Electronic device

Abstract

The present application discloses an electronic device, comprising: a rotating shaft, a flexible circuit board, and two folding parts; the two folding parts are connected to the rotating shaft and can rotate relative to the rotating shaft so that the electronic device is in an unfolded state or a folded state; any one of the folding parts includes a frame and a bracket, a through hole is provided on the frame, the flexible circuit board passes through the frames of the two folding parts through the through hole, the bracket is arranged in the through hole, a seal is provided on one side of the bracket facing the flexible circuit board, the flexible circuit board is clamped between the seal and the frame, wherein, a glue injection hole is provided on the bracket, the glue injection hole penetrates through the bracket along a first direction, the glue injection hole and the frame enclose a first glue dispensing groove, the first glue dispensing groove is used for dispensing sealant, and a gap formed between the two side edges of the flexible circuit board in a second direction and the frame is correspondingly arranged with the first glue dispensing groove. In an embodiment of the present application, by dispensing sealant into the first glue dispensing groove, the waterproof performance between the flexible circuit board and the frame is improved.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] At present, with the development of foldable electronic device technology, the market demand for foldable electronic devices is increasing continuously. Among all the structural component designs of foldable electronic devices, waterproofing is very important, and the waterproofing of the circuit board at the hinge position plays a crucial role.

[0003] In the related art, for the circuit board at the hinge of a foldable electronic device, the conventional design of its waterproofing solution is as follows: a double-sided adhesive is provided on the circuit board, and a through hole is provided on the frame body. After the circuit board passes through the through hole, it is fixed to the frame body with the double-sided adhesive, and then a foam is attached to the peripheral area of the through hole on the frame body, and a locking screw is used to fix and press the foam. The foam will press the circuit board in the vertical direction to form a seal, playing a waterproof role. However, there will be a gap between the edge area of the circuit board and the frame body, resulting in water being able to enter the interior of the electronic device through this gap area, with poor waterproof performance and easy to cause the failure of the electronic device. Summary of the Invention

[0004] This application aims to provide an electronic device, which at least solves the problem of poor waterproof performance between the circuit board and the frame body, and is easy to cause the failure of the electronic device.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] An embodiment of this application provides an electronic device, including: a hinge, a flexible circuit board, and two folding parts; the two folding parts are connected to the hinge and can rotate relative to the hinge so that the electronic device is in an unfolded state or a folded state; any one of the folding parts includes a frame body and a bracket, a through hole is provided on the frame body, the flexible circuit board passes through the through holes of the two folding parts, the bracket is arranged in the through hole, a sealing member is provided on one side of the bracket facing the flexible circuit board, the flexible circuit board is clamped between the sealing member and the frame body, wherein, a glue injection hole is provided on the bracket, the glue injection hole penetrates through the bracket along a first direction, the glue injection hole and the frame body enclose a first glue dispensing groove, the first glue dispensing groove is used for injecting sealing glue, and the gap enclosed between the two side edges of the flexible circuit board and the frame body in a second direction corresponds to the first glue dispensing groove.

[0007] In an embodiment of the present application, an electronic device includes a rotating shaft, a flexible circuit board, and two folding parts. Any one of the folding parts includes a frame and a bracket. A through hole is provided on the frame. The flexible circuit board and the bracket are arranged in the through hole. A sealing member is provided on one side of the bracket facing the flexible circuit board. The flexible circuit board is clamped between the sealing member and the frame, so that the bracket presses the flexible circuit board through the sealing member to form a seal, playing a role in waterproofing. Wherein, a glue filling hole is provided on the bracket. The glue filling hole penetrates through the bracket along a first direction and encloses a first glue dispensing groove with the frame. Along a second direction, a gap is enclosed between the edge of the flexible circuit board and the frame. The gap is correspondingly arranged with the first glue dispensing groove. In this way, by pouring sealing glue into the first glue dispensing groove, the gap between the flexible circuit board, the frame and the sealing member can be sealed by the sealing glue, improving the sealing performance between the flexible circuit board and the frame, and further improving the waterproof performance between the flexible circuit board and the frame, reducing the failure rate of the electronic device.

[0008] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, wherein:

[0010] Figure 1 is an exploded schematic view of an electronic device according to an embodiment of the present application;

[0011] Figure 2 is one of the structural schematic views of an electronic device according to an embodiment of the present application;

[0012] Figure 3 is another structural schematic view of an electronic device according to an embodiment of the present application;

[0013] Figure 4 is according to Figure 3 the A-A cross-sectional view of the electronic device according to the embodiment shown;

[0014] Figure 5 is according to Figure 3 a partial structural schematic view of the B-B cross-sectional view of the electronic device according to the embodiment shown;

[0015] Figure 6 is a third structural schematic view of an electronic device according to an embodiment of the present application.

[0016] Reference numerals:

[0017] 1 housing, 10 vias, 102 mating surfaces, 104 second inclined surfaces, 106 third inclined surfaces, 108 limiting grooves, 109 second bosses, 12 first bosses, 14 bonding surfaces, 2 flexible circuit boards, 20 limiting members, 3 brackets, 30 potting holes, 32 first dispensing grooves, 34 dispensing surfaces, 36 first inclined surfaces, 4 seals, 5 bonding members, 6 connecting members, 7 rotating shafts, 8 folding parts, 9 rotating shaft covers. Detailed implementation manners

[0018] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the scope of protection of the present application.

[0019] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0020] In the description of the present application, it should be noted that, unless otherwise clearly defined and limited, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0021] Next, in conjunction with Figures 1 to 6 Describe an electronic device according to an embodiment of the present application.

[0022] As Figure 1 、 Figure 2 and Figure 6As shown in the figure, an electronic device according to some embodiments of the present application includes: a rotating shaft 7, a flexible circuit board 2, and two folding parts 8; the two folding parts 8 are connected to the rotating shaft 7 and can rotate relative to the rotating shaft 7 to enable the electronic device to be in an unfolded state or a folded state; any one of the folding parts 8 includes a frame body 1 and a bracket 3, a through hole 10 is provided on the frame body 1, the flexible circuit board passes through the through hole 10 and is arranged inside the frame bodies 1 of the two folding parts 8, the bracket 3 is arranged in the through hole 10, a sealing member 4 is provided on one side of the bracket 3 facing the flexible circuit board 2, and the flexible circuit board 2 is clamped between the sealing member 4 and the frame body 1. Among them, a glue filling hole 30 is provided on the bracket 3, the glue filling hole 30 penetrates through the bracket 3 along a first direction, and the glue filling hole 30 and the frame body 1 enclose a first glue dispensing groove 32, the first glue dispensing groove 32 is used for pouring sealing glue, and the gaps formed between the two side edges of the flexible circuit board 2 in a second direction and the frame body 1 are correspondingly arranged with the first glue dispensing groove 32.

[0023] In an embodiment of the present application, the electronic device includes a rotating shaft 7, a flexible circuit board 2, and two folding parts 8. Any one of the folding parts 8 includes a frame body 1 and a bracket 3. A through hole 10 is provided on the frame body 1. The flexible circuit board 2 and the bracket 3 are arranged in the through hole 10. A sealing member 4 is provided on one side of the bracket 3 facing the flexible circuit board 2. The flexible circuit board 2 is clamped between the sealing member 4 and the frame body 1, so that the bracket 3 presses the flexible circuit board 2 through the sealing member 4 to form a seal, playing a role in waterproofing. Among them, a glue filling hole 30 is provided on the bracket 3. The glue filling hole 30 penetrates through the bracket 3 along a first direction and encloses a first glue dispensing groove 32 with the frame body 1. Gaps are formed between the two side edges of the flexible circuit board 2 in a second direction and the frame body 1, and the gaps are correspondingly arranged with the first glue dispensing groove 32. In this way, by pouring sealing glue into the first glue dispensing groove 32, the gaps between the flexible circuit board 2 and the frame body 1 can be sealed by the sealing glue, improving the sealing performance between the flexible circuit board 2 and the frame body 1, and further ensuring the waterproof performance between the flexible circuit board 2 and the frame body 1, reducing the failure rate of the electronic device.

[0024] It can be understood that the electronic device includes at least two folding parts 8. Figure 6 The two folding parts 8 among them are rotatably connected to the rotating shaft 7 and are oppositely arranged. In this way, when the two folding parts 8 rotate around the rotating shaft 7, the electronic device can be switched to the folded state to reduce the volume of the electronic device and facilitate the carrying of the electronic device; when the two folding parts 8 rotate around the rotating shaft 7, the electronic device can also be switched to the unfolded state to increase the display area of the electronic device.

[0025] Specifically, in the folded state, the two folding parts 8 are stacked, and in the unfolded state, the two folding parts 8 are located on both sides of the rotating shaft 7 to increase the display area of the electronic device.

[0026] Among them, as Figure 6As shown, a partial structural schematic diagram of an electronic device is presented. It should be noted that, Figure 6 a folding portion 8 is shown therein.

[0027] Furthermore, the electronic device has two frames 1, and the flexible circuit board 2 can be respectively passed through the vias 10 on the two frames 1 and disposed in the two frames 1, so as to achieve the sealing and waterproofing of the flexible circuit board 2 at the vias 10 of the two frames 1.

[0028] Specifically, the flexible circuit board 2 is passed through the two vias 10 of the two frames 1 and is respectively pressed by two brackets 3, so that the flexible circuit board 2 extends from one frame 1 to the other frame 1.

[0029] It can be understood that the via 10 is located on the side of the frame 1 close to the rotating shaft 7.

[0030] Furthermore, the electronic device further includes a rotating shaft cover 9, and the rotating shaft cover 9 covers the rotating shaft 7.

[0031] In a specific application, the seal 4 includes foam.

[0032] It should be noted that the electronic device is a foldable electronic device. Among them, the via 10 on the frame 1 is arranged close to the rotating shaft of the foldable electronic device.

[0033] As Figure 1 and Figure 5 shown, according to some embodiments of the present application, the electronic device further includes: an adhesive member 5, the frame 1 includes an adhesive surface 14, the adhesive surface 14 is located at the edge of the via 10, and the part of the flexible circuit board 2 extending out of the via 10 is adhered to the adhesive surface 14 through the adhesive member 5. Along the first direction, the seal 4 and the adhesive member 5 are correspondingly arranged.

[0034] In this embodiment, the electronic device further includes an adhesive member 5, and an adhesive surface 14 is provided on the frame 1. The adhesive surface 14 is arranged at the edge of the via 10. In this way, after the flexible circuit board 2 is passed through the via 10, the part of the flexible circuit board 2 extending out of the via 10 can be adhered to the adhesive surface 14 through the adhesive member 5 to realize the fixation of the flexible circuit board 2 and avoid the flexible circuit board 2 from moving when the bracket 3 is installed. Among them, along the first direction, the seal 4 and the adhesive member 5 are correspondingly arranged, so that the flexible circuit board 2 is clamped between the adhesive member 5 and the seal 4, thereby improving the waterproof performance after the flexible circuit board 2 is connected to the frame 1.

[0035] In a specific application, the adhesive member 5 includes double-sided tape.

[0036] Further, the bonding surface 14 includes a first bonding surface and a second bonding surface. The first bonding surface is located on one side of the third direction of the via hole 10. The second bonding surface extends from the first bonding surface to the side away from the potting hole 30, and the second bonding surface is located on both sides of the via hole 10 along the second direction.

[0037] Correspondingly, the shape of the bonding member 5 is adapted to the bonding surface 14, so that the bonding member 5 can be arranged in a U shape around the periphery of the via hole 10. Specifically, the bonding member 5 includes a first bonding member and a second bonding member. The first bonding member is correspondingly arranged with the first bonding surface, and the second bonding member is correspondingly arranged with the second bonding surface, so that the bonding member 5 is arranged in a U shape around the periphery of the via hole 10.

[0038] Meanwhile, the sealing member 4 includes a first sealing member and a second sealing member. The first sealing member is correspondingly arranged with the bonding surface 14 and the bonding member 5 and has a shape adapted thereto. Specifically, the first sealing member includes a first sealing portion and a second sealing portion. The first sealing portion is correspondingly arranged with the first bonding surface, the second sealing portion is connected to the first sealing portion, and the second sealing portion is correspondingly arranged with the second bonding surface. The second sealing member is connected to the first sealing member and extends from the first sealing portion to the side away from the potting hole 30, so that the second sealing member fits on the flexible circuit board 2. In this way, when the bracket 3 is pressed against the flexible circuit board 2, the first sealing member can be arranged in a U shape around the periphery of the via hole 10 and cooperate with the bonding member 5 to effectively seal the periphery of the via hole 10.

[0039] As Figure 1 and Figure 3 shown, according to some embodiments of the present application, along the second direction, both ends of the sealing member 4 protrude from the flexible circuit board 2. A gap is enclosed between the edges of the flexible circuit board 2 on both sides in the second direction, the frame 1 and the sealing member 4. Potting holes 30 are provided on both sides of the bracket 3.

[0040] In this embodiment, along the second direction, both ends of the sealing member 4 protrude from the flexible circuit board 2. Under the action of the bracket 3, the part of the sealing member 4 protruding from the flexible circuit board 2 is pressed against the frame 1. Since the flexible circuit board 2 has a certain thickness, there will be a gap between the edges of the flexible circuit board 2 on both sides in the second direction, the frame 1 and the sealing member 4. In the present application, potting holes 30 corresponding to the above-mentioned gap are provided on the frame 1, so that the potting holes 30 and the frame 1 enclose a first glue application groove 32. Then, injecting sealant into the first glue application groove 32 will seal the gap formed between the flexible circuit board 2, the sealing member 4 and the frame 1, improve the sealing performance between the flexible circuit board 2 and the frame 1, and further improve the waterproof performance.

[0041] Further, potting holes 30 are provided on both sides of the bracket 3. In this way, the gaps can be sealed on both sides of the flexible circuit board 2, ensuring the waterproof performance.

[0042] It is understandable that the gap is the gap formed between the two side edges of the flexible circuit board 2 along the second direction and the housing 1 and the seal 4.

[0043] As Figure 1 and Figure 3 shown, according to some embodiments of the present application, along the first direction, a dispensing surface 34 is provided on the end surface of the bracket 3, the dispensing surface 34 is exposed in the through hole 10, the glue injection hole 30 is provided close to the first side of the bracket 3 along the third direction, and the dispensing surface 34 is provided close to the second side of the bracket 3; the inner wall surface of the through hole 10 includes a mating surface 102, the mating surface 102 protrudes from the dispensing surface 34 along the first direction, and along the third direction, the mating surface 102 is located on the side of the dispensing surface 34 away from the glue injection hole 30, and at least the mating surface 102 and the dispensing surface 34 enclose a second dispensing groove for injecting sealant.

[0044] In this embodiment, along the first direction, a dispensing surface 34 is provided on the end surface of the bracket 3, and the dispensing surface 34 is exposed by the through hole 10. A mating surface 102 is provided on the inner wall surface of the through hole 10, and the mating surface 102 protrudes from the dispensing surface 34 along the first direction. In this way, the mating surface 102 and the dispensing surface 34 can enclose a second dispensing groove, and injecting sealant into the second dispensing groove can achieve the seal between the bracket 3 and the housing 1, thereby improving the waterproof performance of the flexible circuit board 2 at the housing 1.

[0045] Wherein, along the third direction, the dispensing surface 34 is provided close to the second side of the bracket 3, and the glue injection hole 30 is provided close to the first side of the bracket 3, so that the flexible circuit board 2 is effectively sealed on both sides of the bracket 3.

[0046] As Figure 3 shown, according to some embodiments of the present application, the housing 1 further includes a first boss 12. Along the second direction, the first boss 12 is located on both sides of the dispensing surface 34, and the dispensing surface 34, the first boss 12 and the mating surface 102 enclose a second dispensing groove.

[0047] In this embodiment, the housing 1 further includes a first boss 12. Along the second direction, the first boss 12 is located on both sides of the dispensing surface 34, so that the dispensing surface 34, the first boss 12 and the mating surface 102 enclose a second dispensing groove, thereby enabling the gap between the dispensing surface 34 and the housing 1 in the second direction to also be sealed.

[0048] It should be noted that along the third direction, the mating surface 102 is located on the side of the dispensing surface 34 away from the glue injection hole 30, and along the second direction, the first boss 12 is located on both sides of the dispensing surface 34, so that a U-shaped seal can be formed at the dispensing surface 34, improving the sealing performance.

[0049] In a specific application, the wall surface of the first boss 12 facing the via hole 10 is a part of the inner wall surface of the via hole 10. That is, a part of the wall surface of the first boss 12 and the other wall surfaces of the housing 1 enclose the inner wall surface of the via hole 10.

[0050] Further, a part of the circumference of the via hole 10 is enclosed by a part of the seal 4, and the gap formed by the seal 4, the housing 1, and the flexible circuit board 2 is sealed by the first glue application groove 32. Another part of the circumference of the via hole 10 is enclosed by the second glue application groove. That is, a part of the seal 4 and the second glue application groove enclose the circumference of the via hole 10, so that the edges of the circumference of the via hole 10 form seals with both the bracket 3 and the flexible circuit board 2, thereby ensuring the sealing effect among the flexible circuit board 2, the bracket 3, and the housing 1.

[0051] Specifically, the first seal of the seal 4 and the second glue application groove enclose the circumference of the via hole 10.

[0052] Further, as Figure 2 and Figure 3 shown, along the third direction, the ends of the seal 4 and the bonding member 5 contact the first boss 12. In this way, the sealing structure formed among the seal 4, the bonding member 5, and the flexible circuit board 2, and the sealing structure formed by the first boss 12 and the glue application surface 34 surround the via hole 10, thereby achieving complete sealing of the circumference of the flexible circuit board 2.

[0053] As Figure 4 shown, according to some embodiments of the present application, the bracket 3 further includes a first inclined surface 36, the inner wall surface of the via hole 10 includes a second inclined surface 104, and the first inclined surface 36 cooperates with the second inclined surface 104. Among them, the first inclined surface 36 and the second inclined surface 104 are inclined with respect to the first direction. The first inclined surface 36 extends from the glue application surface 34 in a direction away from the glue injection hole 30, and the second inclined surface 104 extends from the mating surface 102 in a direction away from the glue injection hole 30.

[0054] In this embodiment, the bracket 3 further includes a first inclined surface 36, the inner wall surface of the via hole 10 includes a second inclined surface 104, and the first inclined surface 36 and the second inclined surface 104 cooperate with each other, so that in the first direction, the first inclined surface 36 is located below the second inclined surface 104, thereby enabling the bracket 3 to form a reverse buckle structure, thus realizing the fixation of the bracket 3 in the first direction and effectively ensuring the consistency of the sealant filling. At the same time, the first inclined surface 36 extends from the glue application surface 34 in a direction away from the glue injection hole 30, which can play a role in extending the penetration path of the sealant and preventing the occurrence of glue overflow when there is too much sealant.

[0055] In addition, sealing is achieved by applying glue between the bracket 3 and the housing 1, which can effectively reduce the occupation of the space in the third direction by the bracket 3 and the housing 1, does not occupy the adhesive area of the double-sided tape on the battery cover of the electronic device, has higher space utilization rate, and better waterproof effect.

[0056] As shown in Figure 2 and Figure 4 shown, according to some embodiments of the present application, the wall surface of the via 10 further includes a third inclined surface 106. Along the third direction, the third inclined surface 106 is disposed opposite to the second inclined surface 104; a limiting groove 108 is provided on the third inclined surface 106, and a limiting member 20 is provided on the flexible circuit board 2, and the limiting member 20 is connected to the limiting groove 108.

[0057] In this embodiment, the wall surface of the via 10 further includes a third inclined surface 106, a limiting groove 108 is provided on the third inclined surface 106, and a limiting member 20 is provided on the flexible circuit board 2. By connecting the limiting groove 108 and the limiting member 20, the flexible circuit board 2 is fixed in the second direction and the third direction.

[0058] In a specific application, along the third direction, the third inclined surface 106 is disposed opposite to the second inclined surface 104. After the flexible circuit board 2 is inserted into the via 10, through the cooperation of the limiting member 20 and the limiting groove 108, the flexible circuit board 2 is limited in the second direction and the third direction. Then, the flexible circuit board 2 is bonded to the bonding surface 14 by the bonding member 5 to achieve the fixation of the flexible circuit board 2 in the first direction, and further the flexible circuit board 2 is fixed on the frame 1.

[0059] Among them, the second direction, the first direction, and the third direction are perpendicular to each other in pairs.

[0060] According to some embodiments of the present application, the limiting member 20 is bonded to the limiting groove 108.

[0061] In this embodiment, the limiting member 20 is bonded in the limiting groove 108, which is convenient for installing the flexible circuit board 2 on the third inclined surface 106.

[0062] As shown in Figure 2 and Figure 4 shown, according to some embodiments of the present application, along the second direction, second bosses 109 are provided on both sides of the third inclined surface 106, the limiting groove 108 is provided on the second bosses 109, and the limiting member 20 is provided on the side of the flexible circuit board 2 close to the third inclined surface 106 and protrudes from the flexible circuit board 2 along the second direction.

[0063] In this embodiment, along the second direction, second bosses 109 are further provided on both sides of the third inclined surface 106, the limiting groove 108 is provided on the limiting bosses, and the limiting member 20 is provided at the bottom of the flexible circuit board 2. In this way, when installing the flexible circuit board 2, by clamping the limiting member 20 in the limiting groove 108, the flexible circuit board 2 is fixed in the second direction and the third direction.

[0064] As shown in Figure 1 and Figure 3As shown, according to some embodiments of the present application, it further includes: a connecting member 6, and the frame body 1 and the bracket 3 are connected through the connecting member 6.

[0065] In this embodiment, after the flexible circuit board 2 is installed on the frame body 1, the bracket 3 is pressed against the flexible circuit board 2, and the bracket 3 is fixed to the frame body 1 through the connecting member 6 to ensure the connection strength between the frame body 1 and the bracket 3.

[0066] Further, the connecting member 6 includes a locking screw, corresponding through holes are respectively provided on the frame body 1 and the bracket 3, and the locking screw is passed through the through holes to realize the connection between the frame body 1 and the bracket 3.

[0067] In a specific application, the frame body 1 includes a limiting groove 108, an adhesive surface 14, and a through hole 10. The flexible circuit board 2 passes through the through hole 10 provided on the frame body 1. Among them, a limiting member 20 is provided on the flexible circuit board 2, and a limiting groove 108 is provided on the frame body 1. When the flexible circuit board 2 passes through the through hole 10, the limiting member 20 is limited by the limiting groove 108 so that it cannot swing randomly in the second direction and the third direction. The adhesive member 5 is a double-sided tape, and the double-sided tape is pre-attached to the adhesive surface 14. When the flexible circuit board 2 passes through the through hole 10, the flexible circuit board 2 is adhered to the frame body 1 to realize the fixation in the first direction.

[0068] A foam is attached to the wall surface of the bracket 3 corresponding to the flexible circuit board 2. After the flexible circuit board 2 passes through the through hole 10 and is fixed, the bracket 3 is assembled to the frame body 1 and fixed and locked with the frame body 1 through screws. After the bracket 3 is locked with the screw, the foam will press the flexible circuit board 2 in the first direction and form a seal, playing a waterproof role. Among them, the bracket 3 is fixed and locked with the frame body 1 by two left and right screws, and the bracket 3 can be formed by in-mold injection of a stainless steel sheet to improve the overall strength of the bracket 3.

[0069] Further, a first inclined surface 36 is provided on the inner wall surface of the through hole 10. After the bracket 3 is assembled to the frame body 1, an inverted buckle structure will be formed in the third direction, thereby realizing the fixation of the bracket 3 in the first direction.

[0070] Further, a third inclined surface 106 is provided on the inner wall surface of the through hole 10. When the flexible circuit board 2 passes through the through hole 10 on the frame body 1 and passes through the frame body 1, the limiting member 20 of the flexible circuit board 2 is adhered to the third inclined surface 106 by double-sided tape to realize fixation.

[0071] Among them, the flexible circuit board 2 is sandwiched between the double-sided tape and the foam. Since the flexible circuit board 2 itself has a certain thickness, it will cause a certain gap to be formed at the edge areas on both sides of the flexible circuit board 2 in the second direction, resulting in waterproof failure. Therefore, at the edge area of the flexible circuit board 2, glue injection holes 30 are provided on the left and right sides of the bracket 3 correspondingly. After the bracket 3 is fixed and locked to the frame 1 by screws, glue is applied at the positions of the two glue injection holes 30 on the left and right of the bracket 3. The glue can effectively fill the sealing gap caused by the thickness of the flexible circuit board 2, solve the problem of low waterproof performance of the simple foam seal in the conventional design, and effectively improve the waterproof performance.

[0072] Among them, the bracket 3 includes a glue application surface 34. After the bracket 3 is fixed by locking screws, a second glue application groove will be formed between the glue application surface 34 of the bracket 3 and the mating surface 102 provided on the frame 1. Glue is applied in this second glue application groove, and the glue will seal the bracket 3 and the frame 1. At the same time, the setting of the first inclined surface 36 enables an inverted buckling structure to be formed in the third direction after the bracket 3 is assembled to the frame 1, so as to realize the fixation of the bracket 3 in the first direction and effectively ensure the consistency of glue filling. At the same time, the designed first inclined surface 36 can extend the glue penetration path and prevent glue overflow when too much glue is applied. Different from the conventional waterproof scheme design, glue application is used for sealing at this position, which can effectively shorten the space occupied in the third direction, does not occupy the double-sided adhesive area of the battery cover, has higher space utilization rate, and better waterproof effect.

[0073] In specific applications, the electronic device can be a smart phone, a tablet computer, an e-reader, a wearable device, etc., which will not be listed one by one here.

[0074] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0075] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A rotating shaft, a flexible circuit board, and two folding parts; The two folding parts are connected to the rotating shaft and can rotate relative to the rotating shaft to enable the electronic device to be in an unfolded state or a folded state; Any one of the folding parts includes a frame body and a bracket. A through hole is provided on the frame body. The flexible circuit board passes through the through hole and is disposed within the frame bodies of the two folding parts. The bracket is disposed in the through hole. A sealing member is provided on a side of the bracket facing the flexible circuit board. The flexible circuit board is clamped between the sealing member and the frame body. Wherein, a glue injection hole is provided on the bracket. The glue injection hole penetrates through the bracket along a first direction. The glue injection hole and the frame body enclose a first glue dispensing groove for dispensing sealant. A gap enclosed between the flexible circuit board and the frame body at two side edges in a second direction corresponds to the first glue dispensing groove; An adhesive member. The frame body includes an adhesive surface located at an edge of the through hole. A part of the flexible circuit board extending out of the through hole is adhered to the adhesive surface through the adhesive member. Along the first direction, the sealing member and the adhesive member are correspondingly disposed; The adhesive surface includes a first adhesive surface and a second adhesive surface. The first adhesive surface is located on one side of the through hole in a third direction. The second adhesive surface extends from the first adhesive surface to a side away from the glue injection hole and is located on both sides of the through hole along the second direction; The adhesive member includes a first adhesive member and a second adhesive member. The first adhesive member corresponds to the first adhesive surface, and the second adhesive member corresponds to the second adhesive surface; Along the second direction, two ends of the sealing member protrude from the flexible circuit board. A gap is enclosed among two side edges of the flexible circuit board in the second direction, the frame body, and the sealing member. The glue injection holes are provided on both sides of the bracket.

2. The electronic device according to claim 1, wherein Along the first direction, a glue dispensing surface is provided on an end surface of the bracket and is exposed in the through hole. Along the third direction, the glue injection hole is disposed close to a first side of the bracket, and the glue dispensing surface is disposed close to a second side of the bracket; An inner wall surface of the through hole includes a mating surface that protrudes from the glue dispensing surface along the first direction and is located on a side of the glue dispensing surface away from the glue injection hole along the third direction. At least the mating surface and the glue dispensing surface enclose a second glue dispensing groove for dispensing sealant.

3. The electronic device according to claim 2, wherein The frame body further includes a first boss. Along the second direction, the first boss is located on both sides of the glue dispensing surface. The glue dispensing surface, the first boss, and the mating surface enclose the second glue dispensing groove.

4. The electronic device according to claim 3, wherein The bracket further includes a first inclined surface, and the inner wall surface of the via hole includes a second inclined surface, and the first inclined surface cooperates with the second inclined surface, wherein the first inclined surface and the second inclined surface are inclined with respect to the first direction, the first inclined surface extends from the dispensing surface away from the potting hole, and the second inclined surface extends from the mating surface away from the potting hole.

5. The electronic device according to claim 4, wherein the wall surface of the via hole further includes a third inclined surface, and along the third direction, the third inclined surface is disposed opposite to the second inclined surface; a limiting groove is provided on the third inclined surface, a limiting member is provided on the flexible circuit board, and the limiting member is connected to the limiting groove.

6. The electronic device according to claim 5, wherein the limiting member is bonded to the limiting groove.

7. The electronic device according to claim 5, wherein along the second direction, second bosses are provided on both sides of the third inclined surface, the limiting groove is provided on the second bosses, the limiting member is provided on one side of the flexible circuit board close to the third inclined surface, and protrudes from the flexible circuit board along the second direction.

8. The electronic device according to any one of claims 1 to 7, characterized in that Further included is: a connecting member, and the frame body and the bracket are connected through the connecting member.

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