PCB Packaging Design Method, System, Device and Storage Medium

Abstract

The present invention discloses a PCB package design method, system, device, and storage medium, which can be applied to the field of PCB design. The method of the present invention is to draw a PCB circuit board, set a device pad on a first preset area of the PCB circuit board; set a first prohibited copper area in a second preset area near the device pad; set a non-metallized through-hole on the first prohibited copper area; set a second prohibited copper area in the component spring area of the PCB circuit board, and the second prohibited copper area is located directly below the metal contact, so that excess rosin flux is formed through the first prohibited copper area and the non-metallized through-hole, thereby preventing excess rosin flux generated during reflow from overflowing onto the metal contact or spring, resulting in poor contact and poor spring elasticity; at the same time, the second prohibited copper area prevents the metal contact from contacting the PCB for a long time, thereby reducing the occurrence of green oil shedding and short circuit.

Description

Technical Field

[0001] The present invention relates to the field of PCB design, and in particular to a PCB package design method, system, device and storage medium. Background Art

[0002] With the development of electronic products, more and more electronic products have entered people's lives. However, all electronic products inevitably use connectors. Almost all connectors use metal contacts to achieve connection. Many connectors are even precision connectors with very small spacing between metal terminals and metal contacts. Some connectors have built-in springs or elastic metal sheets, such as the commonly used SIM card connector, TF card connector, surface mount buttons, etc. During the production process, it is more or less found that during the reflow soldering process of these connectors, excess rosin flux will overflow onto the metal contacts or springs, resulting in poor contact and poor spring elasticity. The metal contacts are in contact with the PCB for a long time, causing the green solder paste to fall off and short circuit. Currently, during reflow soldering, excess rosin flux overflows onto the metal contacts or springs of these connectors, resulting in poor contact and poor elasticity. The conventional solution is to control the amount of solder paste and rosin flux, but this does not fundamentally solve the problem. Regarding the long-term contact between the metal contacts and the PCB, which causes the green solder paste to fall off and cause a short circuit, the conventional solution is to add a layer of white oil to the contact area. However, due to the certain thickness of white oil, it can easily lead to quality problems such as floating components and false solder joints. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a PCB packaging design method, system, device and storage medium that can effectively improve poor contact or poor elasticity while reducing the occurrence of short circuits.

[0004] In one aspect, an embodiment of the present invention provides a PCB package design method, comprising the following steps:

[0005] Draw PCB circuit board;

[0006] Arranging a device pad on a first predetermined area of the PCB circuit board;

[0007] Setting a first copper-forbidden area in a second preset area close to the device pad;

[0008] Disposing a non-metallized through hole on the first prohibited copper plating area;

[0009] A second prohibited copper pouring zone is set in the component spring area of the PCB circuit board, and the second prohibited copper pouring zone is located directly below the metal contact;

[0010] A copper-pouring area is set in a third preset area of the PCB circuit board, and the third preset area does not overlap with the first copper-pouring-forbidden area and the first copper-pouring-forbidden area.

[0011] In some embodiments, the method further comprises:

[0012] Component placement positioning holes are set in the fourth preset area of the PCB circuit board.

[0013] In some embodiments, the method further comprises:

[0014] Draw the component wireframe diagram on the 25th layer of the PCB package.

[0015] In some embodiments, a single-side diameter of the device pad is larger than a single-side diameter of the metal terminal to be soldered.

[0016] In some embodiments, a single-side diameter of the device pad is 0.3 mm to 0.6 mm larger than a single-side diameter of the metal terminal to be soldered.

[0017] In another aspect, an embodiment of the present invention provides a PCB package design system, including:

[0018] Drawing module, used to draw PCB circuit boards;

[0019] A first setting module is used to set a device pad on a first preset area of the PCB circuit board;

[0020] A second setting module is used to set a first prohibited copper plating area in a second preset area close to the device pad;

[0021] A third setting module is used to set a non-metallized through hole on the first prohibited copper area;

[0022] a fourth setting module, configured to set a second prohibited copper pouring zone in the component spring area of the PCB circuit board, wherein the second prohibited copper pouring zone is located directly below the metal contact;

[0023] The fifth setting module is used to set a copper pouring area in a third preset area of the PCB circuit board, and the third preset area does not overlap with the first prohibited copper pouring area and the first prohibited copper pouring area.

[0024] In some embodiments, a single-side diameter of the device pad is larger than a single-side diameter of the metal terminal to be soldered.

[0025] In some embodiments, a single-side diameter of the device pad is 0.3 mm to 0.6 mm larger than a single-side diameter of the metal terminal to be soldered.

[0026] In another aspect, an embodiment of the present invention provides a PCB package design device, comprising:

[0027] at least one memory for storing a program;

[0028] At least one processor is used to load the program to execute the PCB package design method.

[0029] On the other hand, an embodiment of the present invention provides a storage medium storing a computer-executable program, wherein the computer-executable program is used to implement the PCB packaging design method when executed by a processor.

[0030] The PCB packaging design method provided by the embodiment of the present invention has the following beneficial effects:

[0031] In this embodiment, after drawing a PCB circuit board, a device pad is set on a first preset area of the PCB circuit board; a first prohibited copper area is set in a second preset area close to the device pad; a non-metallized through-hole is set in the first prohibited copper area; a second prohibited copper area is set in the component spring area of the PCB circuit board, and the second prohibited copper area is located directly below the metal contact, so that excess rosin flux is formed through the first prohibited copper area and the non-metallized through-hole, thereby preventing excess rosin flux generated during reflow soldering from overflowing onto the metal contact or spring, resulting in poor contact and poor spring elasticity; at the same time, the second prohibited copper area prevents the metal contact from contacting the PCB for a long time, thereby reducing the occurrence of green solder paste shedding and short circuit.

[0032] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0034] Figure 1 This is a flow chart of a PCB package design method according to an embodiment of the present invention;

[0035] Figure 2 This is a schematic diagram of a PCB packaging design according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0037] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0038] In the description of the present invention, "several" means more than one, "plurality" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The use of "first" and "second" in the description is solely for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, implicitly specifying the number of the indicated technical features, or implicitly specifying the order of the indicated technical features.

[0039] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0040] In the description of the present invention, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the exemplary expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0041] Reference Figure 1 , an embodiment of the present invention provides a PCB package design method, including but not limited to the following steps:

[0042] Step 110: Draw the PCB circuit board;

[0043] Step 120: Setting device pads on a first predetermined area of the PCB circuit board;

[0044] Step 130: setting a first copper-forbidden area in a second preset area close to the device pad;

[0045] Step 140: providing a non-metallized through hole on the first prohibited copper plating area;

[0046] Step 150: Setting a second prohibited copper-pouring zone in the component spring area of the PCB circuit board, wherein the second prohibited copper-pouring zone is located directly below the metal contact;

[0047] Step 160: Set a copper pouring area in a third preset area of the PCB circuit board, wherein the third preset area does not overlap with the first prohibited copper pouring area and the first prohibited copper pouring area.

[0048] In this embodiment, a circuit board is first drawn, and multiple component pads and copper foils are set on the circuit. Specifically, Figure 2 As shown, in the package editor, the device pad 210 is designed according to the component specification. The diameter of the device pad 210 is larger than the diameter of the metal terminal to be soldered to the device. For example, the diameter of the device pad is 0.3-0.6 mm larger than the diameter of the metal terminal to be soldered to the device. The specific size can also be set according to the actual component. A second no-copper area 230 is set in the component spring area below the metal contact location. The size is preferably larger than the metal contact area to prevent the metal contact from contacting the PCB for a long time, which may cause the green paint to fall off and cause a short circuit. A first no-copper area 220 is set near the component pad 210. An appropriate number of non-metallized through-holes 240 are provided in the first no-copper area 220 near the component pad location. The no-copper area creates a diversion path for excess rosin flux generated during reflow soldering, which then flows out through the non-metallized through-holes 240, thereby preventing excess rosin flux from overflowing onto the metal contact or spring during reflow soldering, causing poor contact and poor spring elasticity. In addition, this embodiment also draws a component wireframe diagram on the 25th layer of the PCB package to output a simple 3D representation of the component without a physical 3D representation. Furthermore, component placement positioning holes 250 can be set in the fourth predetermined area of the PCB circuit board to restrict the position of the component through the component placement positioning holes.

[0049] The embodiment of the present invention provides a Figure 1 The PCB package design system corresponding to the method includes but is not limited to:

[0050] Drawing module, used to draw PCB circuit boards;

[0051] A first setting module is used to set a device pad on a first preset area of the PCB circuit board;

[0052] A second setting module is used to set a first prohibited copper plating area in a second preset area close to the device pad;

[0053] A third setting module is used to set a non-metallized through hole on the first prohibited copper area;

[0054] a fourth setting module, configured to set a second prohibited copper pouring zone in the component spring area of the PCB circuit board, wherein the second prohibited copper pouring zone is located directly below the metal contact;

[0055] The fifth setting module is used to set a copper pouring area in a third preset area of the PCB circuit board, and the third preset area does not overlap with the first prohibited copper pouring area and the first prohibited copper pouring area.

[0056] In this embodiment, a circuit board is first drawn, and multiple component pads and copper foils are set on the circuit. Specifically, Figure 2 As shown, in the package editor, design the device pads according to the component specification. The diameter of the device pads should be larger than the diameter of the metal terminal to be soldered. For example, the diameter of the device pads should be 0.3-0.6mm larger than the diameter of the metal terminal to be soldered. The specific size can also be set according to the actual component. A second no-copper zone is set in the component spring area below the metal contact. The size should cover and be larger than the metal contact area to prevent the metal contact from contacting the PCB for a long time, which could cause the green solder paste to fall off and cause a short circuit. A first no-copper zone is set near the component pads. An appropriate number of non-metalized through-holes (PTHs) are placed in this first no-copper zone near the component pads. The no-copper zone creates a diversion path for excess rosin flux generated during reflow soldering, allowing it to flow out through the PTHs. This prevents excess rosin flux from overflowing onto the metal contacts or springs, causing poor contact and poor spring elasticity. In addition, this embodiment also draws a component wireframe diagram on the 25th layer of the PCB package to output a simple 3D representation of the component without a physical 3D representation. Furthermore, component placement positioning holes can be set in the fourth preset area of the PCB circuit board to restrict the position of the component through the component placement positioning holes.

[0057] An embodiment of the present invention provides a PCB package design device, comprising:

[0058] at least one memory for storing a program;

[0059] At least one processor for loading the program to execute Figure 1 The PCB package design method shown.

[0060] The contents of the method embodiments of the present invention are all applicable to the device embodiments. The functions specifically implemented by the device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0061] An embodiment of the present invention provides a storage medium in which a computer-executable program is stored. When the computer-executable program is executed by a processor, it is used to implement Figure 1 The PCB package design method shown.

[0062] The embodiment of the present invention further provides a computer program product or computer program, the computer program product or computer program including computer instructions, the computer instructions stored in a computer readable storage medium. The processor of the computer device can read the computer instructions from the computer readable storage medium, and the processor executes the computer instructions so that the computer device performs Figure 1 The PCB package design method shown.

[0063] While the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to the embodiments described above. Various modifications may be made within the scope of knowledge possessed by a person skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof may be combined with one another unless there is a conflict.

Claims

1. A PCB package design method, characterized in that: The following steps are involved: Draw PCB circuit board; Arranging a device pad on a first predetermined area of the PCB circuit board; A first copper-forbidden area is set in a second preset area close to the device pad, wherein the single-side diameter of the device pad is 0.3 mm to 0.6 mm larger than the single-side diameter of the metal terminal to be welded; Disposing a non-metallized through hole on the first prohibited copper plating area; A second copper-forbidden zone is set in the component spring area of the PCB circuit board, and the second copper-forbidden zone is located directly below the metal contact; A copper-filled area is set in a third preset area of the PCB circuit board, wherein the third preset area does not overlap with the first copper-filled prohibited area and the second copper-filled prohibited area; Setting component placement positioning holes in the fourth preset area of the PCB circuit board; Draw the component wireframe diagram on the 25th layer of the PCB package.

2. A PCB package design system, characterized in that: include: Drawing module, used to draw PCB circuit boards; A first setting module is used to set a device pad on a first preset area of the PCB circuit board; A second setting module is used to set a first prohibited copper plating area in a second preset area close to the device pad, wherein the single side diameter of the device pad is 0.3 mm to 0.6 mm larger than the single side diameter of the metal terminal to be welded; A third setting module is used to set a non-metallized through hole on the first prohibited copper area; a fourth setting module, configured to set a second prohibited copper pouring zone in the component spring area of the PCB circuit board, wherein the second prohibited copper pouring zone is located directly below the metal contact; The fifth setting module is used to set a copper-plating area in a third preset area of the PCB circuit board, and the third preset area does not overlap with the first prohibited copper-plating area and the second prohibited copper-plating area.

3. A PCB package design device, characterized in that: include: at least one memory for storing a program; At least one processor is used to load the program to execute the PCB package design method as claimed in claim 1.

4. A storage medium, characterized in that A computer-executable program is stored therein, and when the computer-executable program is executed by a processor, it is used to implement the PCB packaging design method as claimed in claim 1.

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