Method, system, electronic device and storage medium for designing a micro-modified steel mesh

Abstract

The present invention relates to a method, system, electronic device, and storage medium for designing a slightly modified stencil. The method comprises: obtaining data A of a PCB board to be designed for the stencil and data B of a PCB board for which the stencil design has been completed, and classifying solder paste printing layer graphic data a / b in data A and data B according to package names; performing an exclusive-OR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine first identical graphic data and different graphic data; if it is a slightly modified version, obtaining fifth stencil opening layer graphic data a based on the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a / b, and the stencil opening layer graphic data b; determining whether the stencil opening layer graphic data b is step-covered, and assigning a thickness to the stencil opening layer graphic data a based on the coverage condition, thereby completing the stencil design of the PCB board to be designed for the stencil. The design method of the present invention shortens stencil design time and improves stencil design quality.

Description

Technical Field

[0001] The present invention belongs to the field of electronic manufacturing technology, and in particular relates to a method, system, electronic equipment and storage medium for designing a micro-modified steel mesh. Background Art

[0002] The rapid development of the electronics manufacturing industry has led to the increasing application of highly integrated, high-density electronic products. The speed of electronic product updates is also accelerating. In many cases, the circuit board data used is similar. For example, during the product design process, a completed PCB (Printed Circuit Board) may be found to have many problems, such as unreasonable wiring, errors, or the addition of new functions. However, these changes are minimal compared to the original PCB, requiring only local adjustments. This requires the PCB to be remade, commonly known as a PCB minor revision. After the PCB is modified, the stencil must also be redesigned.

[0003] During the steel mesh design process, due to different processes and different demand scenarios, it is necessary to design the steel mesh opening that meets the requirements according to the actual situation. The current method commonly used in the industry is for engineers to manually redesign the steel mesh opening. This method will cause the following problems:

[0004] 1. It is time-consuming and requires manual redesign of each opening.

[0005] 2. The redesigned opening pattern cannot guarantee whether it meets the process requirements.

[0006] 3. There may be data leakage design issues, which cannot fully guarantee the integrity of the data. Summary of the Invention

[0007] In order to solve the above problems existing in the prior art, the present invention provides a method, system, electronic device and storage medium for designing a micro-modified steel mesh. The technical problem to be solved by the present invention is achieved through the following technical solutions:

[0008] The present invention provides a method for designing a slightly modified steel mesh, comprising:

[0009] Step 1: Obtain data A of the PCB board to be designed with the stencil and data B of the completed stencil design, wherein the data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and the data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b;

[0010] Step 2: Classify the solder paste printing layer graphic data b containing the device name and pin information and the solder paste printing layer graphic data a according to the package name;

[0011] Step 3: performing an XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine first identical graphic data and different graphic data;

[0012] Step 4: Determine whether the PCB board to be designed with the stencil is a slightly revised version. If it is a slightly revised version, obtain fifth stencil opening layer graphic data a based on the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b;

[0013] Step 5, determine whether the steel mesh opening layer graphic data b is covered by the steps. If so, perform XOR analysis on the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained in step 4 to obtain fifth identical graphic data. Compare the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the steps to complete the steel mesh design of the PCB board to be designed with the steel mesh.

[0014] The present invention provides a system for slightly modified steel mesh design, comprising:

[0015] An acquisition module is used to acquire data A of a PCB board to be designed with a stencil and data B of a completed stencil design, wherein the data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and the data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b;

[0016] A classification module, configured to classify the solder paste printing layer graphic data b containing the device name and pin information and the solder paste printing layer graphic data a according to the package name;

[0017] a pattern determination module, configured to perform an XOR analysis on the solder paste printing layer pattern data a and the solder paste printing layer pattern data b to determine first identical pattern data and different pattern data;

[0018] a slightly revised version judgment module, configured to judge whether the PCB board to be designed with the stencil is a slightly revised version; if it is a slightly revised version, obtaining fifth stencil opening layer graphic data a according to the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b;

[0019] The step judgment module is used to judge whether the steel mesh opening layer graphic data b is covered by the step. If so, the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained by the micro-revised version judgment module are subjected to XOR analysis to obtain fifth identical graphic data, and the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the step are compared to complete the steel mesh design of the PCB board to be designed by the steel mesh.

[0020] The present invention provides an electronic device, including a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus; the memory is used to store a computer program; and the processor is used to implement any of the method steps described above when executing the computer program.

[0021] The present invention provides a storage medium, wherein the storage medium stores a computer program, and when the computer program is executed by a processor, any of the method steps described above is implemented.

[0022] Beneficial effects of the present invention:

[0023] The method for designing a micro-modified steel mesh provided by the present invention can greatly reduce the opening time, reduce the need for opening redesign, avoid manual omissions in designing openings, avoid repeated modifications caused by the designed openings not meeting process requirements, etc., greatly shorten the steel mesh design time, and improve the steel mesh design quality.

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 1 is a flow chart of a method for designing a slightly modified steel mesh provided by an embodiment of the present invention;

[0026] Figure 2 1 is a flow chart of another method for designing a slightly modified steel mesh provided by an embodiment of the present invention;

[0027] Figure 3 This is a schematic diagram of a PCB design file read into a system core data module according to an embodiment of the present invention;

[0028] Figure 4 Schematic diagram of a PCB board (B) with a completed steel mesh design provided by an embodiment of the present invention;

[0029] Figure 5 Schematic diagram of graphic data of a steel mesh opening layer of a PCB board (B) provided in an embodiment of the present invention;

[0030] Figure 6Schematic diagram of solder paste printing layer graphic data of a PCB board (B) provided in an embodiment of the present invention;

[0031] Figure 7 Schematic diagram of a PCB board (A) to be designed with a steel mesh provided in an embodiment of the present invention;

[0032] Figure 8 This is a schematic diagram of solder paste printing layer graphic data provided by an embodiment of the present invention;

[0033] Figure 9a and Figure 9b This is a schematic diagram of grouping results according to package names provided by an embodiment of the present invention;

[0034] Figure 10 is a schematic diagram of a method for distinguishing identical graphic data provided by an embodiment of the present invention;

[0035] Figure 11 is a schematic diagram of a method for distinguishing different graphic data provided by an embodiment of the present invention;

[0036] Figure 12 1 is a schematic diagram of identical graphic data marked on the SP layer of a PCB board (B) provided by an embodiment of the present invention;

[0037] Figure 13 This embodiment of the present invention provides a Figure 12 A schematic diagram of SA layer graphic data where the graphic data in the image intersects;

[0038] Figure 14 Schematic diagram of copying a new opening pattern to the SA layer of a PCB board (A) according to an embodiment of the present invention;

[0039] Figure 15 The SA layer graphic data of a PCB board (A) provided by the embodiment of the present invention is based on Figure 14 Updated result diagram;

[0040] Figure 16 Schematic diagram of copying an SA layer graphic to a corresponding position of the SA layer of a PCB board (A) when processing different graphic data, provided by an embodiment of the present invention;

[0041] Figure 17 The SA layer graphic data of a PCB board (A) provided by the embodiment of the present invention is based on Figure 16 Updated result diagram;

[0042] Figure 18 is a schematic diagram of SA layer graphic data covered by steps provided by an embodiment of the present invention;

[0043] Figure 19Schematic diagram of the result of replicating a staircase pattern onto a PCB board (A) provided by an embodiment of the present invention;

[0044] Figure 20 1 is a schematic diagram of the result of SA layer graphic data of a final PCB board (A) provided by an embodiment of the present invention;

[0045] Figure 21 Schematic diagram of a system for slightly modified steel mesh design provided by an embodiment of the present invention;

[0046] Figure 22 It is a structural diagram of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0047] The present invention will be further described in detail below with reference to specific examples, but the embodiments of the present invention are not limited thereto.

[0048] Example 1

[0049] See Figure 1 and Figure 2 , Figure 1 This is a flow chart of a method for designing a slightly modified steel mesh provided by an embodiment of the present invention. Figure 2 1 is a flow chart of another method for designing a slightly modified steel mesh provided by an embodiment of the present invention. This embodiment provides a method for designing a slightly modified steel mesh. The method for designing a slightly modified steel mesh may include:

[0050] Step 1. Obtain data A of the PCB board to be designed with the stencil and data B of the PCB board for which the stencil design has been completed, wherein data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b.

[0051] Specifically, the solder paste printing layer graphic data a and the steel mesh opening layer graphic data a are graphic data obtained from the SP (Solder Paste layer, solder paste printing layer) layer and SA (Stencil Aperture layer, steel mesh opening layer) layer of the PCB board to be designed with the steel mesh, respectively (there is no graphic data in the steel mesh opening layer graphic data a initially), and data A also includes the step layer graphic data a (there is no graphic data in the step layer initially), wherein the solder paste printing layer graphic data a includes: device name, device coordinate data, device package data, pin information, etc.; the solder paste printing layer graphic data b and the steel mesh opening layer graphic data b are graphic data obtained from the SP layer and SA layer of the PCB board whose steel mesh design has been completed, respectively, and data B also includes the step layer graphic data b, wherein the steel mesh opening layer graphic data b includes: thickness information.

[0052] Step 2: Classify the solder paste printing layer graphic data b and the solder paste printing layer graphic data a, which already contain the device name and pin information, according to the package name.

[0053] Specifically, in order to facilitate the subsequent processing of the slightly modified steel mesh design, the solder paste printing layer graphic data b and the solder paste printing layer graphic data a are classified according to the package name, so as to group the graphic data with the same package name.

[0054] In this embodiment, step 2 can be implemented through steps 2.1 to 2.2, wherein:

[0055] Step 2.1: Determine whether the solder paste printing layer graphic data b contains the device name and pin information. If not, perform an XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to find the same graphic data, and assign the device name and pin information corresponding to the same graphic data found in the solder paste printing layer graphic data a to the solder paste printing layer graphic data b, and then execute step 2.2. If it does, execute step 2.2 directly.

[0056] Step 2.2: Classify the solder paste printing layer graphic data a and the solder paste printing layer graphic data b processed in step 2.1 according to the package name.

[0057] Step 3: Perform an XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine first identical graphic data and different graphic data.

[0058] Specifically, by performing XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b, it is possible to determine which graphic data between the solder paste printing layer graphic data a and the solder paste printing layer graphic data b are the same graphic data and which graphic data are different graphic data. Only on this basis can the design steps of the micro-modified steel mesh be carried out.

[0059] In this embodiment, step 3 can be implemented by the following steps, specifically:

[0060] Performing an exclusive OR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the solder paste printing layer graphic data b is within a preset range;

[0061] If they are within the preset range, then continue to compare whether the package names of the solder paste printing layer graphic data a and the solder paste printing layer graphic data b are the same. If the package names are the same, then mark them as the first identical graphic data; if the package names are different, then mark them as different graphic data;

[0062] If it is not within the preset range, it is marked as different graphic data.

[0063] Among them, the difference area percentage is: the area of the difference part / the area of c1. Take a certain graphic data a1 in the solder paste printing layer graphic data a, and a certain graphic data b1 in the solder paste printing layer graphic data b. The area of the difference part is the area of the difference part between the graphic data a1 and the graphic data b1. The area of c1 is: compare the area sizes of graphic data a1 and graphic data b1, and take the graphic data with a smaller area as c1.

[0064] Optionally, the preset range is 5%.

[0065] Step 4: Determine whether the PCB board to be designed for the steel mesh is a slightly revised version. If it is a slightly revised version, obtain the fifth steel mesh opening layer graphic data a based on the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the steel mesh opening layer graphic data b.

[0066] Specifically, it is first determined whether the PCB board to be designed with the steel mesh is a slightly modified version. If so, the fifth steel mesh opening layer graphic data a is obtained based on the first identical graphic data, different graphic data, solder paste printing layer graphic data a, solder paste printing layer graphic data b, and steel mesh opening layer graphic data b. The fifth steel mesh opening layer graphic data a is the steel mesh opening layer graphic data of the PCB board to be designed by the steel mesh obtained preliminarily after the above-mentioned graphic data processing.

[0067] In other embodiments, other methods may be used to obtain the fifth steel mesh opening layer graphic data a, which is not limited in the embodiments of the present disclosure.

[0068] In this embodiment, determining whether the PCB board to be designed with the stencil is a slightly modified version includes:

[0069] Determine whether the preset standards are met. If so, the PCB board to be designed with the stencil is a minor revision; otherwise, it is not a minor revision. The preset standards are that the graphic data identical percentage k is greater than or equal to the first standard value, the graphic data difference percentage k1 is less than the second standard value, the device identical percentage k2 is greater than or equal to the third standard value, and the package identical percentage k3 is greater than or equal to the fourth standard value, wherein:

[0070] k = (number of identical solder paste printing layer pattern data / number of patterns in data A) * 100%;

[0071] k1 = (m / number of solder paste printing layer patterns in data A) * 100%, where m is the number of solder paste printing layer pattern data that are different between data A and data B;

[0072] k2 = (number of devices with the same name in data A and data B / number of devices in data A) * 100%;

[0073] k3=(the number of identical packages of data A and data B / the number of packages of data A)*100%.

[0074] Optionally, the first standard value k 标 =80%, second standard value k1 标 =20%, the third standard value k2 标 =85%, fourth standard value k3 标 =90%, so if k≥80%, k2≥85%, k3≥90% and k1<20%, it is a slightly revised version, otherwise it is not a slightly revised version.

[0075] In a specific embodiment, the fifth stencil opening layer graphic data a is obtained according to the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b, including steps S1 to S2, wherein:

[0076] Step S1. Obtain the first optimal steel mesh opening layer graphic data according to the first identical graphic data, and copy the first optimal steel mesh opening layer graphic data to the steel mesh opening layer graphic data a to obtain the first steel mesh opening layer graphic data a. Then, obtain the second identical graphic data according to the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a, and assign the device name and pin information of the solder paste printing layer graphic data a with the second identical graphic data to the corresponding first steel mesh opening layer graphic data a to obtain the second steel mesh opening layer graphic data a, wherein the first optimal steel mesh opening layer graphic data is the steel mesh opening layer graphic data that is most suitable for copying to the steel mesh opening layer graphic data a, and the second identical graphic data is the graphic data determined to need to assign the device name and pin information of the corresponding solder paste printing layer graphic data a to the corresponding first steel mesh opening layer graphic data a.

[0077] In this embodiment, step S1 can be implemented through steps S1.1 to S1.3, where:

[0078] Step S1.1: Find corresponding graphic data in the steel mesh opening layer graphic data b according to the first identical graphic data.

[0079] In this embodiment, step S1.1 can be implemented through steps S1.11 to S1.12, where:

[0080] Step S1.11, searching for graphic data corresponding to the first identical graphic data in the solder paste printing layer graphic data b;

[0081] Step S1.12: Perform an XOR analysis on the graphic data found in step S1.11 and the stencil opening layer graphic data b to find the corresponding graphic data.

[0082] Step S1.2: Find the most complete graphic data under the same package name in the graphic data obtained in step S1.1 to determine the first opening graphic width-to-thickness ratio and the first area ratio of the opening graphic with the largest area in the same group, and determine the second opening graphic width-to-thickness ratio and the second area ratio of the opening graphic with the largest outer contour in the same group.

[0083] Specifically, since there is a safety distance requirement between the steel mesh opening layer graphic data and the hole, the steel mesh opening layer graphic data in data B obtained in step S1.1 may have been avoided by the hole, resulting in the steel mesh opening layer graphic data in data B being modified and processed. Therefore, the original steel mesh opening layer graphic data is found as much as possible here.

[0084] In this embodiment, the width-to-thickness ratio of the opening pattern = W / H, where W is the width of the opening pattern and H is the thickness of the opening pattern; the area ratio = Area / L*H, where Area is the area of the opening pattern, L is the perimeter of the opening pattern, and H is the thickness of the opening pattern.

[0085] In this embodiment, step S1.2 can be implemented through steps S1.21 to S1.26, where:

[0086] Step S1.21: Group the graphic data of the solder paste printing layer graphic data b with the same package name and the same graphic size.

[0087] Specifically, the graphic data are classified according to conditions such as the same package name and the same graphic size in the solder paste printing layer graphic data b, and graphic data with the same size and the same package name are grouped together.

[0088] Step S1.22: In each group of graphic data obtained in step S1.21, find the largest opening graphic in the stencil opening layer graphic data b corresponding to the solder paste printing layer graphic data b in the same group.

[0089] Step S1.23: Calculate the first opening pattern aspect ratio and the first area ratio of the opening pattern obtained in step S1.22.

[0090] Step S1.24: In each group of graphic data obtained in step S1.21, find the graphic data in the stencil opening layer graphic data b corresponding to the solder paste printing layer graphic data b in the same group.

[0091] Step S1.25: In each set of graphic data, rotate the graphic data obtained in step S1.24 to 0 degrees, superimpose the original graphic data and the rotated graphic data according to the center of the graphic, calculate the maximum outer contour of the superimposed graphic, and use the outer contour graphic as the new opening graphic.

[0092] It should be noted that, during the initial design, the angle of each graphic data has been determined, so the graphic data can be rotated to 0 degrees according to the initial design angle.

[0093] Step S1.26: Calculate the second opening pattern width-to-thickness ratio and the second area ratio of the new opening pattern obtained in step S1.25.

[0094] Step S1.3, based on the first opening graphic aspect ratio, the first area ratio, the second opening graphic aspect ratio and the second area ratio, obtain the first optimal steel mesh opening layer graphic data, and copy the first optimal steel mesh opening layer graphic data to the steel mesh opening layer graphic data a to obtain the first steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a to obtain the second identical graphic data, and assign the device name and pin information of the solder paste printing layer graphic data a with the second identical graphic data to the corresponding first steel mesh opening layer graphic data a to obtain the second steel mesh opening layer graphic data a.

[0095] In this embodiment, step S1.3 can be implemented through steps S1.31 to S1.33, where:

[0096] Step S1.31: Compare the first opening pattern aspect ratio and the second opening pattern aspect ratio with the aspect ratio threshold, and compare the first area ratio and the second area ratio with the area ratio threshold to find the first optimal steel mesh opening layer pattern data.

[0097] Specifically, first, an opening pattern whose aspect ratio and area ratio are both greater than the aspect ratio threshold and the area ratio threshold is selected, that is, when the aspect ratio and the first area ratio of the first opening pattern are both greater than the aspect ratio threshold and the area ratio threshold, and at least one of the aspect ratio and the second area ratio of the second opening pattern is less than the corresponding aspect ratio threshold and the area ratio threshold, the opening pattern obtained in step S1.22 is selected as the first optimal steel mesh opening layer pattern data; when the aspect ratio of the first opening pattern and the aspect ratio of the second opening pattern are both greater than the aspect ratio threshold, and the first area ratio and the second area ratio are both greater than the area ratio threshold, the opening pattern corresponding to the larger value of the aspect ratio of the first opening pattern and the aspect ratio of the second opening pattern is selected as the second steel mesh opening layer pattern data a; when the aspect ratio of the first opening pattern and the aspect ratio of the second opening pattern are both less than or equal to the aspect ratio threshold, and the first area ratio and the second area ratio are both less than or equal to the area ratio threshold, the first optimal steel mesh opening layer pattern data is the pattern data obtained in step S1.12.

[0098] Optionally, the width-to-thickness ratio threshold is 1.5, and the area ratio threshold is 0.66.

[0099] Step S1.32: copy the first optimal steel mesh opening layer graphic data obtained in step S1.31 to the steel mesh opening layer graphic data a to obtain the first steel mesh opening layer graphic data a.

[0100] Step S1.33, perform XOR analysis on the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a is within a preset range. If it is within the preset range, it is the second identical graphic data, and the device name and pin information of the solder paste printing layer graphic data a with the second identical graphic data is assigned to the corresponding first steel mesh opening layer graphic data a to obtain the second steel mesh opening layer graphic data a.

[0101] Step S2:

[0102] According to whether the device names of different graphic data are included in data A or data B, the second optimal steel mesh opening layer graphic data or the third optimal steel mesh opening layer graphic data is obtained accordingly; based on the second optimal steel mesh opening layer graphic data or the third optimal steel mesh opening layer graphic data, the first graphic data to be copied or the second graphic data to be copied is obtained, and copied to the second steel mesh opening layer graphic data a to obtain the third steel mesh opening layer graphic data a or the fourth steel mesh opening layer graphic data a; according to the solder paste printing layer graphic data a and the third steel mesh opening layer graphic data a, the third identical graphic data is obtained, or according to the solder paste printing layer graphic data a and the fourth steel mesh opening layer graphic data a, the fourth identical graphic data is obtained; the device name and pin information of the solder paste printing layer graphic data a having the third identical graphic data or the fourth identical graphic data is assigned to the corresponding third steel mesh opening layer graphic data a or the fourth steel mesh opening layer graphic data a to obtain the fifth steel mesh opening layer graphic data a;

[0103] Alternatively, based on the inclusion of device names of different graphic data in data A and data B, the second optimal steel mesh opening layer graphic data and the third optimal steel mesh opening layer graphic data are obtained accordingly; based on the second optimal steel mesh opening layer graphic data and the third optimal steel mesh opening layer graphic data, the first graphic data to be copied and the second graphic data to be copied are obtained, and are copied to the second steel mesh opening layer graphic data a respectively to obtain the sixth steel mesh opening layer graphic data a; based on the solder paste printing layer graphic data a and the sixth steel mesh opening layer graphic data a, the sixth identical graphic data is obtained; the device name and pin information of the solder paste printing layer graphic data a with the sixth identical graphic data are assigned to the corresponding sixth steel mesh opening layer graphic data a to obtain the fifth steel mesh opening layer graphic data a.

[0104] Specifically, the device names of the different graphic data obtained in step 3 may exist in data A and data B, or may only exist in data A [two situations: ① The package name corresponding to the device name of the different graphic data exists in data B; ② The package name corresponding to the device name of the different graphic data does not exist in data B (in this case, it is automatically created, and the creation method is not limited. It can be automatically created according to preset rules or manually created)]. It is also possible that some device names exist in data A and data B, and some device names only exist in data A. Therefore, after the second steel mesh opening layer graphic data a is obtained in step S1, it needs to be divided into the above three situations, so that according to the different situations that the device names of the different graphic data may exist in data A and data B, or only exist in data A, and some device names may exist in data A and data B, and some device names only exist in data A, they are processed separately, thereby determining the fifth steel mesh opening layer graphic data a that needs to be obtained in step S2 through different situations. Among them, the second optimal steel mesh opening layer graphic data and the third optimal steel mesh opening layer graphic data are the most suitable for replacing the steel mesh opening layer graphic data b corresponding to the solder paste printing layer graphic data b, and the third identical graphic data, the fourth identical graphic data and the sixth identical graphic data are graphic data determined according to different situations to assign the device name and pin information of the corresponding solder paste printing layer graphic data a to the corresponding first steel mesh opening layer graphic data a.

[0105] In a specific embodiment, when the device name of different graphic data exists in data B, the fifth stencil opening layer graphic data a is obtained based on whether the device name of different graphic data is included in data A;

[0106] Step S2 can be implemented through steps S2.11 to S2.15, wherein:

[0107] Step S2.11: Determine whether the graphic data of data A contains the device name of different graphic data. If not, skip and do not process; if yes, execute step S2.12.

[0108] Specifically, when the device name of different graphic data exists in data B, the different graphic data obtained in step 3 and its corresponding device name are obtained; then, it is determined whether the graphic data of data A contains the device name of different graphic data. If not, it is skipped and not processed; if it is, it means that the position of the device in the SP layer in data A is offset from the position in the SP layer in data B, and step S2.12 is executed.

[0109] Step S2.12: Obtain the graphic data corresponding to the device name contained in the solder paste printing layer graphic data b.

[0110] Step S2.13, perform XOR analysis on the graphic data obtained in step S2.12 and the steel mesh opening layer graphic data b. If the analysis result shows that the graphic data are the same, determine the third opening graphic width-to-thickness ratio and the third area ratio of the opening graphic with the largest area in the same group based on the same graphic data, and determine the fourth opening graphic width-to-thickness ratio and the fourth area ratio of the opening graphic with the largest outer contour in the same group.

[0111] Step S2.14: Obtain the second optimal stencil opening layer pattern data according to the third opening pattern aspect ratio, the third area ratio, the fourth opening pattern aspect ratio, and the fourth area ratio.

[0112] Specifically, the third opening pattern aspect ratio and the fourth opening pattern aspect ratio are compared with the aspect ratio threshold, and the third area ratio and the fourth area ratio are compared with the area ratio threshold to find the second optimal steel mesh opening layer pattern data.

[0113] It should be noted that the method for determining the third opening pattern aspect ratio and the third area ratio of the opening pattern with the largest area in the same group, and the fourth opening pattern aspect ratio and the fourth area ratio of the opening pattern with the largest outer contour in the same group is the same as the method for screening the first opening pattern aspect ratio and the first area ratio of the opening pattern with the largest area in the same group, and the second opening pattern aspect ratio and the second area ratio of the opening pattern with the largest outer contour in the same group in step S1.2 in step S1. The method for determining the second optimal steel mesh opening layer pattern data is the same as the method for determining the first optimal steel mesh opening layer pattern data, so it will not be repeated here.

[0114] Step S2.15, use the second optimal steel mesh opening layer graphic data to replace the steel mesh opening layer graphic data b corresponding to the solder paste printing layer graphic data b under the same conditions, obtain the first graphic data to be copied, and copy the first graphic data to be copied to the position corresponding to the same device name in the second steel mesh opening layer graphic data a, to obtain the third steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the third steel mesh opening layer graphic data a to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the third steel mesh opening layer graphic data a is within a preset range. If it is within the preset range, obtain the third identical graphic data, assign the device name and pin information of the solder paste printing layer graphic data a with the third identical graphic data to the corresponding third steel mesh opening layer graphic data a, and obtain the fifth steel mesh opening layer graphic data a; otherwise, create the steel mesh opening layer graphic data a corresponding to the device name, wherein the creation method is not limited: it can be automatically created according to preset rules or manually created.

[0115] In another specific embodiment, when the device names of different graphic data exist only in data A, step S2 can be implemented through steps S2.21 to S2.24, wherein:

[0116] Step S2.21: Search the graphic data of data B to see whether there is solder paste printing layer graphic data b of a device with the same package name as different graphic data. If found, execute step S2.22; if not found, create steel mesh opening layer graphic data a corresponding to the device name.

[0117] Specifically, when the device name of different graphic data only exists in data A, the solder paste printing layer graphic data b of a device with the same package name as the different graphic data is directly searched in the graphic data of data B. If found, it means that further processing is required based on the solder paste printing layer graphic data b, so continue to execute step S2.22. If not found, directly create the steel mesh opening layer graphic data a corresponding to the device name.

[0118] Step S2.22, perform XOR analysis on the solder paste printing layer graphic data b and the steel mesh opening layer graphic data b found in step S2.21. If the analysis result is that the graphic data are the same, determine the fifth opening graphic aspect ratio and the fifth area ratio of the opening graphic with the largest area in the same group based on the same graphic data, and determine the sixth opening graphic aspect ratio and the sixth area ratio of the opening graphic with the largest outer contour in the same group.

[0119] Step S2.23: Obtain the third optimal stencil opening layer pattern data according to the fifth opening pattern aspect ratio, the fifth area ratio, the sixth opening pattern aspect ratio, and the sixth area ratio.

[0120] Specifically, the fifth opening pattern aspect ratio and the sixth opening pattern aspect ratio are compared with the aspect ratio threshold, and the fifth area ratio and the sixth area ratio are compared with the area ratio threshold to find the third optimal steel mesh opening layer pattern data.

[0121] It should be noted that the method for determining the fifth opening pattern aspect ratio and the fifth area ratio of the opening pattern with the largest area in the same group, and the sixth opening pattern aspect ratio and the sixth area ratio of the opening pattern with the largest outer contour in the same group is the same as the method for screening the first opening pattern aspect ratio and the first area ratio of the opening pattern with the largest area in the same group, and the second opening pattern aspect ratio and the second area ratio of the opening pattern with the largest outer contour in the same group in step S1.2 in step S1. The method for determining the third optimal steel mesh opening layer pattern data is the same as the method for determining the first optimal steel mesh opening layer pattern data, so it will not be repeated here.

[0122] Step S2.24, use the third optimal steel mesh opening layer graphic data to replace the steel mesh opening layer graphic data b corresponding to the solder paste printing layer graphic data b under the same conditions to obtain the second graphic data to be copied, and copy the second graphic data to be copied to the position corresponding to the same device name in the second steel mesh opening layer graphic data a to obtain the fourth steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the fourth steel mesh opening layer graphic data a to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the fourth steel mesh opening layer graphic data a is within a preset range. If it is within the preset range, obtain the fourth identical graphic data, assign the device name and pin information of the solder paste printing layer graphic data a with the fourth identical graphic data to the corresponding fourth steel mesh opening layer graphic data a to obtain the fifth steel mesh opening layer graphic data a; otherwise, create the steel mesh opening layer graphic data a corresponding to the device name.

[0123] It should be noted that the sixth identical graphic data is determined by whether the area percentage of the graphic data difference between the solder paste printing layer graphic data a and the sixth steel mesh opening layer graphic data a is within a preset range. The specific determination method is similar to the third identical graphic data and the fourth identical graphic data, and will not be repeated here.

[0124] Step 5. Determine whether the steel mesh opening layer graphic data b is covered by the steps. If so, perform XOR analysis on the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained in step 4 to obtain the fifth identical graphic data. Compare the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the steps to complete the steel mesh design of the PCB board to be designed.

[0125] Specifically, after obtaining the fifth steel mesh opening layer graphic data a through step 4, it is also necessary to determine whether the steel mesh opening layer graphic data b is covered by the steps, so as to fully complete the steel mesh design of the PCB board to be designed by the steel mesh. Specifically, the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b are subjected to XOR analysis processing to determine the fifth identical graphic data between them, and then the final steel mesh design method is determined by thickness comparison.

[0126] In this embodiment, step 5 can be implemented through steps 5.1 to 5.3, wherein:

[0127] Step 5.1: Perform an XOR analysis on the fifth stencil opening layer pattern data a and the stencil opening layer pattern data b to obtain fifth identical pattern data.

[0128] Step 5.2: Check whether the steel mesh opening layer graphic data b and the step layer graphic data b are included. If included, it means that the included steel mesh opening layer graphic data b has steps. Obtain the steel mesh opening layer graphic data b covered by the steps. Otherwise, there are no steps.

[0129] Step 5.3, compare the thickness of the covered steel mesh opening layer graphic data b and the thickness of the fifth identical graphic data to see if they are the same. If they are the same, copy the stepped layer graphic data b covering the steel mesh opening layer graphic data b to the corresponding position of the stepped layer graphic data a to complete the steel mesh design of the PCB board to be designed. If they are not the same, it can be created according to the usage scenario, and the creation method is not limited, such as manual creation.

[0130] Step 6: If the PCB board to be designed with the steel mesh does not need to be slightly modified, the report is directly output.

[0131] The method for designing a micro-modified steel mesh provided by the present invention first determines whether the solder paste printing layer graphic data of the PCB board to be designed by the steel mesh is the same as the solder paste printing layer graphic data of the PCB board for which the steel mesh design has been completed before. If so, the steel mesh opening layer graphic data corresponding to the same device in the graphic data of the PCB board for which the steel mesh design has been completed is reused for the steel mesh opening layer graphic data to be designed by the steel mesh; if not, the steel mesh opening layer graphic data corresponding to the device with different graphic data in the PCB board to be designed by the steel mesh is created based on whether the graphic data of the PCB board to be designed by the steel mesh contains the device name corresponding to the device with different graphic data, and whether the graphic data of the PCB board to be designed by the completed steel mesh contains the device name corresponding to the device with different graphic data. By adopting this scheme, the steel mesh design corresponding to the micro-modified PCB can be quickly created. Therefore, the method for designing a micro-modified steel mesh provided by the present invention can greatly reduce the opening time, reduce the situation of opening redesign, avoid manual omission of design openings, avoid repeated modifications caused by the designed openings not meeting process requirements, etc., greatly shorten the steel mesh design time, and improve the steel mesh design quality.

[0132] Example 2

[0133] Based on the first embodiment, this embodiment provides a specific method for designing a slightly modified stencil. This method, based on the design method of the slightly modified stencil in the first embodiment, takes a PCB board (B) with a completed stencil design and a PCB board (A) with added components as examples. The completed stencil openings in PCB board (B) are applied to PCB board (A) to complete the slightly modified adjustment. The specific implementation is as follows:

[0134] 1. Read the PCB design file into the system core data module. The sample graphics after reading are as follows: Figure 3 The PCB board (B) with completed steel mesh design is shown as Figure 4 As shown, Figure 4 The light grey in the figure is the opening pattern. The pattern data of the steel mesh opening layer (hereinafter referred to as SA layer) of the PCB board (B) is as follows: Figure 5 As shown, the graphic data of the solder paste printing layer (hereinafter referred to as SP layer) of the PCB board (B) is as follows Figure 6 As shown, the PCB board (A) that needs to complete the steel mesh design is as follows Figure 7 As shown, the solder paste printing layer graphic data of PCB board (A) is as follows Figure 8 shown.

[0135] 2. First, group the SP layer graphic data of PCB board (A) and PCB board (B) according to the package name. The result is as follows Figure 9b and Figure 9a As shown, Figure 9a This is the device and package information table of PCB board (B), which is grouped by package name. C508, C509, and C511 are grouped together, R84, R164, R165, and R256 are grouped together, and D31 is grouped together. Figure 9b This is a table of device and package information for PCB board (A). They are grouped by package name: C508, C509, C511, and C495 are one group; R84, R164, R165, and R256 are one group; and D31 is another group.

[0136] 3. Perform XOR analysis using the SP layer graphic data of PCB board (A) and the SP layer graphic data of PCB board (B), as follows:

[0137] (3.1) Graphics XOR processing: the same graphics data are marked as the same graphics data, and the different graphics data are marked as different graphics data. The same and different graphics are distinguished as follows: Figure 10 、 Figure 11 As shown, the percentage of the black part in the entire graphic area is used to judge. If the difference area percentage is less than or equal to 5%, the difference area percentage of C508, C509, C511, R84, R164, R165, R256, and D31 is 0 according to the XOR analysis, that is, the difference area percentage is less than 5%. Then, the package names of C508, C509, C511 of PCB board (A) and C508, C509, and C511 of PCB board (B) are the same, the package names of R84, R164, R165, and R256 of PCB board (A) and R84, R164, R165, and R256 of PCB board (B) are the same, and the package names of D31 of PCB board (A) and D31 of PCB board (B) are the same, then it is considered that their graphic data are the same (such as Figure 10 ).

[0138] (3.2) Processing results: The graphic data of C508, C509, C511 of PCB board (A) and C508, C509, C511 of PCB board (B) are the same, and the marked graphic data are the same; the graphic data of R84, R164, R165, R256 of PCB board (A) and R84, R164, R165, R256 of PCB board (B) are the same, and the marked graphic data are the same; the graphic data of D31 of PCB board (A) and D31 of PCB board (B) are the same, and the marked graphic data are the same; C495 of PCB board (A) is a newly added component and does not exist in PCB board (B), so the marked graphic data is different.

[0139] 4. Determine whether it is a slightly modified version. The example is as follows:

[0140] In step 3 above, the C508, C509, C511, R84, R164, R165, and R256 graphics data are the same, and each has two graphics. The D31 graphics data is the same, with 65 graphics, and a total of 79 identical graphics. The number of graphics on PCB board (A) is 81, and the number of graphics on PCB board (B) is 79.

[0141] Graphic data identical percentage k = (79 / 81) * 100% = 97.5%;

[0142] The number of different graphic data m=2;

[0143] Graphic data difference percentage k1 = (2 / 81) * 100% = 2.4%;

[0144] The number of components on PCB board (A) = 9, and the number of components on PCB board (B) = 8;

[0145] The number of packages for PCB board (A) = 3, the number of packages for PCB board (B) = 3;

[0146] Device identical percentage k2 = (8 / 9) * 100% = 88.89%;

[0147] Package identical percentage k3 = (3 / 3) * 100% = 100%;

[0148] According to the preset standard: k 标 =80%, k1 标 =20%, k2 标 =85%, k3 标 =90%; if k≥80%, k2≥85%, k3≥90% and k1<20%, it is a slightly modified version, otherwise it is not a slightly modified version;

[0149] k=97.5%≥80%; k1=2.4%<20%; k2=88.89%≥85%;

[0150] If k3=100%≥90%, the PCB board (A) is a minor revision and the minor revision operation is performed.

[0151] 5. Perform XOR analysis on the graphic data marked as identical in the SP layer graphic data of PCB board (B) and the SA layer graphic data of PCB board (B) to find the SA layer graphic data that intersects with the SP layer graphic data. For example: The graphic data with identical markings in the SP layer of PCB board (B) is as follows: Figure 12 As shown, Figure 12 The SA layer graphic data where the graphic data in the intersection occurs is as follows Figure 13 As shown, after the SA layer graphic data is grouped according to the same package, the opening pattern is restored in each group.

[0152] In the device information table of PCB board (B), C508, C509, and C511 have the same package and are grouped together. Among the three devices, the 2-pin pattern of C508 has been processed to avoid holes, and the SA layer pattern data is different from the SA layer pattern data of other devices. In this group, find the opening pattern with the largest area and the opening pattern with the largest outer contour. In this embodiment, the preset area ratio threshold of the opening pattern is 0.66, and the width-to-thickness ratio threshold is 1.5.

[0153] (1) Find the opening pattern with the largest area, calculate the area value of each opening pattern, and find the opening pattern with the largest area;

[0154] The areas of all pins of the three devices C508, C509, and C511, except for pin 2 of C508, are the same. Any opening pattern can be marked as the opening pattern with the largest area. For example, pin 1 of C509 (area = 0.217) has an area ratio of 0.828, which is greater than the area ratio threshold of 0.66, and a width-to-thickness ratio of 4.798, which is greater than the width-to-thickness ratio threshold of 1.5.

[0155] (2) Find the opening figure with the largest outer contour, convert each opening figure to 0 degrees according to the angle, and then use several centers of each opening figure as the origin to superimpose all the opening figures and calculate the outer contour figure of the superimposed figure. The calculated outer contour is the same as that of C508, C509, and C511 except for the 2nd foot of C508. For example, the 1st foot of C509 (circumference = 2.62) has an area ratio of 0.828, which is greater than the area ratio threshold of 0.66, and a width-to-thickness ratio of 4.798, which is greater than the width-to-thickness threshold of 1.5.

[0156] The results calculated by the above restoration algorithms are the same. Select the opening pattern in any result of C508, C509, or C511 to replace the other opening patterns. Replace the 2nd pin of C508 with the opening pattern of 1st pin of C509. Rotate the replaced opening pattern according to the 2nd pin of C508. Copy the new opening pattern to the SA layer of the PCB board (A). After the copy is completed, the example is as follows Figure 14 shown.

[0157] It can be seen that there is no opening pattern at the device position corresponding to C495 in the above results, because C495 is marked in a different pattern. The result of updating the SA layer pattern data of PCB board (A) is as follows Figure 15 shown.

[0158] 6. Process graphic data with different marks, such as the C495 position. In the device information table of PCB board (A), it can be seen that the device package name is 0402C-S. In PCB board (B), find the device information C508, C509, and C511 with the same package name. Find a component with the same package name, such as C509, and find the SP layer graphic data corresponding to C509 on the SP layer of PCB board (B). Use this SP layer graphic data and the SA layer graphic data of PCB board (B) to perform XOR analysis to find the SA layer graphic data that intersects with the SP layer graphic data. Taking pin 1 of C509 as an example, the corresponding area ratio is 0.828, which is greater than the area ratio threshold of 0.66, and the corresponding width-to-thickness ratio is 4.798, which is greater than the width-to-thickness ratio threshold of 1.5. The details are similar to the above and will not be repeated here. Copy its SA layer graphic to the C495 position corresponding to the SA layer of PCB board (A), and rotate it correctly according to the angle of C495. After the copy is completed, the example is as follows Figure 16 As shown in the figure, it can be seen that the SA layer opening pattern of the device position corresponding to C495 has been added in the above result; the result of updating the SA layer pattern data of PCB board (A) is as follows: Figure 17 shown.

[0159] 7. Perform XOR analysis on the SA layer graphic data of PCB board (A) and the SA layer graphic data of PCB board (B), and mark the same and different graphic data;

[0160] (1) The SA layer graphic data and the ladder data of the PCB board (B) are included in the judgment, and the SA layer graphic data covered by the ladder is obtained. For example, Figure 18 Through inclusion judgment, the SA layer graphic data of D31 and C509 in the above graphic data are included by the ladder, and other graphics are not included.

[0161] (2) Compare the thickness of the SA layer graphic data of the PCB board (A) and the SA layer graphic data obtained in step (1) in step 7 to see if the thickness is the same. If so, copy this staircase graphic to the staircase layer of the PCB board (A). If not, it can be created according to the usage scenario (the method is not limited: it can be created manually), and the staircase graphic may not be created.

[0162] Here is an example:

[0163] Determine whether the thickness of the graphic data corresponding to D31 and C509 in the SA layer of PCB board (B) is the same as that of the graphic data corresponding to D31 and C509 in the SA layer of PCB board (A). The thickness of D31 in the SA layer of PCB board (B) is 0.1mm, and the thickness of C509 is 0.1mm. The thickness of D31 in the SA layer of PCB board (A) is 0.1mm, and the thickness of C509 is 0.1mm. Copy the corresponding step graphics on PCB board (B) to PCB board (A). The effect after completion is as follows: Figure 19 As shown, the SA layer graphic data of the final PCB board (A) is as follows Figure 20 shown.

[0164] Example 3

[0165] See Figure 21 , Figure 21 Schematic diagram of a system for slightly modified steel mesh design provided by an embodiment of the present invention. The system for slightly modified steel mesh design includes:

[0166] An acquisition module is used to acquire data A of a PCB board to be designed with a stencil and data B of a completed stencil design, wherein the data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and the data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b;

[0167] A classification module, configured to classify the solder paste printing layer graphic data b containing the device name and pin information and the solder paste printing layer graphic data a according to the package name;

[0168] a pattern determination module, configured to perform an XOR analysis on the solder paste printing layer pattern data a and the solder paste printing layer pattern data b to determine first identical pattern data and different pattern data;

[0169] a slightly revised version judgment module, configured to judge whether the PCB board to be designed with the stencil is a slightly revised version; if it is a slightly revised version, obtaining fifth stencil opening layer graphic data a according to the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b;

[0170] The step judgment module is used to judge whether the steel mesh opening layer graphic data b is covered by the step. If so, the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained by the micro-revised version judgment module are subjected to XOR analysis to obtain fifth identical graphic data, and the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the step are compared to complete the steel mesh design of the PCB board to be designed by the steel mesh.

[0171] The system for slightly modified steel mesh design provided in this embodiment can execute the above method embodiment, and its implementation principle and technical effects are similar, which will not be repeated here.

[0172] Example 4

[0173] See Figure 22 , Figure 22 1 is a schematic diagram of the structure of an electronic device provided in this embodiment. The electronic device 1100 includes: a processor 1101, a communication interface 1102, a memory 1103, and a communication bus 1104. The processor 1101, the communication interface 1102, and the memory 1103 communicate with each other via the communication bus 1104.

[0174] Memory 1103, used for storing computer programs;

[0175] The processor 1101 is used to implement all or part of the steps in the above-mentioned method embodiment of the slightly modified steel mesh design when executing the computer program. The specific implementation principles and technical effects are similar and will not be repeated here.

[0176] Example 5

[0177] This embodiment provides a computer-readable storage medium on which a computer program is stored. When the above computer program is executed by a processor, all or part of the steps in the above-mentioned method embodiment for designing a micro-modified steel mesh are implemented. The specific implementation principles and technical effects are similar and will not be repeated here.

[0178] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, devices (equipment), or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware, which are all collectively referred to as "module" or "system" herein. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-readable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code. The computer program is stored / distributed in a suitable medium, provided together with other hardware or as a part of hardware, or other distribution forms can be adopted, such as by the Internet or other wired or wireless telecommunication systems.

[0179] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being described. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0180] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. Throughout this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0181] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A method for designing a slightly modified steel mesh, characterized in that: include: Step 1: Obtain data A of a PCB board to be designed with a stencil and data B of a PCB board with a completed stencil design, wherein data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b; Step 2: Classify the solder paste printing layer graphic data b containing the device name and pin information and the solder paste printing layer graphic data a according to the package name; Step 3: performing an XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine first identical graphic data and different graphic data; Step 4: Determine whether the PCB board to be designed with the stencil is a slightly revised version. If it is a slightly revised version, obtain fifth stencil opening layer graphic data a based on the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b; Step 5, determine whether the steel mesh opening layer graphic data b is covered by the steps. If so, perform XOR analysis on the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained in step 4 to obtain fifth identical graphic data. Compare the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the steps to complete the steel mesh design of the PCB board to be designed with the steel mesh.

2. The method for designing a slightly modified steel mesh according to claim 1, wherein: The step 2 includes: Step 2.1: Determine whether the solder paste printing layer graphic data b contains the device name and pin information. If not, perform an XOR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to find the same graphic data, and assign the device name and pin information corresponding to the same graphic data found in the solder paste printing layer graphic data a to the solder paste printing layer graphic data b, and then execute step 2.

2. If it does, execute step 2.2 directly. Step 2.2: Classify the solder paste printing layer graphic data a and the solder paste printing layer graphic data b processed in step 2.1 according to the package name.

3. The method for designing a slightly modified steel mesh according to claim 1, wherein: The step 3 comprises: Performing an exclusive OR analysis on the solder paste printing layer graphic data a and the solder paste printing layer graphic data b to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the solder paste printing layer graphic data b is within a preset range; If they are within the preset range, then continue to compare whether the package names of the solder paste printing layer graphic data a and the solder paste printing layer graphic data b are the same; if the package names are the same, then mark them as the first identical graphic data; if the package names are different, then mark them as the different graphic data; If it is not within the preset range, it is marked as the different graphic data.

4. The method for designing a slightly modified steel mesh according to claim 1, wherein: Determining whether the PCB board to be designed with the stencil is a slightly modified version includes: Determine whether the preset standards are met. If so, the PCB board to be designed with the stencil is a slightly modified version; otherwise, it is not a slightly modified version. The preset standards are that the graphic data identical percentage k is greater than or equal to the first standard value, the graphic data difference percentage k1 is less than the second standard value, the device identical percentage k2 is greater than or equal to the third standard value, and the package identical percentage k3 is greater than or equal to the fourth standard value. k = (number of identical solder paste printing layer pattern data / number of patterns in data A) * 100%; k1 = (m / number of solder paste printing layer patterns in data A) * 100%, where m is the number of solder paste printing layer pattern data that are different between data A and data B; k2 = (number of devices with the same name in data A and data B / number of devices in data A) * 100%; k3=(the number of identical packages of data A and data B / the number of packages of data A)*100%.

5. The method for designing a slightly modified steel mesh according to claim 1, wherein: Obtaining fifth stencil opening layer graphic data a according to the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b includes: Step S1, obtaining first optimal stencil opening layer graphic data according to the first identical graphic data, and copying the first optimal stencil opening layer graphic data to the stencil opening layer graphic data a to obtain first stencil opening layer graphic data a, then obtaining second identical graphic data according to the solder paste printing layer graphic data a and the first stencil opening layer graphic data a, and assigning the device name and pin information of the solder paste printing layer graphic data a having the second identical graphic data to the corresponding first stencil opening layer graphic data a to obtain second stencil opening layer graphic data a; Step S2: According to whether the device names of the different graphic data are included in the data A or the data B, the second optimal stencil opening layer graphic data or the third optimal stencil opening layer graphic data is obtained accordingly; based on the second optimal stencil opening layer graphic data or the third optimal stencil opening layer graphic data, the first graphic data to be copied or the second graphic data to be copied is obtained, and copied to the second stencil opening layer graphic data a to obtain the third stencil opening layer graphic data a or the fourth stencil opening layer graphic data a; according to the solder paste printing layer graphic data a and the third stencil opening layer graphic data a, the third identical graphic data is obtained, or according to the solder paste printing layer graphic data a and the fourth stencil opening layer graphic data a, the fourth identical graphic data is obtained; the device name and pin information of the solder paste printing layer graphic data a having the third identical graphic data or the fourth identical graphic data is assigned to the corresponding third stencil opening layer graphic data a or the fourth stencil opening layer graphic data a to obtain the fifth stencil opening layer graphic data a; Alternatively, based on whether the device names of the different graphic data are included in the data A and the data B, the second optimal steel mesh opening layer graphic data and the third optimal steel mesh opening layer graphic data are obtained accordingly; based on the second optimal steel mesh opening layer graphic data and the third optimal steel mesh opening layer graphic data, the first graphic data to be copied and the second graphic data to be copied are obtained, and are copied to the second steel mesh opening layer graphic data a respectively to obtain the sixth steel mesh opening layer graphic data a; based on the solder paste printing layer graphic data a and the sixth steel mesh opening layer graphic data a, the sixth identical graphic data is obtained; the device name and pin information of the solder paste printing layer graphic data a with the sixth identical graphic data are assigned to the corresponding sixth steel mesh opening layer graphic data a to obtain the fifth steel mesh opening layer graphic data a.

6. The method for designing a slightly modified steel mesh according to claim 5, characterized in that: Step S1 includes: Step S1.1, searching for corresponding graphic data in the stencil opening layer graphic data b according to the first identical graphic data; The step S1.1 includes: Step S1.11, searching for graphic data corresponding to the first identical graphic data in the solder paste printing layer graphic data b; Step S1.12, performing an XOR analysis on the graphic data found in step S1.11 and the stencil opening layer graphic data b to find the corresponding graphic data; Step S1.2, finding the most complete graphic data under the same package name from the graphic data obtained in step S1.1, to determine a first opening graphic width-to-thickness ratio and a first area ratio of the opening graphic with the largest area in the same group, and to determine a second opening graphic width-to-thickness ratio and a second area ratio of the opening graphic with the largest outer contour in the same group; Step S1.3, based on the first opening graphic aspect ratio, the first area ratio, the second opening graphic aspect ratio and the second area ratio, obtain the first optimal steel mesh opening layer graphic data, and copy the first optimal steel mesh opening layer graphic data to the steel mesh opening layer graphic data a to obtain the first steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a to obtain the second identical graphic data, and assign the device name and pin information of the solder paste printing layer graphic data a with the second identical graphic data to the corresponding first steel mesh opening layer graphic data a to obtain the second steel mesh opening layer graphic data a.

7. The method for designing a slightly modified steel mesh according to claim 6, wherein: Step S1.2 includes: Step S1.21, grouping the graphic data of the solder paste printing layer with the same package name and the same graphic size in the solder paste printing layer graphic data b; Step S1.22: In each group of graphic data obtained in step S1.21, find the largest opening graphic in the stencil opening layer graphic data b corresponding to the solder paste printing layer graphic data b in the same group; Step S1.23, calculating the first opening pattern aspect ratio and the first area ratio of the opening pattern obtained in step S1.22; Step S1.24: In each group of graphic data obtained in step S1.21, find the graphic data in the stencil opening layer graphic data b corresponding to the solder paste printing layer graphic data b in the same group; Step S1.25: In each set of graphic data, rotate the graphic data obtained in step S1.24 to 0 degrees, superimpose the original graphic data and the rotated graphic data at the center of the graphic, calculate the maximum outer contour of the superimposed graphic, and use the outer contour graphic as the new opening graphic; Step S1.26, calculating the second opening pattern width-to-thickness ratio and the second area ratio of the new opening pattern obtained in step S1.

25.

8. The method for designing a slightly modified steel mesh according to claim 6, wherein: Step S1.3 includes: Step S1.31: Compare the first opening pattern aspect ratio and the second opening pattern aspect ratio with the aspect ratio threshold, and compare the first area ratio and the second area ratio with the area ratio threshold to find the first optimal stencil opening layer pattern data; Step S1.32, copying the first optimal steel mesh opening layer graphic data obtained in step S1.31 to the steel mesh opening layer graphic data a to obtain the first steel mesh opening layer graphic data a; Step S1.33, perform XOR analysis on the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a, and determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the first steel mesh opening layer graphic data a is within a preset range. If it is within the preset range, it is the second identical graphic data, and the device name and pin information of the solder paste printing layer graphic data a having the second identical graphic data is assigned to the corresponding first steel mesh opening layer graphic data a to obtain the second steel mesh opening layer graphic data a.

9. The method for designing a slightly modified steel mesh according to claim 5, wherein: When the device name of the different graphic data exists in the data B, the fifth stencil opening layer graphic data a is obtained based on whether the device name of the different graphic data is included in the data A; The step S2 specifically includes: Step S2.11: Determine whether the graphic data of data A contains the device name of the different graphic data. If not, skip the process; if yes, proceed to step S2.

12. Step S2.12, obtaining the graphic data corresponding to the device name contained in the solder paste printing layer graphic data b; Step S2.13: Performing an XOR analysis on the graphic data obtained in step S2.12 and the stencil opening layer graphic data b. If the analysis result shows that the graphic data are identical, determining a third opening graphic aspect ratio and a third area ratio of the opening graphic with the largest area in the same group, and determining a fourth opening graphic aspect ratio and a fourth area ratio of the opening graphic with the largest outer contour in the same group based on the identical graphic data. Step S2.14, obtaining second optimal stencil opening layer pattern data based on the third opening pattern aspect ratio, the third area ratio, the fourth opening pattern aspect ratio, and the fourth area ratio; Step S2.15, use the second optimal steel mesh opening layer graphic data to replace the steel mesh opening layer graphic data b corresponding to the solder paste printing layer graphic data b under the same conditions, obtain the first graphic data to be copied, and copy the first graphic data to be copied to the position corresponding to the same device name in the second steel mesh opening layer graphic data a, to obtain the third steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the third steel mesh opening layer graphic data a to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the third steel mesh opening layer graphic data a is within a preset range. If it is within the preset range, obtain the third identical graphic data, assign the device name and pin information of the solder paste printing layer graphic data a with the third identical graphic data to the corresponding third steel mesh opening layer graphic data a, and obtain the fifth steel mesh opening layer graphic data a; otherwise, create the steel mesh opening layer graphic data a corresponding to the device name.

10. The method for designing a slightly modified steel mesh according to claim 5, wherein: When the device name of the different graphic data exists only in the data A, the step S2 specifically includes: Step S2.21: Search the graphic data of data B to see whether there is solder paste printing layer graphic data b of a device with the same package name as the different graphic data. If found, execute step S2.22; if not found, create stencil opening layer graphic data a corresponding to the device name; Step S2.22: Perform an XOR analysis on the solder paste printing layer pattern data b found in step S2.21 and the stencil opening layer pattern data b. If the analysis result shows that the pattern data are identical, determine, based on the identical pattern data, a fifth opening pattern aspect ratio and a fifth area ratio of the opening pattern with the largest area in the same group, and determine a sixth opening pattern aspect ratio and a sixth area ratio of the opening pattern with the largest outer contour in the same group. Step S2.23, obtaining third optimal stencil opening layer pattern data based on the fifth opening pattern aspect ratio, the fifth area ratio, the sixth opening pattern aspect ratio, and the sixth area ratio; Step S2.24, use the third optimal steel mesh opening layer graphic data to replace the steel mesh opening layer graphic data b corresponding to the solder paste printing layer graphic data b under the same conditions, obtain the second graphic data to be copied, and copy the second graphic data to be copied to the position corresponding to the same device name in the second steel mesh opening layer graphic data a, to obtain the fourth steel mesh opening layer graphic data a, and then perform XOR analysis on the solder paste printing layer graphic data a and the fourth steel mesh opening layer graphic data a to determine whether the graphic data difference area percentage between the solder paste printing layer graphic data a and the fourth steel mesh opening layer graphic data a is within a preset range; if it is within the preset range, obtain the fourth identical graphic data, assign the device name and pin information of the solder paste printing layer graphic data a with the fourth identical graphic data to the corresponding fourth steel mesh opening layer graphic data a, to obtain the fifth steel mesh opening layer graphic data a; otherwise, create the steel mesh opening layer graphic data a corresponding to the device name.

11. The method for designing a slightly modified steel mesh according to claim 1, wherein: The data A also includes staircase layer graphic data a, and the data B also includes staircase layer graphic data b; The step 5 comprises: Step 5.1, performing an XOR analysis on the fifth stencil opening layer pattern data a and the stencil opening layer pattern data b to obtain fifth identical pattern data; Step 5.2: Determine whether the stencil opening layer graphic data b and the step layer graphic data b are included. If included, the included stencil opening layer graphic data b has steps, and obtain the stencil opening layer graphic data b covered by the steps. Otherwise, there are no steps. Step 5.3, compare the thickness of the covered steel mesh opening layer graphic data b with the thickness of the fifth identical graphic data to see if they are the same. If they are the same, copy the stepped layer graphic data b covering the steel mesh opening layer graphic data b to the corresponding position of the stepped layer graphic data a to complete the steel mesh design of the PCB board to be designed.

12. A system for slightly modified steel mesh design, characterized in that: include: An acquisition module is used to acquire data A of a PCB board to be designed with a stencil and data B of a PCB board for which the stencil design has been completed, wherein the data A includes solder paste printing layer graphic data a and stencil opening layer graphic data a, and the data B includes solder paste printing layer graphic data b and stencil opening layer graphic data b; A classification module, configured to classify the solder paste printing layer graphic data b containing the device name and pin information and the solder paste printing layer graphic data a according to the package name; a pattern determination module, configured to perform an XOR analysis on the solder paste printing layer pattern data a and the solder paste printing layer pattern data b to determine first identical pattern data and different pattern data; a slightly revised version judgment module, configured to judge whether the PCB board to be designed with the stencil is a slightly revised version; if it is a slightly revised version, obtaining fifth stencil opening layer graphic data a according to the first identical graphic data, the different graphic data, the solder paste printing layer graphic data a, the solder paste printing layer graphic data b, and the stencil opening layer graphic data b; The step judgment module is used to judge whether the steel mesh opening layer graphic data b is covered by the step. If so, the fifth steel mesh opening layer graphic data a and the steel mesh opening layer graphic data b obtained by the micro-revised version judgment module are subjected to XOR analysis to obtain fifth identical graphic data, and the thickness of the fifth identical graphic data and the steel mesh opening layer graphic data b covered by the step are compared to complete the steel mesh design of the PCB board to be designed by the steel mesh.

13. An electronic device, characterized in that: It includes a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus; memory for storing computer programs; A processor, configured to implement the method steps described in any one of claims 1 to 11 when executing the computer program.

14. A storage medium, characterized in that The storage medium stores a computer program, which, when executed by a processor, implements the method steps described in any one of claims 1 to 11.

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