Vapor Chamber

Abstract

The present invention discloses a heat spreader, which includes: a first cover plate; a second cover plate, the second cover plate being relatively covered with the first cover plate, a receiving cavity being formed between the first cover plate and the second cover plate, the first cover plate being provided with a storage groove on one side of the receiving cavity; a capillary structure, the capillary structure being provided in the receiving cavity and covering the storage groove; and a working medium, the working medium filling the receiving cavity. The heat spreader of the present invention has a storage groove provided on the first cover plate, and the capillary structure is covered on the storage groove, so that the working medium filling the receiving cavity will be absorbed by the capillary structure in a liquid state and flow into the storage groove, thereby increasing the storage capacity of the working medium in the receiving cavity and increasing the saturation capacity of the working medium; thereby, the pores of the capillary structure can be appropriately reduced to increase the capillary force used to drive the flow of the working medium, so that the working medium can perform heat exchange circulation faster, thereby improving the heat dissipation efficiency of the heat spreader and ensuring the heat dissipation effect of the heat spreader.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a temperature homogenizing plate. Background Art

[0002] With the advancement of technology, the computing speed of electronic devices is getting faster and faster, while their size and weight are also decreasing. This has led to the development of electronic devices towards thinner and smaller designs. At the same time, with the development of electronic technology, the performance of electronic components has also increased. As a result, the heat generated by electronic components per unit time is increasing.

[0003] Therefore, in order to prevent the electronic device from overheating and causing the electronic components to have reduced performance or crash, a common heat dissipation method is to install a heat sink above the electronic components. In this way, the heat generated by the electronic components can be dissipated with the help of the heat sink, thereby reducing the temperature of the electronic components. With the continuous development of technology, the heat dissipation technology of electronic devices is constantly updated and iterated, from graphite heat dissipation, metal backplane, frame heat dissipation, thermal conductive gel heat dissipation, heat pipe heat dissipation, to heat spreader heat dissipation and other heat dissipation technologies. In the current heat dissipation solutions for electronic devices, heat spreaders, as a new way to solve the heat dissipation problem, have become a new hot spot in current heat dissipation technology, especially the application of heat spreaders in future 5G commercial products.

[0004] Specifically, a vapor chamber is a heat dissipation device whose working principle is similar to that of a heat pipe. The difference is that the heat conduction of a heat pipe is a one-dimensional linear transfer, while the heat conduction of a vapor chamber is a two-dimensional transfer above. Structurally, the vapor chamber includes a lower plate, a capillary structure, a vapor channel, and an upper plate stacked in sequence. The capillary structure and the vapor channel serve as the working chamber of the vapor chamber, and the working chamber is filled with a working medium. When the lower plate comes into contact with a heat source, such as a heat-generating electronic component, the working medium contained in the capillary structure of the working chamber will be converted from liquid to gas and transferred toward the upper plate through the vapor channel. Finally, after the heat energy is transferred out through the area on the vapor chamber other than the area in contact with the heat source or the heat dissipation structure on the outside of the vapor chamber, such as the fins, the working medium is re-condensed into liquid and returns to the capillary structure of the working chamber, starting the next cycle.

[0005] In order to increase the flow rate of the working medium, the heat spreader in the related technology will increase the capillary force of the capillary structure by reducing the pores of the capillary structure, but this will reduce the liquid storage capacity of the capillary structure, resulting in a smaller saturation amount of the working medium, which reduces the heat dissipation effect of the heat spreader. Summary of the Invention

[0006] The main purpose of the present invention is to provide a heat spreader to solve the technical problem of how to improve the heat dissipation effect of the heat spreader.

[0007] To achieve the above objectives, the present invention provides a temperature distribution plate comprising:

[0008] a first cover plate;

[0009] a second cover plate, the second cover plate being relatively covered with the first cover plate, a receiving cavity being formed between the first cover plate and the second cover plate, and a storage slot being provided on one side of the first cover plate within the receiving cavity;

[0010] a capillary structure, the capillary structure being disposed in the accommodating cavity and covering the storage slot;

[0011] A working medium is filled in the accommodating cavity.

[0012] Optionally, the storage slot extends along the length direction of the first cover plate.

[0013] Optionally, there are multiple storage slots, and the multiple storage slots are arranged at intervals along the width direction of the first cover plate.

[0014] Optionally, the capillary structure includes a heat source contact portion and a plurality of capillary lines connected to the heat source contact portion, a gas channel is formed between two adjacent capillary lines, and the storage groove includes a first groove section and a second groove section, the first groove section corresponds to the heat source contact portion, and the second groove section corresponds to the capillary line.

[0015] Optionally, the heat source contact portion is located in the middle of the capillary structure, and the plurality of capillary lines and the gas channels are radially arranged with the heat source contact portion as the center.

[0016] Optionally, the first cover plate is further provided with a gas groove, the gas groove is located between two adjacent storage grooves, and the gas groove is connected to the gas channel.

[0017] Optionally, the depth of the storage groove is not less than 0.1 μm and does not exceed 100 μm.

[0018] Optionally, one surface of the second cover plate in the accommodating cavity abuts against the capillary structure.

[0019] Optionally, the capillary structure is a sintered body formed by sintering metal particles.

[0020] Optionally, the capillary structure is fixed to the first cover plate by sintering.

[0021] Optionally, the storage groove is formed by an etching process.

[0022] The present invention also provides a sintering jig for manufacturing the above-mentioned temperature-isolating plate. The sintering jig includes a plate body and at least one sintering portion formed on the plate body. Each sintering portion is provided with a shaped groove corresponding to the pattern of the capillary structure to be formed.

[0023] The heat spreader of the present invention has a storage groove on the second cover plate, and a capillary structure is provided on the storage groove, so that the working medium filled in the accommodating cavity will be absorbed by the capillary structure in a liquid state and flow into the storage groove, thereby increasing the storage capacity of the working medium in the accommodating cavity to increase the saturation amount of the working medium; thus, the pores of the capillary structure can be appropriately reduced to increase the capillary force used to drive the flow of the working medium, so that the working medium can circulate heat exchange faster, thereby improving the heat dissipation efficiency of the heat spreader and ensuring the heat dissipation effect of the heat spreader. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0025] Figure 1 This is a schematic structural diagram of an embodiment of a temperature vapor chamber according to the present invention;

[0026] Figure 2 This is an exploded view of the structure of an embodiment of a temperature vapor chamber according to the present invention;

[0027] Figure 3 Schematic diagram of the structure of an embodiment of the capillary structure of the present invention;

[0028] Figure 4 This is a structural diagram of an embodiment of the first cover plate of the present invention;

[0029] Figure 5 Schematic cross-sectional view of an embodiment of a temperature vapor chamber according to the present invention;

[0030] Figure 6 for Figure 5 A partial enlarged view of point A in the middle;

[0031] Figure 7 Schematic diagram of the structure of a sintering jig according to an embodiment of the present invention;

[0032] Figure 8 Flowchart of a method for manufacturing a vapor chamber according to an embodiment of the present invention.

[0033] Description of Figure Numbers:

[0034]

[0035]

[0036] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0039] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing in the full text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0040] The present invention provides a temperature vapor chamber 100 .

[0041] In the embodiment of the present invention, Figures 1 to 7 As shown, the temperature equalizing plate 100 includes: a first cover plate 20; a second cover plate 10, wherein the second cover plate 10 is relatively covered with the first cover plate 20, and a receiving cavity is formed between the first cover plate 20 and the second cover plate 10, and a storage groove 21 is opened on one side of the first cover plate 20 in the receiving cavity; a capillary structure 30, wherein the capillary structure 30 is arranged in the receiving cavity and covers the storage groove 21; and a working medium, wherein the working medium is filled in the receiving cavity.

[0042] The first cover plate 20 and the second cover plate 10 can be circular or square, without any limitation here, as long as the first cover plate 20 and the second cover plate 10 can cover each other. The first cover plate 20 and the second cover plate 10 can each have a corresponding groove. When the first cover plate 20 and the second cover plate 10 are covered, the two grooves enclose a storage chamber. It is understood that in order to prevent leakage of the working medium, the storage chamber should be configured as a sealed chamber, that is, the first cover plate 20 and the second cover plate 10 should be sealed and covered. Specifically, the first cover plate 20 and the second cover plate 10 can be fixed by a welding process to achieve a fixed cover and also seal the storage chamber. The storage slot 21 is used to increase the storage capacity of the working medium in the storage chamber, thereby increasing the upper limit of the single heat exchange of the working medium, thereby improving the heat dissipation effect of the temperature vapor chamber 100. The storage slot 21 can be square or strip-shaped, without any limitation here; the number of storage slots 21 can be one or more, without any limitation here.

[0043] The capillary structure 30 can cause the liquid working medium to produce a capillary phenomenon, that is, it generates a capillary force on the liquid working medium to drive the liquid working medium to flow faster along the capillary structure 30. The capillary structure 30 can be a porous mesh structure, a micro-groove or a sintered powder structure, etc., and there is no limitation here. It only needs to have pores to generate a capillary force on the liquid working medium. After the capillary structure 30 is covered on the storage tank 21, the capillary structure 30 will close the slot of the storage tank 21, that is, the liquid working medium can only enter and exit the storage tank 21 through the capillary structure 30. When the liquid storage capacity of the capillary structure 30 is saturated, the groove wall of the storage tank 21 will generate adhesion to the liquid working medium in the capillary structure 30, so that part of the liquid working medium can flow from the capillary structure 30 to the storage tank 21. The storage tank 21 can be stamped or formed by cutting the material on the first cover plate 20, and there is no limitation here.

[0044] Because the capillary structure 30 needs to improve the storage groove 21, it will abut the first cover plate 20. Of course, the capillary structure 30 can be fixed to the first cover plate 20 during the processing process, and the fixing method is not limited. The second cover plate 10 can abut the capillary structure 30 or form a gap between it and the capillary structure 30, which is not limited here.

[0045] The working medium can be water, alcohol, or other low-boiling-point liquids. Preferably, it is a non-conductive liquid, allowing it to absorb heat from its liquid state and evaporate into a gaseous state. The vapor chamber 100 is preferably vacuum-sealed to prevent the working medium from dissipating after it becomes a gaseous state, and to prevent air from occupying the space after the working medium becomes a gaseous state, thereby compressing the space after it becomes a gaseous state and affecting heat dissipation efficiency. After the liquid working medium is filled into the chamber, it is stored in the capillary structure 30 and the storage tank 21.

[0046] When the temperature equalizing plate 100 is working, one end thereof will contact the heat source, which may be the first cover plate 20 or the second cover plate 10, and there is no restriction here. The working medium will absorb the heat from the heat source and evaporate into gas. The gas will diffuse in the accommodating cavity and flow toward the end away from the heat source. The gaseous working medium will form liquid again after contact and heat exchange with the low-temperature area of ​​the temperature equalizing plate 100 (the low-temperature area can transfer heat to the outside of the temperature equalizing plate 100 through an external heat dissipation structure). Under the action of capillary force, the liquid will re-enter the capillary structure 30 and the storage tank 21 for the next cycle of heat exchange. It can be understood that the liquid working medium in the storage tank 21 will always be affected by the capillary structure 30. As long as the liquid storage capacity of the capillary structure 30 is not saturated, the working medium of the storage tank 21 will be sucked into the capillary structure 30. Therefore, after the working medium in the part of the capillary structure 30 close to the heat source is evaporated, the part away from the heat source will replenish the liquid working medium toward the part close to the heat source, and the storage tank 21 will replenish the liquid working medium toward the capillary structure 30, thereby increasing the flow rate of the working medium and the upper limit of the heat exchange of the working medium, so as to improve the overall heat exchange efficiency of the temperature equalizing plate 100.

[0047] The heat spreader 100 of the present invention has a storage groove 21 opened on the first cover plate 20, and the capillary structure 30 is covered on the storage groove 21, so that the working medium filled in the accommodating cavity will be absorbed by the capillary structure 30 in a liquid state and flow into the storage groove 21, thereby increasing the storage amount of the working medium in the accommodating cavity to increase the saturation amount of the working medium; thus, the pores of the capillary structure 30 can be appropriately reduced to increase the capillary force used to drive the flow of the working medium, so that the working medium can circulate heat exchange faster, thereby improving the heat dissipation efficiency of the heat spreader 100 and ensuring the heat dissipation effect of the heat spreader 100.

[0048] In one embodiment, if Figure 4 As shown, the storage slot 21 extends along the length of the first cover plate 20 to increase the volume of the storage slot 21, thereby increasing the storage capacity of the working medium and further improving the heat exchange efficiency of the temperature plate 100. The storage slot 21 is set to a strip shape, which can enable the storage slot 21 to generate sufficient adhesion attraction for the working medium in the capillary structure 30 to ensure the storage effect of the storage slot 21. Specifically, as Figure 4 As shown, there are multiple storage slots 21, and the multiple storage slots 21 are spaced apart along the width direction of the first cover plate 20 to further increase the storage capacity of the working medium and improve the heat exchange efficiency.

[0049] In one embodiment, if Figures 3 to 6As shown, the capillary structure 30 includes a heat source contact portion 31 and multiple capillary lines 32 connected to the heat source contact portion 31. A gas channel 33 is formed between adjacent capillary lines 32. The storage tank 21 includes a first tank section 211 and a second tank section 212. The first tank section 211 corresponds to the heat source contact portion 31, and the second tank section 212 corresponds to the capillary lines 32. The shape and distribution of the first tank section 211 correspond to the heat source contact portion 31, while the shape and distribution of the second tank section 212 correspond to the capillary lines 32. This allows the heat source contact portion 31 and the capillary lines 32 to effectively cover the first tank section 211 and the second tank section 212, respectively. The formation of the gas channel 33 between adjacent capillary lines 32 provides more flow space for the gaseous working medium, thereby increasing the flow rate of the gaseous working medium, allowing the gaseous working medium to flow more quickly toward the condensing end of the vapor chamber 100 and improving heat exchange efficiency.

[0050] In actual use, the heat source contact portion 31 is located in the middle of the capillary structure 30, and the multiple capillary lines 32 and gas channels 33 are arranged radially with the heat source contact portion 31 as the center. The capillary lines 32 and gas channels 33 scatter outward from the heat source contact portion 31, allowing the working medium in the heat source contact portion 31 to evaporate into gas and then diffuse and flow toward the condensation area of ​​the entire vapor chamber 100. This increases the diffusion range and efficiency of the gaseous working medium, thereby improving the heat exchange efficiency when diffusing to the condensation area. Furthermore, the outward diffusion of the gaseous working medium from the heat source contact portion 31 as the center allows it to effectively contact various parts of the vapor chamber 100, thereby improving the overall effective utilization rate of the vapor chamber 100.

[0051] Specifically, if Figures 4 to 6 As shown, the first cover plate 20 is further provided with a gas groove 22, which is located between two adjacent storage grooves 21 and is interconnected with the gas channel 33. The gas groove 22 can be used to increase the width of the gas channel 33 to provide more flow space for the gaseous working medium, thereby further increasing the flow rate of the gaseous working medium, so that the gaseous working medium flows faster toward the condensing end of the temperature distribution plate 100, thereby improving heat exchange efficiency. There are multiple gas grooves 22, each of which is located between every two adjacent storage grooves 21, to cooperate with multiple gas channels 33 to further increase the flow rate of the gaseous working medium.

[0052] In one embodiment, the depth of the storage groove 21 is not less than 0.1 μm and not more than 100 μm. If the depth of the storage groove 21 is less than 0.1 μm, the volume of the storage groove 21 is too small, the amount of working medium that can be stored is too small, and the heat dissipation efficiency cannot be effectively improved. If the depth of the storage groove 21 is greater than 100 μm, the structural strength of the first cover plate 20 is affected, thereby weakening the overall structural strength of the vapor chamber 100 and reducing the structural stability of the vapor chamber 100. Furthermore, if the depth of the storage groove 21 is greater than 100 μm, the capillary force of the capillary structure 30 on the working medium is weakened, resulting in the capillary structure 30 being unable to fully absorb the working medium in the storage groove 21. Therefore, setting the depth of the storage groove 21 to 0.1 μm to 100 μm can effectively improve the heat dissipation efficiency of the vapor chamber 100 while ensuring the structural strength of the vapor chamber 100.

[0053] Specifically, the storage groove 21 is formed by an etching process, which can be dry etching, wet etching, or plasma etching, etc., and is not limited here, as long as the storage groove 21 can be etched to form the storage groove 21. The etching process can more accurately control the depth of the storage groove 21 in microns, thereby improving the processing accuracy of the storage groove 21.

[0054] In one embodiment, if Figure 6 As shown, one side of the second cover plate 10 in the accommodating cavity abuts against the capillary structure 30 to reduce the distance between the first cover plate 20 and the second cover plate 10 , thereby reducing the overall thickness of the temperature vapor chamber 100 and making the temperature vapor chamber 100 lighter and thinner.

[0055] In one embodiment, the capillary structure 30 is a sintered body formed by sintering metal particles. When sintering the capillary structure 30, the metal particles are first placed in the shaping groove of the graphite jig to obtain the capillary structure 30 of the desired shape after the sintering is completed. The capillary structure 30 formed by sintering metal particles has smaller pores and can generate a greater capillary force, thereby increasing the driving rate of the liquid working medium. Specifically, the capillary structure 30 is sintered and fixed to the second cover body to utilize the characteristics of the sintered body of the capillary structure 30 itself to make the capillary structure 30 more firmly connected to the second cover body, while simplifying the connection method between the capillary structure 30 and the second cover body, thereby improving the utilization rate of the sintering equipment.

[0056] In one embodiment, a liquid storage tank may be opened on one side of the first cover body in the accommodating cavity, and the capillary structure 30 is covered on the liquid storage tank so that the liquid storage tank also has the same effect of storing the working medium as the storage tank 21, thereby further increasing the filling of the working medium in the accommodating cavity to further improve the heat exchange efficiency.

[0057] like Figure 7As shown, the present invention also proposes a sintering jig 40 for making the temperature equalizing plate 100 as described above. The sintering jig 40 includes a plate body and at least one sintering portion formed on the plate body. Each sintering portion is provided with a shaped groove 41 corresponding to the pattern of the capillary structure to be formed.

[0058] like Figure 8 As shown, the present invention further provides a method for manufacturing a temperature vapor chamber 100, which is used to prepare the temperature vapor chamber 100 in the above embodiment. The method for manufacturing the temperature vapor chamber 100 includes the following steps:

[0059] Step S1 : providing a sintering jig 40 and a first cover plate 20 . The sintering jig 40 includes a plate body and at least one sintering portion formed on the plate body. Each sintering portion is provided with a shaped groove 41 corresponding to the pattern of the capillary structure 30 to be formed.

[0060] Specifically, if Figure 7 As shown, there are multiple sintering parts, and the multiple sintering parts are arranged in sequence on the plate body. By setting up multiple sintering parts, it is convenient to sinter multiple capillary structures 30 at the same time during subsequent sintering to improve production efficiency. For example, in some embodiments of the present invention, three sintering parts are provided on the plate body, and the sintering parts are arranged in sequence in a row.

[0061] Specifically, if Figure 7 As shown, a receiving groove for receiving the capillary structure 30 is formed on one side surface of the first cover plate 20, and a shaping area corresponding to the receiving groove is provided in the center of each sintered portion. The shaping groove 41 is formed in the shaping area, and alignment grooves surrounding the shaping area are provided on the four edges of the shaping area.

[0062] The groove wall formed by the first cover plate 20 to form the accommodating groove can be embedded in the alignment groove, and correspondingly, the shaping area can be embedded in the accommodating groove.

[0063] Step S2 , filling the shaping groove 41 with metal particles, and sintering the metal particles to shape the capillary structure 30 ; etching the storage groove 21 at the bottom of the receiving groove of the first cover plate 20 .

[0064] The metal particles are copper powder. It should be noted that in the method for manufacturing the heat spreader 100 of the present invention, the capillary structure 30 is formed by placing metal particles in a sintering jig 40 having shaped grooves 41 and sintering them. By varying the pattern of the shaped grooves 41, a complex capillary structure 30 design can be achieved, thereby enhancing the capillary force of the capillary structure 30 and maximizing the heat dissipation capability of the heat spreader 100. Furthermore, the manufacturing process is simple, with low production costs and high efficiency.

[0065] Step S3: sintering and fixing the capillary structure 30 to the first cover plate 20 .

[0066] The capillary structure 30 is correspondingly covered on the storage groove 21. Since the shaped area can be embedded in the accommodating groove, the capillary structure 30 and the storage groove 21 can be automatically aligned by simply setting the shape of the storage groove 21 to be consistent with the capillary structure 30, so that the capillary structure 30 can accurately cover the storage groove 21.

[0067] Step S4 , taking the first cover plate 20 sintered with the capillary structure 30 out of the sintering jig 40 .

[0068] Step S5 , providing a second cover plate 10 , aligning and fixing the first cover plate 20 sintered with the capillary structure 30 and the second cover plate 10 together, with the capillary structure 30 being located between the first cover plate 20 and the second cover plate 10 .

[0069] Specifically, in step S5 , the first cover plate 20 and the second cover plate 10 sintered with the capillary structure 30 are aligned and fixed together by welding.

[0070] It is worth mentioning that after the first cover plate 20 with the capillary structure 30 sintered thereon is aligned and fixed together with the second cover plate 10 in step S5, the surface of the capillary structure 30 facing away from the first cover plate 20 contacts the second cover plate 10. Except for the area in contact with the capillary structure 30, the remaining surface of the first cover plate 20 facing the second cover plate 10 is spaced apart from the surface of the second cover plate 10 facing the first cover plate 20, forming a gas channel 33 coplanar with the capillary structure 30. In other words, the temperature vapor chamber 100 manufactured using the method of the present invention is a temperature vapor chamber 100 having the capillary structure 30 and gas channel 33 coplanar, and is extremely thin.

[0071] Preferably, the thickness of the temperature homogenizing plate 100 is less than or equal to 0.25 mm.

[0072] Step S6: injecting a working medium between the first cover plate 20 and the second cover plate 10 to obtain a temperature homogenizing plate 100 .

[0073] Specifically, the working medium is in liquid state at room temperature.

[0074] Specifically, the step S6 further includes performing a vacuum heating degassing process between the first cover plate 20 and the second cover plate 10 after injecting the working medium between the first cover plate 20 and the second cover plate 10 .

[0075] It should be noted that the working process of the temperature equalizer 100 is as follows: when the first cover plate 20 comes into contact with a heat source, such as a heat-generating electronic component, the working medium contained in the capillary structure 30 and the storage tank 21 is converted from liquid to gas, and is transmitted toward the second cover plate 10 through the gas channel 33 on the same plane as the capillary structure 30. Finally, after the heat energy is transferred out through the area on the temperature equalizer 100 other than the area in contact with the heat source or the heat dissipation structure on the outside of the temperature equalizer 100, such as the fins, the working medium is re-condensed into liquid and returns to the capillary structure 30 and the storage tank 21, starting the next cycle.

[0076] The above descriptions are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present description and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A temperature equalizing plate, characterized in that: include: a first cover plate; a second cover plate, the second cover plate being relatively covered with the first cover plate, a receiving cavity being formed between the first cover plate and the second cover plate, and a storage slot being provided on one side of the first cover plate within the receiving cavity; a capillary structure, the capillary structure being disposed in the accommodating cavity and covering the storage slot; A working medium is filled in the accommodating cavity; The capillary structure includes a heat source contact portion and a plurality of capillary lines connected to the heat source contact portion, a gas channel is formed between two adjacent capillary lines, and the storage groove includes a first groove section and a second groove section, the first groove section corresponds to the heat source contact portion, and the second groove section corresponds to the capillary lines; The first cover plate is further provided with a gas groove, the gas groove being located between two adjacent storage grooves, and the gas groove being connected to the gas channel; The heat source contact portion is located in the middle of the capillary structure, and the plurality of capillary lines and the gas channels are radially arranged with the heat source contact portion as the center.

2. The temperature vapor chamber according to claim 1, wherein: The storage slot extends along a length direction of the first cover plate.

3. The temperature equalizing plate according to claim 2, wherein: There are multiple storage slots, and the multiple storage slots are spaced apart along the width direction of the first cover plate.

4. The temperature vapor chamber according to any one of claims 1 to 3, wherein: The depth of the storage groove is not less than 0.1 μm and does not exceed 100 μm.

5. The temperature vapor chamber according to any one of claims 1 to 3, wherein: One surface of the second cover plate in the accommodating cavity abuts against the capillary structure.

6. The temperature vapor chamber according to any one of claims 1 to 3, wherein: The capillary structure is a sintered body formed by sintering metal particles.

7. The temperature vapor chamber according to claim 6, wherein: The capillary structure is sintered and fixed to the first cover plate.

8. The temperature vapor chamber according to any one of claims 1 to 3, wherein: The storage groove is formed by an etching process.

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