Processing Method and Processing Equipment of Circuit Board, and Computer Readable Storage Medium

Abstract

The present application discloses a processing method and processing equipment for a circuit board, and a computer-readable storage medium. The processing method for the circuit board includes: determining a target scanning area on a circuit board to be processed according to a preset area to be processed in an initial processing program; scanning the target scanning area to measure the thickness of a medium layer to be processed in the circuit board to be processed; obtaining actual processing parameters based on the thickness of the medium layer to be processed; updating the initial processing program according to the actual processing parameters, so as to process the circuit board to be processed through the updated initial processing program. Through the above method, the present application can automatically and accurately obtain more effective actual processing parameters for each area to be processed, so as to avoid waste of manpower caused by process errors caused by reprocessing to compensate for constant processing parameters, and also make the corresponding processing efficiency higher, and can achieve more precise processing control.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a processing method and processing equipment for circuit boards, and a computer-readable storage medium. Background Art

[0002] Nowadays, with the advancement of the diversification and integration of electronic product functions, the number of layers of printed circuit boards (PCBs) is increasing, the distribution density is also increasing, and due to the irregularity of the graphic distribution, the uniformity of the board thickness / medium thickness of the circuit board is getting worse and worse, seriously affecting the control of back drill Stub (copper residue in the hole) and the impedance value of the signal line.

[0003] Currently, for the back drill Stub fluctuation caused by the poor uniformity of the board thickness / medium thickness, the industry mostly adopts the method of measuring the board thickness in zones for reprocessing compensation; and for the impedance fluctuation of the signal line, the line size of the subsequent product is compensated through impedance data.

[0004] However, on the one hand, such compensation methods waste manpower and efficiency; on the other hand, such compensation has great limitations and it is difficult to accurately control each position to be processed. Summary of the Invention

[0005] The present application provides a processing method and processing equipment for circuit boards, and a computer-readable storage medium to solve the problem that the compensation methods adopted by the existing processing methods for circuit boards for back drill Stub fluctuation and signal line impedance fluctuation will cause waste of manpower, low efficiency, and have great limitations, and it is difficult to accurately control each position to be processed.

[0006] To solve the above technical problems, a technical solution adopted by the present application is: to provide a processing method for a circuit board, wherein the processing method for the circuit board includes: determining a target scanning area on the circuit board to be processed according to the area to be processed preset in the initial processing program; scanning the target scanning area to measure the thickness of the medium layer to be processed in the circuit board to be processed; obtaining actual processing parameters based on the thickness of the medium layer to be processed; updating the initial processing program according to the actual processing parameters, and processing the circuit board to be processed through the updated initial processing program.

[0007] Wherein, the step of determining the target scanning area on the circuit board to be processed according to the area to be processed preset in the initial processing program includes: obtaining the position information of the reference positioning holes on the circuit board to be processed, and determining the target scanning area on the circuit board to be processed according to the position information of the reference positioning holes and the area to be processed.

[0008] Wherein, the reference positioning holes include at least three, and are distributed at the positions of at least three different side edges of the circuit board to be processed.

[0009] Among them, the steps of scanning a target scanning area to measure the thickness of a to-be-processed dielectric layer in a to-be-processed circuit board include: scanning the to-be-processed dielectric layer in the target scanning area to measure the thickness of the to-be-processed dielectric layer in the to-be-processed circuit board.

[0010] Among them, the steps of scanning a target scanning area to measure the thickness of a to-be-processed dielectric layer in a to-be-processed circuit board include: scanning the target scanning area by X-rays or ultrasonic waves to measure the thickness of the to-be-processed dielectric layer in the to-be-processed circuit board.

[0011] Among them, the actual processing parameter is the actual backdrill depth. The steps of scanning a target scanning area to measure the thickness of a to-be-processed dielectric layer in a to-be-processed circuit board include: scanning the target scanning area to measure the maximum distance H between the target copper layer and the surface copper layer in the to-be-processed circuit board. 1 ; The steps of obtaining the actual processing parameter based on the thickness of the to-be-processed dielectric layer include: based on H 1 calculating to obtain the actual backdrill depth Z; where the corresponding calculation formula is Z = H 1 - stub + L; where stub is the target residual copper control value of the to-be-processed circuit board, and L is the initial compensation value.

[0012] Among them, the actual processing parameter is the width to be fabricated of the signal line. The steps of scanning a target scanning area to measure the thickness of a to-be-processed dielectric layer in a to-be-processed circuit board include: scanning the target scanning area to measure the maximum distance H between the copper layer where the signal line is located and its adjacent ground copper layer in the to-be-processed circuit board. 2 ; The steps of obtaining the actual processing parameter based on the thickness of the to-be-processed dielectric layer include: based on H 2 calculating to obtain the width W to be fabricated of the signal line; where the corresponding calculation formula is where z is the target impedance value of the signal line, E r is the material dielectric constant, and T is the thickness of the copper layer where the signal line is located.

[0013] Among them, the cross-sectional size of the target scanning area is not less than three times the cross-sectional size of the to-be-processed area.

[0014] To solve the above technical problems, another technical solution adopted by this application is: to provide a processing device for a circuit board. Among them, the processing device for the circuit board includes a memory, a processor, and a processing device that are mutually coupled; the memory stores program data; the processor is used to execute the program data to control the processing device to implement the processing method of the circuit board as described in any one of the above.

[0015] To solve the above technical problems, another technical solution adopted by this application is: to provide a computer-readable storage medium, wherein the computer-readable storage medium stores program data that can be executed to implement the processing method of the circuit board described in any one of the above.

[0016] The beneficial effect of this application is: different from the prior art, the processing method of the circuit board in this application first determines the target scanning area on the circuit board to be processed through the preset area to be processed in the initial processing program, so as to be able to scan and measure the thickness of the medium layer to be processed in the circuit board to be processed, and calculate more effective actual processing parameters based on the thickness of the medium layer to be processed. Furthermore, it can automatically update the initial processing program according to the actual processing parameters, and process the circuit board to be processed more effectively and perfectly in one go through the updated initial processing program, so as to avoid the waste of manpower caused by the process error caused by reprocessing to compensate for constant processing parameters, and also make the corresponding processing efficiency higher and be able to achieve more precise processing control. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0018] Figure 1 is a schematic flowchart of the first embodiment of the processing method of the circuit board of this application;

[0019] Figure 2a is a schematic flowchart of the second embodiment of the processing method of the circuit board of this application;

[0020] Figure 2b is Figure 2a a schematic structural diagram of an embodiment corresponding to S21-S24 in;

[0021] Figure 2c is Figure 2b a top view of the circuit board to be processed in;

[0022] Figure 3 is a schematic flowchart of the third embodiment of the processing method of the circuit board of this application;

[0023] Figure 4 is a schematic structural diagram of an embodiment of the processing equipment of the circuit board of this application;

[0024] Figure 5 is a schematic structural diagram of an embodiment of the computer-readable storage medium of this application. Specific Embodiments

[0025] To make the technical problems solved by this application, the technical solutions adopted, and the achieved technical effects clearer, the technical solutions of the embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0026] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appearing in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0027] Please refer to Figure 1 , Figure 1 which is a schematic flowchart of the first embodiment of the processing method of the circuit board of this application. This embodiment includes the following steps:

[0028] S11: Determine the target scanning area on the circuit board to be processed according to the area to be processed preset in the initial processing program.

[0029] In this embodiment, a processing method for a circuit board is provided. Specifically, this method is a method for processing a circuit board using a circuit board automatic processing device integrated with a processor. Among them, the processor can perform program control so that the circuit board automatic processing device can control the specific processing devices integrated therein to process the circuit board according to the preset program data. For example, in a specific embodiment, the circuit board automatic processing device can control the mechanical drill bit or laser drill bit in its drilling machine to drill through holes or back drill the area to be processed on the circuit board to be processed, or control the etching machine to form corresponding signal lines in the area to be processed on the circuit board to be processed, or perform patterning processing on the corresponding copper clad board of the circuit board to be processed. Of course, in other embodiments, the processing method of this circuit board can also be applied to the application scenarios of other processing technologies, and this embodiment does not limit this.

[0030] It can be understood that generally, in the design stage of the circuit logic of the circuit board to be processed, the area to be processed of the circuit board to be processed is usually determined according to the current actual requirements, that is, the position parameters where the circuit board to be processed is intended to be processed, so as to be able to form an initial processing program correspondingly and input it into the corresponding circuit board processing device, so that in the subsequent process flow, the area to be processed of the circuit board to be processed can be determined according to the initial processing program, and the corresponding devices in the circuit board processing device can be controlled to process and manufacture the circuit board to be processed.

[0031] Specifically, in this embodiment, first, a preset area to be processed on the circuit board to be processed is determined according to the initial processing program, so as to further determine a target scanning area on the circuit board to be processed for scanning based on the position information of the area to be processed.

[0032] Among them, the size area occupied by the target scanning area on the circuit board to be processed is not less than the size area occupied by the area to be processed, and covers the entire area to be processed. That is to say, the acquisition of the target scanning area can specifically be a certain magnification based on the obtained position information of the area to be processed, or directly determined by the position information of the area to be processed, so as to determine the physical properties of the circuit board to be processed within the entire area to be processed through scanning. For example, the dielectric thickness, area size information, etc. of each dielectric layer corresponding to the area to be processed inside the circuit board to be processed.

[0033] Optionally, there is at least one area to be processed on the circuit board to be processed for processing, and correspondingly, there is also at least one target scanning area.

[0034] It can be understood that due to the individual differences of the circuit board to be processed and the differences in the dielectric thickness parameters of its various parts, the unevenness of its board thickness and dielectric thickness may all lead to different process errors or even process defects in different processing areas when the same process parameters are used to process the circuit board to be processed, resulting in irreparable losses, and also causing waste of manpower and adverse effects on production efficiency in the subsequent reprocessing compensation process. Therefore, it is very necessary to process the circuit board with process parameters matching its actual physical properties for different areas to be processed on the circuit board to be processed.

[0035] Optionally, to ensure the effectiveness of scanning, for example, based on the size of the area to be processed (back drilling, impedance line), a small amount of scanning range can be increased to avoid scanning misalignment caused by expansion and contraction, hole deviation, etc. That is to say, the size area occupied by the target scanning area on the circuit board to be processed is larger than the size area occupied by the area to be processed, so as to effectively prevent the situation that the area to be actually processed is offset due to adverse changes such as expansion and contraction of the local part of the circuit board to be processed, but the physical properties of the actual processing area cannot be obtained through scanning.

[0036] Optionally, the cross-sectional size of the target scanning area is not less than three times or two times or any other reasonable multiple of the cross-sectional size of the area to be processed, so as to effectively reduce the scanning size as much as possible to increase the scanning and calculation efficiency, while also effectively avoiding the adverse effects of local changes in the circuit board to be processed.

[0037] S12: Scan the target scanning area to measure the thickness of the dielectric layer to be processed in the circuit board to be processed.

[0038] Further, scan the target scanning area on the circuit board to be processed. For example, scan it with X-rays, ultrasonic waves, or any other reasonable rays, so as to measure and calculate the thicknesses of the to-be-processed dielectric layers to be processed in the circuit board to be processed according to the corresponding algorithm.

[0039] It can be understood that there is a certain degree of difference in density between copper and other dielectric layers (resin, fiberglass cloth, ceramic filler) in the circuit board, so the absorption of X-rays or any other reasonable rays by the two will also be different; and due to the discontinuity of the interface between the copper layer and other dielectric layers (two different acoustic impedance media), the two also have a certain reflection effect on ultrasonic waves at the corresponding interface; therefore, the dimensions such as the dielectric thickness and copper thickness of each dielectric layer inside the circuit board to be processed can be identified by scanning the circuit board to be processed with X-rays or ultrasonic waves. For example, the thickness of the to-be-processed dielectric layer in the circuit board to be processed is measured and calculated.

[0040] S13: Obtain the actual processing parameters based on the thickness of the to-be-processed dielectric layer.

[0041] Furthermore, based on the thickness of the to-be-processed dielectric layer obtained by scanning and measuring, the actual processing parameters are calculated using a set function. For example, the actual back drill depth or the production width of the signal line is calculated.

[0042] S14: Update the initial processing program according to the actual processing parameters, so as to process the circuit board to be processed through the updated initial processing program.

[0043] In the initial processing program loaded in the processing equipment of the circuit board, there is usually an initial processing parameter corresponding to it. The initial processing parameter can specifically include the position information of the back drill, the back drill depth, the production width of the signal line, etc. And this initial processing parameter is usually a theoretical design value formed without considering the actual situation of the circuit board to be processed, so there will be a situation where it does not match the actual physical characteristics of the circuit board to be processed.

[0044] Specifically, after obtaining the actual processing parameters of each to-be-processed area through scanning and measuring, the initial processing program can be updated with the actual processing parameters. For example, the initial processing parameter in the initial processing program is replaced with a more reasonable actual processing parameter to generate a new processing program, so as to be able to process the circuit board to be processed through the updated initial processing program that better matches the actual physical characteristics of each to-be-processed area.

[0045] Therefore, it can be seen that the processing method of the circuit board of the present application can automatically update the initial processing program according to the actual processing parameters, and process the circuit board through the updated initial processing program, so that the circuit board to be processed can be more effectively processed perfectly at one time. Therefore, it can effectively avoid the waste of manpower caused by compensating for the process errors caused by constant processing parameters through reprocessing, and also make the corresponding processing efficiency higher, and can achieve more accurate processing control.

[0046] Further, in an embodiment, the above S11 of the processing method of the circuit board of the present application may specifically further include: obtaining the position information of the reference positioning holes on the circuit board to be processed, so as to determine the target scanning area on the circuit board to be processed according to the position information of the reference positioning holes and the area to be processed.

[0047] Among them, after the circuit board to be processed is fixed on the machine table of the circuit board processing equipment through the backing plate, in order to ensure the accuracy of the processing position of each circuit board to be processed identified, the identification and positioning of the area to be processed on the circuit board to be processed is usually to directly set a reference system on the circuit board to be processed to obtain the position information relative to the reference point on the circuit board to be processed to determine the corresponding processing position, so as to avoid errors caused by the circuit board to be processed being in different positions on the machine table. For example, first identify and obtain the position information of the reference positioning holes on the circuit board to be processed, and determine the specific target scanning area according to the position information of the area to be processed corresponding to the initial program relative to the reference positioning holes.

[0048] Optionally, the reference positioning holes include at least three, and are distributed at at least three different positions on at least three different side edges of the circuit board to be processed, so as to effectively ensure the accuracy of the scanning position.

[0049] Further, in an embodiment, the above S12 of the processing method of the circuit board of the present application may specifically further include: scanning the medium layer to be processed in the target scanning area to measure and obtain the thickness of the medium layer to be processed in the circuit board to be processed.

[0050] It can be understood that when processing a certain characteristic process of the circuit board to be processed, it is usually not necessary to process each medium layer of the circuit board to be processed. For the medium layer that does not need to be processed, it is not necessary to know its specific physical properties. That is, the scanning depth of the circuit board to be processed does not need to be equal to the board thickness of the circuit board to be processed.

[0051] In this embodiment, by scanning only the medium layer to be processed in the target scanning area for processing, the thickness of the medium layer to be processed in the circuit board to be processed can be measured, which can effectively avoid scanning each medium layer in the entire circuit board to be processed and can effectively improve the efficiency of corresponding scanning and measurement. In other embodiments, the scanning of the target scanning area on the circuit board to be processed can also be the entire board thickness, or one or two layers deeper than the medium layer to be processed, to leave a margin or meet the requirements of multiple different process flows. The present application does not limit this.

[0052] Further, in one embodiment, the above S12 in the method for processing a circuit board of the present application may specifically further include: scanning the target scanning area by X-rays or ultrasonic waves to measure the thickness of the medium layer to be processed in the circuit board to be processed.

[0053] It can be understood that since there is a certain degree of difference in density between copper and other medium layers (resin, fiberglass cloth, ceramic filler) in the circuit board, the absorption of X-rays or any other reasonable rays by the two will also be different; and due to the discontinuity of the interface between the copper layer and other medium layers (two different acoustic impedance media), the two also have a certain reflection effect on ultrasonic waves at the corresponding interface; therefore, the dimensions such as the thickness of each medium layer and the copper thickness inside the circuit board to be processed can be identified by scanning the circuit board to be processed with X-rays or ultrasonic waves. For example, the thickness of the medium layer to be processed in the circuit board to be processed can be measured.

[0054] In other embodiments, the target scanning area can also be scanned by any reasonable rays such as infrared rays and gamma rays to measure the thickness of the medium layer to be processed in the circuit board to be processed. The present application does not limit this.

[0055] Different from the prior art, the method for processing a circuit board in the present application first determines the target scanning area on the circuit board to be processed through the area to be processed preset in the initial processing program, so as to scan and measure the thickness of the medium layer to be processed in the circuit board to be processed, and calculate more effective actual processing parameters based on the thickness of the medium layer to be processed. Furthermore, the initial processing program can be automatically updated according to the actual processing parameters, and the circuit board to be processed can be processed more effectively and perfectly at one time through the updated initial processing program, so as to avoid the waste of manpower caused by the process error caused by reprocessing to compensate for constant processing parameters, and the corresponding processing efficiency is higher, and more accurate processing control can be achieved.

[0056] Please refer to Figures 2a - 2c , where Figure 2a is a schematic flowchart of the second implementation manner of the method for processing a circuit board of the present application, Figure 2b isFigure 2a Schematic structural diagram of an embodiment corresponding to S21 - S24 Figure 2c is Figure 2b The top view of the circuit board to be processed in Figure 1 Schematic flow diagram of a refined embodiment of the lamination method of the circuit board in , where when the processing aimed at the circuit board to be processed is back drilling, the corresponding actual processing parameter is the actual back drilling depth. This embodiment specifically includes the following steps:

[0057] S21: Determine the target scanning area on the circuit board to be processed according to the preset area to be processed in the initial processing program.

[0058] Among them, S21 is the same as S11 in Figure 1 , for specific details, please refer to S11 and its related text descriptions, which will not be elaborated here.

[0059] S22: Scan the target scanning area to measure and obtain the maximum distance H between the target copper layer and the surface copper layer in the circuit board to be processed 1 .

[0060] Specifically, please refer to Figure 2b and Figure 2c , when the circuit board to be processed 100 is fixed on the machine table 300 of the circuit board processing equipment through the backing plate 200 and the back drilling is performed on the circuit board to be processed 100 through the drill bit 400, usually only the corresponding part of the hole copper between the target copper layer and the surface copper layer in the circuit board to be processed 100 needs to be removed by back drilling.

[0061] In this embodiment, first, the area to be processed 120 is positioned and identified through the reference positioning holes 110 on the circuit board to be processed 100, so as to further scan the target scanning area 130 on the circuit board to be processed 100 to measure and obtain the maximum distance H between the target copper layer and the surface copper layer in the circuit board to be processed 100 1 .

[0062] Among them, the maximum distance H 1 is specifically the average value of the maximum distance H between the target copper layer and the surface copper layer measured and obtained within the target scanning area 130 1 .

[0063] Optionally, the reference positioning holes 110 are specifically distributed at at least three different positions on three different side edges of the circuit board to be processed 100 to ensure the accuracy of the scanning position.

[0064] Among them, to ensure the effectiveness of scanning, the target scanning area 130 is specifically a small amount of scanning range added on the basis of the size of the to-be-machined area 120 where back drilling is intended, so as to avoid misalignment of scanning caused by thermal expansion and contraction, hole deviation, etc.

[0065] For ease of understanding, taking the added scanning range as S as an example, the target scanning area 130 for scanning the position of the back drill hole can be a cylinder with a cross-sectional diameter of: (d + s), where d is specifically the diameter of the back drill hole, and s is the width of the ring corresponding to the added scanning range S.

[0066] Among them, the value of s is specifically determined according to the fluidity of the non-copper dielectric layer in the circuit board. For example, when the fluidity of the non-copper dielectric layer is greater, s is greater.

[0067] Optionally, s ≥ 2d and s ≥ 200 microns.

[0068] S23: Based on H 1 Calculate the actual back drill depth Z.

[0069] Among them, for ease of understanding, taking the target residual copper control value for back drilling the to-be-machined circuit board 100 by the drill bit 400 as Stub and the initial compensation value as L, it can be known that based on H 1 The specific calculation formula for calculating the actual back drill depth Z can be:

[0070] Z = H 1 - stub + L.

[0071] Among them, the initial compensation value is L, and it is specifically given by the initial program, and can include the compensation value of the drill tip and the compensation value corresponding to the thermal expansion and contraction change of the to-be-machined circuit board 100, etc.

[0072] S24: Update the initial processing program according to the actual back drill depth Z, so as to perform back drilling on the to-be-machined circuit board through the updated initial processing program.

[0073] Furthermore, update the initial processing program according to the actual back drill depth Z. For example, by replacing the preset back drill depth value in the initial processing program with the actual back drill depth Z to generate a new processing program, so as to further perform back drilling on the to-be-machined circuit board 100 through the updated initial processing program.

[0074] Please refer to Figure 3 , Figure 3 is the schematic flowchart of the third embodiment of the processing method of the circuit board of the present application. The processing method of the circuit board in this embodiment is Figure 1Schematic diagram of a refined implementation of the lamination method for a circuit board, where when the processing aimed at the circuit board to be processed is to fabricate a signal line, the corresponding actual processing parameter is the width of the signal line to be fabricated. This implementation includes the following steps:

[0075] S31: Determine the target scanning area on the circuit board to be processed according to the area to be processed preset in the initial processing program.

[0076] Among them, S21 is the same as Figure 1 S11 in, for specific details, please refer to S11 and its related text descriptions, which will not be elaborated here.

[0077] S32: Scan the target scanning area to measure the maximum distance H between the copper layer where the signal line is located and its adjacent grounding copper layer in the circuit board to be processed 2 .

[0078] Among them, when fabricating a signal line in the circuit board to be processed, usually the copper layer where the signal line is to be fabricated is etched to form the corresponding signal line. And in the fabrication of the signal line, the most important target control value is the impedance value of the signal line, that is, the impedance value of the finally formed signal line needs to be accurately controlled.

[0079] It can be understood that the impedance value of the signal line is specifically determined by the cross-sectional size of the copper medium forming the signal line. Usually in the circuit board to be processed, the thickness of each copper layer is fixed after its fabrication. Therefore, to ensure that the impedance value of the finally formed signal line can be accurately controlled, usually during the corresponding etching, an appropriate width for fabricating the signal line needs to be ensured. For example, when the thickness of the copper layer where the signal line is located is large, a copper medium signal line with a smaller width needs to be etched, and when the thickness of the copper layer where the signal line is located is small, a copper medium signal line with a larger width needs to be etched to ensure the stability of the impedance value of the signal line formed in different areas to be processed.

[0080] Specifically, scan the target scanning area. For example, scan the target scanning area on the circuit board to be processed through X-rays or ultrasonic waves to measure the maximum distance H between the copper layer where the signal line is located and its adjacent grounding copper layer 2 .

[0081] Among them, the maximum distance H 2 Specifically, it is the average value of the maximum distance H between the copper layer where the signal line is located and its adjacent grounding copper layer measured in the target scanning area 130 2 .

[0082] S33: Based on H 2The calculated width W of the signal line to be fabricated is obtained.

[0083] In this embodiment, the width calculation of the signal line takes the surface microstrip line as an example. According to the impedance calculation formula of the microstrip line Z = {87 / [sqrt(Er + 1.41)]}ln[5.98H1 / (0.8W + T)], the corresponding width W of the signal line to be fabricated can be inversely calculated. Wherein, Z is the target impedance value to be achieved by the signal line, Er is the material dielectric constant, and T is the thickness of the copper layer where the signal line is located. Then the corresponding inverse calculation formula is as follows:

[0084]

[0085] S34: Update the initial processing program according to the width W of the signal line to be fabricated, so as to fabricate and form the corresponding signal line in the area to be processed on the circuit board to be processed through the updated initial processing program.

[0086] Further, update the initial processing program according to the width W of the signal line to be fabricated. For example, generate a new processing program by replacing the preset width value of the signal line to be fabricated in the initial processing program with the width W of the signal line to be fabricated, so as to fabricate and form the corresponding signal line in the area to be processed on the circuit board to be processed through the updated initial processing program.

[0087] Based on the overall inventive concept, the present application also provides a processing device for a circuit board. Please refer to Figure 4 , Figure 4 which is a schematic structural diagram of an embodiment of the processing device for the circuit board of the present application.

[0088] Among them, the processing device 41 of the circuit board specifically includes a memory 411, a processor 412 and a processing device 413 that are coupled to each other; the memory 411 stores program data; and the processor 412 is used to execute the program data to control the processing device 413 to implement the processing method of the circuit board as described in any one of the above.

[0089] Optionally, the processing device 413 can specifically be any reasonable mechanical and electronic device such as a drilling machine or an etching machine, so that the processing device 413 can be controlled by the processor 412 loaded with program data, thereby enabling the corresponding circuit board to be processed. The present application does not make any limitations in this regard.

[0090] Based on the overall inventive concept, the present application also provides a computer-readable storage medium. Please refer to Figure 5 , Figure 5 which is a schematic structural diagram of an embodiment of the computer-readable storage medium of the present application. Among them, program data 511 is stored in the computer-readable storage medium 51, and the program data 511 can be executed to implement the processing method of the circuit board as described in any one of the above.

[0091] In one embodiment, the computer-readable storage medium 51 may be a storage chip in a terminal, a hard disk, a mobile hard disk, a USB flash drive, an optical disc, or other writable and readable storage tools, or may also be a server, etc.

[0092] In several embodiments provided by the present application, it should be understood that the disclosed methods and apparatuses can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the processor or the memory is only a logical function division. In actual implementation, there may be other division methods. For example, the functions implemented by multiple processors and memories can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or connections to each other can be through some interfaces. The indirect couplings or connections of devices or units can be in electrical, mechanical, or other forms.

[0093] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of this embodiment.

[0094] In addition, in each embodiment of the present application, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0095] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods in each embodiment of the present application. The foregoing storage medium includes: USB flash drives, mobile hard disks, read-only memories (ROM, Read-Only Memory), random access memories (RAM, Random Access Memory), magnetic disks, or optical discs, etc., which can store program codes.

[0096] Different from the prior art, the processing method of the circuit board in this application first determines the target scanning area on the circuit board to be processed through the preset area to be processed in the initial processing program, so as to be able to scan and measure the thickness of the medium layer to be processed in the circuit board to be processed, and calculate more effective actual processing parameters based on the thickness of the medium layer to be processed. Furthermore, it can automatically update the initial processing program according to the actual processing parameters, and process the circuit board to be processed more effectively at one time through the updated initial processing program, so as to avoid the waste of manpower caused by the process error caused by reprocessing to compensate for constant processing parameters, and also make the corresponding processing efficiency higher, and more accurate processing control can be achieved.

[0097] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A processing method for a circuit board, characterized in that, the processing method for the circuit board includes: determining a target scanning area on the circuit board to be processed according to a preset area to be processed in an initial processing program; wherein, the step of determining the target scanning area on the circuit board to be processed according to the preset area to be processed in the initial processing program includes: obtaining the position information of a reference positioning hole on the circuit board to be processed, so as to determine the target scanning area on the circuit board to be processed according to the position information of the reference positioning hole and the area to be processed; Scan the target scanning area to measure the thickness of the to-be-processed dielectric layer in the to-be-processed circuit board; wherein, the step of scanning the target scanning area to measure the thickness of the to-be-processed dielectric layer in the to-be-processed circuit board includes: scanning the target scanning area to measure the maximum distance H between the target copper layer and the surface copper layer in the to-be-processed circuit board 1 ; Obtain the actual processing parameters based on the thickness of the medium layer to be processed; the actual processing parameters are the actual backdrilling depth, and the step of obtaining the actual processing parameters based on the thickness of the medium layer to be processed includes: based on the H 1 Calculate to obtain the actual backdrilling depth Z; where the corresponding calculation formula is Z = H 1 -stub + L; where stub is the target residual copper control value of the circuit board to be processed, and L is the initial compensation value; updating the initial processing program according to the actual processing parameters, so as to process the circuit board to be processed through the updated initial processing program.

2. The processing method for a circuit board according to claim 1, characterized in that, the reference positioning holes include at least three, and are distributed at positions on at least three different side edges of the circuit board to be processed.

3. The processing method for a circuit board according to claim 1, characterized in that, the step of scanning the target scanning area to measure the thickness of the medium layer to be processed in the circuit board to be processed includes: scanning the medium layer to be processed in the target scanning area to measure the thickness of the medium layer to be processed in the circuit board to be processed.

4. The processing method for a circuit board according to claim 1, characterized in that, the step of scanning the target scanning area to measure the thickness of the medium layer to be processed in the circuit board to be processed includes: scanning the target scanning area by X-ray or ultrasonic wave to measure the thickness of the medium layer to be processed in the circuit board to be processed.

5. The processing method for a circuit board according to claim 1, characterized in that, the cross-sectional dimension of the target scanning area is not less than three times the cross-sectional dimension of the area to be processed.

6. A processing device for a circuit board, characterized in that, the processing device includes a memory, a processor and a processing device which are mutually coupled; the memory stores program data; the processor is used to execute the program data to control the processing device to implement the processing method for the circuit board according to any one of claims 1-5.

7. A computer-readable storage medium, characterized in that, the computer-readable storage medium stores program data, and the program data can be executed to implement the processing method for the circuit board according to any one of claims 1-5.

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