Fine line board based on nail-shaped structure fixed metal line and its manufacturing method

Abstract

The application provides a fine circuit board based on a nail-shaped structure fixed metal circuit and a preparation method thereof, wherein the fine circuit board comprises a circuit board and a metal circuit arranged on the circuit board, and the metal circuit is fixedly connected with a plurality of nail-shaped bodies inserted into the circuit board and fixed on the surface of the circuit board; the preparation method provided by the application forms the nail-shaped bodies integrally connected with the metal circuit through the cooperation of micropores, cavities and nano metal particles sintering to fix the metal circuit on the circuit board, or fixes the metal circuit on the circuit board through the cooperation of micro fixing nails inserted into the circuit board and nano metal particles sintering, so that the metal circuit and the fine circuit board are connected by the nail-shaped bodies, the combination between the metal circuit and the fine circuit board is improved, and the metal circuit is not easy to fall off from the fine circuit board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuits, in particular to a fine circuit board based on a nail-shaped structure for fixing metal lines and a preparation method thereof. BACKGROUND

[0002] A circuit board is a support body and an electrical connection carrier of electronic components. With the development of electronic products towards miniaturization and digitization, the precision requirement of circuits on the circuit board is also increasing. The circuit made of nanometer metal has high precision, but the combination of the circuit board and the metal circuit by traditional welding method is poor and easy to fall off.

[0003] At present, there is no effective technical solution to the above problems. SUMMARY

[0004] The purpose of the embodiments of the present application is to provide a fine circuit board based on a nail-shaped structure for fixing metal lines and a preparation method thereof, which has stable metal line installation and is not easy to fall off.

[0005] In a first aspect, the embodiments of the present application provide a fine circuit board based on a nail-shaped structure for fixing metal lines, comprising a circuit board and a metal line arranged on the circuit board, wherein the metal line is fixedly connected with a plurality of nail-shaped bodies inserted into the circuit board and fixed on the surface of the circuit board.

[0006] The fine circuit board based on a nail-shaped structure for fixing metal lines provided by the embodiments of the present application connects the metal line and the fine circuit board by the nail-shaped body, improves the combination between the metal line and the fine circuit board, and makes the metal line not easy to fall off from the fine circuit board.

[0007] The fine circuit board based on a nail-shaped structure for fixing metal lines, wherein a plurality of tapered holes are arranged on the circuit board, the tapered holes have spherical cavities at the bottom, the nail-shaped bodies are inserted into the tapered holes, and the bottom of the nail-shaped body is hooked to the spherical cavities.

[0008] The fine circuit board based on a nail-shaped structure for fixing metal lines, wherein the nail-shaped body is integrally formed with the metal line.

[0009] The fine circuit board based on a nail-shaped structure for fixing metal lines, wherein the nail-shaped body is in interference fit with the circuit board, and the top of the nail-shaped body is embedded in the metal line.

[0010] The fine circuit board based on a nail-shaped structure for fixing metal lines, wherein the top of the nail-shaped body has a nail cap embedded in the metal line.

[0011] In a second aspect, the embodiments of the present application further provide a preparation method of a fine circuit board with metal lines fixed based on a nail-shaped structure, which is used for forming or repairing the fine circuit board, and comprises the following steps:

[0012] S101, according to a predetermined line distribution, a plurality of micro-holes are punched on the circuit board by using a laser;

[0013] S102, a cavity is punched at the bottom of the micro-hole by using a laser;

[0014] S103, nano-metal particles are coated on the circuit board, and the micro-holes and the cavity are filled with the nano-metal particles;

[0015] S104, along the predetermined line distribution, the nano-metal particles on the circuit board are subjected to a sintering treatment, so that the nano-metal particles are sintered to form metal lines with nail-shaped bodies inserted into the micro-holes;

[0016] S105, the surface of the circuit board is cleaned to remove the nano-metal particles which are not subjected to the sintering.

[0017] The preparation method of the fine circuit board with metal lines fixed based on the nail-shaped structure further comprises a step S106 of annealing the circuit board according to the sintering degree of the nano-metal particles.

[0018] The preparation method of the fine circuit board with metal lines fixed based on the nail-shaped structure, wherein in the step S103, the nano-metal particles coated on the circuit board are nano-metal particle powder or a paste containing nano-metal particles.

[0019] The preparation method of the embodiments of the present application can fix the metal lines on the circuit board by setting the micro-holes, the cavity and the nano-metal particles to sinter the nail-shaped bodies which are integrally connected to the metal lines. Compared with the traditional welding method, the preparation method can fix the metal lines on the circuit board through the physical structure from the line forming stage, and has the characteristics of convenient preparation and stable connection of the metal lines.

[0020] In a third aspect, the embodiments of the present application further provide a preparation method of a fine circuit board with metal lines fixed based on a nail-shaped structure, which is used for forming or repairing the fine circuit board, and comprises the following steps:

[0021] S201, according to a predetermined line distribution, a plurality of micro-fixing nails are vertically inserted into the circuit board;

[0022] S202, a nano-metal particle layer is coated on the circuit board, and the nano-metal particle layer covers the exposed ends of the micro-fixing nails;

[0023] S203, sintering the nano metal particle layer along the predetermined line distribution, so that the nano metal particle layer forms a metal line fixedly connected with the micro fixing nail;

[0024] S204, cleaning the surface of the line board to remove the nano metal particles that are not sintered.

[0025] The preparation method of the embodiment fixes the metal line on the line board by setting the micro fixing nail penetrating into the line board and cooperating with the nano metal particle sintering, and has the characteristics of convenient preparation and stable connection of the metal line.

[0026] In a fourth aspect, the embodiment of the present application also provides a preparation method of a fine line board for fixing a metal line based on a nail-shaped structure, which is used for forming or repairing the fine line board, and includes the following steps:

[0027] S301, coating a nano metal particle layer on the line board;

[0028] S302, according to the predetermined line distribution, vertically penetrating a plurality of micro fixing nails into the line board;

[0029] S303, sintering the nano metal particle layer along the predetermined line distribution, so that the nano metal particle layer forms a metal line fixedly connected with the micro fixing nail;

[0030] S304, cleaning the surface of the line board to remove the nano metal particles that are not sintered.

[0031] The preparation method of the embodiment fixes the metal line on the line board by setting the micro fixing nail penetrating into the line board and cooperating with the nano metal particle sintering, and has the characteristics of convenient preparation and stable connection of the metal line.

[0032] As can be seen from the above, the fine line board for fixing a metal line based on a nail-shaped structure and the preparation method thereof provided by the embodiment of the present application fix the metal line on the line board by setting the micro hole, cavity and cooperating with the nano metal particle sintering to form a nail-shaped body integrally connected with the metal line, or by setting the micro fixing nail penetrating into the line board and cooperating with the nano metal particle sintering, so as to obtain a fine line board connected with the metal line by the nail-shaped body, which improves the combination between the metal line and the fine line board, and makes the metal line not easy to fall off from the fine line board. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 The structure schematic diagram of the fine line board for fixing a metal line based on a nail-shaped structure provided by the embodiment of the present application is shown.

[0034] Figure 2This is a schematic diagram of a second embodiment of a fine circuit board based on a nail-shaped structure for fixing metal circuits, provided in this application.

[0035] Figure 3 This is a schematic diagram of the structure of a fine circuit board based on a nail-shaped structure for fixing metal circuits, as provided in this application.

[0036] Figure 4 The flowchart of the method for preparing a fine circuit board based on a nail-shaped structure to fix metal circuits in Embodiment 1 of this application is provided for the present application.

[0037] Figure 5 The flowchart of the method for preparing a fine circuit board based on a nail-shaped structure to fix metal circuits in Embodiment 2 of this application is provided for the present application.

[0038] Figure 6 The flowchart of the method for preparing a fine circuit board based on a nail-shaped structure to fix metal circuits in Embodiment 3 of this application is provided for the present application.

[0039] Reference numerals: 1. Circuit board; 2. Metal circuit; 3. Nail-shaped body. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0041] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0042] Firstly, please refer to Figures 1-3 , Figures 1-3 This application describes a fine circuit board based on a nail-shaped structure for fixing metal circuits. It includes a circuit board 1 and metal circuits 2 disposed on the circuit board 1. The metal circuits 2 are fixedly connected to a plurality of nail-shaped bodies 3 inserted into the circuit board 1 and fixed to the surface of the circuit board 1.

[0043] The fine circuit board based on the nail-shaped structure fixed metal line provided by the embodiment of the application utilizes the nail-shaped body 3 to connect the metal line 2 and the fine circuit board, improves the combination between the metal line 2 and the fine circuit board, and makes the metal line 2 not easy to fall off the fine circuit board.

[0044] Compared with the traditional welding method, the fine circuit board of the embodiment of the application fixes the metal line on the circuit board 1 through the physical structure of the nail-shaped body 3, has the characteristics of close and stable connection.

[0045] In some preferred embodiments, the plurality of nail-shaped bodies 3 are arranged along the wiring condition of the metal line 2, and the plurality of nail-shaped bodies 3 cooperate with the plurality of tapered holes to fix the metal line 2 as a whole on the circuit board 1 along the wiring condition, thereby ensuring the stable installation of the metal line 2 as a whole.

[0046] The embodiment of the application provides two metal line fixing structures based on the nail-shaped structure, as shown in Figure 1 The metal line 2 is fixed on the circuit board 1 through the nail-shaped body 3, the circuit board 1 is provided with a plurality of tapered holes, the bottom of the tapered hole has a spherical cavity, the nail-shaped body 3 is inserted into the tapered hole, and the bottom is hooked to the spherical cavity.

[0047] Specifically, the bottom of the nail-shaped body 3 fixedly connected with the metal line 2 is hooked to the spherical cavity at the bottom of the tapered hole, which can prevent the metal line 2 from shaking up and down relative to the circuit board 1, and ensure that the metal line 2 is tightly attached to the circuit board 1.

[0048] In some preferred embodiments, the inner circumferential surface of the tapered hole is tightly attached to the outer circumferential surface of the nail-shaped body 3, so as to prevent the horizontal displacement of the nail-shaped body 3, that is, to prevent the horizontal displacement of the metal line 2 on the surface of the circuit board 1.

[0049] In some preferred embodiments, the bottom of the nail-shaped body 3 has a ball head end that fits the spherical cavity and hooks the spherical cavity.

[0050] In some preferred embodiments, the nail-shaped body 3 is integrally formed with the metal line 2, so that the nail-shaped body 3 is fixedly connected with the metal line 2, thereby further improving the connection combination between the metal line 2 and the circuit board 1, and avoiding the problem that the metal line 2 is loose due to different thermal expansion properties of the nail-shaped body 3 and the metal line 2.

[0051] The fine circuit board of the embodiment is fixed on the circuit board 1 through the integrally formed nail-shaped body 3 and the metal line 2, which can effectively ensure the close connection and combination of the metal line 2 and the circuit board 1, and effectively prevent the metal line 2 from falling off the circuit board 1.

[0052] The other metal line fixing structure based on the nail-shaped structure provided by the embodiment of the application is as shown in Figure 2 and3 As shown, the metal circuit 2 is fixed to the circuit board 1 by a nail-like body 3. The nail-like body 3 is interference-fitted with the circuit board 1, and the top of the nail-like body 3 is embedded in the metal circuit 2.

[0053] Specifically, the top of the nail-shaped body 3 is embedded in the metal circuit 2, which can effectively prevent the nail-shaped body 3 from falling out of the metal circuit 2. The nail-shaped body 3 is fixed to the circuit board 1 with an interference fit, so that the metal circuit 2 can be connected and fixed to the circuit board 1. It has the characteristics of convenient operation and stable installation.

[0054] In some preferred embodiments, the nail 3 can be directly driven into the circuit board 1 for fixing to achieve an interference fit, or a blind hole can be set on the circuit board 1 and the nail 3 can be inserted into the blind hole to achieve an interference fit. In this embodiment, the direct driving method is preferred to simplify the installation process.

[0055] In some preferred embodiments, the nail 3 is a miniature fixation nail.

[0056] In some preferred embodiments, the top of the nail 3 has a nail head embedded in the metal line 2. The nail 3 can effectively prevent itself from detaching from the metal line 2 by hooking the metal line 2 with the nail head embedded in the metal line 2.

[0057] In this embodiment, the precision circuit board achieves a fixed connection between the circuit board 1 and the metal circuit 2 by embedding the nail-like body 3 into the metal circuit 2 and mounting it on the circuit board 1 with an interference fit. This effectively ensures the tightness and bonding of the metal circuit 2 and the circuit board 1, and effectively prevents the metal circuit 2 from falling off the circuit board 1.

[0058] Secondly, embodiments of this application provide a method for preparing a fine circuit board based on a nail-like structure for fixing metal circuits, used for forming or repairing fine circuit boards, such as... Figure 4 As shown, it includes the following steps:

[0059] S101. According to the predetermined line distribution, use a laser to drill several micro-holes on the circuit board.

[0060] The predetermined line distribution refers to the metal line distribution in the fine circuit board design. Based on the metal line distribution, micro-holes are drilled in the center line section where the line passes through. Micro-holes can be formed on the circuit board by irradiating with a single laser beam or multiple laser beams.

[0061] S102. Use a laser to create a cavity at the bottom of the micropore;

[0062] Specifically, a cavity can be formed by heating the bottom of a micropore after a confocal laser passes through it. This cavity has a horizontal cross-sectional perimeter larger than that of the top port of the micropore.

[0063] S103, coating the nano metal particles on the circuit board, and filling the micro holes and cavities with the nano metal particles;

[0064] S104, sintering the nano metal particles on the circuit board along the predetermined line distribution, so that the nano metal particles are sintered to form metal lines with nail-shaped bodies inserted into the micro holes;

[0065] S105, cleaning the surface of the circuit board to remove the nano metal particles that have not been sintered.

[0066] Specifically, the preparation method of the embodiment can directly prepare a fine circuit board as shown. Figure 1

[0067] In some preferred embodiments, the nano metal particles are nano copper particles.

[0068] In some preferred embodiments, the cavities are one of spherical, cylindrical, and platform-shaped, and in the embodiment, the cavities are preferably spherical.

[0069] In some preferred embodiments, the micro holes are one of conical, cylindrical, pyramidal, and prismatic, and in the embodiment, the micro holes are preferably conical, i.e., conical holes, which are beneficial for guiding the nano metal particles to fill into the spherical cavities and also make the size of the spherical cavities smaller to save the amount of nano metal particles and thus save costs, while ensuring that the nail-shaped bodies can be tightly hooked on the spherical cavities.

[0070] In some preferred embodiments, the waste generated by the circuit board needs to be removed after the micro holes are punched by the laser, and the waste generated by the circuit board needs to be removed after the spherical cavities are punched by the laser.

[0071] In some preferred embodiments, the micro holes are equidistantly arranged along the predetermined line distribution direction, so that the nail-shaped bodies at the micro holes are equidistantly arranged along the predetermined line distribution direction, which ensures that the metal lines are uniformly fixed on the circuit board and further improves the combination of the metal lines and the circuit board.

[0072] In some preferred embodiments, the method further comprises step S106, annealing the circuit board according to the sintering degree of the nano metal particles; specifically, the nano metal particles can be annealed under appropriate conditions according to the sintering mode and sintering conditions of the nano metal particles, which can enhance the combination between the nano metal particles and improve the structural strength of the metal lines, effectively preventing the nail-shaped bodies from being broken and causing the metal lines to fall off.

[0073] In some preferred embodiments, the annealing temperature is 250-350°C, and the holding time is 1-120 min, which can effectively enhance the structural strength of the metal lines.

[0074] ​In some preferred embodiments, in step S103, the nano-metal particles coated on the circuit board are nano-metal particle powder or paste containing nano-metal particles.

[0075] In some preferred embodiments, in step S103, the nano-metal particles are coated on the circuit board through a nozzle to ensure that the nano-metal particles can completely fill the micropores and cavities, so that the formed metal circuit has a nail-shaped body tightly fitted with the circuit board.

[0076] In some preferred embodiments, in step S104, laser sintering or heating sintering is used for sintering treatment of the nano-metal particles. When laser sintering is used, the laser traces according to the predetermined circuit distribution to sinter the nano-metal particles to form a metal circuit. During the laser circuit tracing process, the laser slightly stays at the micropore position to ensure that the nano-metal particles can be sintered to form a nail-shaped body inserted into the micropore and hooked to the cavity.

[0077] In this embodiment, the nano-metal particles are preferably paste. The paste sintering preferably uses laser sintering. The laser preferably uses a segment pulse width and high power laser. When the laser is focused on the paste, the paste can be quickly sintered into a dense metal circuit.

[0078] In some preferred embodiments, when the nano-metal particles are selected as paste, the nano-metal particles are added to an organic alcohol reagent, and then rosin and flux are added to form the paste when the paste containing nano-metal particles is prepared, which is beneficial to improve the sintering forming efficiency of the metal circuit.

[0079] In some preferred embodiments, in step S105, the surface of the circuit board is cleaned using an oxidizing solvent and an organic solvent, which can effectively remove the excess nano-metal particles on the circuit board.

[0080] The preparation method of this embodiment can prepare a fine circuit board as shown in Figure 2 The method sets micropores and cavities to cooperate with nano-metal particles to sinter a nail-shaped body integrally connected to the metal circuit, which can fix the metal circuit on the circuit board. Compared with the traditional welding method, this preparation method can fix the metal circuit on the circuit board through physical structure from the circuit forming stage, which has the characteristics of convenient preparation and stable metal circuit connection.

[0081] In a third aspect, the embodiments of the present application also provide another preparation method of a fine circuit board for fixing a metal circuit based on a nail-shaped structure, which is used for forming or repairing a fine circuit board, as shown in Figure 5 The method includes the following steps:

[0082] S201, according to the predetermined line distribution, a plurality of micro fixing nails are vertically inserted into the line board; wherein, the predetermined line distribution is the metal line distribution in the fine line board design, according to the metal line distribution, the micro fixing nails are inserted into the center line part of the line passing place;

[0083] S202, a nano metal particle layer is coated on the line board, and the nano metal particle layer covers the exposed end of the micro fixing nail;

[0084] S203, along the predetermined line distribution, the nano metal particle layer is sintered to form a metal line fixedly connected with the micro fixing nail;

[0085] S204, the surface of the line board is cleaned to remove the nano metal particles which are not sintered.

[0086] Specifically, the preparation method of the embodiment can directly prepare the fine line board shown in the figure; wherein, the micro fixing nail is equivalent to the nail-shaped body to fix the metal line on the line board. Figure 2

[0087] In some preferred embodiments, the nano metal particles are nano copper particles.

[0088] In some preferred embodiments, the micro fixing nails are equidistantly arranged along the predetermined line distribution direction, which ensures that the metal line is uniformly fixed on the line board, and further improves the combination of the metal line and the line board.

[0089] In some preferred embodiments, the method further comprises step S205, annealing treatment is performed on the line board according to the sintering degree of the nano metal particles.

[0090] In some preferred embodiments, the annealing treatment temperature is 250-350℃, and the holding time is 1min-120min, which can effectively enhance the structural strength of the metal line.

[0091] In some preferred embodiments, in step S202, the nano metal particles coated on the line board are nano metal particle powder or paste containing nano metal particles.

[0092] In some preferred embodiments, in step S202, the nano metal particles are coated on the line board through a drop nozzle, so as to ensure that the nano metal particles can completely cover the micro fixing nail, and the top surface of the nano metal particles is higher than the micro fixing nail.

[0093] ​In some preferred embodiments, in step S203, laser sintering or heating sintering is used for the sintering treatment of the nano-metal particles. When laser sintering is used, the laser is routed according to the predetermined line distribution to sinter the nano-metal particles to form the metal line.

[0094] In the present embodiment, the nano-metal particles are preferably in the form of a paste, and the paste sintering preferably uses laser sintering, which preferably uses a segment pulse width and high-power laser.

[0095] In some preferred embodiments, when the nano-metal particles are in the form of a paste, the nano-metal particles are added to an organic alcohol reagent, and then rosin and flux are added to form the paste, which is beneficial to improve the sintering forming efficiency of the metal line.

[0096] In some preferred embodiments, in step S204, the surface of the circuit board is cleaned using an oxidizing solvent and an organic solvent.

[0097] The preparation method of the present embodiment can prepare the fine circuit board as shown in Figure 2 The method fixes the metal line on the circuit board by setting the micro fixing nails that penetrate the circuit board and sintering the nano-metal particles, and has the characteristics of convenient preparation and stable connection of the metal line.

[0098] In a fourth aspect, the present embodiment further provides another preparation method of a fine circuit board for fixing a metal line based on a nail-shaped structure, which is used for the forming or repairing of a fine circuit board, as shown in Figure 6 The method includes the following steps:

[0099] S301, coating a nano-metal particle layer on a circuit board;

[0100] S302, vertically penetrating a plurality of micro fixing nails into the circuit board according to a predetermined line distribution;

[0101] S303, sintering the nano-metal particle layer according to the predetermined line distribution, so that the nano-metal particle layer forms a metal line that is fixedly connected to the micro fixing nail;

[0102] S304, cleaning the surface of the circuit board to remove the nano-metal particles that are not sintered.

[0103] Specifically, the preparation method of the present embodiment can directly prepare the fine circuit board in Embodiment Two.

[0104] Specifically, the preparation method of the present embodiment can directly prepare the fine circuit board as shown in Figure 3 The micro fixing nail is equivalent to a nail-shaped body to fix the metal line on the circuit board.

[0105] Specifically, the preparation method adopts the mode of coating the nano metal particle layer first and then inserting the micro fixing nail, which can ensure that the inner side of the nail cap of the micro fixing nail is in close contact with the nano metal particles, improve the tightness between the micro fixing nail and the formed metal circuit, and effectively prevent the micro fixing nail from loosening.

[0106] In some preferred embodiments, the nano metal particles are nano copper particles.

[0107] In some preferred embodiments, the micro fixing nails are equidistantly arranged along the predetermined circuit distribution direction.

[0108] In some preferred embodiments, the method further comprises step S305 of annealing the circuit board according to the sintering degree of the nano metal particles.

[0109] In some preferred embodiments, the annealing temperature is 250-350°C, and the holding time is 1-120 min, which can effectively enhance the structural strength of the metal circuit.

[0110] In some preferred embodiments, in step S301, the nano metal particles coated on the circuit board are nano metal particle powder or paste containing nano metal particles.

[0111] In some preferred embodiments, in step S301, the nano metal particles are coated on the circuit board through a drop nozzle.

[0112] In some preferred embodiments, in step S303, laser sintering or heating sintering is used for the sintering treatment of the nano metal particles, wherein, when laser sintering is used, the laser is routed according to the predetermined circuit distribution to sinter the nano metal particles to form a metal circuit.

[0113] In this embodiment, the nano metal particles are preferably paste, and the paste sintering preferably uses laser sintering, and the laser preferably uses a segment pulse width and high power.

[0114] In some preferred embodiments, when the nano metal particles are paste, the nano metal particles are added to an organic alcohol reagent, and then rosin and flux are added to form the paste, which is beneficial to improve the sintering forming efficiency of the metal circuit.

[0115] In step S304, an oxidizing solvent and an organic solvent are used to clean the surface of the circuit board.

[0116] The preparation method of this embodiment can prepare a circuit board as shown in Figure 3The method fixes the metal circuit on the circuit board by setting the micro fixing nail penetrating into the circuit board and cooperating with the nano metal particle sintering, has the characteristics of convenient preparation and stable metal circuit connection.

[0117] Example one

[0118] According to the distribution of the predetermined circuit, a conical micro hole with a depth of 4 μm and a diameter of 1 μm is punched on the circuit board by laser, and a spherical small hole with a radius of 2 μm is punched at the end of the cone by laser focusing; the nano metal particles with a particle size of 50 nm are added to the ethanol solution to configure a paste with a solid content of 75%, which is uniformly coated on the circuit board through the drop nozzle, and the paste thickness is 2 μm; along the distribution of the predetermined circuit, the nano metal particle paste is sintered by laser, so that the metal circuit with a nail-shaped body inserted into the micro hole is formed on the circuit board, and finally the circuit board is cleaned with ethanol solution to remove the excess nano metal particle paste, and the fine circuit board with the fixed metal circuit based on the nail-shaped structure is obtained.

[0119] Example two

[0120] According to the distribution of the predetermined circuit, the conical micro metal nail with a length of 4 μm and a radius of 1 μm is vertically penetrated into the circuit board by the nail gun, and the penetration depth is 3 μm; the nano metal particles with a particle size of 60 nm are added to the ethanol solution to configure a paste with a solid content of 80%, which is uniformly coated on the circuit board through the drop nozzle, and the paste thickness is 2 μm; along the distribution of the predetermined circuit, the nano metal particle paste is sintered by laser; finally, the circuit board is cleaned with ethanol solution to remove the excess nano metal particle paste, and the fine circuit board with the fixed metal circuit based on the nail-shaped structure is obtained.

[0121] Example three

[0122] The nano metal particles with a particle size of 60 nm are added to the ethanol solution to configure a paste with a solid content of 80%, which is uniformly coated on the circuit board through the drop nozzle, and the paste thickness is 2 μm; according to the distribution of the predetermined circuit, the conical micro metal nail with a length of 4 μm and a radius of 1 μm is vertically penetrated into the circuit board coated with the nano metal particle paste by the nail gun, and the penetration depth into the circuit board is 3 μm; along the distribution of the predetermined circuit, the nano metal particle paste is sintered by laser; finally, the circuit board is cleaned with ethanol solution to remove the excess nano metal particle paste, and the fine circuit board with the fixed metal circuit based on the nail-shaped structure is obtained.

[0123] From the above, the fine circuit board based on the nail-shaped structure fixed metal circuit and the preparation method thereof provided by the embodiment of the application, the preparation method fixes the metal circuit on the circuit board by setting the micropore, the cavity and the nano metal particle sintering to form the nail-shaped body connected to the metal circuit, or fixes the metal circuit on the circuit board by setting the micro fixing nail into the circuit board and the nano metal particle sintering, thereby obtaining a kind of nail-shaped body connecting the metal circuit and the fine circuit board, which improves the combination between the metal circuit and the fine circuit board, so that the metal circuit is not easy to fall off from the fine circuit board.

[0124] In the embodiments provided in the present application, it should be understood that the disclosed structures and methods can be implemented in other ways. The structural embodiments described above are only illustrative.

[0125] The above only describes the embodiments of the present application and is not used to limit the protection scope of the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for preparing a fine circuit board based on a nail-like structure for fixing metal circuits, used for forming or repairing fine circuit boards, characterized in that, A fine circuit board based on a nail-like structure for fixing metal circuits includes a circuit board and metal circuits disposed on the circuit board. The metal circuits are fixedly connected to a plurality of nail-like bodies inserted into the circuit board and fixed to the surface of the circuit board. The circuit board is provided with a plurality of conical holes, the bottom of which has a spherical cavity. The nail-like body is inserted into the conical hole and hooks the bottom of the spherical cavity. The method includes the following steps: S101. According to the predetermined line distribution, use a laser to drill several micro-holes on the circuit board. S102. Use a laser to create a cavity at the bottom of the micropore; S103. Coat the circuit board with nano-metal particles and fill the micropores and cavities with nano-metal particles. S104. Along the predetermined line distribution, the nano-metal particles on the circuit board are sintered to form a metal circuit with nail-like bodies inserted into micropores. S105. Clean the surface of the circuit board to remove unsintered nano-metal particles.

2. The method for preparing a fine circuit board based on a nail-like structure for fixing metal circuits according to claim 1, characterized in that, It also includes step S106, annealing the circuit board according to the degree of sintering of the nano-metal particles.

3. The method for preparing a fine circuit board based on a nail-like structure for fixing metal circuits according to claim 1, characterized in that, In step S103, the nano-metal particles coated on the circuit board are nano-metal particle powder or paste containing nano-metal particles.

4. The method for preparing a fine circuit board based on a nail-like structure for fixing metal circuits according to claim 1, characterized in that, The nail-shaped body is integrally formed with the metal circuit.

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