Preparation technology of optical glass reconstituted motherboard

Abstract

The present invention discloses a process for preparing an optical glass reconstructed motherboard. The motherboard manufactured by the present invention using embossing technology and glass lens reconstructing technology combines optical lenses, gaskets and shielding layers into one structure. Moreover, directly manufacturing optical lens motherboards using glass lenses can also reduce the error of lens shapes and increase the stability and uniformity of the optical lens motherboard performance; the process for preparing optical glass reconstructed motherboards of the present invention reduces the manufacturing cost, simplifies the manufacturing process, and the manufactured motherboards can be used to mass-produce high-precision optical modules.

Description

Technical Field

[0001] The present invention relates to a process technology for manufacturing a motherboard using embossing process technology and glass lens reconstruction technology, and in particular to a process for preparing an optical glass reconstruction motherboard, which is suitable for the manufacture of motherboards for high-precision micro-optical module packaging and high-precision microelectronic wafer packaging in mass production. Background Art

[0002] For motherboards for micro-optical module packaging and microelectronic wafer packaging, the most common patterning methods on the market are: UV exposure machines use the sensitivity of photoresists to ultraviolet rays, combined with preset masks, to transfer patterns to the required photoresist materials to make motherboards with gasket structures and shielding layer structures; or use single-point diamond turning technology SPDT to manufacture a single lens, and then use a single lens to repeatedly replicate optical lens motherboards with nano-imprinting technology. If the product requires a motherboard with a gasket structure and a shielding layer structure for an optical lens, the traditional process is very difficult to produce, and the equipment and devices are usually expensive and the process is cumbersome. Summary of the invention

[0003] In order to solve the above technical problems, the present invention designs a process for preparing an optical glass reconstituted mother plate.

[0004] The present invention adopts the following technical solution:

[0005] A process for preparing an optical glass reconstituted mother plate, the process steps of which are as follows:

[0006] S1. Pretreatment of glass substrate: Cut the glass into square glass substrates and polish the upper and lower surfaces;

[0007] S2, lens cavity production: opening lens cavities evenly distributed in an array on a polished glass substrate;

[0008] S3, working mold assembly: making a working mold, placing the glass substrate with the lens cavity opened into the working mold for alignment and assembly;

[0009] S4, glue injection, embossing and curing: Load the assembled working mold into the automatic embossing packaging machine for glue injection, embossing and molding, inject and emboss a circle of black epoxy resin glue on the outer edge of the lens cavity on the glass substrate, and solidify the glue by ultraviolet light combined with high temperature baking to form a gasket and shielding layer that is fixedly connected to the glass substrate;

[0010] S5, demoulding the working mold: removing the set of working molds after the high-temperature baking glue is solidified from the oven for cooling, and demoulding the packaged motherboard from the working mold;

[0011] S6, glue application on glass lens: extract the glass lens and apply adhesive on the back of the glass lens;

[0012] S7, glass lens construction: a glass lens with adhesive is placed in the lens cavity of the mother board by a transplanting machine to be bonded and fixed, thereby completing the construction of the glass lens;

[0013] S8, repeating the steps of glass lens dispensing and glass lens construction: repeating the steps of glass lens dispensing and glass lens construction until the glass lens of the full layout of the motherboard is completed;

[0014] S9, thermal baking: putting the mother board with the completed glass lens into the oven for thermal baking, and taking it out after baking to complete the entire optical glass reconstructed mother board preparation process.

[0015] Preferably, the working mold comprises an upper mold and a lower mold, an upper template is installed under the upper mold, and a lower template is installed on the lower mold. A groove matching the glass substrate is provided on the lower template. A concave groove corresponding to the gasket and the shielding layer is provided on the bottom of the upper template corresponding to the outer edge of the lens cavity on the glass substrate. Glue injection holes are provided on the lower mold and the upper template, and the glue injection holes are connected to the glue injection grooves.

[0016] Preferably, in step S1, the upper and lower surfaces are polished to: TTV≤1 um.

[0017] Preferably, in step S2, the lens cavity is opened by laser etching.

[0018] Preferably, in step S4, the process conditions of ultraviolet light combined with high temperature baking are: ultraviolet light UV365nm, 10 minutes of irradiation; baking at 120°C, 20 minutes.

[0019] Preferably, in step S5, the cooling process conditions are: cooling at room temperature for 20 minutes.

[0020] Preferably, in step S9, the thermal baking process conditions are: baking at 85° C. for 120 minutes.

[0021] The beneficial effects of the present invention are as follows: (1) The motherboard manufactured by the present invention using the embossing process technology and the glass lens reorganization technology combines the optical lens, the gasket and the shielding layer into one structure. Moreover, the use of glass lenses to directly manufacture the optical lens motherboard will also reduce the error of the lens shape and increase the stability and uniformity of the optical lens motherboard performance; (2) The optical glass reorganization motherboard preparation process of the present invention reduces the production cost and simplifies the production process. The produced motherboard can be used to mass-produce high-precision optical modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a structural schematic diagram of a glass substrate in the present invention;

[0023] Figure 2 It is a structural schematic diagram of a lens cavity processed on a glass substrate in the present invention;

[0024] Figure 3 This is a structural schematic diagram of a glass substrate glue injection mold in the present invention;

[0025] Figure 4 This is a schematic diagram of a structure for performing glue injection and printing on a glass substrate in the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the glass substrate glue injection mold after demoulding in the present invention;

[0027] Figure 6 This is a structural schematic diagram of glass lens dispensing in the present invention;

[0028] Figure 7 It is a schematic diagram of a structure of a glass lens in the present invention;

[0029] Figure 8 It is a schematic diagram of a structure formed by a fully arranged glass lens in the present invention;

[0030] Fig. 9 This is a schematic diagram of the structure of the motherboard after baking the glass lens in the present invention;

[0031] Fig.10 It is a structural schematic diagram of the upper template in the present invention;

[0032] In the figure: 1. glass substrate, 2. lens cavity, 3. upper mold, 4. lower mold, 5. upper template, 6. lower template, 7. glue injection hole, 8. gasket and shielding layer, 9. glass lens, 10. adhesive, 11. glue injection groove. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0034] Example: As attached Figure 1 As shown, a process for preparing an optical glass reconstituted mother plate, the process steps are:

[0035] S1, such as Figure 1 As shown, glass substrate pretreatment: glass is cut into square glass substrates 1, and the upper and lower surfaces are polished;

[0036] S2, such as Figure 2 As shown, lens cavity manufacturing: lens cavities 2 arranged evenly in an array are opened on a polished glass substrate;

[0037] S3, such as Figure 3 As shown, working mold assembly: making a working mold, placing the glass substrate with the lens cavity opened into the working mold for alignment and assembly;

[0038] S4, such as Figure 4 As shown, glue injection, embossing and curing molding: the assembled working mold is loaded into the automatic embossing packaging machine for glue injection, embossing and molding, and a circle of black epoxy resin glue is injected and embossed on the outer edge of the lens cavity on the glass substrate, and the glue is cured by ultraviolet light combined with high temperature baking to form a gasket and a shielding layer 8 that is integrally fixedly connected to the glass substrate;

[0039] S5, such as Figure 5 As shown, demoulding of the working mold: removing the set of working molds after curing the high-temperature baking glue from the oven for cooling, and demoulding the packaged motherboard from the working mold;

[0040] S6, such as Figure 6 As shown, the glass lens glue is applied: the glass lens 9 is taken out, and the adhesive glue 10 is applied on the back of the glass lens;

[0041] S7, such as Figure 7 As shown, the glass lens is built: a glass lens with adhesive is placed in the lens cavity of the mother board by a transplanter to be bonded and fixed, so as to complete the glass lens building;

[0042] S8, such as Figure 8 As shown, the steps of dispensing the glass lens and building the glass lens are repeated: the steps of dispensing the glass lens and building the glass lens are repeated until the glass lens of the full layout of the motherboard is completed;

[0043] S9, such as Fig. 9 As shown, thermal baking: the mother board with the completed glass lens is placed in an oven for thermal baking, and after baking, it is taken out to complete the entire optical glass reconstructed mother board preparation process.

[0044] In step S1, the upper and lower surfaces are polished to: TTV≤1 um.

[0045] In step S2, the lens cavity is opened by laser etching.

[0046] In step S4, the process conditions of ultraviolet light combined with high temperature baking are: ultraviolet light UV365nm, 10 minutes of irradiation; baking at 120°C, 20 minutes.

[0047] In step S5, the cooling process conditions are: cooling at room temperature for 20 minutes.

[0048] In step S9, the thermal baking process conditions are: baking at 85° C. for 120 minutes.

[0049] like Figure 3 and Fig.10 As shown, the working mold includes an upper mold 3 and a lower mold 4, an upper template 5 is installed under the upper mold, and a lower template 6 is installed on the lower mold. A groove matching the glass substrate is arranged in an inward concave manner on the lower template, and a glue injection groove corresponding to the gasket and the shielding layer is arranged in an inward concave manner on the outer edge of the lens cavity on the glass substrate at the bottom of the upper template. Glue injection holes 7 are arranged on the lower mold and the upper template, and the glue injection holes are connected to the glue injection groove 11.

[0050] The optical glass reconstructed master produced by the optical glass reconstructed master preparation process can improve the positioning accuracy of glass lenses from ±2um to ±0.5um; the lens shape dimension tolerance is small, and FE can be improved from ±1um to ±0.2um; the process steps are short; and the master service life is long, which can be increased from 30 times to 100 times.

[0051] The above-described embodiment is only a preferred solution of the present invention and does not limit the present invention in any form. There are other variations and modifications without exceeding the technical solution described in the claims.

Claims

1. A process for preparing an optical glass reconstituted mother plate, characterized in that: The process steps are: S1. Glass substrate pretreatment: Cut the glass into square glass substrates and polish the upper and lower surfaces; S2, lens cavity production: opening lens cavities evenly distributed in an array on a polished glass substrate; S3, working mold assembly: making a working mold, placing the glass substrate with the lens cavity opened into the working mold for alignment and assembly; S4, glue injection, embossing and curing: Load the assembled working mold into the automatic embossing packaging machine for glue injection, embossing and molding, inject and emboss a circle of black epoxy resin glue on the outer edge of the lens cavity on the glass substrate, and solidify the glue by ultraviolet light combined with high temperature baking to form a gasket and shielding layer that is fixedly connected to the glass substrate; S5, demoulding the working mold: removing the set of working molds after the high-temperature baking glue liquid is solidified from the oven for cooling, and demoulding the packaged motherboard from the working mold; S6, glue application on glass lens: extract the glass lens and apply adhesive on the back of the glass lens; S7, glass lens construction: a glass lens with adhesive is placed in the lens cavity of the mother board by a transplanting machine to be bonded and fixed, thereby completing the construction of the glass lens; S8, repeating the steps of glass lens dispensing and glass lens construction: repeating the steps of glass lens dispensing and glass lens construction until the glass lens of the full layout of the motherboard is completed; S9, thermal baking: putting the mother board with the completed glass lens into the oven for thermal baking, and taking it out after baking to complete the entire optical glass reconstructed mother board preparation process.

2. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: The working mold comprises an upper mold and a lower mold, an upper template is installed under the upper mold, and a lower template is installed on the lower mold. A groove matching the glass substrate is provided on the lower template. A concave groove corresponding to the gasket and the shielding layer is provided on the bottom of the upper template corresponding to the outer edge of the lens cavity on the glass substrate. Glue injection holes are provided on the lower mold and the upper template, and the glue injection holes are connected to the glue injection grooves.

3. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: In step S1, the upper and lower surfaces are polished to: TTV≤1 um.

4. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: In step S2, the lens cavity is opened by laser etching.

5. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: In step S4, the process conditions of ultraviolet light combined with high temperature baking are: ultraviolet light UV365nm, 10 minutes of irradiation; baking at 120°C, 20 minutes.

6. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: In step S5, the cooling process conditions are: cooling at room temperature for 20 minutes.

7. The process for preparing the optical glass reconstituted mother plate according to claim 1, characterized in that: In step S9, the thermal baking process conditions are: baking at 85° C. for 120 minutes.

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