Circuit board production system and circuit board production method

Abstract

The application relates to a circuit board production system and belongs to the technical field of circuit boards. The circuit board production system comprises a separating device for scanning whole circuit boards to identify good products and defective products, separating the good products from the whole circuit boards to form waste board edges and good products, and clamping the separated whole circuit boards between a carrier and a pressing plate to form a combination and move out; a conveying device for transferring the combination from the separating device to a first transfer assembly and a second transfer assembly; a first mechanical arm for transferring the good product circuit boards on the second transfer assembly to corresponding positions on the first transfer assembly; and a second mechanical arm arranged between the first transfer assembly and a tray conveying device, which is used for transferring the whole tray of good product circuit boards in the first transfer assembly to the tray conveying device. According to the circuit board production system, the tray conveying device is directly connected to the production line to form a flow line, and the circuit boards output by the tray conveying device are good product circuit boards.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and in particular to a circuit board manufacturing system and a circuit board manufacturing method. Background Technology

[0002] Printed Circuit Boards (PCBs) are a crucial component of the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and even military weaponry, utilizes PCBs. Current PCB manufacturing processes control the incoming materials to ensure 100% high-quality boards. However, this requirement for zero-defect boards places excessively high costs on PCB manufacturers, potentially leading to resource waste. Summary of the Invention

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board production system that does not perform processes such as separating defective products, but instead scraps the defective products along with the scrap boards, and replaces the defective products with good products. This solves the high cost problem of manufacturers requiring all good products, reduces production and supply costs, reduces in-plant labor costs, and improves production efficiency and product yield.

[0004] The circuit board production system according to the present invention includes: a board separating device, which scans a whole board of circuit boards to identify good and bad products, separates the good products from the whole board to form waste board edges and good products, and clamps the separated whole board of circuit boards between a carrier and a pressure plate to form an assembly for removal; a conveying device, at least one first transfer component and at least one second transfer component, the conveying device, the first transfer component and the second transfer component being disposed on the same side of the board separating device, the conveying device being used to transfer the assembly from the board separating device to the first transfer component and the second transfer component; a first robot arm, which is used to transfer good circuit boards from the second transfer component to corresponding positions on the first transfer component; a second robot arm and a tray conveying device, the second robot arm being disposed between the first transfer component and the tray conveying device, the second robot arm being used to transfer a whole tray of good circuit boards from the first transfer component to the tray conveying device, the tray conveying device being used to transfer circuit boards arranged as required in the tray to the next work station.

[0005] According to the circuit board production system of the present invention, the material tray conveying device is directly connected to the production line to form an assembly line, ensuring that the circuit boards output by the material tray conveying device are all good quality circuit boards. At the same time, they are arranged according to demand to achieve unmanned operation. The overall layout is reasonable and the structure is compact, which improves production efficiency and product yield, reduces production and supply costs, and reduces in-plant labor costs.

[0006] According to the circuit board production system of the present invention, the board separating equipment includes: an identification unit for scanning the identification information corresponding to each circuit board of the whole board; and a main control unit for receiving, reading and operating the identification information, and marking the circuit boards that meet the requirements as good products and marking the circuit boards that do not meet the requirements as unqualified products.

[0007] According to the circuit board production system of the present invention, the first transfer assembly includes a first transport track, a first sliding module, and a first transfer table. The first transport track is disposed between the first sliding module and the conveying device. The first transfer table is movably disposed on the first sliding module. The first transfer table has a first position and a second position. The first transfer table is movable between the first position and the second position. When the first transfer table is in the first position, the first transport track is connected to the first transfer table, and the first transfer table lifts the assembly located on the first transport track. The first transfer assembly also includes a first vacuum generator and a vacuum logic valve connected to the first vacuum generator. Each vacuum logic valve is arranged on the first transfer table, and each vacuum logic valve is provided with a first suction nozzle.

[0008] Optionally, the second transfer assembly includes a second transport track and a second transfer platform. The second transport track is connected to the second transfer platform and is used to move the assembly to the second transfer platform. The second transfer assembly also includes a second vacuum generator and vacuum logic valves connected to the second vacuum generator. Each vacuum logic valve is arranged on the second transfer platform and each vacuum logic valve is provided with a second suction nozzle.

[0009] Optionally, the circuit board production system further includes: a turnover table, which includes a rotatable rotating platform and a drive unit. The drive unit is used to drive the rotating platform to rotate. The rotating platform is provided with a first suction cup assembly, which includes multiple arrays of first suction nozzles. When the first transfer table is in the second position, the rotating platform drives the first suction cup assembly to rotate to pick up the circuit boards arrayed on the first transfer table; and a rotation mechanism, in which a second robot arm is used to transfer the circuit boards on the turnover table to the rotation mechanism. The rotation mechanism is used to change the orientation of the circuit boards to adapt to the orientation of the acupoints in the tray.

[0010] Optionally, the drive unit includes a tilting cylinder, the rotating platform is rotatable between a seventh position and an eighth position, when the rotating platform is in the seventh position, the first transfer table is in the second position and the rotating platform is above the first transfer table, when the rotating platform is in the eighth position, the second robot is above the rotating platform, and the included angle formed when the rotating platform rotates from the seventh position to the eighth position is 180°.

[0011] Optionally, the rotating mechanism includes: a frame, the frame including a top plate with a through hole; a follower block, the follower block being disposed on the upper cover of the frame and having a groove; multiple linkage assemblies, each linkage assembly including a linkage shaft, a linkage arm, and a roller, one end of the linkage shaft rotatably passing through the through hole of the frame, the linkage arm being fixedly connected to the other end of the linkage shaft projected onto the linkage arm, the linkage arm also being hinged to the roller, and the roller being movably disposed in the groove; a drive unit, the drive unit being disposed on the frame, the drive unit being controllably able to drive the follower block to move, thereby causing the roller to roll along the groove, and thus causing the linkage shaft to rotate; and multiple rotating bases, each rotating base being respectively connected to each linkage shaft, wherein the multiple linkage assemblies are spaced apart in the groove, and the multiple rotating bases rotate synchronously with the linkage shaft.

[0012] Optionally, the first robotic arm is equipped with a scanning unit, which is used to identify the position of waste on the first transfer table and the second transfer table. The first robotic arm is used to pick up the pressure plate of the combination on the first transfer table and the second transfer table and deliver it to the pressure plate recycling bin. The first robotic arm is used to deliver the waste after the whole board circuit board is cut to the waste recycling bin. The first robotic arm is also used to put the empty carriers on the first transfer table and the second transfer table into the carrier recycling bin.

[0013] Optionally, the pressure plate recycling bin and the waste recycling bin are both located on the same side of the first transfer assembly, while the carrier recycling bin is located on the other side of the first transfer assembly.

[0014] Optionally, the conveying device includes a transfer component that is movable between a fifth position and a sixth position. When the transfer component is in the fifth position and the first transfer table is in the first position, the transfer component is adjacent to the first transfer table. When the transfer component is in the sixth position, it is adjacent to the second transfer table.

[0015] According to the circuit board manufacturing method of the present invention, a method for controlling the circuit board manufacturing system described above includes: controlling a board splitting device to scan a whole board of circuit boards to identify good and defective products, splitting the good products and the whole board to form waste board edges and good products, and clamping the split whole board of circuit boards between a carrier and a pressure plate to form an assembly and removing it; controlling a conveying device to transfer the assembly to a first transfer assembly and a second transfer assembly; controlling a first robot arm to transfer good circuit boards from the second transfer assembly to corresponding positions on the first transfer assembly; controlling a second robot arm to transfer a whole tray of good circuit boards from the first transfer assembly to a tray conveying device; and controlling the tray conveying device to transfer circuit boards arranged as required in the tray to the next workstation.

[0016] The circuit board production method according to the embodiments of the present invention can ensure that all circuit boards output by the material tray conveying device are good quality circuit boards, and can be arranged according to demand to achieve unmanned operation. At the same time, the overall layout is reasonable and the structure is compact, which improves production efficiency and product yield, reduces production and supply costs, and reduces in-plant labor costs. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a top view of a circuit board manufacturing system according to an embodiment of the present invention;

[0020] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0021] Figure 3 This is a perspective view of a partial structure of a circuit board manufacturing system according to an embodiment of the present invention;

[0022] Figure 4 This is a perspective view of another partial structure of the circuit board manufacturing system according to an embodiment of the present invention;

[0023] Figure 5 A perspective view of a board separation device in a circuit board production system according to an embodiment of the present invention;

[0024] Figure 6 A perspective view of the first transfer table of a circuit board manufacturing system according to an embodiment of the present invention;

[0025] Figure 7 A perspective view of the second transfer table of a circuit board manufacturing system according to an embodiment of the present invention;

[0026] Figure 8 A perspective view of the second robotic arm in a circuit board manufacturing system according to an embodiment of the present invention;

[0027] Figure 9 Another perspective view of the second robot arm in a circuit board manufacturing system according to an embodiment of the present invention;

[0028] Figure 10 A perspective view of the turnover table of a circuit board production system according to an embodiment of the present invention;

[0029] Figure 11 A perspective view of the rotating mechanism of a circuit board manufacturing system according to an embodiment of the present invention;

[0030] Figure 12 This is a top view of the rotating mechanism of a circuit board manufacturing system according to an embodiment of the present invention;

[0031] Figure 13 This is a perspective view of a tray conveying device in a circuit board production system according to an embodiment of the present invention;

[0032] Figure 14 A perspective view of a carrier suitable for a circuit board production system according to an embodiment of the present invention;

[0033] Figure 15 A perspective view of the pressure plate of the circuit board production system applicable to embodiments of the present invention;

[0034] Figure 16 A perspective view of the conveying equipment of a circuit board production system according to an embodiment of the present invention;

[0035] Figure 17 This is a schematic diagram of the steps of a circuit board manufacturing method according to an embodiment of the present invention.

[0036] Figure label:

[0037] Circuit board production system 1

[0038] PCB splitting device 10, main control unit 12

[0039] First transfer stage 21, first limiting component 211, first receiving stage 212, first suction nozzle 213, first driving unit 214

[0040] Second transfer table 22, second limiting component 221, stop block 222, third drive unit 223, second drive unit 224, second receiving platform 225, second suction nozzle 226.

[0041] First robotic arm 23, scanning unit 231, second suction cup assembly 232, third suction cup assembly 233, fourth suction cup assembly 234, fourth drive unit 235, fifth drive unit 236.

[0042] First transport track 24, first sliding module 25, second transport track 26

[0043] Conveying device 30, transfer assembly 33, pulley assembly 332, first sensor 334, second sensor 336, slide rail 34.

[0044] Second robotic arm 40,

[0045] Material tray conveyor 50, pallet 51,

[0046] Tilting table 60, rotating platform 61, first suction cup assembly 62, drive unit 63.

[0047] Rotating mechanism 70, frame 71, follower block 72, connecting rod assembly 73, rotating base 75.

[0048] Carrier 2a, pressure plate 2b, circuit board 2c

[0049] Press plate recycling bin H1, waste material recycling bin H2. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] like Figures 1-5 , Figure 13 As shown, the circuit board production system 1 according to an embodiment of the present invention includes: a board separating device 10, a first transfer component, a second transfer component, a conveying device 30, a first robot arm 23, a second robot arm 40, and a tray conveying device 50.

[0052] Specifically, a whole board circuit board 2c is sandwiched between a carrier 2a and a pressure plate 2b to form an assembly. The board separation equipment 10 cuts the whole board circuit board 2c to form waste board edges and finished products. Further, the board separation equipment 10 scans the whole board circuit board 2c to identify good and defective products, and retains the defective products without cutting them, while cutting the good board circuit boards 2c into individual pieces. That is, after separation, the defective products remain connected to the waste board edges, while the good products are separated from the waste board edges. Finally, the assembly after separation is removed from the board separation equipment 10.

[0053] The conveying device 30, the first transfer assembly, and the second transfer assembly are located on the same side of the slab separating device 10. The conveying device 30 is used to transfer the assembly from the slab separating device 10 to the first transfer assembly and the second transfer assembly. The first robot arm 23 is used to remove the defective board edges from the assembly in the first transfer assembly and the second transfer assembly. Since the defective products remain connected to the defective board edges, the defective products are removed from the carrier 2a at the same time as the defective board edges are removed. The carrier 2a forms a vacancy position corresponding to the defective products. The first robot arm 23 replenishes the good circuit boards 2c in the second transfer assembly to the corresponding vacancy position in the carrier 2a in the first transfer assembly. The second robot arm 40 is located between the first transfer assembly and the tray conveying device 50. The second robot arm 40 is used to transfer the entire tray of good circuit boards 2c in the first transfer assembly to the tray conveying device 50. The tray conveying device 50 is used to transfer the circuit boards 2c arranged as required in the tray 51 to the next workstation.

[0054] In some embodiments, such as Figure 4 As shown, Figure 3 The diagram shows a three-dimensional representation of the structure with a protective cover. Figure 14 The image shown is a perspective view of vehicle 2a. Figure 15 The image shown is a three-dimensional view of pressure plate 2b. Figure 12 The circuit board 2c shown is placed on the rotating mechanism 70.

[0055] According to the embodiment of the present invention, the circuit board production system 1 is directly connected to the production line through the material tray conveying device 50 to form an assembly line, ensuring that all circuit boards 2c output by the material tray conveying device 50 are good quality circuit boards 2c. At the same time, they are arranged according to demand, realizing unmanned operation. The overall layout is reasonable and the structure is compact, which improves production efficiency and product yield, reduces production and supply costs, and reduces labor costs in the factory.

[0056] like Figures 1-4 As shown, in the circuit board production system 1 according to an embodiment of the present invention, the board separating equipment 10 includes an identification unit for scanning the identification information corresponding to each circuit board 2c on the whole board; and a main control unit 12 for receiving and reading the identification information and running it. The main control unit 12 marks the circuit boards 2c that meet the requirements as good products and marks the circuit boards 2c that do not meet the requirements as unqualified products, so that the board separating equipment 10 can distinguish between good circuit boards 2c and unqualified circuit boards 2c.

[0057] like Figure 1 , Figure 3 , Figures 6-9As shown, in the circuit board production system 1 according to an embodiment of the present invention, the first transfer component includes a first transport track 24, a first sliding module 25, and a first transfer platform 21. The first transport track 24 is disposed between the first sliding module and the conveying device 30. The first transfer platform 21 is movably disposed on the first sliding module 25. The first transfer platform 21 has a first position and a second position. The first transfer platform 21 is movable between the first position and the second position. When the first transfer platform 21 is in the first position, the first transport track 24 is connected to the first transfer platform 21, and the first transfer platform 21 lifts the assembly located on the first transport track 24. The first transport track 24 is used to drive the assembly to move to the first transfer platform 21. The first transfer component also includes a first vacuum generator and a vacuum logic valve connected to the first vacuum generator. Each vacuum logic valve is arranged on the first transfer platform 21, and each vacuum logic valve is provided with a first suction nozzle 213. Therefore, the vacuum logic valve is closed when there is no vacuum above each first suction nozzle 213 or when a defective circuit board 2c is placed above it. Closing the vacuum logic valve when there is no vacuum prevents vacuum leakage and triggers an alarm for abnormal equipment. Closing the vacuum logic valve when a defective circuit board 2c is placed above it prevents vacuum leakage at the defective circuit board 2c and triggers an alarm for abnormal equipment. In this way, the adsorption of each first suction nozzle 213 can be controlled individually, thereby increasing flexibility and practicality.

[0058] In other words, the assembly is moved to the first transfer platform 21 via the first transport track 24, thereby providing the assembly to the first transfer platform 21. The first transfer platform 21 has a first position and a second position, and the first transfer platform 21 is movable between the first position and the second position. The first position is close to the first transport track 24, and the second position is far away from the first transport track 24. When the first transfer platform 21 is empty, the first transfer platform 21 moves towards the first transport track 24 to the first position, and the first transport track 24 transports the assembly to the first transfer platform 21. The first transfer platform 21 moves to the second position with the whole tray of good products, thereby providing them to the equipment of other workstations.

[0059] In some embodiments, a first transport track 24 is provided with a first conveyor belt, which transports the assembly to a first transfer platform 21. The first transfer platform 21 includes a first receiving platform 212 and a first driving unit 214. The first driving unit 214 is connected to the first receiving platform 212 to drive the first receiving platform 212 to move along the Y-axis.

[0060] In other words, when the first transfer platform 21 is in the first position, the first conveyor belt is higher than the first receiving platform 212, thereby preventing the first receiving platform 212 from blocking the movement of the assembly on the first conveyor belt. At the same time, the first receiving platform 212 is located between two opposing first conveyor belts, allowing the assembly to move above the first receiving platform 212. When the assembly moves above the first receiving platform 212, the first receiving platform 212 is spaced apart from the assembly. The first driving unit 214 drives the first receiving platform 212 to move along the Y-axis until the first receiving platform 212 contacts the assembly and causes the assembly to be spaced apart from the first conveyor belt, preventing interference between the operating first conveyor belt and the assembly, thereby realizing the placement of the assembly on the first transfer platform 21.

[0061] In some embodiments, the first drive unit 214 includes a servo motor, which enables adjustment of multiple height positions of the first accommodating stage 212, thereby facilitating the adaptation of the first accommodating stage 212 to other devices and corresponding height adjustment when the first accommodating stage 212 moves to the second position.

[0062] In some embodiments, such as Figure 6 As shown, the first transfer platform 21 includes a first limiting component 211, which is located on the side of the first transfer platform 21 away from the first transport track 24. When the assembly is on the first transport track 24, the highest point of the first limiting component 211 is at least higher than the bottom surface of the assembly. This arrangement stops the assembly being transported on the first conveyor belt by the stopping action of the first limiting component 211, allowing the assembly to remain directly above the first receiving platform 212.

[0063] The first limiting component 211 includes at least a limiting baffle and a fastener. The limiting baffle is fastened to the first transfer table 21 by the fastener. The limiting baffle is provided with a waist-shaped hole extending along the Y-axis direction, so that the position of the limiting baffle can be adjusted by the fastener.

[0064] In some embodiments, at least one first baffle is provided on the first transport track 24 at a position opposite to a transfer platform. When the assembly is on the first transport track 24, the first baffle is spaced apart from the assembly, thereby limiting the assembly above the assembly by setting the first baffle. The first receiving platform 212 is driven by the first driving unit 214 to move along the Y-axis until the first receiving platform 212 contacts the assembly and drives the assembly to move to a stop with the first baffle.

[0065] That is, when the first transfer platform 21 is in the first position, the first receiving platform 212 is movable between the first lifting position and the first yielding position. When the first receiving platform 212 is in the first yielding position, the first receiving platform 212 is spaced apart from the assembly. When the first receiving platform 212 is in the first lifting position, the side of the assembly facing the first receiving platform 212 abuts against the first receiving platform 212 and is spaced apart from the first conveyor belt. The side of the assembly away from the first receiving platform 212 abuts against the first baffle.

[0066] In some embodiments, such as Figure 1 and Figure 7 As shown, the second transfer component includes a second transport track 26 and a second transfer platform 22. The second transport track 26 is connected to the second transfer platform 22, and the second transport track 26 is used to move the assembly to the second transfer platform 22. The first transfer platform 21 and the second transfer platform 22 are both located on the same side of the separating device 10.

[0067] The second transfer assembly also includes a second vacuum generator and vacuum logic valves connected to it. Each vacuum logic valve is arranged on the second transfer platform, and each vacuum logic valve is equipped with a second suction nozzle 226. Thus, the vacuum logic valve closes when an empty space or a defective circuit board 2c is placed above each second suction nozzle 226. Closing the vacuum logic valve when empty prevents vacuum leakage and triggers an equipment malfunction alarm. Closing the vacuum logic valve when a defective circuit board 2c is placed above it prevents vacuum leakage at the defective circuit board 2c, thus preventing equipment malfunction alarms. This design allows for individual control of whether or not each second suction nozzle 226 is adsorbed, thereby increasing flexibility and practicality.

[0068] like Figure 14 As shown, the carrier 2a is provided with multiple arrays of receiving positions, and each receiving position contains a circuit board 2c. The shape and size of the circuit board 2c are roughly the same as the shape and size of the receiving position. The bottom wall of the receiving position is provided with a clearance hole, so that each first suction nozzle 213 and second suction nozzle 226 can pass through the clearance hole to suction the circuit board 2c.

[0069] The second transfer platform 22 includes a second limiting component 221 and a second receiving platform 225. The second limiting component 221 can move between a stop position and a clearance position in a direction toward or away from the second transfer platform 22. The second limiting component 221 includes a power unit and a stop block 222 that is driven to the power unit. When the second limiting component 221 is in the clearance position, the stop block 222 clears the vehicle 2a placed on the second transfer platform 22. When the second limiting component 221 is in the stop position, the stop block 222 restricts the vehicle 2a from moving toward the stop block 222 in the X-axis direction.

[0070] When the assembly is on the second transport track 26, as the assembly moves above the second receiving platform 225, the second limiting member is in a stop position. The stop block 222 can prevent the assembly from moving further, allowing the assembly to stop directly above the second receiving platform 225. After the assembly moves onto the second receiving platform 225, the second limiting component 221 moves to an avoidance position.

[0071] In some embodiments, a second transport track 26 is provided with a second conveyor belt, which is used to move the assembly to a second transfer table 22. The second transfer table 22 also includes a second drive unit 224, which is used to drive the second receiving table 225 to move along the Y-axis direction.

[0072] In other words, the second conveyor belt is higher than the second receiving platform 225, thereby preventing the second receiving platform 225 from blocking the movement of the assembly on the second conveyor belt. At the same time, the second receiving platform 225 is located between two opposing second conveyor belts, allowing the assembly to move above the second receiving platform 225. When the assembly moves above the second receiving platform 225, the second receiving platform 225 is spaced apart from the assembly. The second driving unit 224 drives the second receiving platform 225 to move along the Y-axis until the second receiving platform 225 contacts the assembly and causes the assembly to space apart from the second conveyor belt, preventing interference between the operating second conveyor belt and the assembly, thereby realizing the placement of the assembly on the second transfer platform 22.

[0073] In some embodiments, the second drive unit 224 includes a lifting cylinder, which simplifies the setup of the components of the first transfer table 21 since the second transfer table 22 is fixed in the X-axis direction.

[0074] In some embodiments, such as Figure 7 As shown, the second limiting assembly 221 also includes a support base and a third drive unit 223. Both the third drive unit 223 and the stop block 222 are mounted on the support base. The support base is connected to the power unit via a transmission connection. The stop block 222 is connected to the third drive unit 223 and is driven by the third drive unit 223 to move along the Y-axis. The height of the stop block 222 can be adjusted by the third drive unit 223, thereby allowing it to move along the Y-axis to avoid the assembly after it has moved directly above the second receiving platform 225.

[0075] The power unit includes, but is not limited to, an electric motor, and the third drive unit 223 includes, but is not limited to, a lifting cylinder.

[0076] In some embodiments, at least one second baffle is provided on the second transport track 26 at a position opposite to the second transfer table 22. When the assembly is on the second transport track 26, the second baffle is spaced apart from the assembly, thereby limiting the assembly above the assembly by setting the second baffle. The second receiving table 225 is driven by the second driving unit 224 to move along the Y-axis until the second receiving table 225 contacts the assembly and drives the assembly to move to a stop with the second baffle.

[0077] In other words, when the assembly is on the second conveyor belt, the second receiving platform 225 is movable between the second lifting position and the second yielding position. When the second receiving platform 225 is in the second yielding position, the second receiving platform 225 is spaced apart from the assembly. When the second receiving platform 225 is in the second lifting position, the side of the assembly facing the second receiving platform 225 abuts against the second receiving platform 225, while being spaced apart from the second conveyor belt, and the side of the assembly away from the second receiving platform 225 abuts against the second baffle.

[0078] According to embodiments of the present invention, such as a screening and feeding device, Figure 6 and Figure 7 As shown, both the first transfer stage 21 and the second transfer stage 22 include a vacuum generator, and both the first transfer stage 21 and the second transfer stage 22 include multiple arrays of suction nozzles 213, with a vacuum logic valve corresponding to each suction nozzle 213.

[0079] The first robotic arm 23 delivers the pressure plate 2b of the assembly on the first transfer table 21. After the pressure plate 2b is removed, the circuit board 2c is exposed. The first robotic arm 23 delivers the pressure plate 2b of the assembly on the second transfer table 22. After the pressure plate 2b is removed, the circuit board 2c is exposed. The first robotic arm 23 sequentially delivers the defective products and scrap boards from the first transfer table 21 and the second transfer table 22 to the waste recycling bin H2. Then, the first robotic arm 23 picks up the good circuit boards 2c from the second transfer table 22 and replenishes them in the empty position of the carrier 2a on the first transfer table 21, ensuring that the entire tray of carrier 2a on the first transfer table 21 is filled with good circuit boards 2c.

[0080] In some embodiments, the first robotic arm 23 is located on the side of the first transfer platform 21 away from the second transfer platform 22, or the first robotic arm 23 is located on the side of the second transfer platform 22 away from the first transfer platform 21.

[0081] It should be noted that there are one or more first transfer stations 21 and one or more second transfer stations 22. Usually, the number of first transfer stations 21 is greater than or equal to the number of second transfer stations 22 to ensure the material feeding rhythm of other workstations.

[0082] In addition, the first robotic arm 23 is used to pick up the pressure plate 2b of the combination on the first transfer table 21 and the second transfer table 22 and deliver it to the pressure plate recycling bin H1. The first robotic arm 23 is used to deliver the waste material after the whole board circuit board 2c is cut to the waste material recycling bin H2. The first robotic arm 23 is also used to put the empty carrier 2a on the first transfer table 21 and the second transfer table 22 into the carrier recycling bin.

[0083] In some embodiments, the pressure plate recycling bin H1 and the waste recycling bin H2 are both located on the same side of the transfer device 20, and the carrier recycling bin is located on the other side of the transfer device 20. This reasonable arrangement of the positions of the various devices in the circuit board production system 1 facilitates the docking of the carrier recycling bin with other workstations.

[0084] In some embodiments, such as Figure 8 and Figure 9 As shown, the first robotic arm 23 is equipped with a scanning unit 231, which is used to identify the position of waste on the first transfer table 21 and the second transfer table 22.

[0085] In other words, after the circuit board 2c on the first transfer platform 21 is adsorbed by the first adsorption component, it moves from the second position to the carrier recycling station. The first robotic arm 23 puts the empty carrier 2a on the first transfer platform 21 into the carrier recycling bin. The carrier recycling station is located between the first position and the second position.

[0086] In some embodiments, the first robotic arm 23 includes a fixed plate, a second suction cup assembly 232, a third suction cup assembly 233, a fourth suction cup assembly 234, a fourth drive unit 235, and a fifth drive unit 236. The second suction cup assembly 232 and the third suction cup assembly 233 are both disposed on the fixed plate. The second suction cup assembly 232 is used to adsorb the pressure plate 2b and the carrier 2a, and the third suction cup assembly 233 is used to adsorb waste. The third suction cup assembly 233 is located outside the second suction cup assembly 232. The fourth drive unit 235 is drivenly connected to the fourth suction cup assembly 234 to drive the fourth suction cup assembly 234 to move along the Y-axis. The fourth suction cup assembly 234 includes a plurality of fourth suction nozzles arranged side by side. The fourth suction nozzles are used to adsorb a single circuit board 2c. The fifth drive unit 236 includes a plurality of sub-drive units. Each sub-drive unit is drivenly connected to a corresponding fourth suction nozzle to drive the corresponding fourth suction nozzle to move along the Y-axis.

[0087] According to the circuit board production system 1 of the present invention, the fourth drive unit 235 can drive the fourth suction cup assembly 234 to move down by a large displacement. Multiple fourth suction nozzles can be individually controlled by multiple sub-drive units, so that different fourth suction nozzles can generate height differences. The fourth suction nozzles are driven to move down further according to the needs of the gripping task, so as to get closer to the circuit board 2c for adsorption, thereby achieving precise control of the movement displacement of the fourth suction nozzles, thereby shortening the operation time of the first robot arm 23 as much as possible.

[0088] The second suction cup assembly 232 is used to adsorb the pressure plate 2b and the carrier 2a, and the third suction cup assembly 233 is used to adsorb the waste. The weight of the pressure plate 2b and the carrier 2a is greater than the weight of the waste. Therefore, the second suction cup assembly 232 and the third suction cup assembly 233 need to be set at the same time to apply different suction strengths to match the weight of the object being sucked. This requires reasonable arrangement of the positions of the second suction cup assembly 232 and the third suction cup assembly 233. Since the waste is mainly the edge of the waste plate, the third suction cup assembly 233 is set on the outside of the second suction cup assembly 232, so that the third suction cup assembly 233 is located on the side of the second suction cup assembly 232 closer to the edge of the fixed plate.

[0089] like Figures 10-12 As shown, the circuit board production system 1 according to an embodiment of the present invention further includes a flipping table 60 and a rotating mechanism 70. The flipping table 60 includes a rotatable rotating platform 61 and a driving member 63. The driving member 63 is used to drive the rotating platform 61 to rotate. The rotating platform 61 is provided with a first suction cup assembly 62, which includes a plurality of arrayed first suction nozzles. When the first transfer table 21 is in the second position, the rotating platform 61 drives the first suction cup assembly 62 to rotate to pick up the arrayed circuit boards 2c on the first transfer table 21. The second robotic arm 40 is used to transfer the circuit boards 2c on the flipping table 60 to the rotating mechanism 70. The rotating mechanism 70 is used to change the orientation of the circuit boards 2c to adapt to the orientation of the acupoints in the tray 51.

[0090] like Figure 10 As shown, the tilting table 60 includes a rotatable rotating platform 61 and a drive member 63, which drives the rotating platform 61 to rotate.

[0091] like Figure 11 and Figure 12 As shown, the rotating platform 61 is provided with a first suction cup assembly 62, which includes multiple arrays of first suction nozzles. When the first transfer table 21 is in the second position, the rotating platform 61 drives the first suction cup assembly 62 to rotate to pick up the array of circuit boards 2c on the first transfer table 21.

[0092] The second robotic arm 40 is used to transfer the circuit board 2c on the flip table 60 to the rotating mechanism 70. The rotating mechanism 70 is used to change the orientation of the circuit board 2c to adapt to the orientation of the acupoint in the tray 51. The second robotic arm 40 is also used to transfer the circuit board 2c with the changed orientation on the rotating mechanism 70 to the tray conveying device 50.

[0093] In detail, the first suction cup assembly 62 picks up all the circuit boards 2c from the carrier 2a on the first transfer table 21, separating the carrier 2a from the circuit boards 2c. The second robotic arm 40 then picks up the circuit boards 2c from the flipping table 60, transferring all the circuit boards 2c to the rotating mechanism 70. The circuit boards 2c are placed on each rotating base 75 of the rotating mechanism 70. By controlling the rotating base 75 to rotate at different angles, all the circuit boards 2c are aligned in the same direction, eliminating the need to adjust individual circuit boards 2c, thereby improving production efficiency.

[0094] In some embodiments, the drive unit 63 includes a tilting cylinder, the rotating platform 61 is rotatable between a seventh position and an eighth position, when the rotating platform 61 is in the seventh position, the first transfer table 21 is in the second position and the rotating platform 61 is above the first transfer table 21, when the rotating platform 61 is in the eighth position, the second robot arm 40 is above the rotating platform 61, and the included angle formed when the rotating platform 61 rotates from the seventh position to the eighth position is 180°.

[0095] Specifically, the drive unit 63 drives the rotating platform 61 to rotate between the seventh position and the eighth position. When the rotating platform 61 is in the seventh position, the first transfer table 21 is in the second position. The rotating platform 61 drives the first suction cup assembly 62 to rotate to pick up the circuit boards 2c arrayed on the first transfer table 21. When the rotating platform 61 is in the eighth position, the second robot arm 40 grabs the circuit board 2c on the rotating platform 61 and transfers it to the rotating mechanism 70. This setting simplifies the structural setup for transferring the circuit board 2c from the first transfer table 21 to the rotating mechanism 70, improves efficiency, and ensures cycle time.

[0096] When the first transfer stage 21 is in the second position, the first drive unit 214 can drive the first receiving stage 212 to move along the Y-axis direction to accommodate the distance between the rotating platform 61 and the first receiving stage 212 in the Y-axis direction.

[0097] like Figure 11 As shown, in some embodiments, the rotating mechanism 70 includes a frame 71, a follower block 72, a plurality of linkage assemblies 73, a drive unit, and a plurality of rotating bases 75.

[0098] Specifically, the frame 71 includes a top plate with a through hole; a follower block 72 is disposed on the top cover of the frame 71 and has a groove; the linkage assembly 73 includes a linkage shaft, a linkage arm, and a roller, one end of the linkage shaft rotatably passes through the through hole of the frame 71, the other end of the linkage arm is fixedly connected to the linkage shaft, the linkage arm is also hinged to the roller, and the roller is movably disposed in the groove; a drive unit is disposed on the frame 71, and the drive unit can controllably drive the follower block 72 to move, thereby causing the roller to roll along the groove, which in turn causes the linkage shaft to rotate; rotating bases 75 are respectively connected to each linkage shaft, wherein multiple linkage assemblies 73 are spaced apart in the groove, and multiple rotating bases 75 rotate synchronously with the linkage shaft. The rotating bases 75 are used to load products, thereby driving several products to rotate simultaneously, thereby improving production efficiency, meeting mass production needs, and reducing labor costs.

[0099] The rotating base 75 is provided with a receiving groove. The rotating base 75 is cylindrical, and the receiving groove is located at one end of the rotating base 75. The cross-section of the receiving groove is circular. The circuit board 2c is in the shape of a disc, and the outer contour diameter of the circuit board 2c is approximately the same as the inner contour diameter of the receiving groove within the error range.

[0100] In some embodiments, the conveying device 30 includes a transfer component 33, which is movable between a fifth position and a sixth position. When the transfer component 33 is in the fifth position and the first transfer table 21 is in the first position, the transfer component 33 is adjacent to the first transfer table 21. When the transfer component 33 is in the sixth position, it is adjacent to the second transfer table 22.

[0101] According to embodiments of the present invention, such as a screening and feeding device, Figure 16 As shown, it also includes a slide rail 34, and a transfer component 33 is movably disposed on the slide rail 34. The transfer component 33 includes a base, a drive member 63 disposed on the base, and a pulley assembly 332 disposed opposite to each other on the base. The transfer component 33 also includes a first sensor 334 and a second sensor 336. The first sensor 334 and the second sensor 336 are respectively disposed at both ends of the pulley assembly 332, and the first sensor 334 and the second sensor 336 are both disposed between the two pulley assemblies 332. The drive member 63 is connected to the base for transmission to drive the base to move.

[0102] The first sensor 334 is located at the end of the transfer assembly 33 furthest from the transport track (first transport track 24 and second transport track 26), and the second sensor 336 is located at the end of the transfer assembly 33 closest to the transport track (first transfer platform 21 and second transfer platform 22). The first sensor 334 is used to sense the assembly moving onto the transport track, thereby controlling the pulley assembly 332 to start running so that the assembly moves toward the transfer platform (first transfer platform 21 and second transfer platform 22). The second sensor 336 is used to sense the assembly leaving the transfer assembly 33, thereby controlling the transfer assembly 33 to stop running. This adaptively controls the start and stop of the transfer assembly 33, saving energy and extending the service life of the transfer assembly 33.

[0103] One pulley assembly 332 supports one side of the assembly, and another pulley assembly 332 supports the other side of the assembly. The first sensor 334 and the second sensor 336 are located between the two pulley assemblies 332, which enables more accurate sensing of the assembly.

[0104] It should be noted that the terms "first position", "second position", "fifth position" and "sixth position" are defined only to illustrate the relative positional relationship between the first transfer platform 21 and the conveying equipment 30.

[0105] In some embodiments, the circuit board production system 1 further includes a slide rail 34, and a transfer component 33 is movably disposed on the slide rail 34. The transfer component 33 includes a pulley assembly 332 disposed opposite to each other. The transfer component 33 also includes a first sensor 334 and a second sensor 336. The first sensor 334 and the second sensor 336 are respectively disposed at both ends of the pulley assembly 332, and both the first sensor 334 and the second sensor 336 are disposed between the two pulley assemblies 332. The pulley assembly 332 includes a circular belt and pulleys. The first sensor 334 is located at the end of the transfer assembly 33 closest to the separating device 10, and the second sensor 336 is located at the end of the transfer assembly 33 furthest from the separating device 10. The first sensor 334 is used to sense the assembly moving out of the separating device 10 and onto the transfer assembly 33, thereby controlling the pulley group 332 to start running so that the assembly moves toward the transfer device 20. The second sensor 336 is used to sense the assembly leaving the transfer assembly 33, thereby controlling the transfer assembly 33 to stop running. This adaptively controls the start and stop of the transfer assembly 33, saving energy and extending the service life of the transfer assembly 33.

[0106] One pulley assembly 332 supports one side of the assembly, and another pulley assembly 332 supports the other side of the assembly. The first sensor 334 and the second sensor 336 are located between the two pulley assemblies 332, which enables more accurate sensing of the assembly.

[0107] In addition, the pulley assembly 332 includes a circular belt and pulleys, which can improve the stability of the pulley assembly 332.

[0108] like Figure 17 As shown, a circuit board manufacturing method according to an embodiment of the present invention, used to control the above-described circuit board manufacturing system, includes:

[0109] S1: The control board splitting equipment will scan the whole board circuit board to identify good products and bad products, split the good products and the whole board to form waste board edges and good products, and clamp the split whole board circuit board between the carrier and the pressure plate to form an assembly and remove it.

[0110] S2: Control the conveying equipment to transfer the assembly onto the first transfer component and the second transfer component;

[0111] S3: Control the first robotic arm to transfer the good circuit board on the second transfer component to the corresponding position on the first transfer component;

[0112] S4: Control the second robotic arm to transfer the entire tray of good circuit boards in the first transfer assembly to the material tray conveying device;

[0113] S5: Control the tray conveyor to transfer the circuit boards arranged as required in the tray to the next workstation.

[0114] Specifically, the control panel 10 scans the entire board of circuit boards 2c to identify good and bad products, retains the bad products without cutting them, and cuts the good circuit boards 2c into individual pieces. The assembly is then transferred from the panel 10 to the first transfer assembly and the second transfer assembly via the conveying device 30. The control panel 23 removes the waste board edges from the assembly in the first and second transfer assemblies. Since the bad products remain connected to the waste board edges, the bad products are removed from the carrier 2a at the same time as the waste board edges are removed. The carrier 2a forms a vacancy position corresponding to the bad products. The first robot 23 replenishes the good circuit boards 2c in the second transfer assembly to the corresponding vacancy position in the carrier 2a in the first transfer assembly. The second robot 40 transfers the entire tray of good circuit boards 2c in the first transfer assembly to the tray conveying device 50. The tray conveying device 50 transfers the circuit boards 2c arranged as required in the tray 51 to the next workstation.

[0115] According to the circuit board production method of the present invention, the material tray conveying device 50 is directly connected to the production line to form an assembly line, ensuring that all circuit boards 2c output by the material tray conveying device 50 are good quality circuit boards 2c. At the same time, they are arranged according to demand, realizing unmanned operation. The overall layout is reasonable and the structure is compact, which improves production efficiency and product yield, reduces production and supply costs, and reduces labor costs in the factory.

[0116] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0117] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0118] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

Claims

1. A circuit board production system, characterized by comprising: The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof.

2. The circuit board production system according to claim 1, characterized by The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof.

3. The circuit board production system according to claim 1, characterized by The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof.

4. The circuit board production system according to claim 3, characterized by The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof.

5. The circuit board production system according to claim 3, characterized by The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. The application relates to a circuit board cutting device and a cutting method thereof. 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The application relates to a circuit board cutting The turnover table comprises a rotatable rotating platform and a driving member for driving the rotating platform to rotate, the rotating platform is provided with a first suction disc assembly comprising a plurality of arrays of first suction nozzles, when the first transfer table is in the second position, the rotating platform drives the first suction disc assembly to rotate to suck the array of circuit boards on the first transfer table; A rotating mechanism, the second mechanical hand is used to transfer the circuit board on the turnover table to the rotating mechanism, the rotating mechanism is used to change the direction of the circuit board to adapt to the orientation of the hole in the tray.

6. The circuit board production system according to claim 5, wherein The driving member comprises a turnover cylinder, the rotating platform is rotatable between a seventh position and an eighth position, when the rotating platform is in the seventh position, the first transfer table is in the second position, and the rotating platform is located above the first transfer table, when the rotating platform is in the eighth position, the second mechanical hand is located above the rotating platform, and the included angle formed when the rotating platform rotates from the seventh position to the eighth position is 180°.

7. The circuit board production system according to claim 6, wherein The rotating mechanism comprises: A rack comprising a top plate having a through hole; A follower block provided on the rack cover, the follower block having a groove; A plurality of link assemblies, the link assembly comprising a link shaft, a link arm and a roller, one end of the link shaft rotatably penetrating the through hole of the rack, the other end of the link shaft being fixedly connected to the projection of the link arm, the link arm being hingedly connected to the roller, and the roller being movably arranged in the groove; A driving unit arranged on the rack, the driving unit being controllably driven to move the follower block to drive the roller to roll along the groove, thereby driving the link shaft to rotate, A plurality of rotating bases connected to each of the link shafts, Wherein, a plurality of the link assemblies are distributed in the groove, and a plurality of the rotating bases rotate synchronously with the link shafts.

8. The circuit board production system according to claim 3, characterized by The first mechanical hand is provided with a scanning unit for identifying the position of the waste on the first transfer table and the second transfer table, the first mechanical hand is used to deliver the press plate of the assembly on the first transfer table and the second transfer table to a press plate recycling bin, the first mechanical hand is used to deliver the waste after the whole board circuit board is cut to a waste recycling bin, and the first mechanical hand is also used to deliver the empty carrier on the first transfer table and the second transfer table to a carrier recycling bin.

9. The circuit board production system according to claim 8, characterized by The press plate recycling bin and the waste recycling bin are located on the same side of the first transfer assembly, and the carrier recycling bin is located on the other side of the first transfer assembly.

10. The circuit board production system according to claim 3, characterized by The conveying device comprises a transfer assembly, the transfer assembly is movable between a fifth position and a sixth position, when the transfer assembly is in the fifth position and the first transfer table is in the first position, the transfer assembly is in abutment with the first transfer table, and when the transfer assembly is in the sixth position, the transfer assembly is in abutment with the second transfer table.

11. A method of producing a circuit board, characterized by, The application relates to a circuit board production system for controlling the circuit board production system as claimed in any one of claims 1-10, characterized in that it comprises: controlling the splitting device to scan the whole circuit board to identify the good product and the defective product, and to split the good product and the whole circuit board to form a waste board edge and the good product, and to clamp the split whole circuit board between the carrier and the pressing plate to form an assembly and move out; controlling the conveying device to transfer the assembly to the first transfer assembly and the second transfer assembly; controlling the first mechanical arm to transfer the good circuit board on the second transfer assembly to the corresponding position on the first transfer assembly; controlling the second mechanical arm to transfer the whole good circuit board in the first transfer assembly to the tray conveying device; controlling the tray conveying device to transfer the circuit board arranged according to the requirement in the tray to the next station.

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