Antenna Module, Manufacturing Method Thereof, and Electronic Device

Abstract

An antenna module, a manufacturing method thereof, and an electronic device, including separately disposing an electronic component and an antenna component on an upper side of a carrier structure, covering the electronic component and the antenna component with a packaging layer, and coupling an antenna portion for communicatively connecting the antenna component to a surface of the packaging layer, and disposing a reflector communicatively connecting the antenna component on a lower side of the carrier structure, so as to facilitate designing a distance between the antenna component and the reflector by disposing the reflector on the lower side of the carrier structure.

Description

Technical Field

[0001] The present invention relates to an antenna module, and more particularly to an antenna module having a reflector, a manufacturing method thereof, and an electronic device. Background Art

[0002] With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multi-function and high performance. Currently, wireless transmission communication technologies have been widely applied to various consumer electronic products. In existing electronic products equipped with antennas, in order to make the directivity of the antenna better, a reflector is usually configured.

[0003] Figure 1 FIG. 1 is a schematic cross-sectional view of a conventional electronic device 1. The electronic device 1 includes a circuit board (PCB) 1b configured with a reflector 15, and an antenna module 1a mounted on the circuit board 1b via a plurality of solder balls 16. The antenna module 1a includes a circuit structure 10 that engages the solder balls 16, a radio frequency chip (not shown) disposed on the circuit structure 10 and electrically connected to the circuit structure 10, a package layer 13 that encapsulates the radio frequency chip, and a patch antenna 14 disposed on an outer surface of the package layer 13. The position of the reflector 15 corresponds to the position of the patch antenna 14, and the circuit structure 10 is wired using a Redistribution Layer (RDL) process, which is provided with a Coplanar waveguide (CPW) and provides an antenna grounding function.

[0004] In the conventional electronic device 1, since the reflector 15 is disposed on the upper surface of the circuit board 1b below the patch antenna 14, the relevant parameters of the patch antenna 14 (such as impedance matching, bandwidth, direction characteristics, etc.) need to be coordinated with the distance D between the patch antenna 14 and the reflector 15 and the height h of the coplanar waveguide from the reflector 15 (i.e., the reliable height h of the solder balls 16).

[0005] However, during the process of mounting the antenna module 1a to the circuit board 1b, it is often difficult to control the height dimension of the solder balls 16, resulting in an inability to effectively control the distance D. Therefore, the error of the electrical parameters of the patch antenna 14 often exceeds a reasonable range.

[0006] In addition, the antenna module 1a is fixedly connected to the circuit board 1b via the solder balls 16, and is limited by the reliability of the solder balls 16, that is, the reliable height h of the solder balls 16 defines the distance D. For example, it is not easy to control the average value and tolerance of the volume and height of the solder balls 16. Specifically, when the average value of the volume of the solder balls 16 is small or the average value of the height is low, it is not conducive to supporting the antenna module 1a; on the contrary, when the average value of the volume of the solder balls 16 is large or the average value of the height is high, adjacent solder balls 16 are prone to bridging phenomenon, resulting in short circuit, and the grid array formed by the solder balls 16 is prone to poor co-planarity, resulting in unbalanced contact stress and easy damage to the antenna module 1a. Therefore, the size of the solder balls 16 is not easy to control, and the bandwidth of the patch antenna 14 is limited by the reliable height h of the solder balls 16, making it difficult to design other bandwidths.

[0007] In addition, due to the limited layout space of the circuit board 1b, the reflector 15 is arranged on the circuit board 1b, which will limit the layout space of other functional components, thus being not conducive to increasing the functions of the electronic device 1, and making it difficult for the electronic device 1 to meet the requirements of multi-functions.

[0008] Therefore, how to overcome the above-mentioned various problems of the prior art has actually become an urgent issue to be overcome in the current industry. Summary of the Invention

[0009] In view of the problems of the prior art, the present invention provides an antenna module, a manufacturing method thereof, and an electronic device, which are beneficial to the distance design between the antenna element and the reflector.

[0010] The antenna module of the present invention includes: a carrier structure having opposite first and second sides; an electronic component disposed on the first side of the carrier structure and electrically connected to the carrier structure; an antenna element disposed on the first side of the carrier structure; a packaging layer disposed on the first side of the carrier structure for covering the electronic component and the antenna element; an antenna portion disposed on the packaging layer and communicatively connected to the antenna element; and a reflector disposed on the second side of the carrier structure and communicatively connected to the antenna element.

[0011] The present invention also provides a manufacturing method of an antenna module, and the steps include: providing a carrier structure which has opposite first and second sides; disposing electronic components and antenna elements on the first side of the carrier structure, and electrically connecting the electronic components and the antenna elements to the carrier structure; forming a packaging layer on the first side of the carrier structure, wherein the packaging layer covers the electronic components and the antenna elements; disposing an antenna portion on the packaging layer of the carrier structure, and communicatively connecting the antenna portion to the antenna elements; and disposing a reflector communicatively connecting to the antenna elements on the second side of the carrier structure.

[0012] In the foregoing antenna module and its manufacturing method, the antenna element has an antenna layer electrically connecting to the carrier structure and communicatively connecting to the antenna portion. The antenna portion includes an antenna body communicatively connecting to the antenna element. The positions of the antenna body and the reflector correspond to the position of the antenna element, and the carrier structure is configured with a coplanar waveguide.

[0013] In the foregoing antenna module and its manufacturing method, the reflector is bonded to the second side of the carrier structure via a bonding layer.

[0014] In the foregoing antenna module and its manufacturing method, the reflector is disposed on an interposer and is bonded to the second side of the carrier structure by bonding the interposer to the carrier structure.

[0015] The present invention also provides an electronic device, including: a circuit board; and the foregoing antenna module, wherein the second side of the carrier structure of the antenna module is stacked on the circuit board via a plurality of conductive elements.

[0016] As can be seen from the above, in the antenna module, its manufacturing method and the electronic device of the present invention, mainly by disposing the reflector on the second side of the carrier structure, the distance of the antenna parameters can be determined by the packaging process of the antenna module without considering the height dimension of the existing solder balls (or the conductive elements of the present invention). Therefore, compared with the prior art, the error of the electrical parameters of the antenna portion of the present invention can be controlled within a reasonable range.

[0017] In addition, since the bandwidth of the antenna portion of the present invention depends on the distance between the antenna element and the reflector, compared with the prior art, even if the height of the existing solder balls (or the conductive elements of the present invention) changes, the bandwidth of the antenna portion will not change accordingly.

[0018] In addition, due to the limited layout space of the circuit board, by disposing the reflector on the second side of the carrier structure, the circuit board does not need to consider the configuration of the reflector. Therefore, compared with the prior art, the circuit board of the electronic device of the present invention can increase the layout space for other functional elements according to requirements, which is beneficial to increasing the functions of the electronic device and enabling the electronic device to meet the requirements of multiple functions. Description of the Drawings

[0019] Figure 1 It is a schematic cross-sectional view of an existing electronic device.

[0020] Figure 2 It is a schematic cross-sectional view of an antenna module according to an embodiment of the present invention.

[0021] Figures 3A to 3E It is a schematic cross-sectional view of a manufacturing method of an antenna module according to an embodiment of the present invention.

[0022] Figure 4 It is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.

[0023] Figure 5 It is a schematic cross-sectional view of an antenna module according to another embodiment of the present invention.

[0024] Figure 6 It is a schematic cross-sectional view of an electronic device according to another embodiment of the present invention.

[0025] Description of reference numerals

[0026] 1, 3a, 3b: Electronic device

[0027] 1a, 2, 3: Antenna module

[0028] 1b, 2b: Circuit board

[0029] 10: Circuit structure

[0030] 13, 23: Encapsulation layer

[0031] 14: Patch antenna

[0032] 15, 25: Reflector

[0033] 16: Solder ball

[0034] 2a: Antenna structure

[0035] 20: Carrier structure

[0036] 20a: First side

[0037] 20b: Second side

[0038] 200: Insulating layer

[0039] 201: Circuit layer

[0040] 21: Electronic component

[0041] 21a: Active surface

[0042] 21b: Non-active surface

[0043] 210, 220, 350: Conductive bumps

[0044] 22: Antenna element

[0045] 22a: Antenna layer

[0046] 24: Antenna portion

[0047] 24a: Antenna body

[0048] 24b: Encapsulation

[0049] 240: Dielectric layer

[0050] 242: Insulating protective layer

[0051] 250: Bonding layer

[0052] 35: Interposer

[0053] 35a: First surface

[0054] 35b: Second surface

[0055] 9: Support member

[0056] 90: Adhesive layer

[0057] A: First region

[0058] B: Second region

[0059] D, H: Distance

[0060] h: Height

[0061] P1, P2: Vertical projection area

[0062] T1, T2: Thickness Detailed implementation manners

[0063] The following illustrates the implementation manners of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0064] It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented. Therefore, they do not have any technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present invention can be implemented. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope under which the present invention can be implemented.

[0065] Figure 2 It is a schematic cross-sectional view of an antenna module according to an embodiment of the present invention. As Figure 2 shown, the antenna module 2 at least includes: a carrier structure (carrier chip) 20, an electronic component 21, an antenna element 22, a packaging layer 23, an antenna portion 24, and a reflector 25.

[0066] The carrier structure 20 has opposite first and second sides 20a and 20b.

[0067] The electronic component 21 is disposed on the first side 20a of the carrier structure 20 and is electrically connected to the carrier structure 20.

[0068] The antenna element 22 is also disposed on the first side 20a of the carrier structure 20, and the antenna element 22 is separately arranged from the electronic component 21.

[0069] The packaging layer 23 is disposed on the first side 20a of the carrier structure 20 and covers the electronic component 21 and the antenna element 22.

[0070] The antenna portion 24 has an antenna body 24a covered by an insulating material, is disposed on the packaging layer 23, and is communicatively connected to the antenna element 22.

[0071] The reflector 25 is disposed on the second side 20b of the carrier structure 20 and is communicatively connected to the antenna element 22.

[0072] According to an embodiment of the present invention, the antenna module 2 of the present invention mainly sets the reflector 25 on the second side 20b of the carrier structure 20, so that the distance of the antenna parameters (i.e., the distance H between the antenna element 22 and the reflector 25) can be determined by the packaging process of the antenna module 2, without considering the existing solder balls (such as Figure 2The height h of the conductive element 26) shown is dimensioned such that, compared with the prior art, the error in the electrical parameters of the antenna body 24a of the antenna unit 24 of the present invention can be controlled within a reasonable range.

[0073] In addition, since the bandwidth of the antenna body 24a of the antenna unit 24 depends on the distance H between the antenna element 22 and the reflector 25, compared with the prior art, even if the height h of the solder ball changes, the bandwidth of the antenna body 24a will not change accordingly.

[0074] Figures 3A to 3E It is a cross-sectional schematic view of a manufacturing method of an antenna module according to an embodiment of the present invention.

[0075] As Figure 3A shown, a carrier structure 20 is disposed on a support 9. The carrier structure 20 has opposite first and second sides 20a and 20b. The carrier structure 20 is coupled to the support 9 via the second side 20b, and the first side 20a defines adjacent first and second regions A and B. In addition, at least one electronic component 21 is disposed on the first region A of the first side 20a of the carrier structure 20, and at least one antenna element 22 is disposed on the second region B of the first side 20a of the carrier structure 20, such that the antenna element 22 and the electronic component 21 are separately disposed.

[0076] In this embodiment, the carrier structure 20 further includes an insulating layer 200 and at least one wiring layer 201 formed on the insulating layer 200, such as at least one fan-out type redistribution layer (RDL). In addition, the material of the wiring layer 201 is copper, and the material of the insulating layer 200 can be a dielectric material such as Polybenzoxazole (PBO), Polyimide (PI), Prepreg (PP), etc.

[0077] In addition, the support 9 can be a plate body of a semiconductor material (such as silicon or glass), on which an adhesive layer 90 is formed, such that the carrier structure 20 is adhered to the adhesive layer 90.

[0078] In addition, the electronic component 21 can be an active component (such as a semiconductor chip, etc.), a passive component (such as a resistor, a capacitor, an inductor, etc.) or a combination of the two. For example, when the electronic component 21 is a semiconductor chip (such as a Radio Frequency Integrated Circuit (RFID)), it has opposite working surfaces 21a and non-working surfaces 21b. The electronic component 21 is disposed on the circuit layer 201 in a flip-chip manner via a plurality of conductive bumps 210 such as solder materials and is electrically connected to the circuit layer 201; alternatively, the electronic component 21 can also be electrically connected to the circuit layer 201 in a wire bonding manner via a plurality of bonding wires (not shown in the figure); or, the electronic component 21 can directly contact the circuit layer 201. However, the manner in which the electronic component 21 is electrically connected to the carrier structure 20 is not limited to the above.

[0079] In addition, the antenna element 22 is a semiconductor element and has an antenna layer 22a. For example, when the antenna element 22 is in a chip specification, its antenna layer 22a is disposed on the circuit layer 201 in a flip-chip manner via a plurality of conductive bumps 220 such as solder materials and is electrically connected to the circuit layer 201; alternatively, the antenna layer 22a of the antenna element 22 can be electrically connected to the circuit layer 201 in a wire bonding manner via a plurality of bonding wires (not shown in the figure); or, the antenna layer 22a of the antenna element 22 can directly contact the circuit layer 201. However, the manner in which the antenna layer 22a of the antenna element 22 is electrically connected to the carrier structure 20 is not limited to the above.

[0080] As Figure 3B shown, a packaging layer 23 is formed on the first side 20a of the carrier structure 20, and the packaging layer 23 covers the electronic component 21 and the antenna element 22.

[0081] In this embodiment, the packaging layer 23 is an insulating dielectric material, such as ABF (Ajinomoto Build-up Film), photosensitive resin, polyimide (PI for short), Bismaleimide Triazine (BT for short), prepreg of FR5

[0082] (Prepreg, PP for short), dry film, epoxy resin, molding compound, Epoxy Molding Compound (EMC for short) or other suitable materials, and it can be formed on the first side 20a of the carrier structure 20 by lamination or molding.

[0083] As Figure 3CAs shown, an antenna portion 24 is formed on the encapsulation layer 23, and the antenna portion 24 includes a dielectric layer 240 formed on the encapsulation layer 23 and an antenna body 24a formed on the dielectric layer 240.

[0084] In this embodiment, the antenna body 24a can be a patch antenna, which is pasted on the dielectric layer 240. In other embodiments, a metal layer can also be formed by means such as electroplating, chemical plating, physical vapor deposition, sputtering, or other appropriate methods to serve as the antenna body 24a.

[0085] In addition, the antenna body 24a is communicatively connected to the antenna layer 22a (such as in a signal inductive coupling manner). For example, the position of the antenna body 24a corresponds to the position of the antenna element 22, that is, the two are vertically aligned within the second region B on the first side 20a.

[0086] In addition, the encapsulation layer 23 and the dielectric layer 240 can be of the same or different materials, without special limitation.

[0087] As Figure 3D shown, the antenna portion 24 can optionally include an insulating protective layer 242 covering the antenna body 24a, and the support member 9 and the adhesive layer 90 thereon are removed to expose the second side 20b of the carrier structure 20.

[0088] In this embodiment, the adhesive layer 90 can be a release film to facilitate the removal of the support member 9.

[0089] In addition, the insulating protective layer 242 is a dielectric material, which is formed on the dielectric layer 240. Therefore, the insulating protective layer 242 and the dielectric layer 240 can be regarded as an integral body to serve as a covering body 24b to cover the antenna body 24a.

[0090] As Figure 3E shown, at least one reflector 25 communicatively connected to the antenna element 22 is disposed on the second side 20b of the carrier structure 20, so that the antenna element 22, the antenna portion 24, and the reflector 25 serve as an antenna structure 2a, and a partial circuit layer 201 of the carrier structure 20 serves as a coplanar waveguide (CPW) of the antenna structure 2a. The partial circuit layer 201 is a grounding circuit connecting the electronic component 21 and the antenna layer 22a to provide a grounding function for the antenna structure 2a.

[0091] In this embodiment, the reflector 25 and the antenna layer 22a are signal inductively coupled to each other. For example, the position of the reflector 25 corresponds to the position of the antenna element 22, that is, the two are vertically aligned with respect to the first side 20a.

[0092] In addition, the reflector 25 is bonded to the second side 20b of the carrier structure 20 via a bonding layer 250. For example, the reflector 25 is a metal sheet, and the bonding layer 250 is a film, such as a die attach film (DAF).

[0093] Or, as Figure 5 shown in the antenna module 3, the reflector 25 can also be disposed on an interposer 35 to be bonded to the second side 20b of the carrier structure 20 via the interposer 35, so that the reflector 25 is disposed on the second side 20b of the carrier structure 20. For example, the interposer 35 has opposite first and second surfaces 35a and 35b. The interposer 35 is stacked on the second side 20b of the carrier structure 20 via a plurality of conductive bumps 350 such as solder materials, and the reflector 25 can be formed on the second surface 35b of the interposer 35 by electroplating, chemical plating, physical vapor deposition, sputtering, or other suitable methods. It should be understood that by disposing the reflector 25 on the second surface 35b of the interposer 35, the distance between the reflector 25 and the carrier structure 20 provided with the coplanar waveguide is relatively far, thereby obtaining a better resonance effect.

[0094] Preferably, the interposer 35 is a semiconductor structure, such as a silicon chip, and its size and structure can be in accordance with the size and structure of the antenna element 22 as required, that is, both are in chip specifications, so as to facilitate the manufacture of the interposer 35 and save manufacturing costs. It should be understood that the reflector 25 can be electrically connected or not electrically connected to the circuits in the interposer 35 as required.

[0095] Since the reflector 25 is disposed at the second side 20b of the carrier structure 20 below the antenna element 22, the relevant parameters of the antenna structure 2a (or the antenna body 24a) (such as impedance matching, bandwidth, direction characteristics, etc.) are coordinated with the distance between the antenna element 22 and the coplanar waveguide and the reflector 25.

[0096] In addition, as Figure 3E shown, since the vertical projection area P1 of the reflector 25 with respect to the first side 20a of the carrier structure 20 is larger than the vertical projection area P2 of the antenna body 24a with respect to the first side 20a of the carrier structure 20, the reflector 25 can effectively reflect the signals from the antenna body 24a via the antenna element 22. In this way, the signal directivity of the antenna body 24a can be improved, and further the radiation direction of the antenna body 24a can be directed towards the ideal direction.

[0097] In addition, a plurality of conductive elements 26 such as solder balls can be implanted on the second side 20b of the carrier structure 20, which are electrically connected to the circuit layer 201 of the carrier structure 20, so that the antenna module 2 can be externally connected to other objects via these conductive elements 26. For example, continuing Figure 3E with the process shown, the antenna module 2 is bonded to a circuit board 2b via the conductive elements 26 to obtain an electronic device 3a as shown in Figure 4 . Among them, the reflector 25 is located between the second side 20b of the carrier structure 20 and the circuit board 2b, and the reflector 25 does not contact the circuit board 2b. It should be understood that if continuing Figure 5 with the process shown, an electronic device 3b as shown in Figure 6 will be obtained.

[0098] Therefore, for the electronic devices 3a and 3b of the present invention, mainly by arranging the reflector 25 on the second side 20b of the carrier structure 20, the distance H for matching the antenna parameters can be determined by the packaging process of the antenna modules 2 and 3, without considering the height h of the conductive element 26 (that is, without considering the process of mounting the antenna modules 2 and 3 to the circuit board 2b). Further, during the manufacturing process of the antenna modules 2 and 3 of the present invention, since the carrier structure 20 and the packaging layer 23 are not easily deformed and it is very easy to control their thicknesses T1 and T2, the distance H between the antenna element 22 and the reflector 25 can be effectively controlled. Therefore, compared with the prior art, the error of the electrical parameters of the antenna structure 2a (or the antenna body 24a) will not exceed a reasonable range.

[0099] It should be understood that since the thicknesses of the dielectric layer 240 and the bonding layer 250 are easy to control, and the intermediate board 35 is a rigid structure and not easily deformed, and even the volumes of the conductive bumps 220 and 350 are extremely small, it is difficult for the dielectric layer 240, the bonding layer 250, the intermediate board 35, and the conductive bumps 220 and 350 to change the distance H between the antenna element 22 and the reflector 25.

[0100] In addition, since the bandwidth of the antenna structure 2a (or the antenna body 24a) is determined by the distance H between the antenna element 22 and the reflector 25, by arranging the reflector 25 on the second side 20b of the carrier structure 20, even if the antenna modules 2 and 3 are fixed to the circuit board 2b through the conductive elements 26 (such as solder materials), the solder structure characteristics of the conductive elements 26 will not change the distance H between the antenna element 22 and the reflector 25. Therefore, regardless of whether the height h dimension design of the conductive element 26 meets the reliable height, the conductive element 26 will not limit the bandwidth design of the antenna structure 2a (or the antenna body 24a).

[0101] In addition, due to the limited layout space of the circuit board 2b, by disposing the reflector 25 on the second side 20b of the carrier structure 20, the circuit board 2b does not need to consider the configuration of the reflector 25. Therefore, compared with the prior art, the circuit board 2b of the electronic devices 3a, 3b of the present invention can add layout space for other functional components according to requirements, which is beneficial to increasing the functions of the electronic devices 3a, 3b, so that the electronic devices 3a, 3b can meet the requirements of multi-functions.

[0102] In addition, the present invention also provides an electronic device 3a, 3b, which includes: a circuit board 2b and an antenna module 2, 3 stacked on the circuit board 2b.

[0103] The antenna modules 2, 3 are stacked on the circuit board 2b via a plurality of conductive elements 26 on the second side 20b of the carrier structure 20, and the reflector 25 does not contact the circuit board 2b.

[0104] In one embodiment, the plurality of conductive elements 26 are solder balls.

[0105] In one embodiment, the plurality of conductive elements 26 are electrically connected to the circuit layer 201 of the circuit board 2b and the carrier structure 20.

[0106] In summary, for the antenna module, its manufacturing method and the electronic device of the present invention, by designing to dispose the reflector on the second side of the carrier structure, the distance between the reflector and the carrier structure with coplanar waveguide and the antenna element is increased, so that a better resonance effect can be obtained.

[0107] In addition, since the present invention does not need to dispose the reflector on the circuit board, the layout design of the circuit board can be avoided from being restricted. Therefore, the application of the electronic device of the present invention can be more extensive.

[0108] The above embodiments are only used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the protection of the rights of the present invention shall be as listed in the claims.

Claims

1. An antenna module, characterized in that, Comprising: A carrier structure having opposite first and second sides; An electronic component disposed on the first side of the carrier structure and electrically connected to the carrier structure; An antenna element disposed on the first side of the carrier structure; An encapsulation layer disposed on the first side of the carrier structure for encapsulating the electronic component and the antenna element; An antenna portion disposed on the encapsulation layer and communicatively connected to the antenna element; And A reflector disposed on the second side of the carrier structure and communicatively connected to the antenna element, wherein the distance between the antenna element and the reflector is determined by the packaging process of the antenna module.

2. The antenna module according to claim 1, characterized in that, The antenna element has an antenna layer electrically connected to the carrier structure and communicatively connected to the antenna portion, and the carrier structure is configured with a coplanar waveguide.

3. The antenna module according to claim 1, wherein The antenna portion includes an antenna body communicatively connected to the antenna element, and the position of the antenna body and the position of the reflector correspond to the position of the antenna element.

4. The antenna module according to claim 1, wherein The reflector is bonded to the second side of the carrier structure via a bonding layer.

5. The antenna module according to claim 1, characterized in that The reflector is disposed on an intermediate board and bonded to the second side of the carrier structure by bonding the intermediate board.

6. A manufacturing method of an antenna module, characterized in that, Comprising: Providing a carrier structure having opposite first and second sides; Disposing an electronic component and an antenna element on the first side of the carrier structure, and the electronic component and the antenna element are electrically connected to the carrier structure; Forming an encapsulation layer on the first side of the carrier structure, wherein the encapsulation layer encapsulates the electronic component and the antenna element; Disposing an antenna portion on the encapsulation layer of the carrier structure, and the antenna portion is communicatively connected to the antenna element; Determining the distance between the antenna element and a reflector; And Disposing the reflector communicatively connected to the antenna element on the second side of the carrier structure.

7. The manufacturing method of the antenna module according to claim 6, characterized in that, The antenna element has an antenna layer electrically connected to the carrier structure and communicatively connected to the antenna portion, the antenna portion includes an antenna body communicatively connected to the antenna element, and the position of the antenna body and the position of the reflector correspond to the position of the antenna element, and the carrier structure is configured with a coplanar waveguide.

8. The manufacturing method of the antenna module according to claim 6, characterized in that, The reflector is bonded to the second side of the carrier structure via a bonding layer.

9. The manufacturing method of the antenna module according to claim 6, characterized in that, The reflector is disposed on an intermediate board and bonded to the second side of the carrier structure by bonding the intermediate board.

10. An electronic device, characterized in that, Comprising: A circuit board; And The antenna module according to any one of claims 1 to 5, wherein the second side of the carrier structure of the antenna module is stacked on the circuit board via a plurality of conductive elements.

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