Circuit board half-hole plate and manufacturing method thereof

Abstract

The present invention proposes a method for manufacturing a circuit board half-hole plate, comprising the following steps: providing a copper-clad substrate, the copper-clad substrate comprising an insulating layer and a first copper foil layer and a second copper foil layer respectively formed on two opposite surfaces of the insulating layer, the copper-clad substrate being provided with a through hole; filling the through hole with a photosensitive material; exposing and developing the photosensitive material to form a photosensitive pattern, the photosensitive pattern comprising an opening; cutting the circuit board along the aperture of the through hole, the through hole being cut to form a half-hole, the surface of the metal layer in the half-hole away from the wall of the half-hole being provided with a microstructure; and removing the photosensitive pattern in the half-hole, thereby obtaining the circuit board half-hole plate. The circuit board half-hole manufactured by the manufacturing method of the present invention has high reliability. The present invention also provides a circuit board half-hole plate prepared by the method.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a circuit board half-hole plate and a manufacturing method thereof. Background Art

[0002] A circuit board half-hole plate refers to a circuit board with a metallized half-hole at the edge of the board. The metallized half-hole has both the function of electrical conduction and can be fixed by welding using the half-hole wall, thereby achieving the fixation between the circuit board half-hole plate and the part to be connected (such as other circuit boards or electronic components). At present, the part to be connected is usually connected to the metal layer on the half-hole wall through a conductive paste. However, in actual use, there is a risk of disconnection between the conductive paste and the metal layer, thereby reducing the reliability of the circuit board half-hole plate. Summary of the invention

[0003] In view of this, the present invention provides a method for manufacturing a circuit board half-hole plate with higher reliability.

[0004] In addition, the present invention also provides a circuit board half-hole plate manufactured by the above manufacturing method.

[0005] A preferred embodiment of the present invention provides a method for manufacturing a half-hole circuit board, comprising the following steps:

[0006] A copper-clad substrate is provided, wherein the copper-clad substrate comprises an insulating layer and a first copper foil layer and a second copper foil layer respectively formed on two opposite surfaces of the insulating layer, wherein a through hole is provided in the copper-clad substrate;

[0007] Filling the through hole with a photosensitive material;

[0008] Exposing and developing the photosensitive material to form a photosensitive pattern, wherein the photosensitive pattern includes an opening, and the opening is located at an edge of the photosensitive pattern;

[0009] Electroplating metal on the first copper foil layer and the second copper foil layer to form a first copper plating layer and a second copper plating layer respectively, and the metal is also filled in the opening to form a metal layer;

[0010] Etching the first copper foil layer and the first copper plating layer to form a first conductive circuit layer, and etching the second copper foil layer and the second copper plating layer to form a second conductive circuit layer, to obtain a circuit substrate;

[0011] Cutting the circuit substrate along the aperture of the through hole to form a half hole after the through hole is cut, and a surface of the metal layer in the half hole away from the hole wall of the half hole is provided with a microstructure; and

[0012] The photosensitive pattern in the half hole is removed to obtain the circuit board half hole plate.

[0013] A preferred embodiment of the present invention provides a circuit board half-hole plate, comprising:

[0014] A first conductive circuit layer;

[0015] A second conductive circuit layer; and

[0016] An insulating layer, located between the first conductive circuit layer and the second conductive circuit layer;

[0017] A half hole is provided at the edge of the half-hole plate of the circuit board, a metal layer is provided in the half-hole, and a microstructure is provided on the surface of the metal layer away from the hole wall of the half-hole.

[0018] The metal layer of the present invention has a microstructure, and the microstructure increases the specific surface area of ​​the metal layer. When the conductive paste is filled in the half hole, the microstructure increases the contact area between the metal layer and the conductive paste, and increases the bonding force between the metal layer and the conductive paste, thereby reducing the risk of disconnection between the metal layer and the conductive paste, thereby improving the reliability of the half-hole board of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1A and Figure 1B They are respectively a cross-sectional view and a top view of the copper-clad substrate provided by the first embodiment of the present invention.

[0020] Figure 2A and Figure 2B Respectively in Figure 1A and Figure 1B The cross-sectional view and top view of the through hole after being filled with photosensitive material are shown.

[0021] Figure 3A and Figure 3B Respectively Figure 2A and Figure 2B The photosensitive material shown is a cross-sectional view and a top view after exposure and development.

[0022] Figure 4A and Figure 4B Respectively in Figure 3A and Figure 3B The cross-sectional view and top view of the first copper foil layer and the second copper foil layer after electroplating are shown.

[0023] Figure 5A and Figure 5B Etching Figure 4A and Figure 4B The first copper foil layer and the first copper plating layer are shown, as well as a cross-sectional view and a top view after etching the second copper foil layer and the second copper plating layer.

[0024] Fig. 6A and Figure 6B They are Figure 5A and Figure 5B The cross-sectional view and top view of the circuit substrate after cutting are shown.

[0025] Fig. 7A and Figure 7B They are Fig. 6A and Figure 6B The cross-sectional view and top view are shown after the photosensitive pattern in the half hole is removed.

[0026] Fig. 8A and Figure 8B Respectively in Fig. 7A and Figure 7B The cross-sectional view and top view of the half-hole board of the circuit board obtained after forming a first solder mask layer on the first conductive circuit layer and a second solder mask layer on the second conductive circuit layer.

[0027] Fig. 9 1 is a top view of a half-hole circuit board provided in accordance with a second embodiment of the present invention.

[0028] Fig.10 1 is a top view of a half-hole circuit board provided in accordance with a third embodiment of the present invention.

[0029] Fig.11 4 is a top view of a half-hole circuit board provided in accordance with a fourth embodiment of the present invention.

[0030] Fig.12 1 is a top view of a half-hole circuit board provided in accordance with a fifth embodiment of the present invention.

[0031] Fig.13 1 is a top view of a half-hole circuit board provided in accordance with a sixth embodiment of the present invention.

[0032] Main component symbols

[0033] Circuit board half hole plate 100, 200, 300, 400, 500, 600

[0034] Copper clad substrate 10

[0035] Insulation layer 101

[0036] The first copper foil layer 102

[0037] The second copper foil layer 103

[0038] Through hole 11

[0039] Photosensitive materials 20

[0040] Photographic Graphics 30

[0041] Opening 31

[0042] The first copper plating layer 40

[0043] The second copper plating layer 41

[0044] Metal layer 42

[0045] The first conductive circuit layer 50

[0046] The second conductive circuit layer 51

[0047] Circuit board 52

[0048] The first solder resist layer 60

[0049] Second solder resist layer 61

[0050] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0052] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0053] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose, the present invention is described in detail below in conjunction with the accompanying drawings and preferred embodiments.

[0054] The first embodiment of the present invention provides a method for manufacturing a half-hole circuit board, comprising the following steps:

[0055] Step S11, see Figure 1A and Figure 1B , providing a copper clad substrate 10.

[0056] In this embodiment, the copper clad substrate 10 includes an insulating layer 101 and a first copper foil layer 102 and a second copper foil layer 103 respectively formed on two opposite surfaces of the insulating layer 101 .

[0057] The material of the insulating layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. In this embodiment, the material of the insulating layer 101 is polyimide.

[0058] The copper clad substrate 10 is provided with a through hole 11 , and the through hole 11 sequentially penetrates the first copper foil layer 102 , the insulating layer 101 , and the second copper foil layer 103 .

[0059] Step S12, see Figure 2A and Figure 2B , a photosensitive material 20 is filled in the through hole 11 .

[0060] In some embodiments, the photosensitive material 20 is photosensitive ink. It is understood that after the photosensitive ink is filled in the through hole 11, part of the photosensitive ink needs to be dried to solidify part of the photosensitive ink. In other embodiments, the photosensitive material 20 is a dry film.

[0061] Step S13, see Figure 3A and Figure 3B , the photosensitive material 20 is exposed and developed to form a photosensitive pattern 30.

[0062] The photosensitive pattern 30 includes an opening 31 , wherein the opening 31 is located at an edge of the photosensitive pattern 30 .

[0063] Step S14, see Figure 4A and Figure 4B , electroplating metal on the first copper foil layer 102 and the second copper foil layer 103 to form a first copper plating layer 40 and a second copper plating layer 41 respectively, and the metal is also filled in the opening 31 to form a metal layer 42 .

[0064] The metal layer 42 is made of copper.

[0065] Step S15, see Figure 5A and Figure 5B , etching the first copper foil layer 102 and the first copper plating layer 40 to form a first conductive circuit layer 50 , and etching the second copper foil layer 103 and the second copper plating layer 41 to form a second conductive circuit layer 51 , to obtain a circuit substrate 52 .

[0066] The first conductive circuit layer 50 is electrically connected to the second conductive circuit layer 51 through the metal layer 42 .

[0067] Step S16, see Fig. 6A and Figure 6B The circuit substrate 52 is cut along the aperture of the through hole 11, and a half hole (not shown) is formed after the through hole 11 is cut. The surface of the metal layer 42 in the half hole away from the hole wall of the half hole is provided with a microstructure 43.

[0068] Step S17, see Fig. 7A and Figure 7B , remove the photosensitive pattern 30 in the half hole.

[0069] The surface of the metal layer 42 away from the half hole wall is a concave surface, and a microstructure 43 protruding away from the half hole wall is provided on the concave surface. The microstructure 43 includes a plurality of semicircular protrusions arranged at intervals. The microstructure 43 increases the specific surface area of ​​the metal layer 42.

[0070] Step S18, see Fig. 8A and Figure 8B , a first solder resist layer 60 is formed on the first conductive circuit layer 50 , and a second solder resist layer 61 is formed on the second conductive circuit layer 51 , thereby obtaining the circuit board half-hole plate 100 .

[0071] The first solder resist layer 60 and the second solder resist layer 61 can be made of solder resist ink, such as green ink. The first solder resist layer 60 is used to protect the first conductive circuit layer 50 , and the second solder resist layer 61 is used to protect the second conductive circuit layer 51 .

[0072] See also Fig. 9 The second embodiment of the present invention provides a method for manufacturing a circuit board half-hole plate 200. The difference between the manufacturing method of the circuit board half-hole plate 200 and the manufacturing method of the circuit board half-hole plate 100 is that: in step S14, a plurality of metal layers 42 are intermittently arranged on the wall of the half-hole, and the surface of each metal layer 42 away from the wall of the half-hole is a convex surface, and the microstructure 43 includes a plurality of serrated protrusions arranged on the convex surface and protruding away from the wall of the half-hole.

[0073] See also Fig.10The third embodiment of the present invention provides a method for manufacturing a circuit board half-hole plate 300. The difference between the manufacturing method of the circuit board half-hole plate 300 and the manufacturing method of the circuit board half-hole plate 100 is that: in step S14, the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a serrated depression arranged on the plane and recessed toward the half-hole hole wall.

[0074] See also Fig.11 The fourth embodiment of the present invention provides a method for manufacturing a circuit board half-hole plate 400. The difference between the method for manufacturing the circuit board half-hole plate 400 and the method for manufacturing the circuit board half-hole plate 100 is that in step S14, the microstructure 43 includes a plurality of triangular protrusions arranged at intervals.

[0075] See also Fig.12 The fifth embodiment of the present invention provides a method for manufacturing a circuit board half-hole plate 500. The difference between the manufacturing method of the circuit board half-hole plate 500 and the manufacturing method of the circuit board half-hole plate 100 is that: in step S14, the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a regular rectangular depression arranged on the plane and recessed toward the half-hole hole wall.

[0076] See also Fig.13 The sixth embodiment of the present invention provides a method for manufacturing a circuit board half-hole plate 600. The difference between the manufacturing method of the circuit board half-hole plate 600 and the manufacturing method of the circuit board half-hole plate 100 is that: in step S14, the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a sickle-shaped depression arranged on the plane and recessed toward the half-hole hole wall.

[0077] The manufacturing method provided by the present invention designs the photosensitive pattern 30 and controls the shape of the opening 31 in the photosensitive pattern 30, so that the metal layer 42 formed in the opening 31 has a microstructure 43, and the microstructure 43 increases the specific surface area of ​​the metal layer 42. When the conductive paste is filled in the half hole (not shown in the figure), the microstructure 43 increases the contact area between the metal layer 42 and the conductive paste, thereby increasing the bonding force between the metal layer 42 and the conductive paste, thereby reducing the risk of disconnection between the metal layer 42 and the conductive paste. When the part to be connected is subsequently connected to the conductive paste (not shown in the figure), the stability between the circuit board half-hole plate and the part to be connected can be improved, thereby improving the reliability of the circuit board half-hole plate.

[0078] See also Fig. 8A and Figure 8BThe first embodiment of the present invention further provides a circuit board half-hole plate 100, wherein the circuit board half-hole plate 100 includes an insulating layer 101, a first conductive circuit layer 50, a second conductive circuit layer 51, a first solder mask layer 60 and a second solder mask layer 61.

[0079] The material of the insulating layer 101 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), etc. In this embodiment, the material of the insulating layer 101 is polyimide.

[0080] The first conductive circuit layer 50 and the second conductive circuit layer 51 are respectively formed on two opposite surfaces of the insulating layer 101 .

[0081] The edge of the circuit board half-hole plate 100 is provided with a half-hole (not shown), and a metal layer 42 is provided in the half-hole. The metal layer 42 is used to electrically connect the first conductive circuit layer 50 and the second conductive circuit layer 51. Among them, the surface of the metal layer 42 away from the hole wall of the half-hole is provided with a microstructure 43. Specifically, the surface of the metal layer 42 away from the hole wall of the half-hole is a concave surface, and the concave surface is provided with the microstructure 43 protruding away from the hole wall of the half-hole. The microstructure 43 includes a plurality of semicircular protrusions arranged at intervals. The microstructure 43 increases the specific surface area of ​​the metal layer 42.

[0082] The first solder resist layer 60 is located on the first conductive circuit layer 50, and the second solder resist layer 61 is located on the second conductive circuit layer 51. The first solder resist layer 60 and the second solder resist layer 61 can be made of solder resist ink, such as green oil. The first solder resist layer 60 is used to protect the first conductive circuit layer 50, and the second solder resist layer 61 is used to protect the second conductive circuit layer 51.

[0083] See also Fig. 9 The second embodiment of the present invention further provides a circuit board half-hole plate 200, the difference between the circuit board half-hole plate 200 and the circuit board half-hole plate 100 is that: a plurality of metal layers 42 are intermittently arranged on the half-hole wall, and the surface of each metal layer 42 away from the half-hole wall is a convex surface, and the microstructure 43 includes a plurality of serrated protrusions arranged on the convex surface and protruding away from the half-hole wall.

[0084] See also Fig.10 The third embodiment of the present invention further provides a circuit board half-hole plate 300, the difference between the circuit board half-hole plate 300 and the circuit board half-hole plate 100 is that the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a serrated depression arranged on the plane and recessed toward the half-hole hole wall.

[0085] See also Fig.11 The fourth embodiment of the present invention further provides a circuit board half-hole plate 400 , and the circuit board half-hole plate 400 is different from the circuit board half-hole plate 100 in that: the microstructure 43 includes a plurality of triangular protrusions arranged at intervals.

[0086] See also Fig.12 The fifth embodiment of the present invention further provides a circuit board half-hole plate 500, the difference between the circuit board half-hole plate 500 and the circuit board half-hole plate 100 is that the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a regular rectangular depression arranged on the plane and recessed toward the half-hole hole wall.

[0087] See also Fig.13 The sixth embodiment of the present invention further provides a circuit board half-hole plate 600, the difference between the circuit board half-hole plate 600 and the circuit board half-hole plate 100 is that the surface of the metal layer 42 away from the half-hole hole wall is a plane, and the microstructure 43 includes a sickle-shaped depression arranged on the plane and recessed toward the half-hole hole wall.

[0088] The edge of the circuit board half-hole plate provided by the present invention is provided with a half hole, and a metal layer 42 is provided in the half hole. The surface of the metal layer 42 away from the wall of the half hole is provided with a microstructure 43, and the microstructure 43 increases the specific surface area of ​​the metal layer 42. When the half hole is filled with conductive paste (not shown in the figure), the microstructure 43 increases the contact area between the metal layer 42 and the conductive paste, thereby increasing the bonding force between the metal layer 42 and the conductive paste, thereby reducing the risk of disconnection between the metal layer 42 and the conductive paste. When the part to be connected is subsequently connected to the conductive paste (not shown in the figure), the stability between the circuit board half-hole plate and the part to be connected can be improved, thereby improving the reliability of the circuit board half-hole plate.

[0089] The above description is only an optimized specific implementation of the present invention, but it cannot be limited to this implementation in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present invention should all fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a half-hole circuit board, characterized in that: The following steps are involved: A copper-clad substrate is provided, wherein the copper-clad substrate comprises an insulating layer and a first copper foil layer and a second copper foil layer respectively formed on two opposite surfaces of the insulating layer, wherein a through hole is provided in the copper-clad substrate; Filling the through hole with photosensitive ink and curing the photosensitive ink; The photosensitive ink is exposed and developed to form a photosensitive pattern, wherein the photosensitive pattern includes an opening, the opening is located at an edge of the photosensitive pattern, and the edge of the photosensitive pattern facing the opening has a first microstructure, wherein the first microstructure includes a plurality of protrusions or depressions, and the shape of the protrusions or depressions is at least one of a semicircular shape, a sawtooth shape, a triangle, a rectangle, and a sickle shape; Electroplating metal on the first copper foil layer and the second copper foil layer to form a first copper plated layer and a second copper plated layer respectively, and the metal is also filled in the opening to form a metal layer, the metal layer is formed with a second microstructure corresponding to the first microstructure, the second microstructure is adapted to the shape of the first microstructure, the second microstructure includes a plurality of depressions or protrusions, and the shape of the depressions or protrusions is at least one of a semicircular, serrated, triangular, rectangular and sickle-shaped; Etching the first copper foil layer and the first copper plating layer to form a first conductive circuit layer, and etching the second copper foil layer and the second copper plating layer to form a second conductive circuit layer, to obtain a circuit substrate; Cutting the circuit substrate along the aperture of the through hole to form a half hole after the through hole is cut, and the surface of the metal layer in the half hole away from the hole wall of the half hole has the second microstructure; and The photosensitive pattern in the half hole is removed to obtain the circuit board half hole plate.

2. The method for manufacturing a half-hole circuit board according to claim 1, characterized in that: The metal layer is electrically connected to the first conductive circuit layer and the second conductive circuit layer.

3. The method for manufacturing a half-hole circuit board according to claim 1, characterized in that: After removing the photosensitive pattern in the half hole, the manufacturing method further includes: forming a first solder resist layer on the first conductive circuit layer; and A second solder resist layer is formed on the second conductive circuit layer.

4. A circuit board half-hole plate, characterized in that: The circuit board half-hole plate is manufactured by the manufacturing method according to any one of claims 1 to 3, and the circuit board half-hole plate comprises: A first conductive circuit layer; A second conductive circuit layer; and An insulating layer, located between the first conductive circuit layer and the second conductive circuit layer; Among them, a half hole is provided on the edge of the half-hole plate of the circuit board, a metal layer is provided in the half-hole, and a microstructure is provided on the surface of the metal layer away from the hole wall of the half-hole, and the microstructure includes a plurality of protrusions or depressions, and the shape of the protrusions or depressions is at least one of semicircular, serrated, triangular, rectangular and sickle-shaped.

5. The circuit board half-hole plate according to claim 4, characterized in that: The metal layer is electrically connected to the first conductive circuit layer and the second conductive circuit layer.

6. The circuit board half-hole plate according to claim 4, characterized in that: A first solder mask layer, located on the first conductive circuit layer; and The second solder mask layer is located on the second conductive circuit layer.

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