change material is completely melted, or release thermal energy in the liquid phase until the metal phase change material is completely solidified.

[0008] Metallic phase-change materials allow for the accumulation of heat over extended periods of time, and in particular, latent and sensible heat. In particular, heat can be accumulated at high temperatures, for example, at least 100°C, preferably at least 500°C, and in particular, approximately 600°C to 650°C. Depending on the type of metallic phase-change material (mPCM), heat can be accumulated at temperatures up to 1500°C. For example, pure silicon with a phase-change temperature of 1414°C or SiB3 with a phase-change temperature of 1385°C can be used.

[0009] Depending on the heat transfer state, the metal phase change material exists in liquid or solid state. A useful phase change material is AlSi 12 .

[0010] If the temperature range is between 25℃ and 600℃, for example, AlSi 12 If used as a metal phase change material, it has an energy density of about 300Wh / kg or about 795Wh / I.

[0011] Typical metal phase change materials mentioned in the literature have high mass fractions of elements such as aluminum, magnesium, or zinc. The typical feature of ordinary phase change materials and metal phase change materials is that the volume changes with the phase change. In addition, metal phase change materials with high specific gravity aluminum, magnesium, or zinc have a volume of about 20 to 30*10 -6 A relatively high coefficient of thermal expansion of the order of 1 / K, in particular compared to other materials commonly used to construct thermal storage devices, for example materials for housings or electric heaters, such as stainless steel, graphite or ceramics.

[0012] During the heat transfer process of a heat storage device based on a metallic phase change material, the temperature of the heat storage material first increases, followed by melting as the melting temperature is reached. During the heating process, the heat storage material in the solid phase expands, while during the melting process, expansion occurs as the phase changes. During the heat release process, these processes occur in the reverse order, with a decrease in volume during the phase change and contraction during the cooling process.

[0013] Due to the volume change during the phase transition, shrinkage cavities (material defects under negative pressure or vacuum) will first form in the area where the thermal storage material of the regenerator solidifies last. Similarly, pores (material defects with trapped gas) may preferably be located in the area where the thermal storage material solidifies last.

[0014] During cooling, the heat storage material generally contracts more strongly than the remaining components, such as the electric heater or the housing, etc. The reason for this is the high coefficient of thermal expansion of the heat storage material.

[0015] These two effects can negatively impact the thermal contact between the heat storage material and the heat input or output device. Besides efficiency, this can also negatively impact the service life of the components, particularly when using resistance heaters. These effects can occur if the physical basis for the formation of material defects is not taken into account during component assembly.

[0016] According to one advantageous design, to ensure thermal contact between the heat input device and the thermal storage material, and between the heat output device and the thermal storage material, the arrangement of the heat input device and the heat output device is selected such that, during normal use of the thermal storage device, shrinkage cavities and / or air holes form in the region where the thermal storage material solidifies last, at locations distal from the heat input device and the heat output device. This can prevent or mitigate adverse changes in the thermal contact between the thermal storage material and the heat input device or the heat output device, positively impacting the service life of the components.

[0017] Compared with the prior art, the heat storage device according to the present invention has a beneficial arrangement structure of the heat input device and the heat output device, so that no shrinkage holes are generated on the heat input device (especially not on the coupling area) and no shrinkage holes are generated on the heat output device (especially not on the coupling area).

[0018] Advantageously, the arrangement of the heat input and heat output can be selected such that gravity has a positive influence on the formation of shrinkage cavities and blowholes.

[0019] According to an advantageous design, thermal contact between the heat input device or heat output device and the heat storage material can be advantageously ensured by flexibly arranging these components relative to one another in the heat storage system, particularly within the heat storage material. In this regard, consideration must be given to the solidification of the heat storage material from the heat output device and the resulting volume reduction, as well as the effects caused by the different coefficients of thermal expansion of the components used. Furthermore, consideration must be given to the influence of the contents of the heat storage material on the effective thermal conductivity within the heat storage device and the associated influence on the solidification of the heat storage material.

[0020] Furthermore, the arrangement of the heat input and heat output can be selected such that, due to the thermal expansion coefficients between the heat storage material and the heat input or heat output, the thermal contact therebetween is additionally improved.

[0021] Advantageously, the phase change material may have a greater coefficient of thermal expansion than the housing material.

[0022] According to one advantageous design, the outer shell of the thermal storage material can be formed from a fiber-reinforced ceramic material. In particular, the outer shell can be formed from a fiber-reinforced, non-oxidizing ceramic material. The fiber-reinforced, non-oxidizing ceramic material can be formed from carbon fiber-reinforced carbon and / or carbon fiber-reinforced silicon carbide and / or silicon carbide fiber-reinforced carbon and / or silicon carbide fiber-reinforced silicon carbide (SiC). Such materials have very low coefficients of thermal expansion. Fiber reinforcement allows for thinner walls.

[0023] Other possible housing materials are ceramics, such as aluminum oxide, zirconium oxide, boron nitride, silicon oxide, aluminum nitride, silicon carbide, boron carbide, etc., and / or such ceramics as a functional layer, for example on a metal substrate, and / or graphite or graphite as a functional layer, and / or surface-treated metals, such as boronized stainless steel, and / or temperature-treated stainless steel, and / or composite materials, such as fiber-reinforced ceramics containing ceramic fibers, such as C or Al2O3, and / or particle-reinforced ceramics, such as WC.

[0024] This makes it possible to achieve a reduced coefficient of thermal expansion compared to metallic phase change materials in a simple manner. Advantageously, the housing can be constructed with a lightweight design. Fiber reinforcement allows for particularly thin walls of the housing.

[0025] Thus, if the corresponding received material is to be repeatedly heated at a high heating rate and cooled at a high cooling rate, the corresponding housing can be advantageously used for receiving the material.

[0026] Sheath materials with high thermal shock resistance, high oxidation resistance, high mechanical stability and, in particular, high corrosion resistance are advantageous. Long-term stable sheaths of phase change materials, which are at least temporarily metallic melts, can be achieved.

[0027] By means of a housing having corresponding wall materials, the metal melt can be enclosed in a stable and long-term manner.

[0028] A high corrosion resistance is obtained. Thus, the housing can be used in connection with metal melts, the temperature of which can be in the range of, for example, up to approximately 600°C or 650°C or even up to 1500°C.

[0029] In principle, the molten metal contained in the housing can be permanently in a liquid state, or it can be only temporarily in a liquid state. For example, the housing can contain a metallic phase change material that is liquid during heat transfer and solid after heat release. This allows for both latent and sensible heat to be stored.

[0030] Advantageously, the wall region of the fiber-reinforced SiC housing, made of the wall material, has a wall thickness of at least 1 mm, particularly at least 2 mm, and at least particularly 2.5 mm, and for example, approximately 3 mm. Preferably, the wall thickness is at most 5 mm. This allows for a mechanically stable wall with high thermal shock resistance. Furthermore, the wall thickness can be kept relatively low, thereby enabling the formation of a low-weight container device.

[0031] The housing can be coated with a suitable thermally insulating material. The insulating material can, for example, contain pyrogenic silica as a thermal insulator. Other materials such as mineral wool, calcium silicate, ceramic fiber (e.g., calcium magnesium silicate), mica, or vacuum insulation can also be advantageously used. Alternatively, other materials with higher thermal conductivity but lower cost can also be used.

[0032] According to an advantageous design, the coupling region of the heat input device and / or the heat output device can be arranged at least partially outside the accommodation space. In particular, the coupling region of the heat input device and / or the heat output device can be arranged at least partially outside the accommodation chamber.

[0033] According to an advantageous embodiment, the coupling region of the heat input device and the coupling region of the heat output device can be arranged on the bottom of the housing outside the receiving space. The coupling region of the heat input device and / or the heat output device can be thermally coupled to the heat storage material via at least one thermal bridge element, wherein the housing comprises at least one thermal bridge element, in particular, wherein the at least one thermal bridge element is arranged on the bottom plate of the housing or is integrated into the bottom plate or realizes the bottom plate.

[0034] In this embodiment, the heat input device (especially its coupling area) and the heat output device (especially its coupling area) can both be located in the bottom surface of the heat storage device, especially in the bottom surface of the receiving chamber of the heat storage device.

[0035] In this way, the heat input and output devices can be directly integrated into the structural elements of the housing (e.g., the baseplate). Therefore, these components are not directly introduced into the chamber containing the thermal storage material. By placing the heat output device on the bottom, solidification begins at the bottom during cooling. Furthermore, gravity also favors solidification toward the bottom. Because the heat input device is also placed on the bottom, it has good thermal contact with the thermal storage material.

[0036] In this way, the heat input device (particularly its coupling region) and the heat output device (particularly its coupling region) can be indirectly connected. The two components do not come into material contact, but rather are only indirectly in thermal contact with the heat storage material via the thermal bridge element. This also prevents undesirable chemical reactions, such as corrosion, from occurring between the heat input device and / or heat output device and the heat storage material.

[0037] According to an advantageous design, the coupling region of the heat input device and / or the heat output device can be arranged at least partially in the accommodation space. In particular, the coupling region of the heat input device and / or the heat output device can be arranged at least partially in the accommodation chamber.

[0038] According to an alternative design, the coupling region of the heat input device can be arranged on the bottom of the housing outside the accommodation space, and the coupling region of the heat output device can be arranged at least partially within the accommodation space, in particular, at least partially within the accommodation chamber. Alternatively, the coupling region of the heat output device can be arranged on the bottom of the housing outside the accommodation space, and the coupling region of the heat input device can be arranged at least partially within the accommodation space, in particular, at least partially within the accommodation chamber. In this case, the coupling region of the heat input device and / or the heat output device can be thermally coupled to the heat storage material via at least one thermal bridge element.

[0039] For example, the heat input device can be located within the thermal storage material, while the heat output device can be located on the bottom surface of the thermal storage device, specifically on the bottom surface of the storage chamber. By placing the heat output device on the bottom surface, solidification begins at the bottom surface during cooling. Furthermore, gravity also favors solidification toward the bottom surface. Advantageously, the heat input device can be placed within the thermal storage material as perpendicularly as possible to the heat output device.

[0040] This advantageously allows it to be arranged parallel to the direction of heat output and, therefore, the direction of solidification. In particular, the direction of solidification plays a decisive role, which in turn depends on the direction of heat output and, therefore, also on the heat output device. This prevents the formation of material defects on the side of the heat input device facing away from the heat output device.

[0041] In another embodiment, the heat input and heat output devices can be arranged interchangeably. This can also achieve beneficial effects during the solidification of the thermal storage material. By placing the heat output device within the thermal storage material, the solidification process begins there. The direction of gravity favors contact with the bottom surface.

[0042] According to one advantageous design, the coupling region of the heat input device and / or heat output device can be thermally coupled to the thermal storage material via at least one thermal bridge element. In this embodiment, the heat input device and the heat output device can be indirectly connected. The two components do not come into material contact, but rather are only indirectly in thermal contact with the thermal storage material via the thermal bridge element. This prevents undesirable chemical reactions, such as corrosion, between the heat input device and / or heat output device and the thermal storage material.

[0043] According to an advantageous embodiment, the housing can include at least one thermal bridge element. In particular, the at least one thermal bridge element can be arranged on the outer cover of the housing, in particular on the base plate of the housing, or integrated into the base plate. In this way, the heat input and heat output devices can be directly integrated into structural elements of the housing (e.g., the base plate).

[0044] According to an alternative design, the coupling region of the heat input device and the coupling region of the heat output device can be arranged at least partially within the receiving space, in particular, at least partially within the receiving chamber. The coupling region of the heat input device and / or the heat output device can be thermally coupled to the heat storage material via at least one thermal bridge element, wherein the at least one thermal bridge element can be arranged within the receiving space.

[0045] In one embodiment, the heat input and heat output devices can be indirectly connected. In this case, the two components do not come into material contact, but rather are only indirectly in thermal contact with the thermal storage material via the thermal bridge element. This prevents undesirable chemical reactions, such as corrosion, from occurring between the heat input and / or heat output devices and the thermal storage material.

[0046] According to one advantageous design, at least one thermal bridge element can be disposed within the accommodation space. This thermal bridge element can advantageously enable heat to be supplied to or released from the metallic phase-change material, while providing a stable thermal ratio. The thermal bridge element can, for example, include heat-conducting fins extending into the phase-change material.

[0047] In this embodiment, the heat input and output devices are not incorporated directly into the thermal storage material, but rather into a housing that serves as a thermal bridge element, which in turn is incorporated into the thermal storage material. Consequently, the heat input and output devices themselves do not need to be material-compatible with the thermal storage material. Only the housing must be material-compatible with the thermal storage material.

[0048] By integrating the heat input and heat output into the same housing, the heat storage material solidifies around the housing at all times, thereby ensuring good thermal contact with the heat storage material for both the heat input and heat output.

[0049] According to an advantageous design, the heat storage material may comprise a metal alloy, which contains one or more of the components aluminum, silicon, copper, magnesium, zinc, and germanium, in particular an AlSi alloy, preferably an AlSi alloy. 12 .

[0050] Advantageously, the phase change material may comprise a metal alloy or a semi-metal alloy comprising one or more of the components aluminum, silicon, copper, magnesium, boron, zinc, in particular an AlSi alloy, preferably an AlSi 12 Interesting alloys are eutectic alloys and intermetallic compounds, such as various silicides, in which phase changes occur under conditions of absorption or release of latent heat.

[0051] Furthermore, binary or ternary alloys and alloy systems comprising more than three components, including eutectic compositions or intermetallic compositions containing at least one of the aforementioned components Al, Si, Cu, Mg, B, Zn, are particularly advantageous.

[0052] According to one advantageous design, the heat input device can include at least one heating device. In particular, the heating device can include a resistance heating system or an induction heating system. Alternatively, the heat input device can be coupled to the heating device. This allows for simple heat transfer. For example, heat input can be achieved without the need for a heat transfer medium to flow through the storage chamber. For example, heat transfer can be achieved by energizing the heating device. The heat from the thermal storage device can then be used directly in an application, such as for heating purposes.

[0053] According to an advantageous design, a heat transfer medium can flow through the heat output device. In particular, the heat output device can include or be connected to at least one pipe through which the heat transfer medium flows. The cross-section of the pipe can be circular, angular, or square. A circular cross-section results in a high degree of symmetry. A rectangular cross-section results in a larger surface area. Furthermore, the pipe can be designed as a hollow, flat element. The heat transfer medium can thus be transported to a heat exchanger, where it can release the transported heat in a suitable manner. The heat storage device can then release heat. This heat can then be utilized at a location separated from the storage chamber.

[0054] According to one advantageous design, the coupling region of the heat input device can be arranged on a side of the coupling region of the heat output device that faces away from the housing. Alternatively, the coupling region of the heat output device can be arranged on a side of the coupling region of the heat input device that faces away from the housing. For example, the heat input device can be arranged directly on the bottom plate of the housing, while the heat output device is arranged on the heat input device. Subsequently, during heat release, heat is transported to the heat output device via the heat input device.

[0055] According to an advantageous embodiment, the heat input device can have at least one element comprising a coupling region, having at least one of the following embodiments:

[0056] The coupling region may comprise substantially the entire length of the element within the accommodation space and / or the entire perimeter of the element and / or the entire perimeter of the element within the accommodation space;

[0057] The coupling region may extend over at least 50%, in particular over at least 60%, of the entire height of the receiving space;

[0058] The element or the coupling region of the element may be spaced apart from the housing. In particular, one end of the element may be spaced apart from the cover and / or bottom of the housing;

[0059] The element or the coupling region of the element may be oriented parallel to the element of the heat output device;

[0060] The element or the coupling region of the element may be oriented parallel to the vertical axis or axis of symmetry of the receiving space;

[0061] The element or the coupling region of the element can be arranged centrally in the receiving space and, in particular, on an axis of symmetry of the receiving space.

[0062] In this way, the heat input device can be formed by a single element which inputs heat into the heat storage material in a beneficial manner.

[0063] By means of at least one of these elements, heat input can in particular be coupled directly into the heat storage material.

[0064] For example, a solid-to-liquid phase transition can be achieved.

[0065] Subsequently, latent heat and sensible heat can be stored in the heat storage material.

[0066] The extension over essentially the entire length / circumference and / or the entire surface area results in an efficient heat input into the heat storage material. Electric heaters often have a heating dead zone in the initial and / or final region. Due to this structurally determined dead zone, only a substantial portion of the length can be heated, not the entire length.

[0067] In particular, at least one element is arranged so that it is surrounded by thermal storage material, and (predominantly liquid) thermal storage material is present between its ends and the cover and / or base, for example. This allows efficient coupling of heat input into the thermal storage material and generates effective heat transfer for the thermal storage device. Compared to liquid thermal storage material, solid thermal storage material occupies a smaller volume. By being spaced from the cover and / or base, the at least one element does not protrude beyond the thermal storage material even in its solid state. This reduces the risk of overheating of the at least one element.

[0068] According to an advantageous design, at least one element can be arranged obliquely (particularly perpendicularly) to the orientation of at least one heat output device, and / or, in normal operating conditions, parallel to the direction of gravity. Furthermore, at least one element can be arranged parallel to the orientation of at least one heat output device. In this way, a beneficial melting process of the heat storage material and a favorable solidification process during heat output can be achieved. Furthermore, gravity favors solidification toward the bottom surface. The heat input device can advantageously be positioned within the heat storage material as perpendicularly as possible to the heat output device. This prevents the formation of material defects on the side of the heat input device facing away from the heat output device.

[0069] According to an advantageous embodiment, the heat output device can have at least one element comprising a coupling region, having at least one of the following embodiments:

[0070] The coupling region may comprise substantially the entire length of the element within the accommodation space and / or the entire perimeter of the element and / or the entire perimeter of the element within the accommodation space;

[0071] The coupling region may extend over at least 50%, in particular over at least 60%, of the entire height of the receiving space;

[0072] The element or the coupling region of the element may be spaced apart from the housing. In particular, one end of the element may be spaced apart from the cover and / or bottom of the housing;

[0073] The element or the coupling region of the element may be oriented parallel to the elements of the heat input device;

[0074] The element or the coupling region of the element may be oriented parallel to the vertical axis or axis of symmetry of the receiving space;

[0075] The element or the coupling region of the element can be arranged centrally in the receiving space and, in particular, on an axis of symmetry of the receiving space.

[0076] In this way, the heat removal device can be formed by a single element which is able to transport heat away from the heat storage material in a beneficial manner.

[0077] According to an advantageous embodiment, at least one element can be designed as a pipe.

[0078] In this embodiment, the heat output device can be disposed within the thermal storage material, while the heat input device can be disposed on the bottom surface of the thermal storage device, particularly the bottom surface of the thermal storage device's receiving chamber. By placing the heat output device within the thermal storage material, the solidification process begins there and extends into the surrounding thermal storage material. The direction of gravity favors contact with the bottom surface.

[0079] According to an advantageous design, at least one element can be arranged centrally in the receiving space and in particular along the axis of symmetry of the receiving space. In this way, an advantageous melting process of the heat storage material and an advantageous solidification process when heat is output can be achieved.

[0080] According to an advantageous embodiment, the heat input device can surround the heat output device in the receiving space at least in one section, in particular concentrically and / or hermetically surrounding the heat output device. In particular, the heat input device can be in thermal and / or mechanical contact with the heat output device in the receiving space. This prevents the formation of material defects on the side of the heat input device facing away from the heat output device. Furthermore, the heat output device can be directly heated by the heat input device.

[0081] According to one advantageous design, the heat input device can be at least partially separated from the heat output device within the accommodation space, with the heat storage material positioned between the heat input and heat output devices. This allows for an advantageous melting process of the heat storage material and a favorable solidification process during heat output. Consequently, heat transfer can be achieved efficiently; in particular, thermal resistance can be relatively low.

[0082] According to an advantageous design, the coupling region of the heat input device and / or the heat output device can be arranged in the housing. In particular, the housing can be arranged at least partially in the receiving chamber and / or the receiving space.

[0083] In this embodiment, the heat input and / or heat output are not introduced directly into the thermal storage material, but rather into a housing which is in turn introduced into the thermal storage material. As a result, the heat input and / or heat output themselves do not need to be embodied to be compatible with the thermal storage material.

[0084] Only the housing must be materially compatible with the thermal storage material. By integrating the heat input and / or heat output into the same housing, the thermal storage material can solidify around the housing. This ensures good thermal contact with the thermal storage material for both the heat input and heat output.

[0085] According to an advantageous embodiment, a central element of the heat output device, in particular a central pipe, can be arranged in the housing, and elements of the heat input device can be arranged spaced apart from the elements. In particular, the elements of the heat input device can be arranged mirror-symmetrically or rotationally symmetrically relative to the elements.

[0086] In this way, a beneficial melting process of the heat storage material and an advantageous solidification process during heat removal can be achieved.

[0087] According to one advantageous design, an element of the heat input device can be centrally arranged in the housing, and multiple elements of the heat output device, particularly pipes, can be positioned spaced apart from this element. In particular, the elements of the heat output device can be arranged with mirror symmetry or rotational symmetry relative to the elements of the heat input device. This can also beneficially influence the melting process of the thermal storage material and its solidification process during heat output. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Further advantages will be apparent from the following description of the drawings. The drawings illustrate embodiments of the present invention. The drawings, the description, and the claims contain numerous features in combination. A person skilled in the art will also appreciate the advantages of examining the features individually and combining them into other useful combinations.

[0089] The figure shows an example:

[0090] Figure 1 An isometric view shows a heat storage device according to one embodiment of the present invention, comprising a planarly extending heat input device and a planarly extending heat output device;

[0091] Figure 2 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planarly extending heat input device and a planarly extending heat output device;

[0092] Figure 3 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planarly extending heat input device and a planarly extending heat output device;

[0093] Figure 4 A thermal storage device according to one embodiment of the present invention is shown in a detailed cross-sectional view;

[0094] Figure 5 A heat storage device according to another embodiment of the present invention is shown in an isometric view, comprising a cylindrical heat input device and a planarly extending heat output device;

[0095] Figure 6 A heat storage device according to another embodiment of the present invention is shown in a cross-sectional view, comprising a cylindrical heat input device and a planarly extending heat output device;

[0096] Figure 7 A heat storage device according to another embodiment of the present invention is shown in a cross-sectional view, comprising a cylindrical heat input device and a planarly extending heat output device;

[0097] Figure 8A heat storage device according to another embodiment of the present invention is shown in an isometric view, comprising a cylindrical heat input device and a cylindrical heat output device;

[0098] Figure 9 A heat storage device according to another embodiment of the present invention is shown in a cross-sectional view, comprising a cylindrical heat input device and a cylindrical heat output device;

[0099] Figure 10 A heat storage device according to another embodiment of the present invention is shown in a cross-sectional view, comprising a cylindrical heat input device and a cylindrical heat output device;

[0100] Figure 11 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planarly extending heat input device and a planarly extending heat output device;

[0101] Figure 12 The cross-sectional view shows the Figure 11 Thermal storage equipment;

[0102] Figure 13 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planar heat output device located in the base plate and a planar heat input device located in the receiving space;

[0103] Figure 14 The cross-sectional view shows the Figure 13 Thermal storage equipment;

[0104] Figure 15 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planar heat output device located in the base plate and a planar heat input device located in the receiving space;

[0105] Figure 16 The cross-sectional view shows the Figure 15 Thermal storage equipment;

[0106] Figure 17 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planar, extended heat output device located in the base plate and a cylindrical heat input device located in the receiving space;

[0107] Figure 18 The cross-sectional view shows the Figure 17 Thermal storage equipment;

[0108] Figure 19An isometric view shows a heat storage device according to another embodiment of the invention, comprising a cylindrical heat output device located in the base plate and a planar heat input device located in the receiving space;

[0109] Figure 20 The cross-sectional view shows the Figure 19 Thermal storage equipment;

[0110] Figure 21 An isometric view shows a heat storage device according to another embodiment of the invention, comprising a cylindrical heat output device located in the base plate and a planar heat input device located in the receiving space;

[0111] Figure 22 The cross-sectional view shows the Figure 21 Thermal storage equipment;

[0112] Figure 23 An isometric view shows a heat storage device according to another embodiment of the invention, comprising a cylindrical heat output device located in the base plate and a planar heat input device located in the receiving space;

[0113] Figure 24 The cross-sectional view shows the Figure 23 Thermal storage equipment;

[0114] Figure 25 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planar, extended heat input device located in the base plate and a cylindrical heat output device located in the receiving space;

[0115] Figure 26 The cross-sectional view shows the Figure 25 Thermal storage equipment;

[0116] Figure 27 An isometric view shows a heat storage device according to another embodiment of the present invention, comprising a planar heat input device located in the base plate and a rectangular parallelepiped heat output device located in the receiving space;

[0117] Figure 28 The cross-sectional view shows the Figure 27 Thermal storage equipment;

[0118] Figure 29 A heat storage device according to another embodiment of the invention is shown in an isometric view, comprising a planar, extended heat input device located in the base plate and a cylindrical heat output device located in the receiving space;

[0119] Figure 30 The cross-sectional view shows the Figure 29 Thermal storage equipment;

[0120] Figure 31 An isometric view shows a heat storage device according to another embodiment of the present invention, comprising a planar heat input device located in the base plate and a rectangular parallelepiped heat output device located in the receiving space;

[0121] Figure 32 The cross-sectional view shows the Figure 31 Thermal storage equipment;

[0122] Figure 33 A heat storage device according to another embodiment of the present invention is shown in an isometric view, comprising a cylindrical heat input device and a cylindrical heat output device located in a housing in a receiving space;

[0123] Figure 34 A heat storage device according to another embodiment of the present invention is shown in a top view, which includes a heat input device and a heat output device arranged linearly in a housing;

[0124] Figure 35 A top view shows a heat storage device according to another embodiment of the present invention, which includes a heat input device and a heat output device arranged in a cross shape in a housing;

[0125] Figure 36 A heat storage device according to another embodiment of the present invention is shown in a top view, comprising a heat input device and a heat output device coaxially arranged in a housing;

[0126] Figure 37 A heat storage device according to another embodiment of the present invention is shown in a top view, which includes a heat input device and a heat output device arranged linearly in a housing;

[0127] Figure 38 A heat storage device according to another embodiment of the present invention is shown in a top view, which includes a heat input device and a heat output device arranged linearly in a housing; and

[0128] Figure 39 A heat storage device according to another embodiment of the present invention is shown in a top view, which includes a heat input device and a heat output device arranged linearly in a housing. DETAILED DESCRIPTION

[0129] In the figures, like or identically functioning components are designated by the same reference numerals. The figures illustrate examples only and are not to be construed as limiting.

[0130] Directional terms such as "left," "right," "upper," "lower," "front," "back," and "after" used below are intended only to facilitate a better understanding of the drawings and are not intended to limit their generality in any way. The components and elements shown, as well as their design and use, may be varied at the discretion of those skilled in the art and adapted to the respective application.

[0131] The phase change material used as the heat storage material 10 in the various embodiments described in the figures has a phase change temperature of at least 100° C., preferably at least 500° C. The heat storage material 10 can be, for example, an aluminum silicon alloy, in particular AlSi 12 This material has a phase transition temperature of approximately 577° C., wherein, at a constant temperature, the material melts when energy is supplied or solidifies when energy is withdrawn.

[0132] In one embodiment, the housing 16 can be formed from a fiber-reinforced ceramic material, such as silicon carbide, or else aluminum oxide or graphite. However, other suitable materials are also conceivable. The wall thickness can be very thin, for example, 1 mm, in particular at least 2 mm and in particular at least 2.5 mm, and for example about 3 mm. Preferably, the wall thickness is at most 5 mm.

[0133] Preferably, the thermal expansion coefficient of the metallic phase change material is greater than the thermal expansion coefficient of the material of the housing 16 .

[0134] In principle, the heat input device 30 and the heat output device 40 can each include one or more components for heat input or heat output.

[0135] The phase change of the thermal storage material 10 caused by heat input or heat output begins at at least one corresponding contact region 11 of the thermal storage material 10. The contact region 11 contacts the coupling region 32 of at least one heat input device 30 and / or the coupling region 42 of at least one heat output device 40. Depending on the arrangement of the coupling regions 32 and 42, multiple contact regions 11, or at least one contact region 11, may abut the bottom of the accommodation chamber 12. In particular, the contact region 11 of the thermal storage material 10 is not arranged in the region of the thermal storage material 10 that typically solidifies last during the phase change caused by heat output. Therefore, the contact region 11 can be free of material defects.

[0136] exist Figures 1 to 3 1 and 2 show heat storage devices 100 according to different embodiments of the present invention in isometric views, which include a planar heat input device 30 and a planar heat output device 40 .

[0137] The heat storage device 100 using a metal phase change material as the heat storage material 10 includes a housing 12 having a housing space 14 for the heat storage material 10 and a housing 16 for the housing space 14. The heat storage material 10 includes a metal alloy, which includes one or more of the components aluminum, silicon, copper, magnesium, zinc, and germanium, in particular an AlSi alloy, preferably an AlSi 12 .

[0138] In addition, the heat storage device 100 includes a heat input device 30 for inputting heat into at least one storage chamber 12 and a heat output device 40 for outputting heat from one of the storage chambers 12. A coupling region 32 of the heat input device 30, which is provided for thermal coupling with the heat storage material 10, and a coupling region 42 of the heat output device 40, which is provided for thermal coupling with the heat storage material 10, are arranged to be spaced apart from the heat storage material 10 in at least some areas.

[0139] The heat input device 30 has at least one heating device 34. In particular, the heating device 34 can have a resistance heating system or an induction heating system or be coupled thereto.

[0140] The heat output device 40 can, for example, have a heat transfer medium 58 flowing through it. Specifically, the heat output device 40 can include or be connected to at least one pipe 52 through which the heat transfer medium 58 flows. The cross section of the pipe 52 can be, for example, circular, angular, or square. The pipe 52 can also be designed as a hollow flat element.

[0141] The coupling regions 32, 42 of the heat input device 30 and the heat output device 40 are at least partially arranged outside the accommodation space 14, in particular at least partially arranged outside the accommodation chamber 12. This is achieved in the following way, that is, the coupling regions 32, 42 of the heat input device 30 and the heat output device 40 are thermally coupled to the heat storage material 10 through at least one thermal bridge element 70. The coupling regions 32, 42 are thus indirectly connected to the heat storage material 10 and are not in direct material contact with it, but are only indirectly in thermal contact with the metallic phase change material. In these embodiments, the housing 16 has at least one thermal bridge element 70. The thermal bridge element 70 can be suitably arranged on the outer cover 18 of the housing 16. Figures 1 to 3 In the embodiment shown in FIG, the thermal bridge element 70 is in particular integrated into the base plate 20 or realized by the base plate 20. The heat input device 30 and the heat output device 40 are themselves arranged at least partially outside the heat storage material 10.

[0142] exist Figure 1In the embodiment, the individual elements 36 of the heat input device 30 and the individual elements 46 of the heat output device 40 are arranged side by side in strips with their longitudinal sides and point with their coupling regions 32 , 42 towards the heat storage material 10 in the receiving chamber 12 .

[0143] exist Figure 2 In FIG. 4 , two strip elements 36 of the heat input device 30 are arranged on both longitudinal sides of a single element 46 of the heat output device 40 .

[0144] exist Figure 3 In FIG. 4 , the element 46 of the heat output device 40 is surrounded by the element 36 of the heat input device 30 .

[0145] Figure 4 A detailed cross-sectional view shows a heat storage device 100 according to one embodiment of the present invention, comprising a cylindrical heat input device 30 and a planar, extended heat output device 40. The heat input device 30 and the heat output device 40 are arranged in a base plate 20, which serves as a thermal bridge element 70 to the heat storage material 10.

[0146] The coupling regions 32 , 42 of the heat input 30 and heat output 40 face the heat storage material 10 or the receiving chamber 12 , but are separated therefrom by the material of the base plate 20 .

[0147] The heat storage material 10 is arranged in the receiving space 14 of the receiving chamber 12. The receiving chamber 12 is surrounded by a housing 16. The housing 16 has a heat insulating material 24 on the outside in order to be able to keep the temperature of the heat storage material 10 constant for as long as possible.

[0148] The heat input device 30, integrated into the base plate 20 of the receiving chamber 12, comprises individual cylindrical elements 36, which are inserted into the receiving opening of the base plate 20 in a parallel, side-by-side arrangement. Thus, the elements 36 can be designed as heating devices 34. For example, the heating device 34 can include or be designed as an electric heating core. Alternatively, however, the elements 36 can also be thermally coupled to a heating element.

[0149] The heat output device 40 is designed as an evaporator device 54, in which a heat transfer medium 58 is evaporated and conducted in the form of vapor via a pipe 52 to a condenser 56. The condenser 56 has coolant connections 60, 62 for the cooling medium, by means of which the vapor can be condensed again in order to be subsequently conducted back to the evaporator as liquid heat transfer medium 58.

[0150] exist Figures 5 to 7, respectively, show different embodiments of a heat storage device 100, which includes a cylindrical heat input device 30 and a planar heat output device 40. The heat input device 30 and the heat output device 40 are each integrated into a base plate 20, which serves as a thermal bridge element 70 for transferring heat from the heat storage material 10 in the receiving chamber 12 and toward the heat storage material in the receiving chamber.

[0151] Figure 5 A heat storage device 100 is shown in an isometric view and comprises a cylindrical heat input device 30 and a planar heat output device 40; in the embodiment described, the heat output device 40 is arranged as a single element 46 in the base plate 20. Two cylindrical elements 36 of the heat input device 30 are arranged in the base plate 20 at a distance from the two longitudinal sides of the element 46, which can be designed, for example, as heating devices 34, for example in the form of heating cores as described above.

[0152] Figure 6 A heat storage device 100 is shown in a cross-sectional view, which includes a cylindrical heat input device 30 and a planar heat output device 40; in one embodiment, the heat input device 30 has two cylindrically designed elements 36 of the heat input device 30 on both sides of the heat output device 40.

[0153] Figure 7 A heat storage device 100 is also shown in cross section, comprising a cylindrical heat input device 30 and a planar heat output device 40; in the embodiment described therein, the heat output device 40, which comprises three elements 46, is arranged in the base plate 20. A cylindrical element 36 of the heat input device 30 is arranged between and on the outer sides of the planar elements 46 of the heat output device 40.

[0154] The cylindrically designed element 36 of the heat input device 30 can be introduced into a hole in the base plate 20 .

[0155] exist Figures 8 to 10 , respectively, show different embodiments of a heat storage device 100, which includes a cylindrical heat input device 30 and a cylindrical heat output device 40. The heat input device 30 and the heat output device 40 are each integrated into a base plate 20, which serves as a thermal bridge element 70 for transferring heat from the heat storage material 10 in the receiving chamber 12 and toward the heat storage material in the receiving chamber.

[0156] Figure 8An isometric illustration shows a heat storage device 100 comprising a cylindrical heat input device 30 and a cylindrical heat output device 40. In one embodiment, the heat input device 30, which comprises three cylindrical elements 36, is arranged in the base plate 20. These elements can be designed, for example, as heating devices 34. Cylindrical elements 46 of the heat output device 40 are arranged in the base plate 20 at intervals between the elements 36.

[0157] Figure 9 A heat storage device 100 is shown in a cross-sectional view, which includes a cylindrical heat input device 30 and a cylindrical heat output device 40; in one embodiment, the heat input device 30 has four cylindrically designed elements 36, between which cylindrically designed elements 46 of the heat output device 40 are arranged.

[0158] Figure 10 A heat storage device 100 is also shown in cross section and comprises a cylindrical heat input device 30 and a cylindrical heat output device 40. In the embodiment described, the heat output device 40 is arranged as a cylindrical element 46 in the base plate 20. Three cylindrical elements 36 of the heat input device 30 are arranged on both sides of the heat output device 40.

[0159] The cylindrically designed element 36 of the heat input device 30 and the cylindrically designed element 46 of the heat output device 40 can be introduced into the openings of the base plate 20 .

[0160] Figure 11 A heat storage device 100 according to another embodiment of the present invention is shown in an isometric view, comprising a planar heat input device 30 and a planar heat output device 40. Figure 12 , the thermal storage device 100 is shown in a cross-sectional view.

[0161] In this embodiment, the coupling region 42 of the heat output device 40 is arranged on the side 22 of the coupling region 32 of the heat input device 30 facing away from the housing 16. The heat input device 30 is arranged directly on the bottom plate 20 so as to be spaced apart from the heat storage material 10, while the heat output device 40 is applied to the outer side of the heat input device 30 facing away from the accommodation chamber 12.

[0162] Alternatively, the coupling region 32 of the heat input device 30 can also be arranged on the side 22 of the coupling region 42 of the heat output device 40 facing away from the housing 16 , so that the heat input device 30 and the heat output device 40 are exchanged.

[0163] exist Figures 13 to 24shows an embodiment of a heat storage device 100, in which the heat input devices 30 are each arranged in the receiving chamber 12, while the heat output device 40 is arranged on the bottom plate 20 of the housing 16 and partially integrated into the bottom plate 20 of the housing 16. By arranging the heat output device 40 on the bottom plate 20, the solidification process begins at the bottom plate 20 of the housing 16 during the cooling process. In addition, gravity also favors solidification toward the bottom plate 20. The heat input device 30 can advantageously be arranged in the heat storage material 10 as perpendicularly as possible to the heat output device 40. This can avoid the formation of material defects on the side of the heat input device 30 facing away from the heat output device 40.

[0164] exist Figures 13 to 24 In the embodiment shown in , the heat input device 30 can have at least one element 36 including a coupling area 32, wherein the coupling area 32 substantially includes the entire length of the element 36 within the receiving space 14 and / or the entire circumference of the element 36 and / or the entire circumference of the element 36 within the receiving space 14.

[0165] In this case, the coupling region 32 can extend over at least 50%, in particular at least 60%, of the entire height of the receiving space 14 .

[0166] The element 36 or the coupling region 32 of the element 36 may be spaced apart from the housing 16, and in particular one end of the element 36 may be spaced apart from the cover 28 and / or the bottom of the housing 16. Alternatively, however, the element 36 may also be arranged to rest directly on the bottom plate 20 of the housing.

[0167] The element 36 or the coupling region 32 of the element 36 can be oriented parallel to the element 46 of the heat output device 40 .

[0168] The element 36 or the coupling region 32 of the element 36 can be oriented parallel to the vertical axis L or the axis of symmetry of the receiving space 14 .

[0169] The element 36 or the coupling region 32 of the element 36 can be arranged centrally in the receiving space 14 and, in particular, on an axis of symmetry of the receiving space 14 .

[0170] The element 36 can be arranged obliquely (in particular perpendicularly) to the orientation of the heat output device 40 and / or, in normal operating conditions, parallel to the direction S of gravity.

[0171] Additionally, the element 36 may be arranged parallel to the orientation of the at least one heat output device 40 .

[0172] Figure 13The isometric view shows a heat storage device 100 comprising a planar heat output device 40 located in the base plate 20 and a planar heat input device 30 located in the receiving space 14. Figure 14 , such a heat storage device 100 is shown in a cross-sectional view. The cross-sectional view includes more elements 36 than the isometric view.

[0173] The heat output device 40 comprises a single element integrated into the base plate 20 of the housing 16, while the heat input device 30 comprises a plurality of elements 36 which are introduced into the heat storage material 10 vertically relative to the base plate 20 in the direction of gravity S and thus perpendicularly to the heat release direction.

[0174] As a result, the coupling region 32 of the heat input device 30 is arranged at least partially within the receiving space 14 , in particular at least partially within the receiving chamber 12 .

[0175] Figure 15 The isometric view shows a heat storage device 100 comprising a planar heat output device 40 located in the base plate 20 and a planar heat input device 30 located in the receiving space 14. Figure 16 , such a thermal storage device is shown in a cross-sectional view, wherein the cross-sectional view includes more elements 36 than the isometric view.

[0176] The arrangement structure of the heat output device 40 is Figure 13 and Figure 14 However, the arrangement structure of the individual elements 36 of the heat input device 30 is horizontal, ie parallel to the bottom plate 20 in the receiving chamber 12 and thus perpendicular to the heat release direction of the heat storage material 10.

[0177] Figure 17 The isometric view shows a heat storage device 100 comprising a planar heat output device 40 located in the base plate 20 and a cylindrical heat input device 30 located in the receiving space 14. Figure 18 , such a heat storage device 100 is shown in a cross-sectional view. The cross-sectional view includes more elements 36 than the isometric view.

[0178] The arrangement structure of the heat output device 40 is Figure 13 and Figure 14 The heat input device 30 comprises a plurality of elements 36 which are cylindrical and are introduced into the heat storage material 10 in the direction of gravity S, standing vertically relative to the base plate 20 and thus perpendicularly to the heat release direction.

[0179] Figure 19The isometric view shows a heat storage device 100 comprising a cylindrical heat output device 40 located in the base plate 20 and a planar heat input device 30 located in the receiving space 14. Figure 20 , such a heat storage device 100 is shown in a cross-sectional view. The cross-sectional view includes more elements 36 than the isometric view.

[0180] The individual elements 46 of the heat output device 40 are cylindrical and are introduced horizontally into the holes of the base plate 20. The heat input device 30 comprises a plurality of elements 36, which are introduced into the heat storage material 10 in the direction of gravity S, vertically standing relative to the base plate 20 and thus perpendicular to the heat release direction.

[0181] Figure 21 The isometric view shows a heat storage device 100 comprising a cylindrical heat output device 40 located in the base plate 20 and a planar heat input device 30 located in the receiving space 14. Figure 22 , such a heat storage device 100 is shown in a cross-sectional view. The cross-sectional view includes more elements 36 than the isometric view.

[0182] The arrangement structure of the heat output device 40 is Figure 19 and Figure 20 However, the arrangement structure of the individual elements 36 of the heat input device 30 is horizontal, ie parallel to the bottom plate 20 in the receiving chamber 12 and thus perpendicular to the heat release direction of the heat storage material 10.

[0183] Figure 23 The isometric view shows a heat storage device 100 comprising a cylindrical heat output device 40 located in the base plate 20 and a planar heat input device 30 located in the receiving space 14. Figure 24 , such a heat storage device 100 is shown in a cross-sectional view. The cross-sectional view includes more elements 36 than the isometric view.

[0184] The arrangement structure of the heat output device 40 is Figure 19 and Figure 20 The heat input device 30 comprises a plurality of elements 36 which are cylindrical and are introduced into the heat storage material 10 in the direction of gravity S, standing vertically relative to the base plate 20 and thus perpendicularly to the heat release direction.

[0185] exist Figures 25 to 32 1 shows an embodiment of a heat storage device 100 , wherein the heat output device 40 is respectively arranged in the receiving chamber 12 , and the heat input device 30 is arranged on the bottom plate 20 of the housing 16 and partially integrated in the bottom plate 20 of the housing 16 .

[0186] By placing the heat output device 40 in the heat storage material 10 , the solidification process starts there. The direction of gravity is favorable for contact with the bottom plate 20 .

[0187] exist Figures 25 to 32 In the embodiment shown in , the heat output device 40 can have at least one element 46 including a coupling area 42, wherein the coupling area 42 substantially includes the entire length of the element 46 within the accommodation space 14 and / or the entire circumference of the element 46 and / or the entire circumference of the element 46 within the accommodation space 14.

[0188] In this case, the coupling region 42 can extend over at least 50%, in particular at least 60%, of the entire height of the receiving space 14 .

[0189] The element 46 or the coupling region 42 of the element 46 can be spaced apart from the housing 16. In particular, one end of the element 46 can be spaced apart from the cover 28 and / or the bottom of the housing 16.

[0190] The element 46 or the coupling region 42 of the element 46 can be oriented parallel to the element 36 of the heat input device 30 .

[0191] The element 46 or the coupling region 42 of the element 46 can be oriented parallel to the vertical axis L or the axis of symmetry of the receiving space 14 .

[0192] The element 46 or the coupling region 42 of the element 46 can be arranged centrally in the receiving space 14 and, in particular, on an axis of symmetry of the receiving space 14 .

[0193] The at least one element 46 can be designed cylindrically and in particular as a tube 52 .

[0194] The at least one element 46 can be arranged centrally within the receiving space 14 and, in particular, along an axis of symmetry of the receiving space 14 .

[0195] Figure 25 The isometric view shows a heat storage device 100 comprising a planar heat input device 30 located in the base plate 20 and a cylindrical heat output device 40 located in the receiving space 14. Figure 26 , such a thermal storage device is shown in cross section.

[0196] The planar heat input device 30 is designed to include two elements 36. The heat output device 40, designed cylindrically as a tube 52, is arranged vertically in the direction of gravity S in the heat storage material 10 with at least one region 48. The sections 38 of the heat input device 30 are arranged on both sides of the heat output device 40. The heat output device 40 can be introduced into the housing 16, for example, from below through the base plate 20.

[0197] The coupling region 42 of the heat output device 40 is arranged at least partially within the receiving space 14 , in particular at least partially within the receiving chamber 12 .

[0198] Figure 27 The isometric view shows a heat storage device 100 comprising a planar heat input device 30 located in the base plate 20 and a rectangular parallelepiped heat output device 40 located in the receiving space 14. Figure 28 , such a thermal storage device 100 is shown in a cross-sectional view.

[0199] The arrangement structure of the heat input device 30 is Figure 25 and Figure 26 The heat output device 40, which is realized in a rectangular parallelepiped shape, is arranged in the heat storage material 10 in at least one region 48 perpendicularly in the direction of gravity S. The sections 38 of the heat input device 30 are arranged on both sides of the heat output device 40. The heat output device 40 can be introduced into the housing 16 and thereby into the heat storage material 10, for example, from below through the base plate 20.

[0200] exist Figures 25 to 28 In the embodiment shown in FIG, the heat input device 30 can surround the heat output device 40 in the receiving space 14 at least by a section 38 , in particular concentrically and / or closed.

[0201] Furthermore, the heat input device 30 can be in thermal and / or mechanical contact with the heat output device 40 in the receiving space 14 , which can also be the case in the embodiments shown in the other figures.

[0202] Figure 29 The isometric view shows a heat storage device 100 comprising a planar heat input device 30 located in the base plate 20 and a cylindrical heat output device 40 located in the receiving space 14. Figure 30 , such a thermal storage device 100 is shown in a cross-sectional view.

[0203] The heat input device 30 comprises a single element integrated into the base plate 20 of the housing 16. The heat output device 40 is designed cylindrically and is realized as a single pipe 52. The heat output device 40 is introduced into the housing 16 and thereby into the heat storage material 10, for example, from above.

[0204] Figure 31 The isometric view shows a heat storage device 100 comprising a planar heat input device 30 located in the base plate 20 and a rectangular parallelepiped heat output device 40 located in the receiving space 14. Figure 32, such a thermal storage device 100 is shown in a cross-sectional view.

[0205] The arrangement structure of the heat input device 30 is Figure 29 and Figure 30 The heat output device 40 is designed as a cuboid and is implemented as a single element. The heat output device 40 is introduced into the housing 16 and thereby into the heat storage material 10 from above, for example.

[0206] exist Figures 13 to 32 In the embodiment shown in , the heat input device 30 is at least partially separated from the heat output device 40 in the accommodation space 14 , wherein the heat storage material 10 is arranged between the heat input device 30 and the heat output device 40 .

[0207] Alternatively, the heat input device 30 or the heat output device 40 can each be designed to adjoin the base plate 20 .

[0208] Figure 33 The isometric view shows a heat storage device 100 comprising a cylindrical heat input device 30 and a cylindrical heat output device 40 in a housing 26 located in a receiving space 14. Figure 34 The heat storage device 100 is shown in a top view and comprises a heat input device 30 and a heat output device 40 arranged linearly within a housing 26 .

[0209] exist Figures 35 to 39 Other embodiments of this arrangement are shown in .

[0210] exist Figures 33 to 39 In the embodiment shown in , the heat input 30 and the heat output 40 are not introduced directly into the heat storage material 10 , but rather into a housing 26 as a heat bridge element 70 , which in turn is introduced into the heat storage material 10 .

[0211] Thus, the heat input device 30 and the heat output device 40 themselves do not need to be embodied to be material-compatible with the heat storage material 10. Only the housing 26 must have material compatibility with respect to the heat storage material 10. By introducing the heat input device 30 and the heat output device 40 into the same housing 26, solidification of the heat storage material 10 preferably occurs around the housing 26. Thus, good thermal contact with the heat storage material 10 is ensured for both the heat input device 30 and the heat output device 40.

[0212] In these embodiments, the coupling regions 32, 42 of the heat input 30 and heat output 40 are arranged in the housing 26. The housing 26, which serves as a thermal bridge element 70, is in turn arranged at least partially within the receiving chamber 12 and the receiving space 14.

[0213] In the housing 26, for example, the element 36 of the heat input device 30 may be centrally arranged, and a plurality of elements 46 of the heat output device 40, in particular pipes 52, may be positioned spaced apart from the element 36. In particular, the elements 46 of the heat output device 40 may be arranged mirror-symmetrically or rotationally symmetrically with respect to the elements 36 of the heat input device 30. Alternatively, the elements 46 of the heat output device 40 may also be centrally arranged and surrounded by the elements 36 of the heat input device 30 at intervals.

[0214] exist Figure 33 and Figure 34 In the embodiment shown in FIG, a central element 46 of the heat output device 40, in particular a central pipe 52, is arranged in the housing 26. Two cylindrical elements 36 of the heat input device 30 are arranged spaced apart from the element 46. The elements 36 of the heat input device 30 are arranged in a row mirror-symmetrically with respect to the elements 46. The elements 36 and 46 are all oriented parallel to one another.

[0215] Figure 35 The heat storage device 100 is shown in a top view and comprises a heat input device 30 and a central heat output device 40 arranged in a cross shape within a housing 26. Two cylindrical elements 36 of the heat input device 30 are each arranged as an arm of the cross, with a single cylindrical element 46 of the heat output device 40 located at the intersection. The elements 36 and 46 are all oriented parallel to one another.

[0216] Figure 36 The heat storage device 100 is shown in a top view and comprises a heat input device 30 and a heat output device 40 arranged coaxially within a housing 26. The heat output device 40 has a centrally arranged cylindrical element 46 which is surrounded in a circular shape by the cylindrical element 36 of the heat input device 30. The elements 36 and 46 are all oriented parallel to each other.

[0217] Figure 37 The heat storage device 100 is shown in a top view and comprises a heat input device 30 and a heat output device 40 arranged linearly within a housing 26 .

[0218] The element 46 of the heat output device 40 is arranged centrally in the housing 26 and is surrounded by two planar elements 36 of the heat input device 30 , wherein these elements are arranged in a row, standing vertically, parallel to the element 46 .

[0219] Figure 38 The heat storage device 100 is shown in a top view and includes a heat input device 30 and a heat output device 40 arranged linearly within a housing 26. Figure 37 The embodiment shown in the design Figure 38The implementation shown in . Figure 38 In FIG. 4 , only two mutually parallel elements 36 of the heat input device 30 are shown on each side of an element 46 of the heat output device 40 .

[0220] Figure 39 A top view of a heat storage device 100 is shown, which comprises a heat input device 30 and a heat output device 40 arranged linearly within a housing 26. In this embodiment, three rod-shaped elements 36 of the heat input device 30 are arranged in a row and parallel to one another opposite a central cylindrical element 46 of the heat output device 40.

Claims

1. A heat storage device (100), wherein the heat storage device uses a metal phase change material as a heat storage material (10), and the heat storage device comprises: at least one receiving chamber (12) having a receiving space (14) for the heat storage material (10) and a housing (16) for the receiving space (14); at least one heat input device (30) for inputting heat into at least one of the receiving chambers (12); and at least one heat output device (40) for outputting heat from at least one of the receiving chambers (12). It is characterized by: The coupling region (32) of the heat input device (30) that is preset for thermal coupling with the heat storage material (10) and / or the coupling region (42) of the heat output device (40) that is preset for thermal coupling with the heat storage material (10) are arranged to be spaced apart from the heat storage material (10) in at least a partial area. In order to ensure thermal contact between the heat input device (30) and the heat storage material (10), and between the heat output device (40) and the heat storage material (10), the arrangement structure of the heat input device (30) and the heat output device (40) is selected so that: in normal use of the heat storage device (100), in the area where the heat storage material (10) is finally solidified, shrinkage cavities and / or air pores are formed at positions away from the heat input device (30) and the heat output device (40).

2. The thermal storage device according to claim 1, characterized in that In order to ensure thermal contact between the heat input device (30) and the heat storage material (10), and between the heat output device (40) and the heat storage material (10), the arrangement of the heat input device (30) and the heat output device (40) is selected based on the volume reduction caused by the solidification of the heat storage material (10) starting from the heat output device (40) and based on the effects resulting from the different thermal expansion coefficients of the components used in the heat storage material (10).

3. The thermal storage device according to claim 2, characterized in that In order to ensure thermal contact, the arrangement of the heat input device (30) and the heat output device (40) is selected according to the influence of the contents in the heat storage material (10) on the effective thermal conductivity within the heat storage material (10) and the associated influence on the solidification of the heat storage material (10).

4. The thermal storage device according to claim 1, characterized in that The coupling region (32) of the heat input device (30) and the coupling region (42) of the heat output device (40) are arranged on the bottom of the housing (16) outside the accommodation space (14). The coupling regions (32, 42) of the heat input device (30) and / or the heat output device (40) are thermally coupled to the heat storage material (10) via at least one thermal bridge element (70). The housing (16) has at least one thermal bridge element (70).

5. The heat storage device according to claim 4, characterized in that At least one thermal bridge element (70) is arranged on a base plate (20) of the housing (16) or is integrated into the base plate (20) or realizes the base plate (20).

6. The thermal storage device according to claim 1, characterized in that The coupling region (32) of the heat input device (30) is arranged on the bottom of the housing (16) outside the accommodation space (14), and the coupling region (42) of the heat output device (40) is at least partially arranged in the accommodation space (14), or the coupling region (42) of the heat output device (40) is arranged on the bottom of the housing (16) outside the accommodation space (14), and the coupling region (32) of the heat input device (30) is at least partially arranged in the accommodation space (14), wherein the coupling regions (32, 42) of the heat input device (30) and / or the heat output device (40) are thermally coupled to the heat storage material (10) via at least one thermal bridge element (70).

7. The thermal storage device according to claim 6, characterized in that The coupling region (32) of the heat input device (30) is arranged on the bottom of the housing (16) outside the accommodation space (14), and the coupling region (42) of the heat output device (40) is arranged at least partially within the accommodation chamber (12), or the coupling region (42) of the heat output device (40) is arranged on the bottom of the housing (16) outside the accommodation space (14), and the coupling region (32) of the heat input device (30) is arranged at least partially within the accommodation chamber (12).

8. The thermal storage device according to claim 6 or 7, characterized in that: At least one of the thermal bridge elements (70) is arranged in the receiving space (14), and / or The housing (16) has at least one thermal bridge element (70).

9. The thermal storage device according to claim 8, characterized in that At least one of the thermal bridge elements (70) is arranged on a base plate (20) of the housing (16) or is integrated into the base plate (20) or realizes the base plate (20).

10. The thermal storage device according to claim 1, wherein The coupling region (32) of the heat input device (30) and the coupling region (42) of the heat output device (40) are at least partially arranged in the receiving space (14), The coupling regions (32, 42) of the heat input device (30) and / or the heat output device (40) are thermally coupled to the heat storage material (10) via at least one thermal bridge element (70). At least one of the thermal bridge elements (70) is arranged in the receiving space (14).

11. The thermal storage device according to claim 10, characterized in that The coupling region (32) of the heat input device (30) and the coupling region (42) of the heat output device (40) are arranged at least partially within the receiving chamber (12).

12. The thermal storage device according to claim 1, characterized in that The coupling region (32) of the heat input device (30) is arranged on a side (22) of the coupling region (42) of the heat output device (40) facing away from the housing (16), or the coupling region (42) of the heat output device (40) is arranged on a side (22) of the coupling region (32) of the heat input device (30) facing away from the housing (16).

13. The thermal storage device according to claim 1, wherein The coupling regions (32, 42) of the heat input device (30) and / or the heat output device (40) are arranged in a housing (26).

14. The thermal storage device according to claim 13, characterized in that The housing (26) is arranged at least partially within the receiving chamber (12) and / or the receiving space (14).

15. The thermal storage device according to claim 13, characterized in that A central element (46) of the heat output device (40) is arranged in the housing (26), and an element (36) of the heat input device (30) is arranged spaced apart from the element (46).

16. The thermal storage device according to claim 15, characterized in that The central element (46) of the heat output device (40) is a central pipe (52).

17. The thermal storage device according to claim 15, characterized in that The element (36) of the heat input device (30) is arranged mirror-symmetrically or rotationally symmetrically with respect to the element (46).

18. The thermal storage device according to any one of claims 13 to 17, characterized in that An element (36) of the heat input device (30) is arranged centrally in the housing (26), and a plurality of elements (46) of the heat output device (40) are positioned spaced apart from the element (36).

19. The thermal storage device according to claim 18, characterized in that The element (46) of the heat output device (40) is a pipe (52).

20. The thermal storage device according to claim 18, wherein The element (46) of the heat output device (40) is arranged mirror-symmetrically or rotationally symmetrically with respect to the element (36) of the heat input device (30).

21. The thermal storage device according to claim 1, wherein The heat input device (30) has at least one element (36) comprising the coupling region (32), having at least one of the following configurations: The coupling region (32) substantially comprises the entire length of the element (36) within the receiving space (14) and / or the entire circumference of the element (36) and / or the entire circumference of the element (36) within the receiving space (14); The coupling region (32) extends over at least 50% of the entire height of the receiving space (14); The element (36) or the coupling region (32) of the element (36) is spaced from the housing (16); The element (36) or the coupling region (32) of the element (36) is oriented parallel to the element (46) of the heat output device (40); The element (36) or the coupling region (32) of the element (36) is oriented parallel to the vertical axis (L) or the axis of symmetry of the receiving space (14); The element (36) or the coupling region (32) of the element (36) is arranged centrally in the receiving space (14).

22. The thermal storage device according to claim 21, characterized in that The coupling region (32) extends over at least 60% of the entire height of the receiving space (14).

23. The thermal storage device according to claim 21, characterized in that One end of the element (36) is spaced from the cover (28) and / or the bottom of the housing (16).

24. The thermal storage device according to claim 21, characterized in that The element (36) or the coupling region (32) of the element (36) is located on the axis of symmetry of the receiving space (14).

25. The thermal storage device according to any one of claims 21 to 24, characterized in that At least one of the elements (36) is arranged obliquely to the orientation of at least one of the heat output devices (40) and / or, in a normal operating state, is arranged parallel to the direction of gravity (S), Alternatively, at least one of the elements (36) is arranged parallel to the orientation of at least one of the heat output devices (40).

26. The thermal storage device according to claim 25, characterized in that At least one of the elements (36) is oriented perpendicularly to at least one of the heat output devices (40).

27. The thermal storage device according to claim 1, characterized in that The heat output device (40) has at least one element (46) comprising the coupling region (42), having at least one of the following configurations: The coupling region (42) substantially includes the entire length of the element (46) within the receiving space (14) and / or the entire circumference of the element (46) and / or the entire circumference of the element (46) within the receiving space (14); The coupling region (42) extends over at least 50% of the entire height of the receiving space (14); The element (46) or the coupling region (42) of the element (46) is spaced from the housing (16); The element (46) or the coupling region (42) of the element (46) is oriented parallel to the element (36) of the heat input device (30); The element (46) or the coupling region (42) of the element (46) is oriented parallel to the vertical axis (L) or the axis of symmetry of the receiving space (14); The element (46) or the coupling region (42) of the element (46) is arranged centrally in the receiving space (14).

28. The thermal storage device according to claim 27, characterized in that The coupling region (42) extends over at least 60% of the entire height of the receiving space (14).

29. The thermal storage device according to claim 27, wherein One end of the element (46) is spaced from the cover (28) and / or the bottom of the housing (16).

30. The thermal storage device according to claim 27, wherein The element (46) or the coupling region (42) of the element (46) is located on the axis of symmetry of the receiving space (14).

31. The thermal storage device according to claim 27, characterized in that At least one of the elements (46) is designed as a pipe (52).

32. The thermal storage device according to any one of claims 27 to 31, characterized in that At least one of the elements (46) is arranged centrally within the receiving space (14).

33. The thermal storage device according to claim 32, characterized in that At least one of the elements (46) is arranged along an axis of symmetry of the receiving space (14).

34. The thermal storage device according to claim 1, characterized in that The heat input device (30) surrounds the heat output device (40) in the receiving space (14) at least in a section (38).

35. The thermal storage device according to claim 34, characterized in that The heat input device (30) surrounds the heat output device in the receiving space (14) concentrically and / or closed at least with the section (38).

36. The thermal storage device according to claim 34, characterized in that The heat input device (30) is in thermal and / or mechanical contact with the heat output device (40) in the accommodation space (14).

37. The thermal storage device according to any one of claims 1, 2, 4 to 7, 10 to 17, 21 to 24, 27 to 31, and 34 to 36, characterized in that The heat input device (30) is at least partially separated from the heat output device (40) in the accommodation space (14), wherein a heat storage material (10) is arranged between the heat input device (30) and the heat output device (40).

38. The thermal storage device according to any one of claims 1, 2, 4 to 7, 10 to 17, 21 to 24, 27 to 31, and 34 to 36, characterized in that The heat storage material (10) comprises a metal alloy containing one or more of the components aluminum, silicon, copper, magnesium, zinc, and germanium.

39. The thermal storage device according to claim 38, characterized in that The metal alloy includes an AlSi alloy.

40. The thermal storage device according to claim 39, wherein The metal alloy comprises AlSi 12 .

41. The thermal storage device according to any one of claims 1, 2, 4 to 7, 10 to 17, 21 to 24, 27 to 31, and 34 to 36, characterized in that The heat input device (30) includes at least one heating device (34).

42. The thermal storage device according to claim 41, characterized in that The heating device (34) includes a resistance heating system or an induction heating system.

43. The thermal storage device according to any one of claims 1, 2, 4 to 7, 10 to 17, 21 to 24, 27 to 31, and 34 to 36, characterized in that A heat transfer medium (58) flows through the heat output device (40).

44. The thermal storage device according to claim 43, characterized in that The heat output device (40) includes at least one pipe (52) through which the heat transfer medium (58) flows, or is connected to the pipe.

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