Parameter determination method and related equipment for equipment reliability accelerated test

Abstract

The present invention provides a parameter determination method and related equipment for an accelerated reliability test of a device, the parameter determination method comprising: obtaining water-cooling element information and a maximum design temperature of a water-cooling system of a target device, the target device comprising a plurality of water-cooling elements; controlling the operation of the target device; adjusting the water-cooling environment temperature to increase according to the maximum design temperature of the water-cooling system and a first temperature gradient until the target device fails, so as to determine the maximum water-cooling operating temperature of the target device; adjusting the water-cooling environment temperature to decrease according to the maximum water-cooling operating temperature and a second temperature gradient, until the water-cooling junction temperature of each water-cooling element is less than the first design junction temperature, so as to determine the first accelerated reliability test temperature of the water-cooling element. The parameter determination method can determine the accelerated test temperature of a target device including a water-cooling element in an accelerated reliability test, so as to reflect the accelerated characteristics of the water-cooling element in the accelerated reliability test, and improve the test efficiency and accuracy during reliability evaluation.

Description

Technical Field

[0001] The present invention relates to the technical field of reliability testing, and in particular to a parameter determination method for an equipment reliability acceleration experiment and related equipment. Background Art

[0002] In the automotive field, the reliability of vehicle controllers is an important indicator that needs to be considered in development and design. Among them, the main accelerating factor of vehicle controller failure is temperature. Therefore, most of the reliability acceleration experiments of vehicle controllers are currently designed based on temperature conditions to evaluate the reliability of vehicle controllers.

[0003] However, with the continuous improvement of the performance requirements for vehicle-mounted controllers, the heat generated by vehicle-mounted controllers in actual use is increasing. It is difficult to meet the use requirements of vehicle-mounted controllers by simply using air cooling, so water-cooled vehicle-mounted controllers or mixed cooling vehicle-mounted controllers that use both air cooling and water cooling have emerged. However, since the current standards do not propose specific methods for reliability acceleration tests for water-cooled or mixed cooling equipment, it is difficult to determine key experimental parameters such as experimental acceleration temperature during the design of related experiments, resulting in poor accuracy of the evaluation results when evaluating water-cooled or mixed cooling vehicle-mounted controllers. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To this end, a first aspect of the present invention provides a method for determining parameters of an accelerated device reliability test.

[0006] A second aspect of the present invention provides a device for determining parameters of an accelerated reliability test of equipment.

[0007] A third aspect of the present invention provides a storage medium.

[0008] A fourth aspect of the present invention provides an electronic device.

[0009] In view of this, according to a first aspect of an embodiment of the present application, a method for determining parameters of an accelerated device reliability experiment is proposed, comprising:

[0010] Acquire water cooling component information and a maximum design temperature of a water cooling system of a target device, where the target device includes multiple water cooling components;

[0011] Control the operation of the target device;

[0012] According to the designed maximum temperature of the water cooling system and the first temperature gradient, the water cooling environment temperature is adjusted to increase gradually until the target device fails, so as to determine the maximum water cooling operating temperature of the target device;

[0013] According to the maximum water-cooling operating temperature and the second temperature gradient, the water-cooling environment temperature is adjusted to decrease until the water-cooling junction temperature of each water-cooling element is lower than the first design junction temperature, so as to determine the first reliability accelerated test temperature of the water-cooling element.

[0014] In a feasible implementation, the step of controlling the water cooling environment temperature to increase gradually according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails to determine the maximum water cooling operating temperature of the target device includes:

[0015] Adjust the water cooling environment temperature to increase from the maximum temperature designed by the water cooling system according to the first temperature gradient;

[0016] Monitor the operating status of the target device;

[0017] In the case of a target device failure, determining the current water cooling environment temperature as a failure water cooling temperature of the target device;

[0018] The maximum water cooling operating temperature is determined according to the difference between the failure water cooling temperature and the first temperature gradient.

[0019] In a feasible implementation manner, according to the maximum water-cooling operating temperature and the second temperature gradient, the water-cooling environment temperature is adjusted to decrease gradually until the water-cooling junction temperature of each water-cooling element is less than the first design junction temperature, so as to determine the first reliability accelerated test temperature of the water-cooling element, including:

[0020] Adjust the water cooling environment temperature from the maximum water cooling working temperature to decrease according to the second temperature gradient;

[0021] Monitor the actual shell temperature of each water-cooling component;

[0022] Determine the water-cooling junction temperature of each water-cooling component based on the actual shell temperature;

[0023] When the water-cooling junction temperature of each water-cooling element is lower than the first design junction temperature, the water-cooling environment temperature corresponding to the current water-cooling junction temperature is determined as the first reliability accelerated test temperature.

[0024] In a feasible implementation manner, the method for determining parameters of the equipment reliability accelerated test further includes:

[0025] Acquire air cooling component information and a maximum design temperature of an air cooling system of a target device, wherein the target device further includes multiple air cooling components;

[0026] According to the maximum design temperature of the air cooling system and the third temperature gradient, the air cooling environment temperature is adjusted to increase gradually until the target device fails, so as to determine the maximum air cooling operating temperature of the target device;

[0027] According to the maximum air-cooling operating temperature and the fourth temperature gradient, the air-cooling environment temperature is adjusted to decrease until the air-cooling junction temperature of each air-cooling element is lower than the second design junction temperature, so as to determine the second reliability accelerated test temperature of the air-cooling element.

[0028] In a feasible implementation manner, the method for determining parameters of the equipment reliability accelerated test further includes:

[0029] Obtain the water-cooling reference shell temperature of each water-cooling component at the maximum design temperature of the water-cooling system;

[0030] Get the average operating environment temperature of the target device;

[0031] Obtain the air-cooled reference shell temperature of each air-cooled component under the average working environment temperature;

[0032] Determine the water cooling acceleration factor of the target device according to the water cooling reference shell temperature and the first reliability accelerated test temperature;

[0033] Determine the air cooling acceleration factor of the target device according to the air cooling reference shell temperature and the second reliability accelerated test temperature;

[0034] Determine the assembly acceleration factor of the target device based on the water cooling acceleration factor and the air cooling acceleration factor.

[0035] In a feasible implementation manner, the assembly acceleration factor is the minimum value of the water cooling acceleration factor and the air cooling acceleration factor.

[0036] In a feasible implementation manner, the method for determining parameters of the equipment reliability accelerated test further includes:

[0037] Obtain the design service life of the target equipment;

[0038] Determine the target working time of the target equipment according to the designed working life;

[0039] Determine the duration of the reliability acceleration test for the target equipment based on the target working time and the assembly acceleration factor.

[0040] According to a second aspect of an embodiment of the present application, a parameter determination device for an accelerated device reliability experiment is provided, comprising:

[0041] A first acquisition module is used to acquire water cooling component information and a maximum design temperature of a water cooling system of a target device, wherein the target device includes a plurality of water cooling components;

[0042] A first control module, used to control the operation of the target device;

[0043] A first determination module is used to adjust the water cooling environment temperature to increase according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails, so as to determine the maximum water cooling operating temperature of the target device;

[0044] The second determination module is used to adjust the water cooling environment temperature to decrease according to the maximum water cooling working temperature and the second temperature gradient until the water cooling junction temperature of each water cooling element is lower than the first design junction temperature, so as to determine the first reliability accelerated test temperature of the water cooling element.

[0045] According to a third aspect of an embodiment of the present application, a storage medium is proposed, the storage medium includes a stored program, wherein when the program is running, the device where the storage medium is located is controlled to execute a parameter determination method for a device reliability acceleration experiment such as any one of the above-mentioned first aspects.

[0046] According to the fourth aspect of an embodiment of the present application, an electronic device is proposed, which includes at least one processor and at least one memory connected to the processor, wherein the processor is used to call program instructions in the memory to execute a parameter determination method for an equipment reliability acceleration experiment as described in any one of the first aspects above.

[0047] Compared with the prior art, the present invention has at least the following beneficial effects: the parameter determination method for the device reliability accelerated experiment provided in the embodiment of the present application can determine the component information using water cooling and heat dissipation in the target device to be subjected to reliability evaluation by acquiring the water cooling component information and the maximum design temperature of the water cooling system of the target device, and determine the maximum temperature that the water cooling system of the target device can reach, so as to facilitate the subsequent targeted testing of the water cooling component and the observation of the operating status of the water cooling component based on the maximum design temperature of the water cooling system. At the same time, the operation of the target device can be controlled, and the water cooling environment temperature of the target device can be adjusted to increase gradually according to the maximum design temperature of the water cooling system and the first temperature gradient until the target device fails, and the maximum water cooling operating temperature of the target device is determined. Therefore, based on the maximum water-cooling operating temperature, the maximum temperature at which the water-cooling components of the target device can operate under water-cooling conditions can be understood, the operating temperature range of the water-cooling components can be clarified, and the water-cooling environment temperature can be adjusted to decrease according to the maximum water-cooling temperature and the second temperature gradient, until the water-cooling junction temperature of each water-cooling component is lower than the first design junction temperature, that is, the junction temperature of all water-cooling components of the target device meets the design requirements, so as to determine the first reliability accelerated test temperature of the water-cooling component, and then, according to the first reliability accelerated test temperature, the temperature condition setting for the subsequent reliability accelerated test of the target device can be guided, so as to more realistically reflect the acceleration characteristics of the water-cooling component in the reliability accelerated test, and improve the experimental efficiency and accuracy of the reliability evaluation of the target device. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the exemplary embodiments below. The accompanying drawings are only for the purpose of illustrating exemplary embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0049] Figure 1 A schematic flow chart of a method for determining parameters of an accelerated device reliability experiment according to an embodiment of the present application;

[0050] Figure 2 A schematic usage scenario diagram of a method for determining parameters of an accelerated device reliability experiment according to an embodiment of the present application;

[0051] Figure 3 A schematic structural block diagram of a parameter determination device for an accelerated device reliability experiment according to an embodiment of the present application;

[0052] Figure 4 A schematic structural block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0053] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present application and to fully convey the scope of the present application to those skilled in the art.

[0054] like Figure 1 As shown, according to the first aspect of the embodiment of the present application, a method for determining parameters of an accelerated device reliability experiment is proposed, comprising:

[0055] Step S101: obtaining water cooling component information of a target device and a maximum design temperature of a water cooling system, wherein the target device includes a plurality of water cooling components;

[0056] Specifically, by obtaining the configuration parameters of the target device, the information of the water-cooling components of the target device and the performance of the water-cooling system can be determined, thereby achieving the acquisition of the water-cooling component information and the maximum design temperature of the water-cooling system, so that the water-cooling components can be tested in a targeted manner and the operating status of the water-cooling components can be observed based on the maximum design temperature of the water-cooling system.

[0057] It can be understood that the heat dissipation method of the target device can be water cooling or a mixed cooling of water cooling and air cooling, so that at least some components in the target device are cooled by water cooling during operation. Accordingly, such components can be classified as water-cooled components of the target device, so that it can be determined which components in the target device are water-cooled components based on the water-cooled component information; at the same time, the aforementioned water cooling system is also a cooling system for water-cooling the water-cooled components.

[0058] Step S102: Control the target device to run;

[0059] Specifically, a test platform can be built for the target device to provide a controllable operating environment for the target device using the test platform, thereby controlling the operation of the target device so as to observe the operating status of the target device during the operation of the target device.

[0060] For example, Figure 2 As shown, Figure 2 A test platform is schematically shown in the figure. The parameter determination method provided in the embodiment of the present application can be applied to the test platform. The test platform includes a high and low temperature box, a coolant control box and an experimental host computer, wherein a accommodating space is formed in the high and low temperature box, the high and low temperature box includes an air temperature controller arranged in the accommodating space, and the air temperature controller is used to adjust the air temperature in the accommodating space. The coolant control box includes a water temperature controller, a flow rate controller and an infusion pipeline. The target device can be placed in the accommodating space. One end of the infusion pipeline is connected to the water inlet of the internal water cooling plate of the target device, and the other end is connected to the water outlet of the aforementioned internal water cooling plate. The flow rate controller and the water temperature controller are both arranged For the infusion pipeline, the flow rate controller is used to adjust the flow rate of the coolant in the infusion pipeline, and the water temperature controller is used to adjust the temperature of the coolant in the infusion pipeline. The infusion pipeline can be filled with coolant, and the coolant can be liquid water, so that the coolant control box can be used to provide a water-cooled environment for the target equipment, and the high and low temperature box can be used to provide an air-cooled environment for the target equipment. The high and low temperature box and the coolant control box are both connected to the experimental host computer. The experimental host computer can control the high and low temperature box to adjust the air temperature in the accommodating space to achieve the regulation of the air-cooled environment temperature, and can control the coolant control box to adjust the temperature of the coolant in the infusion pipe through the water temperature controller to achieve the regulation of the water-cooled environment temperature.

[0061] It is understandable that the water cooling element of the target device is arranged on the internal water cooling plate to obtain water cooling heat dissipation when the coolant flows in the internal water cooling plate; if the target device includes an air cooling element, the air cooling element can be air cooled by adjusting the air temperature in the accommodating space.

[0062] It should be noted that Figure 2The solid line with an arrow in the middle represents the infusion pipeline and the flow direction of the coolant in the infusion pipeline; the dotted line with an arrow represents the connection relationship between the high and low temperature box, the coolant control box and the experimental host computer.

[0063] Step S103: adjusting the water cooling environment temperature to increase gradually according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails, so as to determine the maximum water cooling operating temperature of the target device;

[0064] Specifically, after controlling the operation of the target device, the water-cooling environment temperature of the target device can be adjusted to increase according to the maximum temperature and the first temperature gradient of the water cooling system design until the target device fails. It can be understood that the aforementioned target device failure refers to the failure of the target device caused by the destruction of the working conditions. After restoring the working conditions of the target device, the target device can resume operation. It is not difficult to understand that the aforementioned working conditions, namely the water-cooling environment temperature, are controlled to increase, so that after the water-cooling environment temperature increases to a certain extent, at least part of the water-cooling components of the target device will lose the temperature conditions required for work, and then fail or malfunction, causing the target device to fail. In this process, the maximum water-cooling operating temperature of the target device can be determined by recording the water-cooling environment temperature. The maximum water-cooling operating temperature is also the maximum water-cooling environment temperature corresponding to the target device to maintain the operating state. Therefore, the operating temperature range of the water-cooling components of the target device under water-cooling heat dissipation conditions can be clarified based on the maximum water-cooling operating temperature.

[0065] It is understandable that the aforementioned water cooling environment can be established and the water cooling environment temperature can be adjusted by constructing the aforementioned test platform or other test equipment so that the water cooling environment temperature can be higher than the maximum design temperature of the water cooling system of the target device.

[0066] Step S104: According to the maximum water-cooling operating temperature and the second temperature gradient, the water-cooling environment temperature is adjusted to decrease until the water-cooling junction temperature of each water-cooling element is lower than the first design junction temperature, so as to determine the first reliability accelerated test temperature of the water-cooling element.

[0067] Specifically, when the maximum water-cooling operating temperature is determined, the water-cooling ambient temperature can be further adjusted to decrease according to the maximum water-cooling operating temperature and the second temperature gradient until the water-cooling junction temperature of each water-cooling element is less than the first design junction temperature, that is, the actual junction temperature of all water-cooling elements of the target device meets the junction temperature design requirements. It should be noted that the water-cooling junction temperature is the actual junction temperature of the water-cooling element corresponding to the water-cooling ambient temperature. During the decrease of the water-cooling ambient temperature, the water-cooling junction temperature of each water-cooling element will decrease accordingly and be lower than the corresponding first design junction temperature one by one. Therefore, in this process, by recording the water-cooling ambient temperature, it can be understood that the water-cooling junction temperature of each water-cooling element is less than the corresponding water-cooling ambient temperature when the first design junction temperature is reached. Therefore, the first reliability accelerated test temperature of the water-cooling element can be determined, and then the temperature condition setting for the subsequent reliability accelerated test of the target device can be guided according to the first reliability accelerated test temperature, so that the acceleration characteristics of the water-cooling element can be more realistically reflected in the reliability accelerated test, thereby improving the experimental efficiency and accuracy of the reliability assessment of the target device.

[0068] It can be understood that in the subsequent reliability accelerated test of the target device, when the water-cooled junction temperature of each water-cooled component is lower than the first design junction temperature, each water-cooled component can exert its full performance as much as possible to meet the requirements of the reliability accelerated test, and the higher the first reliability accelerated test temperature, the faster the life of the water-cooled component can be consumed, thereby accelerating the experimental process and improving the experimental efficiency.

[0069] In summary, the parameter determination method for the equipment reliability acceleration experiment provided in the embodiment of the present application can determine the component information using water cooling heat dissipation in the target device to be evaluated for reliability by obtaining the water-cooling component information and the maximum design temperature of the water cooling system of the target device, and determine the maximum temperature that the water cooling system of the target device can reach, so that the water cooling components can be tested and the operating status of the water cooling components can be observed based on the maximum design temperature of the water cooling system. At the same time, the operation of the target device can be controlled, and the water cooling environment temperature of the target device can be adjusted to increase according to the maximum design temperature of the water cooling system and the first temperature gradient until the target device fails, and the maximum water cooling operating temperature of the target device can be determined, so that the maximum water cooling operating temperature can be determined based on the maximum water cooling operating temperature. The operating temperature is determined by the maximum operating temperature of the water-cooling components of the target device under water-cooling conditions, the operating temperature range of the water-cooling components is clarified, and the water-cooling environment temperature is adjusted to decrease according to the maximum water-cooling temperature and the second temperature gradient, until the water-cooling junction temperature of each water-cooling component is less than the first design junction temperature, that is, the actual junction temperature of all water-cooling components of the target device meets the junction temperature design requirements, and the first reliability accelerated test temperature of the water-cooling component is determined. Then, according to the first reliability accelerated test temperature, the temperature condition setting for the subsequent reliability accelerated test of the target device is guided, so that the acceleration characteristics of the water-cooling components can be more realistically reflected in the reliability accelerated test, and the experimental efficiency and accuracy of the reliability evaluation of the target device are improved.

[0070] It is understandable that the aforementioned target device may be a water-cooled vehicle-mounted controller or the aforementioned hybrid-cooled vehicle-mounted controller.

[0071] In some examples, the step of controlling the water cooling environment temperature to increase gradually according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails to determine the maximum water cooling operating temperature of the target device includes:

[0072] Adjust the water cooling environment temperature to increase from the maximum temperature designed by the water cooling system according to the first temperature gradient;

[0073] Monitor the operating status of the target device;

[0074] In the case of a target device failure, determining the current water cooling environment temperature as a failure water cooling temperature of the target device;

[0075] The maximum water cooling operating temperature is determined according to the difference between the failure water cooling temperature and the first temperature gradient.

[0076] Specifically, in the process of controlling the water-cooling environment temperature to increase according to the designed maximum temperature of the water-cooling system and the first temperature gradient until the target device fails to determine the maximum water-cooling operating temperature of the target device, the water-cooling environment temperature can be adjusted from the designed maximum temperature of the water-cooling system to increase according to the first temperature gradient, and the operating status of the target device is monitored to determine whether the target device is working while maintaining functional requirements. After the water-cooling environment temperature continues to increase to a certain level, it will exceed the operating temperature condition of the target device to cause the target device to fail. Therefore, in the event of failure of the target device, the corresponding current water-cooling environment temperature is determined as the failure water-cooling temperature of the target device, and the maximum water-cooling operating temperature is further determined based on the difference between the failure water-cooling temperature and the first temperature gradient, so as to facilitate the use of the maximum water-cooling operating temperature to provide a reference for determining the first reliability accelerated test temperature.

[0077] It can be understood that in the process of adjusting the water-cooling environment temperature according to the first temperature gradient, the water-cooling environment temperature will increase in stages. Therefore, in the process of increasing in stages, it is difficult to judge whether the target device will fail in the next temperature stage based on the current temperature stage. Therefore, when the water-cooling environment temperature increases to the point where the target device fails, the further increase of the water-cooling environment temperature can be stopped to determine the failure water-cooling temperature of the target device, and then the maximum water-cooling operating temperature is determined based on the failure water-cooling temperature and the first temperature gradient. Then, the determination accuracy of the maximum water-cooling operating temperature is related to the first temperature gradient. Exemplarily, the first temperature gradient can be greater than 1°C / min and less than or equal to 10°C / min, and the second temperature gradient can be selected according to the accuracy requirements of the reliability accelerated experiment. When the accuracy requirements of the reliability accelerated experiment are high, a smaller first temperature gradient value can be selected to determine a more accurate maximum water-cooling operating temperature. Accordingly, when the accuracy requirements of the reliability accelerated experiment are low, a larger first temperature gradient value can be selected when the allowable error limit of the maximum water-cooling operating temperature is high.

[0078] In some feasible examples, the first temperature gradient may be 5° C. / min.

[0079] In some examples, the step of adjusting the water cooling environment temperature to decrease gradually according to the maximum water cooling operating temperature and the second temperature gradient until the water cooling junction temperature of each water cooling element is less than the first design junction temperature to determine the first reliability accelerated test temperature of the water cooling element includes:

[0080] Adjust the water cooling environment temperature from the maximum water cooling working temperature to decrease according to the second temperature gradient;

[0081] Monitor the actual shell temperature of each water-cooling component;

[0082] Determine the water-cooling junction temperature of each water-cooling component based on the actual shell temperature;

[0083] When the water-cooling junction temperature of each water-cooling element is lower than the first design junction temperature, the water-cooling environment temperature corresponding to the current water-cooling junction temperature is determined as the first reliability accelerated test temperature.

[0084] Specifically, in the process of adjusting the water-cooling environment temperature to decrease according to the maximum water-cooling operating temperature and the second temperature gradient until the water-cooling junction temperature of each water-cooling component is less than the first design junction temperature to determine the first reliability accelerated test temperature of the water-cooling component, the water-cooling environment temperature can be adjusted from the maximum water-cooling operating temperature of the target device to decrease according to the second temperature gradient, and the actual shell temperature of each water-cooling component is monitored, so as to determine the water-cooling junction temperature of each corresponding water-cooling component according to the actual shell temperature of each water-cooling component, and then in the process of decreasing the water-cooling environment temperature, when the water-cooling junction temperature of each water-cooling component is less than the first design junction temperature, the water-cooling environment temperature corresponding to each water-cooling component at the current water-cooling junction temperature is determined to be the first reliability accelerated test temperature, so that the first reliability accelerated test temperature is relatively large under the condition that the water-cooling junction temperature of each water-cooling component is less than the first design junction temperature, so that in the subsequent process of conducting reliability accelerated tests on the target device, the life consumption of the target device can be accelerated, and the experimental efficiency of the reliability accelerated test can be improved.

[0085] It can be understood that in the process of adjusting the water-cooled environment temperature according to the second temperature gradient, the water-cooled environment temperature will decrease in stages. Therefore, in the process of the staged decrease, it is difficult to judge whether the water-cooled junction temperature of each water-cooled element will meet the condition of being less than the first design junction temperature in the next temperature stage based on the current temperature stage. Therefore, when the water-cooled environment temperature decreases to the point where the water-cooled junction temperature of each water-cooled element is less than the first design junction temperature, the further decrease of the water-cooled environment temperature can be stopped to determine the first reliability accelerated test temperature. By way of example, the second temperature gradient can be greater than 1°C / min and less than or equal to 10°C / min.

[0086] In some possible examples, the second temperature gradient is equal to 5° C. / min.

[0087] In some examples, the method for determining parameters of the device reliability acceleration test further includes:

[0088] Acquire air cooling component information and a maximum design temperature of an air cooling system of a target device, wherein the target device further includes multiple air cooling components;

[0089] According to the maximum design temperature of the air cooling system and the third temperature gradient, the air cooling environment temperature is adjusted to increase gradually until the target device fails, so as to determine the maximum air cooling operating temperature of the target device;

[0090] According to the maximum air-cooling operating temperature and the fourth temperature gradient, the air-cooling environment temperature is adjusted to decrease until the air-cooling junction temperature of each air-cooling element is lower than the second design junction temperature, so as to determine the second reliability accelerated test temperature of the air-cooling element.

[0091] Specifically, when the heat dissipation method of the target device is the aforementioned mixed heat dissipation, the target device includes a plurality of air-cooling elements, and accordingly, the target device includes an air-cooling system for air-cooling the aforementioned air-cooling elements. Furthermore, correspondingly, the information of the air-cooling elements of the target device and the performance of the air-cooling system can be determined by acquiring the configuration parameters of the target device, thereby achieving the acquisition of the air-cooling element information and the maximum design temperature of the air-cooling system, so as to facilitate the subsequent targeted testing of the air-cooling elements and observation of the operating status of the air-cooling elements based on the maximum design temperature of the air-cooling system, and further, when the device is running, the air-cooling ambient temperature of the target device is adjusted to increase according to the maximum design temperature of the air-cooling system and the third temperature gradient until the target device fails, and the maximum air-cooling operating temperature of the target device is determined, so that the maximum air-cooling operating temperature can be determined based on the maximum design temperature of the air-cooling system. The maximum temperature at which the air-cooling components of the target device can operate under air-cooling conditions is understood, the operating temperature range of the air-cooling components is clarified, and the air-cooling environment temperature is adjusted to decrease according to the maximum air-cooling temperature and the fourth temperature gradient, until the air-cooling junction temperature of each air-cooling component is lower than the second design junction temperature, that is, the actual junction temperature of all air-cooling components of the target device meets the junction temperature design requirements, and the second reliability accelerated test temperature of the air-cooling components is determined, and then the second reliability accelerated test temperature can be combined with the first reliability accelerated test temperature to provide a reference for the subsequent temperature condition setting for the reliability accelerated test of the target device.

[0092] In some feasible examples, the aforementioned step of adjusting the air-cooling environment temperature to increase gradually according to the air-cooling system design maximum temperature and the third temperature gradient until the target device fails to determine the maximum air-cooling operating temperature of the target device may include:

[0093] Adjust the air cooling environment temperature to increase from the maximum temperature designed by the air cooling system according to the third temperature gradient;

[0094] Monitor the operating status of the target device;

[0095] In the case of a target device failure, determining the current air cooling environment temperature as a failure air cooling temperature of the target device;

[0096] The maximum air-cooling operating temperature is determined according to the difference between the failure air-cooling temperature and the third temperature gradient.

[0097] In some feasible examples, the aforementioned step of adjusting the air-cooling ambient temperature to decrease according to the maximum air-cooling operating temperature and the fourth temperature gradient until the air-cooling junction temperature of each air-cooling element is less than the second design junction temperature to determine the second reliability accelerated test temperature of the air-cooling element may include:

[0098] Adjust the air cooling environment temperature from the maximum air cooling working temperature to decrease according to the fourth temperature gradient;

[0099] Monitor the actual shell temperature of each air-cooled component;

[0100] Determine the air-cooled junction temperature of each air-cooled component based on the actual shell temperature;

[0101] When the air-cooled junction temperature of each air-cooled component is lower than the second design junction temperature, the air-cooled ambient temperature corresponding to the current air-cooled junction temperature is determined as the second reliability accelerated test temperature.

[0102] Exemplarily, the third temperature gradient may be greater than 1° C. / min and less than or equal to 10° C. / min; and the fourth temperature gradient may be greater than 1° C. / min and less than or equal to 10° C. / min.

[0103] In some feasible examples, the third temperature gradient may be equal to 5° C. / min; and the fourth temperature gradient may be equal to 5° C. / min.

[0104] In some examples, the method for determining parameters of the device reliability acceleration test further includes:

[0105] Obtain the water-cooling reference shell temperature of each water-cooling component at the maximum design temperature of the water-cooling system;

[0106] Get the average operating environment temperature of the target device;

[0107] Obtain the air-cooled reference shell temperature of each air-cooled component under the average working environment temperature;

[0108] Determine the water cooling acceleration factor of the target device according to the water cooling reference shell temperature and the first reliability accelerated test temperature;

[0109] Determine the air cooling acceleration factor of the target device according to the air cooling reference shell temperature and the second reliability accelerated test temperature;

[0110] Determine the assembly acceleration factor of the target device based on the water cooling acceleration factor and the air cooling acceleration factor.

[0111] Specifically, for the target device with mixed heat dissipation, since the air-cooled components and the water-cooled components need to be cooled at the same time when the target device is running, the influence of the air-cooled environment and the water-cooled environment needs to be comprehensively considered in the subsequent reliability acceleration test, so that the acceleration factor of the reliability acceleration test needs to be able to simultaneously reflect the characteristics of air-cooled heat dissipation and water-cooled heat dissipation, so that the operation of the target device in the reliability acceleration test can be closer to the condition under mixed heat dissipation in actual use, and then the water-cooled reference shell temperature of each water-cooled component at the maximum design temperature of the water-cooled system can be obtained. The water-cooled reference shell temperature is also the actual shell temperature of the water-cooled component at the maximum design temperature of the water-cooled system. According to the water-cooled reference shell temperature and the first reliability acceleration test temperature, the water-cooled acceleration factor of the target device is determined, that is, the acceleration factor of the target device under water-cooled heat dissipation conditions in the reliability acceleration test. The water-cooled acceleration factor can be determined based on the Arrhenius formula. For example, the determination formula of the water-cooled acceleration factor is shown in formula (1):

[0112] AFW=min[Exp(Ea / k).(1 / Tcmoyw i –1 / Tendw)] (1)

[0113] In formula (1), AFW is the water cooling acceleration factor; Ea is the activation energy; k is the Boltzmann constant; Tcmoyw i is the water-cooling reference shell temperature; Tendw is the first reliability accelerated test temperature; i is a natural number greater than or equal to 1 and less than or equal to n, and n is the number of water-cooling components.

[0114] It should be noted that, since there are multiple water-cooling elements, combined with formula (1), the number of water-cooling elements can be n, and accordingly, there are also n water-cooling reference shell temperatures. In formula (1), [Exp(Ea / k).(1 / Tcmoyw i –1 / Tendw)] can represent the water-cooling reference shell temperature of the i-th water-cooling element, so that the minimum value is selected from the water-cooling reference shell temperatures of multiple water-cooling elements as the water-cooling acceleration factor of the target device, which can avoid excessively shortening the experiment time in the subsequent reliability acceleration experiment and improve the accuracy of the reliability acceleration experiment results.

[0115] Based on formula (1), it is not difficult to understand that in the process of determining the water cooling acceleration factor, the water cooling reference shell temperature Tcmoyw iAs the absolute temperature of the water-cooling component under normal conditions, that is, the maximum design temperature of the water-cooling system is regarded as the normal condition, so that the water-cooling acceleration factor can more fully reflect the relatively severe water-cooling environment of the target equipment during actual operation, and then based on the aforementioned determination method of the water-cooling acceleration factor, the subsequent reliability acceleration test can cover the severe working conditions of the target equipment. In the absence of standardized standards for the reliability evaluation of water-cooling components, the credibility of the evaluation results of water-cooling components in the reliability acceleration test is improved.

[0116] At the same time, the average working environment temperature of the target device can be obtained. It can be understood that the average working environment temperature refers to the average temperature of the environment in which the target device is located during actual operation, and the air-cooled reference shell temperature of each air-cooled component at the average working environment temperature is obtained. The air-cooled reference shell temperature is also the actual shell temperature of the air-cooled component at the maximum design temperature of the air-cooled system. Then, according to the air-cooled reference shell temperature and the second reliability accelerated test temperature, the air-cooled acceleration factor of the target device is determined, that is, the acceleration factor of the target device under air-cooled heat dissipation conditions in the reliability accelerated test. The air-cooled acceleration factor can be determined based on the Arrhenius formula. For example, the formula for determining the air-cooled acceleration factor is shown in formula (2):

[0117] AFA=min[Exp(Ea / k).(1 / Tcmoy j –1 / Tend)] (1)

[0118] In formula (2), AFA is the air cooling acceleration factor; Tcmoy i is the air-cooled reference shell temperature; Tend is the second reliability accelerated test temperature; j is a natural number greater than or equal to 1 and less than or equal to m, and m is the number of air-cooled components.

[0119] It should be noted that, since there are multiple air-cooling elements, combined with formula (2), the number of air-cooling elements can be m, and accordingly, there are m air-cooling reference shell temperatures. In formula (1), [Exp(Ea / k).(1 / Tcmoy j –1 / Tend)] can represent the air-cooling reference shell temperature of the jth air-cooling component, so that the minimum value is selected from the air-cooling reference shell temperatures of multiple air-cooling components as the air-cooling acceleration factor of the target device, which can avoid excessively shortening the experiment time in the subsequent reliability acceleration experiment and improve the accuracy of the reliability acceleration experiment results.

[0120] Based on formula (2), it is not difficult to understand that in the process of determining the air cooling acceleration factor, the air cooling reference shell temperature Tcmoy jAs the absolute temperature of the air-cooled component under normal conditions, that is, the average working environment temperature is regarded as the normal condition, so that the air-cooling acceleration factor can more fully reflect the relatively normal environmental conditions of the target equipment, and then based on the above-mentioned determination method of the air-cooling acceleration factor, the subsequent reliability acceleration test can be more objective and true, and the accuracy of the evaluation results of the reliability acceleration test can be improved.

[0121] Furthermore, the assembly acceleration factor of the target device can be determined based on the water cooling acceleration factor and the air cooling acceleration factor, so that the assembly acceleration factor can reflect the characteristics of air cooling and water cooling at the same time, which is convenient for comprehensively considering the influence of air cooling environment and water cooling environment in subsequent reliability acceleration experiments, and is conducive to improving the accuracy of reliability evaluation results.

[0122] It can be understood that the assembly acceleration factor is also the acceleration factor of the target device under the aforementioned mixed heat dissipation conditions in the reliability acceleration experiment.

[0123] It should be noted that the actual historical operating environment data of the target device can be statistically analyzed to determine the aforementioned average operating environment temperature of the target device, or the actual historical operating environment data of devices of the same type as the target device can be statistically analyzed to use the average operating environment temperature of the aforementioned devices of the same type to approximately characterize the average operating environment temperature of the target device.

[0124] In some examples, the assembly acceleration factor is the minimum value of the water cooling acceleration factor and the air cooling acceleration factor.

[0125] Specifically, the minimum value of the water cooling acceleration factor and the air cooling acceleration factor can be used as the aforementioned assembly acceleration factor, thereby avoiding excessive shortening of the experiment duration when the experiment duration of the reliability acceleration experiment is subsequently determined based on the assembly acceleration factor, thereby ensuring the accuracy of the evaluation results of the reliability acceleration experiment.

[0126] Exemplarily, the assembly acceleration factor can be determined according to formula (3):

[0127] AF=min(AFA,AFW) (3)

[0128] In formula (3), AF is the assembly acceleration factor.

[0129] In some examples, the method for determining parameters of the device reliability acceleration test further includes:

[0130] Obtain the design service life of the target equipment;

[0131] Determine the target working time of the target equipment according to the designed working life;

[0132] Determine the duration of the reliability acceleration test for the target equipment based on the target working time and the assembly acceleration factor.

[0133] Specifically, the design service life of the target equipment can be obtained according to the design requirements or design parameters of the target equipment, that is, the service life that the target equipment is expected to achieve during the design phase. Then, based on the design service life, the target working time of the target equipment can be determined. The target working time of the target equipment can be determined by referring to relevant standards based on the specific type of the target equipment.

[0134] For example, according to the electronic equipment reliability prediction model and relevant provisions of the data manual, the target working time of the target device can be determined according to formula (4):

[0135] D=a*D d (4)

[0136] In formula (4), D is the target working time; a is the annual working time of the target equipment, usually 508 hours / year; D d Design working life.

[0137] Furthermore, when the target working time of the target device is determined, the reliability acceleration test duration of the target device can be determined according to the assembly acceleration factor and the target working time, and then the experimental duration of the subsequent reliability acceleration test can be set according to the reliability acceleration test duration. Therefore, combined with the aforementioned method of determining the accelerated test temperature and the acceleration factor, the relevant parameters of the reliability acceleration test for the target device with hybrid heat dissipation can be set, which is convenient for improving the experimental efficiency of the reliability acceleration test of the target device and the accuracy of the reliability evaluation results.

[0138] like Figure 3 As shown, according to the second aspect of the embodiment of the present application, a parameter determination device 300 for an equipment reliability acceleration experiment is proposed, comprising:

[0139] A first acquisition module 301 is used to acquire water cooling component information and a maximum design temperature of a water cooling system of a target device, wherein the target device includes a plurality of water cooling components;

[0140] A first control module 302, used to control the operation of the target device;

[0141] A first determination module 303 is used to adjust the water cooling environment temperature to increase according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails, so as to determine the maximum water cooling working temperature of the target device;

[0142] The second determination module 304 is used to adjust the water cooling environment temperature to decrease according to the maximum water cooling working temperature and the second temperature gradient until the water cooling junction temperature of each water cooling element is lower than the first design junction temperature, so as to determine the first reliability accelerated test temperature of the water cooling element.

[0143] The parameter determination device of the equipment reliability acceleration experiment provided in the embodiment of the present application can determine the component information of the target equipment that uses water cooling to dissipate heat, and determine the maximum temperature that the water cooling system of the target equipment can reach, by acquiring the water cooling component information of the target equipment and the maximum design temperature of the water cooling system. This is to facilitate the subsequent targeted testing of the water cooling components and the observation of the operating status of the water cooling components based on the maximum design temperature of the water cooling system. At the same time, the operation of the target equipment can be controlled, and the water cooling environment temperature of the target equipment can be adjusted to increase according to the maximum design temperature of the water cooling system and the first temperature gradient until the target equipment fails. The maximum water cooling operating temperature of the target equipment is determined, so that the maximum water cooling operating temperature can be determined based on the maximum water cooling operating temperature. Temperature, understand the maximum temperature at which the water-cooling components of the target device can operate under water-cooling conditions, clarify the operating temperature range of the water-cooling components, and adjust the water-cooling environment temperature to decrease according to the maximum water-cooling temperature and the second temperature gradient, until the water-cooling junction temperature of each water-cooling component is less than the first design junction temperature, that is, the actual junction temperature of all water-cooling components of the target device meets the junction temperature design requirements, and the first reliability accelerated test temperature of the water-cooling component is determined, and then the first reliability accelerated test temperature can be used to guide the subsequent temperature condition setting for the reliability accelerated test of the target device, so that the acceleration characteristics of the water-cooling components can be more realistically reflected in the reliability accelerated test, thereby improving the experimental efficiency and accuracy of the reliability evaluation of the target device.

[0144] In some feasible examples, the first determining module 303 includes:

[0145] A first adjustment unit is used to adjust the water cooling environment temperature from the maximum temperature designed by the water cooling system to increase according to a first temperature gradient;

[0146] A first monitoring unit, used to monitor the operating status of the target device;

[0147] A first determining unit, configured to determine, when a target device fails, a current water cooling environment temperature as a failure water cooling temperature of the target device;

[0148] The second determining unit is used to determine the maximum water cooling working temperature according to the difference between the failure water cooling temperature and the first temperature gradient.

[0149] In some feasible examples, the second determination module 304 includes:

[0150] The second adjustment unit is used to adjust the water cooling environment temperature from the maximum water cooling working temperature to a second temperature gradient;

[0151] The second monitoring unit is used to monitor the actual shell temperature of each water-cooling element;

[0152] A third determining unit, used to determine the water-cooling junction temperature of each water-cooling element according to the actual shell temperature;

[0153] The fourth determining unit is used to determine that the water-cooling environment temperature corresponding to the current water-cooling junction temperature is the first reliability accelerated test temperature when the water-cooling junction temperature of each water-cooling element is lower than the first design junction temperature.

[0154] In some feasible examples, the device 300 for determining parameters of the equipment reliability accelerated test further includes:

[0155] A second acquisition module is used to acquire air cooling component information and a maximum design temperature of the air cooling system of a target device, wherein the target device further includes a plurality of air cooling components;

[0156] A third determination module is used to adjust the air cooling environment temperature to increase according to the maximum temperature designed for the air cooling system and the third temperature gradient until the target device fails, so as to determine the maximum air cooling operating temperature of the target device;

[0157] The fourth determination module is used to adjust the air-cooling environment temperature to decrease according to the maximum air-cooling operating temperature and the fourth temperature gradient until the air-cooling junction temperature of each air-cooling element is lower than the second design junction temperature, so as to determine the second reliability accelerated test temperature of the air-cooling element.

[0158] In some feasible examples, the third determination module includes:

[0159] A third adjustment unit is used to adjust the air cooling environment temperature from the maximum temperature designed by the air cooling system to increase according to a third temperature gradient;

[0160] A third monitoring unit, used to monitor the operating status of the target device;

[0161] A fifth determining unit, configured to determine, when the target device fails, the current air cooling environment temperature as the failure air cooling temperature of the target device;

[0162] The sixth determination unit is used to determine the maximum air-cooling operating temperature according to the difference between the failure air-cooling temperature and the third temperature gradient.

[0163] In some feasible examples, the fourth determination module includes:

[0164] A fourth adjustment unit, used for adjusting the air-cooling environment temperature to decrease from the maximum air-cooling working temperature according to a fourth temperature gradient;

[0165] The fourth monitoring unit is used to monitor the actual shell temperature of each air-cooled component;

[0166] a seventh determination unit, for determining the air-cooled junction temperature of each air-cooled element according to the actual shell temperature;

[0167] The eighth determination unit is used to determine the air-cooling environment temperature corresponding to the current air-cooling junction temperature as the second reliability accelerated test temperature when the air-cooling junction temperature of each air-cooling element is lower than the second design junction temperature.

[0168] In some feasible examples, the device 300 for determining parameters of the equipment reliability accelerated test further includes:

[0169] The third acquisition module is used to obtain the water-cooling reference shell temperature of each water-cooling component at the maximum design temperature of the water-cooling system;

[0170] A fourth acquisition module is used to acquire the average working environment temperature of the target device;

[0171] A fifth acquisition module, used to acquire the air-cooled reference shell temperature of each air-cooled component under the average working environment temperature;

[0172] A fifth determination module is used to determine a water cooling acceleration factor of a target device according to a water cooling reference shell temperature and a first reliability acceleration test temperature;

[0173] A sixth determination module, used to determine an air cooling acceleration factor of a target device according to an air cooling reference shell temperature and a second reliability acceleration test temperature;

[0174] The seventh determination module is used to determine the assembly acceleration factor of the target device according to the water cooling acceleration factor and the air cooling acceleration factor.

[0175] In some feasible examples, the assembly acceleration factor is the minimum value of the water cooling acceleration factor and the air cooling acceleration factor.

[0176] In some feasible examples, the device 300 for determining parameters of the equipment reliability accelerated test further includes:

[0177] The sixth acquisition module is used to obtain the design working life of the target device;

[0178] An eighth determination module is used to determine the target working time of the target equipment according to the designed working life;

[0179] The ninth determination module is used to determine the duration of the reliability acceleration test of the target equipment according to the target working time and the assembly acceleration factor.

[0180] According to a third aspect of an embodiment of the present application, a storage medium is proposed, the storage medium includes a stored program, wherein when the program is running, the device where the storage medium is located is controlled to execute a parameter determination method for a device reliability acceleration experiment such as any one of the above-mentioned first aspects.

[0181] like Figure 4As shown, according to the fourth aspect of an embodiment of the present application, an electronic device 400 is proposed, and the electronic device 400 includes at least one processor 401 and at least one memory 402 connected to the processor 401, wherein the processor 401 is used to call program instructions in the memory 402 to execute a parameter determination method for an equipment reliability acceleration experiment as described in any one of the first aspects above.

[0182] It should be noted that Figure 2 The experimental host computer shown in the figure may include the electronic device 400 proposed in the fourth aspect of the embodiment of the present application.

[0183] The present application is described with reference to the flowcharts and / or block diagrams of the methods, apparatuses, and electronic devices according to the embodiments of the present application; it should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions; these computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable process management device to generate a machine, so that the instructions executed by the processor of the computer or other programmable process management device generate instructions for implementing the process in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0184] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0185] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the above-mentioned units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.

[0186] In a typical configuration, an electronic device may include one or more processors (CPU), a memory, and a bus; the electronic device may also include an input / output interface, a network interface, and the like.

[0187] The memory may include non-permanent memory in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM, and the memory includes at least one memory chip; the memory is an example of a storage medium.

[0188] Storage media includes permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information; information can be computer-readable instructions, data structures, program modules or other data; examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device; as defined in this article, storage media does not include temporary computer-readable media (transitory media), such as modulated data signals and carrier waves.

[0189] The terms "first", "second", "third", "fourth", etc. (if any) in the description, claims and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence; it should be understood that the data used in this way can be interchangeable under appropriate circumstances so that the embodiments described herein can be implemented in an order other than that illustrated or described herein.

[0190] It should be noted that, for the above-mentioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the order of the actions described, because according to the present application, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.

[0191] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, product or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, product or apparatus; in the absence of further restrictions, the elements defined by the sentence "comprises one..." does not exclude the presence of other identical elements in the process, method, product or apparatus that includes the elements.

[0192] Those skilled in the art should understand that the embodiments of the present application may be provided as methods, devices or electronic devices; therefore, the present application may take the form of a complete hardware embodiment, a complete software embodiment or an embodiment combining software and hardware aspects; moreover, the present application may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0193] Computer program codes for performing operations of the embodiments of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Common Lisp, Python, C++, Objective-C, Smalltalk, Delphi, Java, Swift, C#, Perl, Ruby, JavaScript, and PHP, conventional procedural programming languages, such as Fortran, ALGOL, COBOL, PL / I, BASIC, Pascal, and C, and any other programming languages, such as Lisp, Tcl, Prolog, Visual Basic.NET, SQL, and R; the program codes may be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server; in the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (for example, via the Internet using an Internet service provider).

[0194] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A method for determining parameters of an accelerated equipment reliability test, characterized in that: include: Acquire water cooling element information and a maximum design temperature of a water cooling system of a target device, wherein the target device includes a plurality of water cooling elements; Controlling the target device to run; According to the designed maximum temperature of the water cooling system and the first temperature gradient, adjusting the water cooling environment temperature to increase until the target device fails, so as to determine the maximum water cooling operating temperature of the target device; According to the maximum water-cooling operating temperature and the second temperature gradient, the water-cooling environment temperature is adjusted to decrease gradually until the water-cooling junction temperature of each of the water-cooling elements is lower than the first design junction temperature, so as to determine a first reliability accelerated test temperature of the water-cooling element; Acquire air cooling component information and a maximum design temperature of an air cooling system of the target device, wherein the target device further comprises a plurality of air cooling components; According to the designed maximum temperature of the air cooling system and the third temperature gradient, adjusting the air cooling environment temperature to increase until the target device fails, so as to determine the maximum air cooling operating temperature of the target device; According to the maximum air-cooling operating temperature and the fourth temperature gradient, the air-cooling environment temperature is adjusted to decrease gradually until the air-cooling junction temperature of each of the air-cooling elements is less than the second design junction temperature, so as to determine the second reliability accelerated test temperature of the air-cooling element; Obtaining the water-cooling reference shell temperature of each of the water-cooling elements at the maximum design temperature of the water-cooling system; Obtaining the average operating environment temperature of the target device; Obtaining an air-cooled reference shell temperature of each of the air-cooled components at the average operating ambient temperature; Determining a water cooling acceleration factor of the target device according to the water cooling reference shell temperature and the first reliability accelerated test temperature; Determining an air cooling acceleration factor of the target device according to the air cooling reference shell temperature and the second reliability accelerated test temperature; An assembly acceleration factor of the target device is determined according to the water cooling acceleration factor and the air cooling acceleration factor.

2. The method for determining parameters of equipment reliability accelerated experiment according to claim 1, characterized in that: The step of controlling the water cooling environment temperature to increase gradually according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails to determine the maximum water cooling operating temperature of the target device comprises: Adjusting the water cooling environment temperature to increase from the maximum temperature designed by the water cooling system according to the first temperature gradient; Monitoring the operating status of the target device; In the event that the target device fails, determining the current water cooling environment temperature as the failure water cooling temperature of the target device; The maximum water cooling operating temperature is determined according to the difference between the failure water cooling temperature and the first temperature gradient.

3. The method for determining parameters of equipment reliability accelerated experiment according to claim 1, characterized in that: The step of adjusting the water-cooling environment temperature to decrease according to the maximum water-cooling operating temperature and the second temperature gradient until the water-cooling junction temperature of each of the water-cooling elements is less than the first design junction temperature to determine the first reliability accelerated test temperature of the water-cooling element includes: Adjusting the water cooling environment temperature from the maximum water cooling working temperature to decrease according to the second temperature gradient; Monitoring the actual shell temperature of each of the water-cooling elements; Determining the water-cooling junction temperature of each of the water-cooling elements according to the actual shell temperature; When the water-cooling junction temperature of each of the water-cooling elements is lower than the first design junction temperature, the water-cooling environment temperature corresponding to the current water-cooling junction temperature is determined as the first reliability accelerated test temperature.

4. The method for determining parameters of equipment reliability accelerated experiment according to claim 1, characterized in that: The assembly acceleration factor is the minimum value of the water cooling acceleration factor and the air cooling acceleration factor.

5. The method for determining parameters of equipment reliability accelerated experiment according to claim 1, characterized in that: Also includes: Obtaining the designed service life of the target device; Determining the target working time of the target equipment according to the designed working life; The duration of the reliability acceleration test of the target device is determined according to the target working time and the assembly acceleration factor.

6. A parameter determination device for equipment reliability accelerated test, characterized in that: include: A first acquisition module is used to acquire water cooling element information and a maximum design temperature of a water cooling system of a target device, wherein the target device includes a plurality of water cooling elements; A first control module, used to control the operation of the target device; A first determination module is used to adjust the water cooling environment temperature to increase according to the designed maximum temperature of the water cooling system and the first temperature gradient until the target device fails, so as to determine the maximum water cooling operating temperature of the target device; A second determination module is used to adjust the water-cooling environment temperature to decrease according to the maximum water-cooling operating temperature and the second temperature gradient until the water-cooling junction temperature of each of the water-cooling elements is lower than the first design junction temperature, so as to determine a first reliability accelerated test temperature of the water-cooling element; A second acquisition module is used to acquire the air cooling component information and the maximum design temperature of the air cooling system of the target device, wherein the target device further includes a plurality of air cooling components; A third determination module is used to adjust the air-cooling environment temperature to increase according to the designed maximum temperature of the air-cooling system and the third temperature gradient until the target device fails, so as to determine the maximum air-cooling operating temperature of the target device; a fourth determination module, configured to adjust the air-cooling environment temperature to decrease according to the maximum air-cooling operating temperature and the fourth temperature gradient, until the air-cooling junction temperature of each of the air-cooling elements is less than the second design junction temperature, so as to determine a second reliability accelerated test temperature of the air-cooling element; A third acquisition module is used to obtain the water-cooling reference shell temperature of each of the water-cooling elements at the maximum design temperature of the water-cooling system; A fourth acquisition module, used to acquire an average working environment temperature of the target device; A fifth acquisition module, used to acquire an air-cooled reference shell temperature of each of the air-cooled components under the average working environment temperature; A fifth determination module, configured to determine a water cooling acceleration factor of the target device according to the water cooling reference shell temperature and the first reliability acceleration test temperature; A sixth determination module, configured to determine an air cooling acceleration factor of the target device according to the air cooling reference shell temperature and the second reliability acceleration test temperature; The seventh determination module is used to determine the assembly acceleration factor of the target device according to the water cooling acceleration factor and the air cooling acceleration factor.

7. A storage medium, characterized in that: The storage medium includes a stored program, wherein when the program is executed, the device where the storage medium is located is controlled to execute the parameter determination method for the device reliability acceleration experiment according to any one of claims 1 to 5.

8. An electronic device, characterized in that: The electronic device includes at least one processor and at least one memory connected to the processor, wherein the processor is used to call program instructions in the memory to execute the parameter determination method for the device reliability acceleration experiment as described in any one of claims 1 to 5.

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