Electronic device and control method

Abstract

The present application provides an electronic device and a control method. The first and second bodies of the electronic device can move relative to each other and be in a first state approaching each other and a second state moving away from each other. A first conductor structure and a first near-field communication chip are disposed on the first body, and a second conductor structure is disposed on the second body. In either the first or second state, the near-field communication chip can be electrically connected to at least one of the first and second conductor structures and transmit a differential excitation current. The near-field communication chip electrically connects to different conductor structures in the second and first states. Based on this, the near-field communication chip can select different conductor structures to support NFC signal transmission in different electronic device configurations, making the electronic device more adaptable to communication environments.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device and a control method. Background Art

[0002] With the development of electronic technology, electronic devices such as smartphones and tablet computers play an increasingly important role in people's daily lives and realize more and more functions, such as but not limited to the Near Field Communication (NFC) function of electronic devices.

[0003] Moreover, with the development of electronic technology, electronic devices can realize new forms such as folding, sliding, and pulling. These new forms make the environment of NFC antennas on electronic devices more complex, and NFC antennas cannot adapt to the changes in different forms of electronic devices. Summary of the Invention

[0004] The present application provides an electronic device and a control method. The NFC antenna can adapt to different form changes of the electronic device, and the NFC antenna has stronger adaptability to the communication environment.

[0005] In a first aspect, the present application provides an electronic device, comprising:

[0006] first ontology;

[0007] a first conductor structure, disposed on the first body;

[0008] a second body movable relative to the first body so that the second body and the first body can be in a first state of being close to each other or in a second state of being away from each other;

[0009] A second conductor structure is disposed on the second body; and

[0010] A near field communication chip is provided in the first body or the second body, and the near field communication chip is used to provide a differential excitation current; wherein,

[0011] In the first state, the near field communication chip is electrically connected to at least one of the first conductor structure and the second conductor structure and transmits the differential excitation current;

[0012] In the second state, the near field communication chip is electrically connected to at least one of the second conductor structure and the first conductor structure and transmits the differential excitation current. The conductor structures electrically connected to the near field communication chip in the second state and the first state are different.

[0013] In a second aspect, an embodiment of the present application provides a control method, which is applied to an electronic device, the electronic device including a first body, a second body, a first conductor structure, a second conductor structure, and a near-field communication chip, wherein the first conductor structure is provided on the first body, the second conductor structure is provided on the second body, and the second body is movable relative to the first body so that the second body and the first body are in a first state close to each other or a second state away from each other; the control method includes:

[0014] Determine a current state of the first entity and the second entity, where the current state is the first state or the second state;

[0015] In the first state, controlling the near field communication chip to be electrically connected to at least one of the first conductor structure and the second conductor structure and to transmit the differential excitation current;

[0016] In the second state, the near field communication chip is controlled to be electrically connected to at least one of the second conductor structure and the first conductor structure and transmit the differential excitation current. The conductor structures electrically connected to the near field communication chip in the second state and the first state are different.

[0017] In the electronic device and control method of the present application, the first conductor structure of the electronic device is arranged on the first body, and the second conductor structure is arranged on the second body. When the first body and the second body are in a first state close to each other, the near-field communication chip can select a suitable conductor structure from the first conductor structure and the second conductor structure and electrically connect it to transmit a differential excitation current; when the first body and the second body are in a second state away from each other, the near-field communication chip can select a different conductor structure from the first conductor structure and the second conductor structure and electrically connect it to transmit a differential excitation current; thus, the near-field communication chip can select different conductor structures in different forms of the electronic device to support the transmission of NFC signals, the NFC antenna of the electronic device can better adapt to changes in its form, and the electronic device has stronger adaptability to the communication environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0019] Figure 1 This is a schematic diagram of the first structure of the electronic device provided in an embodiment of the present application.

[0020] Figure 2 for Figure 1 A schematic structural diagram of another form of electronic equipment is shown.

[0021] Figure 3 for Figure 2 A schematic structural diagram of another form of electronic equipment is shown.

[0022] Figure 4 A second structural diagram of the electronic device provided in an embodiment of the present application.

[0023] Figure 5 for Figure 4 A schematic structural diagram of another form of electronic equipment is shown.

[0024] Figure 6 for Figure 4 The first circuit structure diagram of the electronic device shown is shown.

[0025] Figure 7 for Figure 4 The second circuit structure diagram of the electronic device shown is shown.

[0026] Figure 8 for Figure 4 The third circuit structure diagram of the electronic device shown.

[0027] Figure 9 This is a third structural diagram of the electronic device provided in an embodiment of the present application.

[0028] Figure 10 for Figure 9 A schematic structural diagram of another form of electronic equipment is shown.

[0029] Figure 11 for Figure 9 The first circuit structure diagram of the electronic device shown is shown.

[0030] Figure 12 for Figure 9 The second circuit structure diagram of the electronic device shown is shown.

[0031] Figure 13 for Figure 9 The third circuit structure diagram of the electronic device shown.

[0032] Figure 14 for Figure 9 The fourth circuit structure diagram of the electronic device shown.

[0033] Figure 15 for Figure 14 The first electrical connection diagram of the electronic device is shown.

[0034] Figure 16 for Figure 14The second electrical connection diagram of the electronic device is shown.

[0035] Figure 17 for Figure 14 The third electrical connection diagram of the electronic device 10 is shown

[0036] Figure 18 for Figure 9 The diagram shows a first electrical connection diagram of the electronic device when it is in a first state.

[0037] Figure 19 for Figure 9 The diagram shows a first electrical connection diagram of the electronic device when it is in the second state.

[0038] Figure 20 for Figure 9 The diagram shows a second electrical connection diagram of the electronic device when it is in the second state.

[0039] Figure 21 for Figure 9 The second electrical connection diagram shown is when the electronic device is in the first state.

[0040] Figure 22 This is a fourth structural diagram of the electronic device provided in an embodiment of the present application.

[0041] Figure 23 A first flow chart of the control method provided in an embodiment of the present application.

[0042] Figure 24 A second flow chart of the control method provided in an embodiment of the present application.

[0043] Figure 25 This is a third flow chart of the control method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] The following is a combination of the appended examples of the present application Figure 1 To the attached Figure 25 , clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0045] The embodiment of the present application provides an electronic device 10 and a control method. The control method can be applied to the electronic device 10, that is, the execution subject of the control method can be the electronic device 10 provided in the embodiment of the present application. Figure 1 , Figure 1This is a schematic diagram of the first structure of the electronic device 10 provided in the embodiment of the present application. Figure 1 The electronic device 10 may be a computing device such as a laptop computer, a computer monitor containing an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device, a smaller device (such as a wristwatch device, a pendant device, a headset or earpiece device, a device embedded in glasses or other devices worn on the user's head, or other wearable or miniature devices), a television, a computer display that does not contain an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which an electronic device with a display is installed in an information kiosk or a car), a device that implements the functionality of two or more of these devices, or other electronic device. Figure 1 In the exemplary configuration of FIG, electronic device 10 is a portable device, such as a cellular phone, a media player, a tablet computer, or other portable computing device. Other configurations can be used for electronic device 10 if desired. Figure 1 The examples are illustrative only.

[0046] like Figure 1 As shown, the electronic device 10 may include a first body 100 and a second body 200. The second body 200 can move relative to the first body 100. The second body 200 can move closer to each other relative to the first body 100 so that the first body 100 and the second body 200 are in a first state. The second body 200 can also move away from each other relative to the first body 100 so that the first body 100 and the second body 200 are in a second state. The electronic device 10 may further include a flexible screen assembly 300. One end of the flexible screen assembly 300 can be fixedly connected to the first body 100, and the other end of the flexible screen assembly 300 can be fixedly connected to the second body 200. For example, the flexible screen assembly 300 can be directly fixedly connected to the first body 100 or the second body 200. The flexible screen assembly 300 can also be fixedly connected to the first body 100 or the second body 200 through, but not limited to, a connecting member (such as a transmission belt or a transmission rack).

[0047] It is understood that the first body 100 and the second body 200 can provide support for the electronic components in the electronic device 10, thereby assembling the electronic components in the electronic device 10 together. For example, the first body 100 and the second body 200 can support the flexible screen assembly 300. For another example, electronic components such as the camera, receiver, circuit board, and power supply in the electronic device 10 can be mounted on the first body 100 and the second body 200 for fixation.

[0048] The first body 100 and the second body 200 may include a hollow frame structure, or may include a thin plate or sheet-like structure. For example, the first body 100 and the second body 200 may include a structure similar to a frame, a drawer, or the teeth of a comb. It is understood that the first body 100 and the second body 200 may be provided with, but not limited to, a folding structure such as a rotating shaft, or a pull-out or sliding structure such as a slide rail or a slideway, so that the first body 100 and the second body 200 can be folded, rotated, slid, pulled out, etc. to achieve relative movement between the first body 100 and the second body 200. These folding, pull-out, or sliding structures can be found in the description of the relevant art and will not be described in detail here.

[0049] Among them, the first body 100 and the second body 200 can move relative to each other in a direction of approaching or moving away from each other, and the first body 100 and the second body 200 can drive all or part of the flexible screen assembly 300 to move together during the mutual movement (for example, when the first body 100 and the second body 200 can both move, the entire flexible screen assembly 300 can move with the mutual movement of the first body 100 and the second body 200; when one of the first body 100 and the second body 200 moves and the other does not move, part of the flexible screen assembly 300 can be fixed with the fixed body, and the other part of the flexible screen assembly 300 can move with the moving body). The flexible screen assembly 300 can be expanded or contracted with the movement of the first body 100 and the second body 200, so that when the first body 100 and the second body 200 switch between a first state of approaching each other and a second state of moving away from each other, the flexible screen assembly 300 can switch arbitrarily between an expanded state, an intermediate state, and a contracted state.

[0050] like Figure 1 As shown, when the first body 100 and the second body 200 are in a first state close to each other, the flexible screen assembly 300 can be in a retracted state. For example, the electronic device 10 may include a first side and a second side opposite to each other, where the first side may be the front of the electronic device 10 and the second side may be the back of the electronic device 10. When the flexible screen assembly 300 is in the retracted state, a portion of the flexible screen assembly 300 may be located on the first side of the electronic device 10, and a portion of the flexible screen assembly 300 may be located on the second side of the electronic device 10.

[0051] Please combine Figure 1 See also Figure 2 , Figure 2 for Figure 1Schematic diagram of another configuration of the electronic device 10. When the first body 100 and the second body 200 move relative to each other in a direction away from each other and transition from the first state to the second state, the flexible screen assembly 300 may be in an intermediate state such that the flexible screen assembly 300 is exposed on both the first and second sides of the electronic device 10.

[0052] Please combine Figure 1 See also Figure 3 , Figure 3 for Figure 2 The schematic diagram of another embodiment of the electronic device 10 is shown. When the first body 100 and the second body 200 move relative to each other in a direction away from each other and are in a second state away from each other, the flexible screen assembly 300 can be completely exposed to the first side of the electronic device 10, and the flexible screen assembly 300 can be in an unfolded state.

[0053] It should be noted that, in the embodiment of the present application, the first state of the first body 100 and the second body 200 can be the same as the contracted state of the above-mentioned flexible screen assembly 300, or the same as the intermediate state of the above-mentioned flexible screen assembly 300; similarly, the second state of the first body 100 and the second body 200 can be the same as the unfolded state of the above-mentioned flexible screen assembly 300, or the intermediate state of the above-mentioned flexible screen assembly 300; any solution that satisfies the requirement that the distance between the first body 100 and the second body 200 in the first state is less than the distance between the first body 100 and the second body 200 in the second state is within the protection scope of the embodiment of the present application.

[0054] It should be understood that, in the description of this application, terms such as "first" and "second" are only used to distinguish similar objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0055] Based on the structure of the above electronic device 10, please combine Figures 1 to 3 Please also refer to Figure 4 and Figure 5 , Figure 4 This is a second structural diagram of the electronic device 10 provided in an embodiment of the present application. Figure 5 for Figure 4 The electronic device 10 is a schematic structural diagram of another embodiment of the electronic device 10. The electronic device 10 may further include a near field communication chip 400, a first conductor structure 500, and a second conductor structure 600.

[0056] The first conductor structure 500 can be disposed on the first body 100, which can support the first conductor structure 500. The second conductor structure 600 can be disposed on the second body 200, which can support the second conductor structure 600. When the first body 100 and the second body 200 move relative to each other, the first conductor structure 500 can move relative to the first body 100, and the second conductor structure 600 can move relative to the second body 200.

[0057] It is understood that the first body 100 and the second body 200 can move relative to each other. The first body 100 can be fixed and the second body 200 can move closer to or away from the first body 100, the second body 200 can be fixed and the first body 100 can move closer to or away from the second body 200, or both the first body 100 and the second body 200 can move to move closer to or away from each other. The embodiments of this application do not limit the specific movement of the first body 100 and the second body 200.

[0058] The near field communication chip 400 may be provided on the same body as the first conductor structure 500 or the second conductor structure 600, for example. Figure 4 and Figure 5 As shown, the near-field communication chip 400 can be disposed together with the first conductor structure 500 in the same first body 100, and the first body 100 can simultaneously support the first conductor structure 500 and the near-field communication chip 400. Of course, in other embodiments, the near-field communication chip 400 can also be disposed together with the second conductor structure 600 in the same second body 200, and the second body 200 can simultaneously support the second conductor structure 600 and the near-field communication chip 400.

[0059] The near-field communication chip 400 can provide a differential excitation current. The near-field communication chip 400 can select, based on the current state of the electronic device 10, to be directly or indirectly electrically connected to at least one (one or both) of the first conductor structure 500 and the second conductor structure 600, so that at least one of the first conductor structure 500 and the second conductor structure 600 can transmit the differential excitation current.

[0060] It can be understood that the differential excitation current includes two current signals, which have the same amplitude and opposite phase, or it can be understood that the phase difference between the two current signals is 180 degrees. In addition, the differential excitation current is a balanced signal. It can be understood that during the transmission process, if the analog signal is directly transmitted, it is an unbalanced signal; if the original analog signal is inverted and then the inverted analog signal and the original analog signal are transmitted simultaneously, the inverted analog signal and the original analog signal are called balanced signals. During the transmission process, the balanced signal passes through the differential amplifier, and the original analog signal and the inverted analog signal are subtracted to obtain an enhanced original analog signal. Since the two transmission lines are subject to the same interference during the transmission process, the same interference signal is subtracted during the subtraction process, so the balanced signal has better anti-interference performance.

[0061] Please combine Figure 4 、 Figure 5 Please also refer to Figures 6 to 8 , Figure 6 for Figure 4 The first circuit structure diagram of the electronic device 10 is shown in FIG. Figure 7 for Figure 4 The second circuit structure diagram of the electronic device 10 is shown. Figure 8 for Figure 4 A third circuit structure diagram of the electronic device 10 is shown. The near-field communication chip 400 may include a first differential signal terminal 410 and a second differential signal terminal 420. For example, the first differential signal terminal 410 may be a positive (+) port of the near-field communication chip 400, and the second differential signal terminal 420 may be a negative (-) port of the near-field communication chip 400. The first differential signal terminal 410 and the second differential signal terminal 420 may provide a differential excitation current. The differential excitation current provided by the near-field communication chip 400 may be output to a conductor structure (e.g., a first conductor structure 500, a second conductor structure 600, and a third conductor structure 700 described later) via the first differential signal terminal 410, and flow back to the near-field communication chip 400 via the second differential signal terminal 420, thereby forming a conductive loop.

[0062] The first conductor structure 500 may include a first electrical connection point 510 and a second electrical connection point 520 that are spaced apart. Figure 6 As shown, the first electrical connection point 510 can be directly or indirectly electrically connected to a differential signal end of the near-field communication chip 400, such as the second differential signal end 420, and the second electrical connection point 520 can be directly or indirectly electrically connected to another differential signal end of the near-field communication chip 400, such as the first differential signal end 410, so that the near-field communication chip 400 can be electrically connected to the first conductor structure 500 and transmit the differential excitation current through the first conductor structure 500 to realize the NFC function.

[0063] The second conductor structure 600 may include a third electrical connection point 610 and a fourth electrical connection point 620 that are spaced apart. Figure 7 As shown, the third electrical connection point 610 can be directly or indirectly electrically connected to a differential signal end of the near-field communication chip 400, such as the second differential signal end 420, and the fourth electrical connection point 620 can be directly or indirectly electrically connected to another differential signal end of the near-field communication chip 400, such as the first differential signal end 410, so that the near-field communication chip 400 can be electrically connected to the second conductor structure 600 and transmit the differential excitation current through the second conductor structure 600 to realize the NFC function.

[0064] The near field communication chip 400 can also be directly or indirectly electrically connected to the first conductor structure 500 and the second conductor structure 600 at the same time. Figure 8 As shown, the second electrical connection point 520 of the first conductor structure 500 can be directly or indirectly electrically connected to a differential signal end of the near-field communication chip 400, such as the first differential signal end 410, the first electrical connection point 510 of the first conductor structure 500 can be directly or indirectly electrically connected to the fourth electrical connection point 620 of the second conductor structure 600, and the third electrical connection point 610 of the second conductor structure can be directly or indirectly electrically connected to another differential signal end of the near-field communication chip 400, such as the second differential signal end 420, so that the near-field communication chip 400 can be electrically connected to the first conductor structure 500 and the second conductor structure 600 and jointly transmit the differential excitation current to realize the NFC function.

[0065] When the first body 100 and the second body 200 are in the first state, the near-field communication chip 400 can be electrically connected to at least one (one or two) of the first conductor structure 500 and the second conductor structure 600 and transmit a differential excitation current; when the first body 100 and the second body 200 are in the second state, the near-field communication chip 400 can be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 and transmit a differential excitation current, and the conductor structures electrically connected to the near-field communication chip 400 in the second state and the first state are different. It can be understood that the different conductor structures can include the number of conductor structures electrically connected to the near-field communication chip 400 in the two states being different, or the number of conductor structures electrically connected to the near-field communication chip 400 in the two states being the same but the electrically connected conductor structures being different. For example, in a certain state, the near-field communication chip 400 may be electrically connected to one conductor structure, and in another state, the near-field communication chip 400 may be electrically connected to two conductor structures; for another example, in a certain state, the near-field communication chip 400 may be electrically connected to one conductor structure, and in another state, the near-field communication chip 400 may be electrically connected to another conductor structure.

[0066] For example, Figure 4As shown, when the first body 100 and the second body 200 are close to each other and in the first state, the first conductor structure 500 and the second conductor structure 600 can also be close to each other; at this time, as shown in FIG. Figure 7 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the second conductor structure 600 and transmit the differential excitation current. Figure 5 As shown, when the first body 100 and the second body 200 are away from each other and in the second state, the first conductor structure 500 and the second conductor structure 600 can also be away from each other; at this time, as shown in FIG. Figure 6 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and transmit a differential excitation current. Therefore, in the first state and the second state, the conductor structures electrically connected to the near field communication chip 400 are different.

[0067] For example, Figure 4 As shown, when the first body 100 and the second body 200 are close to each other and in the first state, the first conductor structure 500 and the second conductor structure 600 can also be close to each other; at this time, as shown in FIG. Figure 6 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and transmit the differential excitation current. Figure 5 As shown, when the first body 100 and the second body 200 are away from each other and in the second state, the first conductor structure 500 and the second conductor structure 600 can also be away from each other; at this time, as shown in FIG. Figure 7 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the second conductor structure 600 and transmit a differential excitation current. Therefore, in the first state and the second state, the conductor structures electrically connected to the near field communication chip 400 are different.

[0068] Another example is Figure 4 As shown, when the first body 100 and the second body 200 are close to each other and in the first state, the first conductor structure 500 and the second conductor structure 600 can also be close to each other; at this time, as shown in FIG. Figure 6 or Figure 7 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 or the second conductor structure 600 and transmit the differential excitation current. Figure 5 As shown, when the first body 100 and the second body 200 are away from each other and in the second state, the first conductor structure 500 and the second conductor structure 600 can also be away from each other; at this time, as shown in FIG. Figure 8 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and the second conductor structure 600 and transmit the differential excitation current together. Therefore, in the first state and the second state, the conductor structures electrically connected to the near field communication chip 400 are different.

[0069] Also exemplary, Figure 4 As shown, when the first body 100 and the second body 200 are close to each other and in the first state, the first conductor structure 500 and the second conductor structure 600 can also be close to each other; at this time, as shown in FIG. Figure 8 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and the second conductor structure 600 and transmit the differential excitation current together. Figure 5 As shown, when the first body 100 and the second body 200 are away from each other and in the second state, the first conductor structure 500 and the second conductor structure 600 can also be away from each other; at this time, as shown in FIG. Figure 6 or Figure 7 As shown, the near field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 or the second conductor structure 600 and transmit differential excitation current. Therefore, in the first state and the second state, the conductor structures electrically connected to the near field communication chip 400 are different.

[0070] It is understandable that the above figures are only used as an example to illustrate the embodiment of the present application in which the near-field communication chip 400 is provided in the first body 100. It should be noted that the near-field communication chip 400 can also be provided in the second body 200, and the second body 200 can also carry the near-field communication chip 400. In this case, the electrical connection method between the near-field communication chip 400 and the first conductor structure 500 and the second conductor structure 600, as well as the method of selecting the electrically connected conductor structure of the near-field communication chip 400 in the first state and the second state can all be referred to the above description and will not be described in detail here.

[0071] In the electronic device 10 of the embodiment of the present application, the first conductor structure 500 is arranged on the first body 100, and the second conductor structure 600 is arranged on the second body 200. When the first body 100 and the second body 200 are in a first state close to each other, the near-field communication chip 400 can select a suitable conductor structure from the first conductor structure 500 and the second conductor structure 600 and electrically connect to it to transmit a differential excitation current; when the first body 100 and the second body 200 are in a second state away from each other, the near-field communication chip 400 can select different conductor structures from the first conductor structure 500 and the second conductor structure 600 and electrically connect to them to transmit a differential excitation current; thus, the near-field communication chip 400 can select different conductor structures in different forms of the electronic device 10 to support the transmission of NFC signals, the NFC antenna of the electronic device 10 can better adapt to changes in its form, and the electronic device 10 has stronger adaptability to the communication environment.

[0072] Among them, please refer to Figure 9 and Figure 10 , Figure 9 This is a third structural diagram of the electronic device 10 provided in an embodiment of the present application. Figure 10 for Figure 9 The electronic device 10 may further include a third conductor structure 700 .

[0073] The third conductor structure 700 may be provided in the first body 100 or the second body 200. For example, Figure 9 and Figure 10 The third conductor structure 700 can be disposed on the first body 100, the first body 100 can support the third conductor structure 700, and the third conductor structure 700 can be disposed on the same body (first body 100) as the first conductor structure 500. Of course, the third conductor structure 700 can also be disposed on the second body 200, the second body 200 can support the third conductor structure 700, and the third conductor structure 700 can be disposed on the same body (second body 200) as the second conductor structure 600.

[0074] Please combine Figure 9 、 Figure 10 Please also refer to Figures 11 to 13 , Figure 11 for Figure 9 The first circuit structure diagram of the electronic device 10 is shown in FIG. Figure 12 for Figure 9 The second circuit structure diagram of the electronic device 10 is shown. Figure 13 for Figure 9 FIG. 1 is a schematic diagram of a third circuit structure of the electronic device 10. The third conductor structure 700 can be directly or indirectly electrically connected to the near-field communication chip 400. The third conductor structure 700 can also be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 to transmit a differential excitation current together with at least one of the first conductor structure 500 and the second conductor structure 600.

[0075] For example, Figure 11 and Figure 12 As shown, the third conductor structure 700 may include a fifth electrical connection point 710 and a sixth electrical connection point 720 that are spaced apart. The fifth electrical connection point 710 may be directly or indirectly electrically connected to a differential signal terminal of the near-field communication chip 400, such as the first differential signal terminal 410. The sixth electrical connection point 720 may be directly or indirectly electrically connected to the first conductor structure 500 (second electrical connection point 520) or the second conductor structure 600 (fourth electrical connection point 620). The third conductor structure 700 may transmit a differential excitation current together with the first conductor structure 500 or the second conductor structure 600.

[0076] For example, Figure 13As shown, the fifth electrical connection point 710 of the third conductor structure 700 can be directly or indirectly electrically connected to a differential signal end of the near-field communication chip 400, such as the first differential signal end 410, and the sixth electrical connection point 720 of the third conductor structure 700 can be directly or indirectly electrically connected to the fourth electrical connection point 620 of the second conductor structure 600 (it can also be electrically connected to the second electrical connection point 520 of the first conductor structure 500, and the subsequent electrical connection relationship can be adjusted accordingly). The third electrical connection point 610 of the second conductor structure 600 can be electrically connected to the second electrical connection point 520 of the first conductor structure 500, and the first electrical connection point 510 of the first conductor structure 500 can be electrically connected to another differential signal end of the near-field communication chip 400, such as the second differential signal end 420. Thus, the third conductor structure 700 can transmit the differential excitation current together with the first conductor structure 500 and the second conductor structure 600.

[0077] It is understandable that the third conductor structure 700 can be a coil structure, for example, an NFC coil. In this case, on the one hand, the space occupied by the NFC coil is also smaller; on the other hand, the path for transmitting the excitation current by the third conductor structure 700 can be longer, which can increase the sensing area of ​​the third conductor structure 700 supporting NFC signals.

[0078] It is understood that the third conductor structure 700 can be a radiating branch structure on the first body 100 or the second body 200. The conductor structures on the first body 100 or the second body 200 can be formed into radiating branch structures by opening gaps or other forms and can serve as the third conductor structure 700 of the embodiment of the present application. In this case, the third conductor structure 700 can reuse the original components on the first body 100 or the second body 200, and the third conductor structure 700 can be reused.

[0079] It should be noted that the above is only an illustrative example of the third conductor structure 700 in the embodiment of the present application. The third conductor structure 700 can also be, but is not limited to, a patch antenna structure, a PCB board antenna structure, etc., and the embodiment of the present application does not limit this.

[0080] It should be noted that, like the third conductor structure 700, the first conductor structure 500 and the second conductor structure 600 may also be, for example, but not limited to, a coil structure, a radiating branch structure, a patch antenna structure, a PCB antenna structure, etc. The forms of one, two, or three of the first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 may be the same or different. The specific forms of the three conductor structures are not limited in this embodiment of the application.

[0081] The third conductor structure 700 of the embodiment of the present application can transmit a differential excitation current together with at least one of the first conductor structure 500 and the second conductor structure 600. The transmission path of the differential excitation current is longer, and the sensing area of ​​the NFC signal is larger.

[0082] The third conductor structure 700 may be provided in an area of ​​the first body 100 that is not blocked by the second body 200 or an area of ​​the second body 200 that is not blocked by the first body 100 in the first state. Figure 4 、 Figure 5 、 Figure 9 and Figure 10 As shown, a first area 110 can be provided on the first body 100. When the first body 100 and the second body 200 are in a first state close to each other, the first area 110 is located outside the projection area of ​​the second body 200 on the first body 100, and the first area 110 is not blocked by the second body 200. At this time, the third conductor structure 700 can be set in the first area 110.

[0083] Of course, if the first body 100 and the second body 200 are in the first state close to each other, there is a second area 210 on the second body 200 that is not blocked by the first body 100. The second area 210 can be located outside the projection area of ​​the first body 100 on the second body 200. At this time, the third conductor structure 700 can also be set in the second area 210.

[0084] It is understood that the first area 110 and the second area 210 may be areas of the electronic device 100 that are not blocked by the first body 100 and the second body 200 when the first body 100 and the second body 200 are in a first state close to each other. In actual production, the first area 110 and the second area 210 may be, but are not limited to, areas corresponding to structures such as a rotating shaft, gears, and tracks on the electronic device 10.

[0085] In the electronic device 10 according to the embodiment of the present application, the third conductor structure 700 is disposed in an area that is not blocked by the first body 100 and the second body 200 when the first body 100 and the second body 200 are close to each other. Regardless of whether the first body 100 and the second body 200 are in a first state in which they are close to each other or a second state in which they are far apart, changes in the shape of the electronic device 10 have little impact on the antenna environment of the third conductor structure 700, and the performance of the third conductor structure 700 in transmitting differential excitation current is relatively stable. Furthermore, when the third conductor structure 700 and at least one of the first conductor structure 500 and the second conductor structure 600 jointly transmit an NFC signal, the first conductor structure 500 and the second conductor structure 600 can expand the sensing area of ​​the NFC signal, allowing the electronic device 10 to sense the NFC signal over a larger area, thereby improving the NFC signal sensing capability of the electronic device 10.

[0086] Please refer again to Figure 9 、 Figure 10 Please also refer to Figure 14 , Figure 14 for Figure 9 The fourth circuit structure diagram of the electronic device 10 is shown. The electronic device 10 may further include a ground system 800 .

[0087] The ground system 800 may be a structure or region on the electronic device 10 with zero potential. The first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 may be directly or indirectly electrically connected to the ground system 800. For example, the ground system 800 may include a first grounding point 810, a second grounding point 820, and a third grounding point 830 spaced apart from each other. A first conductive path 840 may be formed between the first grounding point 810 and the third grounding point 830, and a second conductive path 850 may be formed between the second grounding point 820 and the third grounding point 830. The second electrical connection point 520 of the first conductor structure 500 may be directly or indirectly electrically connected to the first grounding point 810, the fourth electrical connection point 620 of the second conductor structure 600 may be directly or indirectly electrically connected to the second grounding point 820, and the sixth electrical connection point 720 of the third conductor structure 700 may be electrically connected to the third grounding point 830.

[0088] Combine Figure 14 Please also refer to Figure 15 , Figure 15 for Figure 14 In the first electrical connection diagram of the electronic device 10 shown, when the second differential signal terminal 420 of the near-field communication chip 400 is directly or indirectly electrically connected to the first electrical connection point 510 of the first conductor structure 500, for example, when the second differential signal terminal 420 is electrically connected to the first electrical connection point 510 through the first conductive path M1, the third conductor structure 700, the first conductive path 840 and the first conductor structure 500 can jointly form a first conductive loop S1 for transmitting the differential excitation current.

[0089] Combine Figure 14 Please also refer to Figure 16 , Figure 16 for Figure 14 In the second electrical connection diagram of the electronic device 10 shown, when the second differential signal terminal 420 of the near-field communication chip 400 is directly or indirectly electrically connected to the third electrical connection point 610 of the second conductor structure 600, for example, when the second differential signal terminal 420 is electrically connected to the third electrical connection point 610 through the second conductive path M2, the third conductor structure 700, the second conductive path 850 and the second conductor structure 600 can jointly form a second conductive loop S2 for transmitting the differential excitation current.

[0090] Combine Figure 14 Please also refer to Figure 17 , Figure 17for Figure 14 In the third electrical connection diagram of the electronic device 10 shown, when the first conductor structure 500 and the second conductor structure 600 are connected in series (at this time, one of the conductor structures can be electrically disconnected from the ground system 800), the second differential signal terminal 420 of the near-field communication chip 400 can be directly or indirectly electrically connected to the first and second conductor structures 500 and 600 connected in series, and the third conductor structure 700, the ground system 800, the second conductor structure 600, and the first conductor structure 500 can collectively form a third conductive loop S3 for transmitting differential excitation current. For example, when the second differential signal terminal 420 is electrically connected to the first electrical connection point 510 of the first conductor structure 500 via the first conductive path M1, the third conductor structure 700, the second conductive path 850, the second conductor structure 600, and the first conductor structure 500 can collectively form a third conductive loop S3 for transmitting differential excitation current. It should be noted that, in the embodiment of the present application, the second differential signal end 420 can also be electrically connected to the third electrical connection point 610 of the second conductor structure 600 through the second conductive path M2, so that the third conductor structure 700, the first conductive path 840, the first conductor structure 500 and the second conductor structure 600 can also jointly form a third conductive loop S3 for transmitting the differential excitation current.

[0091] It is understandable that the ground system 800 can be provided on at least one of the first body 100 and the second body 200. For example, the ground system 800 is provided on both the first body 100 and the second body 200 of the electronic device 10, and the ground systems 800 on the two bodies can be electrically connected as a whole. In this case, the first conductor structure 500 can be electrically connected to the ground system 800 region on the first body 100, the second conductor structure 600 can be electrically connected to the ground system 800 region on the second body 200, and the third conductor structure 700 can be electrically connected to the ground system 800 region on the first body 100 or the second body 200.

[0092] It is understood that the plane where the ground system 800 is located can be coplanar with or have a height difference with the plane where the first conductor structure 500, the second conductor structure 600, or the third conductor structure 700 are located. For example, the first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 can be, but are not limited to, disposed in the housing region of the first body 100 or the second body 200, and the ground system 800 can be disposed in the mainboard region of the first body 100 or the second body 200, so that there is a height difference between the conductor structures and the ground system 800. In this case, the first conductive loop S1, the second conductive loop S2, and the third conductive loop S3 have a path along the thickness direction of the electronic device 10, and the NFC sensing area has similar sensitivity on the front and back of the electronic device 10. The user can use the NFC sensing function on both the front and back of the electronic device 10, and the NFC performance of the electronic device 10 is improved.

[0093] In the electronic device 10 of the embodiment of the present application, the first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 can be electrically connected to the ground system 800. The electronic device 10 can transmit the differential excitation current through the first conductive path 840 and the second conductive path 850 on the ground system 800, thereby extending the transmission path of the differential excitation current and increasing the sensing area of ​​the NFC signal.

[0094] Among them, Figures 14 to 17 As shown, the electronic device 10 may further include a switching circuit 900, which may be directly or indirectly electrically connected to the near-field communication chip 400, the first conductor structure 500, and the second conductor structure 600, respectively. The switching circuit 900 may conduct the near-field communication chip 400 and at least one of the first conductor structure 500 and the second conductor structure 600.

[0095] For example, Figure 14 As shown, another differential signal of the near field communication chip 400, for example, the second differential signal terminal 420, can be electrically connected to the first port a of the switching circuit 900, and the second port b of the switching circuit 900 can be electrically connected to the first conductor structure 500 or the second conductor structure 600. Figure 15 As shown, when the second port b of the switching circuit 900 is connected to the first conductor structure 500, a first conductive path M1 is formed between the second port b and the first conductor structure 500, and the switching circuit 900 can connect the first conductor structure 500 to the near field communication chip 400 through the first conductive path M1. Figure 16 As shown, when the second port b of the switching circuit 900 is connected to the second conductor structure 600, a second conductive path M2 can be formed between the second port b and the second conductor structure 600, and the switching circuit 900 can connect the second conductor structure 600 to the near-field communication chip 400 through the second conductive path M2.

[0096] It is understandable that the switching circuit 900 may further include a first switching branch (not shown) that can control the electrical connection between the first conductor structure 500, the second conductor structure 600 and the ground system 800, and a second switching branch (not shown) that can control the electrical connection between the first conductor structure 500 and the second conductor structure 600. Figure 17In the embodiment, a first switching branch can be provided between the second electrical connection point 520 of the first conductor structure 500 and the first grounding point 810 of the ground system 800. The first switching branch can control whether the first conductor structure 500 is connected to the ground system 800 or disconnected. A second switching branch can be provided between the second electrical connection point 520 of the first conductor structure 500 and the third electrical connection point 610 of the second conductor structure 600. The second switching branch can control the electrical connection between the first conductor structure 500 and the second conductor structure 600. It should be noted that the above is merely an illustrative example of the switching circuit 900. The structure of the switching circuit 900 in the embodiment of the present application is not limited thereto and the embodiment of the present application does not limit this.

[0097] It is understandable that the switching circuit 900 can be provided on the first body 100 or on the second body 200. The switching circuit 900 can be provided on the same body as the near-field communication chip 400, for example, but not limited to, the switching circuit 900 is integrated into the near-field communication chip 400. Of course, the switching circuit 900 and the near-field communication chip 400 can also be provided on different bodies, for example, the main board of the electronic device 10 is provided on the first body 100, the near-field communication chip 400 is provided on the second body 200, and the switching circuit 900 is provided on the main board. The embodiment of the present application does not limit the specific location of the switching circuit 900.

[0098] It can be understood that the switching circuit 900 may include one or more switching switches. For example, the switching circuit 900 may include a single-pole double-throw switch. The conduction and disconnection between multiple contacts of the single-pole double-throw switch can form a first conduction path M1 or a second conduction path M2, or make other components conductive or disconnected.

[0099] It is understandable that the switching circuit 900 can also be a blocking circuit. The multiple ends of the blocking circuit can be electrically connected to the near-field communication chip 400, the first conductor structure 500, and the second conductor structure 600, respectively. The electronic device 10 can adjust the parameters of the blocking circuit so that the near-field communication chip 400, the first conductor structure 500, the second conductor structure 600, the third conductor structure 700, and the ground system 800 are connected or disconnected in different states to form the electrical connection relationship required by the electronic device 10. For example, in a certain state, the blocking circuit can connect the near-field communication chip 400 to the first conductor structure 500 and form a first conductive path M1, while disconnecting the near-field communication chip 400 from the first conductor structure 500; in another state, the blocking circuit can connect the near-field communication chip 400 to the second conductor structure 600 and form a second conductive path M2, while disconnecting the near-field communication chip 400 from the second conductor structure 600.

[0100] It is understandable that the blocking circuit may include one or more electronic devices such as resistors, capacitors, and inductors, and the embodiment of the present application does not limit the structure of the blocking circuit.

[0101] It should be noted that the above is only an exemplary description of the switching circuit 900 in the embodiment of the present application. The specific structure of the switching circuit 900 in the embodiment of the present application is not limited to this. Other structures that can realize the connection or disconnection between the near-field communication chip 400 and at least one of the first conductor structure 500 and the second conductor structure 600 are all within the protection scope of the embodiment of the present application.

[0102] The electronic device 10 of the embodiment of the present application connects the near-field communication chip 400 to the first conductor structure 500 and the second conductor structure 600 respectively through the switching circuit 900, which can not only simplify the routing layout between the near-field communication chip 400 and multiple conductor structures, but also simplify the switching control between the near-field communication chip 400 and multiple conductor structures.

[0103] The NFC chip 400 (or the switching circuit 900) can be electrically connected to the first conductor structure 500 and the second conductor structure 600 via a flexible connector to accommodate relative movement between the first body 100 and the second body 200. For example, when the NFC chip 400 (or the switching circuit 900) and the first conductor structure 500 are disposed in the same body and the second conductor structure 600 are disposed in a different body, the NFC chip 400 (or the switching circuit 900) can be electrically connected to the second conductor structure 600 via a flexible connector, and the NFC chip 400 (or the switching circuit 900) can be electrically connected to the first conductor structure 500 via a flexible connector or a non-flexible connector. Conversely, the NFC chip 400 (or the switching circuit 900) can be electrically connected to the first conductor structure 500 via a flexible connector and to the second conductor structure 600 via a flexible connector or a non-flexible connector. The flexible connector can be, but is not limited to, an FPC connector.

[0104] Among them, the near-field communication chip 400 (or the switching circuit 900) can also be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 by contact connection to adapt to the relative movement of the first body 100 and the second body 200. For example, the first body 100 is provided with a first electrical contact electrically connected to the first conductor structure 500, the second body 200 is provided with a second electrical contact electrically connected to the second conductor structure 600, and the near-field communication chip 400 (or the switching circuit 900) is provided with a third electrical contact; when the first body 100 and the second body 200 are close to each other and in the first state, the third electrical contact can disconnect the electrical connection with the first electrical contact, and the second electrical contact can approach and contact the third electrical contact to achieve electrical connection, so that the near-field communication chip 400 (or the switching circuit 900) can achieve electrical connection with the second conductor structure 600 through the connection between the second electrical contact and the third electrical contact; when the first body 100 and the second body 200 are far away from each other and in the second state, the third electrical contact can restore the electrical connection with the first electrical contact to achieve electrical connection with the first conductor structure 500.

[0105] It should be noted that the above is only an illustrative example of the electrical connection between the near-field communication chip 400 and the first conductor structure 500 and the second conductor structure 600 in the embodiment of the present application. Other electrical connection methods that can adapt to the movement of the first body 100 and the second body 200 can also be used in the embodiment of the present application, and the embodiment of the present application does not make specific limitations on this.

[0106] It should be noted that the electrical connection between the near field communication chip 400, the first conductor structure 500, the second conductor structure 600 and the third conductor structure 700 may also be, but is not limited to, a flexible connector or electrical contacts, and this embodiment of the present application does not specifically limit this.

[0107] Based on the structure of the above electronic device 10, please combine Figure 9 Please also refer to Figure 18 , Figure 18 for Figure 9The first electrical connection diagram of the electronic device 10 is shown when it is in a first state. When the first body 100 and the second body 200 are close to each other in the first state, at least a portion of the first conductor structure 500 may overlap with the second body 200, and at least a portion of the projection of the first conductor structure 500 on the second body 200 may be blocked by the second body 200; at least a portion of the second conductor structure 600 may not overlap with the first body 100, and at least a portion of the projection of the second conductor structure 600 on the first body 100 may be located outside the first body 100. In this case, the near-field communication chip 400 may be electrically connected to the second conductor structure 600 and transmit a differential excitation current. For example, the near-field communication chip 400 may form a second conductive loop S2 with the second conductor structure 600, the third conductor structure 700, and the ground system 800 and transmit the differential excitation current.

[0108] It can be understood that when the first body 100 and the second body 200 are close to each other, the second body 200 can be located on the side of the first body 100 away from the display surface (flexible display screen) of the electronic device 10, for example, the second body 200 and the first body 100 are a rotatable and foldable structure; the second body 200 can also be located in the cavity of the first body 100, for example, the second body 200 and the first body 100 are a drawer or comb structure that can be slid or pulled out; at this time, the second body 200 can block at least part of the first body 100, and the first conductor structure 500 located on the first body 100 is affected. At the same time, the second body 200 can also increase the distance between the first conductor structure 500 and the back of the electronic device 10, or increase the distance between the first conductor structure 500 and the display surface of the electronic device 10. This allows the user to sense NFC signals through the first conductor structure 500 at different sensitivities on the front and back of the electronic device 10. The user may not be able to sense NFC signals on one side. As a result, the first conductor structure 500 located on the first body 100 is affected by the thickness of the second body 200, resulting in a decrease in NFC performance. The second conductor structure 600 located on the second body 200 has better NFC performance than the first conductor structure 500. The near-field communication chip 400 is electrically connected to the second conductor structure 600 with better performance and transmits a differential excitation current, thereby improving the NFC performance of the electronic device 10.

[0109] It can be understood that the first conductor structure 500 and the second conductor structure 600 can be set on the frame of the electronic device 10. For example, the first body 100 includes a first frame 120, and the first conductor structure 500 can be set relative to the top frame of the first frame 120; the second body 200 includes a second frame 220, and the second conductor structure 600 can be set relative to the top frame of the second frame 220. On the one hand, the first conductor structure 500 and the second conductor structure 600 are closer to the external free space, and their performance as NFC signal radiation branches is better; on the other hand, when the first body 100 and the second body 200 are close to each other, it is easier for a certain conductor structure in the first conductor structure 500 and the second conductor structure 600 to be unblocked, and the design of the electronic device 10 is simpler.

[0110] Understandably, please combine Figure 18 Please also refer to Figure 19 , Figure 19 for Figure 9 The first electrical connection diagram of the electronic device 10 is shown in the second state. When the first body 100 and the second body 200 are separated from each other in the second state, the first conductor structure 500 and the second conductor structure 600 are separated from each other. At this time, the near-field communication chip 400 can be electrically connected to the first conductor structure 500 and transmit a differential excitation current.

[0111] It is understandable that the near field communication chip 400 can be disposed on the first body 100 together with the first conductor structure 500, such as Figure 19 As shown, when the first body 100 and the second body 200 are in the second state, which are separated from each other, the near-field communication chip 400 is electrically connected to the first conductor structure 500. The electrical connection lines between the near-field communication chip 400 and the first conductor structure 500 do not need to cross different bodies, making the electrical connection layout between the two simpler. Of course, the near-field communication chip 400 can also be set together with the second conductor structure 600 in the second body 200. In this case, when the first body 100 and the second body 200 are in the first state, which are close to each other, the electrical connection lines between the near-field communication chip 400 and the second conductor structure 600 do not need to cross different bodies, making the electrical connection layout between the two simpler.

[0112] It should be noted that, in the first state, the near field communication chip 400 can be Figure 18 As shown, the third conductor structure 700 and the second conductor structure 600 are electrically connected and transmit differential excitation current; at this time, in the second state, the near field communication chip 400 can be as Figure 19As shown, the third conductor structure 700 and the first conductor structure 500 are electrically connected and transmit differential excitation current. The near-field communication chip 400 can also be electrically connected to the third conductor structure 700, the first conductor structure 500, and the second conductor structure 600 at the same time and transmit differential excitation current. The embodiment of the present application does not limit the electrical connection relationship in the second state.

[0113] In the electronic device 10 of the embodiment of the present application, when the first body 100 and the second body 200 are in a first state close to each other, the near-field communication chip 400 selects the second conductor structure 600 that is not blocked by the first body 100 to jointly transmit the differential excitation current, thereby ensuring that the electronic device 10 has better NFC performance.

[0114] Based on the structure of the above electronic device 10, please combine Figure 14 Please also refer to Figure 20 , Figure 20 for Figure 9 The second electrical connection diagram of the electronic device 10 is shown in the second state. When the first body 100 and the second body 200 are separated from each other in the second state, the near-field communication chip 400 can be connected in series with the first conductor structure 500 and the second conductor structure 600 to transmit a differential excitation current.

[0115] It can be understood that the first conductor structure 500 can be set relative to the top frame of the first frame 120, the second conductor structure 600 can be set relative to the top frame of the second frame 220, and the third conductor structure 700 can be set on the first body 100. When the first body 100 and the second body 200 are away from each other and are in the second state, the distance between the end of the first conductor structure 500 and the head end of the second conductor structure 600 is relatively close; at this time, the second differential signal end 420 (or the switching circuit 900) of the near field communication chip 400 can be electrically connected to the first electrical connection point 510 of the first conductor structure 500, and the second electrical connection point 520 of the first conductor structure 500 can be disconnected from the ground system. The first conductor structure 500 and the second conductor structure 600 are electrically connected to each other through the electrical connection of the first conductor structure 600 and the third electrical connection point 610 of the second conductor structure 600. The fourth electrical connection point 620 of the second conductor structure 600 can be electrically connected to the second grounding point 820 of the ground system 800. The third grounding point 830 of the ground system 800 can be electrically connected to the sixth electrical connection point 720 of the third conductor structure 700. The fifth electrical connection point 710 of the third conductor structure 700 can be electrically connected to the first differential signal end 410 of the near-field communication chip 400. Thus, the near-field communication chip 400, the third conductor structure 700, the ground system 800, the second conductor structure 600 and the first conductor structure 500 can form a third conductive loop S3 to jointly transmit the differential excitation current.

[0116] It is understandable that when the first body 100 and the second body 200 are away from each other and in the second state, the distance between the end of the first conductor structure 500 and the beginning of the second conductor structure 600 is relatively close, and the frame of the first body 100 close to the second body 200 (for example, the right frame of the first body 100) and the frame of the second body 200 close to the first body 100 (for example, the left frame of the second body 200) are also relatively close. At this time, an electrical connection area can be set on the right frame of the first body 100 or the left frame of the second body 200, and the first conductor structure 500 and the second conductor structure 600 can both be electrically connected to the electrical connection area, thereby achieving electrical connection between the first conductor structure 500 and the second conductor structure 600. Of course, the first body 100 and the second body 200 can also be electrically connected in other ways, such as but not limited to achieving electrical connection through a flexible connector, which is not limited in this embodiment of the present application.

[0117] Understandably, please combine Figure 18 、 Figure 20 Please also refer to Figure 21 , Figure 21 for Figure 9 The second electrical connection diagram of the electronic device 10 is shown when the electronic device 10 is in the first state. When the first body 100 and the second body 200 are close to each other and in the first state, the near-field communication chip 400 can be electrically connected to the first conductor structure 500 or the second conductor structure 600 and transmit a differential excitation current. For example, the near-field communication chip 400 can form a first conductive loop S1 with the first conductor structure 500, the third conductor structure 700, and the ground system 800, and transmit the differential excitation current. The near-field communication chip 400 can also form a second conductive loop S2 with the second conductor structure 600, the third conductor structure 700, and the ground system 800, and transmit the differential excitation current.

[0118] It is understandable that when the third conductor structure 700 is disposed on the second body 200 , the third conductive loop S3 can be formed by adjusting the relative positions of the conductor structures and the near field communication chip 400 . The specific electrical connection method will not be described in detail here.

[0119] It should be noted that Figures 18 to 21 This is merely an illustrative description of the electrical connection mode when the electronic device 10 is in the first state and the second state, and the embodiments of the present application are not limited thereto. Other solutions that can achieve the purpose of the invention of this application are within the scope of protection of the embodiments of the present application.

[0120] In the electronic device 10 of the embodiment of the present application, when the first body 100 and the second body 200 are in the second state away from each other, the near-field communication chip 400 forms a third conductive loop S3 with the first conductor structure 500 and the second conductor structure 600 and jointly transmits a differential excitation current. The third conductor loop has a wider coverage range and a wider sensing area of ​​the NFC signal, which can ensure that the electronic device 10 has better NFC performance.

[0121] Based on the structure of the electronic device 10, please refer to Figure 22 , Figure 22 This is a fourth structural diagram of the electronic device 10 provided in an embodiment of the present application. The electronic device 10 may further include one or both of a first non-near field communication chip 1100 and a second non-near field communication chip 1200 .

[0122] The first non-near field communication chip 1100 can provide a first non-near field communication excitation current, and the first conductor structure 500 can be directly or indirectly electrically connected to the first non-near field communication chip 1100 to transmit the first non-near field communication excitation current. For example, a seventh electrical connection point 530 can be provided on the first conductor structure 500, and the first non-near field communication chip 1100 can be electrically connected to the seventh electrical connection point 530. The first non-near field communication excitation current can flow on the first conductor structure 500 and return to ground through the second electrical connection point 520.

[0123] The second non-near field communication chip 1200 can provide a second non-near field communication excitation current, and the second conductor structure 600 can be directly or indirectly electrically connected to the second non-near field communication chip 1200 to transmit the second non-near field communication excitation current. For example, an eighth electrical connection point 630 can be provided on the second conductor structure 600, and the second non-near field communication chip 1200 can be electrically connected to the eighth electrical connection point 630. The second non-near field communication excitation current can flow on the second conductor structure 600 and return to ground through the fourth electrical connection point 620.

[0124] It is understood that the first non-near field communication excitation signal and the second non-near field communication excitation signal may be unbalanced signals. The first non-near field communication excitation signal and the second non-near field communication excitation signal may be, but are not limited to, cellular network signals, Wireless Fidelity (Wi-Fi) signals, Global Positioning System (GPS) signals, Bluetooth (BT) signals, etc. Accordingly, the first non-near field communication chip 1100 and the second non-near field communication chip 1200 may be, but are not limited to, cellular communication chips, Wi-Fi communication chips, GPS communication chips, BT communication chips, etc.

[0125] It is understandable that the first non-near field communication chip 1100 and the second non-near field communication chip 1200 can be chips that transmit the same wireless signal or chips that transmit different wireless signals, and this embodiment of the application is not limited to this.

[0126] It should be noted that the electronic device 10 may further include a third non-near-field communication chip (not shown), which can provide a third non-near-field communication excitation current. The third conductor structure 700 can be directly or indirectly electrically connected to the third non-near-field communication chip to transmit the third non-near-field communication excitation current. For related solutions of the third non-near-field communication chip, please refer to the description of the first non-near-field communication chip 1100 and the second non-near-field communication chip 1200 and will not be described in detail here.

[0127] It is understood that when the first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 of the embodiment of the present application only support the transmission of NFC signals, the three conductor structures may not be electrically connected to the ground system 800 and are not grounded. When the first conductor structure 500, the second conductor structure 600, and the third conductor structure 700 are multiplexed to support the transmission of non-NFC signals, the three conductor structures may be electrically connected to the ground system 800 and grounded. The connection and disconnection between each conductor structure and the ground system 800 can be controlled by a switching circuit 900 or other switching circuit. This embodiment of the present application is not described here.

[0128] The first conductor structure 500 and the second conductor structure 600 of the embodiment of the present application can transmit both differential excitation current and non-near-field communication excitation current. The first conductor structure 500 and the second conductor structure 600 can be reused, which can reduce the number of conductor structures for transmitting wireless signals in the electronic device 10 and realize a miniaturized design of the electronic device 10.

[0129] It should be noted that the above is merely an illustrative example of the electronic device 10 of the present embodiment. The structure of the electronic device 10 is not limited thereto. For example, but not limited to, the electronic device 10 may further include a circuit board and a battery. The circuit board may be disposed in either the first body 100 or the second body 200; the battery may be disposed in either the first body 100 or the second body 200. It is understood that the structures of the circuit board and battery can be found in the relevant art and will not be described in detail here.

[0130] It should be noted that the above embodiments of the present application can be arbitrarily combined without conflict, and the combined solutions are also within the protection scope of the embodiments of the present application.

[0131] Based on the structure of the above electronic device 10, the embodiment of the present application further provides a control method, which can be applied to the electronic device 10 of any of the above embodiments. Figure 23 , Figure 23 This is a schematic diagram of a first flow chart of a control method provided in an embodiment of the present application. The electronic device 10 includes a first body 100, a second body 200, a first conductor structure 500, a second conductor structure 600, and a near-field communication chip 400. The first conductor structure 500 can be provided on the first body 100, the second conductor structure 600 can be provided on the second body 200, and the near-field communication chip 400 can be provided on the first body 100 or the second body 200. The second body 200 can move relative to the first body 100 so that the second body 200 and the first body 100 can be in a first state close to each other or a second state away from each other. The control method includes:

[0132] In 101, current states of the first body 100 and the second body 200 are determined, where the current states are the first state and the second state;

[0133] like Figures 1 to 3 As shown, the relative movement of the first body 100 and the second body 200 can put the first body 100 and the second body 200 into different states. The electronic device 10 can determine the current states of the first body 100 and the second body 200 by detecting the motion parameters of the first body 100 and the second body 200.

[0134] For example, the electronic device 10 can obtain the rotation parameters of the motor, gear, and determine the current state of the electronic device 10 through the rotation parameters. For another example, the electronic device 10 can obtain the rotation parameters of a Hall element, such as a circular magnet, to determine the current state of the electronic device 10. For another example, a plurality of feature points can be set on the first body 100 or the second body 200, each feature point being associated with the relative motion distance of the first body 100 and the second body 200. The camera component captures an image containing the feature points, and the motion distance of the first body 100 and the second body 200 is determined by identifying the feature points in the image, thereby determining the current state of the first body 100 and the stacked body.

[0135] It should be noted that the above is only an illustrative example of determining the current status of the first body 100 and the second body 200, and other solutions that can determine the current status are all within the scope of protection of the embodiments of the present application. The embodiments of the present application do not specifically limit this.

[0136] In 102 , in a first state, the near field communication chip 400 is controlled to be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 and transmit a differential excitation current;

[0137] In 103 , in the second state, the near field communication chip 400 is controlled to be electrically connected to at least one of the second conductor structure 600 and the first conductor structure 500 and transmit a differential excitation current. The conductor structures electrically connected to the near field communication chip 400 in the second state and the first state are different.

[0138] When the first body 100 and the second body 200 are close to each other and in a first state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and transmit a differential excitation current. When the first body 100 and the second body 200 are away from each other and in a second state, the near-field communication chip 400 can be directly or indirectly electrically connected to the second conductor structure 600 and transmit a differential excitation current. Thus, the conductor structures electrically connected to the near-field communication chip 400 are different in the first state and the second state.

[0139] When the first body 100 and the second body 200 are close to each other and in a first state, the near-field communication chip 400 can be directly or indirectly electrically connected to the second conductor structure 600 and transmit a differential excitation current. When the first body 100 and the second body 200 are away from each other and in a second state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and transmit a differential excitation current. Thus, the conductor structures electrically connected to the near-field communication chip 400 are different in the first state and the second state.

[0140] When the first body 100 and the second body 200 are close to each other and in a first state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 or the second conductor structure 600 and transmit a differential excitation current. When the first body 100 and the second body 200 are away from each other and in a second state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and the second conductor structure 600 and jointly transmit a differential excitation current. Therefore, in the first state and the second state, the conductor structures electrically connected to the near-field communication chip 400 are different.

[0141] When the first body 100 and the second body 200 are close to each other and in a first state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 and the second conductor structure 600, and jointly transmit a differential excitation current. When the first body 100 and the second body 200 are away from each other and in a second state, the near-field communication chip 400 can be directly or indirectly electrically connected to the first conductor structure 500 or the second conductor structure 600, and transmit a differential excitation current. Therefore, in the first state and the second state, the conductor structures electrically connected to the near-field communication chip 400 are different.

[0142] It is understood that when the electronic device 10 includes the third conductor structure 700, the third conductor structure 700 can be electrically connected to the near-field communication chip 400, so that the third conductor structure 700, the near-field communication chip 400, and the first conductor structure 500 together form a first conductive loop S1 and transmit a differential excitation current. The third conductor structure 700 can also form a second conductive loop S2 together with the near-field communication chip 400 and the second conductor structure 600 and transmit a differential excitation current. Of course, the third conductor structure 700 can also form a third conductive loop S3 together with the near-field communication chip 400, the first conductor structure 500, and the second conductor structure 600 and transmit a differential excitation current.

[0143] According to the control method of the embodiment of the present application, when the first body 100 and the second body 200 are in a first state close to each other, the near-field communication chip 400 can select a conductor structure from the first conductor structure 500 and the second conductor structure 600 and electrically connect it to transmit a differential excitation current; when the first body 100 and the second body 200 are in a second state away from each other, the near-field communication chip 400 can select another conductor structure from the first conductor structure 500 and the second conductor structure 600 and electrically connect it to transmit a differential excitation current; thus, the near-field communication chip 400 can select different conductor structures under different forms of the electronic device 10 to support the transmission of NFC signals, the NFC antenna of the electronic device 10 can better adapt to changes in its form, and the electronic device 10 has stronger adaptability to the communication environment.

[0144] In the first state, a projection of at least a portion of the second conductor structure 600 on the first body 100 may be located outside the first body 100, and in the first state, at least a portion of the second conductor structure 600 is not blocked. In this case, in the first state, controlling the near-field communication chip 400 to be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 and transmitting a differential excitation current includes: controlling the near-field communication chip 400 to be electrically connected to the second conductor structure 600 and transmitting a differential excitation current in the first state.

[0145] In the first state, a projection of at least a portion of the first conductor structure 500 on the second body 200 may be located outside the second body 200, and in the first state, at least a portion of the first conductor structure 500 is not obstructed. In this case, in the first state, controlling the near-field communication chip 400 to be electrically connected to at least one of the first conductor structure 500 and the second conductor structure 600 and transmitting a differential excitation current includes: controlling the near-field communication chip 400 to be electrically connected to the first conductor structure 500 and transmitting a differential excitation current in the first state.

[0146] In which, in the second state, controlling the near-field communication chip 400 to be electrically connected to at least one of the second conductor structure 600 and the first conductor structure 500 and transmitting the differential excitation current includes: in the second state, controlling the near-field communication chip 400 to be connected in series with the first conductor structure 500 and the second conductor structure 600 and transmitting the differential excitation current.

[0147] Based on this, please refer to Figure 24 , Figure 24 This is a second flow diagram of the control method provided in an embodiment of the present application. At least a portion of the second conductor structure 600 may be projected onto the first body 100 outside the first body 100, and in the first state, at least a portion of the second conductor structure 600 is not obscured. In this case, the control method includes:

[0148] In 201 , the current state of the first body 100 and the second body 200 is determined, and the current state is the first state or the second state;

[0149] In 202 , in a first state, the near field communication chip 400 is controlled to be electrically connected to the second conductor structure 600 and transmit a differential excitation current;

[0150] In 203 , in the second state, the near field communication chip 400 is controlled to be electrically connected to the first conductor structure 500 and transmit a differential excitation current.

[0151] In the electronic device 10 of the embodiment of the present application, when the first body 100 and the second body 200 are in a first state close to each other, the near-field communication chip 400 selects the second conductor structure 600 that is not blocked by the first body 100 to jointly transmit the differential excitation current, thereby ensuring that the electronic device 10 has better NFC performance.

[0152] Please refer to Figure 25 , Figure 25 This is a third flow diagram of the control method provided in an embodiment of the present application. The projection of at least a portion of the second conductor structure 600 on the first body 100 may be located outside the first body 100. In the first state, at least a portion of the second conductor structure 600 is not obstructed. In this case, the control method includes:

[0153] In 301 , the current state of the first body 100 and the second body 200 is determined, and the current state is either the first state or the second state;

[0154] In 302 , in a first state, the near field communication chip 400 is controlled to be electrically connected to the second conductor structure 600 and transmit a differential excitation current;

[0155] In 303 , in the second state, the near field communication chip 400 , the first conductor structure 500 , and the second conductor structure 600 are controlled to be connected in series and transmit a differential excitation current.

[0156] In the control method of the embodiment of the present application, when the first body 100 and the second body 200 are in the second state away from each other, the near-field communication chip 400 forms a third conductive loop S3 with the first conductor structure 500 and the second conductor structure 600 and jointly transmits a differential excitation current. The third conductor loop has a wider coverage range and a wider sensing area of ​​the NFC signal, which can ensure that the electronic device 10 has better NFC performance.

[0157] It should be noted that the above is only an exemplary description of the control method of the embodiment of the present application. The embodiment of the above control method and the embodiment of the above electronic device 10 are embodiments of different themes under the same inventive concept. Under the premise of no conflict, any embodiment of the above electronic device 10 can be applied to the embodiment of the above control method and arbitrarily combined. The combined embodiment is still within the protection scope of the embodiment of the present application.

[0158] The electronic device and control method provided in the embodiments of the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. At the same time, for those skilled in the art, according to the ideas of the present application, there will be changes in the specific implementation methods and scope of application. In summary, the content of this specification should not be understood as limiting the present application.

Claims

1. An electronic device, characterized in that: include: The first body comprises a first side and a second side that are oppositely disposed; a first conductor structure, disposed on the first body, wherein the distance between the first conductor structure and the first side is greater than the distance between the first conductor structure and the second side; The second body is slidably or pullably movable relative to the first body, so that the second body and the first body can be in a first state in which the second body and the first body are close to each other or in a second state in which the second body and the first body are separated from each other; the second body includes a third side and a fourth side that are oppositely arranged, and in the second state, the distance between the third side and the second side is smaller than the distance between the third side and the first side; a second conductor structure disposed on the second body, wherein in the first state, a projection of the second conductor structure on the first body is located outside the first body; the second conductor structure includes a third electrical connection point and a fourth electrical connection point spaced apart; and the distance between the second conductor structure and the fourth side is greater than the distance between the second conductor structure and the third side. a third conductor structure disposed on the first body; in the first state, a projection of the third conductor structure on the second body is located outside the second body; a distance between the third conductor structure and the first side is smaller than a distance between the third conductor structure and the second side; the third conductor structure includes a fifth electrical connection point and a sixth electrical connection point disposed at intervals; a grounding system comprising a second grounding point and a third grounding point spaced apart from each other, wherein a second conductive path is formed between the second grounding point and the third grounding point, the fourth electrical connection point is electrically connected to the second grounding point, and the sixth electrical connection point is electrically connected to the third grounding point; and A near field communication chip is provided in the first body, and the near field communication chip is used to provide a differential excitation current; wherein, In the first state, the near field communication chip is electrically connected to the third conductor structure and the second conductor structure, and the near field communication chip, the third conductor structure, the second conductive path, and the second conductor structure jointly transmit the differential excitation current; In the second state, the near-field communication chip is electrically connected to the third conductor structure, the first conductor structure, and the second conductor structure, and the near-field communication chip, the third conductor structure, the second conductive path, the second conductor structure, and the first conductor structure jointly transmit the differential excitation current. The conductor structures electrically connected to the near-field communication chip in the second state and the first state are different.

2. The electronic device according to claim 1, wherein A first area is provided on the first body. In the first state, the first area is located outside a projection area of ​​the second body on the first body. The third conductor structure is provided in the first area.

3. The electronic device according to claim 1, wherein The third conductor structure is a coil structure or a radiation branch structure.

4. The electronic device according to any one of claims 1 to 3, characterized in that: Also includes: A switching circuit is provided in the first body or the second body, and the switching circuit is electrically connected to the near-field communication chip, the first conductor structure, and the second conductor structure respectively. The switching circuit is used to conduct the near-field communication chip with at least one of the first conductor structure and the second conductor structure.

5. The electronic device according to claim 4, characterized in that The switching circuit is electrically connected to the near field communication chip, the first conductor structure or the second conductor structure through a flexible connector.

6. The electronic device according to claim 4, characterized in that The first body is provided with a first electrical contact electrically connected to the first conductor structure, the second body is provided with a second electrical contact electrically connected to the second conductor structure, and the switching circuit is used to connect to the first electrical contact or the second electrical contact and achieve electrical connection.

7. The electronic device according to claim 4, wherein: The switching circuit includes a switching switch or a blocking circuit.

8. The electronic device according to any one of claims 1 to 3, characterized in that: It also includes at least one of a first non-near field communication chip and a second non-near field communication chip; wherein, The first non-near field communication chip is used to provide a first non-near field communication excitation current, and the first conductor structure is electrically connected to the first non-near field communication chip to transmit the first non-near field communication excitation current; The second non-near field communication chip is used to provide a second non-near field communication excitation current, and the second conductor structure is electrically connected to the second non-near field communication chip to transmit the second non-near field communication excitation current.

9. A control method, characterized in that: Applied to an electronic device, the electronic device includes a first body, a second body, a first conductor structure, a second conductor structure, a third conductor structure, a ground system and a near-field communication chip, the near-field communication chip is used to provide a differential excitation current, the first conductor structure and the third conductor structure are arranged on the first body, the second conductor structure is arranged on the second body, the first body includes a first side and a second side arranged opposite to each other, the distance between the first conductor structure and the first side is greater than the distance between the first conductor structure and the second side; the second body includes a third side and a fourth side arranged opposite to each other, the distance between the second conductor structure and the fourth side is greater than the distance between the second conductor structure and the third side; the distance between the third conductor structure and the first side is less than the distance between the third conductor structure and the second side; the second body can slide or pull relative to the first body to make the first conductor structure The two bodies can be in a first state close to each other or a second state away from each other with respect to the first body; in the second state, the distance between the third side and the second side is smaller than the distance between the third side and the first side, the projection of the second conductor structure on the first body is located outside the first body, and the projection of the third conductor structure on the second body is located outside the second body; the second conductor structure includes a third electrical connection point and a fourth electrical connection point arranged at intervals, and the third conductor structure includes a fifth electrical connection point and a sixth electrical connection point arranged at intervals; the ground system includes a second grounding point and a third grounding point arranged at intervals, a second conductive path is formed between the second grounding point and the third grounding point, the fourth electrical connection point is electrically connected to the second grounding point, and the sixth electrical connection point is electrically connected to the third grounding point; the control method includes: Determine a current state of the first entity and the second entity, where the current state is the first state or the second state; In the first state, controlling the near field communication chip to be electrically connected to the third conductor structure and the second conductor structure, and making the near field communication chip, the third conductor structure, the second conductive path, and the second conductor structure jointly transmit the differential excitation current; In the second state, the near-field communication chip is controlled to be electrically connected to the third conductor structure, the first conductor structure, and the second conductor structure, and the near-field communication chip, the third conductor structure, the second conductive path, the second conductor structure, and the first conductor structure jointly transmit the differential excitation current. The conductor structures electrically connected to the near-field communication chip in the second state and the first state are different.

Images