Display panel, display device, panel and method for manufacturing display panel

Abstract

The present invention discloses a display panel, a display device, a panel and a method for manufacturing a display panel, wherein the display panel includes a display area; a virtual area, which is arranged around the display area; the virtual area is provided with a plurality of electrical test pads, and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to the first end of the semiconductor unit corresponding to it, and the second end of the semiconductor unit is used to connect to a charge release circuit arranged outside the display panel. In the present invention, by arranging the semiconductor unit, the process of the conductive layer along the edge of the display panel corroding toward the inner side of the display panel can be effectively blocked; at the same time, by utilizing the semiconductor material characteristics of the semiconductor unit, when the electrostatic charge on the display panel accumulates to a certain extent and reaches a threshold voltage, it can be turned on to transmit the electrostatic charge to the charge release circuit, thereby avoiding defects caused by static electricity on the display panel.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel, a display device, a panel and a method for manufacturing the display panel. Background Art

[0002] During the manufacturing process of display panels, static electricity will be generated and accumulated on the display panels; when it accumulates to a certain extent, it will gather towards the metal wiring. Between different film layers, there will be a situation where the orthographic projections of metal wiring on the substrate overlap; in the same film layer, there is also a situation where metal wiring or metal electrodes are close to each other. After static electricity accumulates to a certain extent, it is easy to produce static electricity release at these overlapping positions and positions close to each other and break through the film layer, thereby changing the properties of the broken film layer and causing a defective display panel. Therefore, when manufacturing display panels, corresponding electrostatic release units will also be set up to release the static electricity accumulated on the display panel to avoid poor display panels caused by static electricity. However, as the application field of display products expands, the application environment is becoming more and more complex. Display panels need to undergo high-corrosive verification projects such as high temperature, high humidity and salt spray. During the process of conducting high-corrosive verification projects, it was found that the location where the electrostatic release unit was set was prone to corrosion, resulting in a high product defect rate. Summary of the invention

[0003] In view of the above problems, the present invention proposes a display panel, a display device, a panel and a method for manufacturing a display panel, which can solve the problem of poor display panel performance caused by static electricity while improving the reliability of the display panel, thereby effectively improving the yield of the display panel.

[0004] In the first aspect, the present application provides the following technical solution through an embodiment:

[0005] A display panel comprises: a display area; a virtual area arranged around the display area; the virtual area is provided with a plurality of electrical test pads and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to a first end of the semiconductor unit corresponding thereto, and a second end of the semiconductor unit is used to be connected to a charge release circuit arranged outside the display panel; the semiconductor unit is configured to be turned on when a voltage difference between the first end and the second end of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display panel to the charge release circuit.

[0006] Optionally, the semiconductor unit extends to an edge of the virtual area.

[0007] Optionally, the display area includes a semiconductor layer for forming a transistor device; and the semiconductor unit and the semiconductor layer are arranged on the same layer.

[0008] Optionally, the virtual area is provided with a conductive connection unit, and the conductive connection unit corresponds to the electrical test pads one by one; each electrical test pad is connected to the first end of the semiconductor unit corresponding to it through the conductive connection unit.

[0009] Optionally, the display area includes a transparent conductive layer for connecting pixel electrodes; and the conductive connection unit and the transparent conductive layer are arranged on the same layer.

[0010] Optionally, a via is provided between the conductive connection unit and the corresponding electrical test pad, a conductive structure is provided in the via, a first end of the conductive structure is connected to the conductive connection unit, and a second end of the conductive structure is connected to the corresponding electrical test pad.

[0011] Optionally, the virtual area is also provided with a circuit board binding pad and a semiconductor unit corresponding to the circuit board binding pad, the circuit board binding pad is conductively connected to the first end of the corresponding semiconductor unit, and the second end of the semiconductor unit is used to connect to a charge release circuit outside the display panel.

[0012] In the second aspect, based on the same inventive concept, the present application provides the following technical solution through an embodiment:

[0013] A display device comprises: a display panel as described in any one of the first aspects above.

[0014] In the third aspect, based on the same inventive concept, the present application provides the following technical solution through an embodiment:

[0015] A panel comprises: a plurality of display areas, a virtual area is arranged between each two adjacent display areas, the virtual area comprises a cutting area and a single-layer area; the cutting area is provided with a charge release circuit; the single-layer area is provided with a plurality of electrical test pads, and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to the first end of the semiconductor unit corresponding to it, and the second end of the semiconductor unit is connected to the charge release circuit; the semiconductor unit is configured to be turned on when the voltage difference between the first end and the second end of the semiconductor unit reaches the threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display area to the charge release circuit.

[0016] In the fourth aspect, based on the same inventive concept, the present application provides the following technical solution through an embodiment:

[0017] A method for manufacturing a display panel, comprising:

[0018] A substrate is provided; the substrate is divided into a display area and a virtual area, and the virtual area surrounds the display area; a plurality of electrical test pads and a semiconductor unit corresponding to each electrical test pad are formed in the virtual area; wherein each electrical test pad is conductively connected to a first end of the semiconductor unit corresponding to it, and a second end of the semiconductor unit is used to connect to a charge release circuit arranged outside the display panel; the semiconductor unit is configured to be turned on when a voltage difference between the first end and the second end of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display panel to the charge release circuit.

[0019] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0020] In an embodiment of the present invention, a display panel, a display device, a panel and a method for manufacturing a display panel are provided, wherein the display panel includes a display area; a virtual area, which is arranged around the display area; the virtual area is provided with a plurality of electrical test pads, and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to the first end of the semiconductor unit corresponding to it, and the second end of the semiconductor unit is used to connect to a charge release circuit arranged outside the display panel; the semiconductor unit is configured to be turned on when the voltage difference between the first end and the second end of the semiconductor unit reaches the threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display panel to the charge release circuit. In the present invention, by setting the semiconductor unit, the process of the conductive layer along the edge of the display panel corroding toward the inner side of the display panel can be effectively blocked; at the same time, by utilizing the semiconductor material characteristics of the semiconductor unit, when the electrostatic charge on the display panel accumulates to a certain extent and reaches the threshold voltage, it can be turned on to transfer the electrostatic charge to the charge release circuit, thereby avoiding defects caused by static electricity on the display panel.

[0021] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 is a schematic structural diagram of a first display panel in an embodiment of the present invention;

[0024] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the middle area A;

[0025] Figure 3 is a schematic structural diagram of a second display panel in an embodiment of the present invention;

[0026] Figure 4 A schematic diagram of a microstructure of a corroded edge of a display panel in an embodiment of the present invention;

[0027] Figure 5 is a schematic structural diagram of a third display panel in an embodiment of the present invention;

[0028] Figure 6 is a curve diagram of the electrostatic voltage and current of the display panel in an embodiment of the present invention;

[0029] Figure 7 A schematic diagram of the microstructure of a display panel film layer being broken down by static electricity and causing burning and short circuit in an embodiment of the present invention;

[0030] Figure 8 A schematic diagram of the microstructure of a film layer damaged at the edge of a display panel in an embodiment of the present invention;

[0031] Fig. 9 is a schematic structural diagram of a fourth display panel according to an embodiment of the present invention;

[0032] Fig.10 is a schematic structural diagram of a fifth display panel in an embodiment of the present invention;

[0033] Fig.11 for Fig.10 Schematic diagram of the enlarged structure of the middle area E;

[0034] Fig.12 The figure is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention. DETAILED DESCRIPTION

[0035] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0036] Various structural schematic diagrams according to embodiments of the present disclosure are shown in the accompanying drawings. These figures are not drawn to scale, and some details are magnified and some details may be omitted for the purpose of clear expression. The shapes of various regions and layers shown in the figures and the relative sizes and positional relationships therebetween are only exemplary, and may deviate in practice due to manufacturing tolerances or technical limitations, and those skilled in the art may further design regions / layers with different shapes, sizes, and relative positions according to actual needs.

[0037] In the context of the present disclosure, when a layer / element is referred to as being "on" another layer / element, the layer / element may be directly on the other layer / element or an intervening layer / element may exist therebetween. In addition, if a layer / element is "on" another layer / element in one orientation, the layer / element may be "below" the other layer / element when the orientation is reversed.

[0038] See also Figure 1 The current display panel 100 includes a display area 110 and a dummy area (Dummy area) 120. Each adjacent display area 110 is arranged at an interval, and the interval between the adjacent display areas 110 is set as the dummy area 120; each display area 110 may correspond to a display panel, such as Figure 2 The display panel in area A is shown. The display area 110 may include a VA (View Area) area and a BM (Black Matrix) area, etc. The virtual area 120 is an area where a virtual pixel (Dummy Pixel) 121 is set. A cutting line 122 is also provided in the virtual area 120. A separate display panel can be obtained by cutting the display panel 100 along the cutting line 122. During the production process, static electricity will accumulate in the display panel. When it accumulates to a certain extent, discharge is likely to occur between the wiring network of the display panel, thereby burning the wiring or film layer. Therefore, in order to release the static electricity generated and accumulated during the production process of the display panel, a corresponding static electricity release unit needs to be provided in the present application to release the static electricity accumulated on the display panel to avoid burning the film layer or wiring of the display panel.

[0039] See also Figure 3In the application, a display panel 200 is provided, including a display area 210 and a virtual area 220, and the virtual area 220 is arranged around the display area 210. An electrical test pad (Electrical test Pad, ET Pad) 223 for electrical testing is arranged in the virtual area 220 of the display panel 200, and a conductive layer 224 is also arranged in the virtual area 220, one end of the conductive layer 224 is connected to the electrical test pad 223, and the other end of the conductive layer 224 is connected to a circuit for storing or eliminating electrostatic charges. The virtual area 220 is an area where a dummy pixel (Dummy Pixel) is arranged. The conductive layer 224 can be implemented by a transparent conductive layer, such as an ITO (Indium Tin Oxide, indium tin oxide) layer, and the conductive layer 224 can be manufactured while manufacturing the wiring corresponding to the pixel electrode, reducing the process cost; of course, in some implementations, the conductive layer 224 can also be manufactured separately. By transmitting the electrostatic charge accumulated in the display panel 200 through the conductive layer 224 to a circuit for storing or eliminating electrostatic charge, the display panel 200 can be effectively protected, avoiding the risk of breakdown when the electrostatic charge accumulated in the display panel 200 reaches a certain amount, and the cost is low.

[0040] Through production verification, it is found that when the display panel 200 is provided with the above-mentioned electrostatic protection structure, the product yield can be significantly improved; in 8WU and 10.1WU (resolution standard) products: when the above-mentioned electrostatic protection structure is not provided in the display panel 200, the product defective rate caused by static electricity is approximately 1.2%, and can reach a maximum of 2%; when the above-mentioned electrostatic protection structure is provided in the display panel 200, the product defective rate caused by static electricity is significantly reduced to about 0.2%, thereby effectively improving the product yield.

[0041] Furthermore, in this implementation, the conductive layer 224 will extend to the edge of the display panel 200 (cutting line 222) when arranged in the virtual area 220; that is, when the display panel 200 corresponding to the display panel 200 has not been cut, the setting position of the conductive layer 224 will pass through the cutting line 222 of the display panel, and when the display panel 200 is obtained by cutting the display panel from the cutting line 222, the edge of the display panel 200 will expose the conductive layer 224. Further, through actual application and experiments, it was found that when the display panel 200 is used in a highly corrosive environment such as high temperature, high humidity and salt spray, corrosion will occur along the conductive layer 224 of the display panel 200, resulting in reliability problems at the module stage, affecting product quality, such as Figure 4 As shown, region B is a severely corroded portion. Therefore, although the problem of display panel 200 failure caused by static electricity can be well solved in this embodiment, the reliability problem of display panel 200 will be caused at the same time.

[0042] In response to the problem of corrosion along the conductive layer in the display panel in the above-mentioned embodiment, based on the same inventive concept, a display panel is also provided in another embodiment of the present application. The structural setting of the display panel can solve the reliability problem of edge corrosion of the display panel while avoiding static electricity from causing poor display panel performance.

[0043] See also Figure 5 The display panel 300 includes: a display area 310 and a virtual area 320, and the virtual area 320 is arranged around the display area 310. The display area 310 and the virtual area 320 are different areas divided on the display panel 300, and each area includes a corresponding plurality of film layer structures forming the display panel 300.

[0044] A plurality of electrical test pads 323 and a semiconductor unit 325 corresponding to each electrical test pad 323 are provided in the virtual area 320. Each electrical test pad 323 is conductively connected to a first end of the semiconductor unit 325 corresponding thereto, and a second end of the semiconductor unit 325 is used to be connected to a charge release circuit provided outside the display panel 300; the charge release circuit can be used to store or eliminate electrostatic charges released after the static electricity is accumulated in the display panel 300. The semiconductor unit 325 is configured to be turned on when the voltage difference between the first end and the second end of the semiconductor unit 325 reaches a threshold voltage of the semiconductor unit 325, so as to transfer the electrostatic charges of the display panel 300 to the charge release circuit.

[0045] The working principle of the electrostatic protection of the display panel 300 of this embodiment is: the electrostatic charge accumulated during the manufacturing, transfer and cutting process of the display panel 300 will be concentrated on the wiring connected to the electrical test pad 323, which will increase the voltage at the first end of the semiconductor unit 325. When the voltage difference between the two ends of the semiconductor unit 325 reaches the conduction threshold voltage, a conduction current will be generated, and the electrostatic charge can be transmitted to the charge release circuit at the second end of the semiconductor unit 325.

[0046] It can be understood that in the display panel 300 of the present embodiment, a semiconductor unit 325 is provided in the structure for extracting the electrostatic charge in the display panel 300, which can effectively block the process of the conductive layer along the edge of the display panel 300 corroding the inner side of the display panel 300; at the same time, by utilizing the semiconductor material characteristics of the semiconductor unit 325, when the electrostatic charge on the display panel 300 accumulates to a certain extent and the voltage difference between the two ends of the semiconductor unit 325 reaches the threshold voltage, it can be turned on to transmit the electrostatic charge to the charge release circuit, thereby avoiding the display panel 300 from being defective due to static electricity. For example, it avoids the electrostatic charge release between the wirings of the display panel 300, which causes the film layer or wiring to burn.

[0047] In some implementations, the semiconductor unit 325 can be arranged to extend to the edge of the virtual area 320, that is, the arranged semiconductor unit 325 can extend to the cutting surface (cutting line 322) of the display panel 300, so that the conductive layer is not exposed on the cutting surface, thereby avoiding corrosion at the edge of the display panel 300, and blocking the corrosion process from the middle position of the virtual area 320 of the display panel 300, thereby further improving the reliability of the product and ensuring the application reliability of the product in high temperature and high humidity environments.

[0048] The display area 310 of the display panel 300 includes a semiconductor layer for forming a transistor device, so in some implementations, the semiconductor unit 325 can also be arranged on the same layer as the semiconductor layer. That is, the semiconductor unit 325 is manufactured while manufacturing the semiconductor layer in the TFT (Thin Film Transistor) substrate of the display panel 300, and the semiconductor unit 325 is realized by the semiconductor channel formed when the semiconductor layer is manufactured; the semiconductor layer can be an amorphous silicon (a-Si) semiconductor layer, a low-temperature polycrystalline silicon semiconductor layer, or an oxide semiconductor layer, which can be determined based on the type of the display panel 300 to be manufactured, without limitation; in some embodiments, an amorphous silicon (a-Si) semiconductor layer can be used to realize the control of the threshold voltage. When the semiconductor unit 325 is manufactured by adopting this structural design, excessively increased process steps can be avoided and process costs can be controlled. Of course, in some other implementations, the semiconductor unit 325 can also be manufactured separately on any film layer of the virtual area 320, without limitation.

[0049] In some implementations, a conductive connection unit 324 may be further provided in the virtual area 320. The conductive connection unit 324 corresponds to the electrical test pads 323 one by one, and each electrical test pad 323 is connected to the first end of the corresponding semiconductor unit 325 through the conductive connection unit 324, so that the electrostatic charge on each wiring in the display panel 300 is led out to the conductive connection unit 324.

[0050] The display area 310 of the display panel 300 includes a transparent conductive layer for connecting the pixel electrodes, and in some implementations, the transparent conductive layer is an 1ITO layer. The conductive connection unit 324 can be set on the same layer as the transparent conductive layer, that is, the conductive connection structure is manufactured at the same time as the transparent conductive layer is manufactured in the display area 310, that is, the conductive connection structure is also a transparent conductive layer. This design method can avoid the manufacture of the conductive connection unit 324 when the process steps are excessively increased, and avoid the increase of process costs when realizing the static electricity of the display panel 300. Of course, in other implementations, the conductive connection unit 324 can also be set and manufactured separately, without limitation.

[0051] In some implementations, the conductive connection unit 324 and the electrical test pad 323 are located in different film layers, so a via hole can be opened between the conductive connection unit 324 and the electrical test pad 323, and a corresponding conductive structure is set in the via hole, the first end of the conductive structure is connected to the conductive connection unit 324, and the second end of the conductive structure is connected to the corresponding electrical test pad 323; that is, the two ends of the conductive structure form conductive contact with the conductive connection unit 324 and the electrical test pad 323 respectively. The size of the conductive structure can be adapted to the size of the via hole. The via hole and the conductive structure can also be manufactured simultaneously when manufacturing the corresponding structure of the display area 310 of the display panel 300 to avoid increasing the process cost.

[0052] In some implementations, it can also be achieved by setting a thin film transistor corresponding to each electrical test pad 323 in the virtual area 320 of the display panel 300. It can be understood that before the display panel 300 is cut on the display board, at least a portion of the semiconductor channel of the thin film transistor is located on the side of the cutting line 322 close to the display panel 300. The thin film transistor can be manufactured synchronously when the TFT array is manufactured, and the thin film transistor is isolated from the TFT array. Further, the gate of the thin film transistor can be removed during the manufacturing process to avoid the discharge gap of the semiconductor unit 325 (here, the semiconductor channel of the thin film transistor), the discharge phenomenon between the source / drain and the gate of the transistor, the short circuit, and the damage to the transistor film layer.

[0053] For example, when the gate of the thin film transistor is not removed, the semiconductor channel can still be turned on after the voltage reaches a certain level, realizing the extraction of electrostatic charge and playing a role in electrostatic protection. However, the breakdown voltage at the semiconductor channel position is about 2.0KV. After the gate of the thin film transistor is removed, the breakdown voltage of the semiconductor channel can reach 4.0KV, and it can also avoid discharge short circuit between the source / drain and the gate of the transistor device, resulting in film damage.

[0054] It can be understood that the discharge gap has a strong voltage stabilizing effect. When the threshold voltage (action voltage) of the semiconductor channel is reached, the semiconductor channel is turned on, and its conduction current increases exponentially. Finally, the voltage across the semiconductor channel is basically constant, such as Figure 6 shown. Figure 6 The maximum allowable continuous operating voltage indicates the maximum voltage that can be continuously and stably applied across the semiconductor unit 325; the rated voltage indicates the maximum stable instantaneous voltage across the semiconductor unit 325. Below this voltage, the discharge gap does not work and does not consume the life of the discharge gap. Above this voltage, a weak current will flow through the discharge gap, and a small amount of charge will pass through, reaching the sub-working state of the discharge gap; the starting action voltage indicates the threshold voltage of the semiconductor unit 325 to conduct ( Figure 6The residual voltage is the voltage at which the film layer in the display panel 300 is broken down and burned by static electricity. Compared with the semiconductor channel with a gate, the discharge gap of the semiconductor channel in this implementation can have a lower threshold voltage and can withstand higher limit voltage and current without being damaged. The discharge gap of the semiconductor channel with a gate has a higher operating voltage. When the static voltage is too high, it is very easy to break down the transistor film layer and cause a short circuit. Figure 7 As shown in FIG. 1 , when the electrostatic charge accumulates to a voltage of 2.5 KV, a breakdown phenomenon occurs between two adjacent source / drain electrodes (position C1), i.e., a burn occurs; a breakdown phenomenon also occurs between the source / drain electrode and the gate electrode (position C2), resulting in a short circuit. When the electrostatic charge accumulates to a voltage of 4.5 KV, a discharge short circuit also occurs between the source / drain electrode and the gate electrode at the position where the charge release circuit is connected at the edge of the display panel 300, resulting in poor film damage (position D), as shown in FIG. Figure 8 shown.

[0055] See also Fig. 9 In some implementations, a circuit board binding pad (Bonding Pad) 326 and a semiconductor unit 325 corresponding to the circuit board binding pad 326 are provided in the virtual area 320 of the display panel 300. The circuit board binding pad 326 can be used to be crimped with a test circuit board, such as an FPC (Flexible Printed Circuit, FPC) during the back-end test. The circuit board binding pad 326 is conductively connected to the first end of the corresponding semiconductor unit 325, and the second end of the semiconductor unit 325 is used to connect to the charge release circuit outside the display panel 300. In this implementation, the routing network range of the electrostatic protection is further expanded, which can effectively increase the anti-static ability of the display panel 300 with a smaller routing width.

[0056] To sum up, the display panel 300 provided in this embodiment can realize static electricity conduction and avoid defects caused by static electricity in the display panel 300, while also improving the corrosion resistance of the edge of the display panel 300, thereby improving the reliability of the display panel 300 in different usage environments.

[0057] Based on the same inventive concept, another embodiment of the present application further provides a display device, including: a display panel as described in any of the above embodiments. The display device in this embodiment can be a mobile phone, a television, a computer monitor, a laptop, an advertising machine, a tablet computer, etc., without limitation.

[0058] It should be noted that the display device in this embodiment is implemented based on the display panel in the aforementioned embodiment, and the structure of the display panel can refer to the description and explanation in the aforementioned embodiment. At the same time, the beneficial effects of the display device in this embodiment can also refer to the beneficial effects of the display panel in the aforementioned embodiment, which will not be repeated in this embodiment.

[0059] See also Fig.10 and Fig.11 ( Fig.11 for Fig.10 Based on the same inventive concept, in another embodiment of the present invention, a panel 400 is provided, which includes: a plurality of display areas 410; a virtual area 420 is provided between each two adjacent display areas 410, and the virtual area 420 includes a cutting area 420b and a single-layer area 420a.

[0060] The cutting area 420b is provided with a charge release circuit 450, the single-layer area 420a is provided with a plurality of electrical test pads 423, and a semiconductor unit 425 corresponding to each electrical test pad 423, each electrical test pad 423 is conductively connected to the first end of the corresponding semiconductor unit 425, and the second end of the semiconductor unit 425 is connected to the charge release circuit 450; the semiconductor unit 425 is configured to be turned on when the voltage difference between the first end and the second end of the semiconductor unit 425 reaches the threshold voltage of the semiconductor unit 425, so as to transfer the electrostatic charge of the display area 410 to the charge release circuit 450.

[0061] It can be understood that the single-layer area 420a is provided with a circuit board binding pad 426 and a semiconductor unit 425 (not shown in the figure) corresponding to the circuit board binding pad 426. For specific implementation, please refer to the description of the circuit board binding pad 326 in the above embodiment.

[0062] The charge release circuit 450 can be made of a conductive material with a larger area. The conductive material can be arranged around the display area 410 in the cut area 420b around each display area 410 to form a ring storage circuit for storing charge, thereby increasing the area of ​​the conductive material and improving the capacity of electrostatic charge. The ring storage circuit between each two adjacent display areas 410 can be shared, and the ring storage circuits of all display areas 410 can be connected as an integrated charge release circuit 450, so that when electrostatic charge is extracted in any display area 410, there can be a sufficiently large charge capacity in the charge release circuit 450 to ensure a good anti-static effect.

[0063] The charge release circuit 450 can be arranged on the same layer as the conductive connection unit 424 in the above embodiment and made of the same material. That is, the charge release circuit 450 can be manufactured at the same time as the conductive connection unit 424, for example, using an 1ITO layer.

[0064] Of course, in some implementations, the charge release circuit 450 may be connected to all semiconductor units 425 and then grounded to release electrostatic charge.

[0065] It can be understood that the panel 400 is a large display panel that has not been cut yet, and the cutting can be carried out along the cutting line 422. Each display area 410 and the corresponding single-layer area 420a where the electrical test pad 423 is set can correspond to a display panel in the aforementioned embodiment; wherein the single-layer area 420a corresponds to the virtual area 420 where the electrical test pad 423 is set in the aforementioned embodiment; in some implementations, it can be understood as referring to the same area. That is to say, the specific implementation of each display area 410, semiconductor unit 425, electrical test pad 423 and other structures in the panel 400 in this embodiment and the corresponding beneficial effects can be found in the description of the aforementioned display panel embodiment, and will not be repeated here.

[0066] It should be noted that in the drawings of the above embodiments ( Figure 1-Figure 10 ) are schematic diagrams and explanations of the planar positional relationship of the corresponding display panel or the various structures of the panel, or the relative positional relationship of the orthographic projections of the various structures on the substrate, so that readers can easily understand the concept of the present invention. Therefore, those skilled in the art should understand that these illustrations do not mean that these structures are arranged on the surface of the display panel or the panel.

[0067] See also Fig.12 Based on the same inventive concept, a method for manufacturing a display panel is provided in this embodiment. The method can be used to manufacture the display panel or panel in the above-mentioned embodiment. The method for manufacturing the display panel includes:

[0068] Step S10: providing a substrate; the substrate is divided into a display area and a virtual area, and the virtual area surrounds the display area;

[0069] Step S20: forming a plurality of electrical test pads and a semiconductor unit corresponding to each electrical test pad in the virtual area; wherein each electrical test pad is conductively connected to the first end of the corresponding semiconductor unit, and the second end of the semiconductor unit is used to connect to a charge release circuit arranged outside the display panel; the semiconductor unit is configured to be turned on when the voltage difference between the first end and the second end of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display panel to the charge release circuit.

[0070] It should be noted that the present embodiment provides a method for manufacturing a display panel, wherein the structure formed in each step can refer to the aforementioned display panel and panel embodiments, and the beneficial effects produced have been described in the aforementioned embodiments of the display panel and panel, and the details can be referred to the aforementioned embodiments of the display panel and panel, which will not be repeated in this embodiment. The specific process implementation when each structure is manufactured can adopt the existing process technology, which is not limited in this embodiment.

[0071] In the above description, the technical details of the patterning and etching of each layer are not described in detail. However, those skilled in the art should understand that various technical means can be used to form layers, regions, etc. of desired shapes. In addition, in order to form the same structure, those skilled in the art can also design methods that are not completely the same as the methods described above. In addition, although the various embodiments are described above separately, this does not mean that the measures in the various embodiments cannot be used in combination to advantage.

[0072] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0073] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A display panel, characterized in that: include: Display area; a virtual area, arranged around the display area; The virtual area is provided with a plurality of electrical test pads and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to a first end of the semiconductor unit corresponding thereto, and a second end of the semiconductor unit is used to be connected to a charge release circuit provided outside the display panel; The semiconductor unit is configured to be turned on when the voltage difference between the first terminal and the second terminal of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer the electrostatic charge of the display panel to the charge release circuit; The virtual area is provided with a conductive connection unit, and the conductive connection unit corresponds to the electrical test pads one by one; each of the electrical test pads is connected to the first end of the semiconductor unit corresponding to it through the conductive connection unit; A via is provided between the conductive connection unit and the corresponding electrical test pad, a conductive structure is provided in the via, a first end of the conductive structure is connected to the conductive connection unit, and a second end of the conductive structure is connected to the corresponding electrical test pad; The semiconductor unit extends to the edge of the virtual area; The display area includes a semiconductor layer forming a transistor device; the semiconductor unit and the semiconductor layer are arranged on the same layer; The display area includes a transparent conductive layer for connecting pixel electrodes; the conductive connection unit and the transparent conductive layer are arranged on the same layer.

2. The display panel according to claim 1, characterized in that: The virtual area is also provided with a circuit board binding pad and a semiconductor unit corresponding to the circuit board binding pad, the circuit board binding pad is conductively connected to the first end of the corresponding semiconductor unit, and the second end of the semiconductor unit is used to connect to the charge release circuit outside the display panel.

3. A display device, characterized in that: include: The display panel according to any one of claims 1 to 2.

4. A panel, comprising the display panel according to any one of claims 1 to 2, characterized in that: include: A plurality of display areas, a virtual area is provided between each two adjacent display areas, and the virtual area includes a cutting area and a single-layer area; The cutting area is provided with a charge release circuit; The single-layer area is provided with a plurality of electrical test pads and a semiconductor unit corresponding to each electrical test pad, each electrical test pad is conductively connected to a first end of the semiconductor unit corresponding thereto, and a second end of the semiconductor unit is connected to the charge release circuit; The semiconductor unit is configured to be turned on when a voltage difference between a first terminal and a second terminal of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer electrostatic charge of the display area to the charge release circuit.

5. A method for manufacturing a display panel, the method being used to manufacture the display panel according to any one of claims 1 to 2, characterized in that: include: providing a substrate; The substrate is divided into a display area and a virtual area, and the virtual area surrounds the display area; forming a plurality of electrical test pads in the dummy area, and a semiconductor unit corresponding to each electrical test pad; Wherein, each electrical test pad is conductively connected to a first end of the semiconductor unit corresponding thereto, and a second end of the semiconductor unit is used to be connected to a charge release circuit arranged outside the display panel; The semiconductor unit is configured to be turned on when a voltage difference between a first terminal and a second terminal of the semiconductor unit reaches a threshold voltage of the semiconductor unit, so as to transfer electrostatic charge of the display panel to the charge release circuit.

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