A relay comprehensive parameter test system

Abstract

The application belongs to the technical field of relay detection, and particularly relates to a relay comprehensive parameter test system, which comprises a host computer and an oscilloscope, and is integrated with a bottom plate, a network switch, a plurality of comprehensive test modules, a plurality of fixture plates, a coil power supply, an ATX power supply and an external power supply interface; the comprehensive test modules and the fixture plates are integrated on the bottom plate; the oscilloscope, the coil power supply and the network switch are respectively connected with the host computer in communication, and are respectively connected with each comprehensive test module through the bottom plate; the coil power supply and the ATX power supply are respectively connected with each comprehensive test module through the bottom plate, and are respectively connected with the external power supply interface. According to the technical scheme, a plurality of comprehensive test modules are integrated on the bottom plate, and the number of the comprehensive test modules can be expanded according to actual needs. Therefore, the technical scheme adopts a low-cost test system, can test a plurality of relays at the same time, is compatible with single relay test and multiple relay test, and is good in flexibility in use.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of relay detection, and particularly relates to a relay comprehensive parameter test system. BACKGROUND

[0002] The relay electric parameter test device control system operates the test product according to the set frequency, and tests the electric parameters. The process control and dynamic data acquisition of the test are completed through the industrial computer expansion board, and the test data are processed and displayed. Due to too many parameters, especially in the multi-parameter detection system formed by combining continuous sampling and operation, the parameter acquisition and operation time are too long, and the detection speed is affected.

[0003] At present, most relay manufacturers still rely on manual adjustment of power supply voltage, and use human eyes to judge the on-off state of the contact and the position of the armature to evaluate the corresponding parameters. However, manual testing is affected by too many human factors, has a high error rate, is not easy to control, seriously restricts the improvement of production efficiency, and is not conducive to mass production of products. Although the existing test system can solve the above problems, it is not only expensive and has a complicated test process, but also has poor flexibility, testability and maintainability. SUMMARY

[0004] The application provides a relay comprehensive parameter test system to solve the problems in the prior art.

[0005] A relay comprehensive parameter test system, characterized in that: the system comprises an upper computer, an oscilloscope and a test main body; the test main body is integrated with a bottom plate, a network switch, a comprehensive test unit, a clamp unit, a coil power supply, an ATX power supply and an external power supply interface. The comprehensive test unit and the clamp unit are integrated on the bottom plate, the comprehensive test unit comprises a plurality of comprehensive test modules connected with the bottom plate respectively, and the clamp unit comprises a plurality of clamp plates connected with the bottom plate respectively. The oscilloscope, the coil power supply and the network switch are in communication connection with the upper computer respectively, and are connected with each comprehensive test module through the bottom plate respectively. The coil power supply and the ATX power supply are connected with each comprehensive test module through the bottom plate respectively, and are connected with the external power supply interface respectively.

[0006] Preferably, an execution button is further arranged on the test main body, and the execution button is connected with the bottom plate.

[0007] Preferably, the comprehensive test module comprises a relay test circuit, and the relay test circuit comprises a master MCU, a program-controlled switch, a test interface, a load module, a differential operational amplifier module I, a differential operational amplifier module II, a relay isolation module I, a time measurement circuit and an A / D module. The test interface comprises a coil part and a contact part; the coil power supply is connected to the coil part of the test interface through the program-controlled switch, and the coil part of the test interface is sequentially connected to the oscilloscope through the differential operational amplifier module I and the relay isolation module I; the master MCU is connected to the program-controlled switch through I / O; the differential operational amplifier module I is connected to the time measurement circuit and the A / D module respectively. The ATX power supply is electrically connected to the master MCU and connected to the contact part of the test interface through the load module; the contact part of the test interface is connected to the relay isolation module I, and is connected to the master MCU through the time measurement circuit and sequentially connected to the master MCU through the differential operational amplifier module II and the A / D module.

[0008] Preferably, the relay test circuit further comprises an LDO linear voltage stabilizing power supply connected between the ATX power supply and the master MCU.

[0009] Preferably, the comprehensive test module further comprises a coil power supply test circuit, and the coil power supply test circuit comprises a relay isolation module II, a differential operational amplifier module III and a sampling resistor connected between the program-controlled switch and the coil power supply, the sampling resistor is sequentially connected to the oscilloscope through the differential operational amplifier module III and the relay isolation module II.

[0010] Preferably, in the comprehensive test module, an STM32F4XX chip is used as the master MCU.

[0011] Preferably, the A / D module uses a 24-bit high-precision ADS1256 chip.

[0012] Preferably, a network communication protocol W5500 chip using MAC+PHY is externally connected to the master MCU for communication connection with the upper computer.

[0013] Preferably, the comprehensive test module further comprises a DAC analog output module, and the time measurement circuit is connected to the master MCU through the DAC analog output module.

[0014] Compared with the prior art, the technical scheme has the following advantages:

[0015] 1) The technical solution integrates a plurality of comprehensive test modules on the bottom plate, and the number of comprehensive test modules can be expanded according to actual needs. Thus, the technical solution uses a low-cost test system to test multiple relays, is compatible with single relay testing and multiple relay testing, and is good in flexibility in use. The so-called multiple relay testing is to use each single comprehensive test module to realize full-function testing of a single relay. Through n comprehensive test modules, not only can n relays be tested in parallel, but also the test can be realized by using the ping-pong test method to realize alternate testing, so as to improve the test efficiency.

[0016] 2) The technical solution realizes rapid installation of the product to be tested by setting the clamp plate, and realizes automatic testing of the corresponding parameters of the product to be tested based on simple operation on the test software, so that the whole testing process is rapid and simple.

[0017] 3) If any one of the comprehensive test modules fails, it will not affect the testing of other comprehensive test modules, and the testability and maintainability are very high. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a principle block diagram of the test system;

[0019] Figure 2 is a principle block diagram of the test main body. DETAILED DESCRIPTION

[0020] The application will be further described below in combination with the drawings and examples, but should not be understood as being limited to the following examples. The deformation and improvement of the application in the art should be included in the protection scope of the claims of the application without departing from the concept of the application.

[0021] Example 1

[0022] The embodiment discloses a relay comprehensive parameter test system (hereinafter referred to as the system), which is the preferred embodiment of the technical solution, as shown in Figure 1 , comprising a host computer, an oscilloscope and a test main body; the test main body integrates a bottom plate, a network switch, a comprehensive test unit, a clamp unit, a coil power supply, an ATX power supply and an external power supply interface; the comprehensive test unit and the clamp unit are integrated on the bottom plate, and the comprehensive test unit contains a plurality of comprehensive test modules connected with the bottom plate respectively, and the clamp unit contains a plurality of clamp plates connected with the bottom plate respectively; the oscilloscope, the coil power supply and the network switch are in communication connection with the host computer respectively, and are connected with each comprehensive test module through the bottom plate respectively; the coil power supply and the ATX power supply are connected with each comprehensive test module through the bottom plate respectively, and are connected with the external power supply interface respectively.

[0023] In practice, the main testing unit needs to be housed within an outer casing to form a complete testing device. Within the main testing unit, the base plate primarily houses the comprehensive parameter testing module and also serves as a general-purpose tooling. The fixture plate is inserted horizontally into the base plate for a plate-to-plate connection, enabling rapid fixation of the product under test. For the testing device, only the mating interface of the base plate is exposed. All non-external parts, including the comprehensive testing module, are isolated and shielded by a shielding cover. That is, looking into the testing device from its opening slot, only the mating interface is visible; the rest of the structure is shielded.

[0024] Its working principle is as follows: In actual use, the product under test is first fixed on the fixture plate and electrically connected to the corresponding integrated test module; then, AC220V AC mains power is connected to the coil power supply and ATX power supply through the external power interface; finally, the system is started to test the corresponding parameters of the product under test. During this period, the network switch and the display screen of the host computer are powered by their matching AC-DC power adapters. The ATX power module outputs DC voltages such as ±12V, +5V, and +3.3V after power conversion to power the integrated test module; the host computer uses RS232 communication to realize the programmable output of the coil power supply. Through programmable control, the coil power supply can output different voltage specifications to meet the power supply requirements of various relay (product under test) coils; the integrated parameter test module uses the network communication bus on the baseboard to communicate with the host computer through the network switch and upload the corresponding test results to the host computer; the oscilloscope is used to collect waveform information at the corresponding position in the integrated test module and upload the waveform information to the host computer.

[0025] This technical solution integrates several comprehensive testing modules (such as...) on the base plate. Figure 1 The number of integrated test modules (n as shown) can be expanded according to actual needs (one fixture plate can correspond to one or more integrated test modules, and the number of fixture plates increases proportionally when expanding the number of integrated test modules). Therefore, this technical solution adopts a low-cost testing system that can simultaneously test n (n>0, can be infinite) relays, compatible with single-relay and multi-relay testing, offering good flexibility. Multi-relay testing refers to using each individual integrated test module to achieve full-function testing of a single relay. With n integrated test modules, not only can parallel testing of n relays be achieved, but alternating testing can also be implemented using the ping-pong testing method to improve testing efficiency.

[0026] Further, the test main body is further provided with an execution button, and the execution button is connected with the bottom plate. In actual application, corresponding test software is installed on the upper computer, test items are selected by the test software, and the comprehensive test module is triggered to work in an external trigger input mode (the change of the high / low level of the I / O input is realized by the change of the on / off of the external execution button, and the comprehensive test module is triggered to work in a level conversion mode).

[0027] The technical scheme realizes quick installation of the to-be-tested product by the clamp plate, and automatic testing of the corresponding parameters of the to-be-tested product can be realized based on simple operation on the test software, so that the whole testing process is quick and simple.

[0028] Embodiment 2

[0029] The embodiment discloses a relay comprehensive parameter test system, as a preferred embodiment of the technical scheme, as shown in Figure 2 Fig. 1, that is, in embodiment 1, the comprehensive test module comprises a relay test circuit, and the relay test circuit comprises a main control MCU, a program-controlled switch, a test interface, a load module, a differential operational amplifier module I, a differential operational amplifier module II, a relay isolation module I, a time measurement circuit and an A / D module; the test interface comprises a coil part and a contact part; the coil power supply is connected to the coil part of the test interface through the program-controlled switch, and the coil part of the test interface is sequentially connected to the oscilloscope through the differential operational amplifier module I and the relay isolation module I; the main control MCU is connected to the program-controlled switch through I / O; the differential operational amplifier module I is connected to the time measurement circuit and the A / D module; the ATX power supply is electrically connected to the main control MCU and connected to the contact part of the test interface through the load module; the contact part of the test interface is connected to the relay isolation module I, and is connected to the main control MCU through the time measurement circuit, and is sequentially connected to the main control MCU through the differential operational amplifier module II and the A / D module.

[0030] The STM32F4XX chip is used as the main control MCU. The main functions and performances of the MCU STM32F4XX chip are as follows:

[0031] Core: 32-bit high-performance ARM Cortex-M4 processor; clock up to 168MHz, supporting FPU (floating point operation) and DSP instructions;

[0032] IO port: 144 pins, 114 IO ports, most of which are resistant to 5V (except for analog channels); supporting debugging, SWD and JTAG, SWD only needs 2 data lines;

[0033] Memory: memory capacity 1024K FLASH, 192K SRAM;

[0034] Clock, reset and power management: 1.8~3.6V power and IO voltage; power-on reset, power-down reset and programmable voltage monitoring; powerful clock system, 4~26M external high-speed crystal oscillator, internal 16MHz high-speed RC oscillator, internal phase-locked loop (PLL, frequency multiplication), general system clock is external or internal high-speed clock after PLL frequency multiplication, external low-speed 32.768K crystal oscillator, mainly for RTC clock source;

[0035] AD: 3 12-bit AD [up to 24 external test channels]; internal channel can be used for internal temperature measurement; built-in reference voltage;

[0036] DA: 2 12-bit DA;

[0037] DMA: 16 DMA channels with FIFO and burst support; support peripherals, timers, ADC, DAC, SDIO, I2S, SPI, I2C and USART;

[0038] Timers up to 17: 10 general-purpose timers (TIM2 and TIM5 are 32-bit); 2 basic timers; 2 advanced timers; 1 system timer; 2 watchdog timers;

[0039] Up to 17 communication interfaces: 3 I2C interfaces; 6 serial ports; 3 SPI interfaces; 2 CAN2.0; 2 USB OTG; 1 SDIO.

[0040] Based on the above structure, to realize the comprehensive parameter test of the relay, the comprehensive test module mainly expands the following functions:

[0041] 1) Network communication function: mainly used for information exchange with the host computer. The network communication function is expanded through the SPI peripheral interface of the main control MCU (not shown in the figure), and the MAC+PHY integrated network communication protocol chip W5500 is used for design, and TCP / IP protocol communication is used. W5500 is a full-hardware TCP / IP embedded Ethernet controller, which provides a more simple Internet connection solution for embedded systems. W5500 integrates the TCP / IP protocol stack, 10 / 100M Ethernet data link layer (MAC) and physical layer (PHY), so that users can use a single chip to expand network connection in applications. It should be noted that W5500 is the network communication protocol chip of the comprehensive test module, which realizes communication with the host computer, and the network switch only realizes the network link exchange between multiple IP devices.

[0042] 2) A / D acquisition function: that is, the A / D module uses a 24-bit high-precision ADS1256 chip, which is mainly used to collect data such as input voltage, input current, contact voltage drop (convert contact static resistance, coil resistance), pull-in release voltage, and action out-of-sync voltage of the product to be tested. Specifically, the A / D acquisition function is expanded through the SPI peripheral interface of the MCU. A 24-bit high-precision A / D chip is used to realize the collection of small voltage signals.

[0043] 3) DAC analog output function: that is, the comprehensive test module also includes a DAC analog output module, and the time measurement circuit is connected to the main control MCU through the DAC analog output module. Based on this, the DAC analog output module is mainly used as a comparison threshold when measuring time. Specifically, the DAC analog output function is expanded through the SPI peripheral interface of the MCU. Further, the DAC analog output module uses a 16-bit high-precision DAC chip DAC8551.

[0044] 4) PWM program control function: mainly used for magnetic latching relay pulse power supply (not shown in the figure). Specifically, the PWM output control is realized through the TIM (timer / counter) of the MCU, and the high-voltage pulse output is realized through the single-channel driver IR2117 after optical coupling isolation.

[0045] 5) Relay isolation output: mainly used for interface isolation and 16-to-1 switching to oscilloscope waveform acquisition. The relay is driven by the I / O of the MCU.

[0046] 6) Time measurement function: mainly used for time parameter testing (including pull-in release time, bounce time, stable time, fly time, and action out-of-sync time). Digital sampling is performed through the TIM (timer / counter) of the MCU to realize time measurement. The differential measurement + threshold comparison conditioning method is used.

[0047] 7) 6V / 10mA test condition: when testing time parameters such as time, contact voltage drop (static resistance), etc., a voltage and load condition of 6V / 10mA need to be provided to the contact. The relay test circuit also includes an LDO linear voltage regulator connected between the ATX power supply and the main control MCU. The 6V voltage is realized through the LDO linear voltage regulator, and the 10mA load is realized through the relay switching into a 600Ω resistive load.

[0048] Further, the comprehensive test module further comprises a coil power supply test circuit, and the coil power supply test circuit comprises a relay isolation module II, a differential operational amplifier module III, and a sampling resistor connected between a program-controlled switch and the coil power supply, the sampling resistor being connected to an oscilloscope through the differential operational amplifier module III and the relay isolation module II in sequence. Based on the internal structure of the comprehensive test module, the oscilloscope can be used to display the coil transient suppression voltage overtravel time waveform in the coil power supply and the product to be tested.

Claims

1. A relay comprehensive parameter testing system, characterized in that: It includes a host computer, an oscilloscope, and a test body; the test body integrates a base plate, a network switch, a comprehensive test unit, a fixture unit, an execution button, a coil power supply, an ATX power supply, and an external power interface, with the coil power supply and ATX power supply respectively connected to the external power interface; The integrated test unit is integrated on the base plate and includes several integrated test modules connected to the base plate. The integrated test modules include a main control MCU, a programmable switch, a test interface, a load module, a differential operational amplifier module I, a differential operational amplifier module II, a relay isolation module I, a time measurement circuit, an A / D module, a DAC analog output module, and an LDO linear regulated power supply. The test interface includes a coil section and a contact section. The fixture unit is integrated on the base plate, which includes several fixture plates that are pushed into the base plate in a horizontal insertion manner to connect to the base plate in a board-to-board manner. The fixture plates are used to quickly fix the relay and electrically connect it to the test interface of the corresponding comprehensive test module. The external execution button is connected to the base plate. By changing the on / off state, the high and low levels of the I / O input are changed, which triggers the operation of the integrated test module in a level conversion manner. The programmable switch is connected to the coil section of the test interface; the coil power supply is connected to the host computer and connected to the programmable switch of each integrated test module through the base plate. Based on the program control of the host computer, it outputs voltages of different specifications to meet the power supply requirements of different relay coils. The main control MCU connects to the programmable switch via I / O and drives the relay based on the I / O; The ATX power supply is connected to the load modules and LDO linear regulated power supplies of each integrated test module via the base plate; the contact part of the test interface of the load module is provided with the voltage and load conditions required for parameter testing through the load module; the LDO linear regulated power supply is connected to the main control MCU. The contact portion of the test interface is connected to relay isolation module I, and the coil portion is connected to relay isolation module I through differential operational amplifier module I; relay isolation module I is connected to the oscilloscope through the base plate, and the oscilloscope is isolated and switched to acquire waveforms through the interface of relay isolation module I and 16-to-1 selection; the oscilloscope is connected to the host computer to upload waveform information to the host computer; The contact part of the test interface is connected to the time measurement circuit, and the coil part is connected to the time measurement circuit through the differential operational amplifier module I; the time measurement circuit is connected to the main control MCU through the DAC analog output module, and the time parameter test of the relay is performed by the time measurement circuit. The DAC analog output module provides the comparison threshold during time measurement; among which, the time parameters include pull-in and release time, bounce time, stabilization time, leap time, and asynchronous action time; The coil and contact parts of the test interface are connected to the A / D module through differential operational amplifier module I and differential operational amplifier module II, respectively. The A / D module is connected to the main control MCU and acquires the electrical parameters of the relay, including input voltage, input current, contact voltage drop, pull-in and release voltage, and asynchronous operation voltage. The network switch is connected to the host computer and is also connected to the main control MCU of each integrated test module through the baseboard to support parallel testing or ping-pong alternating testing of several relays.

2. The relay comprehensive parameter testing system as described in claim 1, characterized in that: The integrated test module also includes a coil power supply test circuit, which includes a relay isolation module II, a differential operational amplifier module III, and a sampling resistor connected between the programmable switch and the coil power supply. The sampling resistor is connected to an oscilloscope through the differential operational amplifier module III and the relay isolation module II in sequence.

3. The relay comprehensive parameter testing system as described in claim 1, characterized in that: The integrated test module uses an STM32F4XX chip as the main control MCU.

4. The relay comprehensive parameter testing system as described in claim 1, characterized in that: The A / D module uses a 24-bit high-precision ADS1256 chip.

5. The relay comprehensive parameter testing system as described in claim 1, characterized in that: The main control MCU is externally connected to a W5500 chip, which uses a MAC+PHY integrated network communication protocol, for communication with the host computer.

Images