Speaker module and speaker
By using the combination of main speakers and auxiliary speakers in the speakers, the problem that medium and high-frequency band audio in existing speakers is easily generated by standing waves, achieving better audio playback effect and sound quality richness in the medium and high-frequency band audio, and improving the user's auditory experience.
Patent Information
- Application Number
- CN202210506214.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-10
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2042-05-10
AI Technical Summary
In the speakers of existing spherical or semispherical soundboxes, the audio in the medium and high frequency band is prone to generate standing waves, resulting in the rapid attenuation of the medium and high frequency sensitivity of the speakers, resulting in the lack of medium and high frequency sound, and the lack of sound quality, which affects the user experience.
A speaker module is adopted, including a main speaker and an auxiliary speaker. The auxiliary speaker is arranged in front of the first diaphragm of the main speaker and is connected to the main speaker for emitting medium and high-frequency audio. The auxiliary speaker may be a piezoelectric speaker, through the design of the mounting frame and the second diaphragm, ensuring that it is spaced from the first diaphragm, avoiding low-frequency audio propagation affecting the main speaker.
Through the setting of the auxiliary speaker, the sound cancellation phenomenon caused by multiple reflections of the medium and high frequency sound waves emitted by the main speaker in the front cavity is effectively alleviated, making up for the medium and high frequency sound lost by the main speaker due to the front cavity effect, improving the playback effect of the speaker in the medium and high frequency bands, improving the richness of sound quality and the degree of analysis and restoration, and improving the user's auditory experience.
Smart Images

Figure CN115334407B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of audio devices, and particularly to a speaker module and a speaker box. Background Art
[0002] With the development of smart speaker boxes, there are more and more speaker box structures in the shape of a sphere or a hemisphere on the market. For a speaker box of this shape, the space between the speaker and the inner wall of the sphere is relatively large, resulting in the fact that the audio in the medium and high frequency bands emitted by the speaker is likely to generate standing waves between the first diaphragm of the speaker and the inner wall of the sphere, causing the medium and high frequency sensitivity of the speaker to rapidly decay, resulting in partial medium and high frequency loss in the played sound, poor richness and resolution of the sound quality of the speaker box, and poor sound quality, which affects the user experience. Summary of the Invention
[0003] The main object of the present invention is to provide a speaker module and a speaker, aiming to improve the richness and resolution of the sound quality of the speaker box and enhance the user's sound quality experience.
[0004] To achieve the above object, a speaker module proposed by the present invention includes:
[0005] Including:
[0006] A main speaker; and
[0007] An auxiliary speaker, the auxiliary speaker is arranged in front of the first diaphragm of the main speaker and is connected to the main speaker, and the auxiliary speaker is arranged at an interval from the first diaphragm and is used for emitting medium and high frequency audio.
[0008] In an embodiment of the speaker module of the present invention, the auxiliary speaker is a piezoelectric speaker.
[0009] In an embodiment of the speaker module of the present invention, the piezoelectric speaker includes:
[0010] A mounting frame, the mounting frame is arranged in front of the first diaphragm and is arranged at an interval from the first diaphragm, and the mounting frame is provided with a hollow hole, and the hollow hole corresponds to the first diaphragm; and
[0011] A second diaphragm, the second diaphragm is embedded in the hollow hole and is arranged opposite to the first diaphragm.
[0012] In an embodiment of the speaker module of the present invention, the mounting frame includes:
[0013] A main body portion, the main body portion is arranged in front of the first diaphragm and is provided with the hollow hole; and
[0014] A connecting portion, the connecting portion extends from the main body portion to the outside of the first diaphragm and is fixedly connected to the main speaker.
[0015] In one embodiment of the speaker module of the present invention, the main speaker comprises:
[0016] An inner shell, wherein a sound cavity is formed in the inner shell, and the inner shell is provided with a mounting opening communicating with the sound cavity; and
[0017] A loudspeaker unit, the loudspeaker unit having a basin frame and the first diaphragm, the basin frame is inserted into the mounting opening to close the sound cavity, the basin frame is provided with a cavity opening toward the outside of the mounting opening and is provided with a pressure relief hole connecting the cavity and the sound cavity, and the first diaphragm cover is provided at the opening of the cavity;
[0018] Wherein, the connecting portion and the basin frame are both fixed to the inner shell.
[0019] In one embodiment of the speaker module of the present invention, the basin frame comprises:
[0020] a basin frame body, the basin frame body being inserted into the installation opening and the basin frame body being provided with the receiving cavity; and
[0021] The surrounding edge is arranged around the basin frame body, and is arranged on the outer wall of the inner shell, and is arranged around the installation opening. The connecting part is located on the side of the surrounding edge away from the inner shell, and is connected to the surrounding edge and the inner shell.
[0022] In one embodiment of the speaker module of the present invention, the speaker module further comprises a locking member, which is sequentially penetrated through the connecting portion, the surrounding edge and the inner shell to connect the connecting portion, the surrounding edge and the inner shell;
[0023] And / or, the speaker module further comprises a shock absorbing pad, wherein the shock absorbing pad is sandwiched between the surrounding edge and the connecting portion;
[0024] And / or, the main speaker has a seismic isolation pad, the seismic isolation pad is attached to the outer wall of the inner shell and is arranged around the circumference of the installation opening, and the surrounding edge and the connecting portion are both located within the surrounding range of the seismic isolation pad;
[0025] And / or, the outer wall of the inner shell is provided with a mounting groove, the bottom wall of the mounting groove is provided with the mounting opening, and the surrounding edge and the connecting portion are both located in the mounting groove;
[0026] And / or, the outer wall of the inner shell facing the surrounding edge is provided with one of a positioning post and a positioning hole, and the surface of the surrounding edge facing the inner shell is provided with the other of a positioning post and a positioning hole, and the positioning post is inserted into the positioning hole.
[0027] In an embodiment of the loudspeaker module of the present invention, a wiring component is provided inside the inner shell, the wiring component penetrates out of the inner shell, the loudspeaker unit has a wiring terminal exposed on the outer surface of the chassis, and the wiring terminal is electrically connected to the wiring component;
[0028] The piezoelectric loudspeaker has a conductive component, and the conductive component is electrically connected to the wiring component.
[0029] In an embodiment of the loudspeaker module of the present invention, the conductive component penetrates into the sound cavity from outside the inner shell and is connected to the wiring terminal.
[0030] In an embodiment of the loudspeaker module of the present invention, the inner shell is provided with an insertion hole communicating with the outside and the sound cavity, the conductive component is inserted through the insertion hole, and a sealing material is filled between the conductive component and the hole wall of the insertion hole.
[0031] In an embodiment of the loudspeaker module of the present invention, the second diaphragm covers the surface of the mounting frame facing the first diaphragm, and the cross-sectional area of the hollow hole gradually expands in a direction away from the first diaphragm;
[0032] And / or, the second diaphragm is provided with a through hole, and the through hole is arranged corresponding to the first diaphragm;
[0033] And / or, the second diaphragm includes a vibrating piece and at least one piezoelectric piece, and at least one of the piezoelectric pieces is laminated on the surface of the vibrating piece.
[0034] The present invention also provides a speaker, and the speaker includes:
[0035] A housing, an installation cavity is formed inside the housing, at least part of the cavity wall of the installation cavity is a concave arc surface, and a sound hole communicating with the outside and the installation cavity is opened on the concave arc surface; and
[0036] The loudspeaker module according to any one of the foregoing items, the loudspeaker module is arranged in the installation cavity, and the main loudspeaker covers the concave arc surface and encloses a front cavity of the main loudspeaker with the concave arc surface.
[0037] In the technical solution of the present invention, there are a main speaker and an auxiliary speaker in the speaker module. The main speaker can emit sounds of the full audio frequency range, and the auxiliary speaker can emit medium and high-frequency sounds. At the same time, the auxiliary speaker is located in the front cavity formed by the enclosure of the main speaker and the arc-shaped cavity wall of the installation cavity, and is spaced apart from the first diaphragm of the main speaker. With such an arrangement, the setting of the auxiliary speaker does not affect the vibration and sound emission of the first diaphragm, so that the low-frequency sound with weak directivity is not affected when radiating outward; and the size of the front cavity of the main speaker can be reduced by the auxiliary speaker, effectively alleviating the sound cancellation phenomenon caused by the multiple reflections of the medium and high-frequency sound waves with shorter wavelengths emitted by the main speaker in the front cavity; at the same time, the medium and high-frequency sounds emitted by the auxiliary speaker can compensate for the medium and high-frequency sounds lost by the main speaker due to the front cavity effect, playing a role of superposition and compensation of the medium and high-frequency sounds, so that the sound played by the speaker includes all frequency bands of medium, high and low, ensuring the sound analysis and restoration degree and the richness of the sound quality of the speaker.
[0038] At the same time, since the superposition and compensation of the medium and high-frequency sounds can be ensured by the auxiliary speaker to guarantee the playing effect of the medium and high-frequency sounds, the main speaker can then be more inclined to play low-frequency sounds at this time, further improving the low-frequency effect of the speaker, better restoring the sound, and improving the sound quality of the speaker. That is to say, in the technical solution of the present invention, by combining the main speaker and the auxiliary speaker to form a speaker module, the playback effect of the speaker in the medium and high-frequency bands can be better improved, the richness of the medium and high frequencies can be enhanced, making the sound field of the speaker wider, and at the same time, the clarity of the sound quality can be improved, thereby improving the richness and analysis and restoration degree of the sound quality of the speaker, and enhancing the user's auditory experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0040] Figure 1 It is a structural diagram of an embodiment of the speaker module of the present invention;
[0041] Figure 2 It is Figure 1 an exploded view of the speaker module;
[0042] Figure 3 It is Figure 2 a structural diagram of the inner shell;
[0043] Figure 4 It is Figure 2 a structural diagram of the speaker unit;
[0044] Figure 5 It isFigure 1 Structural diagram of the middle auxiliary speaker;
[0045] Figure 6 Structural diagram of another embodiment of the speaker module of the present invention;
[0046] Figure 7 Structural diagram of the first embodiment of the speaker of the present invention;
[0047] Figure 8 Structural diagram of the second embodiment of the speaker of the present invention;
[0048] Figure 9 Structural diagram of the third embodiment of the speaker of the present invention;
[0049] Figure 10 Exploded view of the fourth embodiment of the speaker of the present invention;
[0050] Figure 11 Audio simulation diagram of the speaker of the present invention.
[0051] Explanation of the reference numerals in the drawings:
[0052]
[0053]
[0054] The realization, functional features and advantages of the object of the present invention will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific embodiments
[0055] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0056] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.
[0057] In the present invention, unless otherwise clearly specified or limited, terms such as "connection" and "fixation" shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0058] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.
[0059] In response to the problems raised in the background art, the present invention provides a speaker module 10 and a speaker 100, which can improve the richness of the sound quality and the degree of analysis and restoration of the speaker 100, thereby enhancing the user's auditory experience.
[0060] Next, the structures of the speaker module 10 and the speaker 100 of the present application will be described in specific embodiments.
[0061] Please refer to Figure 1 and Figure 6 , in an embodiment of the speaker module 10 of the present invention, it includes:
[0062] A main speaker 11; and
[0063] An auxiliary speaker 13, the auxiliary speaker 13 is disposed in front of the first diaphragm 1131 of the main speaker 11 and is connected to the main speaker 11. The auxiliary speaker 13 is spaced apart from the first diaphragm 1131 and is used for emitting medium and high audio frequencies.
[0064] The loudspeaker module 10 proposed in this application is applied to the sound box 100. The loudspeaker module 10 includes a main loudspeaker 11 and a secondary loudspeaker 13. When the loudspeaker module 10 is arranged in the housing 20 of the sound box 100, a front cavity 117 of the main loudspeaker 11 is formed in front of the first diaphragm 1131 of the main loudspeaker 11. The main loudspeaker 11 is mostly a full-range loudspeaker and can be a moving coil loudspeaker, which is an electroacoustic transducer applying the electric principle. When the main loudspeaker 11 receives the electrical signal from the main board 30 and makes the first diaphragm 1131 vibrate to generate sound, the sound emitted can be radiated outward through the sound hole 211. The secondary loudspeaker 13 is arranged in front of the first diaphragm 1131 of the main loudspeaker 11. It can emit medium and high-frequency tones and can be a thermal sound-emitting loudspeaker, that is, it uses a thermal sound-emitting film to generate sound. Specifically, when the thermal sound-emitting film generates heat, it can heat the air around the thermal sound-emitting film, causing the air to vibrate and generate sound. The sound frequency band emitted can reach the medium and high-frequency band; alternatively, the secondary loudspeaker 13 can also be a piezoelectric loudspeaker as described in the following embodiments. The piezoelectric material deforms in the changing electric field to drive the vibrating piece 1331 to vibrate, causing the air to vibrate and generate sound. The sound frequency band emitted can reach the medium and high-frequency band. The secondary loudspeaker 13 can also be other types of loudspeakers, which are not limited herein. The secondary loudspeaker 13 is located in front of the first diaphragm 1131 of the main loudspeaker 11 and is arranged at an interval from the first diaphragm 1131. Since the directivity of the low-frequency sound emitted by the main loudspeaker 11 is relatively low, the low-frequency sound can be transmitted from the gap between the secondary loudspeaker 13 and the first diaphragm 1131 to the gap between the secondary loudspeaker 13 and the concave arc surface, and then radiated outward through the sound hole 211 to avoid the setting of the secondary loudspeaker 13 affecting the propagation of low-frequency sound waves and ensure the low-frequency effect of the sound box 100; at the same time, when the loudspeaker module 10 is installed in the housing 20 of the sound box 100, the size of the front cavity 117 of the main loudspeaker 11 is reduced, so as to reduce the number of reflections of the medium and high-frequency sound emitted by the main loudspeaker 11 in the front cavity 117, thereby reducing the cancellation loss of the sound emitted by the main loudspeaker 11 in the front cavity 117; at the same time, the medium and high-frequency sound emitted by the secondary loudspeaker 13 can be superimposed on the sound emitted by the main loudspeaker 11 to compensate for the medium and high-frequency loss of the main loudspeaker 11 due to the front cavity 117 effect, so that the sound played by the sound box 100 includes all frequency bands of low, medium, and high, ensuring the sound analysis and restoration degree and sound quality richness of the sound box 100. On the other hand, since the sound box 100 mainly emits medium and high-frequency sounds by the secondary loudspeaker 13 at this time, the main loudspeaker 11 can be mainly used to emit low-frequency sounds to improve the low-frequency sound effect of the sound box 100, so that the sound box 100 optimizes the low-frequency sound effect while improving the reproduction effect and richness of the medium and high-frequency band, further improving the sound quality richness and analysis and restoration degree of the sound box 100 and enhancing the user's auditory experience.
[0065] In addition, in some embodiments, a thermoacoustic device or a piezoelectric speaker is used as the auxiliary speaker 13, and its sound frequency range can extend from 400 Hz to 40 kHz. Although the audible sound frequency range of the human body is only from 20 Hz to 20 kHz, the sounds in daily life are composed of fundamental frequencies and overtones, that is, the sound itself includes sounds that people can hear and sounds that people cannot hear. If only the auxiliary speaker 13 emits sounds within the audible audio range of the human body and does not include sounds of other frequencies, the waveform of the sound will change, resulting in audio distortion and poor audio restoration. In this application, the combination of the main sound generator and the auxiliary speaker 13 is adopted, so that the sound range emitted by the speaker 100 is between 0 and 40 kHz, which can make the speaker 100 have a high audio restoration degree, make the sound emitted by it closer to the original sound, and provide a better auditory experience for users.
[0066] Therefore, it can be understood that in the technical solution of the present invention, for the speaker module 10, the main speaker 11 and the auxiliary speaker 13, the main speaker 11 can emit sounds of the full audio range, and the auxiliary speaker 13 can emit medium and high frequency sounds. At the same time, the auxiliary speaker 13 is located in the front cavity 117 formed by the enclosure of the main speaker 11 and the arc-shaped cavity wall of the installation cavity 25, and is spaced from the first diaphragm 1131 of the main speaker 11. Such a setting ensures that the setting of the auxiliary speaker 13 does not affect the vibration and sound emission of the first diaphragm 1131, and thus does not affect the outward radiation of the low audio with weak directivity; moreover, the space size of the front cavity 117 of the main speaker 11 can be reduced by the auxiliary speaker 13, effectively alleviating the sound cancellation phenomenon caused by the multiple reflections of the medium and high frequency sound waves with shorter wavelengths emitted by the main speaker 11 in the front cavity 117; at the same time, the medium and high frequency sounds emitted by the auxiliary speaker 13 can make up for the medium and high frequency sounds lost by the main speaker 11 due to the front cavity 117 effect, playing a role in superimposing and compensating the medium and high frequency sounds, so that the sounds played by the speaker 100 include all frequency bands of medium, high and low, ensuring the sound analysis and restoration degree and the richness of the sound quality of the speaker 100.
[0067] At the same time, since the auxiliary speaker 13 can be used to superimpose and compensate the medium and high frequency sounds to ensure the playback effect of the medium and high frequency sounds, the main speaker 11 can then be more inclined to play low frequency sounds, further improving the low frequency effect of the speaker 100, better restoring the sound, and improving the sound quality of the speaker 100. That is to say, in the technical solution of the present invention, by combining the main speaker 11 and the auxiliary speaker 13 to form the speaker module 10, the playback effect of the speaker 100 in the medium and high frequency bands can be better improved, the richness of the medium and high frequencies can be increased, the sound field of the speaker 100 can be made more open, and the clarity of the sound quality can be improved at the same time, thereby improving the richness of the sound quality and the analysis and restoration degree of the speaker 100, and enhancing the user's auditory experience.
[0068] Please refer to Figure 1 and Figure 6, in some embodiments of the speaker 100 of the present invention, the auxiliary speaker 13 is a piezoelectric speaker.
[0069] In this embodiment, the auxiliary speaker 13 is a piezoelectric speaker. Among them, the second diaphragm 133 of the piezoelectric speaker includes a vibrating piece 1331 and a piezoelectric piece 1333. The vibrating piece 1331 can be, but is not limited to, a metal sheet, a piezoelectric ceramic sheet, a film material, etc., which is not limited here. When it vibrates, it will drive the air to vibrate and generate sound; the piezoelectric piece 1333 is a sheet-like structure made of piezoelectric material, which can be piezoelectric ceramic, polyvinylidene fluoride and other materials. It is attached to one side surface of the vibrating piece 1331 and is electrically connected to the main board 30 of the speaker 100 to receive the electrical signal output by the main board 30, so that the electric field around the piezoelectric piece 1333 changes to drive the piezoelectric piece 1333 to generate deformation. At this time, the piezoelectric piece 1333 will expand or contract under the action of the electric field, thereby driving the vibrating piece 1331 to vibrate and generate sound. For example, when the piezoelectric piece 1333 is laminated on the side surface of the vibrating piece 1331 facing away from the main speaker 11, if the piezoelectric piece 1333 expands, the vibrating piece 1331 bends away from the speaker, and if the piezoelectric piece 1333 contracts, the vibrating piece 1331 will bend towards the speaker. In this way, only by frequently changing the electric field of the piezoelectric piece 1333, the piezoelectric piece 1333 can drive the vibrating piece 1331 to vibrate back and forth to generate sound. The overall structure of the piezoelectric speaker is small, and it has good mid-high frequency characteristics, which can better compensate the mid-high frequencies of the main speaker 11 and improve the sound quality of the speaker 100.
[0070] Please refer to Figure 2 and Figure 5 , in some embodiments of the speaker module 10 of the present invention, the piezoelectric speaker includes:
[0071] An installation frame 131, the installation frame 131 is erected in front of the first diaphragm 1131 and is spaced from the first diaphragm 1131. The installation frame 131 is provided with a hollow hole 1315, and the hollow hole 1315 corresponds to the first diaphragm 1131; and
[0072] A second diaphragm 133, the second diaphragm 133 is embedded in the hollow hole 1315 and is disposed opposite to the first diaphragm 1131.
[0073] In this embodiment, the piezoelectric speaker includes a mounting frame 131 and a second diaphragm 133. The mounting frame 131 provides a mounting base for the second diaphragm 133. The second diaphragm 133 is embedded in the hollow hole 1315 of the mounting frame 131. The hollow hole 1315 is used to avoid interfering with the second diaphragm 133 when it vibrates, so as not to affect the vibration of the second diaphragm 133. With this arrangement, the piezoelectric speaker can be assembled first and then the mounting frame 131 can be fixedly connected to the main speaker 11, so that the second diaphragm 133 is disposed in front of the first diaphragm 1131 and opposite to the first diaphragm 1131, and the assembly is relatively simple.
[0074] Please refer to Figure 1 、 Figure 5 and Figure 6 , in some embodiments of the speaker module 10 of the present invention, the mounting frame 131 includes:
[0075] A main body portion 1311, which is disposed in front of the first diaphragm 1131 and is provided with the hollow hole 1315; and
[0076] A connecting portion 1313, which extends from the main body portion 1311 to the outside of the first diaphragm 1131 and is fixedly connected to the main speaker 11.
[0077] In this embodiment, the mounting frame 131 includes a main body portion 1311 and a connecting portion 1313. The main body portion 1311 is disposed in front of the first diaphragm 1131 of the main speaker 11 and is provided with the aforementioned hollow hole 1315. The connecting portion 1313 extends from the main body portion 1311 to the outside of the first diaphragm 1131 to be fixedly connected to the main speaker 11. It can be connected to the chassis 1133 of the speaker unit 113. When the main speaker 11 is provided with an inner shell 111, it can also be fixed to the inner shell 111, which is not limited herein. With this arrangement, the main body portion 1311 can be suspended in front of the first diaphragm 1131 and spaced from the first diaphragm 1131, so as to avoid affecting the vibration and sound emission of the first diaphragm 1131 of the main speaker 11 and the propagation of low-frequency sounds due to the arrangement of the auxiliary speaker 13. Among them, a plurality of connecting portions 1313 can be provided, and the plurality of connecting portions 1313 are spaced along the circumferential direction of the main body portion 1311, so as to improve the connection structure stability between the main speaker 11 and the auxiliary speaker 13.
[0078] Please refer to Figures 2 to 4 , in some embodiments of the speaker module 10 of the present invention, the main speaker 11 includes:
[0079] An inner shell 111, in which a sound cavity 1111 is formed, and the inner shell 111 is provided with a mounting opening communicating with the sound cavity 1111; and
[0080] The loudspeaker unit 113, the loudspeaker unit 113 has a chassis 1133 and the first diaphragm 1131, the chassis 1133 is inserted into the mounting opening to close the sound cavity 1111, the chassis 1133 is provided with a cavity with an opening facing outside the mounting opening and is provided with a pressure relief hole 1135 communicating the cavity and the sound cavity 1111, and the first diaphragm 1131 covers the opening of the cavity;
[0081] Wherein, both the connecting portion 1313 and the chassis 1133 are fixed to the inner shell 111.
[0082] In this embodiment, the main loudspeaker 11 includes an inner shell 111 and a loudspeaker unit 113. The inner shell 111 is fixed in the mounting cavity 25 and fixedly connected to the housing 20. A sound cavity 1111 is formed inside the inner shell 111. The inner shell 111 is provided with a mounting opening communicating with the sound cavity 1111. The mounting opening is used to mount and fix the loudspeaker unit 113. The loudspeaker unit 113 generally includes components such as a chassis 1133, a first diaphragm 1131, a voice coil, a magnet, a surround, and a dust cap, and is generally a moving coil loudspeaker. The loudspeaker unit 113 is mounted on the mounting opening of the inner shell 111, and at least part of the chassis 1133 is inserted into the mounting opening, so that the first diaphragm 1131 faces outside the mounting opening. At the same time, a pressure relief hole 1135 communicating the rear cavity of the loudspeaker unit 113 and the sound cavity 1111 is provided on the chassis 1133. With such a setting, the rear sound cavity 1111 of the loudspeaker unit 113 can be increased through the sound cavity 1111 of the inner shell 111, the low-frequency sound effect of the loudspeaker unit 113 can be improved, the low-frequency sound effect is made more mellow and full, the reduction degree of the low-frequency sound effect is improved, and thus the sound quality of the speaker 100 is improved.
[0083] Further, when the sound cavity 1111 is completely closed, the main loudspeaker 11 forms a structure similar to that of a closed speaker 100. When the main loudspeaker is powered on to make the first diaphragm 1131 vibrate and emit sound, the pressure change in the sound cavity 1111 can drive the first diaphragm 1131 to quickly reset in response to a continuously changing electrical signal. For example, when the first diaphragm 1131 moves toward the sound cavity 1111 side, the pressure in the sound cavity 1111 increases, thereby generating a repulsive force on the first diaphragm 1131, driving the first diaphragm 1131 to quickly move outward and reset. When the first diaphragm 1131 moves toward the outside of the sound cavity 1111, the pressure in the sound cavity 1111 decreases, thereby generating an attractive force on the first diaphragm 1131, driving the first diaphragm 1131 to quickly move inward and reset; at this time, the first diaphragm 1131 can quickly respond to subsequent electrical signals to vibrate according to subsequent electrical signals, improving the instantaneous characteristics of the main loudspeaker 11.
[0084] In this embodiment, the connection part 1313 and the basin frame 1133 are both fixed to the inner shell 111. They can be connected to the inner shell 111 separately, or the connection part 1313, the basin frame 1133 and the inner shell 111 can be connected and fixed together as in the following embodiment, which is not limited here.
[0085] Please refer to Figure 4 In some embodiments of the speaker module 10 of the present invention, the basin frame 1133 includes:
[0086] A basin frame body 1133a, wherein the basin frame body 1133a is inserted into the installation opening and the basin frame body 1133a is provided with the receiving cavity; and
[0087] The border 1133b is arranged around the basin frame body 1133a, and is arranged on the outer wall of the inner shell 111, and is arranged around the installation opening. The connecting portion 1313 is located on the side of the border 1133b away from the inner shell 111, and is connected to the border 1133b and the inner shell 111.
[0088] In this embodiment, the basin frame 1133 of the speaker unit 113 includes a basin frame body 1133a and a surrounding edge 1133b. The basin frame body 1133a is inserted into the installation opening. The basin frame body 1133a is provided with a cavity opening toward the outside of the installation opening, and a pressure relief hole 1135 is provided to connect the cavity with the sound cavity 1111 of the inner shell 111. The first diaphragm 1131 is provided in the cavity. The surrounding edge 1133b is arranged around the opening of the cavity, and is arranged outside the installation opening and fixedly connected to the inner shell 111, so as to improve the connection stability between the basin frame 1133 and the inner shell 111. At this time, the connection part 1313 of the installation frame 131 extends from the main body 1311 to the outside of the installation opening, and is arranged on the side of the surrounding edge 1133b away from the inner shell 111 and connected to the surrounding edge 1133b, so as to be fixed on the inner shell 111, so that the main body 1311 and the second diaphragm 133 are arranged in front of the first diaphragm 1131.
[0089] Further references Figure 1 and Figure 6 In some embodiments, the speaker module 10 further includes a locking member 15 , and the locking member 15 is sequentially passed through the connecting portion 1313 , the surrounding edge 1133 b and the inner shell 111 to connect the connecting portion 1313 , the surrounding edge 1133 b and the inner shell 111 .
[0090] In this embodiment, the speaker unit 113 and the piezoelectric speaker are fastened to the inner shell 111 by fastening members 15 such as screws. Among them, screw holes are provided on the inner shell 111, and the screws are sequentially inserted through the connecting portion 1313 and the surrounding edge 1133b and inserted into the screw holes to be threadedly connected with the screw holes. It can be understood that screwing has high connection stability, avoiding the vibration energy during the vibration of the first diaphragm 1131 of the speaker unit 113 or the second diaphragm 133 of the piezoelectric speaker from being transmitted to the connection positions of the connecting portion 1313, the surrounding edge 1133b and the inner shell 111, resulting in loose connection and unstable fixation of the speaker unit 113 and the piezoelectric speaker, which affects the sound production effect.
[0091] Further, in some embodiments, an extension portion 1116 protrudes from the inner wall of the inner shell 111 corresponding to the connection position, and the fastening member 15 is inserted into the extension portion 1116.
[0092] It can be understood that the setting of the extension portion 1116 can prevent the thin wall thickness of the inner shell 111 from not playing a stable connection role. By using the extension portion 1116, the depth of the screw hole can be deepened, and a longer screw can be used for screwing to improve the connection stability of the overall structure.
[0093] Please refer to Figure 5 , in some embodiments of the speaker module 10 of the present invention, the speaker module 10 further includes a shock pad 137, and the shock pad 137 is clamped between the surrounding edge 1133b and the connecting portion 1313.
[0094] It can be understood that whether it is a dynamic coil speaker, a thermal sound generating device or a piezoelectric speaker, its essence is to drive the surrounding air to vibrate and generate sound by the vibration of the first diaphragm 1131 or temperature change. In this embodiment, a shock pad 137 is provided between the surrounding edge 1133b and the connecting portion 1313 to reduce the mutual transmission of vibration energy when the main speaker 11 and the auxiliary speaker 13 vibrate and generate sound, thereby avoiding the mutual influence of vibrations between the main speaker 11 and the auxiliary speaker 13 and affecting the sound output effect of the speaker module 10. Among them, the shock pad 137 can be only padded between the surrounding edge 1133b and the connecting portion 1313. When there are multiple connecting portions 1313, a shock pad 137 is correspondingly provided at each connecting portion 1313, or the shock pad 137 can be arranged to surround the surrounding edge 1133b; in addition, the shock pad 137 can be made of elastic materials such as sponge and rubber, which is not limited here.
[0095] Please refer to Figure 1 , Figure 2 and Figure 6, in some embodiments of the loudspeaker module 10 of the present invention, the main loudspeaker 11 has a shock isolation pad 115, and the shock isolation pad 115 is attached to the outer wall of the inner shell 111 and is arranged in a circumferential manner around the installation opening. Both the surrounding edge 1133b and the connecting portion 1313 are within the surrounding range of the shock isolation pad 115.
[0096] It can be understood that when the loudspeaker module 10 is applied to the sound box 100, the main loudspeaker 11 is covered on the inner wall of the housing 20 to form a front cavity 117 of the main loudspeaker 11 in front of the first diaphragm 1131. In this embodiment, a shock isolation pad 115 arranged in a circumferential manner around the first diaphragm 1131 is provided on the main loudspeaker 11. The setting of the shock isolation pad 115 can play a role in buffering vibration, avoiding the vibration energy being transmitted to the housing 20 when the main loudspeaker 11 makes the first diaphragm 1131 vibrate and sound, driving the housing 20 to resonate and generate noise, affecting the sound quality of the sound box 100, and increasing the risk of damage to internal components. Among them, the shock isolation pad 115 can be made of elastic materials such as sponge or rubber, which can effectively absorb vibration and reduce the transmission of vibration energy.
[0097] Furthermore, the shock isolation pad 115 can also play a sealing role. In this embodiment, both the surrounding edge 1133b and the connecting portion 1313 are within the surrounding range of the shock isolation pad 115, that is, both the loudspeaker unit 113 and the piezoelectric loudspeaker are within the front cavity 117, ensuring the sealing of the front cavity 117 of the main loudspeaker 11, thereby avoiding the sound emitted by the main loudspeaker 11 and the piezoelectric loudspeaker being transmitted to the inside of the housing 20 of the sound box 100, resulting in sound resonance and affecting the sound output effect.
[0098] Combined with reference to Figure 1 and Figure 3 , in some embodiments of the loudspeaker module 10 of the present invention, an installation groove 1117 is formed on the outer wall of the inner shell 111, and the installation opening is formed on the bottom wall of the installation groove 1117. Both the surrounding edge 1133b and the connecting portion 1313 are within the installation groove 1117.
[0099] In this embodiment, an installation groove 1117 is formed on the outer wall of the inner shell 111, and the installation opening is formed at the bottom of the installation groove 1117. At this time, the surrounding edge 1133b is limited within the installation groove 1117, improving the connection stability between the loudspeaker unit 113 and the inner shell 111, thereby improving the stability of the overall structure. In some embodiments, the loudspeaker module 10 is provided with a shock isolation pad 115. At this time, the shock isolation pad 115 can be arranged in a circumferential manner around the opening of the installation groove 1117 to ensure the sealing of the front cavity 117 of the main loudspeaker 11 when the loudspeaker module 10 is applied to the sound box 100.
[0100] Combined with reference to Figures 1 to 4, in some embodiments of the loudspeaker module 10 of the present invention, one of a positioning post 1119 and a positioning hole 1139 is provided on an outer wall of the inner shell 111 facing the surrounding edge 1133b, and the other of the positioning post 1119 and the positioning hole 1139 is provided on a surface of the surrounding edge 1133b facing the inner shell 111, and the positioning post 1119 is inserted into the positioning hole 1139.
[0101] In this embodiment, a positioning structure is provided between the loudspeaker unit 113 and the inner shell 111 to improve the stability of the overall structure and the convenience of installation. Specifically, one of a positioning post 1119 and a positioning hole 1139 is provided on an outer wall of the inner shell 111 facing the surrounding edge 1133b, and the other of the positioning post 1119 and the positioning hole 1139 is provided on a surface of the surrounding edge 1133b facing the inner shell 111. The positioning post 1119 is inserted into the positioning hole 1139 to facilitate the positioning and installation of the loudspeaker unit 113 and the inner shell 111, and the mounting holes on the surrounding edge 1133b and the inner shell 111 can be aligned with each other, facilitating the installation and connection of the locking member 15.
[0102] In some embodiments of the loudspeaker module 10 of the present invention, an input end of the auxiliary loudspeaker 13 is electrically connected to a wiring member 1113 of the main loudspeaker 11 to be commonly electrically connected to a main board 30 of the sound box 100.
[0103] In this embodiment, the input end of the auxiliary loudspeaker 13 is connected to the wiring member 1113 of the main loudspeaker 11 through a conductive member 135 and then electrically connected to the main board 30. Specifically, in order to form a complete circuit, positive and negative electrodes for electrical connection are provided on the auxiliary loudspeaker 13 to form an input end for receiving an electrical signal. The wiring member 1113 on the main loudspeaker 11 also includes positive and negative terminals. The positive and negative electrodes of the auxiliary loudspeaker 13 are electrically connected to the positive and negative terminals on the main loudspeaker 11 through the conductive member 135 and then simultaneously electrically connected to the main board 30, so that the main board 30 simultaneously sends the same electrical signal to the main loudspeaker 11 and the auxiliary loudspeaker 13, ensuring that the medium and high frequencies reproduced by the auxiliary loudspeaker 13 are in the same phase as the medium and high frequencies reproduced by the main loudspeaker 11, effectively improving the superimposed effect of the medium and high frequencies of the auxiliary loudspeaker 13 and the main loudspeaker 11, and improving the sound quality of the sound box 100.
[0104] Combined with reference to Figures 1 to 6 , in some embodiments of the loudspeaker module 10 of the present invention, a wiring member 1113 is provided inside the inner shell 111, the wiring member 1113 penetrates out of the inner shell 111, the loudspeaker unit 113 has a wiring terminal 1137 exposed on an outer surface of the chassis 1133, and the wiring terminal 1137 is electrically connected to the wiring member 1113;
[0105] The piezoelectric loudspeaker has a conductive member 135, and the conductive member 135 is electrically connected to the wiring member 1113.
[0106] In this embodiment, a wiring member 1113 is provided on the inner shell 111. The wiring member 1113 penetrates through the wall of the inner shell 111 and is electrically connected to the wiring terminal 1137 of the speaker unit 113. The specific position of the wiring member 1113 on the inner shell 111 can be set according to the actual wiring position. The wiring member 1113 is used to be electrically connected to the main board 30 of the speaker 100, facilitating the connection between the main speaker 11 and the main board 30 of the speaker 100. For example, in some embodiments, when the speaker module 10 is applied to the speaker 100, the main board 30 of the speaker 100 is arranged below the inner shell 111. At this time, the wiring member 1113 can be arranged on the bottom wall of the inner shell 111 to directly contact the output end on the main board 30 during installation, reducing the application of connecting components such as wires and improving the installation convenience.
[0107] Meanwhile, the conductive member 135 for receiving an electrical signal on the piezoelectric speaker is electrically connected to the wiring member 1113. With this arrangement, when the wiring member 1113 of the inner shell 111 is electrically connected to the main board 30 of the speaker 100 to receive an electrical signal, the electrical signal is simultaneously transmitted to the speaker unit 113 and the piezoelectric speaker, ensuring that the mid-high frequencies reproduced by the piezoelectric speaker are in the same phase as the mid-high frequencies reproduced by the main speaker 11, effectively improving the mid-high frequency stacking effect of the piezoelectric speaker and the main speaker 11 and enhancing the sound quality of the speaker 100. The conductive member 135 can be a wire or a flexible circuit board, which is not limited herein.
[0108] It should be noted that in this embodiment, the conductive member 135 is electrically connected to the wiring member 1113, which can be such that Figure 6 in the illustrated embodiment, the conductive member 135 extends along the outer wall of the inner shell 111 to the wiring member 1113 and is directly connected to the wiring member 1113, or in the following embodiment, the conductive member 135 penetrates into the inner shell 111 and is connected to the wiring terminal 1137 of the speaker unit 113, and is electrically connected to the wiring member 1113 via the wiring terminal 1137, which is not limited herein.
[0109] Please refer to Figures 1 to 5 , in some embodiments of the speaker module 10 of the present invention, the conductive member 135 penetrates into the sound cavity 1111 from outside the inner shell 111 and is connected to the wiring terminal 1137.
[0110] In this embodiment, the conductive member 135 passes through the outer wall of the inner shell 111 from the outside and is inserted into the sound cavity 1111 of the inner shell 111, and is connected to the terminal 1137 of the speaker unit 113, and is electrically connected to the wiring member 1113 via the terminal 1137. With this arrangement, it can not only protect the conductive member 135, but also only make the conductive member 135 extend to the position of the terminal 1137 without extending to the position of the wiring member 1113, shortening the length of the conductive member 135 and reducing the material usage.
[0111] With reference to Figure 1 and Figure 3 , in some embodiments of the speaker module 10 of the present invention, the inner shell 111 is provided with an insertion hole 1115 communicating the outside and the sound cavity 1111, the conductive member 135 passes through the insertion hole 1115, and a sealing material is filled between the conductive member 135 and the hole wall of the insertion hole 1115.
[0112] In this embodiment, the inner shell 111 is provided with an insertion hole 1115 communicating the outside and the sound cavity 1111, so that the conductive member 135 passes through the insertion hole 1115 and enters the inside of the sound cavity 1111 to be electrically connected to the conductive terminal of the speaker unit 113. At the same time, a sealing material is filled between the hole wall of the insertion hole 1115 and the conductive member 135 to maintain the airtightness of the sound cavity 1111, avoid gas leakage in the sound cavity 1111 from affecting the bass performance of the main speaker 11, and also avoid affecting the reset speed of the first diaphragm 1131 due to the incomplete closure of the sound cavity 1111 and affecting the instantaneous characteristics of the main speaker 11. Among them, the sealing material can be sealant, and the sealant has good fluidity, can fully fill the gap between the conductive member 135 and the hole wall of the insertion hole 1115, and can also play a role in fixing the conductive member 135, avoiding the conductive member 135 from vibrating along with the vibration of the main speaker 11 or the auxiliary speaker 13 or the vibration of the surrounding air, resulting in mutual friction and wear between the conductive member 135 and the hole wall of the insertion hole 1115, thereby improving the use safety of the speaker module 10; of course, the sealing material can also be a sealing ring or other filling materials, which is not limited herein.
[0113] In some embodiments, the chassis 1133 of the speaker unit 113 is provided with a peripheral edge 1133b to be mounted on the outer edge of the mounting opening. At this time, the through hole can penetrate the peripheral edge 1133b of the chassis 1133 and the side wall of the inner shell 111, and the conductive member 135 passes through the peripheral edge 1133b of the chassis 1133 and the side wall of the inner shell 111, which can also play a role in the overall structural stability.
[0114] Please refer to Figure 1 and Figure 6, in some embodiments of the speaker module 10 of the present invention, the second diaphragm 133 covers the surface of the mounting frame 131 facing the first diaphragm 1131, and the cross-sectional area of the hollow hole 1315 gradually expands in a direction away from the first diaphragm 1131.
[0115] In this embodiment, the second diaphragm 133 covers the surface of the mounting frame 131 facing the main speaker 11, and at the same time, the cross-sectional area of the hollow hole 1315 on the mounting frame 131 gradually expands in a direction away from the main speaker 11, that is, the mounting frame 131 is similar to a horn or trumpet-shaped structure. At this time, the mounting frame 131 can play the role of a loudspeaker to a certain extent to increase the sound pressure of the sound emitted by the second diaphragm 133 and improve the clarity of the sound. In some embodiments, through holes 1335 for the mid-high frequency sound of the speaker to pass through are formed on the second diaphragm 133. At this time, the horn-shaped structure of the mounting frame 131 can also play a role in amplifying the mid-high frequency sound of the main speaker 11.
[0116] Please refer to Figure 1 and Figure 6 , in some embodiments of the speaker module 10 of the present invention, through holes 1335 are formed in the second diaphragm 133, and the through holes 1335 are arranged corresponding to the first diaphragm 1131.
[0117] In this embodiment, the first diaphragm 1131 of the main speaker 11 is generally in an inverted conical structure, including a central part opposite to the second diaphragm 133 of the piezoelectric speaker and an edge part arranged in a conical surface surrounding the central part. It can be understood that in the main speaker 11, the voice coil is connected to the edge of the central part, and the central part is closer to the voice coil. Due to the partition vibration effect, at this time, the central part is more inclined to emit mid-high frequency sounds when vibrating, while the edge part is more inclined to emit low-frequency sound waves when vibrating. The mid-high frequency sounds emitted by the central part will converge in the middle front of the main speaker 11. At this time, by forming through holes 1335 in the second diaphragm 133 of the piezoelectric speaker, the mid-high frequency sounds of the main speaker can pass through the through holes 1335 and radiate outward from the sound emitting holes 211, avoiding the mid-high frequency sounds of the main speaker 11 being blocked by the first diaphragm 1131 of the speaker and reflected and cancelled each other, and at the same time making the mid-high frequency sounds of the speaker more concentrated and emitted outward; at this time, the mid-high frequency sounds emitted by the piezoelectric speaker can coincide with the mid-high frequency sounds emitted by the main speaker, further enhancing the mid-high frequency sound quality of the speaker box 100.
[0118] Please refer to Figure 2 , in some embodiments of the speaker module 10 of the present invention, the second diaphragm 133 includes a vibrating piece 1331 and at least one piezoelectric piece 1333, and at least one of the piezoelectric pieces 1333 is stacked on the surface of the vibrating piece 1331.
[0119] It can be understood that a piezoelectric speaker mainly drives the piezoelectric sheet 1333 to deform, driving the overall vibration of the second diaphragm 133, thereby causing the surrounding air to vibrate and produce sound. Among them, the second diaphragm 133 of the piezoelectric speaker includes a vibrating piece 1331 and a piezoelectric sheet 1333. The vibrating piece 1331 can be, but is not limited to, a metal sheet, a piezoelectric ceramic sheet, a film material, etc., which is not limited here. When it vibrates, it will drive the air to vibrate and produce sound; the piezoelectric sheet 1333 is a sheet structure made of piezoelectric material, which can be materials such as piezoelectric ceramics and polyvinylidene fluoride. It is attached to one side surface of the vibrating piece 1331 and electrically connected to the main board 30 of the speaker 100 to receive the electrical signal output by the main board 30, so that the electric field around the piezoelectric sheet 1333 changes, driving the piezoelectric sheet 1333 to deform. At this time, the piezoelectric sheet 1333 will expand or contract under the action of the electric field, thereby driving the vibrating piece 1331 to vibrate and produce sound. For example, when the piezoelectric sheet 1333 is stacked on the side surface of the vibrating piece 1331 facing away from the main speaker 11, if the piezoelectric sheet 1333 expands, the vibrating piece 1331 bends away from the speaker, and if the piezoelectric sheet 1333 contracts, the vibrating piece 1331 will bend towards the speaker. In this way, only by frequently changing the electric field of the piezoelectric sheet 1333, the piezoelectric sheet 1333 can drive the vibrating piece 1331 to vibrate reciprocally and produce sound.
[0120] Further, in some embodiments, the number of piezoelectric sheets 1333 is greater than one. At this time, several piezoelectric sheets 1333 are stacked on the surface of the vibrating piece 1331. The setting of multiple piezoelectric sheets 1333 can improve the rigidity of the vibrating piece 1331, improve the low-frequency performance of the piezoelectric speaker, reduce distortion, so that the sound quality effect of the piezoelectric speaker is better. It should be noted that in this embodiment, several piezoelectric sheets 1333 can be arranged on the same side surface of the vibrating piece 1331, or can be arranged on different surfaces of the vibrating piece 1331. When several piezoelectric sheets 1333 are arranged on different surfaces of the vibrating piece 1331, it is only necessary to make the electric fields of the piezoelectric sheets 1333 on both side surfaces opposite, which is not limited here.
[0121] In some embodiments, the vibrating piece 1331 is connected to the mounting frame 131 through an adhesive.
[0122] In this embodiment, when the vibrating piece 1331 covers the hollow hole 1315 of the mounting frame 131, it is bonded to the mounting frame 131 through an adhesive. The connection structure is simple and convenient for assembly.
[0123] In some embodiments, a glue groove is formed on the surface of the mounting frame 131 facing the vibrating piece 1331. The glue groove extends along the circumference of the hollow hole 1315, and the adhesive is arranged in the glue groove.
[0124] In this embodiment, the surface of the mounting frame 131 facing the diaphragm 1331 is provided with a glue groove for filling the adhesive. With this arrangement, when bonding the diaphragm 1331 to the mounting frame 131, the adhesive can be first injected into the glue groove. The glue groove can prevent the adhesive from flowing to other positions and affecting the bonding of the diaphragm 1331. If the adhesive flows to the middle of the diaphragm 1331, it will also affect the vibration ability of the diaphragm 1331 and the electro-acoustic conversion characteristics.
[0125] Further referring to Figure 1 and Figure 5 In some embodiments, the mounting frame 131 is provided with a limiting groove 1317, and one end of the conductive member 135 is disposed in the limiting groove 1317 and electrically connected to the piezoelectric sheet 1333.
[0126] In this embodiment, the piezoelectric sheet 1333 of the second diaphragm 133 is attached to the surface of the diaphragm 1331 facing the hollow hole 1315 and is located within the hollow hole 1315. At the same time, a limiting groove 1317 is provided on the mounting frame 131, and the limiting groove 1317 communicates with the hollow hole 1315, so that one end of the conductive member 135 is limited in the limiting groove 1317 and electrically connected to the piezoelectric sheet 1333. The provision of the limiting groove 1317 can limit the conductive member 135, improve the position stability of the conductive member 135 and the connection stability between the conductive member 135 and the piezoelectric sheet 1333.
[0127] Please refer to Figures 7 to 10 The present invention also provides a speaker 100, which includes a housing 20 and the speaker module 10 as described in any one of the foregoing. An installation cavity 25 is formed in the housing 20. Taking the main speaker 20 as a reference system, at least part of the cavity wall of the installation cavity 25 covered by the main speaker 20 is a concave arc surface, and a sound hole 211 communicating with the outside and the installation cavity 25 is provided on the concave arc surface. The speaker module 10 is disposed in the installation cavity 25, and the main speaker 11 covers the concave arc surface and encloses a front cavity 117 of the main speaker 11 with the concave arc surface. The technical solution proposed in this application can be used to improve the problem of mid-high frequency attenuation caused by the front cavity 117 effect due to the too large front cavity 117 caused by the structural characteristics of the concave arc surface, and can also be applied to the problem of mid-high frequency attenuation caused by the too large front cavity 117 of the main speaker 11 due to other reasons. At this time, only the cavity wall covered by the main speaker 20 being a concave arc surface will cause the foregoing problem. The structure of the cavity wall outside the main speaker 20 is not limited, and it can all be a concave arc surface, or can be set accordingly according to the internal component structure layout. At the same time, the external shape of the housing 20 can be spherical, square, cylindrical, hemispherical or other shape structures, which are not limited herein.
[0128] Commonly, a main board 30 is provided in the speaker 100. Both the main speaker 11 and the auxiliary speaker 13 are electrically connected to the main board 30 to receive the electrical signals of the main board 30 for electro-acoustic conversion to emit sound, and the emitted sound can be radiated outward through the sound hole 211. Among them, the auxiliary speaker 13 can emit medium and high-frequency tones, which can be superimposed on the sound emitted by the main speaker 11 to compensate for the medium and high-frequency loss caused by the front cavity 117 effect of the main speaker 11, so that the sound played by the speaker 100 includes all frequency bands of low, medium and high, ensuring the sound analysis and restoration degree and the richness of sound quality of the speaker 100; and it can reduce the size of the front cavity 117 of the main speaker 11, so as to reduce the number of reflections of the medium and high-frequency sound emitted by the main speaker 11 in the front cavity 117, thereby reducing the cancellation loss of the sound emitted by the main speaker 11 in the front cavity 117. Due to the setting of the auxiliary speaker 13, the main speaker 11 can emit sound of all audio frequencies or only low-frequency sound, which is not limited here. When the main speaker 11 focuses on emitting low-frequency sound, the low-frequency sound effect of the speaker 100 can be improved, so that while improving the playback effect and richness of the medium and high-frequency bands, the low-frequency sound effect of the speaker 100 is optimized, further improving the richness of sound quality and the analysis and restoration degree of the speaker 100, and enhancing the user's auditory experience. Figure 11 FIG. Figure 11 is an audio comparison diagram of the speaker 100 of the present application and a conventional speaker without an auxiliary speaker 30. It can be seen that there is an obvious lack of audio in the medium and high audio frequency bands in the speaker without the auxiliary speaker 30, while the speaker of the present application with the auxiliary speaker 30 solves this problem well, so that the sound played by the speaker 100 includes all frequency bands of low, medium and high, ensuring the sound analysis and restoration degree and the richness of sound quality of the speaker 100.
[0129] Since the speaker 100 proposed in the present application applies all the technical solutions of all the embodiments in the foregoing speaker module 10, it has at least all the beneficial effects brought by all the foregoing technical solutions, which will not be elaborated here one by one.
[0130] Please refer to Figure 10 , in some embodiments of the speaker 100 of the present invention, the housing 20 of the speaker 100 includes a front housing 21 and a rear housing 23. The front housing 21 and the rear housing 23 are covered with each other to form the foregoing installation cavity 25. The front housing 21 and the rear housing 23 are detachably connected, which is convenient for the disassembly and assembly of the internal components of the speaker 100.
[0131] Please refer to Figure 7 and Figure 8 , in some embodiments of the speaker 100 of the present invention, a button 29 is provided on the housing 20 of the speaker 100. The button 29 is electrically connected to the main board 30 of the speaker 100. At this time, the user can input a control instruction by operating the button 29 to control the speaker 100 to perform corresponding actions according to the instruction, including adjusting the volume or switching audio, etc.
[0132] Please refer toFigure 7 , in some embodiments of the speaker 100 of the present invention, a battery is further disposed in the accommodating cavity, and the auxiliary speaker 13 and the main speaker 11 are both electrically connected to the battery assembly. Here, the battery assembly mainly functions as a power source, so that the mobile and portable function of the speaker 100 can be realized. Further, the housing 20 is further provided with a charging interface 27. The charging interface 27 penetrates through the housing 20 and is electrically connected to the battery assembly. In this way, when the power of the battery assembly is exhausted, the battery assembly can be charged by connecting a power source through the charging interface 27, so that the service life of the speaker 100 can be guaranteed without repeatedly replacing the battery.
[0133] Please refer to Figure 7 and Figure 10 , in some embodiments of the speaker 100 of the present invention, the speaker 100 further includes a mesh cloth 40, and the mesh cloth 40 covers the outer side wall of the housing 20.
[0134] In this embodiment, the outer wall of the housing 20 of the speaker 100 is covered with a mesh cloth 40. The setting of the mesh cloth 40 can play a role in blocking dust in the space, so that dust cannot enter the inside of the speaker 100, preventing the aging of the internal components of the speaker 100 and ensuring the service life of the speaker 100; at the same time, numerous dense small holes are formed on the mesh cloth 40 to avoid the setting of the mesh cloth 40 affecting the sound output and heat dissipation of the speaker 100.
[0135] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made by using the description and drawings of the present invention under the inventive concept of the present invention, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present invention.
Claims
1. A loudspeaker module, characterized in that, include: The main speaker comprises a speaker unit; the speaker unit comprises a basin frame and a first diaphragm, the basin frame is provided with an opening, and the first diaphragm cover is provided at the opening; the main speaker is a full-range speaker; and The auxiliary speaker comprises a mounting frame and a second diaphragm; the mounting frame is mounted in front of the first diaphragm and connected to the basin frame, and is provided with a hollow hole corresponding to the first diaphragm; the second diaphragm is embedded in the hollow hole to be arranged opposite to the first diaphragm; the auxiliary speaker is used to emit mid-high frequencies.
2. The loudspeaker module according to claim 1, characterized in that, The auxiliary speaker is a piezoelectric speaker.
3. The loudspeaker module according to claim 2, wherein, The mounting frame comprises: a main body, the main body being arranged in front of the first diaphragm and having the hollow hole; and A connecting portion extends from the main body toward the outside of the first diaphragm and is fixedly connected to the main speaker.
4. The loudspeaker module according to claim 3, characterized in that, The main speaker further comprises an inner shell; a sound cavity is formed in the inner shell, and a mounting opening communicating with the sound cavity is provided in the inner shell; the basin frame is inserted into the mounting opening to close the sound cavity, the basin frame is provided with a receiving cavity and a pressure relief hole communicating with the receiving cavity and the sound cavity is provided; the opening faces outward from the mounting opening and communicates with the receiving cavity; Wherein, the connecting portion and the basin frame are both fixed to the inner shell.
5. The loudspeaker module according to claim 4, wherein The basin frame comprises: a basin frame body, the basin frame body being inserted into the installation opening and the basin frame body being provided with the receiving cavity; and The surrounding edge is arranged around the basin frame body, and is arranged on the outer wall of the inner shell, and is arranged around the installation opening. The connecting part is located on the side of the surrounding edge away from the inner shell, and is connected to the surrounding edge and the inner shell.
6. The loudspeaker module according to claim 5, wherein The speaker module further includes a locking piece, which is sequentially penetrated through the connecting portion, the surrounding edge, and the inner shell to connect the connecting portion, the surrounding edge, and the inner shell; And / or, the speaker module further comprises a shock absorbing pad, wherein the shock absorbing pad is sandwiched between the surrounding edge and the connecting portion; And / or, the main speaker has a seismic isolation pad, the seismic isolation pad is attached to the outer wall of the inner shell and is arranged around the circumference of the installation opening, and the surrounding edge and the connecting portion are both located within the surrounding range of the seismic isolation pad; And / or, the outer wall of the inner shell is provided with a mounting groove, the bottom wall of the mounting groove is provided with the mounting opening, and the surrounding edge and the connecting portion are both located in the mounting groove; And / or, the outer wall of the inner shell facing the surrounding edge is provided with one of a positioning post and a positioning hole, and the surface of the surrounding edge facing the inner shell is provided with the other of a positioning post and a positioning hole, and the positioning post is inserted into the positioning hole.
7. The speaker module according to claim 4, wherein A wiring member is arranged in the inner shell, and the wiring member is extended out of the inner shell. The speaker unit has a wiring terminal exposed on the outer surface of the basin frame, and the wiring terminal is electrically connected to the wiring member; The piezoelectric speaker has a conductive member electrically connected to the wiring member.
8. The loudspeaker module according to claim 7, wherein, The conductive member penetrates into the sound cavity from outside the inner shell and is connected to the wiring terminal.
9. The speaker module according to claim 8, wherein The inner shell is provided with an insertion hole communicating with the outside and the sound cavity, the conductive member is inserted through the insertion hole, and a sealing material is filled between the conductive member and the hole wall of the insertion hole.
10. The loudspeaker module according to claim 2, wherein, The second diaphragm covers the surface of the mounting frame facing the first diaphragm, and the cross-sectional area of the hollow hole gradually expands in a direction away from the first diaphragm; And / or, the second diaphragm is provided with a through hole, and the through hole is arranged corresponding to the first diaphragm; And / or, the second diaphragm includes a vibrating piece and at least one piezoelectric piece, and at least one of the piezoelectric pieces is laminated on the surface of the vibrating piece.
11. A speaker, characterized in that, The sound box includes: A housing, an installation cavity is formed in the housing, at least part of the cavity wall of the installation cavity is a concave arc surface, and a sound hole communicating with the outside and the installation cavity is opened on the concave arc surface; and The speaker module according to any one of claims 1 to 10, the speaker module is arranged in the installation cavity, and the main speaker covers the concave arc surface and encloses a front cavity of the main speaker with the concave arc surface.
Citation Information
Patent Citations
Double-vibrating-diaphragm speaker module
CN103297904A
Loudspeaker and electronic equipment
CN215991191U