Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method are provided. The substrate processing apparatus includes a substrate support unit that supports a substrate; a liquid supply unit that supplies a liquid to the substrate supported by the substrate support unit, the liquid including any one of a chemical liquid and a cleaning liquid; a processing container that accommodates the substrate support unit and recovers the liquid supplied to the substrate from the liquid supply unit; and a capturing module that is provided to the processing container and captures the liquid in a manner that suppresses the liquid scattered from the substrate from rebounding and being scattered again from the processing container.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] In the process of handling substrates, a process is performed in which the substrate is rotated at high speed and liquid is discharged from the rotating substrate. In this process, the liquid discharged from the nozzle may scatter from the substrate to the outside. Due to this scattering, various contaminants included in the liquid may diffuse to undesirable locations, causing widespread contamination and process defects in substrate handling.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Korean Patent Registration No. 10-0952035 Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a substrate processing apparatus and a substrate processing method that can effectively control the splashing of liquid from the substrate during the process of discharging liquid onto the substrate.

[0007] In addition, a substrate processing apparatus and a substrate processing method are provided that can appropriately select the area of ​​liquid splattering to prevent liquid from splattering to undesirable locations.

[0008] In addition, a substrate processing apparatus and a substrate processing method are provided that can not only prevent liquid from scattering but also prevent contaminants included in the scattering liquid from spreading due to scattering.

[0009] In addition, a substrate processing apparatus and a substrate processing method are provided to prevent the spilled liquid from splashing again, and to link such a splash prevention tool with the execution of a process so as to enable organic cleaning of the splash prevention tool itself.

[0010] The technical problems to be solved by the present invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0011] According to one aspect of the present invention, a substrate processing apparatus for solving the above-mentioned technical problems may include: a substrate support unit for supporting a substrate; a liquid supply unit for supplying liquid to the substrate supported by the substrate support unit, the liquid including either a pharmaceutical solution or a cleaning solution; a processing container for housing the substrate support unit and recovering the liquid supplied from the liquid supply unit to the substrate; and a capture module disposed in the processing container for capturing the liquid in a manner that prevents the liquid scattering from the substrate from bouncing off and scattering from the processing container.

[0012] Additionally, the capture module may include a mesh structure and may capture the liquid that bounces off the processing container and disperses toward the substrate.

[0013] In addition, the capture module can be located in a multi-layer configuration inside the processing container to capture the liquid.

[0014] In addition, the capture module may include polypropylene (PP) material.

[0015] In addition, the specifications of the capture module may include a thickness ranging from 0.5T to 1T and a width of at least 10mm.

[0016] In addition, the capture module can supply the drug solution to the substrate based on the liquid supply unit, capture the drug solution that has scattered into the processing container for the first time, supply the cleaning solution to the substrate based on the liquid supply unit, capture the cleaning solution that has scattered into the processing container for the second time, and clean the drug solution that was captured in the first time through the second capture.

[0017] Additionally, the processing container may include: a first processing container located at the innermost part; a second processing container forming a first inflow space with the first processing container; and a third processing container forming a second inflow space with the second processing container, wherein the capture module is disposed at least in either the first inflow space or the second inflow space to capture the inflowing liquid.

[0018] In addition, the capture module can slide back and forth on the inner wall of the processing container to operate in a first position adjustment mode for capturing the liquid.

[0019] In addition, the capture module can be spaced apart from the inner wall of the processing container by a connecting ball disposed on the inner wall of the processing container.

[0020] In addition, the capture module can tilt and move within a certain range on the connecting ball, thereby operating in a second position adjustment mode for capturing the liquid.

[0021] In addition, the capture module can be installed on the processing container in one or more configurations.

[0022] Additionally, the cleaning solution may include a rinsing solution, and the liquid that scatters from the substrate may include foreign matter that has been cleaned from the substrate.

[0023] A substrate processing method according to another aspect of the present invention for solving the above-mentioned technical problems may include: a step of supporting the substrate by a support unit; a step of supplying liquid to the substrate by a liquid supply unit; and a step of recovering the supplied liquid from the substrate by a processing container, wherein the processing container has a capturing module that captures the liquid as it scatters from the rotating substrate in a manner that prevents the scattered liquid from bouncing off the processing container and scattering again to the periphery.

[0024] The substrate processing apparatus and substrate processing method of the present invention, as described above, have one or more of the following effects.

[0025] The present invention provides a substrate processing apparatus and a substrate processing method that can control the amount of liquid splashing from the substrate during the process of discharging liquid onto the substrate, thereby effectively controlling the extent of liquid splashing.

[0026] In addition, a substrate processing apparatus and substrate processing method can be provided that can appropriately select the area of ​​liquid splattering to prevent liquid from splattering to undesirable locations.

[0027] In addition, a substrate processing apparatus and substrate processing method can be provided that can not only prevent liquid from scattering but also prevent contaminants included in the scattering liquid from spreading due to scattering.

[0028] Additionally, a substrate processing apparatus and substrate processing method can be provided that can provide a splash prevention tool to prevent the splashed liquid from splashing again, and can link such a splash prevention tool to the execution of a process so as to organically clean the splash prevention tool itself. Attached Figure Description

[0029] Figure 1 This is a diagram illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0030] Figures 2 to 3 It is a schematic representation of the basis Figure 1 A diagram showing the operating state of the substrate processing apparatus.

[0031] Figure 3 It shows the basis Figure 1 A diagram showing a portion of the configuration of a substrate processing apparatus.

[0032] Figures 4 to 5 It shows the basis Figure 1 A diagram showing another state of a component of a substrate processing apparatus.

[0033] Figures 6 to 7 It shows the basis Figure 1 A diagram showing another state of a component of a substrate processing apparatus.

[0034] Figures 8 to 9 It shows the basis Figure 1 A diagram showing another state of a component of a substrate processing apparatus.

[0035] Figures 10 to 12 It shows the basis Figure 1 A diagram showing another state of a component of a substrate processing apparatus.

[0036] Figure 13 This is a diagram illustrating a substrate processing apparatus according to another embodiment of the present invention.

[0037] Figure 14 This is a diagram illustrating a substrate processing apparatus according to yet another embodiment of the present invention.

[0038] Figure 15 This is a diagram illustrating a substrate processing apparatus according to yet another embodiment of the present invention.

[0039] Figure 16 This is a flowchart illustrating a substrate processing method according to an embodiment of the present invention.

[0040] Explanation of reference numerals in the attached figures

[0041] 110: Substrate support unit

[0042] 120: Liquid supply unit

[0043] 130: Handling Containers

[0044] 131: First processing container

[0045] 132: Second processing container

[0046] 133: Third processing container

[0047] 140: Capture Module Detailed Implementation

[0048] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, as well as methods for achieving these advantages and features, will be explained by referring to the following description in conjunction with the accompanying drawings. Figure 1The invention becomes clear from the detailed description of the embodiments. However, the invention is not limited to the embodiments disclosed below, but can be implemented in many different forms. These embodiments are provided only to make the disclosure of the invention complete and to fully inform those skilled in the art of the scope of the invention, which is defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0049] To readily describe the relationship between one element or component and another, as shown in the figure, spatial relative terms such as "below," "below," "lower," "above," and "upper" can be used. It should be understood that, in addition to the orientation shown in the figure, spatial relative terms also include terms indicating the different orientations of the elements during use or operation. For example, when the element shown in the figure is flipped, an element described as "below" or "below" of another element may be located "above" of that element. Therefore, the exemplary term "below" can include both "below" and "above" orientations. An element may also be oriented in another direction, thus allowing the spatial relative terms to be interpreted according to orientation.

[0050] Although the terms "first," "second," etc., are used to describe various elements, constituent elements, and / or parts, these elements, constituent elements, and / or parts are obviously not limited by these terms. These terms are only used to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, the first element, first constituent element, or first part mentioned below can obviously also be a second element, second constituent element, or second part within the technical concept of the present invention.

[0051] The terminology used in this specification is for illustrative purposes and is not intended to limit the invention. In this specification, single forms also include plural forms unless specifically mentioned herein. The terms "comprises" and / or "comprising" as used in this specification do not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or components in addition to those mentioned.

[0052] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) may be used in the sense that can be commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be ideally or excessively interpreted unless explicitly defined otherwise.

[0053] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing the invention with reference to the drawings, identical or corresponding constituent elements are given the same reference numerals, regardless of the reference numerals, and repeated descriptions thereof are omitted. Furthermore, for ease of explanation, descriptions of liquid discharge and scattering are exaggerated compared to actual conditions.

[0054] Reference Figure 1 According to an embodiment of the present invention, a substrate processing apparatus includes a substrate support unit 110, a liquid supply unit 120, a processing container 130, and a capture module 140.

[0055] The liquid supply unit 120 described above includes a nozzle drive unit 121, a nozzle arm 122, a nozzle 123, and a liquid supply source 124 (see [link]). Figure 2 The aforementioned processing container 130 includes a first processing container 131, a second processing container 132, and a third processing container 133.

[0056] Here, the aforementioned substrate support unit 110 serves to support the substrate W via the support structure 111. The aforementioned liquid supply unit 120 supplies the substrate W supported by the aforementioned substrate support unit 110 with a liquid solution L1 (see [link to liquid supply unit]). Figure 2 ) and cleaning fluid L2 (see Figure 3 Any liquid in )

[0057] The nozzle 123 of the liquid supply unit 120 uniformly sprays fluid for processing the substrate W from the center to the edge. For this purpose, the position of the nozzle 123 is moved using the nozzle arm 122 as a medium.

[0058] The processing container 130 houses the substrate support unit 110. It also serves to recover liquid supplied from the liquid supply unit 120 to the substrate W. The capture module 140 is disposed within the processing container 130.

[0059] The first processing container 131 of the aforementioned processing container 130 is disposed on the outermost periphery with reference to the aforementioned substrate W. The second processing container 132 of the aforementioned processing container 130 is disposed to form a first inflow space S1 with the aforementioned first processing container 131.

[0060] The third processing container 133 of the aforementioned processing container 130 is configured to form a second inflow space S2 with the aforementioned second processing container 132. The aforementioned third inflow space S3 is also formed on the side of the aforementioned third processing container 133. The aforementioned capture module 140 is provided at least at any of the aforementioned first inflow space S1 to the aforementioned third inflow space S3 to capture (e.g., absorb moisture, grab, etc.) the inflowing liquid.

[0061] Reference Figure 2The capture module 140 prevents the liquid that has splashed from the substrate W from bouncing off the processing container 130 and splashing again. To this end, the capture module 140 includes, for example, a mesh structure for capturing the liquid that splashes again. Thus, the capture module 140 is located in a multi-layered configuration inside the processing container 130 to capture the liquid.

[0062] Reference Figures 2 to 3 The liquid discharged from the liquid supply unit 120 to the substrate W includes a pharmaceutical solution L1 and a cleaning solution (e.g., a rinsing solution) L2. For example, after the pharmaceutical solution L1 and the like are discharged to the substrate W, a rinsing solution and the like are discharged as a subsequent process to clean the substrate W.

[0063] The capture module 140 supplies the liquid medicine L1 to the substrate W based on the liquid supply unit 120, and captures the liquid medicine L1 that has scattered into the processing container 130 for the first time.

[0064] Here, the aforementioned liquid medicine L1 includes foreign matter P on the substrate W due to cleaning the substrate W. The aforementioned capture module 140 captures the aforementioned liquid medicine L1 and the foreign matter P included in the aforementioned liquid medicine L1 together through the aforementioned first capture.

[0065] The aforementioned capture module 140, based on supplying the cleaning solution L2 to the aforementioned substrate W, captures for the second time the cleaning solution L2 that has scattered into the aforementioned processing container 130. That is, through the aforementioned second capture following the first capture, the aforementioned solution L1 captured in the first capture is naturally cleaned during the process.

[0066] Therefore, in the process of processing the substrate W, organic cleaning of the capture module 140 is achieved. As a result, additional cleaning management performed separately from the processing of the substrate W can be omitted or minimized.

[0067] Reference Figure 4 The aforementioned capture module 140 has a circular edge portion 141, and at least a portion thereof is formed as a multi-layered mesh 142. The mesh 142 of this capture module 140 is structured such that the upper layer 1421 and the lower layer 1422 alternately interweave. The mesh 142 is configured such that the upper layer 1421 and the lower layer 1422 intersect each other. In this case, the edge portion 141 can obviously be omitted.

[0068] Reference Figure 5 The aforementioned capture module 140 and Figure 4 The same terrain becomes multiple layers, but the upper layer 1421 and the lower layer 1422 of the aforementioned mesh screen 142 are not connected, but are set independently. At this time, the upper layer 1421 and the lower layer 1422 of the mesh screen 142 are set in a cross-shaped configuration.

[0069] Reference Figures 6 to 7 The aforementioned capture module 140 has the same characteristics as described above. Figures 4 to 5 The structure shown corresponds to the structure shown, but the difference lies in that the overall outer shape is formed, for example, a rectangular shape. This becomes a factor that may affect the capture area of ​​the liquid after being placed on the aforementioned processing container 130.

[0070] Reference Figure 9 The screen 142 of the capture module 140 has a multi-layer structure, but it is arranged so that the upper layer 1421 and the lower layer 1422 are stacked on top of each other without crossing. Here, the capture module 140 is configured to have a through portion TH formed in the center.

[0071] Reference Figure 8 The aforementioned capture module 140 has the same characteristics as... Figure 8 Mostly similar in form. However, it is designed with a through-section TH forming not only in the central part but also on the outer perimeter. In this... Figure 8 and Figure 9 The image shows that the screen 142 has three layers, including an upper layer 1421 and a lower layer 1422, but it can obviously include more than three layers.

[0072] By further stacking the screens 1421, 1422, and 1423 of the capture module 140 in multiple layers, the process of capturing the liquid becomes easier. At the same time, the captured liquid impacts the inner wall of the stacked screens 1421, 1422, and 1423 of the capture module 140 due to the height of the stacked screens, thereby suppressing the liquid from scattering to the outside.

[0073] As described above, the number of layers in the capture module 140 is adjusted considering the liquid inflow space of the processing container 130 and the specifications required for capturing the liquid. Of course, the capture module 140 is obviously not limited to a multi-layered form. At least a portion of the area of ​​the capture module 140 in contact with the liquid is made of polypropylene (PP) material.

[0074] Reference Figure 10 The aforementioned capture module 140 has mesh screens 142a, 142b, 142c, and 142d in its central portion, using the edge portion 141 as a medium. At this time, the mesh screens 142a, 142b, 142c, and 142d are configured to protrude upwards. Additionally, referring to… Figure 11 The mesh 142 of the aforementioned capture module 140 and Figure 10 Similar to the mesh 142, the above-mentioned capture module 140 is configured such that meshes 142a and 142b are divided into two.

[0075] Reference Figure 12The capture module 140's screen 142 is configured to be divided into a central screen 1420 and peripheral screens 142a, 142b, 142c, and 142d surrounding the central screen 1420. Here, the peripheral screens 142a, 142b, 142c, and 142d are configured to protrude, and the central screen 1420 is configured to be either protruding or recessed, unlike the peripheral screens 142a, 142b, 142c, and 142d.

[0076] Reference Figure 13 The capture module 140 slides back and forth on the inner wall of the processing container 130, thereby operating in a first position adjustment mode for capturing the liquid. Here, the sliding method can be implemented manually or automatically using an actuator or the like.

[0077] Reference Figure 14 The capture module 140 is configured to be spaced apart from the inner wall of the processing container 130 by a certain range, using the connecting ball 141 disposed on the inner wall of the processing container 130 as a medium. Here, it is preferable to adjust the spacing considering the first inflow space S1 to the third inflow space S3, etc.

[0078] The aforementioned capture module 140 tilts within a certain range on the connecting ball, thereby operating in a second position adjustment mode for capturing the liquid. That is, the tilting movement takes into account factors such as the angle of liquid dispersion, the size of the liquid, the injection pressure of the liquid supply unit 120, and the injection angle.

[0079] The tilting movement of the capture module 140 described above can be achieved manually or automatically. In particular, when tilting automatically, the tilting is performed in a direction that maximizes the contact area with the liquid, while taking into account the factors mentioned above.

[0080] Similarly, regarding the tilt of the aforementioned capture module 140, it is preferable to adjust its degree of movement by taking into account the aforementioned first inflow space S1 and the aforementioned second inflow space S2, etc. Here, multiple capture modules 140 are provided.

[0081] Conversely, refer to Figure 15 The aforementioned capture module 140 is configured as a single unit on the aforementioned processing container 130, instead of multiple units. The only difference is that its area is larger.

[0082] Reference Figure 16In step S110 of the substrate processing method S100 according to an embodiment of the present invention, the substrate W is supported by a support unit. Then, in step S120, liquid is supplied to the substrate W through a liquid supply unit 120. Then, in step S130, the supplied liquid is recovered from the substrate W through a processing container 130.

[0083] Here, when liquid splashes from the rotating substrate W, the processing container 130 prevents the splashed liquid from bouncing off the container and splashing back into the periphery. For this purpose, a capture module 140 for capturing the liquid is provided in the processing container 130.

[0084] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus comprising: a substrate support unit supporting a substrate; a liquid supply unit supplying a liquid to the substrate supported by the substrate support unit, the liquid including any one of a chemical liquid and a cleaning liquid; a processing container accommodating the substrate support unit and recovering the liquid supplied to the substrate from the liquid supply unit; and a capturing module provided to the processing container and capturing the liquid scattered from the substrate, wherein the capturing module is moved in and out in a sliding manner on an inner wall of the processing container, thereby operating in a first position adjustment mode for capturing the liquid, or the capturing module is moved in a range of inclination on a connecting ball, thereby operating in a second position adjustment mode for capturing the liquid. 2.The substrate processing apparatus according to claim 1, wherein the capturing module captures the liquid in a manner of suppressing the liquid scattered from the substrate from rebounding and scattering again from the processing container. 3.The substrate processing apparatus according to claim 1, wherein the capturing module includes a mesh structure for capturing the liquid scattered again. 4.The substrate processing apparatus according to claim 1, wherein the capturing module is located inside the processing container in a multi-layered form to capture the liquid. 5.The substrate processing apparatus according to claim 2, wherein the capturing module includes a polypropylene material. 6.The substrate processing apparatus according to claim 2, wherein a specification of the capturing module includes a thickness in a range of 0.5T to 1T and a width of at least 10mm. 7.The substrate processing apparatus according to claim 1, wherein the capturing module first captures the chemical liquid scattered to the processing container based on the liquid supply unit supplying the chemical liquid to the substrate, the capturing module second captures the cleaning liquid scattered to the processing container based on the liquid supply unit supplying the cleaning liquid to the substrate, and the capturing module cleans the chemical liquid previously captured by the first capturing through the second capturing. the processing container includes:

8. The substrate processing apparatus according to claim 1, wherein a first processing container located at the innermost, a second processing container forming a first inflow space with the first processing container, and a third processing container forming a second inflow space with the second processing container, wherein the capturing module is provided at least at any one of the first inflow space and the second inflow space to capture the liquid inflowed. 9.The substrate processing apparatus according to claim 1, wherein the capturing module is spaced apart from an inner wall of the processing container with the connecting ball provided to the inner wall of the processing container as a medium. 10.The substrate processing apparatus according to claim 1, wherein the capturing module is provided in a single or multiple on the processing container. 11.A substrate processing apparatus comprising: a substrate support unit supporting a substrate; a liquid supply unit supplying a liquid to the substrate supported by the substrate support unit, the liquid including any one of a chemical liquid and a cleaning liquid; ​ a processing container accommodating the substrate support unit and recovering a liquid supplied to the substrate from the liquid supply unit; and a capturing module provided in the processing container and capturing the liquid scattered from the substrate, wherein the capturing module captures the liquid scattered from the substrate in a manner to inhibit the liquid from rebounding from the processing container and being scattered again, and includes a mesh structure for capturing the liquid scattered again, the capturing module is located inside the processing container in a multi-layered form to capture the liquid, and first captures the chemical liquid scattered to the processing container based on the liquid supply unit supplying the chemical liquid to the substrate, and the capturing module second captures the cleaning liquid scattered to the processing container based on the liquid supply unit supplying the cleaning liquid to the substrate, and cleans the chemical liquid previously captured by the first capturing through the second capturing, and wherein the capturing module is slidably moved in and out on an inner wall of the processing container, thereby operating in a first position adjustment mode for capturing the liquid, or the capturing module is obliquely moved within a range on a connecting ball, thereby operating in a second position adjustment mode for capturing the liquid.

12. A substrate processing method, comprising: a step of supporting a substrate by a support unit; a step of supplying a liquid to the substrate by a liquid supply unit; and a step of recovering the supplied liquid from the substrate by a processing container, wherein the processing container has a capturing module that captures the liquid when the liquid is scattered from the rotating substrate, and wherein the capturing module is slidably moved in and out on an inner wall of the processing container, thereby operating in a first position adjustment mode for capturing the liquid, or the capturing module is obliquely moved within a range on a connecting ball, thereby operating in a second position adjustment mode for capturing the liquid.

13. The substrate processing method according to claim 12, wherein when the liquid is scattered from the rotating substrate, the capturing module captures the scattered liquid in a manner to inhibit the liquid from rebounding from the processing container and being scattered again to a peripheral portion.

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