A temperature measurement method and device

Abstract

An embodiment of the present application provides a temperature measurement method and device. The method includes: obtaining the current working state of an electronic product; determining a current thermal power consumption compensation value corresponding to the current working state according to a preset correspondence between the working state and the thermal power consumption compensation value, where the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained using the thermal power consumption compensation value corresponding to the working state; using the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product; obtaining the current original ambient temperature measured by the electronic product after thermal power consumption compensation; using the preset compensation temperature under the preset thermal power consumption to perform temperature compensation on the current original ambient temperature to obtain the current actual ambient temperature. By applying the technical solution provided by the embodiment of the present application, the accuracy of measuring the actual ambient temperature of an electronic product with multiple functions is improved.

Description

Technical Field

[0001] The present application relates to the field of smart home technology, and in particular to a temperature measurement method and device. Background Art

[0002] Smart home products often require precise indoor temperature measurement. Currently, a common temperature measurement method uses the difference between the original ambient temperature measured by the temperature sensor in the smart home product and the actual ambient temperature as a constant, then applies temperature compensation to the actual temperature measured by the temperature sensor to obtain the actual ambient temperature.

[0003] When the thermal power consumption of a smart home product is constant, the aforementioned temperature measurement method can accurately measure the ambient temperature. However, as smart home products become increasingly versatile, their thermal power consumption varies depending on the function. This difference in thermal power consumption leads to different differences between the raw temperature measured by the temperature sensor and the ambient temperature, making it impossible to accurately measure the actual ambient temperature using the aforementioned method. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a temperature measurement method and device to improve the accuracy of measuring the actual ambient temperature of electronic products with multiple functions. The specific technical solution is as follows:

[0005] In a first aspect, an embodiment of the present application provides a temperature measurement method, the method comprising:

[0006] Get the current working status of electronic products;

[0007] Determining, based on a correspondence between a preset working state and a thermal power consumption compensation value, a current thermal power consumption compensation value corresponding to the current working state, wherein the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state;

[0008] Using the current thermal power consumption compensation value, performing thermal power consumption compensation on the electronic product;

[0009] Obtaining the current original ambient temperature measured by the electronic product after thermal power consumption compensation;

[0010] The current original ambient temperature is temperature compensated using the preset compensation temperature under the preset thermal power consumption to obtain the current actual ambient temperature.

[0011] Optionally, the correspondence between the preset operating states and the thermal power consumption compensation values includes: the correspondence between the preset operating states and the thermal power consumption compensation values of each functional module included in the electronic product. The sum of the original thermal power consumption and the compensated thermal power consumption of each functional module in the operating state is the preset sub-thermal power consumption of the functional module. The compensated thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value of the functional module corresponding to the operating state. The sum of the original thermal power consumption of all the functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption;

[0012] The step of determining the current thermal power consumption compensation value corresponding to the current operating state according to the correspondence between the preset operating states and the thermal power consumption compensation values includes:

[0013] Determining the current thermal power consumption compensation value of each functional module corresponding to the current operating state according to the correspondence between the preset operating states and the thermal power consumption compensation values of each functional module;

[0014] The step of using the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product includes:

[0015] Using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module.

[0016] Optionally, heating components are respectively pre-installed on each functional module, and the thermal power consumption compensation value is a current value;

[0017] The step of using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module includes:

[0018] Powering the heating components pre-installed on each functional module according to the current current value of each functional module.

[0019] Optionally, the heating component is a heating film or a heating resistor.

[0020] Optionally, the thermal power consumption compensation value is the chip operating parameter of the functional module;

[0021] The step of using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module includes:

[0022] Performing thermal power consumption compensation on each functional module according to the current chip operating parameter of each functional module.

[0023] Optionally, the maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.

[0024] Second aspect, embodiments of the present application provide a temperature measurement device, the device comprising:

[0025] A first acquisition unit, configured to acquire the current working state of the electronic product;

[0026] A determination unit, configured to determine a current thermal power consumption compensation value corresponding to the current working state according to a preset correspondence between the working state and the thermal power consumption compensation value, wherein the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is a preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state;

[0027] A first compensation unit, configured to perform thermal power consumption compensation on the electronic product by using the current thermal power consumption compensation value;

[0028] A second acquisition unit, configured to acquire a current original ambient temperature measured by the electronic product after thermal power consumption compensation;

[0029] A second compensation unit, configured to perform temperature compensation on the current original ambient temperature by using a preset compensation temperature under the preset thermal power consumption to obtain a current actual ambient temperature.

[0030] Optionally, the preset correspondence between the working state and the thermal power consumption compensation value includes: a preset correspondence between the working state and the thermal power consumption compensation value of each functional module included in the electronic product, wherein the sum of the original thermal power consumption and the compensated thermal power consumption of each functional module in the working state is a preset sub-thermal power consumption of the functional module, the compensated thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value of the functional module corresponding to the working state, and the sum of the original thermal power consumption of all functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption;

[0031] The determination unit is specifically configured to determine a current thermal power consumption compensation value of each functional module corresponding to the current working state according to a preset correspondence between the working state and the thermal power consumption compensation value of each functional module;

[0032] The first compensation unit is specifically configured to perform thermal power consumption compensation on each functional module by using the current thermal power consumption compensation value of each functional module.

[0033] Optionally, heating components are respectively preset on each functional module, and the thermal power consumption compensation value is a current value;

[0034] The first compensation unit is specifically configured to supply power to the heating components preset on each functional module according to the current value of each functional module.

[0035] Optionally, the heating component is a heating film or a heating resistor.

[0036] Optionally, the thermal power consumption compensation value is the chip operating parameter of the functional module;

[0037] The first compensation unit is specifically configured to perform thermal power consumption compensation on each functional module according to the current chip operating parameter of each functional module.

[0038] Optionally, the maximum compensation thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.

[0039] In a third aspect, an embodiment of the present application provides an electronic product, including a processor and a memory; the memory is used to store a computer program; when the processor executes the program stored on the memory, the steps of the temperature measurement method described in any one of the above are implemented.

[0040] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, in which a computer program is stored, and when the computer program is executed by a processor, the steps of the temperature measurement method described in any one of the above are implemented.

[0041] An embodiment of the present application also provides a computer program, which when running on a computer, causes the computer to execute the temperature measurement method described in any one of the above.

[0042] Advantages of the embodiments of the present application:

[0043] In the technical solution provided by the embodiment of the present application, for an electronic product with multiple working states, different thermal power consumption compensation values are used to perform thermal power consumption compensation on the electronic product in different working states, so that the overall thermal power consumption of the electronic product is a constant preset thermal power consumption. When the overall thermal power consumption of the electronic product is constant, by using a fixed value (i.e., the preset compensation temperature) to perform temperature compensation on the original ambient temperature measured by the electronic product, the actual ambient temperature can be accurately obtained, and the accuracy of the actual ambient temperature measured by the electronic product with multiple functions is improved.

[0044] Of course, it is not necessary for any product or method implementing the present application to achieve all the above advantages simultaneously. Description of the Drawings

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other embodiments can be obtained based on these drawings without creative efforts.

[0046] Figure 1 It is a schematic diagram of compensating temperature in the related technology;

[0047] Figure 2 It is a schematic diagram of compensating temperature by applying the technical solution provided by the embodiment of the present application;

[0048] Figure 3 It is the first flow schematic diagram of the temperature measurement method provided by the embodiment of the present application;

[0049] Figure 4 It is the second flow schematic diagram of the temperature measurement method provided by the embodiment of the present application;

[0050] Figure 5 It is the third flow schematic diagram of the temperature measurement method provided by the embodiment of the present application;

[0051] Figure 6 It is the first structural schematic diagram of the electronic product provided by the embodiment of the present application;

[0052] Figure 7 It is the first structural schematic diagram of the temperature measurement device provided by the embodiment of the present application;

[0053] Figure 8 It is the second structural schematic diagram of the electronic product provided by the embodiment of the present application. Detailed implementation manners

[0054] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art based on the present application belong to the scope of protection of the present application.

[0055] For ease of understanding, the terms that appear in the embodiments of the present application are explained below.

[0056] Thermal power consumption: It refers to the power consumed by the device in the form of heat.

[0057] Thermal power consumption compensation: When the thermal power consumption of the device decreases, increase the thermal power consumption of the compensation module; when the thermal power consumption of the device increases, decrease the thermal power consumption of the compensation module. Make the total thermal power consumption of the device and the compensation module remain stable.

[0058] Currently, smart home products have more and more functions. Different functions correspond to different working states of smart home products. In different working states, the thermal power consumption of smart home products is different. And at different thermal power consumption levels, the original ambient temperature measured by the temperature sensor in the smart home product is different, and thus the difference between the original ambient temperature measured by the temperature sensor and the actual ambient temperature is different. Using a fixed value to perform temperature compensation on the temperature actually measured by the temperature sensor will not be able to accurately measure the actual ambient temperature.

[0059] In addition, when the smart home product switches its working state while the actual ambient temperature remains unchanged, the thermal power consumption will change suddenly, but the temperature will not change suddenly. Instead, it will change gradually over time, and thus the compensation temperature will also change gradually, as Figure 1 shown. In this case, in order to accurately measure the actual ambient temperature, based on the above method of using a fixed value to perform temperature compensation on the temperature actually measured by the temperature sensor, it is necessary to test the difference between the original ambient temperature measured by the temperature sensor and the actual ambient temperature at different times during the working state switching process. This leads to an increase in the complexity of temperature measurement. Considering the change of the actual ambient temperature, it will further increase the complexity of temperature measurement.

[0060] Moreover, as smart home products have more and more functions, the temperature change curve caused by working state switching becomes more and more complex. Using the method of testing the difference between the original ambient temperature measured by the temperature sensor and the actual ambient temperature at different times during the working state switching process cannot cover the complex usage scenarios of smart home products. This poses a huge challenge to the difficulty and complexity of temperature measurement.

[0061] To solve the above problems, the embodiments of the present application provide a temperature measurement method, which can be applied to an electronic product with a temperature sensor or a controller connected to the electronic product. The electronic product can be the above-mentioned smart home product or other electronic products with a temperature sensor. The controller can be an independent physical machine or integrated on the electronic product. For the sake of understanding, the following will be described with the controller as the execution subject, which is not intended to be limiting.

[0062] In this temperature measurement method, for an electronic product with multiple working states, the controller uses different thermal power consumption compensation values to perform thermal power consumption compensation on the electronic product in different working states, so that the overall thermal power consumption of the electronic product is a constant preset thermal power consumption. When the overall thermal power consumption of the electronic product is constant, the relationships among the original ambient temperature, compensation temperature, actual ambient temperature, and thermal power consumption measured by the electronic product are as Figure 2As shown in the figure. At this time, the controller uses a fixed value (i.e., the preset compensation temperature) to perform temperature compensation on the original ambient temperature measured by the electronic product, and the actual ambient temperature can be accurately obtained, improving the accuracy of the actual ambient temperature measured by the electronic product with multiple functions.

[0063] In addition, in this temperature measurement method, as long as the overall thermal power consumption state of the electronic product is constant, and then a fixed value is used to perform temperature compensation on the original ambient temperature measured by the electronic product, the actual ambient temperature can be accurately obtained. This method is simple to operate, without considering the accumulation of temperature over time, greatly reducing the difficulty of temperature compensation, significantly reducing the workload of the test temperature and the temperature compensation algorithm, and there is no error accumulated over time during the working state switching.

[0064] In addition, the fixed value for temperature compensation does not change with time and the working state of the electronic product, making it easy to control the accuracy of this fixed value and can cover various usage scenarios of the electronic product. Further improving the accuracy of the actual ambient temperature measured by the electronic product with multiple functions.

[0065] The following will detail the temperature measurement method provided by the embodiments of the present application through specific embodiments.

[0066] See Figure 3 , Figure 3 which is the first flow diagram of the temperature measurement method provided by the embodiments of the present application. The method includes the following steps:

[0067] Step S31, obtain the current working state of the electronic product.

[0068] The electronic product can have one or more working states. For example, the working states can include but are not limited to: normal working state, sleep state, and semi-sleep state, etc. In different working states, the signals fed back by the electronic product are different. In the embodiments of the present application, different feedback signals can be used to represent different working states of the electronic product.

[0069] In the embodiments of the present application, the controller can periodically obtain the current working state of the electronic product. The controller can also obtain the current working state of the electronic product according to the temperature measurement instruction after receiving the user input. There is no limitation on this.

[0070] Step S32, determine the current thermal power consumption compensation value corresponding to the current working state according to the preset corresponding relationship between the working state and the thermal power consumption compensation value.

[0071] Among them, the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in a working state is the preset thermal power consumption. The compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state. For the convenience of operation, the above-mentioned preset thermal power consumption is greater than or equal to the maximum thermal power consumption of the electronic product. When different feedback signals are used to represent different working states of the electronic product, corresponding adjustment signals can be used to represent the corresponding thermal power consumption compensation values.

[0072] In the embodiment of the present application, the controller presets the correspondence between the working state and the thermal power consumption compensation value. After obtaining the current working state of the electronic product, the correspondence including the current working state is searched from the preset correspondence between the working state and the thermal power consumption compensation value. After finding the correspondence including the current working state, the controller uses the thermal power consumption compensation value included in the correspondence as the current thermal power consumption compensation value.

[0073] Step S33: Use the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product.

[0074] After obtaining the current thermal power consumption compensation value, the controller uses the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product. The overall thermal power consumption of the electronic product after thermal power consumption compensation is the above-mentioned preset thermal power consumption.

[0075] Step S34: Obtain the current original ambient temperature measured by the electronic product after thermal power consumption compensation.

[0076] In the embodiment of the present application, the electronic product includes a temperature sensor. After the controller performs thermal power consumption compensation on the electronic product, the temperature sensor included in the electronic product in the current working state measures the ambient temperature as the current original ambient temperature, and transmits the current original ambient temperature to the controller. Furthermore, the controller obtains the current original ambient temperature measured by the electronic product after thermal power consumption compensation.

[0077] Step S35: Use the preset compensation temperature under the preset thermal power consumption to perform temperature compensation on the current original ambient temperature to obtain the current actual ambient temperature.

[0078] In the embodiment of the present application, the controller has previously measured the difference between the original ambient temperature and the actual ambient temperature measured by the electronic product under the preset thermal power consumption, that is, the preset compensation temperature. The controller uses the preset compensation temperature under the preset thermal power consumption to perform temperature compensation on the current original ambient temperature to obtain the current actual ambient temperature.

[0079] For example, the preset compensation temperature is -5°C, and the current original ambient temperature is 20°C. The controller uses the preset compensation temperature to perform temperature compensation on the current original ambient temperature, and the obtained current actual ambient temperature is: 20 + (-5) = 15°C.

[0080] Applying the above embodiments for temperature measurement improves the accuracy of the actual ambient temperature measured by electronic products with multiple functions, and at the same time reduces the complexity of the temperature measurement operation.

[0081] In the embodiments of the present application, the electronic product can be regarded as a whole, that is, the thermal power consumption compensation value in the above preset corresponding relationship is the thermal power consumption compensation value for the whole electronic product. This implementation method is simple.

[0082] However, an electronic product includes multiple functional modules. Different functional modules have different functions and different spatial positions in the electronic product. Moreover, the spatial positions of the same functional module in different electronic products are also completely different. The different functions and spatial positions of the functional modules will also have different impacts on the thermal power consumption of the electronic product.

[0083] In order to improve the applicability of the temperature measurement method provided by the embodiments of the present application and further improve the accuracy of the actual ambient temperature measured by electronic products with multiple functions, in an embodiment of the present application, the above preset corresponding relationship between the working state and the thermal power consumption compensation value may include: the preset corresponding relationship between the working state and the thermal power consumption compensation value of each functional module included in the electronic product. Wherein, the sum value of the original thermal power consumption and the compensation thermal power consumption of each functional module under a working state is the preset sub-thermal power consumption of the functional module, and the compensation thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value of the functional module corresponding to the working state. The sum value of the original thermal power consumption of all functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption.

[0084] For example, the electronic product includes functional modules A, B, and C. The working states of the electronic product include working state G1 and working state G2. At this time, the preset corresponding relationship between the working state and the thermal power consumption compensation value of each functional module included in the electronic product in the controller is shown in Table 1.

[0085] Table 1

[0086] Functional Module A Functional Module B Functional Module C <![CDATA[Working state G1]]> <![CDATA[Thermal power consumption compensation value A1]]> <![CDATA[Thermal power consumption compensation value B1]]> <![CDATA[Thermal power consumption compensation value C1]]> <![CDATA[Working state G2]]> <![CDATA[Thermal power consumption compensation value A2]]> <![CDATA[Thermal power consumption compensation value B2]]> <![CDATA[Thermal power consumption compensation value C2]]>

[0087] In an example, for each functional module, the maximum compensation thermal power consumption of the functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module. It can be understood that the maximum value of the adjustable compensation thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module, so as to facilitate the adjustment of the thermal power consumption compensation value.

[0088] Based on the above preset corresponding relationship between the working state and the thermal power consumption compensation value of each functional module included in the electronic product, the embodiments of the present application provide another temperature measurement method, as Figure 4As shown, in this method, step S32 can be refined into step S321, and step S33 can be refined into step S331.

[0089] Step S321: Determine the current thermal power consumption compensation value of each functional module corresponding to the current working state according to the corresponding relationship between the preset working state and the thermal power consumption compensation value of each functional module.

[0090] In the embodiment of the present application, after obtaining the current working state of the electronic product, the controller searches for the corresponding relationship including the current working state from the corresponding relationship between the preset working state and the thermal power consumption compensation value of each functional module. After finding the corresponding relationship including the current working state, the controller uses the thermal power consumption compensation value of each functional module included in the corresponding relationship as the current thermal power consumption compensation value of the functional module.

[0091] Taking Table 1 above as an example for illustration. When the current working state is G1, the controller can determine that the current thermal power consumption compensation value of functional module A is A1, the current thermal power consumption compensation value of functional module B is B1, and the current thermal power consumption compensation value of functional module C is C1 based on the working state G1 and Table 1.

[0092] Step S331: Use the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module.

[0093] Still taking the example in step S321 above for illustration. The controller determines that the current thermal power consumption compensation value of functional module A is A1, the current thermal power consumption compensation value of functional module B is B1, and the current thermal power consumption compensation value of functional module C is C1. The controller uses the thermal power consumption compensation value A1 to perform thermal power consumption compensation on functional module A. The controller uses the thermal power consumption compensation value B1 to perform thermal power consumption compensation on functional module B. The controller uses the thermal power consumption compensation value C1 to perform thermal power consumption compensation on functional module C.

[0094] In the technical solution provided by the embodiment of the present application, for different functional modules, the controller respectively sets the corresponding relationship between the working state and the thermal power consumption compensation value. Furthermore, for the electronic product in different working states, thermal power consumption compensation is respectively performed on each functional module, which can effectively solve the influence brought by the differences in the functions and spatial positions of the functional modules, further improve the accuracy of measuring the actual environmental temperature of the electronic product with multiple functions, and enhance the applicability of the technical solution provided by the embodiment of the present application.

[0095] In an embodiment of the present application, a heating component may be preset on each functional module. This heating component is the compensation module. The heating component may be a component with a heating function such as a heating film or a heating resistor. When a heating component is preset on the functional module, the thermal power consumption compensation value may adopt a current value, and the current thermal power consumption compensation value is the current value.

[0096] Based on this, the above step S331 may specifically be: power the heating components preset on each functional module according to the current value of each functional module.

[0097] In the embodiment of the present application, after determining the current thermal power consumption compensation value of each functional module, that is, the current value of each functional module, for each functional module, the controller powers the preset heating component on the functional module according to the current value of the functional module.

[0098] For example, the functional module is a Wireless Fidelity (WiFi) module. The working states of the WiFi module include a network configuration and network search state, a sleep and keep-alive state, a normal network connection and data output state, and a high-speed download state. The original thermal power consumption of the WiFi module in the network configuration and network search state is P1, the original thermal power consumption of the WiFi module in the sleep and keep-alive state is P2, the original thermal power consumption of the WiFi module in the normal network connection and data output state is P3, and the original thermal power consumption of the WiFi module in the high-speed download state is P4. Among them, P1 < P2 < P3 < P4. The preset sub-thermal power consumption of the WiFi module is P4.

[0099] At this time, in the network configuration and network search state, the compensated thermal power consumption of the WiFi module is P4 - P1, and the thermal power consumption compensation value (i.e., the current value) is (P4 - P1) / U; in the sleep and keep-alive state, the compensated thermal power consumption of the WiFi module is P4 - P2, and the thermal power consumption compensation value (i.e., the current value) is (P4 - P2) / U; in the normal network connection and data output state, the compensated thermal power consumption of the WiFi module is P4 - P3, and the thermal power consumption compensation value (i.e., the current value) is (P4 - P3) / U; in the high-speed download state, the compensated thermal power consumption of the WiFi module is 0, and the thermal power consumption compensation value (i.e., the current value) is 0. Among them, U represents the working voltage of the WiFi module.

[0100] When it is determined that the current working state is the power grid search state, the controller supplies power to the pre-set heating component on the WiFi module according to the current value (P4 - P1) / U. When it is determined that the current working state is the sleep and keep-alive state, the controller supplies power to the pre-set heating component on the WiFi module according to the current value (P4 - P2) / U. When it is determined that the current working state is the normal network connection and current output state, the controller supplies power to the pre-set heating component on the WiFi module according to the current value (P4 - P3) / U. When it is determined that the current working state is the high-speed download state, the controller supplies power to the pre-set heating component on the WiFi module according to the current value 0.

[0101] In the embodiment of the present application, the controller identifies the working state of the electronic product and controls the input current of the pre-set heating component on the functional module in each working state, which can ensure the stability of the total thermal power consumption of the functional module, and further ensure the stability of the influence of the functional module on the temperature sensor, improving the accuracy of measuring the actual ambient temperature of the electronic product with multiple functions.

[0102] In an embodiment of the present application, the thermal power consumption compensation value is the chip working parameter of the functional module, and the current thermal power consumption compensation value is the current chip working parameter of the functional module.

[0103] Based on this, the above step S331 can specifically be: performing thermal power consumption compensation on each functional module according to the current chip working parameter of each functional module.

[0104] In the embodiment of the present application, after determining the current thermal power consumption compensation value of each functional module, that is, the current chip working parameter of each functional module, for each functional module, the controller adjusts the chip of the functional module according to the current chip working parameter of the functional module, so that the chip working parameter of the functional module is updated to the current chip working parameter. The total thermal power consumption of the functional module in the current chip working parameter is the preset sub-thermal power consumption.

[0105] For example, the preset sub-thermal power consumption of the above WiFi module is P4. After performing thermal power consumption compensation on the WiFi module according to the current chip working parameter of the WiFi module, the preset sub-thermal power consumption of the WiFi module reaches P4.

[0106] In the embodiment of the present application, the controller can also use other methods to perform thermal power consumption compensation on each functional module. This is not limited.

[0107] The following combines Figure 5 and Figure 6 The flow schematic diagram of the temperature measurement method shown to detail the temperature measurement method provided by the embodiment of the present application.

[0108] Figure 5 In the temperature measurement method shown:

[0109] Step S51: Determine the functional modules included in the electronic product according to functions and spatial positions.

[0110] Specifically, the electronic product includes multiple devices that affect temperature measurement. These devices form a set of influence sources. According to the functions and spatial positions of the devices in the set of influence sources, each device in the set of influence sources is defined as a different functional module.

[0111] Step S52: Preset thermal power consumption compensation measures for each functional module.

[0112] Specifically, a heating film or a heating resistor is preset on each functional module respectively, or chip operating parameters for thermal power consumption compensation are configured for each functional module.

[0113] Step S53: Test the original thermal power consumption of each functional module under different operating states.

[0114] Here, under different operating states, each functional module should have a corresponding feedback signal, which can be denoted as feedback signal a.

[0115] Step S54: Perform thermal power consumption compensation for each functional module under different operating states.

[0116] After thermal power consumption compensation, for each functional module, the total thermal power consumption of the functional module under different operating states is a stable value. Among them, the signal for adjusting the compensation thermal power consumption can be denoted as adjustment signal b.

[0117] Step S55: Establish a one-to-one mapping relationship between feedback signal a and adjustment signal b. That is, establish a correspondence between the operating state and the thermal power consumption compensation value.

[0118] In the embodiment of the present application, when the operating state of the electronic product changes, each functional module will generate a corresponding feedback signal a. Then, based on the mapping relationship in the above step S55, the corresponding adjustment signal b for each functional module is obtained. The adjustment signal b of each functional module is used to perform thermal power consumption compensation on the functional module, so that the heating state of the electronic product is stable, the original ambient temperature measured by the temperature sensor is stable, and the difference between the original ambient temperature measured by the temperature sensor and the actual ambient temperature is a fixed value. The controller can quickly and accurately measure the actual ambient temperature using this fixed value.

[0119] Figure 6 In the example, it is only illustrated by taking the set of influence sources in the electronic product including three functional modules, namely functional module 1, functional module 2, and functional module 3, which is not restrictive.

[0120] Figure 6Among them, the working states of functional module 1, functional module 2, and functional module 3 are monitored. When it is detected that the working state of a functional module changes, that is, when it is detected that the thermal power consumption of the functional module changes, thermal power consumption compensation is performed on the functional module. For the specific method of thermal power consumption compensation, refer to the description in the above Figure 3-4 section, which will not be elaborated here.

[0121] By performing thermal power consumption compensation on the functional module, the influence of all functional modules on temperature is made a fixed value. Using the fixed value of the influence of all functional modules on temperature, the original ambient temperature measured by the temperature sensor is temperature-compensated to obtain the actual ambient temperature.

[0122] Based on the above temperature measurement method, an embodiment of the present application further provides a temperature measurement device, as Figure 7 shown. The device includes:

[0123] A first acquisition unit 71, configured to acquire the current working state of the electronic product;

[0124] A determination unit 72, configured to determine the current thermal power consumption compensation value corresponding to the current working state according to the preset correspondence between the working state and the thermal power consumption compensation value. The sum of the original thermal power consumption and the compensation thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensation thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state;

[0125] A first compensation unit 73, configured to perform thermal power consumption compensation on the electronic product by using the current thermal power consumption compensation value;

[0126] A second acquisition unit 74, configured to acquire the current original ambient temperature measured by the electronic product after thermal power consumption compensation;

[0127] A second compensation unit 75, configured to perform temperature compensation on the current original ambient temperature by using the preset compensation temperature under the preset thermal power consumption to obtain the current actual ambient temperature.

[0128] In an optional embodiment, the preset correspondence between the working state and the thermal power consumption compensation value includes: the preset correspondence between the working state and the thermal power consumption compensation value of each functional module included in the electronic product. The sum of the original thermal power consumption and the compensation thermal power consumption of each functional module in the working state is the preset sub-thermal power consumption of the functional module. The compensation thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value corresponding to the working state of the functional module. The sum of the original thermal power consumption of all functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption;

[0129] A determination unit 72, which can be specifically used to determine the current thermal power consumption compensation value of each functional module according to the corresponding relationship between the preset working state and the thermal power consumption compensation value of each functional module.

[0130] A first compensation unit 73, which can be specifically used to perform thermal power consumption compensation on each functional module by using the current thermal power consumption compensation value of each functional module.

[0131] In an optional embodiment, heating components are respectively preset on each functional module, and the thermal power consumption compensation value is a current value.

[0132] The first compensation unit 73 can be specifically used to supply power to the heating components preset on each functional module according to the current value of each functional module.

[0133] In an optional embodiment, the heating component can be a heating film or a heating resistor.

[0134] In an optional embodiment, the thermal power consumption compensation value can be the chip working parameter of the functional module.

[0135] The first compensation unit 73 can be specifically used to perform thermal power consumption compensation on each functional module according to the current chip working parameter of each functional module.

[0136] In an optional embodiment, the maximum compensation thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.

[0137] In the technical solution provided by the embodiment of the present application, for an electronic product with multiple working states, different thermal power consumption compensation values are used to perform thermal power consumption compensation on the electronic product in different working states, so that the overall thermal power consumption of the electronic product is a constant preset thermal power consumption. When the overall thermal power of the electronic product is constant, by using a fixed value (i.e., the preset compensation temperature) to perform temperature compensation on the original ambient temperature measured by the electronic product, the actual ambient temperature can be accurately obtained, and the accuracy of measuring the actual ambient temperature of the electronic product with multiple functions is improved.

[0138] Based on the above temperature measurement method, the embodiment of the present application further provides an electronic product, as Figure 8 shown, including a processor 81, a memory 82, and a temperature sensor 83; the memory 82 is used to store a computer program; the temperature sensor 83 is used to measure the original ambient temperature; the processor 81 is used to implement the steps of the above-mentioned temperature measurement method when executing the program stored on the memory 82.

[0139] The memory may include a Random Access Memory (RAM), or may also include a Non-Volatile Memory (NVM), such as at least one disk memory. Optionally, the memory may also be at least one storage device located far from the aforementioned processor.

[0140] The processor may be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0141] In another embodiment provided by the present application, there is also provided a computer-readable storage medium, in which a computer program is stored, and when the computer program is executed by a processor, the steps of the temperature measurement method described in any one of the above are implemented.

[0142] In another embodiment provided by the present application, there is also provided a computer program, which when running on a computer causes the computer to execute the steps of the temperature measurement method described in any one of the above.

[0143] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the processes or functions described in the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from a website, computer, server, or data center to another website, computer, server, or data center by wire (such as coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (such as a floppy disk, hard disk, magnetic tape), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state drive (SSD)).

[0144] It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including", or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or device that includes a series of elements includes not only those elements but also other elements that are not explicitly listed, or further includes elements that are inherent to such process, method, article, or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article, or device that includes the element.

[0145] Each embodiment in this specification is described in a related manner. The same or similar parts between the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for the embodiments of the temperature measurement device, electronic product, computer-readable storage medium, and computer program, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiments.

[0146] The above are only the preferred embodiments of the present application and are not intended to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application are all included in the protection scope of the present application.

Claims

1. A temperature measurement method, characterized in that, The method includes: Obtaining the current working state of the electronic product; Determining the current thermal power consumption compensation value corresponding to the current working state according to the preset corresponding relationship between the working state and the thermal power consumption compensation value, where the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is the preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state; Using the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product; Obtaining the current original ambient temperature measured by the electronic product after thermal power consumption compensation; Using the preset compensation temperature under the preset thermal power consumption to perform temperature compensation on the current original ambient temperature to obtain the current actual ambient temperature.

2. The method according to claim 1, characterized in that The preset corresponding relationship between the working state and the thermal power consumption compensation value includes: the preset corresponding relationship between the working state and the thermal power consumption compensation value of each functional module included in the electronic product, where the sum of the original thermal power consumption and the compensated thermal power consumption of each functional module in the working state is the preset sub-thermal power consumption of the functional module, and the compensated thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value of the functional module corresponding to the working state, and the sum of the original thermal power consumption of all functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption; The step of determining the current thermal power consumption compensation value corresponding to the current working state according to the preset corresponding relationship between the working state and the thermal power consumption compensation value includes: Determining the current thermal power consumption compensation value of each functional module corresponding to the current working state according to the preset corresponding relationship between the working state and the thermal power consumption compensation value of each functional module; The step of using the current thermal power consumption compensation value to perform thermal power consumption compensation on the electronic product includes: Using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module.

3. The method according to claim 2, characterized in that Heating components are respectively preset on each functional module, and the thermal power consumption compensation value is a current value; The step of using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module includes: Powering the heating components preset on each functional module according to the current value of each functional module.

4. The method according to claim 3, wherein The heating component is a heating film or a heating resistor.

5. The method according to claim 2, wherein The thermal power consumption compensation value is the chip working parameter of the functional module; The step of using the current thermal power consumption compensation value of each functional module to perform thermal power consumption compensation on each functional module includes: Performing thermal power consumption compensation on each functional module according to the current chip working parameter of each functional module.

6. The method according to any one of claims 1-5, characterized in that, The maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.

7. A temperature measuring device, characterized in that, The device includes: A first acquisition unit for acquiring the current working state of the electronic product; A determination unit, configured to determine a current thermal power consumption compensation value corresponding to the current working state according to a preset correspondence between the working state and the thermal power consumption compensation value, where the sum of the original thermal power consumption and the compensated thermal power consumption of the electronic product in the working state is a preset thermal power consumption, and the compensated thermal power consumption of the electronic product is the thermal power consumption of the electronic product obtained by using the thermal power consumption compensation value corresponding to the working state; A first compensation unit, configured to perform thermal power consumption compensation on the electronic product by using the current thermal power consumption compensation value; A second acquisition unit, configured to acquire a current original ambient temperature measured by the electronic product after thermal power consumption compensation; A second compensation unit, configured to perform temperature compensation on the current original ambient temperature by using a preset compensation temperature under the preset thermal power consumption to obtain a current actual ambient temperature.

8. The device according to claim 7, wherein The preset correspondence between the working state and the thermal power consumption compensation value includes: the preset correspondence between the working state and the thermal power consumption compensation value of each functional module included in the electronic product, where the sum of the original thermal power consumption and the compensated thermal power consumption of each functional module in the working state is a preset sub-thermal power consumption of the functional module, and the compensated thermal power consumption of each functional module is the thermal power consumption of the functional module obtained by using the thermal power consumption compensation value of the functional module corresponding to the working state, and the sum of the original thermal power consumption of all functional modules included in the electronic product and the preset sub-thermal power consumption is the preset thermal power consumption; The determination unit is specifically configured to determine a current thermal power consumption compensation value of each functional module corresponding to the current working state according to the preset correspondence between the working state and the thermal power consumption compensation value of each functional module; The first compensation unit is specifically configured to perform thermal power consumption compensation on each functional module by using the current thermal power consumption compensation value of each functional module.

9. The device according to claim 8, characterized in that, A heating component is preset on each functional module, and the thermal power consumption compensation value is a current value; The first compensation unit is specifically configured to supply power to the heating component preset on each functional module according to the current value of each functional module.

10. The device according to claim 9, characterized in that, The heating component is a heating film or a heating resistor.

11. The device according to claim 8, characterized in that, The thermal power consumption compensation value is a chip operating parameter of the functional module; The first compensation unit is specifically configured to perform thermal power consumption compensation on each functional module according to the current chip operating parameter of each functional module.

12. The device according to any one of claims 7 to 11, characterized in that, The maximum compensated thermal power consumption of each functional module is greater than or equal to the difference between the maximum thermal power consumption and the minimum thermal power consumption of the functional module.

13. An electronic product, characterized in that, It includes a processor and a memory; the memory is used to store a computer program; when the processor executes the program stored on the memory, it implements the method steps described in any one of claims 1-6.

14. A computer-readable storage medium, characterized in that, A computer program is stored in the computer-readable storage medium, and when the computer program is executed by the processor, it implements the method steps described in any one of claims 1-6.

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