Liquid cooling heat dissipation device

Abstract

The application provides a liquid cooling heat dissipation device, comprising: a liquid cooling mounting plate assembly, the liquid cooling mounting plate assembly comprising a liquid cooling mounting plate shell and a liquid cooling mounting plate, the liquid cooling mounting plate being fixedly connected through the liquid cooling mounting plate shell; a liquid cooling assembly, the liquid cooling assembly comprising a first fluid connector, a second fluid connector, a liquid cooling flow channel, a liquid inlet and a liquid outlet, the liquid cooling flow channel being a sealed pipeline arranged inside the liquid cooling mounting plate, the liquid inlet and the liquid outlet being arranged on the surface of the liquid cooling mounting plate, the first fluid connector being communicated with the liquid inlet and the inlet end of the liquid cooling flow channel, and the second fluid connector being communicated with the liquid outlet and the outlet end of the liquid cooling flow channel; and a fixed mounting plate assembly, the liquid cooling mounting plate assembly being fixedly connected through the fixed mounting plate assembly. By using the liquid cooling heat dissipation device, the heat dissipation requirement of high-power heat generating components can be met, and the reliability of airborne equipment can be greatly improved.

Description

Technical Field

[0001] This manual relates to the field of heat dissipation devices, specifically to a liquid cooling heat dissipation device. Background Technology

[0002] With the increasing integration of electronic devices, components are becoming smaller and smaller, resulting in highly concentrated heat dissipation. This places higher demands on the reliability of electronic devices. The main cause of premature failure in electronic devices is overstress, namely electrical, thermal, and mechanical stress, with a close relationship between electrical and thermal stress. Electronic devices require suitable operating temperatures; prolonged overheating can lead to malfunctions or failures. Temperature changes significantly affect the failure rate of electronic components; data shows that 70% of electronic device failures are related to excessively high thermal environments. The percentage increase in failure rate for electronic devices at an initial temperature of 50°C is shown for different temperature rises. The failure rate of electronic devices increases exponentially with increasing temperature. This is because thermal coupling occurs between components through convection, conduction, and radiation. Therefore, temperature has a crucial impact on the performance of electronic devices. Summary of the Invention

[0003] In view of this, the embodiments of this specification provide a liquid cooling heat dissipation device to meet the heat dissipation requirements of high-power heat-generating components.

[0004] The embodiments in this specification provide the following technical solutions:

[0005] A liquid cooling heat dissipation device, comprising:

[0006] A liquid-cooled mounting plate assembly, comprising a liquid-cooled mounting plate housing and a liquid-cooled mounting plate, wherein the liquid-cooled mounting plate is connected and fixed through the liquid-cooled mounting plate housing;

[0007] The liquid cooling assembly includes a first fluid connector, a second fluid connector, a liquid cooling channel, an inlet, and an outlet. The liquid cooling channel is a sealed pipe located inside the liquid cooling mounting plate. The inlet and outlet are both located on the surface of the liquid cooling mounting plate. The first fluid connector is connected to the inlet end of the liquid cooling channel through the inlet, and the second fluid connector is connected to the outlet end of the liquid cooling channel through the outlet.

[0008] The liquid-cooled mounting plate assembly is connected and fixed via the fixed mounting plate assembly.

[0009] Furthermore, the liquid-cooled mounting plate assembly includes a front mounting plate assembly, a first side mounting plate assembly, and a second side mounting plate assembly. The fixed mounting plate assembly includes an upper mounting plate, a rear mounting plate, and a lower mounting plate. The front mounting plate assembly, the first side mounting plate assembly, the second side mounting plate assembly, the upper mounting plate, the rear mounting plate, and the lower mounting plate are connected by a connecting device to form a hollow cavity, and the heating element is placed inside the hollow cavity.

[0010] Furthermore, the front mounting plate assembly includes a front mounting plate and four front mounting plate flow channel grooves, all of which are disposed inside the front mounting plate and communicate with the liquid cooling flow channel;

[0011] The first side mounting plate assembly includes a first side mounting plate and two first side mounting plate flow channel bosses. The two first side mounting plate flow channel bosses are both located inside the first side mounting plate and communicate with the liquid cooling flow channel.

[0012] The second side mounting plate assembly includes a second side mounting plate and two second side mounting plate flow channel bosses. The two second side mounting plate flow channel bosses are both located inside the second side mounting plate and communicate with the liquid cooling flow channel.

[0013] Both the inlet and outlet are located on the surface of the front mounting plate. Coolant flows into the liquid cooling channel of the front mounting plate through the inlet and flows into and out of the liquid cooling channel of the first side mounting plate through the channel formed by the insertion and cooperation of the groove of the front mounting plate and the protrusion of the first side mounting plate. Coolant flows into and out of the liquid cooling channel of the second side mounting plate through the channel formed by the insertion and cooperation of the groove of the front mounting plate and the protrusion of the second side mounting plate and flows out through the outlet.

[0014] Furthermore, the front mounting plate assembly also includes sealing rings, which are respectively disposed at the connection between the front mounting plate flow channel groove and the first side mounting plate flow channel boss, as well as at the connection between the front mounting plate flow channel groove and the second side mounting plate flow channel boss.

[0015] Furthermore, a weight-reducing groove for the first side mounting plate is provided.

[0016] Furthermore, a weight-reducing groove for the second mounting plate is provided on the second mounting plate.

[0017] Furthermore, the connecting device is a screw or a snap-fit.

[0018] Furthermore, the first side mounting plate assembly also includes a first side mounting plate cylindrical boss, and multiple first side mounting plate cylindrical bosses are disposed on the inner surface of the first side mounting plate. The heat-generating components are fixed by the first side mounting plate cylindrical bosses and the liquid cooling heat dissipation device.

[0019] Furthermore, the second side mounting plate assembly also includes a second side mounting plate cylindrical boss, with multiple second side mounting plate cylindrical bosses disposed on the inner surface of the second side mounting plate, and the heat-generating components are fixed by the second side mounting plate cylindrical bosses and the liquid cooling heat dissipation device.

[0020] Furthermore, the liquid-cooled mounting plate and the liquid-cooled mounting plate housing are connected and fixed by vacuum brazing.

[0021] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:

[0022] Liquid cooling systems house numerous heat-generating electronic devices, meeting the heat dissipation needs of high-power, high-heat components and significantly improving equipment reliability. Liquid-cooled chassis offer superior heat dissipation capabilities compared to naturally cooled chassis, increasing cooling capacity by over 60%. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a perspective view of a liquid cooling heat dissipation device without a fluid connector according to an embodiment of the present invention;

[0025] Figure 2 This is a front view of the liquid cooling heat dissipation device after the fluid connector is installed according to an embodiment of the present invention;

[0026] Figure 3 This is a bottom view of the liquid cooling heat dissipation device after the fluid connector is installed according to an embodiment of the present invention;

[0027] Figure 4 This is a rear view of the liquid cooling heat dissipation device after the fluid connector is installed according to an embodiment of the present invention;

[0028] Figure 5 This is a side view of the pre-installation version of an embodiment of the present invention;

[0029] Figure 6 yes Figure 5 A sectional view of section AA;

[0030] Figure 7 This is a schematic diagram of the back of the mounting plate in an embodiment of the present invention;

[0031] Figure 8 This is a side view of the mounting plate in an embodiment of the present invention;

[0032] Figure 9 This is a top view of the mounting plate in an embodiment of the present invention;

[0033] Figure 10 This is a front view of the first side mounting plate assembly according to an embodiment of the present invention;

[0034] Figure 11 This is a side view of the first side mounting plate assembly according to an embodiment of the present invention;

[0035] Figure 12 This is a top view of the first side mounting plate assembly according to an embodiment of the present invention;

[0036] Figure 13 This is a front view of the second side mounting plate assembly according to an embodiment of the present invention;

[0037] Figure 14 This is a side view of the second side mounting plate assembly according to an embodiment of the present invention;

[0038] Figure 15 This is a top view of the second side mounting plate assembly according to an embodiment of the present invention;

[0039] Figure 16 This is a front view of the rear mounting plate according to an embodiment of the present invention;

[0040] Figure 17 This is a side view of the rear mounting plate according to an embodiment of the present invention;

[0041] Figure 18 This is a schematic diagram of the back of the mounting plate in an embodiment of the present invention;

[0042] Figure 19 This is a side view of the mounting plate in an embodiment of the present invention;

[0043] Figure 20 This is a top view of the mounting plate in an embodiment of the present invention.

[0044] Explanation of reference numerals in the attached drawings: 1. Front mounting plate assembly; 101. Front mounting plate housing; 102. Front mounting plate; 103. Sealing ring; 104. Front mounting plate flow channel groove; 2. Upper mounting plate; 3. First side mounting plate assembly; 301. First side mounting plate housing; 302. First side mounting plate; 303. First side mounting plate cylindrical boss; 304. First side mounting plate weight reduction groove; 305. First side mounting plate flow channel boss; 4. Second side mounting plate assembly; 401. Second side mounting plate housing; 402. Second side mounting plate; 403. Second side mounting plate cylindrical boss; 404. Second side mounting plate weight reduction groove; 405. Second side mounting plate flow channel boss; 5. Rear mounting plate; 6. Lower mounting plate; 7. Liquid inlet; 8. Liquid outlet; 9. First fluid connector; 10. Second fluid connector. Detailed Implementation

[0045] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0046] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0048] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0049] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0050] Based on their functions, the liquid cooling heat dissipation device includes: a liquid cooling mounting plate assembly, a liquid cooling component, and a fixed mounting plate assembly. The liquid cooling mounting plate assembly includes a liquid cooling mounting plate housing and a liquid cooling mounting plate, which is connected and fixed via the housing. The liquid cooling component includes a first fluid connector, a second fluid connector, a liquid cooling channel, an inlet, and an outlet. The liquid cooling channel is a sealed pipe located inside the liquid cooling mounting plate. The inlet and outlet are both located on the surface of the mounting plate. The first fluid connector connects to the inlet end of the liquid cooling channel via the inlet, and the second fluid connector connects to the outlet end of the channel via the outlet. The cooling effect is achieved by the flow of liquid within the heat dissipation device carrying away heat. The fixed mounting plate assembly connects and fixes the liquid cooling mounting plate assembly.

[0051] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0052] refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The present invention mainly consists of a front mounting plate assembly 1, a first side mounting plate assembly 3, a second side mounting plate assembly 4, a lower mounting plate 6, a rear mounting plate 5, an upper mounting plate 2, and a connecting device. The heating element is placed in a cavity formed by the front mounting plate assembly 1, the first side mounting plate assembly 3, the second side mounting plate assembly 4, the lower mounting plate 6, the rear mounting plate 5, and the upper mounting plate 2. The heating element is placed inside the hollow cavity.

[0053] Liquid cooling channels are designed inside the front mounting plate assembly 1, the first side mounting plate assembly 3, and the second side mounting plate assembly 4. The front mounting plate assembly 1 is provided with a liquid inlet 7 and a liquid outlet 8, which are respectively connected to the first fluid connector 9 and the second fluid connector 10.

[0054] The liquid flow path within the liquid cooling system is as follows: it flows in through the first fluid connector 9 on the left side of the front mounting plate assembly 1, then through the front mounting plate assembly to the second side mounting plate assembly 4, then back into the front mounting plate assembly 1 via the second side mounting plate assembly 4, then through the front mounting plate assembly 1 to the first side mounting plate assembly 3, then back into the front mounting plate assembly 1 via the first side mounting plate assembly 3, and finally out through the second fluid connector 10 on the right side of the front mounting plate assembly 1. Through the circulation of the coolant within the chassis panel, heat is carried away from the chassis, thereby achieving heat dissipation for the heat-generating equipment and components inside the liquid cooling system.

[0055] like Figure 5As shown, the front mounting plate assembly 1 consists of a front mounting plate housing 101 and a front mounting plate 102. The front mounting plate 102 is connected to other mounting plates via the front mounting plate housing 101. The front mounting plate housing 101 and the front mounting plate 102 are connected by vacuum brazing. The coolant inlet and outlet are both located on the front mounting plate assembly 1 to ensure that the cooling function can be realized.

[0056] like Figure 6 As shown, each side of the front mounting plate assembly 1 has two front mounting plate flow channel grooves 104, the second side mounting plate assembly 4 has two second side mounting plate flow channel bosses 405, and the first side mounting plate assembly 3 has a first side mounting plate flow channel boss 305. Cooling fluid flows between the front mounting plate assembly 1 and the second side mounting plate assembly 4 via the two front mounting plate flow channel grooves 104 and the two second side mounting plate flow channel bosses 405. Similarly, liquid flows between the front mounting plate assembly 1 and the first side mounting plate assembly 3 via the two front mounting plate flow channel grooves 104 and the two first side mounting plate flow channel bosses 305. To prevent fluid leakage between the two mounting plate assemblies, two annular grooves are designed inside each of the two front mounting plate flow channel grooves 104, and O-ring seals 103 are installed within these annular grooves to seal the flowing liquid.

[0057] like Figure 7 , Figure 8 and Figure 9 As shown, the upper mounting plate is a support plate, and the upper mounting plate is provided with screw holes or snap-fit ​​structures for connection.

[0058] like Figure 10 , Figure 11 and Figure 12 As shown, the first side mounting plate assembly 3 consists of a first side mounting plate housing 301 and a first side mounting plate 302, which are connected by vacuum brazing. Figure 13 , Figure 14 and Figure 15 As shown, the second side mounting plate assembly 4 consists of a second side mounting plate housing 401 and a second side mounting plate 402, which are connected by vacuum brazing. Both the first side mounting plate assembly 3 and the second side mounting plate assembly 4 include multiple cylindrical bosses on the side mounting plates, namely, cylindrical bosses 303 and 403. The avionics system functional modules housed inside the liquid cooling heat dissipation device are fixed to the liquid cooling heat dissipation device via the cylindrical bosses 303 and 403.

[0059] The front mounting plate assembly 1, rear mounting plate 5, upper mounting plate 2, lower mounting plate 6, second side mounting plate assembly 4, and first side mounting plate assembly 3 of the liquid cooling heat dissipation device are all connected and fixed by connecting devices, i.e., screws or clips.

[0060] like Figure 3 As shown, a weight-reducing groove 304 is provided on the first side mounting plate 302. The weight-reducing groove 304 is a hollow groove, as shown in the figure. Figure 2 As shown, the second side mounting plate 402 is provided with a second side mounting plate weight reduction groove 404, which is a hollow groove. The hollow structure of the first side mounting plate weight reduction groove 304 and the second side mounting plate weight reduction groove 404 can reduce the weight of the two side mounting plates, thereby reducing the weight of the entire liquid cooling heat dissipation device.

[0061] like Figure 16 and Figure 17 As shown, the rear mounting plate is a support plate, and the rear mounting plate is provided with screw holes or snap-fit ​​structures for connection.

[0062] like Figure 18 , Figure 19 and Figure 20 As shown, the lower mounting plate is a support plate, and the lower mounting plate is provided with screw holes or snap-fit ​​structures for connection.

[0063] In other embodiments, depending on the actual heat dissipation needs, the rear mounting plate 5, the upper mounting plate 2, and the lower mounting plate 6 can all be designed with the same structure as the second side mounting plate assembly 4 and the first side mounting plate assembly 3, that is, liquid cooling channels are set inside the mounting plates to increase the heat dissipation function.

[0064] In other embodiments, the mounting plate assembly may be a structure customized according to the shape of the heat-generating component, such as an irregularly shaped structure like a cylinder.

[0065] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description because they correspond to the system; relevant parts can be referred to the descriptions in the system embodiments.

[0066] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A liquid cooling heat dissipation device, characterized in that, include: A liquid-cooled mounting plate assembly, the liquid-cooled mounting plate assembly including a liquid-cooled mounting plate housing and a liquid-cooled mounting plate, the liquid-cooled mounting plate being connected and fixed through the liquid-cooled mounting plate housing; The liquid cooling assembly includes a first fluid connector (9), a second fluid connector (10), a liquid cooling channel, an inlet (7), and an outlet (8). The liquid cooling channel is a sealed pipe disposed inside the liquid cooling mounting plate. The inlet (7) and the outlet (8) are both disposed on the surface of the liquid cooling mounting plate. The first fluid connector (9) is connected to the inlet end of the liquid cooling channel through the inlet (7), and the second fluid connector (10) is connected to the outlet end of the liquid cooling channel through the outlet (8). A fixed mounting plate assembly, wherein the liquid-cooled mounting plate assembly is connected and fixed through the fixed mounting plate assembly; The liquid-cooled mounting plate assembly includes a front mounting plate assembly (1), a first side mounting plate assembly (3), and a second side mounting plate assembly (4). The fixed mounting plate assembly includes an upper mounting plate (2), a rear mounting plate (5), and a lower mounting plate (6). The front mounting plate assembly (1), the first side mounting plate assembly (3), the second side mounting plate assembly (4), the upper mounting plate (2), the rear mounting plate (5), and the lower mounting plate (6) are connected by a connecting device to form a hollow cavity, and heating elements are placed inside the hollow cavity. The front mounting plate assembly (1) includes a front mounting plate (102) and four front mounting plate flow channel grooves (104), all of which are disposed inside the front mounting plate (102) and communicate with the liquid cooling flow channel; The first side mounting plate assembly (3) includes a first side mounting plate (302) and two first side mounting plate flow channel bosses (305). The two first side mounting plate flow channel bosses (305) are both disposed inside the first side mounting plate (302) and communicate with the liquid cooling flow channel. The second side mounting plate assembly (4) includes a second side mounting plate (402) and two second side mounting plate flow channel bosses (405). The two second side mounting plate flow channel bosses (405) are both disposed inside the second side mounting plate (402) and communicate with the liquid cooling flow channel. Both the inlet (7) and the outlet (8) are located on the surface of the front mounting plate (102). Cooling liquid flows into the liquid cooling channel of the front mounting plate (102) through the inlet (7) and flows into and out of the liquid cooling channel of the first side mounting plate (302) through the channel formed by the front mounting plate channel groove (104) and the first side mounting plate channel boss (305). The cooling liquid flows into and out of the liquid cooling channel of the second side mounting plate (402) through the channel formed by the front mounting plate channel groove (104) and the second side mounting plate channel boss (405) and flows out through the outlet (8).

2. The liquid cooling heat dissipation device according to claim 1, characterized in that, The front mounting plate assembly (1) also includes a sealing ring (103), which is respectively disposed at the connection between the front mounting plate flow channel groove (104) and the first side mounting plate flow channel boss (305) and the connection between the front mounting plate flow channel groove (104) and the second side mounting plate flow channel boss (405).

3. The liquid cooling heat dissipation device according to claim 1, characterized in that, The first side mounting plate (302) is provided with a first side mounting plate weight reduction groove (304).

4. The liquid cooling heat dissipation device according to claim 1, characterized in that, The second side mounting plate (402) is provided with a second side mounting plate weight reduction groove (404).

5. The liquid cooling heat dissipation device according to claim 1, characterized in that, The connecting device is a screw or a snap-fit.

6. The liquid cooling heat dissipation device according to claim 1, characterized in that, The first side mounting plate assembly (3) also includes a first side mounting plate cylindrical boss (303), and a plurality of first side mounting plate cylindrical bosses (303) are disposed on the inner surface of the first side mounting plate (302). The heat-generating components are fixed by the first side mounting plate cylindrical bosses (303) and the liquid cooling heat dissipation device.

7. The liquid cooling heat dissipation device according to claim 1, characterized in that, The second side mounting plate assembly (4) also includes a second side mounting plate cylindrical boss (403). Multiple second side mounting plate cylindrical bosses (403) are disposed on the inner surface of the second side mounting plate (402). The heat-generating components are fixed by the second side mounting plate cylindrical bosses (403) and the liquid cooling heat dissipation device.

8. The liquid cooling heat dissipation device according to claim 1, characterized in that, The liquid-cooled mounting plate and the liquid-cooled mounting plate housing are connected and fixed by vacuum brazing.

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