Environmentally Controllable Micro / Nano Precision Eddy Current Sensor Testing Platform

Abstract

This invention discloses a temperature-controlled micro / nano precision eddy current sensor testing platform, comprising a base, a moving module, a load assembly, a displacement sensor, a probe holding module, a probe, and a temperature control module. The moving module is used to move the load assembly at least in a first horizontal direction. The displacement sensor is connected to the moving module and is used to measure the relative displacement distance of the load assembly. The probe is mounted on the probe holding module and is opposite to the load assembly in the first horizontal direction. The probe holding module is used to move the probe at least in a second horizontal direction perpendicular to the first horizontal direction and in a vertical direction. The eddy current sensor testing platform disclosed in this invention is horizontally arranged overall. It uses a unit displacement sensor to measure the lift-off distance online for precise adjustment, and the temperature control module realizes local temperature monitoring and adjustment, making the ambient temperature of the probe and the sample under test measurable and controllable.

Description

Technical Field

[0001] This invention relates to the field of high-precision measurement technology, and in particular to a test platform for micro-nano precision eddy current sensors with controllable ambient temperature. Background Technology

[0002] As a high-precision non-contact detection method, eddy current sensors can be applied to measure micron-level displacement or nanometer-level metal thin film thickness. Calibration and performance testing are crucial aspects of sensor research, with a focus on performance indicators such as sensitivity, measurement range, output stability, and accuracy. Conventional testing platforms typically place the sample horizontally and fix the probe vertically. In this configuration, the lift-off distance is easily affected by vibration, and previous technologies often used two displacement sensors differentially to measure the lift-off distance. Furthermore, the impact of ambient temperature changes on sensor performance needs effective evaluation. Therefore, while ensuring accurate and controllable lift-off distance, implementing a local ambient temperature control module and its integration with the platform is of great significance. Summary of the Invention

[0003] This invention aims to at least partially address one of the technical problems in related technologies. To this end, embodiments of this invention propose a testing platform for eddy current sensors with precisely adjustable lift-off distance and controllable ambient temperature.

[0004] The eddy current sensor testing platform of this invention includes: a base, a moving module, a load assembly, a displacement sensor, a probe holding module, a probe, and a temperature control module. The moving module and the probe holding module are mounted on the base. The load assembly carries the sample to be tested and is connected to the moving module. The moving module moves the load assembly at least in a first horizontal direction. The displacement sensor is connected to the moving module and measures the relative displacement distance of the load assembly in real time. The probe is mounted on the probe holding module and is opposite to the load assembly in the first horizontal direction. The probe holding module moves the probe at least in a second horizontal direction perpendicular to the first horizontal direction and in a vertical direction. The operation is simple. The temperature control module includes a temperature sensor and a heating element. The temperature sensor and the heating element are located in at least one of the probe holding module and the load assembly, and are used to regulate the local ambient temperature of the probe and / or the sample to be tested.

[0005] The eddy current sensor testing platform provided in this invention can be used for performance testing and calibration of eddy current sensors, and can also serve as an experimental platform to measure relevant parameters of the sample under test. The eddy current sensor testing platform is horizontally arranged, with the probe and the sample under test facing each other in the horizontal direction, effectively reducing potential vibration problems associated with vertical placement. Furthermore, it provides a method for online measurement of lift-off distance using a unit displacement sensor, offering high measurement accuracy and low cost. In addition, the temperature control module enables local temperature monitoring and adjustment, making the ambient temperature measurable and controllable.

[0006] In some embodiments, the moving module includes a horizontal displacement fine-tuning component, a first adapter bracket, and a first micro-motion module. The first micro-motion module is disposed on the base, the first adapter bracket is connected to the first micro-motion module, the horizontal displacement fine-tuning component is disposed on the first adapter bracket and connected to the load assembly to move the load assembly in the first horizontal direction, and the first micro-motion module is used to move the first adapter bracket in the first horizontal direction and simultaneously move the horizontal displacement fine-tuning component and the load assembly.

[0007] In some embodiments, the first adapter bracket includes a vertically arranged first adapter plate, the first adapter plate being perpendicular to the first horizontal direction, the loading assembly being located on the side of the first adapter plate closer to the probe, and the horizontal displacement fine-tuning assembly being supported by the first adapter bracket and connected to the loading assembly.

[0008] In some embodiments, a through hole is provided on the first adapter plate, and the horizontal displacement fine adjustment component is located on the side of the first adapter plate away from the probe and passes through the through hole to be connected to the loading component.

[0009] In some embodiments, a side baffle is connected to one side of the first adapter plate, and the displacement sensor is connected to the side baffle.

[0010] In some embodiments, the probe holding module includes a second adapter bracket, a second micro-motion module, and a probe mounting bracket. The second adapter bracket is disposed on the base, the second micro-motion module is disposed on the second adapter bracket, and the probe is connected to the second micro-motion module through the probe mounting bracket. The second micro-motion module is used to move the probe in the second horizontal direction and the second vertical direction.

[0011] In some embodiments, the second adapter bracket includes a vertically arranged third adapter plate, the third adapter plate being perpendicular to the first horizontal direction, the second micro-motion module being disposed on the third adapter plate, and the probe mounting bracket being disposed on the side of the second micro-motion module away from the third adapter plate.

[0012] In some embodiments, the probe mounting bracket has a mounting slot with an opening facing the carrier assembly and a bolt hole communicating with the mounting slot. The probe is inserted into the mounting slot through the opening, and the bolt extends through the bolt hole into the mounting slot to abut against the probe. The dimensions of the probe and the mounting slot can be adjusted to a certain extent according to the dimensions of the sensitive element placed in the probe.

[0013] In some embodiments, the mounting groove is provided with a heating element and a temperature sensor on its groove wall.

[0014] In some embodiments, the sample carrier assembly includes a stage and a stage cover. The stage is connected to the moving module. A slot is provided on the side of the stage near the probe. The stage cover includes a locking part and a limiting part. The stage cover has a test opening. The locking part is engaged in the slot and the sample to be tested is clamped between the stage and the limiting part. The test portion of the sample to be tested is opposite to the test opening.

[0015] In some embodiments, the slot is an arc-shaped groove, and the engaging portion matches the arc-shaped groove.

[0016] In some embodiments, the carrier assembly may further include a gasket located between the limiting portion and the sample to be tested.

[0017] In some embodiments, a heating element and a temperature sensor are provided on the side of the stage away from the probe, and the heating element and temperature sensor are opposite to the sample being tested in the first horizontal direction. Attached Figure Description

[0018] Figure 1 This is a front view of the eddy current sensor device testing platform provided in an embodiment of the present invention.

[0019] Figure 2 This is a connection view of the first adapter bracket and the displacement sensor provided in an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the lift-off distance measurement principle of the eddy current sensor device testing platform provided in this embodiment of the invention.

[0021] Figure 4 This is a schematic diagram of the probe mounting bracket provided in an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram of the structure of the cargo-carrying component provided in an embodiment of the present invention.

[0023] Figure 6 This is an exploded view of the cargo-carrying component provided in an embodiment of the present invention.

[0024] Figure label:

[0025] Eddy current sensor device testing platform 100

[0026] Base 1, Moving Module 2, Horizontal Displacement Fine Adjustment Component 21, First Adapter Bracket 22, First Adapter Plate 221, Through Hole 2211, Second Adapter Plate 222, Side Baffle 223, First Micro-motion Module 23, Loading Component 3, Hollow Column 31, First Bolt Hole 311, Loading Stage 32, Slot 321, Loading Stage Cover 33, Engaging Part 331, Limiting Part 332, Test Opening 333, Washer 34, Displacement Sensor 4, Probe Holding Module 5, Second Adapter Bracket 51, Third Adapter Plate 511, Fourth Adapter Plate 512, Second Micro-motion Module 52, Probe Mounting Bracket 53, Mounting Slot 531, Second Bolt Hole 532, Probe 6, Sample Under Test 7, Eddy Current Sensor Detection Circuit Module 8, Heating Element 91, Temperature Controller 92, Temperature Sensor 93. Detailed Implementation

[0027] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0028] The following is based on Figures 1-6 This invention describes an eddy current sensor testing platform 100 provided in an embodiment of the invention. The eddy current sensor testing platform 100 includes: a base 1, a moving module 2, a load assembly 3, a displacement sensor 4, a probe holding module 5, and a probe 6. The moving module 2 and the probe holding module 5 are disposed on the base 1. The load assembly 3 is used to carry the sample 7 to be tested. The load assembly 3 is connected to the moving module 2. The moving module 2 is used for at least a first horizontal direction (e.g., ...). Figure 1 The load assembly 3 is moved along the moving module 2 (as indicated by the arrow in the diagram). A displacement sensor 4, connected to the moving module 2, measures the relative displacement distance of the load assembly 3 in real time, allowing the determination of the lift-off distance. A probe 6 is mounted on a probe holding module 5 and is positioned opposite the load assembly 3 in a first horizontal direction. The probe holding module 5 is used to move the probe 6 in at least a second horizontal direction and a vertical direction. The second horizontal direction is perpendicular to the first horizontal direction.

[0029] The principle of determining the lift-off distance using displacement sensor 4 is as follows: Figure 3 As shown: The operation of the moving module 2 moves the carrier component 3 to bring the sample 7 under test into contact with the probe 6, and this position is set as the zero point. The displacement distance x of the carrier component 3 is the displacement of the sample 7 under test. Then, by adding the thickness d of the coil enclosure shell of the probe 6 to the x measured by the displacement sensor 4, the lift-off distance h can be obtained, that is, h = x + d.

[0030] The eddy current sensor testing platform 100 also includes a temperature control module. The temperature control module includes a temperature controller 92, a heating element 91, and a temperature sensor 93. The heating element 91 and the temperature sensor 93 are located on at least one of the probe holding module 5 and the sample carrier assembly 3, and are used to regulate the temperature of the probe 6 and / or the sample 7 under test. That is, the heating element 91 and the temperature sensor 93 can be located on the probe holding module 5 to measure and heat the probe 6, thereby achieving temperature control of the probe 6; the heating element 91 and the temperature sensor 93 can also be located on the sample carrier assembly 3 to measure and heat the sample 7 under test, thereby achieving temperature control of the sample 7 under test; or, the heating element 91 and the temperature sensor 93 can be located on each of the probe holding module 5 and the sample carrier assembly 3 for synchronous temperature regulation of the probe 6 and the sample 7 under test. The heating element 91 and the temperature sensor 93 are connected to the thermostat 92. The temperature sensor 93 transmits the temperature measurement signal to the thermostat 92, which is used to display the temperature information and control the start and stop of the heating element 91.

[0031] The eddy current sensor testing platform provided in this invention can be used for performance testing of eddy current sensors, and can also serve as an experimental platform to measure relevant parameters of the sample under test, such as measuring the thickness of a metal thin film or minute displacements. The eddy current sensor testing platform is horizontally arranged, with the probe and the sample under test facing each other in the horizontal direction, effectively reducing potential vibration problems that would occur with vertical placement. Furthermore, a method for online measurement of lift-off distance using a unit displacement sensor is provided, offering high measurement accuracy, low cost, and simple operation.

[0032] Furthermore, the temperature control module enables local temperature monitoring and adjustment, making the ambient temperature measurable and controllable. Compared to related technologies that use temperature chambers (such as constant temperature chambers) to change the platform's ambient temperature, this method is simpler in structure, lower in cost, and easier to operate.

[0033] like Figure 1 As shown, the base 1 is placed horizontally, and both the first horizontal direction and the second horizontal direction are parallel to the upper surface of the base 1.

[0034] In some embodiments, such as Figure 1 As shown, the moving module 2 is used to move the carrier assembly 3 in the first horizontal direction, thereby moving the sample 7 under test and adjusting the distance between it and the probe 6. The sample 7 under test can be a thin metal film with silicon or silicon dioxide as a substrate, and its size can be 2 to 4 inches.

[0035] The moving module 2 includes a horizontal displacement fine adjustment component 21, a first adapter bracket 22, and a first micro-motion module 23. The first micro-motion module 23 is disposed on the upper surface of the base 1. The first adapter bracket 22 is connected to the first micro-motion module 23. The horizontal displacement fine adjustment component 21 is disposed on the first adapter bracket 22 and connected to the load assembly 3 to move the load assembly 3 in the first horizontal direction. The first micro-motion module 23 is used to move the first adapter bracket 22 in the first horizontal direction and simultaneously move the horizontal displacement fine adjustment component 21 and the load assembly 3.

[0036] Specifically, such as Figure 2 As shown, the first adapter bracket 22 is an orthogonal bracket, including a first adapter plate 221 perpendicular to each other and a second adapter plate 222 perpendicular to the first adapter plate 221. The first adapter plate 221 is vertically arranged and perpendicular to the first horizontal direction, and the second adapter plate 222 is horizontally arranged. The second adapter plate 222 is mounted on the first micro-motion module 23. By adjusting the first micro-motion module 23, the first adapter bracket 22 moves in the first horizontal direction. Since the horizontal displacement fine adjustment component 21 and the load component 3 are both connected to the first adapter bracket 22, the movement of the first adapter bracket 22 simultaneously drives the horizontal displacement fine adjustment component 21 and the load component 3 to move.

[0037] The sample carrier 3 is located on the side of the first adapter plate 221 closest to the probe 6. The horizontal displacement fine-tuning component 21 is supported by the first adapter bracket 22 and connected to the sample carrier 3. By adjusting the horizontal displacement fine-tuning component 21, the sample carrier 3 can be moved in the first horizontal direction. Optionally, the horizontal displacement fine-tuning component 21 can be a manual movement module with micron-level accuracy. The movement of the sample carrier 3 in the first direction causes the sample 7 to move, bringing the sample 7 closer to or away from the probe 6.

[0038] Specifically, such as Figure 5 As shown, a hollow column 31 is provided on the side of the loading assembly 3 near the first adapter plate 221, and a through bolt hole 311 is provided on the side wall of the hollow column 31. A through hole 2211 is provided on the first adapter plate 221. The horizontal displacement fine adjustment assembly 21 is located on the side of the first adapter plate 221 away from the probe 6. The adjustment rod of the horizontal displacement fine adjustment assembly 21 extends into the hollow column 31 through the through hole 2211. The bolt passes through the first bolt hole 311 on the hollow column 31 and abuts against the loading assembly 3 so that the loading assembly 3 is connected to the horizontal displacement fine adjustment assembly 21. The horizontal displacement fine adjustment assembly 21 is supported by the first adapter bracket 22. By adjusting the adjustment rod, the position of the loading assembly 3 in the first horizontal direction is adjusted, thereby adjusting the distance between the sample 7 and the probe 6 in the first horizontal direction.

[0039] In this embodiment of the invention, a displacement sensor 4 is used to measure the lift-off distance. Generally, the distance between the probe and the sample needs to be controlled within millimeters or micrometers; the limited space severely restricts the installation of the displacement sensor 4. In this embodiment, as... Figure 2 As shown, a side baffle 223 is connected to one side of the first adapter plate 221. The side baffle 223 is perpendicular to the first adapter plate 221. The displacement sensor 4 is connected to the outside of the side baffle 223. In this embodiment, the displacement sensor 4 can be a laser displacement sensor, which is installed on the back of the loading assembly 3 (e.g., ...). Figure 1 As shown). In practical work, the principle of lift-off distance calculation is as follows: Figure 3 As shown, the moving carrier assembly 3 moves the surface of the sample 7 to a specified position (i.e., in contact with the probe), which is set as the zero point. The horizontal movement distance x of the carrier assembly 3 is the displacement of the sample 7. Then, by adding the thickness d of the coil casing to the x measured by the displacement sensor 4, the lifting distance h can be obtained, i.e., h = x + d.

[0040] In some embodiments, the probe holding module 5 includes a second adapter bracket 51, a second micro-motion module 52, and a probe mounting bracket 53. The second adapter bracket 51 is mounted on the base 1, and the second micro-motion module 52 is mounted on the second adapter bracket 51. The probe 6 is connected to the second micro-motion module 52 via the probe mounting bracket 53. The second micro-motion module 52 is used to move the probe 6 in the second horizontal direction and the vertical direction. That is, the second micro-motion module 52 is a two-degree-of-freedom micro-motion module, and adjusting the second micro-motion module 52 can cause the probe mounting bracket 52 to move the probe 6 freely within a certain range in the vertical plane. The second micro-motion module 52 may include two micro-motion units, respectively used to move the probe mounting bracket 53 and the probe 6 in the second horizontal direction and the vertical direction.

[0041] Optionally, the second micro-motion module 52 has a movement accuracy of 10 micrometers.

[0042] It should be noted that the horizontal displacement fine adjustment component 21, the first micro-motion module 23, and the second micro-motion module 52 can all be manual movement modules known in the art, and the adjustment can be achieved by manually rotating and adjusting the micrometer head of the manual movement module.

[0043] exist Figure 1 In the specific embodiment shown, the second adapter bracket 51 is an orthogonal adapter bracket, including a vertically arranged third adapter plate 511 and a horizontally arranged fourth adapter plate 512. The third adapter plate 511 is perpendicular to the first horizontal direction, parallel to the first adapter plate 211 and opposite to the first adapter plate 211 in the first horizontal direction. The second micro-motion module 52 is located on the side of the third adapter plate 551 facing the loading assembly 3, and the probe mounting bracket 53 is located on the side of the second micro-motion module 52 away from the third adapter plate 551.

[0044] like Figure 4 As shown, the probe mounting bracket 53 has a mounting groove 531 with an opening facing the loading assembly and a second bolt hole 532 communicating with the mounting groove 531. The probe 6 is inserted into the mounting groove 531 through the opening, and the bolt extends into the mounting groove 531 through the second bolt hole 532 to abut against the probe 6, thereby fixing the probe 6 and the probe mounting bracket 53 together. Figure 4 As shown, the lower sidewall of the mounting groove 531 is V-shaped, which is used to fix the probe 6 and limit the probe 6 from shifting in the left and right directions.

[0045] like Figure 1 As shown, probe 6 is connected to the eddy current sensor detection circuit module 8 via communication.

[0046] In some embodiments, such as Figure 5 and Figure 6 As shown, the sample carrier assembly 3 includes a stage 32 and a stage cover 33. The stage 32 is connected to the moving module 2. The side of the stage 32 near the probe 6 is provided with a slot 321. The stage cover 33 includes a locking part 331 and a limiting part 332. The stage cover 33 has a test opening 333. The locking part 331 is fitted in the slot 321 and the sample 7 to be tested is clamped between the stage 32 and the limiting part 332. The tested part of the sample 7 is opposite to the probe in the first horizontal direction of 6.

[0047] exist Figure 6 In the specific embodiment shown, the stage cover 33 has an annular structure, the limiting part 332 has a circular annular sheet structure, and the test opening 333 is located in the middle of the limiting part 332. There are two arc-shaped engaging parts 331 and two arc-shaped slots 321. The engaging parts 331 and the slots 321 are structurally matched and correspond one-to-one. The engaging parts 331 extend into the corresponding slots 321 and embed into the arc-shaped slots 321, thus fixing the sample 7 to be tested between the limiting part 332 and the stage 32.

[0048] Furthermore, the sample carrier 3 may also include a washer 34, which is located between the limiting portion and the sample 7 to be tested, and is used to protect the sample 7. Optionally, the washer 34 is a sponge washer.

[0049] like Figure 5 As shown, a heating element 91 and a temperature sensor 93 are provided on the side of the stage 32 away from the probe 6, and the heating element 91 and the temperature sensor 93 are opposite to the sample 7 being measured in the first horizontal direction. Figure 4As shown, a heating element 91 and a temperature sensor 93 are also provided on the wall of the mounting groove 531 of the probe mounting bracket 53, so that they are in close contact with the probe 6. In this embodiment of the invention, the heating element 91 can be a heating film. The temperature sensor 93 can be a thermistor (or a thermocouple), and its size is the same as that of a common chip resistor (its specifications are generally 0603, 0805, etc.).

[0050] Optionally, the stage 32 and the probe mounting bracket can be made of 40% glass fiber injection-molded PPS (polyphenylene sulfide). PPS reinforced with 40% glass fiber has a heat distortion temperature of up to 260℃, and exhibits high strength, rigidity, and corrosion resistance. The first adapter bracket 22, the second adapter bracket 51, the first micro-motion module 23, and the second micro-motion module 52 can be made of anodized aluminum alloy, which has high strength and good casting and plastic processing properties.

[0051] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0053] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0054] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0055] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A test platform for micro / nano precision eddy current sensors with controllable ambient temperature, characterized in that, include: The system comprises a base, a moving module, a load assembly, a displacement sensor, a probe holding module, a probe, and a temperature control module. The moving module and the probe holding module are mounted on the base. The load assembly carries the sample to be tested and is connected to the moving module. The moving module moves the load assembly at least in a first horizontal direction. The displacement sensor is connected to the moving module and measures the relative displacement distance of the load assembly in real time. The probe is opposite to the load assembly in the first horizontal direction. The probe holding module includes a second adapter bracket, a second micro-motion module, and a probe mounting bracket. The second adapter bracket is mounted on the base, and the second micro-motion module is mounted on the second adapter bracket. The probe is connected to the second micro-motion module through the probe mounting bracket. The second micro-motion module moves the probe in a second horizontal direction perpendicular to the first horizontal direction and in a vertical direction. The temperature control module includes a temperature sensor and a heating element, which are disposed on at least one of the probe holding module and the sample carrier assembly, and are used to regulate the local ambient temperature of the probe and / or the sample under test. The probe mounting bracket has a mounting groove with an opening facing the loading assembly and a bolt hole communicating with the mounting groove. The probe is inserted into the mounting groove through the opening, and the bolt extends into the mounting groove through the bolt hole to abut against the probe. The heating element and the temperature sensor are provided on the groove wall.

2. The eddy current sensor device testing platform according to claim 1, characterized in that, The moving module includes a horizontal displacement fine-tuning component, a first adapter bracket, and a first micro-motion module. The first micro-motion module is disposed on the base, and the first adapter bracket is connected to the first micro-motion module. The horizontal displacement fine-tuning component is disposed on the first adapter bracket and connected to the load assembly to move the load assembly in the first horizontal direction. The first micro-motion module is used to move the first adapter bracket in the first horizontal direction and simultaneously move the horizontal displacement fine-tuning component and the load assembly.

3. The eddy current sensor device testing platform according to claim 2, characterized in that, The first adapter bracket includes a vertically arranged first adapter plate, which is perpendicular to the first horizontal direction. The loading component is located on the side of the first adapter plate closer to the probe. The horizontal displacement fine adjustment component is supported by the first adapter bracket and connected to the loading component.

4. The eddy current sensor device testing platform according to claim 3, characterized in that, The first adapter plate has a through hole, and the horizontal displacement fine adjustment component is located on the side of the first adapter plate away from the probe and passes through the through hole to be connected to the loading component.

5. The eddy current sensor device testing platform according to claim 3, characterized in that, A side baffle is connected to one side of the first adapter plate, and the displacement sensor is connected to the side baffle.

6. The eddy current sensor device testing platform according to claim 1, characterized in that, The second adapter bracket includes a vertically arranged third adapter plate, which is perpendicular to the first horizontal direction. The second micro-motion module is disposed on the third adapter plate, and the probe mounting bracket is disposed on the side of the second micro-motion module away from the third adapter plate.

7. The eddy current sensor device testing platform according to claim 1, characterized in that, The sample carrier assembly includes a stage and a stage cover. The stage is connected to the moving module. A slot is provided on the side of the stage near the probe. The stage cover includes a locking part and a limiting part. The stage cover has a test opening. The locking part is engaged in the slot and the sample to be tested is clamped between the stage and the limiting part. The test portion of the sample to be tested is opposite to the test opening.

8. The eddy current sensor device testing platform according to claim 7, characterized in that, The heating element and the temperature sensor are located on the side of the stage away from the probe, and the heating element and the temperature sensor are opposite to the sample being tested in the first horizontal direction.

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