A high-speed and high-precision die bonder head for semiconductor chips

Abstract

The present invention discloses a die bonding head for a high-speed and high-precision semiconductor chip die bonder, which includes a lightweight frame, a die bonding head, and a high-speed moving mechanism. The high-speed moving mechanism is disposed on the lightweight frame, and the die bonding head is disposed on the high-speed moving mechanism and is driven by the high-speed moving mechanism to move at high speed. The resonant frequency of the lightweight frame is higher than 400 Hz. This die bonding head of the die bonder can achieve high-speed and high-precision handling of semiconductor chips.

Description

Technical Field

[0001] The present invention relates to a die bonding device for chips, and in particular to a die bonder head for a high-speed and high-precision semiconductor chip die bonder. Background Art

[0002] A die bonder is one of the key devices essential in the semiconductor chip packaging process, and is used to bond a semiconductor chip to a specified area on a PCB or a substrate through a colloid to form a thermal path or an electrical path, providing conditions for subsequent wire bonding connections.

[0003] A die bonder head is an important component of a die bonder and is used to grasp and transport semiconductor chips. Generally, it includes a frame, a die bonding head, and a moving mechanism. The die bonding head is used to grasp the semiconductor chip, and the moving mechanism is used to drive the die bonding head to move so as to transport the semiconductor chip to a specified area.

[0004] For the existing die bonder heads, due to the large weight of the frame and the low resonance frequency, which is about 200 Hz, the moving mechanism is likely to generate resonance with the frame when driving the die bonding head to move. Therefore, it is necessary to control the moving acceleration of the moving mechanism below 10g and the moving speed below 2.5 m / s, and long-term operation affects the accuracy. Summary of the Invention

[0005] In order to solve the above deficiencies of the prior art, the present invention provides a die bonder head for a semiconductor chip, which can achieve high-speed and high-precision transportation of the semiconductor chip.

[0006] The technical problems to be solved by the present invention are realized through the following technical solutions:

[0007] A die bonder head for a high-speed and high-precision semiconductor chip includes a lightweight frame, a die bonding head, and a high-speed moving mechanism. The high-speed moving mechanism is arranged on the lightweight frame, and the die bonding head is arranged on the high-speed moving mechanism and is driven by the high-speed moving mechanism to move at high speed; the resonance frequency of the lightweight frame is higher than 400 Hz.

[0008] Further, the high-speed moving mechanism includes a first moving mechanism, a second moving mechanism, and a third moving mechanism. The first moving mechanism, the second moving mechanism, and the third moving mechanism are all arranged on the lightweight frame and are used to drive the die bonding head to move at high speed along the X-axis, Y-axis, and Z-axis respectively, and the X-axis, Y-axis, and Z-axis are perpendicular to each other in pairs.

[0009] Further, the first moving mechanism includes a first guide rail disposed on the lightweight frame along the X-axis direction, a first base disposed on the first guide rail, and a first linear motor disposed on the lightweight frame and connected to drive the first base to move on the first guide rail. The second moving mechanism includes a second guide rail disposed on the first base of the first moving mechanism along the Y-axis direction, a second base disposed on the second guide rail, and a second linear motor disposed on the lightweight frame and connected to drive the second base to move on the second guide rail. The third moving mechanism includes a third guide rail disposed on the second base of the second moving mechanism along the Z-axis direction, a third base disposed on the third guide rail, and a third linear motor disposed on the lightweight frame and connected to drive the third base to move on the third guide rail. The die bonding head is disposed on the third base to move along the X-axis, Y-axis, and Z-axis directions with the third base.

[0010] Further, the first linear motor includes a first mover plate for driving the first base to move along the X-axis direction, a first stator plate for driving the first mover plate to move along the X-axis direction, and two first guiding members. The first stator plate is fixedly disposed on the lightweight frame, and the two first guiding members are oppositely disposed at both ends of the first stator plate in the Y-axis direction. The first mover plate is located between the two first guiding members. A first guiding groove extending along the X-axis direction is formed on the surface of each of the two first guiding members facing the first mover plate. The two ends of the first mover plate in the X-axis direction respectively extend into the first guiding grooves of the corresponding first guiding members.

[0011] Further, the second linear motor includes a second mover plate for driving the second base to move along the Y-axis direction, a second stator plate for driving the second mover plate to move along the Y-axis direction, and two second guiding members. The second stator plate is fixedly disposed on the first base, and the two second guiding members are oppositely disposed at both ends of the second stator plate in the X-axis direction. The second mover plate is located between the two second guiding members. A second guiding groove extending along the Y-axis direction is formed on the surface of one of the second guiding members facing the second mover plate, and a guiding hole extending along the Y-axis direction is formed on the other second guiding member. One end of the second mover plate in the X-axis direction extends into the second guiding groove of the corresponding second guiding member, and the other end in the X-axis direction passes through the guiding hole of the corresponding second guiding member and is connected to the second base.

[0012] Further, the second linear motor further includes two air jet members which are oppositely arranged at two ends of the second stator plate in the Y-axis direction, and the two air jet members are configured to respectively jet air curtains onto two side surfaces of the second mover plate in the Z-axis direction; each air jet member includes an air inlet joint and an air jet nozzle which are communicated with each other, and a flow guiding inclined platform and an air outlet groove which are communicated with each other. The air inlet joint of the air jet member is used for connecting a compressed air source. The air jet nozzle and the flow guiding inclined platform are oppositely arranged in the Z-axis direction to respectively face the two side surfaces of the second mover plate; the flow guiding inclined platforms of the two air jet members both face the air jet nozzles of the other party.

[0013] Further, the third linear motor includes a third mover plate for driving the third base to move in the Z-axis direction, and a third stator plate for driving the third mover plate to move in the Z-axis direction. The third stator plate is arranged on the lightweight frame, and the third mover plate is connected to the third base.

[0014] Further, the third linear motor further includes an air jet member and a grid hole plate which are oppositely arranged at two ends of the third stator plate in the Y-axis direction, and the third mover plate is located between the air jet member and the grid hole plate; the air jet member is configured to jet an air curtain onto one side surface of the third mover plate in the X-axis direction, and the grid hole plate is configured to allow the air curtain jetted by the air jet member to flow out.

[0015] Further, the lightweight frame includes a frame base and a frame body, and the frame body is arranged on the frame base; a receiving groove extending in the X-axis direction is formed on a surface of the frame base facing the frame body, and the first moving mechanism is arranged in the receiving groove; the frame body includes a body bottom plate, a support wall, two support columns and two support beams. The support wall is vertically connected to one side of the body bottom plate in the X-axis direction, the two support columns are vertically connected to the other side of the body bottom plate in the X-axis direction, and the two support columns are respectively located at two ends of the body bottom plate in the Y-axis direction; one support beam is connected between one support column and the body bottom plate, and the other support beam is connected between the other support column and the body bottom plate; the second moving mechanism is arranged in a space surrounded by the body bottom plate, the support wall, the support columns and the support beams; the third moving mechanism is arranged on a surface of the two support columns facing away from the support wall.

[0016] Further, a plurality of second weight reduction grooves are formed on surfaces of the body bottom plate and the support wall, and a plurality of third weight reduction grooves are formed on a surface of the support beam.

[0017] The present invention has the following beneficial effects: The bonding head of the die bonder uses a lightweight frame with a resonant frequency higher than 400 Hz to carry the high-speed moving mechanism, so as to avoid resonance between the high-speed moving mechanism and the lightweight frame when the high-speed moving mechanism drives the bonding head of the die bonder to move at high speed. It is allowed to increase the moving acceleration of the high-speed moving mechanism to more than 18 g and the moving speed to more than 4.5 m / s, greatly improving the speed and accuracy of the bonding head of the die bonder for handling semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic structural diagram of the bonding head of the die bonder provided by the present invention;

[0019] Figure 2 is Figure 1 a schematic structural diagram of the first moving mechanism in the bonding head of the die bonder shown;

[0020] Figure 3 is Figure 2 a schematic structural diagram of the first linear motor in the first moving mechanism shown;

[0021] Figure 4 is Figure 1 a schematic structural diagram of the second moving mechanism in the bonding head of the die bonder shown;

[0022] Figure 5 is Figure 4 a schematic structural diagram of the second linear motor in the second moving mechanism shown;

[0023] Figure 6 is Figure 4 a schematic cross-sectional view of the second linear motor in the second moving mechanism shown;

[0024] Figure 7 is Figure 5 a schematic structural diagram of the air jet member in the second linear motor shown;

[0025] Figure 8 is Figure 5 a schematic cross-sectional view of the air jet member in the second linear motor shown;

[0026] Figure 9 is Figure 1 a schematic structural diagram of the third moving mechanism in the bonding head of the die bonder shown;

[0027] Figure 10 is Figure 10 a schematic structural diagram of the third linear motor in the third moving mechanism shown;

[0028] Figure 11 is Figure 1 a schematic structural diagram of the frame in the bonding head of the die bonder shown. DETAILED DESCRIPTION OF THE INVENTION

[0029] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation of the present invention.

[0030] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention.

[0031] In addition, the terms "first", "second", "third" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first", "second", "third" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "set", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may also be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] As Figure 1 shown, a die bonding head of a high-speed and high-precision semiconductor chip die bonder includes a lightweight frame 100, a die bonding head 300, and a high-speed moving mechanism 200. The high-speed moving mechanism 200 is disposed on the lightweight frame 100, and the die bonding head 300 is disposed on the high-speed moving mechanism 200 and is driven by the high-speed moving mechanism 200 to move at high speed; the resonance frequency of the lightweight frame 100 is higher than 400 Hz.

[0034] The die bonder head uses a lightweight frame 100 with a resonant frequency higher than 400 Hz to carry the high-speed moving mechanism 200, so as to avoid resonance between the high-speed moving mechanism 200 and the lightweight frame 100 when the high-speed moving mechanism 200 drives the die bonder head 300 to move at high speed. It is allowed to increase the moving acceleration of the high-speed moving mechanism 200 to more than 18g and the moving speed to more than 4.5 m / s, greatly improving the speed and accuracy of the die bonder head 300 for handling semiconductor chips.

[0035] The high-speed moving mechanism 200 includes a first moving mechanism 201, a second moving mechanism 202, and a third moving mechanism 203. The first moving mechanism 201, the second moving mechanism 202, and the third moving mechanism 203 are all arranged on the lightweight frame 100 and are used to drive the die bonder head 300 to move at high speed along the X-axis, Y-axis, and Z-axis respectively, and the X-axis, Y-axis, and Z-axis are perpendicular to each other in pairs.

[0036] As Figure 2 shown, the first moving mechanism 201 includes a first guide rail 204 arranged on the lightweight frame 100 along the X-axis direction, a first base 205 arranged on the first guide rail 204, and a first linear motor 206 arranged on the lightweight frame 100 and connected to drive the first base 205 to move on the first guide rail 204.

[0037] In this embodiment, the number of the first guide rails 204 is two, which are arranged in parallel along the Y-axis direction on the lightweight frame 100. The first base 205 is arranged across the two first guide rails 204, and the first linear motor 206 is located between the two first guide rails 204 and connected to the first base 205.

[0038] The first base 205 includes a first body 207 and a second body 208. The first body 207 and the second body 208 are vertically connected. Among them, the first body 207 is located on the XY plane and is connected to the first guide rail 204 and the first linear motor 206 inside the lightweight frame 100. The second body 208 is located on the YZ plane and is connected to the second moving mechanism 202 outside the lightweight frame 100. At both ends of the first body 207 in the Y-axis direction, a sliding connection part 209 extends out in the direction away from the second body 208 respectively, and the two sliding connection parts 209 are respectively arranged on the corresponding first guide rails 204. The first linear motor 206 is located in the space surrounded by the two sliding connection parts 209 and the first body 207.

[0039] A plurality of first weight-reducing grooves 210 are formed in the first base body 207 and the two sliding connection parts 209 to reduce the weight of the first base 205. The first weight-reducing grooves 210 can be, but are not limited to, rectangular grooves or triangular grooves, and can also be other grooves with relatively stable shapes, such as hexagonal grooves, etc. The first base body 207 and the second base body 208 are also connected by a plurality of first fixing plates 211. The first fixing plates 211 are perpendicular to both the first base body 207 and the second base body 208 to improve the stability between the first base body 207 and the second base body 208.

[0040] As Figure 4 shown, the second moving mechanism 202 includes a second guide rail 212 arranged on the first base 205 of the first moving mechanism 201 along the Y-axis direction, a second base 213 arranged on the second guide rail 212, and a second linear motor 214 arranged on the lightweight frame 100 and connected to drive the second base 213 to move on the second guide rail 212.

[0041] In this embodiment, the number of the second guide rails 212 is two, which are arranged in parallel along the Z-axis direction on the second base body 208 of the first base 205. The second base 213 is arranged across the two second guide rails 212. The second linear motor 214 is located outside one side of the two second guide rails 212 in the Z-axis direction and is connected to the second base 213.

[0042] The second base 213 is located on the YZ plane. One end of it in the Z-axis direction extends into the lightweight frame 100 and is connected to the second linear motor 214, and the other end of it in the Z-axis direction extends out of the lightweight frame 100 and is connected to the second guide rail 212.

[0043] As Figure 9 shown, the third moving mechanism 203 includes a third guide rail 215 arranged on the second base 213 of the second moving mechanism 202 along the Z-axis direction, a third base 216 arranged on the third guide rail 215, and a third linear motor 217 arranged on the lightweight frame 100 and connected to drive the third base 216 to move along the Z-axis direction on the third guide rail 215.

[0044] In this embodiment, the number of the third guide rails 215 is two, which are arranged in parallel along the Y-axis direction on the second base 213. The third base 216 is arranged across the two third guide rails 215. The third linear motor 217 is located outside one end of the two third guide rails 215 in the Z-axis direction and is connected to the third base 216.

[0045] The entire third moving mechanism 203 is located outside the lightweight frame 100. The third base 216 is located on the YZ plane. One end of the third base 216 in the Z-axis direction is connected to the third linear motor 217, and the other end of the third base 216 in the Z-axis direction is connected to the third guide rail 215.

[0046] The die bonding head 300 is disposed on the third base 216 to move along the X-axis, Y-axis, and Z-axis directions with the third base 216.

[0047] In this die bonder, the second linear motor 214 of the second moving mechanism 202 is disposed on the lightweight frame 100 instead of on the first base 205 of the first moving mechanism 201. The second linear motor 214 does not move along the X-axis direction with the first base 205, which can reduce the load of the first linear motor 206 and improve the driving speed of the first linear motor 206. Similarly, the third linear motor 217 of the third moving mechanism 203 is disposed on the lightweight frame 100 instead of on the second base 213 of the second moving mechanism 202. The third linear motor 217 does not move along the X-axis and Y-axis directions with the second base 213, which can reduce the loads of the first linear motor 206 and the second linear motor 214 simultaneously and improve the driving speeds of the first linear motor 206 and the second linear motor 214.

[0048] In this embodiment, the Z-axis direction is the vertical direction. That is, the third base 216 driving the die bonding head 300 to move along the Z-axis direction is actually a vertical lifting. Preferably, the second base 213 and the third base 216 are further connected by an elastic member 218. The automatic reset of the third base 216 and the die bonding head 300 is achieved through the elastic force of the elastic member 218, reducing the power consumption of the third linear motor 217.

[0049] The elastic member 218 can be, but is not limited to, a spring.

[0050] Such as Figure 3As shown in the figure, the first linear motor 206 includes a first mover plate 219 for driving the first base 205 to move in the X-axis direction, a first stator plate 220 for driving the first mover plate 219 to move in the X-axis direction, and two first guide members 221. The first stator plate 220 is fixedly arranged on the lightweight frame 100, and the first mover plate 219 is connected to the first base 205. The two first guide members 221 are oppositely arranged at both ends of the first stator plate 220 in the Y-axis direction, and the first mover plate 219 is located between the two first guide members 221. On one side of each of the two first guide members 221 facing the first mover plate 219, a first guide groove 222 extending in the X-axis direction is formed. The two ends of the first mover plate 219 in the X-axis direction respectively extend into the first guide grooves 222 of the corresponding first guide members 221.

[0051] In this embodiment, there are two first stator plates 220, which are oppositely arranged on both sides of the first mover plate 219 in the Z-axis direction. The two first guide members 221 are respectively arranged between the two first stator plates 220. At least one first stator plate 220 is provided with an electromagnetic coil, and the first mover plate 219 is provided with a magnet. Or conversely, at least one first stator plate 220 is provided with a magnet, and the first mover plate 219 is provided with an electromagnetic coil, so as to drive the first mover plate 219 to move linearly based on electromagnetic force.

[0052] As Figure 5 As shown in the figure, the second linear motor 214 includes a second mover plate 223 for driving the second base 213 to move in the Y-axis direction, a second stator plate 224 for driving the second mover plate 223 to move in the Y-axis direction, and two second guide members 225. The second stator plate 224 is fixedly arranged on the first base 205, and the second mover plate 223 is connected to the second base 213. The two second guide members 225 are oppositely arranged at both ends of the second stator plate 224 in the X-axis direction, and the second mover plate 223 is located between the two second guide members 225. On one side of one second guide member 225 facing the second mover plate 223, a second guide groove 226 extending in the Y-axis direction is formed, and on the other second guide member 225, a guide hole 227 extending in the Y-axis direction is formed. One end of the second mover plate 223 in the X-axis direction extends into the second guide groove 226 of the corresponding second guide member 225, and the other end of the second mover plate 223 in the X-axis direction passes through the guide hole 227 of the corresponding second guide member 225 and is then connected to the second base 213.

[0053] In this embodiment, there are two second stator plates 224, which are oppositely arranged on both sides of the second mover plate 223 in the Z-axis direction, and two second guiding members 225 are arranged between the two second stator plates 224; an electromagnetic coil is arranged on at least one second stator plate 224, and a magnet is arranged on the second mover plate 223, or vice versa, a magnet is arranged on at least one second stator plate 224, and an electromagnetic coil is arranged on the second mover plate 223, so as to drive the second mover plate 223 to move linearly based on electromagnetic force.

[0054] In this embodiment, the Y-axis is parallel to the axial direction of the lightweight frame 100, that is, the moving stroke of the die bonding head 300 driven by the second moving mechanism 202 in the Y-axis direction is much larger than the moving strokes of the die bonding head 300 driven by the first moving mechanism 201 and the third moving mechanism 203 in the X-axis direction and the Z-axis direction respectively. In addition, the second mover plate 223 needs to move back and forth at a high speed in the Y-axis direction. Therefore, a large amount of heat will be generated on the second mover plate 223, and too high a temperature will affect the moving accuracy of the second moving mechanism 202.

[0055] Therefore, the second linear motor 214 further includes two air jet members 228, which are oppositely arranged at both ends of the second stator plate 224 in the Y-axis direction and are arranged between the two second stator plates 224; the two air jet members 228 are used to jet air curtains onto the two side surfaces of the second mover plate 223 in the Z-axis direction respectively, so as to dissipate heat from the second mover plate 223.

[0056] By arranging two air jet members 228 in the second linear motor 214, the die bonding head of this die bonder jets air curtains onto the two side surfaces of the second mover plate 223 from both ends of the second mover plate 223 respectively to dissipate heat, so as to reduce the temperature of the second mover plate 223 and improve the moving accuracy of the second moving mechanism 202.

[0057] Such as Figure 6 and 7As shown, the jet component 228 includes a connected air inlet connector 229 and a jet nozzle 230, and a connected guide ramp 231 and an air outlet groove 232, the jet nozzle 230 extends along the X-axis direction (that is, extends along the width direction of the second movable plate 223), so that the ejected air curtain is parallel to the two side surfaces of the second movable plate 223; the jet nozzle 230 and the guide ramp 231 are both facing the second movable plate 223, wherein the jet nozzle 230 and the guide ramp 231 of the same jet component 228 are respectively facing the two side surfaces of the second movable plate 223 in the Z-axis direction, the jet nozzles 230 of different jet components 228 are respectively facing the two side surfaces of the second movable plate 223 in the Z-axis direction, and the guide ramps 231 of different jet components 228 are respectively facing the two side surfaces of the second movable plate 223 in the Z-axis direction.

[0058] During heat dissipation, the air inlet connectors 229 of the two jet components 228 are connected to a compressed air source, and two air curtains are respectively ejected from the jet nozzles 230 of the two jet components 228 toward the two side surfaces of the second mover plate 223 to take away the heat on the two side surfaces of the second mover plate 223, and are guided by the opposite guide ramps 231 and finally flow out from the opposite air outlet grooves 232. The guide ramps 231 can guide the air curtains to flow toward the air outlet grooves 232 on the same side to avoid crosstalk between the wind curtain on one side and the wind curtain on the other side and affect the flow rate.

[0059] The wind curtain satisfies p+ρgh+(1 / 2)*ρv^ at any point 2 =G, p is the airflow pressure at that point, v is the airflow velocity at that point, ρ is the airflow density at that point, g is the acceleration due to gravity, h is the height of that point, and G is a constant.

[0060] In this embodiment, one air curtain is located between the second mover plate 223 and one second stator plate 224 , and another air curtain is located between the second mover plate 223 and another second stator plate 224 .

[0061] like Figure 8 As shown, the interior of the jet component 228 is provided with a first channel 233, a connecting cavity 234 and a second channel 235, the first channel 233 and the second channel 235 both extend along the X-axis direction and are staggered along the Y-axis direction and the Z-axis direction, the first channel 233 is connected to the air inlet connector 229, the second channel 235 is connected to the jet nozzle 230, and the first channel 233 is connected to the second channel 235 through the connecting cavity 234.

[0062] In this embodiment, the intake joint 229 of the jetting member 228 has two, which are respectively connected to both ends of the first channel 233. The communication cavities 234 of the jetting member 228 also have two, which are respectively connected between both ends of the first channel 233 and both ends of the second channel 235.

[0063] The air flow flows along the X-axis direction in the first channel 233 and the second channel 235, and flows along the Y-axis and Z-axis directions in the communication cavity 234. Therefore, when the air flow enters the communication cavity 234 from the first channel 233, and when it enters the second channel 235 from the communication cavity 234, turning occurs. The turning causes the air flow to be blocked and the flow rate to decrease. According to Bernoulli's theorem, the sum of the static pressure and the dynamic pressure of the air flow always remains unchanged. The decrease in the flow rate will cause the dynamic pressure of the air flow to decrease, and at the same time, the static pressure of the air flow will increase. The air flow accumulates energy and is compressed inside the jetting member 228, and the internal high pressure further increases the flow rate when the air curtain is ejected from the jet nozzle 230, further improving the heat dissipation effect.

[0064] Preferably, the diameter of the communication cavity 234 is larger than the diameter of the first channel 233. When the air flow enters the larger-diameter communication cavity 234 from the smaller-diameter first channel 233, the flow rate will decrease, and the static pressure of the air flow will further increase to accumulate energy and be compressed. The diameter of the communication cavity 234 is larger than the diameter of the second channel 235. When the air flow enters the smaller-diameter second channel 235 from the larger-diameter communication cavity 234, the static pressure of the air flow is converted into dynamic pressure, increasing the flow rate when the air curtain is ejected from the jet nozzle 230.

[0065] More preferably, some buffer grooves 236 are provided on the wall surface of the communication cavity 234 to increase the complexity of the area where the air flow passes through, so as to buffer the high-speed air flow and increase the static pressure.

[0066] The cross-section of the communication cavity 234 is generally in the shape of a right trapezoid, and a stepped structure is formed on the inclined surface of the trapezoid through the buffer grooves 236, so that the diameter of the communication cavity 234 gradually increases and then gradually decreases along the air flow direction.

[0067] At any point inside the jetting member, p + ρgh+(1 / 2)*ρv^ 2 = G, where p is the air flow pressure at this point, v is the air flow velocity at this point, ρ is the air flow density at this point, g is the acceleration due to gravity, h is the height at this point, and G is a constant.

[0068] Such as Figure 10As shown, the third linear motor 217 includes a third mover plate 237 for driving the third base 216 to move in the Z-axis direction, and a third stator plate 238 for driving the third mover plate 237 to move in the Z-axis direction. The third stator plate 238 is disposed on the lightweight frame 100, and the third mover plate 237 is connected to the third base 216.

[0069] In this embodiment, there are two third stator plates 238, which are oppositely disposed on both sides of the third mover plate 237 in the X-axis direction; at least one third stator plate 238 is provided with an electromagnetic coil, and a magnet is disposed on the third mover plate 237, or vice versa, at least one third stator plate 238 is provided with a magnet, and an electromagnetic coil is disposed on the third mover plate 237 to drive the third mover plate 238 to move linearly based on electromagnetic force.

[0070] The third linear motor 217 further includes an air jet member 228 and a grille orifice plate 239. The air jet member 228 and the grille orifice plate 239 are oppositely disposed at both ends of the third stator plate 238 in the Y-axis direction, and the third mover plate 237 is located between the air jet member 228 and the grille orifice plate 239; the air jet member 228 is used to jet an air curtain onto one side surface of the third mover plate 237 in the X-axis direction, and the grille orifice plate 239 is used for the air curtain jetted by the air jet member 228 to flow out.

[0071] The distance between the air jet member 228 and the grille orifice plate 239 is greater than the width of the third mover plate 237 in the Y-axis direction to allow the third mover plate 237 to move along the Y-axis with the third base, and the distance between the two third stator plates 238 is greater than the thickness of the third mover plate 237 in the X-axis direction to allow the third mover plate 237 to move along the X-axis with the third base.

[0072] As Figure 11As shown, the lightweight frame 100 includes a frame base 101 and a frame body 102, and the frame body 102 is arranged on the frame base 101; on one side of the frame base 101 facing the frame body 102, a receiving groove 103 extending in the X-axis direction is formed, and the first moving mechanism 201 is arranged in the receiving groove 103; the frame body 102 includes a body bottom plate 106, a support wall 107, two support columns 110 and two support beams 111, the support wall 107 is vertically connected to one side of the body bottom plate 106 in the X-axis direction, two support columns 110 are vertically connected to the other side of the body bottom plate 106 in the X-axis direction, and the two support columns 110 are respectively located at both ends of the body bottom plate 106 in the Y-axis direction; one support beam 111 is connected between one support column 110 and the body bottom plate 106, and the other support beam 111 is connected between the other support column 110 and the body bottom plate 106; the second moving mechanism 202 is arranged in the space enclosed by the body bottom plate 106, the support wall 107, the support columns 110 and the support beams 111; the third moving mechanism 203 is arranged on the side of the two support columns 110 facing away from the support wall 107.

[0073] Specifically, the receiving groove includes a first groove portion 104 and a second groove portion 105 formed at the bottom of the first groove portion 104. The first linear motor 206 of the first moving mechanism 201 is arranged in the second groove portion 105, and the first guide rail 204 of the first moving mechanism 201 and the first seat body 207 of the first base 205 are arranged in the first groove portion 104; the first fixing plate 211 of the first base 205 is supported on the second groove portion 105, and the second seat body 208 of the first base 205 is located outside one side of the frame base 101 in the X-axis direction.

[0074] On the surfaces of the body bottom plate 106 and the support wall 107, a plurality of second weight-reducing grooves 108 are formed to reduce the weight of the frame body 102. The second weight-reducing grooves 108 can be, but are not limited to, rectangular grooves or triangular grooves, and can also be other grooves with relatively stable shapes, such as hexagonal grooves, etc. The body bottom plate 106 and the support wall 107 are also connected by a plurality of second fixing plates 109, and the second fixing plates 109 are perpendicular to both the body bottom plate 106 and the support wall 107 to improve the stability between the body bottom plate 106 and the support wall 107.

[0075] On the surface of the support beam 111, a plurality of third weight-reducing grooves 112 are formed to reduce the weight of the frame body 102. The third weight-reducing grooves 112 can be, but are not limited to, rectangular grooves or triangular grooves, and can also be other grooves with relatively stable shapes, such as hexagonal grooves, etc.

[0076] When designing the lightweight frame 100, first determine the required resonance frequency, and then design the main structure of the lightweight frame 100 according to the required resonance frequency. Next, import the required resonance frequency and the designed main structure into finite element analysis software for analysis. Finally, design the quantity, size, arrangement position, etc. of the second weight reduction groove 108 and the third weight reduction groove 112 on the lightweight frame 100 according to the actual resonance frequency and stress diagram output by the finite element analysis software, and then import them into the finite element analysis software for analysis and verification. Then modify and optimize the quantity, size, arrangement position, etc. of the second weight reduction groove 108 and the third weight reduction groove 112 until the actual resonance frequency output by the finite element analysis software is the required resonance frequency.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention rather than to limit them. Although the embodiments of the present invention have been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the embodiments of the present invention can still be modified or equivalently replaced, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A die bonding head for a high-speed and high-precision semiconductor chip die bonder, characterized in that, it includes a lightweight frame, a die bonding head, and a high-speed moving mechanism. The high-speed moving mechanism is arranged on the lightweight frame, and the die bonding head is arranged on the high-speed moving mechanism and is driven by the high-speed moving mechanism to move at high speed; the resonance frequency of the lightweight frame is higher than 400 Hz; the high-speed moving mechanism includes a first moving mechanism, a second moving mechanism, and a third moving mechanism. The first moving mechanism, the second moving mechanism, and the third moving mechanism are all arranged on the lightweight frame and are used to drive the die bonding head to move at high speed along the X-axis, Y-axis, and Z-axis respectively, and the X-axis, Y-axis, and Z-axis are perpendicular to each other in pairs. The first moving mechanism includes a first guide rail arranged on the lightweight frame along the X-axis direction, a first base arranged on the first guide rail, and a first linear motor arranged on the lightweight frame and connected to drive the first base to move on the first guide rail. The second moving mechanism includes a second guide rail arranged on the first base of the first moving mechanism along the Y-axis direction, a second base arranged on the second guide rail, and a second linear motor arranged on the lightweight frame and connected to drive the second base to move on the second guide rail. The third moving mechanism includes a third guide rail arranged on the second base of the second moving mechanism along the Z-axis direction, a third base arranged on the third guide rail, and a third linear motor arranged on the lightweight frame and connected to drive the third base to move on the third guide rail. The die bonding head is arranged on the third base to move along the X-axis, Y-axis, and Z-axis directions with the third base.

2. The die bonding head for a high-speed and high-precision semiconductor chip die bonder according to claim 1, characterized in that, the first linear motor includes a first mover plate for driving the first base to move along the X-axis direction, a first stator plate for driving the first mover plate to move along the X-axis direction, and two first guiding members. The first stator plate is fixedly arranged on the lightweight frame, and the two first guiding members are oppositely arranged at both ends of the first stator plate in the Y-axis direction, and the first mover plate is located between the two first guiding members. First guiding grooves extending in the X-axis direction are formed on the surfaces of the two first guiding members facing the first mover plate, and the two ends of the first mover plate in the X-axis direction respectively extend into the first guiding grooves of the corresponding first guiding members.

3. The die bonding head for a high-speed and high-precision semiconductor chip die bonder according to claim 1, characterized in that, The second linear motor includes a second mover plate for driving the second base to move in the Y-axis direction, a second stator plate for driving the second mover plate to move in the Y-axis direction, and two second guide members. The second stator plate is fixedly arranged on the first base. The two second guide members are oppositely arranged at both ends of the second stator plate in the X-axis direction. The second mover plate is located between the two second guide members. A second guide groove extending in the Y-axis direction is formed on the surface of one second guide member facing the second mover plate, and a guide hole extending in the Y-axis direction is formed on the other second guide member. One end of the second mover plate in the X-axis direction extends into the second guide groove of the corresponding second guide member, and the other end in the X-axis direction passes through the guide hole of the corresponding second guide member and is connected to the second base.

4. The bonding head of the high-speed and high-precision semiconductor chip die bonder according to claim 3, wherein, the second linear motor further includes two air jet members. The two air jet members are oppositely arranged at both ends of the second stator plate in the Y-axis direction. The two air jet members are used for respectively jetting air curtains onto both side surfaces of the second mover plate in the Z-axis direction.

5. The bonding head of the high-speed and high-precision semiconductor chip die bonder according to claim 1, wherein, the third linear motor includes a third mover plate for driving the third base to move in the Z-axis direction and a third stator plate for driving the third mover plate to move in the Z-axis direction. The third stator plate is arranged on the lightweight frame, and the third mover plate is connected to the third base.

6. The bonding head of the high-speed and high-precision semiconductor chip die bonder according to claim 5, wherein, the third linear motor further includes an air jet member and a grille hole plate. The air jet member and the grille hole plate are oppositely arranged at both ends of the third stator plate in the Y-axis direction. The third mover plate is located between the air jet member and the grille hole plate. The air jet member is used for jetting an air curtain onto one side surface of the third mover plate in the X-axis direction, and the grille hole plate is used for allowing the air curtain jetted by the air jet member to flow out.

7. The bonding head of the high-speed and high-precision semiconductor chip die bonder according to claim 1, wherein, The lightweight frame includes a frame base and a frame body, and the frame body is arranged on the frame base; a receiving groove extending in the X-axis direction is formed on a surface of the frame base facing the frame body, and the first moving mechanism is arranged in the receiving groove; the frame body includes a body bottom plate, a support wall, two support columns and two support beams, the support wall is vertically connected to one side of the body bottom plate in the X-axis direction, the two support columns are vertically connected to the other side of the body bottom plate in the X-axis direction, and the two support columns are respectively located at two ends of the body bottom plate in the Y-axis direction; one support beam is connected between one support column and the body bottom plate, and the other support beam is connected between the other support column and the body bottom plate; the second moving mechanism is arranged in a space enclosed by the body bottom plate, the support wall, the support columns and the support beams; the third moving mechanism is arranged on a surface of the two support columns facing away from the support wall.

8. The bonding head of the high-speed and high-precision semiconductor chip die bonder according to claim 7, characterized in that a plurality of second weight-reducing grooves are formed on surfaces of the body bottom plate and the support wall, and a plurality of third weight-reducing grooves are formed on a surface of the support beam.

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