Wiring sheet and sheet heater

Abstract

The present invention provides a wiring sheet comprising a sheet-like structure (2) formed by a plurality of conductive wires (21) spaced apart, a pair of electrodes (4), and a first power supply section (51) and a second power supply section (52) respectively disposed on the electrodes (4). The number of conductive wires (21) is set to N, and the resistance value of the nth conductive wire (21) counted from the first power supply section (51) and the second power supply section (52) is set to r. n When the resistance value of electrode (4) is set to R, all conditions shown in the following mathematical formulas (F1), (F2), and (F3) are satisfied. r1 / R≤300···(F1); r n+1 ≤r n ...(F2) (In the above mathematical expression (F2), n is an integer greater than or equal to 1); 0 < r1 - r N ···(F3).

Description

TECHNICAL FIELD

[0001] The present application relates to a wiring sheet and a sheet-shaped heater. BACKGROUND

[0002] A sheet-shaped conductive member (hereinafter also referred to as "conductive sheet") having a sheet-like structure in which a plurality of conductive linear bodies are arranged at intervals has the possibility of being used as a member of various articles such as a heating element for a heating device, a heat-generating textile material, a protective film (shatterproof film) for a display, and the like.

[0003] As a sheet for use as a heating element, for example, a conductive sheet having a sheet-like structure in which a plurality of linear bodies extending in one direction are arranged at intervals is described in Patent Literature 1. In addition, by providing a pair of electrodes at both ends of the plurality of linear bodies, a wiring sheet that can be used as a heating element can be obtained.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: International Publication No. 2017 / 086395 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] As electrodes used for a wiring sheet, a metal foil or a silver paste is generally used. However, from the viewpoint of flexibility of the electrode portion of the wiring sheet, a technique of using a metal wire or the like instead of a metal foil or a silver paste has been investigated. On the other hand, in the case where a fine electrode such as a metal wire is used as an electrode, the resistance value of the electrode becomes relatively large. Therefore, the resistance value of the electrode, which should originally be negligible, becomes non-negligible. As a result, it is known that, when a current flows through the wiring sheet to heat it, temperature unevenness sometimes occurs.

[0009] An object of the present application is to provide a wiring sheet and a sheet-shaped heater capable of suppressing temperature unevenness.

[0010] METHOD FOR SOLVING PROBLEMS

[0011] A wiring sheet of one embodiment of the present application includes a sheet-like structure in which a plurality of conductive linear bodies are arranged at intervals, a pair of electrodes, and a first power supply portion and a second power supply portion provided to the electrodes, respectively, the number of the conductive linear bodies is N, the resistance value of the nth conductive linear body counted from the side of the first power supply portion and the second power supply portion is r n , the resistance value of the electrodes is R, and all of the following conditions expressed by the following mathematical expression (F1), the following mathematical expression (F2), and the following mathematical expression (F3) are satisfied.

[0012] r1 / R ≤ 300... (F1)

[0013] r n+1 ≤ r n ... (F2)

[0014] (In the above mathematical expression (F2), n is an integer of 1 or more.)

[0015] 0 < r1-r N ... (F3)

[0016] In the wiring sheet of one embodiment of the present application, it is preferable to satisfy the condition indicated by the following mathematical expression (F3-1).

[0017] r1-r N ≤ NR... (F3-1)

[0018] In the wiring sheet of one embodiment of the present application, it is preferable that the interval between the conductive linear bodies be 20 mm or less.

[0019] In the wiring sheet of one embodiment of the present application, it is preferable that the width of the electrode be 100 mm or less when the pseudo sheet-like structure is viewed in plan view.

[0020] In the wiring sheet of one embodiment of the present application, it is preferable to further include a substrate that supports the pseudo sheet-like structure.

[0021] The sheet-like heater of one embodiment of the present application includes the wiring sheet of one embodiment of the present application.

[0022] According to the present application, a wiring sheet and a sheet-like heater that can suppress temperature unevenness can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a schematic view of a wiring sheet of a first embodiment of the present application.

[0024] Figure 2 is a cross-sectional view of a II-II cross section of Figure 1 .

[0025] Figure 3 is a schematic view of a wiring sheet of a second embodiment of the present application.

[0026] Figure 4 is a cross-sectional view of a IV-IV cross section of Figure 3 .

[0027] Figure 5 is a schematic view of a wiring sheet of a third embodiment of the present application.

[0028] Figure 6This is a photograph showing the measurement results of the temperature distribution of the wiring sheet obtained in Example 1.

[0029] Figure 7 This is a photograph showing the measurement results of the temperature distribution of the wiring sheet obtained in Comparative Example 1.

[0030] Figure 8 This is a coordinate graph showing the relationship between the temperature of the wire and the wire number in the measurement of the temperature distribution of the wiring sheet obtained in Example 1 and Comparative Example 1.

[0031] Symbol Explanation

[0032] 1···Substrate

[0033] 2, 2A, 2B...simulated sheet-like structures

[0034] 21··· Conductive linear body

[0035] 3··· Resin layer

[0036] 4···Electrode

[0037] 51···First Power Supply Department

[0038] 52···Second Power Supply Department

[0039] 100, 100A, 100B... wiring sheets Detailed Implementation

[0040] [First Implementation Method]

[0041] The present invention will now be described with reference to the accompanying drawings, using examples of embodiments. However, the present invention is not limited to the embodiments described herein. It should be noted that some parts in the accompanying drawings are enlarged or reduced for ease of explanation.

[0042] (Wirework Piece)

[0043] like Figure 1 and Figure 2 As shown, the wiring sheet 100 of this embodiment includes: a substrate 1, a sheet-like structure 2, a resin layer 3, and a pair of electrodes 4. Specifically, in the wiring sheet 100, a resin layer 3 is stacked on the substrate 1, and a sheet-like structure 2 is stacked on the resin layer 3. A plurality of conductive wires 21 of the sheet-like structure 2 are arranged at intervals. Among them, a first power supply section 51 is provided on one side of the electrode 4, and a second power supply section 52 is provided on the other side of the electrode 4.

[0044] In this embodiment, the number of conductive wires 21 is set to N, and the resistance value of the nth conductive wire 21 counted from the first power supply section 51 and the second power supply section 52 side is set to r. n[Ω], and the resistance value of the electrode 4 is set to R [Ω], all of the conditions shown in mathematical expression (F1), mathematical expression (F2), and mathematical expression (F3) described below need to be satisfied.

[0045] Here, the "n-th conductive linear member counted from the first power supply portion 51 and the second power supply portion 52" means the conductive linear member 21 that is electrically connected to the pair of electrodes 4, and is the n-th conductive linear member 21 counted along the wiring of the wiring sheet 100 from the first power supply portion 51 and the second power supply portion 52.

[0046] In the present embodiment, the condition shown in the following mathematical expression (F1) needs to be satisfied.

[0047] r1 / R ≤ 300...(F1)

[0048] In the case where the value of r1 / R exceeds 300, the resistance value of the conductive linear member 21 as the heat generating portion is sufficiently larger than the resistance value of the electrode 4. Therefore, for the wiring sheet 100, the resistance value of the electrode 4 can be substantially ignored, and the problem of temperature unevenness is hardly likely to occur.

[0049] On the contrary, as the value of r1 / R becomes smaller, the problem of temperature unevenness is likely to occur, and therefore, the significance of using the wiring sheet 100 of the present embodiment increases.

[0050] The value of r1 / R can be 200 or less, or 100 or less. However, if the value of r1 / R is too small, the electrode 4 also generates heat, and therefore, the value of r1 / R is preferably 10 or more.

[0051] In the present embodiment, the condition shown in the following mathematical expression (F2) needs to be satisfied.

[0052] r n+1 ≤ r n ...(F2)

[0053] In the case where the condition shown in mathematical expression (F2) is not satisfied, temperature unevenness cannot be suppressed.

[0054] In mathematical expression (F2), n is an integer of 1 or more. In addition, the upper limit of n is the number N of the conductive linear members 21.

[0055] The number N of the conductive linear members 21 is preferably 3 or more, more preferably 5 or more, and further preferably 10 or more. The more the number of the conductive linear members 21, the more the tendency to cause temperature unevenness, but even in the case where the number of the conductive linear members 21 is large, temperature unevenness can be suppressed by the wiring sheet 100 according to the present embodiment. In addition, the upper limit of the number N of the conductive linear members 21 is not particularly limited, and is, for example, 150.

[0056] In the present embodiment, the condition shown in the following mathematical expression (F3) needs to be satisfied.

[0057] 0 < r1-r N (F3)

[0058] In a case where the condition shown in the mathematical expression (F3) is not satisfied, temperature unevenness cannot be suppressed.

[0059] In addition, from the viewpoint of further suppressing temperature unevenness, it is preferable that the condition shown in the following mathematical expression (F3-1) be satisfied.

[0060] r1-r N ≤ NR (F3-1)

[0061] That is, as long as the value of r1-r N is below the value obtained by multiplying the number N of the electrically conductive linear bodies 21 by the resistance value R of the electrode 4, temperature unevenness can be further suppressed. In addition, based on the same viewpoint, the value of r1-r N is more preferably NR / 8 or more and NR or less, further preferably NR / 4 or more and NR or less, and particularly preferably NR / 2 or more and NR or less.

[0062] The present inventors and others have conjectured the following reasons why temperature unevenness can be suppressed when all the conditions shown in the mathematical expression (F1), the mathematical expression (F2), and the mathematical expression (F3) are satisfied.

[0063] That is, in a case where the condition of the mathematical expression (F1) is satisfied, the ratio of the resistance value of the electrically conductive linear body 21, which is a heat generating portion, to the resistance value of the electrode 4 becomes small, so that the resistance value of the electrode 4, which should originally be negligible, becomes non-negligible. As a result, when a current flows through the wiring sheet 100 to heat it, temperature unevenness sometimes occurs. The reason is that, for the electrically conductive linear body 21 located far from the first power supply portion 51 and the second power supply portion 52, the influence of the resistance of the electrode 4 to that electrically conductive linear body 21 becomes large. Therefore, the present inventors and others have conjectured that, when a current flows through the wiring sheet 100 to heat it, the current flowing through that electrically conductive linear body 21 becomes relatively small, and the temperature becomes low compared to other electrically conductive linear bodies 21.

[0064] On the contrary, in a case where the conditions shown in the mathematical expression (F2) and the mathematical expression (F3) are satisfied, the farther away from the first power supply portion 51 and the second power supply portion 52, the lower the resistance value r n of the nth electrically conductive linear body 21. Therefore, for the electrically conductive linear body 21 located far from the first power supply portion 51 and the second power supply portion 52, although the influence of the resistance of the electrode 4 to that electrically conductive linear body 21 becomes large, the resistance value r nThe inventors hypothesize that this reduction can offset the temperature fluctuations.

[0065] The resistance values ​​of the conductive linear body 21 and the electrode 4 can be set by appropriate known methods, for example, by changing the material, cross-sectional area and length.

[0066] For example, such as Figure 1 As shown, if the length of the conductive wire 21 is set to be shorter the further away from the first power supply section 51 and the second power supply section 52, then the resistance value of the conductive wire 21 can be reduced the further away from the first power supply section 51 and the second power supply section 52 it is. In addition, the resistance value can be reduced by increasing the conductivity of the conductive wire 21 or increasing the cross-sectional area.

[0067] (Substrate)

[0068] Examples of substrate 1 include synthetic resin films, paper, metal foil, nonwoven fabrics, cloth, and glass films. This substrate 1 can be used to directly or indirectly support the sheet-like structure 2. Furthermore, substrate 1 is preferably a flexible substrate.

[0069] As a flexible substrate, synthetic resin films, paper, nonwoven fabrics, and cloths can be used. Among these flexible substrates, synthetic resin films, nonwoven fabrics, or cloths are preferred, and nonwoven fabrics or cloths are more preferred.

[0070] Examples of synthetic resin films include: polyethylene films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene vinyl acetate copolymer films, ionomer resin films, ethylene-(meth)acrylate copolymer films, ethylene-(meth)acrylate copolymer films, polystyrene films, polycarbonate films, and polyimide films. Furthermore, cross-linked films and laminated films can be cited as flexible substrates.

[0071] In addition, examples of paper include: fully spunbond paper, recycled paper, and kraft paper. Examples of nonwoven fabrics include: spunbond nonwoven fabric, needle-punched nonwoven fabric, meltblown nonwoven fabric, and spunlace nonwoven fabric. Examples of fabrics include: woven fabrics and knitted fabrics. Paper, nonwoven fabrics, and fabrics as flexible substrates are not limited to these.

[0072] (Similar to a sheet-like structure)

[0073] The pseudo-sheet-like structure 2 is formed in a structure in which a plurality of the conductive linear bodies 21 are arranged at intervals from each other. That is, the pseudo-sheet-like structure 2 is a structure in which a plurality of the conductive linear bodies 21 are arranged at intervals from each other in a manner of constituting a plane or a curved surface. When the wiring sheet 100 is viewed from above, the conductive linear bodies 21 are in a straight line shape. In addition, the pseudo-sheet-like structure 2 is formed in a structure in which a plurality of the conductive linear bodies 21 are arranged in a direction intersecting with the axial direction of the conductive linear bodies 21.

[0074] Note that, when the wiring sheet 100 is viewed from above, the conductive linear bodies 21 can also be in a wave shape. As the wave shape, specifically, the conductive linear bodies 21 can be, for example, a sine wave, a circular wave, a rectangular wave, a triangular wave, and a sawtooth wave, or the like. The pseudo-sheet-like structure 2 only needs to have such a structure, and when the wiring sheet 100 is stretched in the axial direction of the conductive linear bodies 21, the disconnection of the conductive linear bodies 21 can be suppressed.

[0075] The volume resistivity of the conductive linear bodies 21 is preferably 1.0 x 10 -9 Ω·m or more and 1.0 x 10 -3 Ω·m or less, and more preferably 1.0 x 10 -8 Ω·m or more and 1.0 x 10 -4 Ω·m or less. When the volume resistivity of the conductive linear bodies 21 is set to the above range, the surface resistance of the pseudo-sheet-like structure 2 can be easily reduced.

[0076] The volume resistivity of the conductive linear bodies 21 is measured as follows. The end portion on one side of the conductive linear bodies 21 and the portion 40 mm away from the end portion are coated with silver paste, the resistance of the end portion and the portion 40 mm away from the end portion is measured, and the resistance value of the conductive linear bodies 21 is calculated. Then, the cross-sectional area (unit: m 2 ) of the conductive linear bodies 21 is multiplied by the above resistance value, and the obtained value is divided by the above measured length (0.04 m), and the volume resistivity of the conductive linear bodies 21 is calculated.

[0077] The shape of the cross section of the conductive linear bodies 21 is not particularly limited, and can be a polygonal shape, a flat shape, an elliptical shape, or a circular shape, or the like, but from the viewpoint of matching with the resin layer 3 and the like, an elliptical shape or a circular shape is preferable.

[0078] In the case where the cross section of the conductive linear bodies 21 is a circular shape, the thickness (diameter) D (refer to FIG. 2) of the conductive linear bodies 21 is preferably 0.1 mm or more and 1.0 mm or less. Figure 2) is preferably 5 μm or more and 3 mm or less. From the viewpoint of suppressing an increase in the resistance of the sheet and improving the heat generation efficiency and the insulation breakdown resistance when the wiring sheet 100 is used as a heat generation body, the diameter D of the conductive linear bodies 21 is more preferably 8 μm or more and 1 mm or less, and further preferably 12 μm or more and 100 μm or less.

[0079] In the case where the cross section of the conductive linear bodies 21 is an elliptical shape, the major axis is preferably in the same range as the diameter D described above.

[0080] The diameter D of the conductive linear bodies 21 was measured at five randomly selected sites of the conductive linear bodies 21 of the sheet-like structure 2 using a digital microscope, and the average value was taken.

[0081] The interval L of the conductive linear bodies 21 (see FIG. 2) is preferably 20 mm or less, more preferably 0.5 mm or more and 15 mm or less, and further preferably 1 mm or more and 10 mm or less. Figure 2

[0082] When the interval of the conductive linear bodies 21 from each other is in the above range, the conductive linear bodies are densely arranged to some extent, and thus the functions of the wiring sheet 100, such as keeping the resistance of the sheet-like structure low, making the distribution of the temperature rise when the wiring sheet 100 is used as a heat generation body uniform, and the like, can be improved.

[0083] The interval L of the conductive linear bodies 21 was measured by visually observing or using a digital microscope to observe the conductive linear bodies 21 of the sheet-like structure 2, and measuring the interval of two adjacent conductive linear bodies 21.

[0084] Note that the interval of two adjacent conductive linear bodies 21 refers to the length in the direction in which the conductive linear bodies 21 are arranged, and is the length between the opposing portions of the two conductive linear bodies 21 (see FIG. 2). Figure 2

[0085] The conductive linear bodies 21 are not particularly limited, and can be linear bodies containing metal wires (hereinafter also referred to as "metal wire linear bodies"). Metal wires have high thermal conductivity, high electrical conductivity, high processability, and versatility, and thus, when metal wire linear bodies are used as the conductive linear bodies 21, the light transmittance can be improved while reducing the resistance value of the sheet-like structure 2. In addition, when the wiring sheet 100 (sheet-like structure 2) is used as a heat generation body, rapid heat generation is easily achieved. In addition, as described above, fine linear bodies are easily obtained.

[0086] ​​Note that as the conductive linear member 21, in addition to the metal wire linear member, a linear member including a carbon nanotube, and a linear member in which a wire is covered with a conductive material can be exemplified.

[0087] The metal wire linear member can be a linear member formed of one metal wire, or a linear member twisted from a plurality of metal wires.

[0088] As the metal wire, a metal wire including copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, or the like, or a metal wire including an alloy containing two or more kinds of metals (for example, stainless steel, carbon steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron-nickel, nickel-chromium alloy, nickel-titanium, constantan, hastelloy, and tungsten-rhenium) can be exemplified. In addition, the metal wire can be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder, or the like, or can be covered with a carbon material or a polymer as described later. From the viewpoint of producing a conductive linear member 21 having a low volume resistivity, a wire including one or more kinds of metals selected from tungsten and molybdenum and alloys containing them is particularly preferable.

[0089] As the metal wire, a metal wire covered with a carbon material can be exemplified. When the metal wire is covered with a carbon material, the metallic luster is reduced, and the presence of the metal wire is less likely to be seen. In addition, when the metal wire is covered with a carbon material, metal corrosion can also be suppressed.

[0090] As the carbon material covering the metal wire, amorphous carbon (for example, carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber), graphite, fullerene, graphene, and carbon nanotube, or the like can be exemplified.

[0091] The linear body including carbon nanotubes can be obtained, for example, by pulling out carbon nanotubes in a sheet shape from the end portion of a carbon nanotube forest (a growth body in which a plurality of carbon nanotubes are grown on a substrate in a manner of being oriented in a direction perpendicular to the substrate, and is sometimes referred to as "array"), bundling the pulled-out carbon nanotube sheet, and twisting the bundle of carbon nanotubes. In such a manufacturing method, a tape-shaped carbon nanotube linear body can be obtained without twisting at the time of twisting, and a thread-shaped linear body can be obtained with twisting. The tape-shaped carbon nanotube linear body is a linear body that does not have a structure in which carbon nanotubes are twisted. Furthermore, a carbon nanotube linear body can also be obtained by spinning or the like from a dispersion liquid of carbon nanotubes. The manufacturing of a carbon nanotube linear body based on spinning can be performed, for example, by the method disclosed in U.S. Patent Application Publication No. 2013 / 0251619 (Japanese Patent Application Publication No. 2012-126635). From the viewpoint of obtaining uniformity in the diameter of the carbon nanotube linear body, it is desirable to use a thread-shaped carbon nanotube linear body, and from the viewpoint of obtaining a carbon nanotube linear body with high purity, it is preferable to obtain a thread-shaped carbon nanotube linear body by twisting a carbon nanotube sheet. The carbon nanotube linear body can also be a linear body in which two or more carbon nanotube linear bodies are braided with each other. In addition, the carbon nanotube linear body can be a linear body in which carbon nanotubes are compounded with other conductive materials (hereinafter also referred to as "composite linear body").

[0092] As the composite linear body, for example, the following can be listed: (1) a composite linear body obtained by pulling out carbon nanotubes in a sheet shape from the end portion of a carbon nanotube forest, bundling the pulled-out carbon nanotube sheet, and twisting the bundle of carbon nanotubes, in which a metal element or a metal alloy is loaded on the surface of the forest, sheet, bundle, or twisted linear body of carbon nanotubes by evaporation, ion plating, sputtering, wet plating, or the like during the process; (2) a composite linear body obtained by twisting a bundle of carbon nanotubes together with a linear body of a metal element, a linear body of a metal alloy, or a composite linear body; (3) a composite linear body obtained by braiding a linear body of a metal element, a linear body of a metal alloy, or a composite linear body with a carbon nanotube linear body or a composite linear body; and the like. Note that, for the composite linear body of (2), the metal can be loaded on the carbon nanotubes in the same manner as the composite linear body of (1) at the time of twisting the bundle of carbon nanotubes. In addition, the composite linear body of (3) is a composite linear body at the time of braiding two linear bodies, but as long as it includes at least one linear body of a metal element, a linear body of a metal alloy, or a composite linear body, three or more carbon nanotube linear bodies, linear bodies of metal elements, linear bodies of metal alloys, or composite linear bodies can also be braided together.

[0093] As the metal of the composite linear body, metal elements such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, and alloys containing at least one of these metal elements (copper-nickel-phosphorus alloy, copper-iron-phosphorus-zinc alloy, and the like) can be given.

[0094] The conductive linear body 21 can be a linear body obtained by applying conductive coating to a filament. As the filament, a filament spun from a resin such as nylon or polyester can be given. As the conductive coating, a film of a metal, a conductive polymer, a carbon material, or the like can be given. The conductive coating can be formed by plating or vapor deposition, or the like. The linear body obtained by applying conductive coating to a filament can increase the conductivity of the linear body while maintaining the flexibility of the filament. That is, the resistance of the patch-like structure 2 can be easily reduced.

[0095] (resin layer)

[0096] The resin layer 3 is a layer containing a resin. By the resin layer 3, the patch-like structure 2 can be directly or indirectly supported. In addition, the resin layer 3 is preferably a layer containing an adhesive. When the patch-like structure 2 is formed on the resin layer 3, the adhesion of the conductive linear body 21 to the resin layer 3 can be facilitated by the adhesive.

[0097] The resin layer 3 can be a layer formed of a dryable or curable resin. Thereby, the resin layer 3 can be imparted with a hardness sufficient to protect the patch-like structure 2, and the resin layer 3 also functions as a protective film. In addition, the resin layer 3 after curing or drying has impact resistance, and can also suppress deformation of the wiring sheet caused by impact.

[0098] From the viewpoint that curing can be performed simply in a short time, the resin layer 3 is preferably energy ray-curable, such as ultraviolet rays, visible energy rays, infrared rays, electron beams, or the like. Note that "energy ray-curing" also includes thermal curing based on heating using energy rays.

[0099] The adhesive of the resin layer 3 can be a heat-curable adhesive that is cured by heat, a so-called heat-seal type adhesive that is adhered by heat, an adhesive that exhibits adhesion by wetting, or the like. Among these, the resin layer 3 is preferably energy ray-curable from the viewpoint of ease of use. As the energy ray-curable resin, a compound having at least one polymerizable double bond in the molecule, preferably an acrylate compound having a (meth)acryloyl group, can be given.

[0100] As the above-mentioned acrylate compound, for example, a (meth)acrylate containing a chain aliphatic skeleton (trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate, etc.), a (meth)acrylate containing a cyclic aliphatic skeleton (dicyclopentyl di(meth)acrylate, and dicyclopentadiene di(meth)acrylate, etc.), a polyalkylene glycol (meth)acrylate (polyethylene glycol di(meth)acrylate, etc.), an oligoester (meth)acrylate, a urethane (meth)acrylate oligomer, an epoxy-modified (meth)acrylate, a polyether (meth)acrylate other than the above-mentioned polyalkylene glycol (meth)acrylate, and an itaconic acid oligomer, etc. can be exemplified.

[0101] The weight average molecular weight (Mw) of the energy ray-curable resin is preferably 100 to 30,000, and more preferably 300 to 10,000.

[0102] The energy ray-curable resin contained in the adhesive composition can be only one kind, or two or more kinds, and in the case of two or more kinds, the combination and the ratio thereof can be arbitrarily selected. In addition, it can be combined with the thermoplastic resin described later, and the combination and the ratio can be arbitrarily selected.

[0103] The resin layer 3 can also be an adhesive layer formed of an adhesive (pressure-sensitive adhesive). The adhesive of the adhesive layer is not particularly limited. As the adhesive, for example, an acrylic adhesive, a urethane adhesive, a rubber adhesive, a polyester adhesive, a silicone adhesive, and a polyvinyl ether adhesive can be exemplified. Among them, the adhesive is preferably at least one selected from the group consisting of an acrylic adhesive, a urethane adhesive, and a rubber adhesive, and more preferably an acrylic adhesive.

[0104] As the acrylic adhesive, for example, a polymer containing a structural unit derived from an alkyl (meth)acrylate having a linear alkyl group or a branched alkyl group (i.e., a polymer obtained by polymerizing at least an alkyl (meth)acrylate), and an acrylic polymer containing a structural unit derived from a (meth)acrylate having a cyclic structure (i.e., a polymer obtained by polymerizing at least a (meth)acrylate having a cyclic structure) can be exemplified. Here, "(meth)acrylate" is a term used to indicate both "acrylate" and "methacrylate", and the same treatment is applied to other similar terms.

[0105] When the acrylic polymer is a copolymer, there is no particular limitation on the copolymerization method. The acrylic copolymer can be any of the following: block copolymer, random copolymer, or graft copolymer.

[0106] When the acrylic polymer is a copolymer, there is no particular limitation on the copolymerization method. The acrylic copolymer can be any of the following: block copolymer, random copolymer, or graft copolymer.

[0107] Acrylic copolymers can also be crosslinked using crosslinking agents. Examples of crosslinking agents include known epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, and metal chelate crosslinking agents. When crosslinking acrylic copolymers, functional groups derived from the monomer components of the acrylic polymer can be introduced into the acrylic copolymer, such as hydroxyl or carboxyl groups that react with these crosslinking agents.

[0108] When resin layer 3 is formed by an adhesive, resin layer 3 may contain the aforementioned energy-curable resin in addition to the adhesive. Furthermore, when using an acrylic adhesive as the adhesive, a compound having both functional groups that react with functional groups from the monomer components of the acrylic copolymer and energy-curable functional groups in one molecule can be used as the energy-curable component. Through the reaction of the functional groups of this compound with the functional groups from the monomer components of the acrylic copolymer, the side chains of the acrylic copolymer can be polymerized by irradiation with energy rays. When the adhesive is not an acrylic adhesive, a component with energy-curable side chains can also be used as the polymer component other than an acrylic polymer.

[0109] The thermosetting resin used for resin layer 3 is not particularly limited, but may include epoxy resin, phenolic resin, melamine resin, urea-formaldehyde resin, polyester resin, urethane resin, acrylic resin, and benzo[a]benzene resin. Azide resins, phenoxy resins, amine compounds, and acid anhydride compounds, etc. These can be used individually or in combination of two or more. From the viewpoint of suitability for curing with imidazole-based curing catalysts, epoxy resins, phenolic resins, melamine resins, urea-formaldehyde resins, amine compounds, and acid anhydride compounds are preferred. In particular, from the viewpoint of exhibiting excellent curability, epoxy resins, phenolic resins, mixtures thereof, or mixtures of epoxy resins with at least one selected from phenolic resins, melamine resins, urea-formaldehyde resins, amine compounds, and acid anhydride compounds are preferred.

[0110] As the moisture-curable resin for the resin layer 3, there is no particular limitation, and urethane resins, modified silicone resins, and the like, which generate isocyanate groups by moisture, can be cited as resins.

[0111] In the case of using an energy ray-curable resin or a thermosetting resin, a photopolymerization initiator or a thermal polymerization initiator, or the like is preferably used. By using a photopolymerization initiator or a thermal polymerization initiator, or the like, a crosslinked structure can be formed, and the sheet-like structure 2 can be more firmly protected.

[0112] As the photopolymerization initiator, benzophenone, phenylethanone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl ester, benzoin dimethyl ether, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, and bis(2,4,6-trimethylbenzoyl) phenyl phosphine oxide, and the like can be cited.

[0113] As the thermal polymerization initiator, hydrogen peroxide, peroxodisulfate (ammonium peroxodisulfate, sodium peroxodisulfate, potassium peroxodisulfate, and the like), azo compounds (2,2'-azobis(2-imidazolinium) dihydrochloride, 4,4'-azobis(4-cyanopentanoic acid), 2,2'-azobisisobutyronitrile, and 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), and the like), and organic peroxides (benzoyl peroxide, lauroyl peroxide, peroxyacetic acid, peroxy succinic acid, di-tert-butyl peroxide, tert-butyl hydroperoxide, cumene hydroperoxide, and the like) can be cited.

[0114] These polymerization initiators can be used alone or in combination with two or more.

[0115] In the case of using these polymerization initiators to form a crosslinked structure, the amount thereof is preferably 0.1 parts by mass or more and 100 parts by mass or less, more preferably 1 part by mass or more and 100 parts by mass or less, and particularly preferably 1 part by mass or more and 10 parts by mass or less, with respect to 100 parts by mass of the energy ray-curable resin or the thermosetting resin.

[0116] The resin layer 3 can also not be curable, but can be a layer formed of, for example, a thermoplastic resin composition. Furthermore, by containing a solvent in the thermoplastic resin composition, the thermoplastic resin layer can be softened. Thus, when the sheet-like structure 2 is formed on the resin layer 3, it becomes easy to adhere the electrically conductive linear body 21 to the resin layer 3. On the other hand, by volatilizing the solvent in the thermoplastic resin composition, the thermoplastic resin can be dried and solidified.

[0117] As the thermoplastic resin, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyethersulfone, polyimide, and acrylic resin, etc. can be exemplified.

[0118] As the solvent, alcoholic solvents, ketonic solvents, ester solvents, ether solvents, hydrocarbon solvents, halogenated alkyl solvents, and water, etc. can be exemplified.

[0119] The resin layer 3 can also contain an inorganic filler. By containing an inorganic filler, the hardness of the resin layer 3 after curing can be further increased. Also, the thermal conductivity of the resin layer 3 can be increased.

[0120] As the inorganic filler, for example, inorganic powder (powder of, for example, silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride), beads obtained by spheroidizing inorganic powder, single crystal fiber, and glass fiber, etc. can be exemplified. Among these, as the inorganic filler, silica filler and alumina filler are preferable. The inorganic filler can be used singly in one kind, or two or more kinds in combination.

[0121] Other components can also be contained in the resin layer 3. As the other components, for example, known additives such as organic solvent, flame retardant, tackifier, ultraviolet absorber, antioxidant, antiseptic, antimold agent, plasticizer, defoaming agent, and wetness adjuster, etc. can be exemplified.

[0122] The thickness of the resin layer 3 can be appropriately determined according to the use of the wiring sheet 100. For example, from the viewpoint of adhesiveness, the thickness of the resin layer 3 is preferably 3 μm or more and 150 μm or less, and more preferably 5 μm or more and 100 μm or less.

[0123] (Electrode)

[0124] The electrode 4 is used to supply current to the conductive linear member 21. The electrode 4 can be formed using known electrode materials. As the electrode material, conductive paste (silver paste, etc.), metal foil (copper foil, etc.), and metal wire, etc. can be exemplified. The electrode 4 is disposed in electrical connection with both end portions of the conductive linear member 21. In the case where the electrode material is a metal wire, the metal wire can also be one, but is preferably two or more.

[0125] As the metal of the metal foil or the metal wire, there can be mentioned copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and the like, or an alloy containing two or more of these metals (for example, stainless steel, carbon steel, and the like, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron-nickel, nickel-chromium alloy, nickel-titanium, constantan, hastelloy, and the like, and tungsten-rhenium). In addition, the metal foil or the metal wire can be a material plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, or solder, or the like. In particular, from the viewpoint of low volume resistivity, it is preferable to contain one or more metals selected from copper and silver, and alloys containing these.

[0126] The width of the electrode 4 is preferably 100 mm or less, more preferably 10 mm or less, and further preferably 100 μm or less, when viewed in plan view of the sheet-like structure 2. The narrower the width of the electrode 4, the more likely it is to cause temperature unevenness, but even in the case where the width of the electrode 4 is narrow, the wiring sheet 100 of the present embodiment can suppress temperature unevenness. Note that, in the case where the electrode 4 is a metal wire, the width of the electrode 4 is the diameter of the metal wire.

[0127] The ratio of the resistance value of the electrode 4 to the resistance value of the sheet-like structure 2 (resistance value of the electrode 4 / resistance value of the sheet-like structure 2) is preferably 0.0001 or more and 0.3 or less, and more preferably 0.0005 or more and 0.1 or less. The ratio of the resistance value of the electrode to the resistance value of the sheet-like structure 2 can be obtained by "resistance value of the electrode 4 / resistance value of the sheet-like structure 2". By being within this range, in the case where the wiring sheet 100 is used as a heat generating body, abnormal heat generation in the electrode portion can be suppressed. In the case where the sheet-like structure 2 is used as a sheet-like heater, a sheet-like heater in which only the sheet-like structure 2 generates heat and which is excellent in heat generation efficiency can be obtained.

[0128] The resistance values of the electrode 4 and the sheet-like structure 2 can be measured using a multimeter. First, the resistance value of the electrode 4 is measured, and then the resistance value of the sheet-like structure 2 after the electrode 4 is attached thereto is measured. Then, the resistance values of the electrode 4 and the sheet-like structure 2 are calculated by subtracting the measured value of the electrode 4 from the resistance value of the sheet-like structure 2 after the electrode 4 is attached thereto.

[0129] (Power supply portion)

[0130] The first power supply portion 51 and the second power supply portion 52 are portions that apply a voltage to the wiring sheet 100. In the case where the electrode 4 is exposed and formed in a manner that enables electrical connection, any part of the electrode 4 can be used as the first power supply portion 51 or the second power supply portion 52.

[0131] In addition, in order to easily connect a power supply (not shown) to the electrode 4, the first power supply portion 51 and the second power supply portion 52 can be separately provided. In this case, as the material of the first power supply portion 51 and the second power supply portion 52, the same material as that of the electrode 4 can be used. In addition, in a case where the electrode 4 is covered with an insulating material for preventing short-circuiting and the like, a portion from which a part of the insulating material is removed can be used as the first power supply portion 51 and the second power supply portion 52.

[0132] (Method for manufacturing wiring sheet)

[0133] The method for manufacturing the wiring sheet 100 of the present embodiment is not particularly limited. The wiring sheet 100 can be manufactured, for example, by the following procedures.

[0134] First, a composition for forming the resin layer 3 is applied to the base material 1 to form a coating film. Next, the coating film is dried to produce the resin layer 3. Next, the conductive linear bodies 21 are arranged and disposed on the resin layer 3 to form the sheet-like structure 2. For example, in a state where the resin layer 3 with the base material 1 is disposed on the outer circumferential surface of a drum member, the conductive linear bodies 21 are wound in a spiral shape on the resin layer 3 while the drum member is rotated. Then, the bundle of the conductive linear bodies 21 wound in a spiral shape is cut along the axial direction of the drum member. Thus, the sheet-like structure 2 is formed and disposed on the resin layer 3. Then, the resin layer 3 with the base material 1 on which the sheet-like structure 2 is formed is removed from the drum member to obtain a sheet-like conductive member. According to this method, for example, by moving the continuous feeding portion of the conductive linear bodies 21 in a direction parallel to the axis of the drum member while the drum member is rotated, the interval L between the adjacent conductive linear bodies 21 in the sheet-like structure 2 can be easily adjusted.

[0135] Next, the electrode 4 is attached to both end portions of the conductive linear bodies 21 in the sheet-like structure 2 of the sheet-like conductive member, and then the first power supply portion 51 and the second power supply portion 52 are provided, and thus the wiring sheet 100 can be produced.

[0136] (Effects of the first embodiment)

[0137] According to the present embodiment, the following effects can be achieved.

[0138] (1) According to the present embodiment, by satisfying the conditions shown in mathematical formula (F2) and mathematical formula (F3), the farther away from the first power supply portion 51 and the second power supply portion 52, the lower the resistance value of the conductive linear bodies 21. Thus, it is possible to suppress the temperature unevenness of the wiring sheet 100.

[0139] (2) In the present embodiment, since the length of the electrically conductive linear member 21 is set to be shorter as it is farther from the first power supply portion 51 and the second power supply portion 52, the farther it is from the first power supply portion 51 and the second power supply portion 52, the lower the electric resistance value of the electrically conductive linear member 21 can be.

[0140] (3) The wiring sheet 100 of the present embodiment can suppress temperature unevenness, and thus can be suitably used as a sheet-shaped heater.

[0141] [Second Embodiment]

[0142] Next, the second embodiment of the present application will be described based on the drawings.

[0143] As Figure 3 and Figure 4 shown, the wiring sheet 100A of the present embodiment includes the base material 1, the sheet-shaped structure 2A, the resin layer 3, and the pair of electrodes 4. The plurality of electrically conductive linear members 21 of the sheet-shaped structure 2A are arranged at intervals. The first power supply portion 51 is provided to the electrode 4 on one side, and the second power supply portion 52 is provided to the electrode 4 on the other side.

[0144] Note that, in the present embodiment, the method of adjusting the electric resistance value of the electrically conductive linear member 21 is different from that of the first embodiment, and thus the method of adjusting the electric resistance value of the electrically conductive linear member 21 will be described, and the parts other than this which are common to the previous description will be omitted.

[0145] In the present embodiment, as Figure 4 shown, the thickness of the electrically conductive linear member 21 becomes thicker in the order of D1, D2, D3, and D4. That is, the thickness of the electrically conductive linear member 21 is thicker as it is farther from the first power supply portion 51 and the second power supply portion 52, and the cross-sectional area of the electrically conductive linear member 21 is also larger as it is farther from the first power supply portion 51 and the second power supply portion 52. Thus, it is possible to make the electric resistance value of the electrically conductive linear member 21 lower as it is farther from the first power supply portion 51 and the second power supply portion 52.

[0146] (Action Effects of the Second Embodiment)

[0147] According to the present embodiment, in addition to the action effects (1) and (3) in the above-described first embodiment, the following action effect (4) can also be exerted.

[0148] (4) In the present embodiment, the thickness of the conductive linear bodies 21 is made thicker as they are farther from the first power supply portion 51 and the second power supply portion 52, and thus the resistance value of the conductive linear bodies 21 can be made lower as they are farther from the first power supply portion 51 and the second power supply portion 52. In addition, since it is not necessary to change the length of the conductive linear bodies 21 as in the above-described first embodiment, the planar shape of the wiring sheet 100A can be, for example, a rectangular shape or a square shape.

[0149] [Third Embodiment]

[0150] Next, the third embodiment of the present application will be described based on the drawings.

[0151] As Figure 5 shown in the drawing, the wiring sheet 100B of the present embodiment is provided with a base material 1, two sheet-like structures 2B, a resin layer 3, and two pairs of electrodes 4. The plurality of conductive linear bodies 21 of the sheet-like structures 2B are arranged at intervals. The first power supply portion 51 is provided at one of the electrodes 4, and the second power supply portion 52 is provided at the other of the electrodes 4.

[0152] Note that the wiring sheet 100B of the present embodiment is configured in such a manner that two wiring sheets 100 of the first embodiment are arranged adjacent to each other when the wiring sheet 100 is viewed from above. As for the base material 1, the sheet-like structures 2B, the resin layer 3, and the electrodes 4, they are the same as in the first embodiment, and thus the arrangement of the two sheet-like structures 2B and the like will be described, and the portions other than these will be omitted as they are common to the previous description.

[0153] In the present embodiment, as Figure 5 shown in the drawing, two wiring structures 10 are provided, and the wiring structures 10 are provided with the sheet-like structures 2B, the pairs of electrodes 4, and the first power supply portions 51 and the second power supply portions 52. The length of the conductive linear bodies 21 is made shorter as they are farther from the first power supply portions 51 and the second power supply portions 52. Thus, the planar shape of the wiring structures 10 is a trapezoidal shape, and one side where the first power supply portions 51 and the second power supply portions 52 are present is long. In addition, for the two wiring structures 10, when the wiring sheet 100B is viewed from above, one of the wiring structures 10 and the other of the wiring structures 10 are arranged in such a manner that the positions of the first power supply portions 51 and the second power supply portions 52 are on opposite sides.

[0154] (Action Effects of the Third Embodiment)

[0155] According to the present embodiment, in addition to the action effects (1) to (3) in the above-described first embodiment, the following action effect (5) can be achieved.

[0156] (5) In the present embodiment, the two wiring structure bodies 10 whose planar shape is a trapezoid are arranged so that the lower bases of the bottom edges of the trapezoids are on opposite sides of each other when viewed from above the wiring sheet 100B. In this case, one lower base of the bottom edge of the trapezoid and the upper base of the bottom edge of the other trapezoid exist at both ends of the wiring sheet 100B. Therefore, the lengths of the wires at both ends of the wiring sheet 100B can be made substantially equal, and the planar shape of the wiring sheet 100B can be made, for example, a rectangle or a square.

[0157] [Variations of Embodiments]

[0158] The present application is not limited to the above-described embodiments, and variations, modifications, and the like made within a range capable of achieving the object of the present application are included in the scope of the present application.

[0159] For example, in the above-described embodiments, the wiring sheet 100 has the base material 1, but is not limited thereto. For example, the wiring sheet 100 can not have the base material 1. In this case, the wiring sheet 100 can be used by being attached to an adherend by the resin layer 3.

[0160] In the above-described embodiments, the wiring sheet 100 has the resin layer 3, but is not limited thereto. For example, the wiring sheet 100 can not have the resin layer 3. In this case, the wiring sheet 100 can be formed by using a knitted fabric as the base material 1 and knitting the conductive linear bodies 21 into the base material 1.

[0161] Example

[0162] Hereinafter, the present application will be described in more detail by citing examples. The present application is not limited to these examples.

[0163] [Example 1]

[0164] An adhesive sheet was produced by applying an acrylic adhesive to a polyurethane film having a thickness of 100 μm as a base material at a thickness of 20 μm to provide a resin layer.

[0165] A wire shooting device (manufactured by Linde Co., Ltd.) was used to shoot a metal wire (material: tungsten, diameter: 80 μm) having a circular cross section on the adhesive sheet while moving the nozzle, and the metal wire was arranged as a conductive linear body. Then, electrodes (width: 80 μm, material: copper) were provided at both end portions of the metal wire, and a first power supply portion and a second power supply portion (both materials: copper) were provided on the one end side of the electrodes, to obtain the wiring sheet shown in FIG. 1. Note that the length of the first metal wire was set to 200 mm, and the length of the last metal wire was set to 120 mm so that the lengths of the metal wires become shorter in order from one side, counting from the side of the first power supply portion and the second power supply portion. Figure 1

[0166] ​In the obtained wiring sheet, the number N of the metal wires was 30, the resistance value R of the electrode was 306 mΩ, and the resistance values r1 to r 29 were each 25070 mΩ. In addition, the interval between the metal wires was 10 mm. 30 In addition, the interval between the metal wires was 10 mm.

[0167] [Comparative Example 1]

[0168] A wiring sheet was produced in the same manner as in Example 1 except that the length of the metal wires was not changed and the length of all the metal wires was set to 200 mm.

[0169] In the obtained wiring sheet, the number N of the metal wires was 30, the resistance value R of the electrode was 306 mΩ, and the resistance values r1 to r 30 were each 25070 mΩ. In addition, the interval between the metal wires was 10 mm.

[0170] [Temperature Difference Evaluation of Sheet-shaped Heater]

[0171] After the sheet-shaped heater was caused to generate heat by applying a voltage of 5.0 V thereto, the temperature distribution was measured using a thermal imager ("FLIR C2" manufactured by FLIR) from a position 150 mm apart from the surface of the sheet-shaped heater. The measurement was performed with the emissivity at that time set to 0.95. The measurement results of the temperature distribution of the sheet-shaped heater obtained in Example 1 are shown in Figure 6 . In addition, the measurement results of the temperature distribution of the sheet-shaped heater obtained in Comparative Example 1 are shown in Figure 7 .

[0172] Next, the temperatures of the 30 wires were read from the obtained temperature distribution. The results are shown in Figure 8 . Further, the difference between the highest temperature and the lowest temperature in 28 wires other than each of the 1 wire at both ends in the 30 wires was taken as the temperature difference (unit: °C). The smaller the temperature difference, the more the temperature unevenness was suppressed.

[0173] The temperature difference in Example 1 was 3.7°C, and the temperature difference in Comparative Example 1 was 11.5°C. From this result, it was known that the temperature difference of the sheet-shaped heater obtained in Example 1 was smaller than that of the sheet-shaped heater obtained in Comparative Example 1, and the temperature unevenness could be suppressed.

[0174] [Confirmation of Effects]

[0175] In order to confirm that the wiring sheet capable of suppressing temperature unevenness can be obtained according to the present embodiment, analysis of the power consumption distribution was performed as described below.

[0176] In the analysis of power consumption distribution, the wiring patch of this embodiment was substituted into the ladder circuit diagram, and the power consumption distribution in the circuit was analyzed.

[0177] The number N of conductive wires 21, the resistance value r1 [mΩ] of the first conductive wire 21 counted from the side of the first power supply section 51 and the second power supply section 52, and the resistance value r of the nth conductive wire 21 counted from the side of the first power supply section 51 and the second power supply section 52. N The resistance values ​​R[mΩ] of electrode 4 are shown in Tables 1 and 2. It should be noted that r2~r N-1 The value of [mΩ] is from the value of r1 to r N The values ​​decrease gradually at the same rate of change.

[0178] Additionally, r1-r N The values ​​of [mΩ] and NR [mΩ] are also shown in Table 1 and Table 2.

[0179] Then, the power consumption of each conductive wire from the first conductive wire 21 to the Nth conductive wire 21 when current flows through the above circuit was calculated, and the power consumption distribution was analyzed. Based on the obtained power consumption distribution, the highest power consumption, the lowest power consumption, and the average power consumption were determined, and the power unevenness (unit: ±%) was calculated based on the following formula. The results for Examples 1 to 19 are shown in Table 1. The results for Examples 20 to 37 are shown in Table 2.

[0180] (Electricity imbalance) = [{(Highest electricity consumption) - (Lowest electricity consumption)} / (Average electricity consumption) / 2] × 100

[0181] It can be inferred that the smaller the electrical unevenness, the more effectively the temperature unevenness can be suppressed. The electrical unevenness was evaluated according to the following criteria. The results for Examples 1 to 19 are shown in Table 1. The results for Examples 20 to 37 are shown in Table 2.

[0182] A: The value of power unevenness is below 20 [±%].

[0183] B: The value of power unevenness exceeds 20 [±%] and is below 30 [±%].

[0184] C: The value of power unevenness exceeds 30 [±%] and is below 100 [±%].

[0185] [Table 1]

[0186]

[0187] [Table 2]

[0188]

Claims

1. A wiring sheet comprising: a sheet-like structure in which a plurality of electrically conductive linear bodies are arranged at intervals; a pair of electrodes; and a first power supply portion and a second power supply portion provided respectively to the electrodes, wherein r1 / R ≤ 300 (F1) in which r1 is a distance between the first power supply portion and the second power supply portion, and R is a distance between the electrodes, and wherein n is an integer of 1 or more in the following mathematical expression (F2): 1 ≤ n ≤ 100 (F2).

2. The wiring sheet according to claim 1, wherein the interval of the electrically conductive linear bodies is 20 mm or less.

3. The wiring sheet according to claim 1, wherein the width of the electrodes is 100 mm or less when the sheet-like structure is viewed from above.

4. The wiring sheet according to any one of claims 1 to 3, further comprising a base material that supports the sheet-like structure. The number of the conductive linear bodies is set to N, the resistance value of the nth conductive linear body counted from the first power supply part and the second power supply part side is set to r n , and the resistance value of the electrode is set to R, all conditions shown in the following mathematical expression (F1), the following mathematical expression (F2), and the following mathematical expression (F3) are satisfied, 5. A sheet heater comprising the wiring sheet according to any one of claims 1 to 4. r n+1 ≤r n ···(F2) NR / 8 ≤ r1 - r N ≤ NR · · · (F3) wherein, ​ ​ ​ ​ ​ ​ ​

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