Single board, electronic device and manufacturing method

Abstract

The present application discloses a single board, an electronic device and a manufacturing method, which belong to the field of bare chip packaging technology. The single board includes a PCB assembly, a bare chip, a reinforcement frame, a heat sink and a fixing member; the bare chip and the reinforcement frame are both located on the surface of the PCB assembly, and the bare chip is located in the reinforcement frame, and the reinforcement frame is fixedly connected to the PCB assembly through the fixing member; the heat sink is located on the surface of the bare chip away from the PCB assembly, and the heat sink is fixedly connected to the reinforcement frame through the fixing member. By adopting the present application, the deformation of the PCB assembly at the bare chip can be reduced, the connection reliability between the bare chip and the PCB assembly can be improved, and the number of vias on the PCB assembly can be reduced, which is beneficial to the wiring of the PCB assembly and the installation of components, and can achieve high-density wiring on the PCB surface.

Description

Technical Field

[0001] The present application relates to the technical field of bare chip packaging, and in particular to a single board, an electronic device and a manufacturing method. Background Art

[0002] A single board of an electronic device mainly includes a printed circuit board (PCB) assembly, a bare chip and a heat sink. The bare chip is soldered on the surface of the PCB assembly, and the heat sink is located on the surface of the bare chip away from the PCB assembly.

[0003] When a single board is in transportation or when the temperature of the single board is high, its PCB assembly is prone to deformation. Once the PCB assembly is deformed, the connection between the bare chip and the PCB assembly is prone to cracking, resulting in poor connection reliability between the bare chip and the PCB assembly. Summary of the invention

[0004] The present application provides a single board, an electronic device and a manufacturing method, which can solve the problems in the related technologies. The technical solutions are as follows:

[0005] In one aspect, a single board is provided, the single board comprising a PCB assembly, a bare chip, a reinforcement frame, a heat sink and a fixing member;

[0006] The bare chip and the reinforcing frame are both located on the surface of the PCB assembly, and the bare chip is located in the reinforcing frame, and the reinforcing frame is fixedly connected to the PCB assembly through the fixing member;

[0007] The heat sink is located on the surface of the bare chip away from the PCB assembly, and the heat sink is fixedly connected to the reinforcement frame through the fixing member.

[0008] Among them, the PCB assembly may include a PCB and a protective plate. The protective plate may also be called a handle bar, which serves as the base of the single board and the surface of the protective plate to which the PCB is fixed.

[0009] In the solution shown in the present application, the reinforcing frame is located on the surface of the PCB of the PCB assembly and surrounds the bare chip, so that the reinforcing frame can enhance the rigidity of the PCB at the position corresponding to the bare chip, thereby reducing the deformation of the PCB at the position corresponding to the bare chip. Once the deformation of the PCB at the position corresponding to the bare chip is small or even non-deformed, the reliability of the connection between the bare chip and the PCB can be improved.

[0010] In a possible implementation manner, the fixing member includes a first fixing member and a second fixing member;

[0011] The first fixing member passes through the reinforcing frame and is fixed in the PCB assembly;

[0012] The second fixing member passes through the heat sink and is fixed in the reinforcement frame, and a depth of the second fixing member entering the reinforcement frame is less than or equal to a thickness of the reinforcement frame.

[0013] In the solution shown in the present application, the reinforcement frame is fixedly connected to the PCB assembly by a first fixing member, the heat sink is fixedly connected to the reinforcement frame by a second fixing member, the PCB of the PCB assembly has a via hole for the first fixing member to pass through, and the second fixing member does not pass through the PCB. Therefore, compared with the reinforcement frame being fixed to the protective plate by screws and the heat sink being fixed to the protective plate by screws, it is obvious that the number of vias on the PCB can be reduced. The reduction in the number of vias on the PCB is beneficial to the wiring on the PCB surface and the installation of components.

[0014] In a possible implementation manner, the second fixing member includes a screw and a first elastic member;

[0015] The screw passes through the heat sink and is fixed in the reinforcement frame, and the depth of the screw entering the reinforcement frame is less than or equal to the thickness of the reinforcement frame, and the first elastic member is compressed between the nut of the screw and the heat sink.

[0016] In the solution shown in the present application, the reinforcing frame is provided with a threaded hole, wherein the threaded hole may be a through hole with a threaded inner wall, or a blind hole with a threaded inner wall, which is not limited in the present embodiment. In this way, the screw can pass through the radiator and be screwed into the threaded hole of the reinforcing frame, and the depth of the screw entering the reinforcing frame is less than or equal to the thickness of the reinforcing frame, so that the screw will not pass through the threaded hole and enter the PCB.

[0017] In the solution shown in the present application, the first elastic member is compressed between the nut of the screw and the heat sink, which can not only absorb the tolerance between the bare chip and the heat sink, but also keep the bottom of the bare chip and the heat sink in close contact to accelerate the heat transfer between the bare chip and the heat sink, thereby accelerating the heat dissipation of the bare chip.

[0018] In a possible implementation manner, the fixing member passes through the heat sink and the reinforcement frame and is fixed in the PCB assembly.

[0019] In the solution shown in the present application, the fixing part passes through the heat sink and the reinforcement frame and is fixed in the protective plate of the PCB assembly. The heat sink and the reinforcement frame share the fixing part. Therefore, compared with the reinforcement frame being fixed to the protective plate by screws and the heat sink being fixed to the protective plate by screws, it is obviously possible to reduce the number of vias on the PCB. The reduction in the number of vias on the PCB is conducive to the wiring on the PCB surface and realizes high-density wiring on the PCB surface.

[0020] In a possible implementation manner, the fixing member includes a stud, a nut and a second elastic member, and the outer wall of the stud has a boss;

[0021] The first end of the stud passes through the reinforcement frame and is fixed in the PCB assembly, and the boss is located on a surface of the reinforcement frame away from the PCB assembly, and the second end of the stud passes through the heat sink;

[0022] The nut is fixed at a position of the stud close to the second end, and the second elastic member is compressed between the nut and the heat sink.

[0023] In the solution shown in the present application, the protective plate of the PCB assembly can have a threaded hole, wherein the threaded hole can be a through hole with a threaded inner wall, or a blind hole with a threaded inner wall, which is not limited in this embodiment. In this way, the first end of the stud can pass through the reinforcement frame and be screwed into the threaded hole of the protective plate, and the boss is located on the surface of the reinforcement frame away from the PCB assembly, so that the reinforcement frame and the protective plate are fixedly connected. The second end of the stud extends out of the heat sink, and the second elastic member is placed on the surface of the heat sink away from the bare chip. The nut is screwed on the position of the stud close to the second end, so that the second elastic member is compressed between the heat sink and the nut to achieve a fixed connection between the heat sink and the reinforcement frame, and the second elastic member absorbs the gap between the heat sink and the bare chip, so that the heat sink and the bare chip maintain a fitted state, and accelerate the heat transfer between the bare chip and the heat sink.

[0024] In a possible implementation manner, the second elastic member includes a telescopic member and a shell;

[0025] The housing is sleeved outside the stud and is located above the boss, and the housing and the nut are buckled;

[0026] The telescopic member is located in the housing and is compressed between the housing and the nut.

[0027] The shell plays a role in protecting the second elastic member.

[0028] In the solution shown in the present application, the shell can move up and down relative to the nut along the axial direction of the stud under the telescopic movement of the telescopic part, and the movement stroke is within a preset range, so that the second elastic part can play a buffering role to absorb the tolerance between the heat sink and the bare chip, and keep the heat sink and the bare chip in a fitted state.

[0029] In a possible implementation, the inner wall of the shell has a protrusion, the outer wall of the nut has a groove, the height of the groove is greater than the thickness of the protrusion, and the protrusion is located in the groove.

[0030] The solution shown in the present application can achieve a fixed connection between the shell and the nut through the cooperation of the protrusion and the groove, and by setting the thickness of the protrusion to be smaller than the height of the groove along the axial direction of the stud, it can be achieved that the shell can move up and down along the axial direction of the stud as the telescopic part is extended and retracted, so that the second elastic part has a buffering effect.

[0031] In a possible implementation manner, the bare chip and the heat sink are both multiple in number;

[0032] The reinforcing frame is in a grid shape, including a plurality of grids, and each of the bare chips is located in one of the grids;

[0033] The plurality of radiators are all fixedly connected to the reinforcement frame.

[0034] In the solution shown in the present application, multiple bare chips share one reinforcement frame. Compared with the one-to-one correspondence between bare chips and reinforcement frames, it is obviously possible to reduce the area occupied by the reinforcement frame on the PCB surface and also reduce the number of vias provided on the PCB for fixing the reinforcement frame.

[0035] Moreover, multiple bare chips share one reinforcement frame, so the reinforcement frame has a larger area and is fixed on the surface of the PCB assembly, which can not only enhance the rigidity of the PCB at the bare chip, but also enhance the overall rigidity of the PCB to reduce its deformation.

[0036] Moreover, since the multiple heat sinks are fixed on the reinforcement frame, the reinforcement frame can be used to fix the multiple heat sinks together, thereby saving the substrate used to fix the multiple heat sinks together. Once the substrate used to fix the multiple heat sinks is omitted, the space occupied by the substrate in the single board can be increased, and the extra space can be used to extend the height of the heat sink fins to increase the area of ​​the heat sink fins, further increase the heat dissipation area of ​​the heat sink, and improve the heat dissipation effect of the heat sink.

[0037] In a possible implementation, the reinforcement frame is made of metal;

[0038] The single board also includes an insulating layer, and the insulating layer is located between the reinforcement frame and the PCB assembly.

[0039] In the solution shown in the present application, if the reinforcement frame is made of metal and there are traces and components on the PCB surface, in order to prevent the reinforcement frame from affecting the traces and components on the PCB surface, an insulating layer can be installed between the reinforcement frame and the PCB to isolate the reinforcement frame from the traces on the PCB surface. The reinforcement frame and the insulating layer fit tightly, and the insulating layer and the PCB fit tightly, so as to effectively improve the rigidity of the PCB at the bare chip.

[0040] On the other hand, a method for manufacturing a single board is provided, the method being applied to the single board described above, the method comprising:

[0041] Solder the bare chip to the surface of the PCB assembly;

[0042] Placing a reinforcement frame on the surface of the PCB assembly, wherein the reinforcement frame surrounds the bare chip;

[0043] Placing a heat sink on a surface of the bare chip away from the PCB assembly;

[0044] The reinforcing frame and the PCB assembly are fixedly connected by using a fixing piece, and the heat sink and the reinforcing frame are fixedly connected.

[0045] In the solution shown in the present application, the bare chip is soldered to the surface of the PCB of the PCB assembly by tin, the reinforcing frame is located on the surface of the PCB and surrounds the bare chip, and the reinforcing frame is fixedly connected to the protective plate of the PCB assembly by a fixing member. The reinforcing frame can enhance the rigidity of the PCB assembly at the corresponding bare chip, thereby reducing the deformation of the PCB assembly at the bare chip and improving the connection reliability between the bare chip and the PCB assembly.

[0046] In the solution shown in the present application, the heat sink is located on the surface of the bare chip away from the PCB, and the bottom of the heat sink is tightly fitted with the bare chip so that the heat sink dissipates heat for the bare chip. The heat sink is fixedly connected to the reinforcing frame through a fixing member. The reinforcing frame is fixedly connected to the protective plate of the PCB assembly, and the heat sink is fixedly connected to the reinforcing frame. Compared with the reinforcing frame being fixedly connected to the protective plate of the PCB assembly, and the heat sink is also fixedly connected to the protective plate of the PCB assembly, this can obviously reduce the number of vias on the PCB. Once the number of vias on the PCB is reduced, it will be beneficial to the wiring of the PCB and the installation of components, and high-density wiring on the PCB surface can be achieved.

[0047] In a possible implementation manner, the fixing member includes a first fixing member and a second fixing member;

[0048] The method of using a fixing member to fix the reinforcing frame and the PCB assembly, and to fix the heat sink and the reinforcing frame, comprises:

[0049] Passing the first fixing member through the reinforcing frame and fixing it in the PCB assembly;

[0050] The second fixing member passes through the radiator and is fixed in the reinforcement frame.

[0051] In the solution shown in the present application, the first fixing member and the second fixing member can both be screws, one screw passes through the reinforcement frame and is screwed into the protective plate of the PCB assembly, and the other screw passes through the heat sink and is screwed into the reinforcement frame instead of the protective plate. This can reduce the number of vias on the PCB of the PCB assembly, and once the number of vias on the PCB is reduced, it will be beneficial to the wiring of the PCB and the installation of components, and can achieve high-density wiring on the PCB surface.

[0052] In a possible implementation manner, the method of using a fixing member to fix the reinforcement frame and the PCB assembly, and to fix the heat sink and the reinforcement frame includes:

[0053] The fixing member passes through the heat sink and the reinforcing frame and is fixed in the PCB assembly.

[0054] In the solution shown in the present application, the fixing part passes through the heat sink and the reinforcement frame and is fixed in the protective plate of the PCB assembly. The heat sink and the reinforcement frame share the fixing part. Therefore, compared with the reinforcement frame being fixed to the protective plate by screws and the heat sink being fixed to the protective plate by screws, it is obviously possible to reduce the number of vias on the PCB. The reduction in the number of vias on the PCB is conducive to the wiring on the PCB surface and realizes high-density wiring on the PCB surface.

[0055] In a possible implementation manner, the fixing member includes a stud, a nut and a second elastic member, and the outer wall of the stud has a boss;

[0056] The step of passing the fixing member through the heat sink and the reinforcing frame and fixing the fixing member in the PCB assembly comprises:

[0057] Passing the first end of the stud through the reinforcing frame and fixing it in the PCB assembly, wherein the boss is located on a surface of the reinforcing frame away from the PCB assembly, and the second end of the stud passes through the heat sink;

[0058] The nut is fixed at a position of the stud near the second end, wherein the second elastic member is compressed between the heat sink and the nut.

[0059] On the other hand, an electronic device is provided, and the electronic device includes the single board described above.

[0060] In the solution shown in the present application, the electronic device can be any device including a bare chip, for example, it can be a communication device, or it can be a server device, etc. The electronic device includes the single board described above.

[0061] The single board includes a reinforcing frame, which is located on the surface of the PCB assembly and surrounds the bare chip. The reinforcing frame can enhance the rigidity of the PCB assembly at the corresponding bare chip, thereby reducing the deformation of the PCB assembly at the bare chip and improving the connection reliability between the bare chip and the PCB assembly.

[0062] Moreover, the reinforcing frame and the PCB assembly are fixedly connected, and the heat sink for dissipating heat from the bare chip and the reinforcing frame are fixedly connected. Compared with the fixed connection between the reinforcing frame and the PCB assembly and the fixed connection between the heat sink and the PCB assembly, the number of vias on the PCB assembly can obviously be reduced. Once the number of vias on the PCB assembly is reduced, it will be beneficial to the wiring of the PCB assembly and the installation of components, and high-density wiring can be achieved on the surface of PCB11. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 It is a schematic diagram of the exploded structure of a single board provided by the present application;

[0064] Figure 2 It is a structural schematic diagram of a single board provided by the present application;

[0065] Figure 3 It is a schematic diagram of the exploded structure of a single board provided by the present application;

[0066] Figure 4 It is a structural schematic diagram of a single board provided by the present application;

[0067] Figure 5 It is a structural schematic diagram of a fixing member provided by the present application;

[0068] Figure 6 It is a schematic diagram of the exploded structure of a single board provided by the present application;

[0069] Figure 7 It is a partial structural schematic diagram of a reinforced frame of a single board provided in the present application.

[0070] Legend

[0071] 1. PCB assembly; 11. PCB; 12. protective plate; 121. column;

[0072] 2. Bare chip;

[0073] 3. Strengthen the framework; 30. Grid;

[0074] 4. radiator; 41. heat dissipation substrate; 42. heat dissipation fins;

[0075] 5. Fixing member; 51. First fixing member; 52. Second fixing member;

[0076] 53, stud; 531, boss; 54, nut; 55, second elastic member;

[0077] 551, telescopic member; 552, housing; 553, protrusion;

[0078] 554, first shell; 555, second shell;

[0079] 6. Protective frame. DETAILED DESCRIPTION

[0080] The present application embodiment provides a single board of an electronic device, such as Figure 1 As shown, the single board includes a printed circuit board (PCB) assembly 1, a bare chip 2, a reinforcement frame 3, a heat sink 4 and a fixing member 5. In terms of positional relationship: the bare chip 2 and the reinforcement frame 3 are both located on the surface of the PCB assembly 1, and the bare chip 2 is located in the reinforcement frame 3, and the heat sink 4 is located on the surface of the bare chip 2 away from the PCB assembly. In terms of fixed relationship: the reinforcement frame 3 is fixedly connected to the PCB assembly 1 through the fixing member 5, and the heat sink 4 is fixedly connected to the reinforcement frame 3 through the fixing member 5.

[0081] like Figure 1 As shown, the PCB assembly 1 may include a PCB11 and a protective plate 12. The protective plate 12 may also be called a handle bar, which serves as the base of the single board. The surface of the protective plate 12 to which the PCB11 is fixed, for example, the two may be fixedly connected by gluing or screws. In the case where the PCB11 is fixed to the surface of the protective plate 12 by screws, if the thickness of the protective plate 12 is small and it is difficult to form threaded holes, a column may be provided on the surface of the protective plate 12 close to the PCB11, and a threaded hole may be provided in the column, so that the screw may pass through the PCB11 and be screwed into the threaded hole of the column to achieve a fixed connection between the PCB11 and the protective plate 12. Moreover, due to the presence of the column, there is a gap between the PCB11 and the protective plate 12, so wiring can be performed on the surface of the PCB11 close to the protective plate 12, and some components can be installed.

[0082] The bare chip 2 may also be referred to as a die, and is manufactured from semiconductor components.

[0083] The reinforcement frame 3 may also be called a reinforcement skeleton, which surrounds the bare chip 2 and may be made of metal.

[0084] The heat sink 4 is a device for dissipating heat for the bare chip 2, and is usually made of metal aluminum or metal copper. Figure 1As shown, it may include a heat dissipation substrate 41 and heat dissipation fins 42. The heat dissipation fins 42 are located on the surface of the heat dissipation substrate 41. For example, the heat dissipation fins 42 can be welded on the surface of the heat dissipation substrate 41. The more the number of heat dissipation fins 42 and the larger the area, the larger the heat dissipation area of ​​the radiator 4 and the better the heat dissipation effect.

[0085] In one example, the bare chip 2 is located on the surface of the PCB 11, and there is usually a protective member around the bare chip 2 for protecting the bare chip 2, such as Figure 1 As shown, the single board also includes a protection frame 6, which is located on the surface of PCB 11 and surrounds the bare chip 2. The protection frame 6 is not only used to protect the bare chip 2, but also can be used as a shielding device to shield interference signals in the environment around the bare chip 2, and also to shield the signals of the bare chip 2 to reduce interference to surrounding components.

[0086] In one example, the bare chip 2 is typically soldered to the surface of the PCB assembly 1 by tinning. For example, the bare chip 2 has solder balls on its surface, and the surface of PCB11 of the PCB assembly 1 has solder pads. The solder balls of the bare chip 2 are soldered to the solder pads of PCB11 by tinning to achieve electrical connection between the bare chip 2 and PCB11.

[0087] When the temperature of PCB11 rises, or when the single board is being transported, PCB11 will be deformed. Once PCB11 is deformed, the reliability of the connection between the bare chip 2 and PCB11 will be reduced, resulting in the instability of the electrical connection between the bare chip 2 and PCB11.

[0088] In order to improve the connection stability between the bare chip 2 and the PCB11, the reinforcing frame 3 is located on the surface of the PCB11 of the PCB assembly 1 and surrounds the bare chip 2. In this way, the reinforcing frame 3 can enhance the rigidity of the PCB11 at the position corresponding to the bare chip 2, thereby reducing the deformation of the PCB11 at the position corresponding to the bare chip 2. Once the deformation of the PCB11 at the position corresponding to the bare chip 2 is small or even non-deformed, the reliability of the connection between the bare chip 2 and the PCB11 can be improved.

[0089] Since the reinforcing frame 3 is intended to improve the rigidity of the PCB 11 , accordingly, the reinforcing frame 3 can be closely fitted with the PCB 11 to effectively improve the rigidity of the PCB 11 at the bare chip 2 .

[0090] Alternatively, if the reinforcing frame 3 is made of metal and there are traces and components on the surface of PCB11, in order to prevent the reinforcing frame 3 from affecting the traces and components on the surface of PCB11, an insulating layer may be installed between the reinforcing frame 3 and PCB11 to isolate the reinforcing frame 3 from the traces on the surface of PCB11. The reinforcing frame 3 and the insulating layer fit tightly, and the insulating layer and PCB11 fit tightly, so as to effectively improve the rigidity of PCB11 at the bare chip 2.

[0091] PCB11, protective plate 12, bare chip 2, reinforcing frame 3 and heat sink 4 are in a fixed relationship. As described above, PCB11 is fixed to the surface of protective plate 12 by screws or adhesive, and bare chip 2 is welded to the surface of PCB11 away from protective plate 12.

[0092] Then, for the reinforcing frame 3 and the heat sink 4 , the reinforcing frame 3 is fixedly connected to the protection plate 12 of the PCB assembly 1 through the fixing member 5 , and the heat sink 4 is fixedly connected to the reinforcing frame 3 through the fixing member 5 .

[0093] The fixing member 5 may include two structural forms. One structural form of the fixing member 5 may be referred to in Figure 2 As shown, the fixing member 5 includes a first fixing member 51 and a second fixing member 52. Then, the reinforcing frame 3 is fixedly connected to the protective plate 12 of the PCB assembly 1 through the first fixing member 51 in the fixing member 5, and the radiator 4 is fixedly connected to the reinforcing frame 3 through the second fixing member 52 of the fixing member 5, and the depth of the second fixing member 52 entering the reinforcing frame 3 is less than or equal to the thickness of the reinforcing frame 3.

[0094] Another structural form of the fixing member 5 can be seen in Figure 3 and Figure 4 As shown, the fixing member 5 passes through the heat sink 4 and the reinforcing frame 3 and is fixed in the protective plate 12 of the PCB assembly 1 .

[0095] Whether the heat sink 4 is fixed to the reinforcing frame 3 by the second fixing member 52, the reinforcing frame 3 is fixed to the protective plate 12 by the first fixing member 51, or the fixing member 5 passes through the heat sink 4 and the reinforcing frame 3 and is fixed to the protective plate 12, compared with the reinforcing frame 3 being fixed to the protective plate 12 by screws, and the heat sink 4 being also fixed to the protective plate 12 by screws, the number of vias on the PCB 11 of the PCB assembly 1 can be reduced. The reasons for reducing the number of vias on the PCB 11 can be seen as follows:

[0096] The reinforcement frame 3 is fixedly connected to the PCB assembly 1 through the first fixing member 51, and the heat sink 4 is fixedly connected to the reinforcement frame 3 through the second fixing member 52. Figure 2As shown, there are vias on the PCB11 of the PCB assembly 1 for the first fixing member 51 to pass through. Since the depth that the second fixing member 52 enters the reinforcing frame 3 is less than or equal to the thickness of the reinforcing frame 3, the second fixing member 52 does not enter the PCB11. Then, there is no need to set holes on the PCB11 for the second fixing member 52 to enter. Therefore, compared with the case where the reinforcing frame 3 is fixed to the protective plate 12 by screws and the radiator 4 is also fixed to the protective plate 12 by screws, it is obvious that the number of vias on the PCB11 can be reduced. The reduction in the number of vias on the PCB11 is beneficial to the wiring on the surface of the PCB11 and the installation of components.

[0097] The fixing member 5 passes through the radiator 4 and the reinforcing frame 3 and is fixed in the protective plate 12 of the PCB assembly 1. As Figure 4 shown, the radiator 4 and the reinforcing frame 3 share the fixing member 5. Therefore, compared with the case where the reinforcing frame 3 is fixed to the protective plate 12 by screws and the radiator 4 is also fixed to the protective plate 12 by screws, it is obvious that the number of vias on the PCB11 can also be reduced. The reduction in the number of vias on the PCB11 is beneficial to the wiring on the surface of the PCB11 and realizes high-density wiring on the surface of the PCB11.

[0098] For example, if in the prior art, the reinforcing frame 3 is fixedly connected to the protective plate 12 by four screws and the radiator 4 is also fixedly connected to the protective plate 12 by four screws, then eight vias need to be set on the PCB11 for the above eight screws to pass through. And if Figure 2 shown, the radiator 4 is fixed to the reinforcing frame 3 by the second fixing member 52 and the reinforcing frame 3 is fixed to the protective plate 12 by the first fixing member 51. Then, the reinforcing frame 3 is fixedly connected to the protective plate 12 by four first fixing members 51, and the radiator 4 is fixedly connected to the reinforcing frame 3 by four second fixing members 52, and none of the four second fixing members 52 is inserted into the PCB11. Therefore, the PCB11 only needs to set four vias for the first fixing member 51 to pass through. And if Figure 4 shown, the fixing member 5 passes through the radiator 4 and the reinforcing frame 3 and is fixed to the protective plate 12. Then, each of the four fixing members 5 passes through the radiator 4 and the reinforcing frame 3 and is screwed into the protective plate 12. Then, only four vias need to be set on the PCB11 for the four fixing members 5 to pass through.

[0099] It can be seen that whether the radiator 4 is fixed to the reinforcing frame 3 by the second fixing member 52 and the reinforcing frame 3 is fixed to the protective plate 12 by the first fixing member 51, or the fixing member 5 passes through the radiator 4 and the reinforcing frame 3 and is fixed to the protective plate 12, the number of vias on the PCB11 of the PCB assembly 1 can be reduced.

[0100] The above two fixing methods of the reinforcing frame 3 and the radiator 4 will be described below.

[0101] As described above, the reinforcement frame 3 can be fixedly connected to the protection plate 12 of the PCB assembly 1 through the first fixing member 51. Figure 1 As shown, the first fixing member 51 may be a screw, such as Figure 2 As shown, the first fixing member 51 passes through the reinforcing frame 3 and is fixed in the PCB assembly 1 . For example, the first fixing member 51 passes through the reinforcing frame 3 and the PCB 11 and is fixed in the protective plate 12 .

[0102] There are multiple first fixing members 51, for example: Figure 1 As shown, there can be four or more first fixing members 51, which can be flexibly selected according to actual conditions, for example, according to the number of bare chips 2 included in the single board. If the number of bare chips 2 is one, then the number of first fixing members 51 can be four, and if the number of bare chips 2 is Figure 6 As shown in FIG. 4 , the number of the first fixing members 51 may be ten.

[0103] In one example, the first fixing member 51 is fixed in the protective plate 12. For example, the protective plate 12 may be provided with a threaded hole, and the first fixing member 51 of a screw is screwed into the threaded hole. The threaded hole may be a through hole with a threaded inner wall, or a blind hole with a threaded inner wall, which is not limited in this embodiment.

[0104] It should be noted that if the thickness of the protective plate 12 is relatively thin, the depth of the threaded hole may not be sufficient. Figure 2 As shown, a column 121 may be provided on the surface of the protective plate 12 close to the PCB 11, and a threaded hole may be provided on the column 121, and the first fixing member 51 is screwed into the threaded hole of the column 121. In this way, the depth of the threaded hole can be lengthened by means of the column 121, so that the first fixing member 51 can be screwed into the threaded hole.

[0105] As described above, the radiator 4 is fixedly connected to the reinforcing frame 3 through the second fixing member 52. Figure 1 As shown, the second fixing member 52 may include a screw 521 and a first elastic member 522. Figure 2 As described, the screw 521 passes through the heat sink 4, and the depth of the screw entering the reinforcement frame 3 is less than or equal to the thickness of the reinforcement frame 3, so that the screw 521 does not enter the PCB 11, but is fixed in the reinforcement frame 3, and the first elastic member 522 is compressed between the nut of the screw 521 and the heat sink 4.

[0106] The number of the second fixing members 52 may also be multiple, for example, Figure 1As shown, there may be four or more second fixing members 52, which can be flexibly selected according to actual conditions, for example, according to the number of heat sinks 4 included in the single board. If the number of heat sinks 4 is one, then the number of second fixing members 52 can be four, and if the number of heat sinks 4 is Figure 6 As shown in FIG. 4 , the number of the second fixing members 52 may be 16.

[0107] As described above, the heat sink 4 includes a heat dissipation substrate 41 and heat dissipation fins 42. Figure 2 As shown, the screw 521 can pass through the heat dissipation substrate 41 and be fixed in the reinforcement frame 3 , and the first elastic member 522 is compressed between the nut of the screw 521 and the heat dissipation substrate 41 .

[0108] In one example, if Figure 2 As shown, the reinforcing frame 3 may be provided with a threaded hole, wherein the threaded hole may be a through hole with a threaded inner wall, or a blind hole with a threaded inner wall, which is not limited in this embodiment. Accordingly, the screw 521 passes through the heat dissipation substrate 41 of the radiator 4 and is screwed into the threaded hole of the reinforcing frame 3, and the depth of the screw 521 entering the threaded hole of the reinforcing frame 3 is less than or equal to the depth of the threaded hole, so that the screw 521 will not enter the PCB 11. Since the screw 521 does not enter the PCB 11, it is not necessary to set a via hole on the PCB 11 for the screw 521 to enter, thereby reducing the number of via holes on the PCB 11.

[0109] Among them, the first elastic member 522 can be a component with contraction elasticity, for example, it can be a spring, an elastic fastener and a compressible heat-conducting medium, etc. This embodiment does not limit the specific structural form of the first elastic member 522, and a spring can be used as an example in the accompanying drawings.

[0110] Among them, the first elastic member 522 is compressed between the nut of the screw 521 and the heat sink 4, which can not only absorb the tolerance between the bare chip 2 and the heat sink 4, but also keep the bottom of the bare chip 2 and the heat sink 4 in close contact, so as to accelerate the heat transfer between the bare chip 2 and the heat sink 4 and accelerate the heat dissipation of the bare chip 2.

[0111] The reinforcing frame 3 is fixed to the protective plate 12 by a first fixing member 51, and the heat sink 4 is fixed in the reinforcing frame 3 by a second fixing member 52. The second fixing member 52 does not pass through the PCB 11, so that the PCB 11 has fewer vias, which is beneficial to the wiring of the PCB 11 and the installation of components.

[0112] As described above, the fixing member 5 passes through the heat sink 4 and the reinforcing frame 3 and is fixed in the protection plate 12 of the PCB assembly 1 .

[0113] There are multiple fixing members 5, for example: Figure 1 As shown, there can be four or more fixing members 5, which can be flexibly selected according to actual conditions, for example, according to the number of bare chips 2 included in the single board. If the number of bare chips 2 is one, then the number of fixing members 5 can be four, and if the number of bare chips 2 is Figure 6 The number of the fixing members 5 is four as shown, and thus the number of the fixing members 5 may be ten.

[0114] The fixing member 5 passes through the heat sink 4 and the reinforcement frame 3 and is fixed in the protective plate 12 of the PCB assembly 1. One way in the scheme may be that the fixing member 5 includes a stud 53, a nut 54 and a second elastic member 55. The stud 53 has an external thread at a position close to the first end, and the stud 53 has an external thread at a position close to the second end. The first end of the stud 53 passes through the heat sink 4, the reinforcement frame 3 and the PCB11 in sequence and is screwed in the protective plate 12 of the PCB assembly 1. The second end of the stud 53 extends out of the heat dissipation substrate 41 of the heat sink 4, and the second elastic member 55 is located on the surface of the heat dissipation substrate 41 away from the reinforcement frame 3. The nut 54 is fixed at a position close to the second end of the stud 53, and the second elastic member 55 is compressed between the heat dissipation substrate 41 and the nut 54.

[0115] Among them, the second elastic member 55 can be a component with contraction elasticity, for example, it can be a spring, an elastic fastener and a compressible heat-conducting medium, etc. This embodiment does not limit the specific structural form of the second elastic member 55, and a spring can be used as an example in the accompanying drawings.

[0116] The fixing member 5 passes through the heat sink 4 and the reinforcing frame 3 and is fixed in the protective plate 12 of the PCB assembly 1. Another solution may be as follows: Figure 3 As shown, the fixing member 5 also includes a stud 53, a nut 54 and a second elastic member 55. The difference from the above fixing member 5 is that the outer wall of the stud 53 has a boss 531, wherein the boss 531 can also be called a step.

[0117] like Figure 4 As shown, the first end of the stud 53 passes through the reinforcement frame 3 and is fixed in the PCB assembly 1, and the boss 531 is located on the surface of the reinforcement frame 3 away from the PCB assembly 1, the second end of the stud 53 passes through the heat sink 4, the nut 53 is fixed at a position of the stud 53 close to the second end, and the second elastic member 55 is compressed between the nut 54 and the heat sink 4.

[0118] The stud 53 is screwed into the protective plate 12. For example, the protective plate 12 is provided with a threaded hole, wherein the threaded hole can be a through hole with a threaded inner wall, or a blind hole with a threaded inner wall, which is not limited in this embodiment. The stud 53 can be screwed into the threaded hole of the protective plate 12. If the thickness of the protective plate 12 is relatively thin, in order to tighten the stud 53 in the protective plate 12, correspondingly, it can be referred to Figure 4 As shown, the surface of the protective plate 12 close to the PCB 11 has a column 121, and the column 121 is provided with a threaded hole. In this way, the stud 53 is screwed into the threaded hole of the column 121, and the depth of the threaded hole can be lengthened by means of the column 121, so that the stud 53 can be tightened in the protective plate 12.

[0119] For example, the first end of the stud 53 passes through the reinforcing frame 3 and the PCB 11, the external thread near the first end is screwed into the column of the protective plate 12, and the boss 531 of the stud 53 is attached to the surface of the reinforcing frame 3 away from the PCB 11. Then, the heat sink 4 is placed on the surface of the bare chip 2 and the reinforcing frame 3 away from the PCB 11, and the second end of the stud 53 passes through the heat dissipation substrate 41 of the heat sink 4, and then the second elastic member 55 and the nut 54 are installed at the position near the second end of the stud 53, and the second elastic member 55 is compressed between the heat dissipation substrate 41 and the nut 54, so that the heat dissipation substrate 41 of the heat sink 4 and the reinforcing frame 3 are fixedly connected, and the second elastic member 55 can also absorb the tolerance between the bare chip 2 and the heat sink 4, and keep the bottom of the bare chip 2 and the heat sink 4 in close contact, so as to accelerate the heat transfer between the bare chip 2 and the heat sink 4, and accelerate the heat dissipation of the bare chip 2.

[0120] like Figure 5 As shown, the second elastic member 55 may include a telescopic member 551 and a shell 552 . The shell 552 is sleeved on the stud 53 and is located above the boss 531 . The shell 552 and the nut 54 are buckled together. The telescopic member 551 is located in the shell 552 and is compressed between the shell 552 and the nut 54 .

[0121] The shell 552 serves to protect the second elastic member 55 .

[0122] Among them, the shell 552 can move up and down along the axial direction of the stud 53 relative to the nut 54 under the telescopic movement of the telescopic member 551, and the moving stroke is within a preset range, so that the second elastic member 55 can play a buffering role to absorb the tolerance between the heat sink 4 and the bare chip 2, and keep the heat sink 4 and the bare chip 2 in a fitted state.

[0123] In one example, the fastening method of the housing 552 and the nut 54 can be as follows: Figure 5As shown, the inner wall of the housing 552 has a groove 553 , and the outer wall of the nut 54 has a protrusion 553 , and the protrusion 553 is located in the groove 541 , thereby achieving the buckling of the housing 552 and the nut 54 .

[0124] In order to enable the housing 552 to move up and down relative to the nut 54 along the axial direction of the stud 53, accordingly, Figure 5 As shown, the height of the groove 541 along the axial direction of the stud 53 is greater than the thickness of the protrusion 553, and the difference between the height of the groove 541 and the thickness of the protrusion 553 is within the preset range described above, that is, the stroke of the shell 552 moving up and down relative to the nut 54.

[0125] In this way, through the cooperation of the protrusion 553 and the groove 541, the fixed connection between the shell 552 and the nut 54 can be achieved. By setting the thickness of the protrusion 553 to be smaller than the height of the groove 541 along the axial direction of the stud 53, the shell 552 can be moved up and down along the axial direction of the stud 53 as the telescopic member 551 is extended and retracted, so that the second elastic member 55 has a buffering effect.

[0126] In one example, the shell 552 can be a stepped shell, and the inner diameter of the bottom of the shell 552 is smaller than the inner diameter of the top, so that the telescopic member 551 can be located in the shell 552, and the telescopic member 551 can be supported on the bottom surface of the shell 552, so that the telescopic member 551 is compressed between the bottom of the shell 552 and the bottom of the nut 54.

[0127] like Figure 5 As shown, the housing 552 may include a first housing 554 and a second housing 555, and the bottom of the first housing 554 is connected to the top of the second housing 555. For example, the first housing 554 and the second housing 555 are integrally formed. For another example, the first housing 554 and the second housing 555 are connected by threads. As an example, the inner wall of the bottom of the first housing 554 has an internal thread, and the outer wall of the top of the second housing 555 has an external thread, and the two are connected by threads.

[0128] In order to allow the first shell 554 and the second shell 555 to be sleeved outside the stud 53 , the inner diameter of the first shell 554 and the inner diameter of the second shell 555 are correspondingly larger than the outer diameter of the stud 53 .

[0129] In order to enable the telescopic member 551 to be located in the housing 552 and compressed in the housing 552, accordingly, the inner diameter of the first housing 554 is larger than the outer diameter of the telescopic member 551, and the inner diameter of the bottom of the second housing 555 is smaller than the outer diameter of the telescopic member 551. In this way, the telescopic member 551 can be located in the first housing 554, and the bottom of the telescopic member 551 can be supported on the inner surface of the bottom of the second housing 555. Alternatively, the entire inner diameter of the second housing 555 is smaller than the outer diameter of the telescopic member 551, so that the telescopic member 551 can be located in the first housing 554, and the telescopic member 551 is supported on the outer surface of the top of the second housing 555.

[0130] In one example, a single board may include one or more bare chips 2, such as Figure 6 As shown, the single board includes a plurality of bare chips 2, and the plurality of bare chips 2 are located on the surface of the PCB assembly 1, for example, the plurality of bare chips 2 are located on the surface of the PCB 11. The plurality of bare chips 2 can use a larger heat sink 4 for heat dissipation, or the plurality of bare chips 2 use a plurality of heat sinks 4 for heat dissipation, and the number of bare chips 2 and heat sinks 4 can be equal or unequal, which is not limited in this embodiment.

[0131] Multiple bare chips 2 can share a reinforcing frame 3, for example, Figure 6 And refer to Figure 7 As shown, Figure 7 for Figure 6 The reinforcing frame 3 is a schematic diagram of a local structure. The reinforcing frame 3 is in a grid shape, including a plurality of grids 30. Each bare chip 2 is located in a grid 30. A plurality of heat sinks 4 can be fixed on the reinforcing frame 3.

[0132] In order to enable multiple bare chips 2 to share a reinforcement frame 3, the reinforcement frame 3 is adapted to the area where the multiple bare chips 2 are located. For example, the area of ​​the reinforcement frame 3 is adapted to the area where the multiple bare chips 2 are located. The grids 30 of the reinforcement frame 3 can correspond one-to-one to the bare chips 2, or the grids 30 of the reinforcement frame 3 can be more than the bare chips 2. The grids 30 can be used not only to install the bare chips 2, but also to install other components of the single board.

[0133] Compared with the one-to-one correspondence between the bare chips 2 and the reinforcement frame 3, this method of multiple bare chips 2 sharing one reinforcement frame 3 can obviously reduce the area occupied by the reinforcement frame 3 on the surface of PCB 11, and can also reduce the number of vias set on PCB 11 for fixing the reinforcement frame 3.

[0134] Moreover, the reinforcing frame 3 has a large area and is fixed on the surface of the PCB assembly 1, which can not only enhance the rigidity of the PCB 11 at the bare chip 2, but also enhance the rigidity of the entire PCB 11 to reduce its deformation.

[0135] Moreover, since the plurality of radiators 4 are fixed on the reinforcing frame 3, the reinforcing frame 3 can be used to fix the plurality of radiators 4 together, thereby saving the substrate used to fix the plurality of radiators 4 together. Once the substrate used to fix the plurality of radiators 4 is omitted, there will be more space occupied by the substrate in the single board, and the extra space can be used to extend the height of the heat dissipation fins 42 of the radiator 4, so as to increase the area of ​​the heat dissipation fins 42, further increase the heat dissipation area of ​​the radiator 4, and improve the heat dissipation effect of the radiator 4.

[0136] In addition, in the solution where multiple heat sinks 4 dissipate heat for multiple bare chips 2, the multiple heat sinks 4 can be connected through heat pipes or heat spreaders to form a connected heat sink, and the multiple heat sinks 4 are connected. The connected heat sink formed by the multiple heat sinks 4 can achieve temperature uniformity for each bare chip 2, so that some bare chips 2 do not have poor heat dissipation and accumulate high temperatures, while some bare chips 2 do not have excessive heat dissipation and have low temperatures.

[0137] The conjoined radiator formed by multiple radiators 4 is fixed on the reinforcing frame 3, which can also protect the heat pipe or the heat spreader, because the material of the heat pipe or the heat spreader is generally copper and thin. If there is no support plate, the heat pipe or the heat spreader is easily damaged. The conjoined radiator formed by multiple radiators 4 is fixed on the reinforcing frame 3, so that the heat pipe or the heat spreader is located in the same plane, and it will not be bent and damaged, thus protecting the heat pipe or the heat spreader.

[0138] In an embodiment of the present application, the single board includes a reinforcing frame, which is located on the surface of the PCB assembly and surrounds the bare chip. The reinforcing frame can enhance the stiffness of the PCB assembly at the corresponding bare chip, thereby reducing the deformation of the PCB assembly at the bare chip and improving the connection reliability between the bare chip and the PCB assembly.

[0139] Moreover, the reinforcement frame and the PCB assembly are fixedly connected, and the heat sink and the reinforcement frame are fixedly connected. Compared with the reinforcement frame and the PCB assembly being fixedly connected and the heat sink and the PCB assembly being fixedly connected, the number of vias on the PCB assembly can be reduced. Once the number of vias on the PCB assembly is reduced, it will be beneficial to the wiring of the PCB assembly and the installation of components, and high-density wiring can be achieved on the surface of PCB11.

[0140] Moreover, in the case where a single board includes multiple bare chips, the multiple bare chips can share a reinforcement frame, which is in the shape of a grid, including multiple grids, and each bare chip is located in a grid. Compared with the one-to-one correspondence between bare chips and reinforcement frames, this solution can obviously reduce the area occupied by the reinforcement frame on the PCB assembly, and can also reduce the number of vias of the PCB assembly, and can achieve high-density wiring on the surface of PCB11.

[0141] Moreover, in the case where a single board includes multiple heat sinks, the multiple heat sinks can be fixed on a reinforcement frame, and the reinforcement frame fixes the multiple heat sinks together, thereby eliminating the need for a substrate for fixing the multiple heat sinks together. Once the substrate for fixing the multiple heat sinks is eliminated, there is more space occupied by the substrate in the single board, and the extra space can be used to extend the height of the heat sink fins to increase the area of ​​the heat sink fins, further increase the heat dissipation area of ​​the heat sink, and improve the heat dissipation effect of the heat sink.

[0142] An embodiment of the present application also provides a method for manufacturing a single board, which is applied to the single board described above and includes the following steps.

[0143] In step 1, the bare chip 2 is soldered on the surface of the PCB assembly 1 .

[0144] The PCB assembly 1 may include a PCB 11 and a protection plate 12 , and the PCB 11 is fixed to the surface of the protection plate 12 .

[0145] In an example, the surface of the bare chip 2 has solder balls, and the surface of the PCB 11 has solder pads. The solder balls of the bare chip 2 can be soldered to the surface of the PCB 11 by tin to achieve electrical connection between the bare chip 2 and the PCB 11.

[0146] In step 2, the reinforcing frame 3 is placed on the surface of the PCB assembly 1 , and the reinforcing frame 3 surrounds the bare chip 2 .

[0147] In an example, the reinforcement frame 3 is placed on the surface of the PCB 11 , and the reinforcement frame 3 includes a grid 30 , and the grid 30 surrounds the bare chip 2 therein.

[0148] In step three, the heat sink 4 is placed on the surface of the bare chip 2 away from the PCB assembly 1 .

[0149] In one example, the heat sink 4 is used to dissipate heat for the bare chip 2 , so the heat sink 4 is placed on the surface of the bare chip 2 away from the PCB assembly 1 .

[0150] In step four, the reinforcing frame 3 and the PCB assembly 1 are fixedly connected by using the fixing member 5 , and the heat sink 4 and the reinforcing frame 3 are fixedly connected.

[0151] In one example, a fixing method can be that the reinforcement frame 3 is fixedly connected to the protective plate 12 of the PCB assembly 1 through the first fixing member 51 in the fixing member 5, and the heat sink 4 is fixedly connected to the reinforcement frame 3 through the second fixing member 52 of the fixing member 5. Figure 2 Another fixing method is that the fixing member 5 passes through the heat sink 4 and the reinforcing frame 3 and is fixed in the protective plate 12 of the PCB assembly 1. Figure 3 and Figure 4 shown.

[0152] As can be seen from the above, the single board includes a reinforcing frame 3, which is located on the surface of the PCB assembly 1 and surrounds the bare chip 2 therein. The reinforcing frame 3 can enhance the rigidity of the PCB assembly 1 at the corresponding bare chip 2, thereby reducing the deformation of the PCB assembly 1 at the bare chip 2 and improving the connection reliability between the bare chip 2 and the PCB assembly 1.

[0153] Moreover, the reinforcing frame 3 is fixedly connected to the PCB assembly 1, and the heat sink 4 for dissipating heat from the bare chip 2 is fixedly connected to the reinforcing frame 3. Compared with the fixed connection between the reinforcing frame 3 and the PCB assembly 1 and the fixed connection between the heat sink 4 and the PCB assembly 1, this fixing method can obviously reduce the number of vias on the PCB assembly 1. Once the number of vias of the PCB assembly 1 is reduced, it will be beneficial to the wiring of the PCB assembly 1 and the installation of components, and high-density wiring on the surface of PCB11 can be achieved.

[0154] In an example, the fixing member 5 includes a first fixing member 51 and a second fixing member 52, and the above step 4 can be performed as follows.

[0155] Firstly, the first fixing member 51 can be passed through the reinforcing frame 3 and fixed in the PCB assembly 1 .

[0156] For example, the first fixing member 51 passes through the reinforcing frame 3 and the PCB 11 of the PCB assembly 1 and is fixed in the protection plate 12 of the PCB assembly 1. The second fixing member 52 passes through the heat sink 4 and is fixed in the reinforcing frame 3.

[0157] In another example, the above step 4 may also be performed in the following manner: the fixing member 5 is passed through the heat sink 4 and the reinforcing frame 3 and fixed in the PCB assembly 1 .

[0158] For example, the fixing member 5 includes a stud 53, a nut 54, and a second elastic member 55, wherein the position of the stud 53 near the first end has an external thread, and the position of the stud 53 near the second end has an external thread. First, the first end of the stud 53 is passed through the heat sink 4, the reinforcement frame 3, and the PCB 11 in sequence, and is screwed into the column 121 of the protective plate 12 of the PCB assembly 1, wherein the second end of the stud 53 extends out of the heat dissipation substrate 41 of the heat sink 4, and the second elastic member 55 is located on the surface of the heat dissipation substrate 41 away from the reinforcement frame 3, and then, the nut 54 is fixed to the position of the stud 53 near the second end, and the second elastic member 55 is compressed between the heat dissipation substrate 41 and the nut 54.

[0159] For another example, the fixing member 5 includes a stud 53, a nut 54 and a second elastic member 55, and the outer wall of the stud 53 has a boss 531. The fixing member 5 is passed through the heat sink 4 and the reinforcing frame 3 and fixed in the PCB assembly 1, which can be performed according to the following process:

[0160] First, the first end of the stud 53 is passed through the reinforcing frame 3 and fixed in the PCB assembly 1 , wherein the boss 531 is located on the surface of the reinforcing frame 3 away from the PCB assembly 1 .

[0161] Then, the heat sink 4 is placed on the surface of the bare chip 2 away from the PCB assembly 1 , and the second end of the stud 53 passes through the heat sink 4 .

[0162] Thereafter, the nut 54 is fixed to a position of the stud 53 close to the second end, wherein the second elastic member 55 is compressed between the heat sink 4 and the nut 54 .

[0163] In an embodiment of the present application, a single board manufactured by the above method includes a reinforcing frame, which is located on the surface of the PCB assembly and surrounds the bare chip therein. The reinforcing frame can enhance the stiffness of the PCB assembly at the corresponding bare chip, thereby reducing the deformation of the PCB assembly at the bare chip and improving the connection reliability between the bare chip and the PCB assembly.

[0164] Moreover, the reinforcing frame and the PCB assembly are fixedly connected, and the heat sink and the reinforcing frame are fixedly connected. Compared with the reinforcing frame and the PCB assembly being fixedly connected and the heat sink and the PCB assembly being fixedly connected, it is obvious that the number of vias on the PCB assembly can be reduced. Once the number of vias on the PCB assembly is reduced, it will be beneficial to the wiring of the PCB assembly and the installation of components, and high-density wiring can be achieved on the surface of PCB11.

[0165] The present application also provides an electronic device, which can be any device including a bare chip, for example, a communication device, a server device, etc. The electronic device includes the single board described above.

[0166] As described above, the single board includes a reinforcing frame, which is located on the surface of the PCB assembly and surrounds the bare chip. The reinforcing frame can enhance the stiffness of the PCB assembly at the corresponding bare chip, thereby reducing the deformation of the PCB assembly at the bare chip and improving the connection reliability between the bare chip and the PCB assembly.

[0167] Moreover, the reinforcing frame and the PCB assembly are fixedly connected, and the heat sink for dissipating heat from the bare chip and the reinforcing frame are fixedly connected. Compared with the fixed connection between the reinforcing frame and the PCB assembly and the fixed connection between the heat sink and the PCB assembly, the number of vias on the PCB assembly can obviously be reduced. Once the number of vias on the PCB assembly is reduced, it will be beneficial to the wiring of the PCB assembly and the installation of components, and high-density wiring can be achieved on the surface of PCB11.

[0168] The above description is only an embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A single board, It is characterized in that The single board comprises a printed circuit board (PCB) assembly (1), a plurality of bare chips (2), a reinforcement frame (3), a plurality of heat sinks (4) and a fixing member (5); the PCB assembly (1) comprises a PCB (11) and a handle bar; The bare chip (2) and the reinforcing frame (3) are both located on the surface of the PCB (11); the reinforcing frame (3) is in a grid shape and includes a plurality of grids (30); each bare chip (2) is located in one of the grids (30); the reinforcing frame (3) is bonded to the PCB (11); or the reinforcing frame (3) is made of metal, an insulating layer is provided between the reinforcing frame (3) and the PCB (11); the reinforcing frame (3) is bonded to the insulating layer, and the insulating layer is bonded to the PCB (11); A side of the handle bar close to the PCB (11) has a column (121); The plurality of heat sinks (4) are located on a surface of the bare chip (2) away from the PCB (11), and the plurality of heat sinks (4) are all fixed to the reinforcement frame (3); The fixing member (5) comprises a stud (53), a nut (54) and a second elastic member (55); the outer wall of the stud (53) has a boss (531); the first end of the stud (53) passes through the reinforcing frame (3) and is fixed in the column (121) of the handle bar, and the boss (531) is located on a surface of the reinforcing frame (3) away from the PCB (11); the second end of the stud (53) passes through the heat sink (4), and the nut (54) is fixed at a position close to the second end of the stud (53); The second elastic member (55) comprises a telescopic member (551) and a shell (552), the shell (552) comprising a first shell (554) and a second shell (555), the inner wall of the bottom of the first shell (554) being threadedly connected to the outer wall of the top of the second shell (555), and the first shell (554) and the second shell are located above the boss (531), the inner wall of the first shell (554) has a protrusion (553), the outer wall of the nut (54) has a groove (541), and the height of the groove (541) is greater than the thickness of the protrusion (553), the protrusion (553) is located in the groove (541), the telescopic member (551) is located in the first shell (554) and the second shell (555), and is compressed between the bottom of the second shell (555) and the bottom of the nut (54).

2. A method for manufacturing a single board, It is characterized in that The method is applied to the single board according to claim 1, and the method comprises: Soldering the bare chip (2) to the surface of the PCB (11); Placing a reinforcement frame (3) on the surface of the PCB (11), with the reinforcement frame (3) surrounding the bare chips (2), and each bare chip (2) being located in one of the grids (30); Placing a heat sink (4) on a surface of the bare chip (2) away from the PCB (11); The first end of the stud (53) is passed through the reinforcing frame (3) and fixed in the column (121) in the handle bar, wherein the boss (531) is located on the surface of the reinforcing frame (3) away from the PCB (11), and the second end of the stud (53) passes through the heat sink (4), and the nut (54) is fixed at a position close to the second end of the stud (53), wherein the second elastic member (55) is compressed between the heat sink (4) and the nut (54).

3. An electronic device, It is characterized in that The electronic device comprises the single board according to claim 1.

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