A die bonding apparatus and a die bonding method

Abstract

This invention relates to the field of die bonding technology, and particularly to a die bonding apparatus and method. The die bonding apparatus, used to fix a chip onto a substrate, includes a main body with a robotic arm assembly mounted thereon. The main body defines at least two spaced-apart soldering zones and photocuring zones. The apparatus also includes a control module. The robotic arm assembly, the soldering zones, and the photocuring zones are electrically connected to the control module. Under the control of the control module, the robotic arm assembly can individually enter the soldering zone or the photocuring zone, or sequentially enter the photocuring zone and the soldering zone, depending on the substrate type, to fix the chip onto the substrate. This application benefits from the diversity of robotic arm assembly functions and enhances the versatility of the die bonding apparatus.

Description

[Technical Field]

[0002] This invention relates to the field of crystal bonding technology, and in particular to a crystal bonding apparatus and a crystal bonding method. [Background Technology]

[0004] Currently, die bonding for related electronic products is usually accomplished by die bonding equipment. However, existing die bonding equipment can usually only perform soldering or bonding operations, which is limited in function and has poor versatility. [Summary of the Invention]

[0006] To address the problem of poor versatility in existing die bonding equipment, this invention provides a die bonding device and a die bonding method.

[0007] The present invention provides a die bonding device for fixing chips onto a substrate, comprising a main body, a robotic arm assembly, a movable robotic arm and a universal binding head on the robotic arm, an operating head detachably connected to the universal binding head, the universal binding head being connectable to different types of operating heads, the main body defining at least spaced soldering areas and photocuring areas, and a control module, the robotic arm assembly, the soldering areas and the photocuring areas being electrically connected to the control module; the robotic arm assembly, under the control of the control module, can individually enter the soldering area or the photocuring area, or sequentially enter the photocuring area and the soldering area, to fix the chip onto the substrate.

[0008] Preferably, the welding area is provided with a eutectic stage, the eutectic stage includes a support part and an upper cover that is movably covered on the support part, the upper cover and the support part form a die-bonding area, the support part is provided with a first vacuum suction hole for adsorbing the substrate, and the support part is provided with a heating component for heating the die-bonding area.

[0009] Preferably, the light curing zone is provided with a light curing stage and an irradiation device for curing the light-curing adhesive. The irradiation device emits light to irradiate at least a portion of the area of ​​the light curing stage. The light curing stage and the irradiation device can move relative to each other so that the irradiation device can irradiate different areas of the light curing stage.

[0010] Preferably, the die bonding device further includes a vision adjustment module for precision calibration, the vision adjustment module being electrically connected to the control module, the vision adjustment module including a first vision component for observing the substrate state and a second vision component for observing the chip state; the robotic arm assembly can also adjust the relative orientation of the chip and the substrate based on the sensing results of the first vision component and the second vision component.

[0011] To solve the above-mentioned technical problems, the present invention also provides a die bonding method, which uses the above-mentioned die bonding equipment to bond a substrate, and includes the following steps:

[0012] Identify the substrate to be die bonded and confirm the substrate type;

[0013] The substrate is transported to the soldering area or photocuring area;

[0014] Replace the manipulator head on the robotic arm assembly to move the chip to be soldered to the soldering area and solder it to the substrate located within the soldering area; or

[0015] The chip to be bonded is moved to the photocuring area and bonded to the substrate located in the photocuring area; or the chip to be bonded to the substrate located in the photocuring area is first transported to the welding area for welding.

[0016] Preferably, the step of welding the substrate located in the welding area specifically includes the following steps:

[0017] Identify the chip to be processed;

[0018] Pick up the chip, move it, and place it onto the substrate in the soldering area;

[0019] The substrate and chip located in the welding zone are heated for a predetermined time to complete the welding process.

[0020] Preferably, before placing the chip onto the substrate within the soldering area, the following steps are further included:

[0021] The orientation of the substrate and chip is calibrated;

[0022] The orientation of the substrate or chip is calibrated based on the acquired images of the substrate and chip.

[0023] Preferably, the step of photocuring the substrate located in the photocuring zone specifically includes the following steps:

[0024] Identify the substrate placed within the photocuring area;

[0025] Adhesive treatment is applied to a predetermined area of ​​the substrate within the photocuring zone;

[0026] Move the chip to be bonded and place it in the preset area where the adhesive has been applied to complete the pre-bonding;

[0027] The pre-bonded substrate and chip in the photocuring zone are subjected to photocuring treatment.

[0028] Preferably, the adhesive treatment includes dispensing and / or painting.

[0029] Preferably, the step of photocuring the substrate and chip within the photocurable area specifically includes the following steps:

[0030] Move the substrate with the chip in place to the photocuring irradiation area;

[0031] Allow the substrate with the chip placed on it to remain in the irradiation area for a predetermined time;

[0032] Remove the irradiated substrate and allow the next substrate to enter the irradiation range for photocuring.

[0033] Compared with the prior art, the die bonding equipment and die bonding method of the present invention have the following advantages:

[0034] 1. The die bonding equipment of the present invention is provided with a welding area and a photocuring area. It can be understood that the robotic arm assembly can enter the welding area or the photocuring area under the control of the control module to perform corresponding operations, and can also move between the welding area and the photocuring area. The operating head conversion frame facilitates the rapid replacement of the operating head of the robotic arm assembly, allowing the robotic arm assembly to complete a variety of operating processes by changing the operating head, which helps to enhance the versatility of the robotic arm assembly's functions.

[0035] 2. The eutectic stage of this invention achieves the heating function through the heating component in the carrier part, thereby melting the solder. The first vacuum suction hole can adsorb the substrate and prevent the substrate from shifting. The ventilation hole on the carrier part allows inert gas to be introduced into the die bonding area through the ventilation hole during heating, which can prevent the substrate and chip from oxidizing during the heating process.

[0036] 3. In this invention, the photocuring area, through the cooperation of the photocuring stage and the irradiation device, allows the two steps of irradiation photocuring and coating to be independent of each other. The drive component can move the substrate with the coated chip placed to the irradiation range for photocuring, while the robotic arm component can continue to operate on the substrate to be processed.

[0037] 4. The visual adjustment module in this invention can assist in identifying the positioning positions of the substrate and the chip, making it convenient to quickly pick up the substrate and the chip; in addition, the visual adjustment module can also fine-tune the orientation of the chip during the movement and placement of the chip, making the fit between the chip and the substrate more precise and improving the die bonding quality.

[0038] 5. In the die bonding method of the present invention, by identifying the substrate to be processed in advance, it is possible to automatically determine whether the subsequent process should be welding or photopolymerization; and transport the substrate to the corresponding area.

[0039] 6. In the die bonding method of the present invention, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the bonding area. This can effectively enhance the placement accuracy between the chip and the substrate, which is beneficial to improving product quality and reducing the defect rate.

[0040] 7. In the die bonding method of the present invention, the orientation calibration between the chip and the substrate is completed by image comparison, which has high calibration accuracy.

[0041] 8. In the die bonding method of the present invention, the robotic arm assembly can automatically change the corresponding operating head for different processes, which has a high degree of automation and strong versatility.

[0042] 9. In the die bonding method of the present invention, while removing the photocured substrate, the next substrate is allowed to enter the irradiation range of the photocuring, which helps to improve the overall efficiency of photocuring. [Attached Image Description]

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a block diagram of the die bonding apparatus provided in the first embodiment of the present invention.

[0046] Figure 2 This is a block diagram of the robotic arm assembly of the die bonding device provided in the first embodiment of the present invention.

[0047] Figure 3 This is a block diagram of the welding area of ​​the die bonding device provided in the first embodiment of the present invention.

[0048] Figure 4 This is a block diagram of the photocuring zone of the die bonding device provided in the first embodiment of the present invention.

[0049] Figure 5 This is a block diagram of the vision adjustment module of the die bonding device provided in the first embodiment of the present invention.

[0050] Figure 6 This is a block diagram of the transfer stage in the die bonding device provided in the first embodiment of the present invention.

[0051] Figure 7 This is a block diagram of the die bonding method provided in the second embodiment of the present invention.

[0052] Figure 8 This is a block diagram of step S3A of the die bonding method provided in the second embodiment of the present invention.

[0053] Figure 9 This is a block diagram of step 1B of the die bonding method provided in the second embodiment of the present invention.

[0054] Explanation of reference numerals in the attached diagram:

[0055] 100. Die bonding equipment;

[0056] 1. Main body; 11. Processing table; 111. Processing area;

[0057] 12. Robotic arm assembly; 121. Movable robotic arm; 122. Movable end; 123. Universal binding head; 124. Operating head;

[0058] 2. Welding area; 21. Eutectic stage; 211. Supporting part; 2111. First vacuum suction port; 2112. Heating component; 2113. Vent hole; 212. Top cover;

[0059] 3. UV curing area; 31. UV curing stage; 311. Drive assembly; 312. Fixture; 3121. Slot; 32. Irradiation device; 33. Adhesive application stage;

[0060] 4. Material box; 5. Transfer rack;

[0061] 6. Visual adjustment module; 61. First visual component; 62. Second visual component;

[0062] 7. Transfer platform; 71. Second vacuum suction port;

[0063] 8. Control module.

Detailed Implementation Methods

[0065] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0066] The terms “vertical,” “horizontal,” “left,” “right,” “up,” “down,” “upper left,” “upper right,” “lower left,” “lower right,” “lower left,” “lower right,” and similar expressions used in this article are for illustrative purposes only.

[0067] Please combine Figure 1 and Figure 2The first embodiment of the present invention provides a die bonding device 100, including a main body 1. The main body 1 includes a support platform 11, a robotic arm assembly 12 disposed on the support platform 11, an operating head conversion frame 5, and at least two types of operating heads 124 disposed on the operating head conversion frame 5. The operating head conversion frame 5 is provided with at least one suction head placement slot and at least one adhesive head placement slot. Different processing areas 111 are defined on the support platform 11. The robotic arm assembly 12 includes a movable robotic arm 121 and a universal binding head 123 disposed on the robotic arm. The universal binding head 123 is detachably connected to the operating head 124. The robotic arm assembly 12 can automatically replace the operating head 124 connected to the universal binding head 123 according to the needs of different processing areas 111.

[0068] It is understood that the die bonding equipment 100 of the present invention defines a welding zone 2 and a photocuring zone 3. The robotic arm assembly 12 can operate in the welding zone 2 or the photocuring zone 3. At the same time, the robotic arm assembly 12 can be replaced with different types of suction heads or adhesive heads 124 through the operating head conversion frame 5. With the cooperation of the above mechanisms, the die bonding equipment 100 of the present invention can be freely switched between welding and adhesive processes, which can effectively enhance the versatility of the functions of the die bonding equipment 100.

[0069] Furthermore, the processing area 111 is defined by at least a welding area 2 and a photocuring area 3. This design facilitates the diversification of functions of the die bonding equipment 100.

[0070] Furthermore, the die bonding equipment 100 also includes a control module 8, and the robotic arm assembly 12 is electrically connected to the control module 8; under the control of the control module 8, the robotic arm assembly 12 automatically changes the operating head 124 to adapt to the needs of different processing areas 111. This design facilitates real-time detection and control of the die bonding equipment 100, resulting in a high degree of automation.

[0071] Furthermore, the support platform 11 is also equipped with a material box 4 for holding the substrate and the chip.

[0072] Please continue reading. Figure 1 and Figure 2 The robotic arm assembly 12 includes a movable robotic arm 121 and a movable end 122 disposed on the movable robotic arm 121. A universal tie head 123 is disposed on the movable end 122 and can move within the processing area 111 as the movable robotic arm 121 operates.

[0073] Specifically, in this embodiment, the movable robotic arm 121 is a three-axis movable robotic arm, which includes movable X-axis guide rails, Y-axis guide rails and Z-axis guide rails, with the movable end 122 located at the end of the Z-axis guide rail; in other embodiments, other types of three-axis or multi-axis robotic arm components 12 may also be used.

[0074] Specifically, in this embodiment, the operating head 124 includes a suction head and an adhesive head. The end of each suction head and adhesive head that is used to cooperate with the universal binding head 123 is a universal end with the same structure and size. It can be understood that the suction head may be provided with one or more suction holes of equal or different sizes.

[0075] Please combine Figure 1 and Figure 3 The soldering area 2 is provided with a eutectic stage 21, which includes a support portion 211 and an upper cover 212 movably covering the support portion 211. The support portion 211 is provided with a first vacuum suction hole 2111, and a heating component 2112 is provided inside the support portion 211. The eutectic stage 21 of the present invention achieves its heating function through the heating component 2112 inside the support portion 211, thereby melting the solder. The first vacuum suction hole 2111 can adsorb the substrate and prevent the substrate from shifting.

[0076] Specifically, in this embodiment, the heating component 2112 includes an infrared heating device.

[0077] Furthermore, an opening is provided in the central region of the side of the top cover 212 away from the support portion 211, through which the robotic arm assembly 12 picks up and places the substrate and the chip. Specifically, in this embodiment, the opening is located in the central region of the top surface of the top cover 212.

[0078] Furthermore, the upper cover 212 and the support portion 211 form a die-bonding region, and the support portion 211 is also provided with vent holes 2113 for ventilation within the die-bonding region. Understandably, during heating, introducing inert gas into the die-bonding region through the vent holes 2113 can prevent oxidation of the substrate and chip during the heating process. After heating, cooling gases such as nitrogen can be introduced into the die-bonding region through the vent holes 2113 for rapid cooling, which helps improve die-bonding efficiency.

[0079] Specifically, in this embodiment, the upper cover 212 is placed directly on the support portion 211 to form a die-bonding area, and the two are not fixed together so that the upper cover 212 can be removed.

[0080] Please combine Figure 1 and Figure 4 The photocuring area 3 is provided with a photocuring stage 31 and an irradiation device 32. The irradiation device 32 emits light to irradiate a part of the photocuring stage 31. The photocuring stage 31 includes a driving component 311 and a clamp 312 provided on the driving component 311. The clamp 312 is provided with a plurality of slots 3121 for placing substrates. The clamp 312 can move with the driving component 311 so that each slot 3121 enters the irradiation range of the irradiation device 32 in sequence.

[0081] Understandably, in this embodiment, the cooperation between the photocuring stage 31 and the irradiation device 32 allows the two steps of photocuring and coating to be independent of each other. The drive component 311 can move the substrate with the coated substrate and chip placed on it into the irradiation range for photocuring, while the robotic arm component 12 can continue to operate on other substrates to be processed on the photocuring stage 31.

[0082] Specifically, in this embodiment, the drive component 311 includes a slide rail assembly and an electrode for driving the slide rail assembly; in other embodiments, the drive component 311 may also take the form of an electrode-driven conveyor belt or other forms.

[0083] In other embodiments, the irradiation device 32 and the photocuring stage 31 can be moved relative to each other by driving the irradiation device 32 through the driving component 311; the irradiation device 32 and the photocuring stage 31 can also be moved relative to each other by driving the irradiation device 32 and the photocuring stage 31 respectively.

[0084] Furthermore, the slots 3121 are arranged at equal intervals on the fixture 312. This design allows the illuminated slots 3121 to be changed simply by moving the drive assembly 311 a fixed distance.

[0085] Furthermore, a glue-dip station 33 is also provided in the light curing zone 3, which is located in the processing area 111.

[0086] Please combine Figure 1 and Figure 5 The die bonding equipment 100 also includes a vision adjustment module 6 for precision calibration. The vision adjustment module includes a first vision component 61 and a second vision component 62. The first vision component 61 is located on the movable end 122 and is set close to the universal binding head 123. The second vision component 62 is located in the processing area 111.

[0087] Understandably, the visual adjustment module 6 of the present invention can assist in identifying the positioning positions of the substrate and the chip, making it convenient to quickly pick up the substrate and the chip; in addition, the visual adjustment module 6 can also fine-tune the orientation of the chip during the movement and placement of the chip, making the fit between the chip and the substrate more precise and improving the die bonding quality.

[0088] Furthermore, the robotic arm assembly 12 can adjust the relative orientation of the chip and the substrate based on the sensing results of the first vision assembly 1 and the second vision assembly 62.

[0089] Specifically, in this embodiment, the first vision component 61 includes a downward-looking CCD camera, and the second vision component 62 includes an upward-looking CCD camera.

[0090] Please combine Figure 1 and Figure 6The die bonding equipment 100 also includes a transfer station 7 for cooperating with the first vision component 61. The transfer station 7 is provided with a second vacuum suction hole 71 and is located in the processing area 111.

[0091] Understandably, the transfer station 7 of the present invention can assist the robotic arm assembly 12 in adjusting the orientation of the chip, which helps to improve the adjustment efficiency; the second vacuum suction hole 71 on the transfer station 7 can adsorb the chip to prevent the chip from shifting and affecting the calibration accuracy.

[0092] Furthermore, the transfer station 7 is located near the welding area 2 within the processing area 111.

[0093] Understandably, the transfer station 7 is positioned close to the welding area 2 to facilitate the first vision component 61 in quickly acquiring an image of the substrate on the welding area 2, which can further improve adjustment efficiency.

[0094] Please combine Figure 1 , Figure 3 , Figure 4 and Figure 6 The carrier platform 11 has multiple mounting holes, through which the eutectic stage 21, photopolymerization stage 31, operating head conversion frame 5, material box 4, second vision component 62, and transfer station 7 are detachably connected to the carrier platform 11. This design facilitates the later maintenance of the die bonding equipment 100, and also makes it easy to replace different models of modules for different products, thus having strong versatility.

[0095] Please combine Figures 7 to 9 The second embodiment of the present invention provides a die bonding method, comprising the following steps:

[0096] Step S1: Identify the substrate to be processed and confirm the substrate type;

[0097] Step S2: Transport the substrate to the soldering area or photocuring area;

[0098] Step S3A: Move the chip to be soldered to the soldering area and solder it onto the substrate located in the soldering area;

[0099] Step S3B: Move the chip to be bonded to the photocuring area and bond it to the substrate located in the photocuring area;

[0100] Step S3C: First, attach the chip to be processed to the substrate located in the photocuring area, and then transport it to the soldering area for soldering.

[0101] Steps S3A, S3B, and S3C represent three options, which can be selected based on actual product requirements.

[0102] Understandably, in the die bonding method of the present invention, by identifying the substrate to be processed in advance, it is possible to automatically determine whether the subsequent process should be welding or photopolymerization; and transport the substrate to the corresponding area.

[0103] Specifically, in this embodiment, the substrate in step S3A is transported to the support portion at the eutectic stage in the welding area; at the same time, the first vacuum suction hole on the support portion is opened to firmly suction the substrate.

[0104] Furthermore, step S3A specifically includes the following steps:

[0105] Step S3A1: Identify the chip to be welded; understandably, identifying the chip to be processed first helps improve the operation progress of the robotic arm components.

[0106] Step S3A2: Pick up the chip, move it and place it on the preset soldering position on the substrate in the soldering area;

[0107] Specifically, in this embodiment, the chip is gripped and moved by the operating head on the robotic arm assembly.

[0108] Step S3A3: Heat the substrate and chip located in the welding area for a predetermined time to complete the welding process.

[0109] Furthermore, before placing the chip onto the substrate within the soldering area, the following steps are also included:

[0110] Step S3A4: Calibrate the orientation of the chip according to the orientation of the substrate.

[0111] In this embodiment, the numerical values ​​of each step do not necessarily represent the order of occurrence.

[0112] Understandably, in the die bonding method of the present invention, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the bonding area. This can effectively enhance the placement accuracy between the chip and the substrate, which is beneficial to improving product quality and reducing the defect rate.

[0113] Furthermore, the following steps are included before proceeding to step S3A3:

[0114] Step S3A5: Turn on the protective gas, use the temperature controller to heat the heating element to the preset temperature, and maintain it for the predetermined time;

[0115] Furthermore, after step S3A3, the following steps are also included:

[0116] S3A6: Turn on the cooling gas to lower the temperature to the preset value, then turn off the eutectic stage vacuum. Specifically, in this embodiment, the cooling gas is nitrogen.

[0117] Furthermore, step S3A4 specifically includes the following steps:

[0118] Step S3A41: Obtain an image of the substrate within the welding area;

[0119] Step S3A42: Acquire an image of the chip;

[0120] Step S3A43: Calibrate the orientation of the chip based on the acquired images of the substrate and the chip.

[0121] As can be understood, in the die bonding method of the present invention, the orientation calibration between the chip and the substrate is completed by image comparison, and the calibration accuracy is high.

[0122] Furthermore, step S3B specifically includes the following steps:

[0123] Step S3B1: Identify the substrate placed within the photocuring area;

[0124] Specifically, identify the substrate type and obtain the adhesive area and / or adhesive points on the substrate.

[0125] Step S3B2: The robotic arm assembly moves to the operator head conversion frame to change the operator head;

[0126] Step S3B3: Apply adhesive to a preset area of ​​the substrate within the photocuring zone;

[0127] Step S3B4: The robotic arm assembly moves to the operator head conversion frame to change the operator head;

[0128] Step S3B5: Move the chip to be bonded and place it in the preset area where the adhesive has been applied;

[0129] Step S3B6: Perform photocuring treatment on the substrate and chip in the photocuring zone.

[0130] Understandably, in the die bonding method of the present invention, the robotic arm assembly can automatically change the corresponding operating head for different processes, resulting in a high degree of automation and strong versatility.

[0131] Specifically, in this embodiment, before moving the chip and substrate, it is ensured that the operating head of the robotic arm assembly has been replaced with the corresponding suction head; and before performing the adhesive treatment, the suction head is replaced with the corresponding adhesive head.

[0132] Optional adhesive treatments include dispensing and / or painting.

[0133] Understandably, when the bonding area between the chip and the substrate is small, dispensing is sufficient; when the bonding area between the chip and the substrate is large, applying adhesive or a combination of dispensing and applying adhesive can be used.

[0134] Furthermore, step S3B6 specifically includes the following steps:

[0135] Step S3B61: Move the substrate with the chip in place to the photocuring irradiation area;

[0136] Step S3B62: Allow the substrate with the chip placed to remain in the irradiation area for a predetermined time;

[0137] Step S3B63: Remove the irradiated substrate and allow the next substrate to enter the photocuring irradiation range.

[0138] Furthermore, step S3C specifically includes the following steps:

[0139] Step S3C1: Attach the chip to be processed to the substrate located in the photocuring area; for specific steps, please refer to step S3B.

[0140] Step S3C2: Move the photocured chip and substrate into the soldering area;

[0141] Step S3C3: Solder the chip to the substrate in the soldering area.

[0142] Compared with the prior art, the die bonding equipment and die bonding method of the present invention have the following advantages:

[0143] 1. The die bonding equipment of the present invention is provided with a welding area and a photocuring area. It can be understood that the robotic arm assembly can enter the welding area or the photocuring area under the control of the control module to perform corresponding operations, and can also move between the welding area and the photocuring area. The operating head conversion frame facilitates the rapid replacement of the operating head of the robotic arm assembly, allowing the robotic arm assembly to complete a variety of operating processes by changing the operating head, which helps to enhance the versatility of the robotic arm assembly's functions.

[0144] 2. The eutectic stage of this invention achieves the heating function through the heating component in the carrier part, thereby melting the solder. The first vacuum suction hole can adsorb the substrate and prevent the substrate from shifting. The ventilation hole on the carrier part allows inert gas to be introduced into the die bonding area through the ventilation hole during heating, which can prevent the substrate and chip from oxidizing during the heating process.

[0145] 3. In this invention, the photocuring area, through the cooperation of the photocuring stage and the irradiation device, allows the two steps of irradiation photocuring and coating to be independent of each other. The drive component can move the substrate with the coated chip placed to the irradiation range for photocuring, while the robotic arm component can continue to operate on the substrate to be processed.

[0146] 4. The visual adjustment module in this invention can assist in identifying the positioning positions of the substrate and the chip, making it convenient to quickly pick up the substrate and the chip; in addition, the visual adjustment module can also fine-tune the orientation of the chip during the movement and placement of the chip, making the fit between the chip and the substrate more precise and improving the die bonding quality.

[0147] 5. In the die bonding method of the present invention, by identifying the substrate to be processed in advance, it is possible to automatically determine whether the subsequent process should be welding or photopolymerization; and transport the substrate to the corresponding area.

[0148] 6. In the die bonding method of the present invention, the orientation of the chip is calibrated according to the orientation of the substrate before the chip is placed on the substrate in the bonding area. This can effectively enhance the placement accuracy between the chip and the substrate, which is beneficial to improving product quality and reducing the defect rate.

[0149] 7. In the die bonding method of the present invention, the orientation calibration between the chip and the substrate is completed by image comparison, which has high calibration accuracy.

[0150] 8. In the die bonding method of the present invention, the robotic arm assembly can automatically change the corresponding operating head for different processes, which has a high degree of automation and strong versatility.

[0151] 9. In the die bonding method of the present invention, while removing the photocured substrate, the next substrate is allowed to enter the irradiation range of the photocuring, which helps to improve the overall efficiency of photocuring.

[0152] The die bonding apparatus and die bonding method disclosed in the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A die bonding apparatus for fixing a chip onto a substrate, characterized in that: The device comprises a main body, a mechanical arm assembly arranged on the main body, the mechanical arm assembly comprising a movable mechanical arm and a universal binding head arranged on the mechanical arm, the universal binding head being detachably connected with an operating head, the universal binding head being connectable with different types of operating heads, the main body being defined with at least a welding area and a light curing area arranged in a spaced manner, the die bonding device further comprising a control module, the mechanical arm assembly, the welding area and the light curing area being electrically connected with the control module; the mechanical arm assembly is controlled by the control module to enter the welding area or the light curing area according to the type of substrate or sequentially enter the light curing area and the welding area to fix the chip on the substrate.

2. The die bonding apparatus of claim 1, wherein: The welding area comprises a eutectic table, the eutectic table comprising a bearing part and a movable cover arranged on the bearing part, the bearing part being provided with a first vacuum suction hole, the bearing part being provided with a heating assembly.

3. The die bonding apparatus of claim 1, wherein: The light curing area is provided with a light curing table for curing light curing adhesive and an irradiation device, the irradiation device emitting light to irradiate at least a part of the light curing table; the light curing table and the irradiation device are relatively movable so that the irradiation device can irradiate different areas of the light curing table.

4. The die bonding apparatus of claim 1, wherein: The die bonding device further comprises a visual adjustment module for precision calibration, the visual adjustment module being electrically connected with the control module, the visual adjustment module comprising a first visual component for observing the state of the substrate and a second visual component for observing the state of the chip; the mechanical arm assembly can further adjust the relative position of the chip and the substrate according to the sensing results of the first visual component and the second visual component.

5. A die bonding method, characterized by, The die bonding device according to any one of claims 1-3 is used for die bonding of a substrate, comprising the following steps: identifying the substrate to be die bonded and confirming the type of the substrate; transporting the substrate into the welding area or the light curing area; replacing the operating head on the mechanical arm assembly, moving the chip to be processed which needs to be welded into the welding area and welding it onto the substrate located in the welding area; or moving the chip to be processed which needs to be bonded into the light curing area and bonding it onto the substrate located in the light curing area; or first bonding the chip to be processed onto the substrate located in the light curing area and then transporting it into the welding area for welding processing.

6. The method of claim 5, wherein the adhesive is applied to the die by a method selected from the group consisting of dispensing, screen printing, and ink jet printing. The step of welding the substrate located in the welding area comprises the following steps: identifying the chip to be processed; picking up the chip, moving and placing it onto the substrate in the welding area; heating the substrate and the chip in the welding area for a predetermined time to complete the welding.

7. The method of claim 6, wherein the adhesive is applied to the die by a method selected from the group consisting of dispensing, screen printing, and ink jet printing. Before placing the chip onto the substrate in the welding area, the following steps are further included: calibrating the position of the substrate and the chip; calibrating the position of the substrate or the chip according to the obtained images of the substrate and the chip.

8. The method of claim 5, wherein the adhesive is applied to the die by a method selected from the group consisting of dispensing, screen printing, and ink jet printing. The step of light curing the substrate located in the light curing area comprises the following steps: identifying the substrate placed in the light curing area; performing adhesive treatment on the preset area of the substrate in the light curing area; moving and placing the chip to be bonded at the preset area where the adhesive is applied; performing light curing treatment on the substrate and the chip in the light curing area.

9. The method of claim 8, wherein: The adhesive treatment comprises point adhesive treatment and / or line adhesive treatment.

10. The method of claim 8, wherein the adhesive is applied to the die by a method selected from the group consisting of dispensing, screen printing, and ink jet printing. The step of photo-curing the substrate and the chip in the photo-curing area comprises the following steps: moving the substrate with the chip to the photo-curing irradiation area; stopping the substrate with the chip in the irradiation area for a predetermined time; moving the substrate out of the photo-curing irradiation area, and moving the next substrate into the photo-curing irradiation area.

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