A circuit board automatic defoaming system, method, device and storage medium

Abstract

The present application discloses a circuit board automatic defoaming system, method, device and storage medium, the method comprising: transporting a carrier storing a circuit board to a feed conveyor by an automatic guided transport vehicle, transferring the carrier to a conveyor belt by the feed conveyor; transporting the carrier to a vacuum pump by a transmission belt, vacuumizing the circuit board on the carrier by the vacuum pump, and transporting the carrier to a tunnel oven by a conveyor belt after the vacuuming is completed, pre-baking the circuit board by the tunnel oven, and transporting the carrier to a discharge conveyor by a conveyor belt after the pre-baking is completed; transferring the carrier to an automatic guided transport vehicle by the discharge conveyor, so that the automatic guided transport vehicle obtains the defoamed circuit board, and transporting the defoamed circuit board to the next section by the automatic guided transport vehicle. The present application can realize unmanned automated operation in the thick copper plate defoaming section, which not only reduces the operating intensity of personnel, but also improves the defoaming efficiency.

Description

Technical Field

[0001] The present application relates to the field of circuit board processing, and in particular to a circuit board automatic defoaming system, method, device and storage medium. Background Art

[0002] During the screen printing process of the circuit board (PCB), the thickness of the wet ink on the circuit and substrate of the PCB with a surface copper thickness greater than 3 ounces (OZ) will usually exceed 40um. The thicker ink will produce bubbles during stirring and screen printing. If the bubbles cannot be completely removed by standing for 15-30 minutes before pre-baking, the PCB board factory will use a machine to vacuum to eliminate the bubbles in the thick ink to avoid the ink falling off due to the residual solution of bubbles on the circuit or copper surface, which will cause short circuit / open circuit after the component is printed.

[0003] In the prior art, the PCB board is often manually moved into a vacuum box, and after the vacuum box is evacuated, the PCB board is manually moved into a tunnel oven, and after pre-baking, the PCB board is manually moved out.

[0004] However, the factory needs to process large batches of PCB boards every day. This method requires personnel to move the frames repeatedly, which greatly increases the labor intensity of employees and fails to effectively improve production efficiency. Summary of the invention

[0005] The main technical problem solved by the present application is to provide a circuit board automatic defoaming system, method, device and storage medium, which connects the vacuum pump and the tunnel oven in series through a connecting device, and replaces the manual frame moving with the feeding conveyor and the unloading conveyor, so as to solve the problems of high labor intensity and low production efficiency caused by manual frame moving.

[0006] In order to solve the above-mentioned technical problems, the first technical solution adopted in the present application is to provide an automatic defoaming system for circuit boards, which includes an automatic guided transport vehicle, a feeding conveyor, a conveyor belt, a vacuum pump, a tunnel oven and a unloading conveyor; the vacuum pump is located at one end of the tunnel oven; the feeding conveyor is located at one end of the vacuum pump; the unloading conveyor is located at the other end of the tunnel oven; one end of the conveyor belt is connected to the feeding conveyor, and the other end is connected to the unloading conveyor, and is arranged corresponding to the vacuum pump and the tunnel oven; the automatic guided transport vehicle is used to transport the carrier storing the circuit boards to the front of the feeding conveyor, so that the feeding conveyor transfers the carrier to the conveyor belt, and obtains the defoamed circuit boards from the unloading conveyor after pre-baking is completed, and transports the defoamed circuit boards to the next work section.

[0007] The conveyor belt is at the same height as the vacuum machine and the opening and exit of the tunnel oven.

[0008] The infeed conveyor and the unloading conveyor include a transfer device, which is used to transfer the carrier from the automatic guided transport vehicle or to the automatic guided transport vehicle.

[0009] The transfer device includes a pallet and a multi-axis robotic arm, and the multi-axis robotic arm is connected to the bottom of the pallet to drive the pallet to rise, fall or extend.

[0010] In order to solve the above technical problems, the second technical solution adopted by the present application is to provide a circuit board automatic defoaming method, which is implemented by a circuit board automatic defoaming system, and the circuit board automatic defoaming system includes an automatic guided transport vehicle, a feeding conveyor, a conveyor belt, a vacuum pump, a tunnel oven and a discharge conveyor; the vacuum pump is located at one end of the tunnel oven; the feeding conveyor is located at one end of the vacuum pump; the discharge conveyor is located at the other end of the tunnel oven; one end of the conveyor belt is connected to the feeding conveyor, and the other end is connected to the discharge conveyor, and is arranged corresponding to the vacuum pump and the tunnel oven; the circuit board automatic defoaming method includes: by automatically The automatic guided transport vehicle transports the carrier storing the circuit boards to the front of the feeding conveyor, and transfers the carrier to the conveyor belt through the feeding conveyor; the carrier is transported into the vacuum machine through the transmission belt, and the circuit boards on the carrier are vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is transported into the tunnel oven through the conveyor belt, and the circuit boards are pre-baked through the tunnel oven, and after the pre-baking is completed, the carrier is transported to the unloading conveyor through the conveyor belt; the carrier is transferred to the automatic guided transport vehicle through the unloading conveyor, so that the automatic guided transport vehicle obtains the defoamed circuit boards, and the defoamed circuit boards are transported to the next work section by the automatic guided transport vehicle.

[0011] Among them, before the carrier storing the circuit boards is transported to the feed conveyor by the automatic guided transport vehicle, and before the step of transferring the carrier to the conveyor belt by the feed conveyor, it also includes: obtaining the processing parameters of the circuit boards on the carrier by the automatic guided transport vehicle, and uploading the processing parameters to the MES system, so that the MES system sends the processing parameters to the feed conveyor, conveyor belt, vacuum machine, tunnel oven and unloading conveyor.

[0012] The processing parameters include at least one of a conveying speed, a vacuum degree, a vacuuming time, an oven temperature, a baking time, and an oven type.

[0013] Among them, there are one or more tunnel ovens, and there are one or more corresponding conveyor belts; when there are multiple tunnel ovens, the carrier is transported into the vacuum machine by the transmission belt, the circuit board on the carrier is vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is transported into the tunnel oven by the conveyor belt, the circuit board is pre-baked by the tunnel oven, and after the pre-baking is completed, the carrier is transported into the unloading conveyor by the conveyor belt. The steps specifically include: transporting the carrier into the vacuum machine by the transmission belt, vacuuming the circuit board on the carrier by the vacuum machine, and after the vacuuming is completed, the carrier is diverted by multiple conveyor belts according to different processing parameters to transport the carriers with different processing parameters into the corresponding tunnel ovens, pre-baking the circuit boards by multiple tunnel ovens, and after the pre-baking is completed, the carrier is transported into the unloading conveyor by multiple conveyor belts.

[0014] In order to solve the above technical problems, the third technical solution adopted in the present application is to provide an automatic defoaming device for a circuit board, comprising: a memory for storing program data, which implements the steps of the automatic defoaming method for a circuit board as described in any one of the above items when the stored program data is executed; and a processor for executing the program instructions stored in the memory to implement the steps of the automatic defoaming method for a circuit board as described in any one of the above items.

[0015] In order to solve the above technical problems, the fourth technical solution adopted in the present application is to provide a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by the processor, the steps in the automatic defoaming method for circuit boards as described in any of the above items are implemented.

[0016] The beneficial effects of the present application are as follows: different from the prior art, the present application connects the vacuum machine and the tunnel oven in series through a connecting device, and replaces the manual frame moving by a feeding conveyor and a unloading conveyor, so as to realize unmanned automatic operation in the thick copper plate defoaming section, which not only reduces the operation intensity of personnel, but also improves the defoaming efficiency; in addition, since the vacuum machine and the tunnel oven are connected by a conveyor belt, the automatic guided transport vehicle is avoided to transport between the vacuum machine and the tunnel oven, which further improves the defoaming efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a structural schematic diagram of an embodiment of the automatic defoaming system for circuit boards of the present application;

[0019] Figure 2 It is a schematic flow chart of an embodiment of the automatic defoaming method for a circuit board of the present application;

[0020] Figure 3 This is a structural schematic diagram of an embodiment of the automatic defoaming device for circuit boards of the present application;

[0021] Figure 4 It is a structural schematic diagram of an implementation method of a computer-readable storage medium of the present application. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0023] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms of "a", "said", and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless otherwise clearly indicated above, and "multiple" generally includes at least two, but does not exclude the inclusion of at least one.

[0024] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0025] It should be understood that the terms "include", "comprises" or any other variations used herein are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the sentence "includes..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0026] During the screen printing process of the circuit board (PCB), the thickness of the wet ink on the circuit and substrate of the PCB with a surface copper thickness greater than 3 ounces (OZ) will usually exceed 40um. The thicker ink will produce bubbles during stirring and screen printing. If the bubbles cannot be completely removed by standing for 15-30 minutes before pre-baking, the PCB board factory will use a machine to vacuum to eliminate the bubbles in the thick ink to avoid the ink falling off due to the residual solution of bubbles on the circuit or copper surface, which will cause short circuit / open circuit after the component is printed.

[0027] In the prior art, the PCB board is often manually moved into a vacuum box, and after the vacuum box is evacuated, the PCB board is manually moved into a tunnel oven, and after pre-baking, the PCB board is manually moved out.

[0028] However, the factory needs to process large batches of PCB boards every day. This method requires personnel to move the frames repeatedly, which greatly increases the labor intensity of employees and fails to effectively improve production efficiency.

[0029] Based on the above situation, the present application provides a circuit board automatic defoaming system, method, device and storage medium, which connects the vacuum machine and the tunnel oven in series through a connecting device, and replaces the manual frame moving with the feeding conveyor and the unloading conveyor, which can solve the problems of high labor intensity and low production efficiency caused by manual frame moving.

[0030] The present application is described in detail below with reference to the accompanying drawings and implementation methods.

[0031] See also Figure 1 , Figure 1 Schematic diagram of the structure of an embodiment of the automatic defoaming system for circuit boards of the present application. Figure 1 As shown, in this embodiment, the circuit board automatic defoaming system 100 includes an automated guided vehicle (AGV) 1, a feeding conveyor 2, a conveyor belt 3, a vacuum machine 4, a tunnel oven 5 and a unloading conveyor 6.

[0032] Among them, the vacuum machine 4 is located at one end of the tunnel oven 5; the feeding conveyor 2 is located at one end of the vacuum machine 4; the unloading conveyor 6 is located at the other end of the tunnel oven 5; one end of the conveyor belt 3 is connected to the feeding conveyor 2, and the other end is connected to the unloading conveyor 6, and is set corresponding to the vacuum machine 4 and the tunnel oven 5; the automatic guided transport vehicle 1 is used to transport the carrier storing the circuit board to the front of the feeding conveyor 2, so that the feeding conveyor 2 transfers the carrier to the conveyor belt 3, and obtains the defoamed circuit board from the unloading conveyor 6 after the pre-baking is completed, and transports the defoamed circuit board to the next work section.

[0033] The conveyor belt 3 is at the same height as the opening and exit of the vacuum pump 4 and the tunnel oven 5. It can be understood that this connection method is convenient for the transportation of the carrier.

[0034] The conveyor belt 3 includes rollers and belts.

[0035] In this embodiment, the infeed conveyor 2 and the unloading conveyor 6 include a transfer device (not shown), which is used to transfer the carrier from the automatic guided transport vehicle 1 or to the automatic guided transport vehicle 1. The transfer device includes a pallet and a multi-axis robot arm, and the multi-axis robot arm is connected to the bottom of the pallet to drive the pallet to rise, fall or extend.

[0036] Specifically, the automatic guided transport vehicle 1 lifts the carrier and moves the carrier onto the belt of the conveyor belt 3, and transports it through rollers. The pallet of the feed conveyor 2 is raised to the same height as the carrier by the multi-axis robot arm, and the carrier is transferred to the pallet by the extension and retraction of the multi-axis robot arm. The carrier is transported to the vacuum machine 4 via the pallet, so that the vacuum machine 4 vacuums the PCB boards stored on the carrier.

[0037] It can be understood that after the carrier is transported to the feed conveyor 2 by the automatic guided transport vehicle 1, it is directly sent into the vacuum machine 4 through the feed conveyor 2 and the conveyor belt 3, avoiding repetitive labor of personnel and reducing the number of times personnel move frames to 0 times / day. It not only greatly reduces the operating intensity of personnel, but also improves the efficiency of frame moving, and then improves the defoaming efficiency of PCB boards.

[0038] In other embodiments, a lifting robot arm is provided on the side of the vacuum machine 4 close to the automatic guided transport vehicle 1, and the lifting robot arm can be used to directly lift the carrier from the automatic guided transport vehicle 1 and then send it into the vacuum machine 4. This application does not limit this.

[0039] It can be understood that since the vacuum machine 4 and the tunnel oven 5 are connected by the conveyor belt 3, the PCB board can be directly transported to the tunnel oven 5 through the conveyor belt 3 after being processed in the vacuum machine 4, thereby avoiding the automatic guided transport vehicle 1 from performing multiple transportations between the vacuum machine 4 and the tunnel oven 5, and further improving the defoaming efficiency of the PCB board.

[0040] Different from the prior art, the vacuum machine 4 and the tunnel oven 5 of this embodiment are connected in series through the conveyor belt 3, and the feeding conveyor 2 and the unloading conveyor 6 can directly move the frame, which can realize unmanned automatic operation in the thick copper plate defoaming section, which not only reduces the operation intensity of personnel, but also improves the defoaming efficiency; in addition, since the vacuum machine 4 and the tunnel oven 5 are connected by the conveyor belt 3, the automatic guided transport vehicle 1 is avoided from transporting between the vacuum machine 4 and the tunnel oven 5, which further improves the defoaming efficiency.

[0041] Correspondingly, the present application provides a method for automatic defoaming of a circuit board.

[0042] Specifically, see Figure 2 , Figure 2 It is a flow chart of an embodiment of the automatic defoaming method for circuit boards of the present application. In this embodiment, the automatic defoaming method for circuit boards is implemented by an automatic defoaming system for circuit boards, which includes an automatic guided transport vehicle, a feeding conveyor, a conveyor belt, a vacuum pump, a tunnel oven, and a discharge conveyor; the vacuum pump is located at one end of the tunnel oven; the feeding conveyor is located at one end of the vacuum pump; the discharge conveyor is located at the other end of the tunnel oven; one end of the conveyor belt is connected to the feeding conveyor, and the other end is connected to the discharge conveyor, and is arranged corresponding to the vacuum pump and the tunnel oven.

[0043] like Figure 2 As shown, the circuit board automatic defoaming method includes:

[0044] S21: The carrier storing the circuit boards is transported to the infeed conveyor by an automated guided vehicle, and the infeed conveyor transfers the carrier to the conveyor belt.

[0045] In this embodiment, when the automatic guided transport vehicle transports a carrier storing circuit boards, it will automatically read the processing parameters of the circuit boards on the carrier and upload the processing parameters to the MES system, so that the MES system will send the processing parameters to the feeding conveyor, conveyor belt, vacuum machine, tunnel oven and unloading conveyor.

[0046] Among them, the MES (Messaging System) system is an intelligent manufacturing system based on the Internet of Things. It can build a digital factory based on data to drive production management, so as to realize the automation, informatization, transparency and intelligence of the production process.

[0047] In this embodiment, the processing parameters include at least one of a conveying speed, a vacuum degree, a vacuuming time, an oven temperature, a baking time, and an oven type.

[0048] The transmission is divided into four sections: feeding, vacuuming, pre-baking and discharging. The carrier is pushed backward by the front section (feeding section) of the robot arm and pulled backward by the rear section (discharging section) through the transmission form and the conveyor belt to achieve the transmission between sections. Each section is driven by an independent motor, and the transmission speed of each section can be set independently according to needs.

[0049] Among them, when there are multiple tunnel ovens, there are corresponding conveyor belts. At this time, the PCB boards coming out of the vacuum machine need to be diverted into different tunnel ovens, and after pre-baking in different tunnel ovens, they are transmitted through multiple conveyor belts and merged into the unloading conveyor. That is, the transmission is divided into 6 sections: feeding, vacuuming, diversion, pre-baking, merging and discharging.

[0050] Specifically, in the intelligent manufacturing mode, after the installation is completed, that is, after the vacuum machine and the tunnel oven are connected in series through the connection equipment, the processing parameters of each section of the thick copper plate defoaming section can be controlled through the MES system. The processing methods of PCB boards transported by different carriers are different, and the corresponding processing parameters are different. After reading the processing parameters of different PCB boards, the automatic guided transport vehicle uploads them to the MES system. The MES system controls the vacuum time of the vacuum machine and the baking time of the tunnel oven according to the processing parameters.

[0051] S22: The carrier is transported into a vacuum machine through a transmission belt, the circuit board on the carrier is vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is transported into a tunnel oven through a conveyor belt, the circuit board is pre-baked in the tunnel oven, and after the pre-baking is completed, the carrier is transported into a discharge conveyor through a conveyor belt.

[0052] In this embodiment, there are one or more tunnel ovens, and there are one or more corresponding conveyor belts.

[0053] When there are multiple tunnel ovens, the MES system also needs to control the transportation direction of the conveyor belt to divert different PCB boards to different ovens and control the baking time of each tunnel oven.

[0054] Specifically, when there are multiple tunnel ovens, the carrier is transported into a vacuum machine via a transmission belt, the circuit board on the carrier is vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is diverted by multiple conveyor belts according to different processing parameters to transport the carriers with different processing parameters into the corresponding tunnel ovens, the circuit boards are pre-baked by multiple tunnel ovens, and after the pre-baking is completed, the carrier is transported into the unloading conveyor by multiple conveyor belts.

[0055] S23: The carrier is transferred to the automatic guided transport vehicle through the unloading conveyor, so that the automatic guided transport vehicle obtains the defoamed circuit board, and the defoamed circuit board is transported to the next work section through the automatic guided transport vehicle.

[0056] Different from the prior art, this embodiment connects the vacuum machine and the tunnel oven in series through a connecting device, and replaces the manual frame moving by the feeding conveyor and the unloading conveyor, so as to realize unmanned automatic operation in the thick copper plate defoaming section, which not only reduces the operation intensity of personnel, but also improves the defoaming efficiency; in addition, since the vacuum machine and the tunnel oven are connected by a conveyor belt, the automatic guided vehicle is avoided to transport between the vacuum machine and the tunnel oven, which further improves the defoaming efficiency.

[0057] Correspondingly, the present application provides an automatic defoaming device for a circuit board.

[0058] Specifically, see Figure 3 , Figure 3 Schematic diagram of the structure of an embodiment of the automatic defoaming device for circuit boards of the present application. Figure 3 As shown, the circuit board automatic defoaming device 30 includes a memory 31 and a processor 32 coupled to each other.

[0059] In this embodiment, the memory 31 is used to store program data, and when the program data is executed, the steps in the circuit board automatic defoaming method described in any of the above embodiments can be implemented; the processor 32 is used to execute the program instructions stored in the memory 31 to implement the steps in any of the above embodiments or the steps corresponding to the circuit board automatic defoaming device in any of the above embodiments. In addition to the processor 32 and the memory 31, the circuit board automatic defoaming device 30 can also include a touch screen, a communication circuit, etc. according to requirements, which are not limited here.

[0060] Specifically, the processor 32 is used to control itself and the memory 31 to implement the steps in any of the above-mentioned trajectory acquisition method embodiments. The processor 32 can also be called a CPU (Central Processing Unit). The processor 32 may be an integrated circuit chip with signal processing capabilities. The processor 32 can also be a general-purpose processor, a digital signal processor (Digital Signal Processor, DSP), an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), a field-programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. In addition, the processor 32 can be implemented by multiple integrated circuit chips.

[0061] Different from the prior art, the present application provides an automatic defoaming device for circuit boards, which can realize unmanned automated operation in the defoaming section of thick copper plates, which not only reduces the operating intensity of personnel, but also improves the defoaming efficiency; in addition, since the vacuum machine and the tunnel oven are connected by a conveyor belt, the automatic guided transport vehicle is avoided from transporting between the vacuum machine and the tunnel oven, further improving the defoaming efficiency.

[0062] Correspondingly, the present application provides a computer-readable storage medium.

[0063] See also Figure 4 , Figure 4 It is a structural schematic diagram of an implementation method of a computer-readable storage medium of the present application.

[0064] like Figure 4 As shown, the computer-readable storage medium 40 includes a computer program 401 stored on the computer-readable storage medium 40. When the computer program 401 is executed by the above-mentioned processor, the steps in any of the above-mentioned embodiments or the steps corresponding to the steps executed by the automatic defoaming device for the circuit board in the above-mentioned embodiments are implemented.

[0065] Specifically, if the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium 40. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, which is stored in a computer-readable storage medium 40, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned computer-readable storage medium 40 includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0066] In the several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other ways. For example, the device implementation described above is only schematic. For example, the division of modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of devices or units can be electrical, mechanical or other forms.

[0067] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0068] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0069] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) or a processor (processor) to perform all or part of the steps of each implementation method of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program code.

[0070] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A circuit board automatic defoaming system, characterized in that: The circuit board automatic defoaming system includes an automatic guided transport vehicle, a feeding conveyor, a conveyor belt, a vacuum pump, a tunnel oven and a feeding conveyor; The vacuum pump is located at one end of the tunnel oven; The feeding conveyor is located at one end of the vacuum pump; The unloading conveyor is located at the other end of the tunnel oven; One end of the conveyor belt is connected to the feeding conveyor, and the other end is connected to the unloading conveyor, and is arranged corresponding to the vacuum pump and the tunnel oven; the conveyor belt is at the same height as the opening and exit of the vacuum pump and the tunnel oven; The automatic guided transport vehicle is used to transport the carrier storing the circuit board to the front of the feeding conveyor, so that the feeding conveyor transfers the carrier to the conveyor belt, and obtains the defoamed circuit board from the unloading conveyor after pre-baking is completed, and transports the defoamed circuit board to the next work section.

2. The circuit board automatic defoaming system according to claim 1, characterized in that: The infeed conveyor and the unloading conveyor include a transfer device, which is used to transfer the carrier from the automatic guided transport vehicle or to the automatic guided transport vehicle.

3. The circuit board automatic defoaming system according to claim 2, characterized in that: The transfer device includes a tray and a multi-axis mechanical arm, and the multi-axis mechanical arm is connected to the bottom of the tray to drive the tray to rise, fall or extend.

4. A method for automatic defoaming of a circuit board, characterized in that: The circuit board automatic defoaming method is implemented by a circuit board automatic defoaming system, which includes an automatic guided transport vehicle, a feeding conveyor, a conveyor belt, a vacuum pump, a tunnel oven and a feeding conveyor; the vacuum pump is located at one end of the tunnel oven; the feeding conveyor is located at one end of the vacuum pump; the conveyor belt is at the same height as the vacuum pump and the opening and exit of the tunnel oven; The unloading conveyor is located at the other end of the tunnel oven; one end of the conveyor belt is connected to the feeding conveyor, and the other end is connected to the unloading conveyor, and is set corresponding to the vacuum pump and the tunnel oven; the circuit board automatic defoaming method includes: The carrier storing the circuit board is transported to the infeed conveyor by the automatic guided transport vehicle, and the carrier is transferred to the conveyor belt by the infeed conveyor; The carrier is transported into the vacuum machine by the conveyor belt, the circuit board on the carrier is vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is transported into the tunnel oven by the conveyor belt, the circuit board is pre-baked by the tunnel oven, and after the pre-baking is completed, the carrier is transported into the unloading conveyor by the conveyor belt; The carrier is transferred to the automatic guided transport vehicle by the unloading conveyor, so that the automatic guided transport vehicle obtains the defoamed circuit board, and the defoamed circuit board is transported to the next work section by the automatic guided transport vehicle.

5. The automatic defoaming method for a circuit board according to claim 4, characterized in that: Before the step of transporting the carrier storing the circuit board to the infeed conveyor by the automatic guided transport vehicle and transferring the carrier to the conveyor belt by the infeed conveyor, the step further includes: The processing parameters of the circuit board on the carrier are obtained by the automatic guided transport vehicle, and the processing parameters are uploaded to the MES system, so that the MES system sends the processing parameters to the feeding conveyor, the conveyor belt, the vacuum machine, the tunnel oven and the unloading conveyor.

6. The automatic defoaming method for a circuit board according to claim 5, characterized in that: The processing parameters include at least one of a conveying speed, a vacuum degree, a vacuuming time, an oven temperature, a baking time, and an oven type.

7. The automatic defoaming method for a circuit board according to claim 6, characterized in that: The number of the tunnel ovens is one or more, and the number of the conveyor belts is one or more; When there are multiple tunnel ovens, the steps of conveying the carrier into the vacuum machine by the conveyor belt, vacuuming the circuit board on the carrier by the vacuum machine, conveying the carrier into the tunnel oven by the conveyor belt after vacuuming, pre-baking the circuit board by the tunnel oven, and conveying the carrier into the unloading conveyor by the conveyor belt after pre-baking specifically include: The carrier is transported into the vacuum machine by the conveyor belt, the circuit board on the carrier is vacuumed by the vacuum machine, and after the vacuuming is completed, the carrier is diverted by multiple conveyor belts according to different processing parameters to transport the carriers with different processing parameters into the corresponding tunnel ovens, the circuit boards are pre-baked by multiple tunnel ovens, and after the pre-baking is completed, the carrier is transported into the unloading conveyor by multiple conveyor belts.

8. An automatic defoaming device for a circuit board, characterized in that: include: A memory for storing program data, wherein the stored program data, when executed, implements the steps of the circuit board automatic defoaming method according to any one of claims 4 to 7; A processor is used to execute the program instructions stored in the memory to implement the steps in the automatic defoaming method for a circuit board as described in any one of claims 4 to 7.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the automatic defoaming method for a circuit board as claimed in any one of claims 4 to 7 are implemented.

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