A heat exchange plate channel and a heat exchanger

Abstract

The present application relates to heat exchanger technical field, specifically to a kind of heat exchange plate channel and heat exchanger.The heat exchange plate channel includes: first plate unit, including channel bottom plate and first channel support plate;Multiple groups of first channel support plate are spaced apart in parallel first direction relative to channel bottom plate;Second plate unit, including reinforcing rib and second channel support plate;Multiple groups of second channel support plate are spaced apart in parallel first direction;Reinforcing rib is arranged between any two adjacent groups of second channel support plate;Third plate unit, including multiple groups of third channel support plate, multiple groups of third channel support plate are spaced apart in parallel first direction;At least one of first plate unit, second plate unit and third plate unit is suitable for being stacked along third direction to form heat exchange channel.The heat exchange plate channel provided by the present application overcomes the limitation of chemical etching to plate material and chemical etching size, enriches the stacking forming mode of heat exchange channel, and is beneficial to reduce production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat exchangers, in particular to a heat exchange plate channel and a heat exchanger. BACKGROUND

[0002] The printed circuit board type heat exchanger is generally composed of side plates, cold side plates, hot side plates, joints and the like. The side plates, cold side plates and hot side plates are stacked in a certain order and are integrally formed by vacuum diffusion welding, thereby forming a heat exchanger core. Then the heat exchanger core is welded with the joints to form a heat exchanger.

[0003] At present, the cold side plates and the hot side plates of the printed circuit board type heat exchanger are formed by chemical etching. The cold side plates and the hot side plates are distributed with fluid channels. Generally, the bottom surfaces of the cold (hot) side plates and the hot (cold) side plates form one kind of channel, and the bottom surfaces of the hot (cold) side plates and the cold (hot) side plates form another kind of channel. The stacking mode is relatively simple. This forming method has problems of high price, size limitation and material limitation.

[0004] As shown in Figure 1 , Figure 2 , the existing heat exchange plate channel structure is generally formed by stacking the cold side plates 100 and the hot side plates 200. The bottom surfaces of the cold side plates 100 and the hot side plates 200 form one kind of channel, and the bottom surfaces of the hot side plates 200 and the cold side plates 100 form another kind of channel. The cold side plates 100 and the hot side plates 200 are formed by chemical etching. Since the existing channel structure is generally formed by chemical etching, on the one hand, chemical etching cannot etch corrosion-resistant alloys such as high-temperature alloys and hastelloy, which limits the plates. On the other hand, the chemical etching process also has requirements for the size of the plates. As shown in Figure 3 , the thickness of the plate is H, wherein the value of H needs to satisfy H≤C1; the width of the channel is W, and the value of W needs to satisfy W≥C2×h+C3, wherein h is the depth of the channel, C1, C2 and C3 are constants, and the values of C1, C2 and C3 are related to the material. When the plate material is stainless steel, the value of C1 is generally 2, the value of C2 is 1.2, and the value of C3 is 0. Therefore, the existing channel structure of the printed circuit board type heat exchanger and the forming method thereof are easily restricted by the material and the size, and the cost is high, and the stacking mode is simple. SUMMARY

[0005] Therefore, the technical problem to be solved by the present application is to overcome the defects in the prior art that the plate channel of the printed circuit board type heat exchanger formed by chemical etching is easily restricted by the material and the chemical etching size, so as to provide a heat exchange plate channel which can overcome the restriction of the material and the chemical etching size.

[0006] To solve the above technical problems, the heat exchange plate channel provided by the present application comprises:

[0007] a first plate unit comprising a channel bottom plate and a first channel support plate; a plurality of groups of the first channel support plates are arranged in parallel to the channel bottom plate along a first direction;

[0008] a second plate unit comprising a reinforcing rib and a second channel support plate; a plurality of groups of the second channel support plates are arranged in parallel to the first direction; the reinforcing rib is arranged between any two adjacent groups of the second channel support plates;

[0009] a third plate unit comprising a plurality of groups of third channel support plates; a plurality of groups of the third channel support plates are arranged in parallel to the first direction;

[0010] at least one of the first plate unit, the second plate unit and the third plate unit is adapted to be stacked along a third direction to form a heat exchange channel.

[0011] Optionally, the heat exchange plate channel further comprises a partition plate, the partition plate is arranged on at least one side of the second plate unit or the third plate unit along the third direction.

[0012] Optionally, when the heat exchange plate channel is stacked by the first plate unit, every two groups of the first plate units are arranged oppositely to form a full interlocking structure; the full interlocking structure is stacked along the third direction to form a heat exchange channel.

[0013] Optionally, when the heat exchange plate channel is stacked by the second plate unit and the partition plate, at least two groups of the second plate units are arranged between every two adjacent groups of the partition plates; the two groups of the partition plates and the at least two groups of the second plate units are stacked along the third direction to form a half hollow structure, the half hollow structure is adapted to be stacked along the third direction to form a heat exchange channel.

[0014] Optionally, when the heat exchange plate channel is stacked by the third plate unit and the partition plate, at least two groups of the third plate units are arranged between every two adjacent groups of the partition plates; the two groups of the partition plates and the at least two groups of the third plate units are stacked along the third direction to form a full hollow structure, the full hollow structure is adapted to be stacked along the third direction to form a heat exchange channel.

[0015] Optionally, when the heat exchange plate channel is stacked by the first plate unit and the second plate unit, at least one group of the second plate units is arranged between every two adjacent groups of the first plate units; the two groups of the first plate units and the at least one group of the second plate units are stacked along the third direction to form a first composite channel structure, the first composite channel structure is adapted to be stacked along the third direction to form a heat exchange channel.

[0016] Optionally, when the heat exchange plate channel is stacked by the first plate unit and the third plate unit, at least one group of the third plate unit is arranged between every two adjacent groups of the first plate unit, and the two groups of the first plate unit and the at least one group of the third plate unit are stacked along a third direction to form a second composite channel structure, and the second composite channel structure is suitable for being stacked along the third direction to form a heat exchange channel.

[0017] Optionally, the forming mode of the second plate unit and / or the third plate unit includes, but is not limited to, laser cutting, stamping and / or chemical etching.

[0018] Optionally, the forming mode of the first plate unit includes, but is not limited to, chemical etching.

[0019] The application further provides a heat exchanger, comprising:

[0020] The heat exchange plate channel as described above;

[0021] One of any two adjacent layers of flow channels of the heat exchange plate channel along the third direction is a hot side flow channel, and the other is a cold side flow channel.

[0022] The channel cross-sectional shape of the heat exchange plate channel includes, but is not limited to, a rectangle, a circle, a semicircle and / or an ellipse.

[0023] The technical scheme of the application has the following advantages:

[0024] 1. The heat exchange plate channel provided by the application comprises: a first plate unit comprising a channel bottom plate and a first channel support plate; a plurality of groups of the first channel support plates are arranged in parallel to the channel bottom plate and spaced apart along a first direction; a second plate unit comprising a reinforcing rib and a second channel support plate; a plurality of groups of the second channel support plates are arranged in parallel to the first direction and spaced apart; the reinforcing rib is arranged between any two adjacent groups of the second channel support plates; and a third plate unit comprising a plurality of groups of third channel support plates, and the plurality of groups of the third channel support plates are arranged in parallel to the first direction and spaced apart; at least one of the first plate unit, the second plate unit and the third plate unit is stacked along a third direction to form a heat exchange channel, thereby overcoming the limitations of chemical etching on plate material and chemical etching size, enriching the stacking forming mode of the heat exchange channel, and being beneficial to reducing production cost.

[0025] 2. The heat exchange plate channel provided by the present application, when the heat exchange plate channel only comprises the first plate unit, the first plate unit is arranged in a full counter-buckle structure (the full counter-buckle structure is an AA type composite structure) in a third direction during stacking, so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the full counter-buckle structure are stacked in the third direction to form the heat exchange channel, one of any two adjacent groups of the full counter-buckle structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between any two adjacent groups of the full counter-buckle structure heat exchange channel, and the stacking forming mode of the heat exchange channel is enriched.

[0026] 3. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the first plate unit, the third plate unit and the partition plate, a group of the third plate unit is arranged between each group of the first plate unit and each group of the partition plate, and is stacked in a third direction to form a third composite channel structure (not shown in the figure, the third composite channel structure is an ACD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the third composite channel structure are stacked in the third direction to form the heat exchange channel, one of any two adjacent groups of the third composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between any two adjacent groups of the third composite channel structure heat exchange channel, not only overcoming the limitation of chemical etching on the plate material and the chemical etching size, but also enriching the stacking forming mode of the heat exchange channel.

[0027] 4. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the second plate unit and the partition plate, at least two groups of the second plate unit are arranged between each two adjacent groups of the partition plate, and two groups of the partition plate and at least two groups of the second plate unit are stacked in a third direction to form a half-hollow structure (the half-hollow structure is a DBBD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the half-hollow structure are stacked in the third direction to form the heat exchange channel, one of any two adjacent groups of the half-hollow structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between any two adjacent groups of the half-hollow structure heat exchange channel, while overcoming the limitation of chemical etching on the plate material and the chemical etching size, it is also beneficial to enrich the stacking forming mode of the heat exchange channel and reduce the production cost.

[0028] 5. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the third plate unit and the partition plate, at least two groups of the third plate unit are arranged between every two adjacent groups of the partition plate, and two groups of the partition plate and at least two groups of the third plate unit are stacked along the third direction to form a full hollow structure (the full hollow structure is a DCCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the full hollow structure are stacked along the third direction to form the heat exchange channel, one of any two adjacent groups of the full hollow structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize the heat exchange of the heat exchange channels of any two adjacent groups of the full hollow structure, overcome the limitation of chemical etching on the plate material and the etching size, and facilitate the stacking forming mode of the heat exchange channel and reduce the production cost.

[0029] 6. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the first plate unit and the second plate unit, at least one group of the second plate unit is arranged between every two adjacent groups of the first plate unit, and two groups of the first plate unit and at least one group of the second plate unit are stacked along the third direction to form a first composite channel structure (the first composite channel structure is an ABA type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the first composite channel structure are adapted to be stacked along the third direction to form the heat exchange channel, one of any two adjacent groups of the first composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize the heat exchange of the heat exchange channels of any two adjacent groups of the first composite channel structure, overcome the limitation of chemical etching on the plate material and the etching size, and facilitate the stacking forming mode of the heat exchange channel and reduce the production cost.

[0030] 7. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the first plate unit, the second plate unit, the third plate unit and the partition plate, one group of the second plate unit and one group of the third plate unit are arranged between each group of the first plate unit and each group of the partition plate, and are stacked along the third direction to form a fourth composite channel structure (not shown in the figure, the fourth composite channel structure is an ABCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the fourth composite channel structure are stacked along the third direction to form the heat exchange channel, one of any two adjacent groups of the fourth composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize the heat exchange between the heat exchange channels of any two adjacent groups of the fourth composite channel structure, not only overcome the limitation of chemical etching on the plate material and the etching size, but also enrich the stacking forming mode of the heat exchange channel.

[0031] 8. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the first plate unit and the third plate unit, at least one group of the third plate unit is arranged between every two adjacent groups of the first plate unit, and the two groups of the first plate unit and the at least one group of the third plate unit are stacked along a third direction to form a second composite channel structure (the second composite channel structure is an ACA type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the second composite channel structure are adapted to be stacked along the third direction to form the heat exchange channel, one of any two adjacent groups of the second composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize the heat exchange between the heat exchange channels of any two adjacent groups of the second composite channel structure, overcome the limitation of chemical etching on the plate material and the chemical etching size, and facilitate the stacking forming mode of the heat exchange channel and reduce the production cost.

[0032] 9. The heat exchange plate channel provided by the present application, when the heat exchange plate channel is stacked by the first plate unit, the third plate unit and the partition plate, two groups of the third plate unit are arranged between each group of the first plate unit and each group of the partition plate, and are stacked along a third direction to form a fifth composite channel structure (not shown in the figure, the fifth composite channel structure is an ACCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the fifth composite channel structure are stacked along the third direction to form the heat exchange channel, one of any two adjacent groups of the fifth composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize the heat exchange between the heat exchange channels of any two adjacent groups of the fifth composite channel structure, not only overcome the limitation of chemical etching on the plate material and the chemical etching size, but also enrich the stacking forming mode of the heat exchange channel. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0034] Figure 1 The overall structure schematic diagram of the heat exchange plate channel structure before improvement;

[0035] Figure 2 The cross-sectional structure schematic diagram of the heat exchange plate channel structure before improvement;

[0036] Figure 3 The size schematic diagram of the heat exchange plate channel structure before improvement;

[0037] Figure 4 The whole structure schematic diagram of the first plate unit of the heat exchange plate channel of the present application;

[0038] Figure 5 The whole structure schematic diagram of the second plate unit of the heat exchange plate channel of the present application;

[0039] Figure 6 The whole structure schematic diagram of the third plate unit of the heat exchange plate channel of the present application;

[0040] Figure 7 The explosion structure schematic diagram of the full pair of buckle structure of the heat exchange plate channel of the present application;

[0041] Figure 8 The cross section structure schematic diagram of the full pair of buckle structure of the heat exchange plate channel of the present application;

[0042] Figure 9 The size schematic diagram of the full pair of buckle structure of the heat exchange plate channel of the present application;

[0043] Figure 10 The flow direction schematic diagram of the full pair of buckle structure of the heat exchange plate channel of the present application;

[0044] Figure 11 The explosion structure schematic diagram of the half hollow structure of the heat exchange plate channel of the present application;

[0045] Figure 12 The distribution schematic diagram of the reinforcing rib of the half hollow structure of the heat exchange plate channel of the present application;

[0046] Figure 13 The cross section structure schematic diagram of the half hollow structure of the heat exchange plate channel of the present application;

[0047] Figure 14 The size schematic diagram of the half hollow structure of the heat exchange plate channel of the present application;

[0048] Figure 15 The flow direction schematic diagram of the half hollow structure of the heat exchange plate channel of the present application;

[0049] Figure 16 The explosion structure schematic diagram of the full hollow structure of the heat exchange plate channel of the present application;

[0050] Figure 17 The cross section structure schematic diagram of the full hollow structure of the heat exchange plate channel of the present application;

[0051] Figure 18 The size schematic diagram of the full hollow structure of the heat exchange plate channel of the present application;

[0052] Figure 19Flow direction schematic view of full-hollow structure of heat exchange plate channel of the present application;

[0053] Figure 20 Exploded structure schematic view of first composite channel structure of heat exchange plate channel of the present application;

[0054] Figure 21 Cross-section structure schematic view of first composite channel structure of heat exchange plate channel of the present application;

[0055] Figure 22 Size schematic view of first composite channel structure of heat exchange plate channel of the present application;

[0056] Figure 23 Flow direction schematic view of first composite channel structure of heat exchange plate channel of the present application;

[0057] Figure 24 Exploded structure schematic view of second composite channel structure of heat exchange plate channel of the present application;

[0058] Figure 25 Cross-section structure schematic view of second composite channel structure of heat exchange plate channel of the present application;

[0059] Figure 26 Size schematic view of second composite channel structure of heat exchange plate channel of the present application;

[0060] Figure 27 Flow direction schematic view of second composite channel structure of heat exchange plate channel of the present application;

[0061] Figure 28 Rectangular channel cross-section structure schematic view of heat exchange plate channel of the present application;

[0062] Figure 29 Circular channel cross-section structure schematic view of heat exchange plate channel of the present application;

[0063] Figure 30 Semicircular channel cross-section structure schematic view of heat exchange plate channel of the present application;

[0064] Figure 31 Elliptical channel cross-section structure schematic view of heat exchange plate channel of the present application.

[0065] Explanation of reference signs:

[0066] 1. first plate unit; 11. channel bottom plate; 12. first channel support plate;

[0067] 2. second plate unit; 21. reinforcing rib; 22. second channel support plate;

[0068] 3. third plate unit; 32. third channel support plate;

[0069] 4. partition;

[0070] 51. full butt structure; 52. half hollow structure; 53. full hollow structure;

[0071] 61. first composite channel structure; 62. second composite channel structure. DETAILED DESCRIPTION

[0072] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0073] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0074] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0075] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0076] Combination Figures 4-31 As shown in the drawings, the heat exchange plate channel provided by the embodiment includes:

[0077] The first plate unit 1 includes a channel bottom plate 11 and a first channel support plate 12; a plurality of first channel support plates 12 are arranged in parallel with the first direction and spaced apart from the channel bottom plate 11;

[0078] The second plate unit 2 comprises a reinforcing rib 21 and a second channel support plate 22; a plurality of groups of the second channel support plates 22 are arranged in parallel to the first direction at intervals; the reinforcing rib 21 is arranged between any two adjacent groups of the second channel support plates 22;

[0079] The third plate unit 3 comprises a plurality of groups of third channel support plates 32, and the plurality of groups of the third channel support plates 32 are arranged in parallel to the first direction at intervals;

[0080] At least one of the first plate unit 1, the second plate unit 2 and the third plate unit 3 is adapted to be stacked along the third direction to form a heat exchange channel.

[0081] It should be noted that the first direction refers to the direction indicated by the arrow "X" in Figure 7 、 Figure 11 、 Figure 16 、 Figure 20 and / or Figure 24 ; the second direction refers to the direction indicated by the arrow "Y" in Figure 7 、 Figure 11 、 Figure 16 、 Figure 20 and / or Figure 24 ; and the third direction refers to the direction indicated by the arrow "Z" in Figure 7 、 Figure 11 、 Figure 16 、 Figure 20 and / or Figure 24 .

[0082] It should be noted that the height of the reinforcing rib 21 along the third direction is less than or equal to the height of the second channel support plate 22 along the third direction; in combination with Figure 12 , when the height of the reinforcing rib 21 along the third direction is equal to the height of the second channel support plate 22 along the third direction, the reinforcing ribs 21 of any two adjacent groups of the second channel support plates 22 must be arranged at intervals in the first direction to avoid the reinforcing ribs 21 of the two adjacent groups of the second channel support plates 22 coinciding in the third direction, thereby causing the flow channel to be blocked and the medium to be unable to flow.

[0083] In combination with Figure 4 , in the embodiment, the first plate unit 1 comprises a channel bottom plate 11 and a first channel support plate 12; a plurality of groups of the first channel support plates 12 are arranged in parallel to the first direction at intervals relative to the channel bottom plate 11; and the channel bottom plate 11 and the first channel support plate 12 are an integrally formed structure.

[0084] Optionally, the first plate unit 1 is formed by a chemical etching processing method.

[0085] Optionally, when the first plate unit 1 is formed by chemical etching processing, the material of the first plate unit 1 can be selected from stainless steel, titanium, copper and the like.

[0086] In combination Figure 5 In the embodiment shown, the second plate unit 2 includes a reinforcing rib 21 and a second channel support plate 22; a plurality of the second channel support plates 22 are arranged in parallel along the first direction; the reinforcing rib 21 is arranged between any two adjacent groups of the second channel support plates 22; and the reinforcing rib 21 and the second channel support plate 22 are integrally formed.

[0087] Optionally, the height of the reinforcing rib 21 along the third direction is less than the height of the second channel support plate 22 along the third direction, so as to reduce the flow resistance of the medium in the heat exchange channel and improve the heat exchange efficiency.

[0088] Optionally, the reinforcing ribs 21 of two adjacent groups of the second plate unit 2 are arranged in a staggered manner along the first direction, so as to reduce the flow resistance of the medium in the heat exchange channel and improve the heat exchange efficiency.

[0089] Optionally, the second plate unit 2 is formed by laser cutting or stamping processing, which not only avoids the material and chemical etching size constraints, but also has a lower cost compared with the chemical etching processing.

[0090] Optionally, when the second plate unit 2 is formed by laser cutting or stamping processing, the material of the second plate unit 2 can be selected from stainless steel, titanium, copper, high-temperature alloy, hastelloy and the like.

[0091] In combination Figure 6 In the embodiment shown, the third plate unit 3 includes a plurality of third channel support plates 32, and the plurality of third channel support plates 32 are arranged in parallel along the first direction.

[0092] Optionally, the third plate unit 3 is formed by laser cutting or stamping processing, which not only avoids the material and chemical etching size constraints, but also has a lower cost compared with the chemical etching processing.

[0093] Optionally, when the third plate unit 3 is formed by laser cutting or stamping processing, the material of the second plate unit 2 can be selected from stainless steel, titanium, copper, high-temperature alloy, hastelloy and the like.

[0094] In the embodiment, the heat exchange plate channel comprises: a first plate unit 1 comprising a channel bottom plate 11 and a first channel support plate 12; a plurality of groups of the first channel support plates 12 are arranged in parallel in a first direction and are spaced apart with respect to the channel bottom plate 11; a second plate unit 2 comprising a reinforcing rib 21 and a second channel support plate 22; a plurality of groups of the second channel support plates 22 are arranged in parallel in the first direction and are spaced apart; the reinforcing rib 21 is arranged between any two adjacent groups of the second channel support plates 22; a third plate unit 3 comprising a plurality of groups of third channel support plates 32, and a plurality of groups of the third channel support plates 32 are arranged in parallel in the first direction and are spaced apart; at least one of the first plate unit 1, the second plate unit 2, and the third plate unit 3 is stacked in a third direction to form a heat exchange channel, thereby overcoming the limitations of the plate material and the chemical etching size of chemical etching, not only enriching the stacking forming mode of the heat exchange channel, but also being conducive to reducing the production cost.

[0095] Specifically, the heat exchange plate channel further comprises a partition plate 4 arranged on at least one side of the second plate unit 2 or the third plate unit 3 in the third direction.

[0096] In order to facilitate the description of different combinations between the first plate unit 1, the second plate unit 2, the third plate unit 3, and / or the partition plate 4, the first plate unit 1 is represented by the letter “A”, the second plate unit 2 is represented by the letter “B”, the third plate unit 3 is represented by the letter “C”, and the partition plate 4 is represented by the letter “D”, then the first plate unit 1 can be stacked in the third direction to form an AA type composite structure, such as the full butt joint structure 51 shown in FIG. 1A; the second plate unit 2 and the partition plate 4 can be stacked in the third direction to form a DBBD type composite structure, such as the half hollow structure 52 shown in FIG. 1B; the third plate unit 3 and the partition plate 4 can be stacked in the third direction to form a DCCD type composite structure, such as the full hollow structure 53 shown in FIG. 1C; the first plate unit 1 and the second plate unit 2 can be stacked in the third direction to form an ABA type composite structure, such as the first composite channel structure 61 shown in FIG. 1D; the first plate unit 1 and the third plate unit 3 can be stacked in the third direction to form an ACA type composite structure, such as the second composite channel structure 62 shown in FIG. 1E. Figure 8 Figure 13 Figure 17 Figure 21 Figure 25 ​​​​The second composite channel structure 62 shown in the figure; the first plate unit 1, the third plate unit 3 and the partition plate 4 can also be stacked along the third direction to form an ACD composite structure (not shown in the figure); the first plate unit 1, the third plate unit 3 and the partition plate 4 can also be stacked along the third direction to form an ACCD composite structure (not shown in the figure); the first plate unit 1, the second plate unit 2 and the partition plate 4 can also be stacked along the third direction to form an ABD composite structure (not shown in the figure); the first plate unit 1, the second plate unit 2 and the partition plate 4 can also be stacked along the third direction to form an ABBD composite structure (not shown in the figure); the first plate unit 1, the second plate unit 2, the third plate unit 3 and the partition plate 4 can also be stacked along the third direction to form an ABCD composite structure (not shown in the figure); wherein the number of the second plate unit 2 and / or the third plate unit 3 in the middle part of the above composite structure can be adjusted according to actual needs, not limited to the case described in the embodiment.

[0097] Specifically, when the heat exchange plate channel is stacked by the first plate unit 1, every two groups of the first plate unit 1 are oppositely arranged to form a full counter structure 51; the full counter structure 51 is stacked along the third direction to form a heat exchange channel.

[0098] It should be noted that, in combination with Figure 9 As shown in the figure, the channel depth of the full counter structure 51 along the third direction is h, h satisfies h = h1 + h2, wherein h1 is the channel depth of one group of the first plate unit 1 along the third direction which constitutes the full counter structure 51, and h2 is the channel depth of another group of the first plate unit 1 along the third direction which constitutes the full counter structure 51; in combination with Figure 10 As shown in the figure, the channel depth of the full counter structure 51 along the third direction is h, and the channel direction of the full counter structure 51 is arranged along the first direction.

[0099] In combination with Figures 7-10 As shown in the figure, in the embodiment, when the heat exchange plate channel only includes the first plate unit 1, the first plate unit 1 is oppositely arranged and stacked along the third direction during the stacking process to form a full counter structure 51 (the full counter structure 51 is an AA composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the full counter structure 51 are stacked along the third direction to form a heat exchange channel, and one group of the full counter structure 51 in any adjacent two groups is adapted to flow the cold side medium, and the other group is adapted to flow the hot side medium, so as to realize the heat exchange of the heat exchange channels of any adjacent two groups of the full counter structure 51, and enrich the stacking forming mode of the heat exchange channel.

[0100] As a deformation, when the heat exchange plate channel is stacked by the first plate unit 1, the third plate unit 3 and the partition plate 4, a group of the third plate unit 3 is arranged between each group of the first plate unit 1 and each group of the partition plate 4, and is stacked in the third direction to form a third composite channel structure (not shown in the figure, the third composite channel structure is an ACD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the third composite channel structure are stacked in the third direction to form a heat exchange channel, one of any two adjacent groups of the third composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between the heat exchange channels of any two adjacent groups of the third composite channel structure, not only overcoming the limitation of chemical etching on the plate material and the size of chemical etching, but also enriching the stacking forming mode of the heat exchange channel.

[0101] Specifically, when the heat exchange plate channel is stacked by the second plate unit 2 and the partition plate 4, at least two groups of the second plate unit 2 are arranged between each two adjacent groups of the partition plate 4, and two groups of the partition plate 4 and at least two groups of the second plate unit 2 are stacked in the third direction to form a semi-hollow structure 52, and the semi-hollow structure 52 is adapted to be stacked in the third direction to form a heat exchange channel.

[0102] It should be noted that, in combination with Figure 14 shown, the channel depth of the semi-hollow structure 52 in the third direction is h, h satisfies h = H1 + H2, wherein H1 is the channel depth of one of the second plate units 2 constituting the semi-hollow structure 52 in the third direction, and H2 is the channel depth of the other of the second plate units 2 constituting the semi-hollow structure 52 in the third direction; in combination with Figure 15 shown, the channel depth of the semi-hollow structure 52 in the third direction is h, and the channel direction of the semi-hollow structure 52 is arranged in the first direction; the semi-hollow structure 52 can also be formed by stacking three or more groups of the second plate units 2 in the third direction, which can be adjusted according to the actual production situation, and is not limited to the case described in the embodiment.

[0103] Optionally, in the stacking process, two groups of the second plate unit 2 are arranged between each two adjacent groups of the partition plate 4, and two groups of the partition plate 4 and two groups of the second plate unit 2 are stacked in the third direction to form the semi-hollow structure 52.

[0104] In combination with Figures 11-15As shown, in the embodiment, when the heat exchange plate channel is stacked by the second plate unit 2 and the partition plate 4, at least two groups of the second plate unit 2 are arranged between every two adjacent groups of the partition plate 4, and the two groups of the partition plate 4 and the at least two groups of the second plate unit 2 are stacked in the third direction to form a half-hollow structure 52 (the half-hollow structure 52 is a DBBD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the half-hollow structure 52 are stacked in the third direction to form a heat exchange channel, one of any two adjacent groups of the half-hollow structure 52 is adapted to flow through the cold side medium, and the other is adapted to flow through the hot side medium, so as to realize heat exchange of the heat exchange channels of any two adjacent groups of the half-hollow structure 52, overcome the limitation of chemical etching on the plate material and the size of chemical etching, and facilitate to enrich the stacking forming mode of the heat exchange channel and reduce the production cost.

[0105] Specifically, when the heat exchange plate channel is stacked by the third plate unit 3 and the partition plate 4, at least two groups of the third plate unit 3 are arranged between every two adjacent groups of the partition plate 4, and the two groups of the partition plate 4 and the at least two groups of the third plate unit 3 are stacked in the third direction to form a full-hollow structure 53, and the full-hollow structure 53 is adapted to be stacked in the third direction to form a heat exchange channel.

[0106] It should be noted that, in combination with Figure 18 As shown, the channel depth of the full-hollow structure 53 in the third direction is h, and h satisfies h=H1+H2, wherein H1 is the channel depth of one of the third plate units 3 constituting the full-hollow structure 53 in the third direction, and H2 is the channel depth of the other of the third plate units 3 constituting the full-hollow structure 53 in the third direction; in combination with Figure 19 As shown, the channel depth of the full-hollow structure 53 in the third direction is h, and the channel direction of the full-hollow structure 53 is arranged in the first direction; the full-hollow structure 53 can also be formed by stacking three or more groups of the third plate unit 3 in the third direction, which can be adjusted according to the actual production situation, and is not limited to the case described in the embodiment.

[0107] Optionally, in the stacking process, two groups of the third plate unit 3 are arranged between every two adjacent groups of the partition plate 4, and the two groups of the partition plate 4 and the two groups of the third plate unit 3 are stacked in the third direction to form the full-hollow structure 53.

[0108] In combination with Figures 16-19As shown, in the embodiment, when the heat exchange plate channel is stacked by the third plate unit 3 and the partition plate 4, at least two groups of the third plate unit 3 are arranged between every two adjacent groups of the partition plate 4, and the two groups of the partition plate 4 and the at least two groups of the third plate unit 3 are stacked along the third direction to form a full hollow structure 53 (the full hollow structure 53 is a DCCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the full hollow structure 53 are stacked along the third direction to form a heat exchange channel, one of any two adjacent groups of the full hollow structure 53 is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange of the heat exchange channels of any two adjacent groups of the full hollow structure 53, overcome the limitation of chemical etching on the plate material and the size of chemical etching, and facilitate rich stacking forming modes of the heat exchange channel and reduce production cost.

[0109] Specifically, when the heat exchange plate channel is stacked by the first plate unit 1 and the second plate unit 2, at least one group of the second plate unit 2 is arranged between every two adjacent groups of the first plate unit 1, and the two groups of the first plate unit 1 and the at least one group of the second plate unit 2 are stacked along the third direction to form a first composite channel structure 61, and the first composite channel structure 61 is adapted to be stacked along the third direction to form a heat exchange channel.

[0110] It should be noted that the above description is combined with the following description. Figure 22 As shown, the channel depth of the first composite channel structure 61 along the third direction is h, h satisfies h = h1 + h2 + h3, wherein h1 is the channel depth of one of the first plate units 1 along the third direction for constituting the first composite channel structure 61, h3 is the channel depth of the other of the first plate units 1 along the third direction for constituting the first composite channel structure 61, and h2 is the channel depth of the second plate unit 2 along the third direction for constituting the first composite channel structure 61; the above description is combined with the following description. Figure 23 As shown, the channel depth of the first composite channel structure 61 along the third direction is h, and the channel direction of the first composite channel structure 61 is arranged along the first direction; the first composite channel structure 61 can also be formed by stacking two or more groups of the second plate unit 2 and two groups of the first plate unit 1 arranged oppositely along the third direction, which can be adjusted according to actual production conditions, and is not limited to the case described in the embodiment.

[0111] Optionally, in the stacking process, one group of the second plate unit 2 is arranged between every two adjacent groups of the first plate unit 1, and the two groups of the first plate unit 1 and the one group of the second plate unit 2 are stacked along the third direction to form the first composite channel structure 61.

[0112] The above description is combined with the following description. Figures 20-23As shown, in the embodiment, when the heat exchange plate channel is stacked by the first plate unit 1 and the second plate unit 2, at least one group of the second plate unit 2 is arranged between every two adjacent groups of the first plate unit 1, and the two groups of the first plate unit 1 and the at least one group of the second plate unit 2 are stacked along the third direction to form a first composite channel structure 61 (the first composite channel structure 61 is an ABA type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the first composite channel structure 61 are adapted to be stacked along the third direction to form the heat exchange channel, and one of any two adjacent groups of the first composite channel structure 61 is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between the heat exchange channels of the any two adjacent groups of the first composite channel structure 61, and overcome the limitation of chemical etching on the plate material and the chemical etching size, while facilitating the stacking forming mode of the heat exchange channel and reducing the production cost.

[0113] As a deformation, when the heat exchange plate channel is stacked by the first plate unit 1, the second plate unit 2, the third plate unit 3 and the partition plate 4, a group of the second plate unit 2 and a group of the third plate unit 3 are arranged between each group of the first plate unit 1 and each group of the partition plate 4, and are stacked along the third direction to form a fourth composite channel structure (not shown in the figure, the fourth composite channel structure is an ABCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the fourth composite channel structure are stacked along the third direction to form the heat exchange channel, and one of any two adjacent groups of the fourth composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between the heat exchange channels of the any two adjacent groups of the fourth composite channel structure, not only overcoming the limitation of chemical etching on the plate material and the chemical etching size, but also enriching the stacking forming mode of the heat exchange channel.

[0114] Specifically, when the heat exchange plate channel is stacked by the first plate unit 1 and the third plate unit 3, at least one group of the third plate unit 3 is arranged between every two adjacent groups of the first plate unit 1, and the two groups of the first plate unit 1 and the at least one group of the third plate unit 3 are stacked along the third direction to form a second composite channel structure 62, and the second composite channel structure 62 is adapted to be stacked along the third direction to form the heat exchange channel.

[0115] It should be noted that the above description is combined with the following description. Figure 26As shown, the channel depth of the second composite channel structure 62 along the third direction is h, h satisfies h = h1 + h2 + h3, wherein h1 is the channel depth of one group of the first plate units 1 along the third direction, h3 is the channel depth of another group of the first plate units 1 along the third direction, and h2 is the channel depth of one group of the third plate units 3 along the third direction. Figure 27 As shown, the channel depth of the second composite channel structure 62 along the third direction is h, and the channel direction of the second composite channel structure 62 is arranged along the first direction. The second composite channel structure 62 can also be formed by stacking two or more groups of the third plate units 3 and two groups of the first plate units 1 arranged oppositely along the third direction. The actual production situation can be adjusted, and it is not limited to the case described in the embodiment.

[0116] Optionally, during the stacking process, one group of the third plate units 3 is arranged between every two adjacent groups of the first plate units 1, and the two groups of the first plate units 1 and the one group of the third plate units 3 are stacked along the third direction to form the second composite channel structure 62.

[0117] As shown, Figures 24-27 In the embodiment, when the heat exchange plate channel is stacked by the first plate units 1 and the third plate units 3, at least one group of the third plate units 3 is arranged between every two adjacent groups of the first plate units 1, and the two groups of the first plate units 1 and the at least one group of the third plate units 3 are stacked along the third direction to form the second composite channel structure 62 (the second composite channel structure 62 is an ACA type composite structure), thereby increasing the size and / or cross-sectional area of the heat exchange channel and improving the heat exchange efficiency. Multiple groups of the second composite channel structure 62 are suitable for being stacked along the third direction to form the heat exchange channel, one group of any two adjacent groups of the second composite channel structure 62 is suitable for flowing the cold-side medium, and the other group is suitable for flowing the hot-side medium, thereby realizing heat exchange of the heat exchange channels of any two adjacent groups of the second composite channel structure 62, overcoming the limitation of chemical etching on the plate material and the size of chemical etching, and being beneficial to enriching the stacking forming mode of the heat exchange channel and reducing the production cost.

[0118] As a deformation, when the heat exchange plate channel is stacked by the first plate unit 1, the third plate unit 3 and the partition plate 4, two groups of the third plate unit 3 are arranged between each group of the first plate unit 1 and each group of the partition plate 4, and are stacked in a third direction to form a fifth composite channel structure (not shown in the figure, the fifth composite channel structure is an ACCD type composite structure), so as to increase the size and / or cross-sectional area of the heat exchange channel and improve the heat exchange efficiency; a plurality of groups of the fifth composite channel structure are stacked in the third direction to form a heat exchange channel, one of any two adjacent groups of the fifth composite channel structure is adapted to flow the cold side medium, and the other is adapted to flow the hot side medium, so as to realize heat exchange between the heat exchange channels of any two adjacent groups of the fifth composite channel structure, which not only overcomes the limitation of chemical etching on the plate material and the chemical etching size, but also enriches the stacking forming mode of the heat exchange channel.

[0119] Specifically, the processing and forming mode of the second plate unit 2 and / or the third plate unit 3 includes but is not limited to laser cutting, stamping and / or chemical etching.

[0120] It should be noted that the processing and forming mode of the second plate unit 2 and / or the third plate unit 3 includes but is not limited to laser cutting, stamping and / or chemical etching; the material of the second plate unit 2 and / or the third plate unit 3 includes but is not limited to stainless steel, titanium, copper, high-temperature alloy and / or hastelloy; when the material of the second plate unit 2 and / or the third plate unit 3 is stainless steel, titanium, copper, high-temperature alloy, hastelloy and the like, the processing and forming mode of the second plate unit 2 and / or the third plate unit 3 can be laser cutting and stamping, so as to overcome the limitation of chemical etching on the plate material and the chemical etching size, and reduce the processing and manufacturing cost of the plate; when the material of the second plate unit 2 and / or the third plate unit 3 is stainless steel, titanium, copper and the like, the processing and forming mode of the second plate unit 2 can be chemical etching, so as to improve the precision of plate production and processing, which can be adjusted according to the actual production situation, and is not limited to the situation described in the embodiment.

[0121] Specifically, the processing and forming mode of the first plate unit 1 includes but is not limited to chemical etching.

[0122] It should be noted that the processing and forming mode of the first plate unit 1 includes but is not limited to laser cutting, stamping and / or chemical etching; the material of the first plate unit 1 includes but is not limited to stainless steel, titanium, copper, high-temperature alloy and / or hastelloy; when the material of the first plate unit 1 is stainless steel, titanium, copper and the like, the processing and forming mode of the first plate unit 1 can be chemical etching, so as to improve the precision of plate production and processing, which can be adjusted according to the actual production situation, and is not limited to the situation described in the embodiment.

[0123] This embodiment also provides a heat exchanger, specifically a printed circuit board type heat exchanger, including:

[0124] Such as the heat exchange plate channels mentioned above;

[0125] The heat exchange plate channel has one of two adjacent flow channels along the third direction, one of which is a hot-side flow channel and the other is a cold-side flow channel.

[0126] The cross-sectional shape of the heat exchange plate channel includes, but is not limited to, rectangular, circular, semi-circular and / or elliptical shapes.

[0127] It should be noted that, in combination Figures 28-31 As shown, the cross-sectional shape of the heat exchange plate channels includes, but is not limited to, those shown. Figure 28 rectangular channel cross section in Figure 29 The circular channel cross section in Figure 30 The semi-circular channel section and / or Figure 31 The elliptical channel cross section can be adjusted according to the actual production situation, and is not limited to the situation described in this embodiment; at least one of the first plate unit 1, the second plate unit 2 and the third plate unit 3 are stacked along the third direction and formed by welding to form a heat exchange channel. The welding method includes, but is not limited to, diffusion welding, brazing and argon arc welding, and can be adjusted according to the actual production situation, and is not limited to the situation described in this embodiment.

[0128] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A heat exchange plate channel, characterized in that The application relates to a heat exchange plate channel, which comprises the following parts: a first plate unit (1) comprising a channel bottom plate (11) and a first channel support plate (12); a plurality of groups of the first channel support plates (12) are arranged in parallel with the channel bottom plate (11) in a first direction; a second plate unit (2) comprising a reinforcing rib (21) and a second channel support plate (22); a plurality of groups of the second channel support plates (22) are arranged in parallel in the first direction; the reinforcing rib (21) is arranged between any two adjacent groups of the second channel support plates (22); a third plate unit (3) comprising a plurality of groups of third channel support plates (32); a plurality of groups of the third channel support plates (32) are arranged in parallel in the first direction; at least one of the first plate unit (1), the second plate unit (2) and the third plate unit (3) is suitable for being stacked in a third direction to form a heat exchange channel.

2. The heat exchange plate channel according to claim 1, characterized in that The application further comprises a partition plate (4), which is arranged on at least one side of the second plate unit (2) or the third plate unit (3) in the third direction.

3. The heat exchange plate channel according to claim 2, characterized in that When the heat exchange plate channel is stacked by the first plate unit (1), every two groups of the first plate units (1) are arranged oppositely to form a full interlocking structure (51); the full interlocking structure (51) is stacked in the third direction to form a heat exchange channel.

4. The heat exchange plate channel according to claim 2, characterized in that When the heat exchange plate channel is stacked by the second plate unit (2) and the partition plate (4), at least two groups of the second plate units (2) are arranged between every two adjacent groups of the partition plates (4); two groups of the partition plates (4) and at least two groups of the second plate units (2) are stacked in the third direction to form a half hollow structure (52); the half hollow structure (52) is suitable for being stacked in the third direction to form a heat exchange channel.

5. The heat exchange plate channel according to claim 2, characterized in that When the heat exchange plate channel is stacked by the third plate unit (3) and the partition plate (4), at least two groups of the third plate units (3) are arranged between every two adjacent groups of the partition plates (4); two groups of the partition plates (4) and at least two groups of the third plate units (3) are stacked in the third direction to form a full hollow structure (53); the full hollow structure (53) is suitable for being stacked in the third direction to form a heat exchange channel.

6. The heat exchange plate channel according to claim 2, characterized in that When the heat exchange plate channel is stacked by the first plate unit (1) and the second plate unit (2), at least one group of the second plate units (2) is arranged between every two adjacent groups of the first plate units (1); two groups of the first plate units (1) and at least one group of the second plate units (2) are stacked in the third direction to form a first composite channel structure (61); the first composite channel structure (61) is suitable for being stacked in the third direction to form a heat exchange channel.

7. The heat transfer plate channel according to claim 2, characterised in that When the heat exchange plate channel is stacked by the first plate unit (1) and the third plate unit (3), at least one group of the third plate units (3) is arranged between every two adjacent groups of the first plate units (1); two groups of the first plate units (1) and at least one group of the third plate units (3) are stacked in the third direction to form a second composite channel structure (62); the second composite channel structure (62) is suitable for being stacked in the third direction to form a heat exchange channel.

8. The heat exchange plate channel according to any of the claims 1-7, characterised in that The forming method of the second plate unit (2) and / or the third plate unit (3) includes laser cutting, stamping or chemical etching.

9. The heat exchange plate channel according to any of the claims 1-7, characterized in that The forming method of the first plate unit (1) is chemical etching.

10. A heat exchanger, characterized by The heat exchange plate channel comprises: The heat exchange plate channel according to any one of claims 1-9; The heat exchange plate channel is arranged in a third direction, and any two adjacent layers of the heat exchange plate channel are a hot side flow channel and a cold side flow channel. The cross-sectional shape of the heat exchange plate channel includes a rectangle, a circle, a semicircle and / or an ellipse.

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