Semiconductor automated plastic packaging equipment

Abstract

The present invention relates to a semiconductor automatic plastic packaging equipment, which includes a base and a sheet arranging device, wherein a first space is provided inside the base; the sheet arranging device is arranged in the first space, and the sheet arranging device includes a pushing mechanism, a transfer platform, a first conveying mechanism, a preheating platform and a second conveying mechanism, the pushing mechanism is used to push the sheet in the material box to the sheet conveying track; the transfer platform is arranged beside the conveying track, and the transfer platform has a plurality of temporary storage positions arranged in parallel for temporarily storing the sheet; the first conveying mechanism is slidably arranged above the transfer platform and the conveying track, and the first conveying mechanism is used to convey the sheet from the conveying track to the temporary storage position; the preheating platform is arranged beside the transfer platform, and the preheating platform has a plurality of preheating positions for preheating the sheet; the second conveying mechanism has a plurality of transfer stations corresponding to the temporary storage positions, each transfer station can clamp at least one sheet, and the second conveying mechanism can convey a plurality of sheets from the plurality of temporary storage positions arranged in parallel to the preheating platform.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor plastic packaging, and in particular to a semiconductor automatic plastic packaging device. Background Art

[0002] In current semiconductor packaging factories, workers face high temperatures, dust, and high labor intensity in the packaging workshop. This not only increases labor costs for companies, but also makes it difficult to recruit and manage employees. For this reason, automated equipment for semiconductor packaging has emerged. Since the process requires preheating the sheet in the sheet arrangement module, the existing technology pushes the sheet onto a transfer platform via a pushing mechanism and preheats it on the transfer platform. However, since both pushing and preheating the sheet require a certain amount of time, the main robot cannot transfer the sheet on the transfer platform during the preheating process. In other words, the main robot needs to stop and wait for the sheet to be preheated on the transfer platform. This results in a slower cycle time for the entire automated packaging equipment, which in turn affects production efficiency. Summary of the Invention

[0003] Based on this, it is necessary to provide a semiconductor automatic plastic packaging equipment to address the problem that the production cycle of semiconductor automatic plastic packaging equipment in the prior art is slow, thereby affecting production efficiency.

[0004] A semiconductor automatic plastic packaging device includes a base and a sheet arranging device, wherein a first space is provided inside the base; the sheet arranging device is provided in the first space, and the sheet arranging device includes:

[0005] The material pushing mechanism is used to push the sheets in the material box onto the sheet conveying track;

[0006] A transfer platform is provided beside the conveying track, and the transfer platform has a plurality of temporary storage positions arranged in parallel for temporarily storing the sheets;

[0007] a first transport mechanism, slidably disposed above the transfer platform and the conveying track, for transporting the sheet from the conveying track to the temporary storage position;

[0008] A preheating platform is provided beside the transfer platform, and the preheating platform has a plurality of preheating positions for preheating the sheet;

[0009] There are multiple transfer stations corresponding to the temporary storage positions, each transfer station can clamp at least one of the sheet, and the second transport mechanism can transport multiple sheets from the multiple temporary storage positions arranged in parallel to the preheating platform.

[0010] In some embodiments, the transfer platform includes:

[0011] A plurality of transfer slides arranged side by side, each slide having two mutually spaced support surfaces for supporting the sheet, the two mutually spaced support surfaces defining a plurality of temporary storage locations, and the plurality of temporary storage locations being arranged along the extension direction of the transfer slide;

[0012] A transmission assembly is movably connected to the transfer slide and can move along the extension direction of the transfer slide. The transmission assembly is used to work in conjunction with the material sheet to move the material sheet from one temporary storage position to another temporary storage position along the extension direction of the transfer slide.

[0013] In some embodiments, the transmission assembly includes:

[0014] a transmission rod rotatably connected to the bottom of the transfer slide;

[0015] a driving block, threadedly connected to the transmission rod, wherein a portion of a top surface of the driving block is in sliding contact with a bottom surface of the transfer slideway to restrict the driving block from rotating around the axis of the transmission rod;

[0016] A positioning pin has one end fixedly connected to the top surface of the driving block and the other end higher than the supporting surface, and the positioning pin is located beside the edge of the supporting surface.

[0017] In some embodiments, the first transport mechanism is slidably connected above one end of the transfer slide, and the preheating platform is disposed on a side of the transfer slide that is away from the first transport mechanism.

[0018] In some embodiments, the second transport mechanism includes a plurality of mutually spaced clamping portions, the number of the clamping portions corresponding to the number of the transfer slides, and the clamping portions are used to clamp the sheet on the transfer slides.

[0019] In some embodiments, the base further includes a second space and a third space, and the second space, the first space, and the third space are sequentially distributed from top to bottom inside the base. The semiconductor automated plastic packaging equipment further includes:

[0020] A press, staggered with the base, for plastic-sealing the workpiece;

[0021] a mold cleaning mechanism, movably connected to the press, for cleaning the mold on the press;

[0022] a debonding and boxing module, disposed in the second space, capable of removing the runner from the blank and placing the blank into a finished box;

[0023] a resin discharge mechanism, disposed in the third space and configured to discharge resin;

[0024] A main robot is arranged adjacent to the press and the base, and is used to transfer the sheet between the preheating platform, the press and the debonding and boxing module. The main robot is also used to transfer the resin between the resin discharge mechanism and the press.

[0025] In some embodiments, the de-glueing and boxing module includes:

[0026] A material storage platform having a plurality of material storage positions for storing the plastic-sealed sheets;

[0027] A runner removal mechanism is provided beside the material storage platform and is used to remove the runner on the plastic-sealed sheet;

[0028] The boxing mechanism is arranged on the side of the runner removal mechanism away from the material storage platform, and is used to place the material sheet after the runner is removed into the finished product box.

[0029] In some embodiments, the de-sprue mechanism includes:

[0030] a runner removal die, comprising an upper die and a lower die, wherein the lower die is fixed to the bottom wall corresponding to the first space, and the upper die is movable relative to the lower die, and the runner between the two tablets is removed by the punching force between the upper die and the lower die;

[0031] The first grabbing robot arm is arranged on one side of the material storage platform, and the first grabbing robot arm is used to transfer the material sheet from the material storage platform to the lower mold.

[0032] In some embodiments, the packaging mechanism includes:

[0033] a finished product box storage platform, provided on the bottom wall corresponding to the second space, for fixing the finished product box;

[0034] The second grabbing robot arm is provided at one side of the finished product box storage platform, and the second grabbing robot arm is used to transfer the blank from the de-sprue mechanism to the finished product box.

[0035] In some embodiments, the finished product box storage platform has two storage locations spaced apart from each other for storing the finished product boxes;

[0036] The second grabbing robot arm is provided with two grabbing parts spaced apart from each other, and the distance between the two grabbing parts corresponds to the distance between the cavities of the finished product boxes on the two storage positions.

[0037] In some embodiments, the main robot includes a loading and unloading mechanism, which is used to load and unload the web and the resin, and the loading and unloading mechanism includes:

[0038] A plurality of clamping assemblies, each of the clamping assemblies comprising a clamping portion capable of opening and closing to clamp and release the sheet;

[0039] A plurality of feeding components are connected to the clamping component, wherein the feeding component comprises a receiving cavity for receiving the resin, and the feeding component is used to feed the resin into the receiving cavity.

[0040] In some embodiments, the mold cleaning mechanism includes:

[0041] A visual unit is provided above the plastic encapsulation mold, and is used to detect the cleanliness status of the surface of the plastic encapsulation mold;

[0042] a cleaning unit slidably connected to the press, the cleaning unit being used to purge the molding die, the cleaning unit being able to extend above the molding die, or being able to retract to the side of the molding die;

[0043] A control unit is communicatively connected to both the visual unit and the cleaning unit, and the control unit controls the cleaning unit to run or stop in response to a detection result of the visual unit.

[0044] Beneficial effects of the present invention:

[0045] The semiconductor automated plastic packaging equipment provided by this technical solution pushes the sheet in the material box onto the conveyor track through a pushing mechanism, so that the sheet moves with the movement of the conveyor track, and then moves the sheet to the side of the transfer platform, so that the first conveying mechanism can convey the sheet from the conveyor track to the temporary storage position on the transfer platform. The preheating platform is set on the side of the transfer platform, and the sheet is conveyed to the preheating platform by the second conveying mechanism to preheat the sheet. Because in the prior art, the sheet is pushed onto the conveyor track by the pushing mechanism, and then the sheet is transferred from the conveyor track to the transfer platform by the manipulator, and the movement of the sheet on the conveyor track takes time, and the sheet is heated on the transfer platform. The preheating time of the sheet is often based on the preheating time of the last sheet. Therefore, during the preheating process, the main robot needs to wait for the preheating time of the sheet to meet the requirements before transferring it. This technical solution, however, features a dedicated preheating platform next to the transfer platform. The second transport mechanism transfers multiple parallel-arranged blanks from the temporary storage area to the preheating platform at once, allowing the preheating platform to preheat multiple blanks simultaneously while the transfer platform and conveyor track transport the blanks. This synergistic effect of the pusher mechanism, transfer platform, first transport mechanism, preheating platform, and second transport mechanism reduces the main robot's waiting time for materials, thereby improving the production cycle of the entire semiconductor automated plastic packaging equipment and ultimately increasing production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic structural diagram of a sheet arrangement device for semiconductor automated plastic packaging equipment provided by an embodiment of the present invention;

[0047] Figure 2 A schematic structural diagram of a sheet arrangement device for semiconductor automated plastic packaging equipment provided by an embodiment of the present invention;

[0048] Figure 3 A schematic structural diagram of the pusher mechanism side of the sheet arrangement device of the semiconductor automated plastic packaging equipment provided by an embodiment of the present invention;

[0049] Figure 4 A schematic structural diagram of a conveying track in a sheet arrangement device of a semiconductor automated plastic packaging equipment provided by an embodiment of the present invention;

[0050] Figure 5 A schematic structural diagram of a transfer platform in a sheet arrangement device of a semiconductor automated plastic packaging equipment provided by an embodiment of the present invention;

[0051] Figure 6 A schematic structural diagram of a first transport mechanism in a sheet arrangement device of a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0052] Figure 7A schematic structural diagram of a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0053] Figure 8 A schematic diagram of the three-dimensional structure of the layout of various mechanisms within a base in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0054] Figure 9 A schematic planar structural diagram of the layout of various mechanisms within a base in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0055] Figure 10 A schematic diagram of the three-dimensional structure of the layout of various mechanisms within a base in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0056] Figure 11 A schematic diagram of the three-dimensional structure of a debonding and boxing module in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0057] Figure 12 A schematic structural diagram of a material storage platform in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0058] Figure 13 A schematic structural diagram of a finished product box storage platform in a debonding and boxing module in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0059] Figure 14 A schematic structural diagram of a runner removal mold in a desizing and boxing module in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0060] Figure 15 A schematic structural diagram of a main robot in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0061] Figure 16 A schematic structural diagram of a press and mold cleaning mechanism in a semiconductor automated plastic packaging device provided by an embodiment of the present invention;

[0062] Figure 17 This is a structural schematic diagram of a resin discharge mechanism in a semiconductor automated plastic packaging device provided by an embodiment of the present invention.

[0063] Base 10; first space 101; second space 102; third space 103; first bottom plate 104; second bottom plate 105;

[0064] Sheet arrangement device 20; pushing mechanism 201; transfer platform 202; transfer slide 2021; support surface 2022; transmission assembly 2023; transmission rod 2023a; drive block 2023b; end plate 2024; first transport mechanism 203; guide rail 2031; preheating platform 204; preheating position 2041; second transport mechanism 205; transfer station 2051; conveying track 206;

[0065] Press 30; Plastic encapsulation mold 301;

[0066] Mold cleaning mechanism 40; visual unit 401; cleaning unit 402;

[0067] Glue removal and cartoning module 50; material storage platform 501; material storage position 5011; runner removal mechanism 502; runner removal mold 5021; upper mold 5021a; lower mold 5021b; first grabbing robot arm 5022; cartoning mechanism 503; finished product box storage platform 5031; storage position 5031a; second grabbing robot arm 5032;

[0068] Resin discharge mechanism 60;

[0069] Main robot 70; gripping component 701; feeding component 702; material box 80. DETAILED DESCRIPTION

[0070] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings. The following description sets forth numerous specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0071] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0072] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0073] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0074] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0075] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0076] See Figures 1-17 , Figure 1The structure diagram of the sheet discharging device of the semiconductor automatic plastic packaging equipment provided by an embodiment of the present invention is shown. An embodiment of the present invention provides a semiconductor automatic plastic packaging equipment, which includes a base 10 and a sheet discharging device 20. The base 10 is provided with a first space 101; the sheet discharging device 20 is arranged in the first space 101, and the sheet discharging device 20 includes a pushing mechanism 201, a transfer platform 202, a first conveying mechanism 203, a preheating platform 204 and a second conveying mechanism 205. The pushing mechanism 201 is used to push the sheet in the material box 80 to the sheet conveying track 206; the transfer platform 202 is arranged beside the conveying track 206, and the transfer platform 20 2 has a plurality of temporary storage positions arranged in parallel for temporarily storing webs; a first transport mechanism 203 is slidably disposed above the transfer platform 202 and the conveying track 206, and is used to transport webs from the conveying track 206 to the temporary storage positions; a preheating platform 204 is disposed beside the transfer platform 202, and has a plurality of preheating positions 2041 for preheating webs; a second transport mechanism 205 has a plurality of transfer stations 2051 corresponding to the temporary storage positions, each transfer station 2051 being capable of clamping at least one web, and the second transport mechanism 205 is capable of transporting a plurality of webs from the plurality of temporary storage positions arranged in parallel to the preheating platform 204.

[0077] The semiconductor automated plastic packaging equipment provided by this technical solution uses a pushing mechanism 201 to push the blanks in the magazine 80 onto the conveyor track 206, so that the blanks move with the movement of the conveyor track 206 and then move to the side of the transfer platform 202, so that the first transport mechanism 203 can transport the blanks from the conveyor track 206 to a temporary storage position on the transfer platform 202. A preheating platform 204 is set next to the transfer platform 202, and the second transport mechanism 205 transports the blanks to the preheating platform 204 for preheating. In the prior art, the material pusher 201 pushes the sheet onto the conveyor track 206, and the manipulator then transfers the sheet from the conveyor track 206 to the transfer platform 202. Furthermore, the movement of the sheet by the conveyor track 206 takes time. Furthermore, the preheating time for heating the sheet on the transfer platform 202 is often based on the preheating time of the last sheet. Therefore, during the preheating process, the main robot 70 needs to wait for the sheet's preheating time to meet the requirement before transferring the sheet. In contrast, the present invention provides a preheating platform 204 dedicated to preheating next to the transfer platform 202. Multiple sheets arranged in parallel on the temporary storage location can be transferred to the preheating platform 204 at once via the second transport mechanism 205. This allows the preheating platform 204 to preheat multiple sheets simultaneously, while the transfer platform 202 and the conveyor track 206 transport the sheets. That is, the synergistic effect of the pushing mechanism 201, the transfer platform 202, the first transport mechanism 203, the preheating platform 204 and the second transport mechanism 205 reduces the waiting time of the main robot 70, thereby improving the production rhythm of the entire semiconductor automated plastic packaging equipment and further improving production efficiency.

[0078] There is no limitation on the workpieces to be molded by the semiconductor automation molding equipment. In this embodiment, the lead frame is used as an example for illustration. Figure 9 As shown, there is a cavity in the frame of the base 10, which is divided from top to bottom into a second space 102, a first space 101 and a third space 103 by a first bottom plate 104 and a second bottom plate 105. The film arrangement device 20 is arranged in the first space 101. Figure 2The left side of the drawing is provided with a magazine 80 for placing lead frames. The magazines 80 are arranged sequentially from the front to the back on the left side of the first space 101. Each magazine 80 is provided with multiple support positions for supporting the lead frames. When the opening of the magazine 80 is aligned with the end of the conveyor track 206, the pushing mechanism 201 pushes the lead frames in the first layer of the magazine 80 from the end of the magazine 80 facing away from the conveyor track 206 onto the conveyor track 206. The magazine 80 then descends until the lead frames in the second layer are flush with the plane of the conveyor track 206. The pushing mechanism 201 then pushes the lead frames in the second layer. The above steps are repeated in sequence. When all the lead frames in the magazine 80 have been pushed out, the magazine 80 descends to the bottom of the first space 101. The front magazine 80 is pushed to align with the conveyor track 206, so that the pushing mechanism 201 can push the lead frames in the magazine 80 aligned with the conveyor track 206. The conveying track 206 is a conventional track for conveying lead frames and will not be described in detail here.

[0079] In some embodiments, as Figure 1-2 as well as Figure 5 As shown, the transfer platform 202 includes a plurality of transfer slides 2021 arranged side by side and a transmission assembly 2023 for driving the lead frame to slide along the temporary storage. Each slide has two support surfaces 2022 spaced apart from each other for supporting the material. Each slide has two support surfaces 2022 spaced apart from each other for supporting the material. The two support surfaces 2022 spaced apart from each other define a plurality of temporary storage positions, and the plurality of temporary storage positions are arranged along the extension direction of the transfer slide 2021; the transmission assembly 2023 is movably connected to the transfer slide 2021 and can move along the extension direction of the transfer slide 2021. The transmission assembly 2023 is used to link with the material so that the material moves from one temporary storage position to another temporary storage position along the extension direction of the transfer slide 2021.

[0080] It should be noted that, in this embodiment, the extension direction of all transfer slides 2021 is consistent with the extension direction of the transmission track, that is, all transfer slides 2021 and the transmission track are arranged side by side, such as Figure 9 As shown, the transfer slide 2021 and the transfer track extend along the left and right directions of the first space 101. The material box 80 and the preheating platform 204 are respectively arranged at both ends of the extension direction of the transfer slide 2021. Specifically, as Figure 5As shown, each transfer slide 2021 includes two spaced apart structural members, and each structural member is provided with an L-shaped groove along its extension direction. The grooves on the two structural members are arranged opposite to each other, and the surface along the horizontal plane of the L-shaped groove is the support surface 2022. A bracket is provided at each end of the structural member, and one end of the bracket is fixed on the second base plate 105 so that there is a certain accommodation space between the structural member and the second base plate 105 to facilitate the arrangement of other components. The two ends of the structural member are respectively connected to the bracket, and the bracket is used to support the structural member. The support surfaces 2022 on the two structural members define a temporary storage position for supporting the lead frame, such as Figure 5 As shown, two temporary storage positions are provided on the same transfer slide 2021 along its extending direction, that is, two lead frames can be temporarily stored on one transfer slide 2021 along its extending direction.

[0081] The transmission assembly 2023 can be arranged above the transfer slide 2021, or below the transfer slide 2021 or at other locations. Figure 1-Figure 2 as well as Figure 5 As shown, the transmission assembly 2023 is entirely disposed below the transfer slide 2021, that is, the transmission assembly 2023 is disposed between the support structure and the second base plate 105. A portion of the transmission assembly 2023 can move along the extension direction of the transfer slide 2021, thereby driving the lead frame placed on the transfer slide 2021 to move from one temporary storage position to the next along the extension direction of the transfer slide 2021 under the driving force of the transmission assembly 2023.

[0082] Specifically, if Figure 5As shown, the transmission assembly 2023 includes a transmission rod 2023a, a driving block 2023b and a positioning pin. The transmission rod 2023a is rotatably connected to the bottom of the transfer slide 2021; the driving block 2023b is threadedly connected to the transmission rod 2023a, and a portion of the top surface of the driving block 2023b is slidably fitted with the bottom surface of the transfer slide 2021 to limit the driving block 2023b from rotating around the axis of the transmission rod 2023a; one end of the positioning pin is fixedly connected to the top surface of the driving block 2023b, and the other end is higher than the support surface 2022, and the positioning pin is located beside the edge of the support surface 2022. Transmission rod 2023a is provided with an external thread, and driver block 2023b is provided with an internal thread. A portion of the top surface of driver block 2023b slides in contact with the bottom surface of a structural member forming transfer slideway 2021. This allows the bottom surface of the structural member to resist driver block 2023b, thereby restricting the driver member from rotating about the axis of transmission rod 2023a, thereby converting the rotation of transmission rod 2023a about its own axis into linear movement of the driver rod along the axis of transmission rod 2023a. The ends of transmission rod 2023a are rotatably connected to two brackets of transfer slideway 2021, thereby enabling the driver block 2023b to move along the extension direction of transfer slideway 2021. A positioning pin is provided on driver block 2023b, allowing the positioning pin to move with the movement of driver block 2023b. The end of the positioning pin facing away from the driver block 2023b is positioned higher than the support surface 2022, allowing the raised portion of the positioning pin to be inserted into the pin hole in the lead frame, thereby achieving a connection between the positioning pin and the lead frame. With this arrangement, as the positioning pin moves along the transfer slide 2021 with the driver block 2023b, the lead frame can move from one temporary storage position to the next along the extension direction of the transfer slide 2021 with the positioning pin.

[0083] In some embodiments, the first transport mechanism 203 is slidably connected above one end of the transfer slide 2021 , and the preheating platform 204 is disposed beside the end of the transfer slide 2021 facing away from the first transport mechanism 203 .

[0084] Specifically, if Figure 1-Figure 2 as well as Figure 6As shown, a guide rail 2031 assembly is disposed above and on the side of one end of the transfer slide 2021 facing the storage area for the magazines 80. The guide rail 2031 assembly includes two end plates 2024, a connector, and the guide rail 2031. The two end plates 2024 are respectively fixed to the second base plate 105. The ends of the connector are connected to the two end plates 2024, forming a stable integral body between the two end plates 2024. In this embodiment, two spaced-apart connectors are provided, extending perpendicularly to the direction of extension of the transfer slide 2021. The ends of the guide rail 2031 are respectively fixedly connected to the two end plates 2024, extending perpendicularly to the direction of extension of the transfer slide 2021. The first transport mechanism 203 is slidably connected to the guide rail 2031, enabling the first transport mechanism 203 to move from the position of the conveyor track 206 to the position of the forwardmost transfer slide 2021. In this embodiment, since only one conveying track 206 is provided, only one clamping station is provided on the first conveying mechanism 203, that is, one first conveying mechanism 203 can only transport one lead frame. Of course, in other embodiments, multiple conveying tracks 206 can be provided side by side, and multiple clamping stations corresponding to the number of conveying tracks 206 can be provided on the first conveying mechanism 203, so that the lead frames on multiple conveying tracks 206 can be transported to multiple transfer slides 2021 at one time. The specific structural form of the first conveying mechanism 203 can be an existing conventional setting, which will not be described in detail here. The preheating platform 204 is provided on the side of the transfer slide 2021 away from one end of the first conveying mechanism 203 to prevent interference between the second conveying mechanism 205 and the first conveying mechanism 203, thereby making the spatial layout of the entire sheet arrangement device 20 more reasonable and the operation more stable and reliable.

[0085] In some embodiments, the second transport mechanism 205 includes a plurality of spaced-apart clamping portions, the number of which corresponds to the number of transfer slides 2021. The clamping portions are used to grip the blanks on the transfer slides 2021. It should be noted that the second transport mechanism 205 is used to transport lead frames on the end of the transfer slide 2021 facing away from the first transport mechanism 203. The plurality of clamping portions provided on the second transport mechanism 205, with the number of clamping portions corresponding to the number of transfer slides 2021, allows the second transport mechanism 205 to simultaneously transport all lead frames on the transfer slide 2021 near the preheating platform 204 onto the preheating platform 204. This improves production efficiency and reduces the preheating cycle time for the lead frames on the entire preheating platform 204, thereby reducing the waiting time of the main robot 70 and improving the production cycle time of the entire semiconductor automation equipment plastic packaging system.

[0086] Reference Figures 1-9It is understood that the overall operation of the sheet arrangement device 20 is as follows: the pusher mechanism 201 pushes the lead frames from the magazine 80 onto the conveyor track 206. The first transport mechanism 203 then transports the lead frames to the transfer slide 2021. The transmission assembly 2023 then moves the lead frames from the temporary storage position away from the preheating platform 204 to a station near the preheating platform 204. The second transport mechanism 205 then transports the multiple lead frames on the transfer slide 2021 to the preheating platform 204. The preheating platform 204 then preheats the multiple lead frames. It should be noted that the number of preheating stations 2041 on the preheating platform 204 matches the number of molding stations on the molding press 30 and the number of clamping sections of the main robot 70. This allows the main robot 70 to transfer all lead frames on the preheating platform 204 to the molding mold 301 at once. Through such an arrangement, the transport track, the first transport mechanism 203, the transfer platform 202, the second transport mechanism 205 and the preheating platform 204 each perform their respective functions without affecting each other, so that the main robot 70 does not need to wait for the delivery of the lead frame on the transfer slide 2021, but only needs to transfer the lead frame according to the preheating status of the lead frame on the preheating platform 204, thereby saving the column robot transfer cycle and improving the production efficiency of the entire semiconductor automated plastic packaging equipment.

[0087] In some embodiments, see Figure 7-Figure 9 It is understood that the base 10 also includes a second space 102 and a third space 103. The second space 102, the first space 101 and the third space 103 are distributed in sequence from top to bottom inside the base 10. The semiconductor automated plastic packaging equipment also includes a press 30, a mold cleaning mechanism 40, a debonding and boxing module 50, a resin discharge mechanism 60 and a main robot 70. Among them, the press 30 is staggered with the base 10 and is used for plastic packaging workpieces; the mold cleaning mechanism 40 is movably connected to the press 30 for cleaning the press. 30; the degumming and boxing module 50 is arranged in the second space 102, and the degumming and boxing module 50 can remove the runner on the tablet and place the tablet in the finished box; the resin discharge mechanism 60 is arranged in the third space 103, and is used to discharge resin; the main robot 70 is arranged adjacent to the press 30 and the base 10, and the main robot 70 is used to transfer the tablet between the preheating platform 204, the press 30 and the degumming and boxing module 50, and the main robot 70 is also used to transfer resin between the resin discharge mechanism 60 and the press 30.

[0088] The degumming and boxing module 50, the film discharge mechanism and the resin discharge mechanism 60 are respectively arranged in the second space 102, the first space 101 and the third space 103 in the height direction of the base 10. On the one hand, it is convenient for the main robot 70 to transport, and on the other hand, it is conducive to saving space, thereby making the entire semiconductor automatic plastic packaging equipment compact in structure, small in footprint, and space-saving. The press 30 and the base 10 are staggered so that there is a space between the press 30 and the base 10, which can be used to arrange the main robot 70 so that the main robot 70 can transport the lead frame between the base 10 and the press 30. The mold cleaning mechanism cleans the mold on the press 30, thereby improving the automation level of the entire plastic packaging equipment. By arranging the degumming and boxing module 50, the functions of automatic runner removal and automatic boxing are realized, which also improves the automation level of the entire plastic packaging equipment, thereby saving labor.

[0089] Further, see Figure 10-14 It is understood that the de-glueing and boxing module 50 includes a material storage platform 501, a runner removal mechanism 502, and a boxing mechanism 503. The material storage platform 501 has multiple material storage positions 5011 for storing plastic-sealed sheets; the runner removal mechanism 502 is located next to the material storage platform 501 and is used to remove the runners on the plastic-sealed sheets; the boxing mechanism 503 is located next to the runner removal mechanism 502 away from the material storage platform 501 and is used to place the sheets after the runners are removed into the finished box. The plastic-sealed lead frame is transported to the material storage platform 501 by the main robot 70, and the runners generated by the lead frame during the plastic-sealing process are removed by the runner removal mechanism 502. Finally, the boxing mechanism 503 places the lead frame after the runners are removed from the runner removal mechanism 502 into the finished box. With the above structure, the lead frame after the runner is removed can be directly loaded into the finished product box, which saves labor and improves the automation level of the plastic packaging equipment.

[0090] Specifically, see Figure 10-14It is understood that the runner removal mechanism 502 includes a runner removal mold 5021 and a first grabbing robot 5022. The runner removal mold 5021 includes an upper mold 5021a and a lower mold 5021b. The lower mold 5021b is fixed to the bottom wall corresponding to the first space 101. The upper mold 5021a is movable relative to the lower mold 5021b. The runner between the two tablets is removed by the punching force between the upper mold 5021a and the lower mold 5021b. The first grabbing robot 5022 is located on one side of the material storage platform 501 and is used to transfer the tablets from the material storage platform 501 to the lower mold 5021b. The first grabbing robot 5022 transfers the lead frame placed on the material storage platform 501 to the lower mold 5021b. Then, by moving the upper mold 5021a, the upper mold 5021a acts on the runner on the lead frame, removing the runner through the punching force. It should be noted that, in this embodiment, one encapsulation mold 301 can encapsulate two lead frames at the same time, so that the two lead frames share one runner. In other words, after encapsulation, the two lead frames are connected together through the runner. Accordingly, the first grabbing robot arm 5022 grabs the two lead frames at the same time, and the runner removal mold 5021 is also used to remove the runner between the two lead frames, and the packing mechanism 503 can simultaneously load the two lead frames into two finished product boxes respectively. It should be noted that the material storage platform 501 is provided with material storage positions 5011 corresponding to the number of encapsulation molds 301 in the press 30, and each material storage position 5011 can store two lead frames.

[0091] In some embodiments, see Figure 10-14 It is understood that the boxing mechanism 503 includes a finished product box storage platform 5031 and a second grabbing robot 5032. The finished product box storage platform 5031 is located on the bottom wall corresponding to the second space 102 and is used to hold the finished product boxes. The second grabbing robot 5032 is located on one side of the finished product box storage platform 5031 and is used to transfer the blanks from the de-sprue mechanism 502 to the finished product boxes. The second grabbing robot 5032 transfers the lead frame, after the sprue is removed from the de-sprue mechanism 502, into the finished product box, completing the boxing process of the lead frame.

[0092] In this embodiment, see Figure 10-14It is understood that the finished product box storage platform 5031 has two mutually spaced storage locations 5031a for storing finished product boxes; the second grabbing robot arm 5032 is provided with two mutually spaced gripping portions, the distance between the two gripping portions corresponding to the distance between the cavities of the finished product boxes on the two storage locations 5031a. The two storage locations 5031a are used to store finished product boxes. Specifically, a positioning structure can be provided on the filing device to secure the finished product box when the packaging package is placed on the storage locations 5031a. When the second grabbing robot arm 5032 places the lead frame into the finished product box, the finished product box is fixed in place, thereby ensuring a smooth packaging process. The two grasping parts on the second grasping robot arm 5032 correspond to the positions of the two lead frames on the de-runner mold 5021, so that the second grasping robot arm 5032 can grasp the two lead frames on the de-runner mold 5021 at the same time; and the distance between the grasping parts on the second grasping robot arm 5032 is set to correspond to the distance between the cavities of the finished product boxes on the two storage positions 5031a, so that the second grasping robot arm 5032 can just place the two lead frames into the finished product box, thereby successfully completing the packing process of the leads in the frame.

[0093] In some embodiments, participation Figure 15It is understood that the main robot 70 includes a loading and unloading mechanism, which is used to load and unload the blanks and resin. The loading and unloading mechanism includes multiple gripping components 701 and multiple feeding components 702. The gripping components 701 include a clamping portion that can be opened and closed to grip and release the blanks; the feeding component 702 is connected to the gripping components 701, and the feeding component 702 includes a receiving cavity for accommodating the resin, and the feeding component 702 is used to release the resin into the receiving cavity. By integrating the gripping components 701 and the feeding components 702 together, when the lead frame is plastic-encapsulated, the lead frame can be transferred from the preheating platform 204 to the plastic encapsulation mold 301 via the gripping components 701, and the resin material can be directly released into the plastic encapsulation mold 301 via the feeding components 702 connected to the gripping components 701. During the entire process, the robot only needs to move from the preheating platform 204 to the plastic encapsulation mold 301 once to achieve the transfer of the lead frame and the release of the plastic encapsulation material. The material transfer process is saved, and the material transfer time is saved, thereby improving production efficiency and thus increasing production capacity. It should be noted that, in the present embodiment, each clamping component 701 includes two clamping parts, and each clamping part can clamp one lead frame, that is, one clamping component 701 can clamp one lead frame. The number of clamping components 701 can be determined according to the number of plastic encapsulation molds 301 on the press 30. For example, a press 30 is provided with 4 plastic encapsulation molds 301, and each plastic encapsulation mold 301 includes a cavity for plastic encapsulating two lead frames, then a main robot 70 needs to be provided with 4 clamping components 701. The number of feeding components 702 should be consistent with the number of clamping parts, so that each feeding component 702 feeds one cavity in a plastic encapsulation mold 301.

[0094] In some embodiments, reference Figure 16It is understood that the mold cleaning mechanism 40 includes a visual unit 401, a cleaning unit 402, and a control unit. The visual unit 401 is provided above the molding mold 301 and is used to detect the cleanliness of the surface of the molding mold 301. The cleaning unit 402 is slidably connected to the press 30 and is used to purge the molding mold 301. The cleaning unit 402 can extend above the molding mold 301 or retract to the side of the molding mold 301. The control unit is in communication with both the visual unit 401 and the cleaning unit 402. The control unit controls the operation or stop of the cleaning unit 402 in response to the detection result of the visual unit 401. The visual unit 401 is provided in the cleaning mechanism of the molding mold 301 and is used to detect the cleanliness of the surface of the molding mold 301. The visual unit 401 can feed back the detected cleanliness to the control unit. The control unit controls the operation of the cleaning element according to the result of the cleanliness detected by the visual unit 401. The cleaning unit 402 is configured to slide relative to the molding press 30. When the surface of the molding mold 301 needs to be cleaned, the cleaning unit 402 extends above the molding mold 301 to clean the molding mold 301. After cleaning the molding mold 301, the cleaning unit 402 retracts to the side of the molding mold 301 to provide the necessary operating space for the molding process of the molding mold 301. Through the coordinated action of the vision unit 401, the cleaning unit 402, and the control unit, the molding mold 301 is automatically cleaned. Not only can the vision unit 401 provide feedback on the cleaning status, thereby reducing the risk of material jamming due to inadequate cleaning, but it can also replace manual cleaning, thereby improving the automation level of the mold cleaning process.

[0095] The working principle of the semiconductor automatic plastic packaging equipment provided by the embodiment of the present invention is as follows:

[0096] The sheet discharging device 20, the press 30, the glue removal and boxing module 50 and the resin discharge mechanism 60 operate independently to perform their respective functions.

[0097] The pushing mechanism 201 pushes the lead frame in the material box 80 onto the conveying track 206. The first conveying mechanism 203 transfers the lead frame on the conveying track 206 to the transfer platform 202. The transmission component 2023 on the transfer platform 202 transfers the lead frame from one end to the other end. Then, multiple lead frames are transported to the preheating platform 204 at one time for preheating through the second conveying mechanism 205. The plastic encapsulation mold 301 in the press 30 is responsible for plastic encapsulating the lead frame; the mold cleaning mechanism 40 is responsible for cleaning the plastic encapsulation mold 301 after plastic encapsulation; the resin discharge mechanism 60 is responsible for placing the resin; the de-glueing and boxing module 50 is responsible for removing the runner on the lead frame after plastic encapsulation and placing the finished lead frame after the runner is removed into the finished product box. Throughout the entire process, the main robot is used to load and unload materials (including lead frames and resin) between the above-mentioned modules. Specifically, the main working process of the main robot is as follows:

[0098] Since the encapsulation of the lead frame in the encapsulation mold 301 takes a considerable amount of time, the loading and unloading mechanism of the main robot 70 moves to the resin discharge mechanism 60. Other manipulators then place resin into the feeding assembly 702 within the loading and unloading mechanism. Once the resin is placed in the loading and unloading mechanism of the main robot 70, the encapsulation of the encapsulation mold 301 is essentially complete and the mold is opened. At this point, the gripping assembly 701 within the loading and unloading mechanism of the main robot 70 grabs the encapsulated lead frame from the encapsulation mold 301 and transfers it to the material storage platform 501. The loading and unloading mechanism of the main robot 70 then moves to the preheating platform 204 of the sheet discharge device 20. The gripping assembly 701 grabs the preheated lead frame. In this embodiment, the loading and unloading mechanism of the main robot 70 can simultaneously hold eight lead frames. The loading and unloading mechanism of the main robot 70 transfers the lead frame to the encapsulation mold 301, and the feeding assembly 702 then deposits the resin into the encapsulation mold 301. This cycle is repeated to complete the plastic encapsulation of the lead frame. The operation of the main robot 70 in this manner not only allows the entire plastic encapsulation process to proceed in an orderly manner, but also makes the production cycle of the entire plastic encapsulation process more compact, thereby increasing the utilization rate of each module and improving the production efficiency of the entire semiconductor automated plastic encapsulation equipment.

[0099] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0100] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A semiconductor automatic plastic packaging equipment, characterized in that: It includes a base and a film arrangement device, wherein a first space is provided inside the base; The film arrangement device is provided in the first space, and the film arrangement device includes: The material pushing mechanism is used to push the sheets in the material box onto the sheet conveying track; A transfer platform is provided beside the conveying track, and the transfer platform has a plurality of temporary storage positions arranged in parallel for temporarily storing the sheets; a first transport mechanism, slidably disposed above the transfer platform and the conveying track, for transporting the sheet from the conveying track to the temporary storage position; A preheating platform is provided beside the transfer platform, and the preheating platform has a plurality of preheating positions for preheating the sheet; The second conveying mechanism has multiple transfer stations corresponding to the temporary storage positions, each transfer station can clamp at least one of the sheet, and the second conveying mechanism can transport multiple sheets from the multiple temporary storage positions arranged in parallel to the preheating platform.

2. The semiconductor automatic plastic packaging equipment according to claim 1, characterized in that: The transfer platform includes: A plurality of transfer slides arranged side by side, each slide having two mutually spaced support surfaces for supporting the sheet, the two mutually spaced support surfaces defining a plurality of temporary storage locations, and the plurality of temporary storage locations being arranged along the extension direction of the transfer slide; A transmission assembly is movably connected to the transfer slide, a portion of which can move along the extension direction of the transfer slide, and the transmission assembly is used to work in conjunction with the material sheet to move the material sheet from one temporary storage position to another temporary storage position along the extension direction of the transfer slide.

3. The semiconductor automatic plastic packaging equipment according to claim 2, characterized in that: The transmission assembly comprises: a transmission rod rotatably connected to the bottom of the transfer slide; a driving block, threadedly connected to the transmission rod, wherein a portion of a top surface of the driving block is in sliding contact with a bottom surface of the transfer slideway to restrict the driving block from rotating around the axis of the transmission rod; A positioning pin has one end fixedly connected to the top surface of the driving block and the other end higher than the supporting surface, and the positioning pin is located beside the edge of the supporting surface.

4. The semiconductor automatic plastic packaging equipment according to any one of claims 1 to 3, characterized in that: The base further includes a second space and a third space, wherein the second space, the first space, and the third space are sequentially distributed from top to bottom inside the base, and the semiconductor automated plastic packaging equipment further includes: A press, staggered with the base, for plastic-sealing the workpiece; a mold cleaning mechanism, movably connected to the press, for cleaning the mold on the press; a debonding and boxing module, disposed in the second space, capable of removing the runner from the blank and placing the blank into a finished box; a resin discharge mechanism, disposed in the third space and configured to discharge resin; A main robot is arranged adjacent to the press and the base, and is used to transfer the sheet between the preheating platform, the press and the debonding and boxing module. The main robot is also used to transfer the resin between the resin discharge mechanism and the press.

5. The semiconductor automatic plastic packaging equipment according to claim 4, characterized in that: The debonding and boxing module includes: A material storage platform having a plurality of material storage positions for storing the plastic-sealed sheets; A runner removal mechanism is provided beside the material storage platform and is used to remove the runner on the plastic-sealed sheet; The boxing mechanism is arranged on the side of the runner removal mechanism away from the material storage platform, and is used to place the material sheet after the runner is removed into the finished product box.

6. The semiconductor automatic plastic packaging equipment according to claim 5, characterized in that: The de-sprue mechanism comprises: a runner removal die, comprising an upper die and a lower die, wherein the lower die is fixed to the bottom wall corresponding to the first space, and the upper die is movable relative to the lower die, and the runner between the two tablets is removed by the punching force between the upper die and the lower die; The first grabbing robot arm is arranged on one side of the material storage platform, and the first grabbing robot arm is used to transfer the material sheet from the material storage platform to the lower mold.

7. The semiconductor automatic plastic packaging equipment according to claim 5, characterized in that: The packing mechanism comprises: a finished product box storage platform, provided on the bottom wall corresponding to the second space, for fixing the finished product box; The second grabbing robot arm is provided at one side of the finished product box storage platform, and the second grabbing robot arm is used to transfer the blank from the de-sprue mechanism to the finished product box.

8. The semiconductor automatic plastic packaging equipment according to claim 7, characterized in that: The finished product box storage platform has two storage locations spaced apart from each other for storing the finished product boxes; The second grabbing robot arm is provided with two grabbing parts spaced apart from each other, and the distance between the two grabbing parts corresponds to the distance between the cavities of the finished product boxes on the two storage positions.

9. The semiconductor automatic plastic packaging equipment according to claim 4, characterized in that: The main robot includes a loading and unloading mechanism, which is used to load and unload the sheet and the resin. The loading and unloading mechanism includes: A plurality of clamping assemblies, each of the clamping assemblies comprising a clamping portion capable of opening and closing to clamp and release the sheet; A plurality of feeding components are connected to the clamping component, wherein the feeding component comprises a receiving cavity for receiving the resin, and the feeding component is used to feed the resin into the receiving cavity.

10. The semiconductor automatic plastic packaging equipment according to claim 4, characterized in that: The mold cleaning mechanism includes: A visual unit is provided above the plastic encapsulation mold, and is used to detect the cleanliness status of the surface of the plastic encapsulation mold; a cleaning unit slidably connected to the press, the cleaning unit being used to purge the molding die, the cleaning unit being able to extend above the molding die, or being able to retract to the side of the molding die; A control unit is communicatively connected to both the visual unit and the cleaning unit, and the control unit controls the cleaning unit to run or stop in response to a detection result of the visual unit.

Images