A method for manufacturing a pattern in a stepped groove and a PCB

Abstract

The application relates to the technical field of PCB and discloses a stepped groove inner pattern manufacturing method and a PCB. The method comprises the following steps: providing a PCB with a groove body and a pattern die made of magnetic inactivation material, the inner wall of the groove body is provided with a pattern area to be manufactured; the pattern die is provided with a groove, the outer shape and size of the groove are matched with the groove body, the groove wall of the groove is manufactured with a hollow area, and the position, shape and size of the hollow area are consistent with those of the pattern area to be manufactured on the inner wall of the groove body; the groove of the pattern die is placed into the groove body of the PCB, so that the hollow area is aligned with the pattern area to be manufactured; conductive paste is filled in the hollow area and the conductive paste is pre-solidified to obtain a groove inner pattern; the pattern die is heated through an alternating magnetic field until the pattern die is melted and removed, and then the conductive paste is completely solidified. The application can effectively reduce the risk of pollution of the groove inner pattern by resin, realize manufacturing of any type of pattern, is simple and easy to operate, and can also ensure high manufacturing precision.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB (Printed Circuit Boards), and particularly relates to a stepped groove inner pattern manufacturing method and a PCB. BACKGROUND

[0002] With the development of PCB (Printed Circuit Boards) towards light, thin, short and small, in order to save the volume of PCB, some components originally surface-mounted on the PCB begin to be sunkly mounted in the special groove designed in the PCB itself. In order to ensure good conduction of the components and the PCB, a line or pad pattern needs to be designed in the stepped groove.

[0003] However, the current stepped groove inner pattern manufacturing process can only realize the pattern manufacturing of the groove bottom and cannot realize the pattern manufacturing of the sidewall, or needs multiple pressing operations, and the manufacturing process is complex, and there are some pattern design limitations, and some special pattern designs cannot be realized, and the groove inner pattern surface is often contaminated by residual resin. SUMMARY

[0004] The present application aims to provide a stepped groove inner pattern manufacturing method and a PCB to overcome the defects of the prior art, such as complex pattern manufacturing process, limited pattern design and contaminated pattern.

[0005] To achieve this goal, the present application adopts the following technical solutions:

[0006] A stepped groove inner pattern manufacturing method, comprising the steps of:

[0007] providing a PCB with a groove body and a pattern mold made of magnetic inactivation material, the inner wall of the groove body being provided with a pattern area to be manufactured;

[0008] The pattern mold is provided with a groove, the outer shape and size of the groove are matched with the groove body, and the groove wall of the groove is manufactured with a hollow area, the position, shape and size of the hollow area being consistent with the pattern area to be manufactured of the inner wall of the groove body;

[0009] The groove of the pattern mold is placed in the groove body of the PCB, so that the hollow area is aligned with the pattern area to be manufactured;

[0010] The hollow area is filled with conductive paste, and the conductive paste is pre-solidified to obtain a groove inner pattern;

[0011] After the groove inner pattern is obtained, the pattern mold is heated by an alternating magnetic field until the pattern mold is melted and removed;

[0012] After the patterned mold is removed by melting, the conductive paste is baked to completely solidify the conductive paste.

[0013] Optionally, the filling of the conductive paste in the hollowed-out area and the pre-solidification of the conductive paste comprise:

[0014] An extrusion mold is provided, which has an outer shape and size matching the groove.

[0015] First, the conductive paste is injected into the groove of the patterned mold.

[0016] Then, the extrusion mold is pressed into the groove of the patterned mold until the outer wall of the extrusion mold is in close contact with the inner wall of the groove, so that the conductive paste flows to fill the hollowed-out area of the groove wall under the extrusion of the extrusion mold, while the excess conductive paste flows out.

[0017] Then, the conductive paste is pre-solidified, and the extrusion mold is removed.

[0018] Optionally, the extrusion mold is provided with at least one flow channel, and the excess conductive paste flows out through the flow channel.

[0019] Optionally, when the extrusion mold is pressed into the groove of the patterned mold, the inlet of the flow channel is aligned with the non-hollowed-out area of the groove wall.

[0020] Optionally, the thickness of the groove wall is designed according to the thickness design value of the in-groove pattern.

[0021] Optionally, the hollowed-out area of the groove wall comprises at least a first hollowed-out sub-area for forming a first pattern unit with a first thickness design value, and a second hollowed-out sub-area for forming a second pattern unit with a second thickness design value; the first thickness design value is not equal to the second thickness design value.

[0022] In the non-hollowed-out area of the groove wall, the groove wall thickness surrounding the outer periphery of the first hollowed-out sub-area is the first thickness design value, and the groove wall thickness surrounding the outer periphery of the second hollowed-out sub-area is the second thickness design value.

[0023] Optionally, the magnetic inactivation material is magnetic inactivation glue.

[0024] Optionally, the inner wall of the groove body comprises a side wall and a bottom wall, and the side wall and / or the bottom wall are respectively provided with the patterned region.

[0025] Optionally, the extrusion mold, the patterned mold and the PCB are aligned by cooperating with positioning holes and positioning columns.

[0026] A PCB comprising a stepped slot, the inner pattern of the stepped slot being made according to the stepped slot inner pattern making method of any one of the above.

[0027] Compared with the prior art, the present application has the following beneficial effects:

[0028] (1) The embodiment of the present application can effectively reduce the risk of contamination of the inner pattern by resin, since the slot body is first made and then the inner pattern in the slot body is made, without the need for multiple pressing operations;

[0029] (2) The embodiment of the present application uses a hollowed-out design of the pattern mold to achieve selective coating of the conductive paste on the inner wall of the slot body, which not only can make the side wall pattern or the slot bottom pattern separately, but also can make the side wall pattern and the slot bottom pattern simultaneously, and the shape, size and position of the pattern are not limited, and any type of pattern making can be achieved, with strong flexibility;

[0030] (3) The embodiment of the present application uses a magnetic inactivation material to make a pattern mold matched with the slot body, which only needs to be placed in the slot body and filled with conductive paste in the hollowed-out area during pattern making, and the pattern mold can be removed by magnetic field heating after the pattern making is completed, the whole making process is simple and easy to operate, and high pattern making precision can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0032] Figure 1 The stepped slot inner pattern making method flow chart provided by the embodiment of the present application.

[0033] Figure 2 The stepped slot inner pattern making process schematic diagram provided by the embodiment of the present application.

[0034] Figure 3 The structure schematic diagram of the first pattern mold provided by the embodiment of the present application.

[0035] Figure 4 The structure schematic diagram of the second pattern mold provided by the embodiment of the present application.

[0036] Figure 5 The method flow chart of filling conductive paste in the hollowed-out area provided by the embodiment of the present application.

[0037] Figure 6A process schematic diagram for filling conductive paste in the hollowed-out area is provided for the embodiment of the present application.

[0038] Figure 7 A combination structure schematic diagram of the extrusion die and the pattern die under the uniform thickness design is provided for the embodiment of the present application.

[0039] Figure 8 A combination structure schematic diagram of the extrusion die and the pattern die under the non-uniform thickness design is provided for the embodiment of the present application.

[0040] Illustration:

[0041] PCB 1, groove body 11, pattern die 2, hollowed-out area 21, conductive paste 3, extrusion die 4, flow channel 41. DETAILED DESCRIPTION

[0042] In order to make the invention purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the embodiments described below are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0043] To solve the problems of complex process, limited pattern design and easy pollution of the existing pattern making process in the groove, the embodiment of the present application applies a magnetic inactivated glue to make a pattern die, and uses the pattern die to assist in making patterns in the pattern area to be made in the groove. After the pattern making is completed, the pattern die can be quickly removed by heating through a magnetic field, which not only greatly simplifies the manufacturing process, but also facilitates the realization of various pattern designs, and effectively reduces the risk of pollution of the pattern by resin due to multiple pressing operations.

[0044] Please refer to Figure 1 and Figure 2 , the embodiment of the present application provides a stepped groove pattern making method, comprising the steps of:

[0045] Step 101, providing a PCB 1 having a groove body 11 and a pattern die 2 made of a magnetic inactivated material, the inner wall of the groove body 11 is provided with a pattern area to be made.

[0046] Among them, the pattern die 2 is provided with a groove, the outer shape and size of the groove are matched with the groove body 11, and the groove wall is made of a hollowed-out area 21, the position, shape and size of the hollowed-out area 21 are consistent with the pattern area to be made of the inner wall of the groove body 11.

[0047] The magnetic inactivation material can be a magnetic inactivation glue. Unlike conventional materials, the magnetic inactivation material applied in the embodiment of the present application contains tiny iron oxide, which causes the iron oxide particles to heat up when the pattern mold 2 made of the magnetic inactivation material is placed in a magnetic field oscillating at a certain frequency, so that the pattern mold 2 melts, thereby making the pattern mold 2 easy to be removed.

[0048] It should be noted that the patterned region to be made refers to the design region of the pattern such as a circuit, a pad, and a gold finger on the inner wall of the groove body 11. In the embodiment, the patterned region to be made can be designed on any region of the inner wall of the groove body 11, such as the side wall and / or the bottom wall of the groove body 11.

[0049] When the patterned region to be made is designed on the side wall of the groove body 11, the pattern subsequently made in the patterned region to be made can be referred to as a side wall pattern; when the patterned region to be made is designed on the bottom wall of the groove body 11, the pattern subsequently made in the patterned region to be made can be referred to as a groove bottom pattern.

[0050] The specific shape and size of the patterned region to be made depend on the shape and size of the pattern to be made, which are not specifically limited in the embodiment and can be set according to actual needs.

[0051] Step 102: Place the recess of the pattern mold 2 into the groove body 11 of the PCB 1, so that the hollowed-out region 21 is aligned with the patterned region to be made.

[0052] It can be understood that, after the recess of the pattern mold 2 is placed into the groove body 11 of the PCB 1, since the hollowed-out region 21 of the recess is aligned with the patterned region to be made of the groove body 11, the patterned region to be made of the inner wall of the groove body 11 is exposed to the outside, and the other regions (non-patterned regions to be made) of the inner wall are shielded by the pattern mold 2; based on this, a containing groove with the inner wall of the groove body 11 as the bottom wall and the groove wall of the recess of the pattern mold 2 as the side wall will be formed in the patterned region to be made, which will be used to fill the conductive paste 3.

[0053] Step 103: Fill the conductive paste 3 in the hollowed-out region 21 and pre-cure the conductive paste 3 to make a groove-in pattern.

[0054] The conductive paste 3, also known as conductive glue, is a mixture of noble metal powder, base metal powder, glass powder, and synthetic resin. When the conductive paste 3 is filled into the hollowed-out region 21, it is used to form a groove-in pattern with a signal transmission function, which can be a circuit pattern, a pad pattern, or a gold finger pattern.

[0055] In this step, according to the pre-curing requirements of the conductive glue, the conductive paste 3 is baked at a lower baking temperature and for a shorter baking time, so as to achieve the purpose of pre-curing the conductive paste 3, and to ensure that the conductive paste 3 can maintain the original shape in the subsequent process of removing the pattern mold 2. In this pre-curing process, since the baking temperature is low and the baking time is short, the melting conditions of the magnetic inactivation material are not met, so the pattern mold 2 can maintain the original solid shape well.

[0056] Step 104, after the in-tank pattern is prepared, the pattern mold 2 is heated by an alternating magnetic field until the pattern mold 2 is melted and removed.

[0057] In this step, since the magnetic inactivation material contains tiny iron oxide particles that can be heated by an alternating magnetic field, the pattern mold 2 can be heated by an alternating magnetic field to melt it. The pattern mold 2 in the molten state easily flows out of the tank body 11 due to its fluid characteristics, thereby achieving the purpose of removing the pattern mold 2.

[0058] The magnetic field itself is relatively weak and safe, and the hands of the person using it will not generate excessive heat. Only 30 seconds of application of the magnetic inactivation material to the pattern mold 2 is required to melt the pattern mold 2.

[0059] Step 105, bake the conductive paste 3 so that the conductive paste 3 is completely cured.

[0060] In summary, on the one hand, the embodiment of the present application can effectively reduce the risk of contamination of the in-tank pattern by resin, as the tank body 11 is first prepared and then the in-tank pattern is prepared in the tank body 11, without the need for multiple pressing operations.

[0061] On the other hand, the embodiment of the present application uses a pattern mold 2 with a hollow design to achieve selective coating of the conductive paste 3 on the inner wall of the tank body 11. Not only can the side wall pattern or the tank bottom pattern be made separately, but also the side wall pattern and the tank bottom pattern can be made simultaneously. Moreover, the shape, size and position of the pattern are not limited, and any type of pattern can be made, which is highly flexible.

[0062] On the other hand, the embodiment of the present application uses a pattern mold 2 with a hollow design to achieve selective coating of the conductive paste 3 on the inner wall of the tank body 11. Not only can the side wall pattern or the tank bottom pattern be made separately, but also the side wall pattern and the tank bottom pattern can be made simultaneously. Moreover, the shape, size and position of the pattern are not limited, and any type of pattern can be made, which is highly flexible.

[0063] After the recess of the graphic mold 2 is placed into the groove 11 of the PCB 1, a containing groove with the inner wall of the groove 11 as the bottom wall and the recess groove wall of the graphic mold 2 as the side wall will be formed in the area where the graphic is to be made. The containing groove will be filled with the conductive paste 3, and the conductive paste 3 filled into the containing groove will be solidified to form the in-groove graphic. Therefore, the embodiment of the present application designs the thickness of the recess groove wall of the graphic mold 2 according to the design value of the thickness of the in-groove graphic. In this way, the in-groove graphic with various thicknesses can be made by adjusting the thickness of the recess groove wall.

[0064] When the graphic thickness is uniform, the recess thickness of the graphic mold 2 can be designed uniformly, as shown in Figure 3 When the graphic thickness is not uniform, the recess thickness of the graphic mold 2 can be designed non-uniformly in different areas, as shown in Figure 4 For example, the hollowed area 21 of the recess groove wall includes at least a first hollowed sub-area for forming a first graphic unit with a first thickness design value and a second hollowed sub-area for forming a second graphic unit with a second thickness design value. The first thickness design value is not equal to the second thickness design value. Based on this, the thickness of the recess groove wall surrounding the outer periphery of the first hollowed sub-area is the first thickness design value, and the thickness of the recess groove wall surrounding the outer periphery of the second hollowed sub-area is the second thickness design value. In this way, the in-groove graphic with two different thicknesses can be formed.

[0065] Please refer to Figure 5 and Figure 6 To further improve the filling efficiency and quality of the conductive paste 3, the method of filling the conductive paste 3 into the hollowed area 21 in step 103 can include:

[0066] Step 201, providing an extrusion mold 4, the external shape and size of which match the recess.

[0067] Step 202, injecting the conductive paste 3 into the recess of the graphic mold 2.

[0068] Step 203, pressing the extrusion mold 4 into the recess of the graphic mold 2 until the outer wall of the extrusion mold 4 is in close contact with the inner wall of the recess, so that the conductive paste 3 flows to fill the hollowed area 21 of the recess groove wall under the extrusion of the extrusion mold 4, and the excess conductive paste 3 flows out.

[0069] It should be noted that the initial injection amount of the conductive paste 3 is not less than the actual filling amount currently required. During the extrusion process, part of the conductive paste 3 is filled into the hollowed area 21, and part of the conductive paste 3 flows to the area outside the hollowed area 21.

[0070] The combined structure of the extrusion mold 4 and the graphic mold 2 under the uniform thickness design is as shown in Figure 7As shown, the combined structure of the extrusion die 4 and the pattern die 2 under the non-uniform thickness design is as shown in FIG. 2B. Figure 8 As shown in FIG. 2B.

[0071] In step 204, the conductive paste 3 is pre-cured, and then the extrusion die 4 is taken out.

[0072] In this method, the conductive paste 3 in the recess of the pattern die 2 is extruded by the extrusion die 4 cooperating with the pattern die 2, so that the conductive paste 3 flows to automatically fill the hollowed-out areas 21 of the pattern die 2, which can greatly improve the production efficiency.

[0073] As shown in FIG. 2B. Figure 7 Or Figure 8 As shown, the extrusion die 4 is provided with at least one flow channel 41, and in the extrusion process, the excess conductive paste 3 flows out through the flow channel 41. When the extrusion die 4 is taken out, the conductive paste 3 flowing into the flow channel 41 and outside the flow channel 41 will be separated from the inner wall of the groove 11 along with the extrusion die 4.

[0074] In order to further improve the production accuracy, when the extrusion die 4 is pressed into the recess of the pattern die 2, the inlet of the flow channel 41 is aligned with the non-hollowed-out area 21 of the groove wall, so that the excess conductive paste 3 is only connected with the non-hollowed-out area 21 of the inner wall of the pattern die 2 and is not connected with the conductive paste 3 filled in the hollowed-out area 21, so that the excess conductive paste 3 can be removed when the extrusion die 4 is removed, and the thickness of the conductive paste 3 filled in the hollowed-out area 21 can be accurately controlled.

[0075] In addition, the pattern die 2, the extrusion die 4 and the PCB 1 are aligned by cooperating with the positioning holes and the positioning columns to ensure the accuracy of the pattern making position. Of course, other conventional alignment methods can also be used.

[0076] The embodiment of the present application also provides a PCB comprising a stepped groove, and the in-groove pattern of the stepped groove is made by the above-mentioned in-groove pattern making method. Since the in-groove pattern making method based on the pattern die made of magnetic inactivation material is used, the in-groove pattern with high accuracy can be obtained.

[0077] The above-described embodiments are only used to illustrate the technical solutions of the present application, but not limit the same; although the foregoing embodiments of the present application have been described in detail, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for creating a pattern within a stepped groove, characterized in that, Including the following steps: A PCB with a groove and a graphic mold made of a magnetically deactivating material are provided, wherein the inner wall of the groove is provided with a region for which the graphic is to be fabricated. The graphic mold is provided with a groove, the external shape and size of which match the groove body, and the groove wall is provided with a hollow area, the hollow area being consistent with the position, shape and size of the graphic area to be made on the inner wall of the groove body; The groove of the graphic mold is placed into the slot of the PCB, so that the cutout area is aligned with the area of ​​the graphic to be made; The hollowed-out area is filled with conductive paste and the conductive paste is pre-cured to obtain the groove pattern; After the pattern in the groove is obtained, the pattern mold is heated by an alternating magnetic field until the pattern mold melts and is removed. After the graphic mold is melted and removed, the conductive paste is baked to completely solidify it.

2. The method for creating the pattern within the stepped groove according to claim 1, characterized in that, The step of filling the hollowed-out area with conductive paste and pre-curing the conductive paste includes: An extrusion die is provided, the external shape and dimensions of which match the groove; First, inject conductive paste into the groove of the graphic mold; Then, the extrusion mold is pressed into the groove of the graphic mold until the outer wall of the extrusion mold is in contact with the inner wall of the groove, so that the conductive paste flows under the extrusion action of the extrusion mold to fill the hollow area of ​​the groove wall, while the excess conductive paste flows out. Then, the conductive paste is pre-cured, and then the extrusion mold is removed.

3. The method for creating the pattern within the stepped groove according to claim 2, characterized in that, The extrusion die is provided with at least one flow channel, through which excess conductive slurry flows out.

4. The method for creating the pattern within the stepped groove according to claim 3, characterized in that, When the extrusion die is pressed into the groove of the graphic die, the inlet of the flow channel is aligned with the non-hollowed-out area of ​​the groove wall.

5. The method for creating a stepped groove pattern according to claim 1, characterized in that, The thickness of the groove wall is designed based on the thickness design value of the groove pattern.

6. The method for creating a stepped groove pattern according to claim 5, characterized in that, The hollowed-out area of ​​the groove wall includes at least: a first hollowed-out sub-region for forming a first graphic unit with a first thickness design value, and a second hollowed-out sub-region for forming a second graphic unit with a second thickness design value; the first thickness design value and the second thickness design value are not equal; In the non-perforated area of ​​the groove wall, the thickness of the groove wall surrounding the first perforated sub-area is the first thickness design value, and the thickness of the groove wall surrounding the second perforated sub-area is the second thickness design value.

7. The method for creating a stepped groove pattern according to claim 1, characterized in that, The magnetic deactivating material is a magnetic deactivating adhesive.

8. The method for creating a stepped groove pattern according to claim 1, characterized in that, The inner wall of the groove includes a side wall and a bottom wall, and the side wall and / or the bottom wall are respectively provided with the area of ​​the graphic to be produced.

9. The method for creating a stepped groove pattern according to claim 2, characterized in that, The extrusion die, the graphic die, and the PCB are aligned by means of positioning holes and positioning posts.

10. A PCB comprising stepped grooves, characterized in that, The internal pattern of the stepped groove is made according to the method for making the internal pattern of the stepped groove as described in any one of claims 1 to 9.

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