A glue-exposed die-cut piece with a protective film and its manufacturing method

Abstract

The present invention relates to a glue-exposed die-cut part with a protective film and a manufacturing method thereof. The method comprises the following steps: (1) attaching the non-glue surface of a second protective film (3) to the glue surface of a conventional protective film (1); (2) attaching a double-silicon film (2) to the glue surface of the second protective film (3) to form a primary strip; (3) performing die-cutting on the primary strip to cut out grooves and discharging waste, exposing the glue surface of the second protective film (3); (4) attaching the glue surface of a first protective film (4) to the double-silicon film (2); (5) after attachment, die-cutting out the outer frame of the product and then removing the redundant waste materials to obtain the glue-exposed die-cut part product with a protective film. Compared with the prior art, the present invention has the advantages of being processed and completed with fewer laminating steps and fewer die-cutting steps, etc.

Description

Technical Field

[0001] The present invention relates to the field of die-cut part processing, and particularly to a glue-exposed die-cut part with a protective film and a manufacturing method thereof. Background Art

[0002] The protective film is a commonly used material in die-cut processing. Generally, the protective film has adhesiveness on one side and no adhesiveness on the other side, belonging to a kind of single-sided adhesive. The processing of conventional die-cut parts with protective films is also relatively convenient, and generally can be formed by one-time punching. However, for some products with relatively complex structures, multiple processing steps are required to form them.

[0003] For example, for the product as shown in Figure 1 When preparing the existing technology, only the common release film (i.e., PET film, with silicone oil coated on one side, the side with silicone oil is the release surface, and the side without silicone oil is the non-release surface) is considered for processing, but usually no less than two lamination steps and no less than three die-cutting steps are required for processing, and the steps are very cumbersome. Summary of the Invention

[0004] The purpose of the present invention is to overcome the defects of the above-mentioned existing technology and provide a glue-exposed die-cut part with a protective film and a manufacturing method thereof, which can be processed with fewer lamination steps and fewer die-cutting steps.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A manufacturing method of a glue-exposed die-cut part with a protective film, the method comprising the following steps:

[0007] (1) Stick the non-adhesive surface of the second protective film on the adhesive surface of the conventional protective film;

[0008] (2) Stick the double-silicon film on the adhesive surface of the second protective film to form a primary tape;

[0009] The double-silicon film is a double-sided release film, with silicone oil coated on both sides;

[0010] (3) Punch out grooves from the primary tape and discharge waste to expose the adhesive surface of the second protective film;

[0011] (4) Stick the adhesive surface of the first protective film on the double-silicon film;

[0012] Since the materials used are all relatively thin, generally not more than 0.05 mm, the groove gap in the middle can be ignored;

[0013] (5) After sticking, punch out the outer frame of the product, and then remove the excess waste to obtain the glue-exposed die-cut part product with a protective film.

[0014] Furthermore, when the primary strip is die-cut, the die-cutting levels include a double silicon film and a second protective film.

[0015] Furthermore, the groove is located in the middle of the second protective film.

[0016] Furthermore, the waste discharging in step (3) refers to discharging the waste of the second protective film at the groove.

[0017] Furthermore, in step (4), the adhesive surface in the middle of the first protective film is attached to the exposed adhesive surface of the second protective film, and the adhesive surfaces on both sides of the first protective film are attached to the double silicon film.

[0018] Furthermore, the excess waste in step (5) is border waste, a conventional protective film, and a double silicon film.

[0019] Furthermore, the thickness of the double silicon film is less than 0.05 mm.

[0020] A gumming die-cut part with a protective film manufactured by the method as described above.

[0021] Furthermore, the die-cut part includes a second protective film and a first protective film.

[0022] Furthermore, the second protective film is located in the middle of the first protective film.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] (1) The prior art needs three die-cuts to form, while the present invention only needs two die-cuts to form, saving one die-cut step; the prior art needs to laminate materials multiple times, while the present invention only needs to laminate materials twice, saving the material lamination step;

[0025] (2) While saving the material lamination step, the present invention also reduces the risk of material contamination. Because the more lamination steps there are, the easier it is for the materials to get dirty. The prior art needs to laminate two release films, while the present invention only needs to laminate one double silicon film, saving materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a product drawing of the die-cut part prepared by the present invention;

[0027] Figure 2 It is the first preparation flow chart in the comparative example;

[0028] Figure 3 It is the second preparation flow chart in the comparative example;

[0029] Figure 4 It is the third preparation flow chart in the comparative example;

[0030] Figure 5 It is the first preparation flow chart in the embodiment;

[0031] Figure 6 It is the second preparation flow chart in the embodiment;

[0032] As shown in the figure: conventional protective film 1, double silicon film 2, second protective film 3, first protective film 4, first release film 5, second release film 6. Specific implementation mode

[0033] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operation processes are given, but the protection scope of the present invention is not limited to the following embodiments.

[0034] Embodiment

[0035] A manufacturing method of a gumming die-cutting part with a protective film, referring to Figure 1 The die-cutting part includes a second protective film 3 and a first protective film 4, and the second protective film 3 is located in the middle of the first protective film 4.

[0036] The method includes the following steps:

[0037] (1) Stick the non-adhesive surface of the second protective film 3 on the adhesive surface of the conventional protective film 1;

[0038] (2) Stick the double silicon film 2 on the adhesive surface of the second protective film 3 to form a primary tape, such as Figure 5 ; The double silicon film is a double-sided release film, with silicone oil coated on both sides, and the thickness is generally less than 0.05 mm;

[0039] (3) Punch out grooves in the primary tape. The grooves are located in the middle of the second protective film 3. When punching, the punching layers include the double silicon film 2 and the second protective film 3, and waste is discharged to remove the waste of the second protective film at the groove, exposing the adhesive surface of the second protective film 3;

[0040] (4) Stick the adhesive surface of the first protective film 4 on the double silicon film 2, such as Figure 6 , the adhesive surface in the middle of the first protective film 4 is stuck on the exposed adhesive surface of the second protective film 3, and the adhesive surfaces on both sides of the first protective film 4 are stuck on the double silicon film 2; Since the materials used are all relatively thin, generally not more than 0.05 mm, the intermediate groove gap can be ignored;

[0041] (5) After sticking, punch out the outer frame of the product, and then remove the excess waste materials, that is, the frame waste, the conventional protective film 1 and the double silicon film 2, to obtain the gumming die-cutting part product with a protective film.

[0042] Comparative example

[0043] A traditional manufacturing method of a gumming die-cutting part with a protective film, referring to Figure 1, the die-cut part includes a second protective film 3 and a first protective film 4, and the second protective film 3 is located in the middle of the first protective film 4.

[0044] The method includes the following steps:

[0045] (1) Stick the non-release surface of the first release film 5 on the adhesive surface of the conventional protective film 1 to form a primary strip.

[0046] (2) Punch a groove in the middle of the first release film 5, and remove the first release film inside the groove to expose the adhesive of the underlying conventional protective film, as Figure 2 ;

[0047] (3) Stick the non-adhesive surface of the second protective film 3 on the exposed adhesive surface of the conventional protective film 1, and then stick a second release film 6 on it for protection to form a secondary strip, as Figure 3 ; Since all the materials used are relatively thin, generally only 0.05 mm, the gap in the middle can be ignored.

[0048] (4) After sticking, punch the second protective film 3 so that the punched second protective film 3 is exactly the groove area where the first release film 5 was removed before. After punching, remove the excess waste, and then remove the second release film 6 on the second protective film 3.

[0049] (5) Then, stick the adhesive surface of the first protective film 4 on the adhesive surface of the second protective film 3, and the extra adhesive surface of the first protective film 4 is stuck on the release surface of the first release film 5, as Figure 4 ;

[0050] (6) After sticking, punch out the outer frame of the product, and then remove the excess waste, that is, the frame waste, the conventional protective film 1 and the first release film 5, to obtain a die-cut product with a protective film and exposed adhesive.

[0051] By comparing the examples with the comparative examples, it is known that the present invention mainly replaces the first-stuck release film with a double-silicon film. Therefore, it only needs to be punched twice to form, saving one punching step (the comparative example needs three punches), and only needs to stick the materials twice (the comparative example needs multiple times). The present invention only needs to stick the double-silicon film once, saving materials (the comparative example needs to stick two release films).

[0052] The above is only a preferred embodiment of the present invention, and it is not a limitation of the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution content of the present invention still belong to the protection scope of the technical solution of the present invention.

Claims

1. A manufacturing method of a glue-exposed die-cut part with a protective film, characterized in that, The method comprises the following steps: S1. Stick the non - adhesive surface of the second protective film (3) onto the adhesive surface of the conventional protective film (1); S2. Stick the double - silicon film (2) onto the adhesive surface of the second protective film (3) to form a primary strip; S3. Punch out grooves in the primary strip and discharge waste, exposing the adhesive surface of the second protective film (3); S4. Stick the adhesive surface of the first protective film (4) onto the double - silicon film (2); S5. After sticking, punch out the product outer frame and then discharge the excess waste materials to obtain a product of a die - cut part with a protective film and exposed adhesive; When punching the primary strip, the punching layer includes the double - silicon film (2) and the second protective film (3).

2. The manufacturing method of a glue-exposed die-cut part with a protective film according to claim 1, wherein The groove is located in the middle of the second protective film (3); In step S4, the adhesive surface in the middle of the first protective film (4) is stuck onto the exposed adhesive surface of the second protective film (3), and the adhesive surfaces on both sides of the first protective film (4) are stuck onto the double - silicon film (2).

3. The manufacturing method of a glue-exposed die-cut part with a protective film according to claim 1, characterized in that, The waste discharge in step S3 refers to discharging the waste of the second protective film (3) at the groove.

4. The manufacturing method of a glue-exposed die-cut part with a protective film according to claim 1, characterized in that, The excess waste materials in step S5 are the frame waste, the conventional protective film (1) and the double - silicon film (2).

5. The manufacturing method of a glue-exposed die-cut part with a protective film according to claim 1, characterized in that, The thickness of the double - silicon film (2) is less than 0.05 mm.

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