Fast welding method, system and device with multiple nozzles

Abstract

The present invention discloses a rapid dip soldering method, system and device with multiple nozzles. The method includes: providing a dip soldering furnace with multiple nozzles; the nozzles are arranged side by side in the first direction, and the dip soldering furnace moves in the second direction, and each nozzle is independently started and closed; scanning the circuit board to be soldered to obtain the distribution of solder joints to be soldered in a two-dimensional coordinate system with the circuit board to be soldered as the two-dimensional coordinate system, and forming the coordinate positions of the solder joints to be soldered; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction; selecting the corresponding target nozzle in the dip soldering furnace according to the coordinate positions of each solder joint to be soldered. When the dip soldering furnace moves in the second direction and the solder joint to be soldered enters the tin spraying range of the target nozzle, the target nozzles are all configured in the tin spraying state; multiple points can be soldered simultaneously. During soldering, the nozzles do not need to move and position repeatedly. The entire circuit board can move horizontally in sequence to solder all the solder joints. The soldering efficiency is high. The configured nozzles can adapt to all circuit boards, and the equipment utilization rate is high.

Description

Technical Field

[0001] The present invention relates to the technical field of wave soldering, and in particular to a fast row soldering method, system and device with multiple nozzles. Background Art

[0002] With the continuous development of Chinese electronic devices, high efficiency and high quality have become the continuous pursuit in the manufacturing industry. Selective wave soldering is a new method that emerged in recent years to solder specific through-hole insertion components using equipment, and it is widely used in fields such as automotive electronics, digital, electronics, electroacoustics, and LCD.

[0003] Generally, the existing selective wave soldering equipment in the market is only equipped with one or two nozzles, and only one or two solder joints can be soldered at a time. When soldering a circuit board with multiple solder joints, the nozzle needs to be repeatedly moved and positioned, resulting in low soldering efficiency. Although the nozzles customized for PCBs can solder multiple solder joints at a time, they can only be used for specific purposes, have a narrow scope of adaptation, and high costs. Although there are devices with multiple nozzles developed in the prior art, for example, the document with the application number 202121953583.1 discloses a selective precision wave soldering multi-nozzle device; including a nozzle body, a connecting part is fixed below the nozzle body, a nozzle channel is arranged inside the connecting part, a partition is fixed inside the nozzle body, multiple groups of spray openings are equidistantly arranged above the surface of the partition, connecting pipes are arranged at the bottom ends of the spray openings, and the connecting pipes are communicated with the nozzle channel. It also includes a blowing component for improving the shape of the wave peak umbrella top formed by the spray pipe, and the blowing component is located inside the spray opening. By providing multiple groups of spray openings, the original single-point circular soldering spray opening is changed to a multi-point rectangular soldering spray opening, and multiple points in a local area can be sprayed with tin simultaneously during operation, effectively improving the production efficiency, meeting the needs of users, and being convenient for use; however, it only discloses a multi-nozzle device, and for the solder joints with different arrangements, distributions, and sizes on the circuit board, it cannot truly and effectively perform soldering judgment, and for the solder joints exactly located between the two, the device does not provide an effective method for soldering. Therefore, in practical applications, there is still a lack of a method that can complete the soldering task of all solder joints on the circuit board in a single movement. Summary of the Invention

[0004] Aiming at the problem existing in the above technology: the problem that all solder joints on the circuit board cannot be soldered during a single row soldering movement; the present application provides a technical solution to solve this problem.

[0005] To achieve the above object, the present invention provides a fast row soldering method with multiple nozzles, including the following steps:

[0006] Provide a soldering furnace with multiple nozzles; the nozzles are arranged side by side in the first direction, and the soldering furnace moves in the second direction, and each of the nozzles is independently started and closed;

[0007] Scan the circuit board to be soldered to obtain the distribution of solder joints to be soldered in a two-dimensional coordinate system with the circuit board to be soldered as the coordinate system, and form the coordinate positions of the solder joints to be soldered; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction;

[0008] Select the corresponding target nozzles in the soldering furnace according to the coordinate positions of each solder joint to be soldered. When the soldering furnace moves in the second direction and the solder joint to be soldered enters the tin spraying range of the target nozzle, the target nozzles are all configured to be in the tin spraying state.

[0009] Preferably, compare the size of the circuit board to be soldered and the effective tin spraying length of the soldering furnace in the first direction, and adjust the number of nozzles.

[0010] Preferably, when scanning the circuit board to be soldered, obtain the soldering ranges of all the solder joints to be soldered; select the corresponding target nozzles in the soldering furnace according to the soldering ranges; when the soldering range enters the tin spraying range of the target nozzle, the target nozzle enters the tin spraying state.

[0011] Preferably, obtain the tin spraying range of the nozzle. When the scanning path of the tin spraying range of the nozzle in the second direction completely covers the soldering range, it is selected as the target nozzle.

[0012] Preferably, obtain the tin spraying range of the nozzle. When the scanning path of the tin spraying range of the nozzle in the second direction does not completely cover the soldering range, select at least one adjacent nozzle to form a target nozzle group composed of at least two nozzles, and the tin spraying range formed by the target nozzle group completely covers the soldering range; when the solder joint to be soldered enters the tin spraying range of the target nozzle group, the target nozzle group is simultaneously configured to be in the tin spraying state.

[0013] Preferably, according to the soldering range and the coordinate positions of the solder joints to be soldered, group the solder joints to be soldered according to the solder joints to be soldered in the same first direction. When the soldering furnace drives the nozzles to move in the second direction, solder all the solder joints to be soldered in the same first direction.

[0014] It further includes a fast sequential soldering system with multiple nozzles, adopting the above method, including a control module, a scanning unit and a soldering furnace with multiple nozzles,

[0015] The nozzles are arranged side by side in the first direction, and the soldering furnace moves in the second direction. The control module independently controls each of the nozzles to be independently started and closed;

[0016] Provide a circuit board to be welded. The scanning unit is used to scan the circuit board to be welded to obtain the distribution of solder joints to be welded with the circuit board to be welded as a two-dimensional coordinate system, and form the coordinate positions of the solder joints to be welded; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction.

[0017] The control module is used to select the corresponding target nozzle in the tin furnace according to the coordinate positions of each solder joint to be welded. When the tin furnace moves in the second direction and the solder joint to be welded enters the tin spraying range of the target nozzle, the target nozzle is configured to be in the tin spraying state.

[0018] Preferably, after the circuit board to be welded enters the flux spraying module, the scanning unit completes the scanning and puzzle assembly of the circuit board to be welded.

[0019] Preferably, each nozzle has the same specification, and two adjacent nozzles are arranged in contact with each other.

[0020] It also includes a fast row welding device with multiple nozzles, including a tin furnace. The tin furnace has multiple nozzles, and the above system runs in the tin furnace.

[0021] The beneficial effects of the present invention are as follows: The present invention discloses a fast row welding method with multiple nozzles, including the following steps: providing a tin furnace with multiple nozzles; the nozzles are arranged side by side in the first direction, and the tin furnace moves in the second direction, and each nozzle is independently started and closed; scanning the circuit board to be welded to obtain the distribution of solder joints to be welded with the circuit board to be welded as a two-dimensional coordinate system, and form the coordinate positions of the solder joints to be welded; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction; selecting the corresponding target nozzle in the tin furnace according to the coordinate positions of each solder joint to be welded. When the tin furnace moves in the second direction and the solder joint to be welded enters the tin spraying range of the target nozzle, the target nozzle is configured to be in the tin spraying state; multiple points can be welded simultaneously. During welding, the nozzle does not need to move and position repeatedly. The entire circuit board can move horizontally in sequence to weld all solder joints. The welding efficiency is high, the configured nozzles can adapt to all circuit boards, and the equipment utilization rate is high. Description of the Drawings

[0022] Figure 1 It is a flowchart of the method of the present invention;

[0023] Figure 2 It is a schematic diagram of an embodiment of the present invention.

[0024] The main component symbols are explained as follows:

[0025] c, circuit board to be welded; d, solder joint to be welded; e, nozzle. Detailed Description of the Invention

[0026] To describe the present invention more clearly, the present invention will be further described below with reference to the accompanying drawings.

[0027] In the following description, specific details of general election examples are given to provide a deeper understanding of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. It should be understood that the specific embodiments are only used to explain the present invention and are not used to limit the present invention.

[0028] It should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, wholes, steps, operations, elements or components, but do not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components or combinations thereof.

[0029] This application discloses that the present invention provides a fast dip soldering method with multiple nozzles. Please refer to Figure 1 ; including the following steps:

[0030] Provide a solder pot with multiple nozzles; the nozzles are arranged side by side in the first direction, and the solder pot moves in the second direction. Each nozzle is independently started and closed. Since there are various circuit board specifications, the number of nozzles can be configured according to the specific circuit board specifications, and the nozzle specifications can also be matched according to the soldering requirements. For example, the specification of a single nozzle can be customized specifications such as 5mm, 6mm, 8mm, etc., and the distance between two nozzles is designed with dimensions such as 1mm, 2mm, 3mm, etc. And for a specific circuit board design, different specifications of nozzles can be combined in the selection of nozzles to achieve faster working efficiency and better tin spraying effect; wherein, the so-called side-by-side arrangement in the first direction means that all nozzles are adjacent and side by side in sequence and are located on the same straight line. Then, in order to start the nozzles for soldering simultaneously, the entire solder pot moves in the second direction to form a complete coverage area;

[0031] Scan the circuit board to be soldered. Specifically, when the circuit board to be soldered enters the flux spraying module, the camera completes the scanning and stitching of the circuit board to obtain the distribution of the solder joints to be soldered with the circuit board to be soldered as the two-dimensional coordinate system, and form the coordinate positions of the solder joints to be soldered; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction; that is to say, the first direction and the second direction are two mutually perpendicular directions. Then, when the solder pot moves in the second direction, the position where it pauses arbitrarily can form a coverage range in the first direction; thereby realizing the soldering action on the solder joints to be soldered.

[0032] Select the corresponding target nozzle in the soldering furnace according to the coordinate positions of each solder joint to be welded. When the soldering furnace moves in the second direction and the solder joint to be welded enters the solder spraying range of the target nozzle, the target nozzle is configured to be in the solder spraying state. Since the relative positions of each solder joint to be welded in the XY coordinate system are obtained during the scanning process, it is possible to know which nozzle in the soldering furnace will pass below the solder joint to be welded when moving, so that welding can be completed. Specifically, when the soldering furnace drives the nozzle to move in the second direction, if it enters the range of the solder joint to be welded, then the target nozzle sprays solder. At the same time, since all nozzles are on the same straight line in the first direction at this time, and there may be other solder joints to be welded on this straight line, the target nozzles corresponding to the remaining solder joints to be welded also work to achieve covering welding. Then when the soldering furnace finishes moving in the second direction (after completely covering the circuit board to be welded), all the solder joints on the circuit board have been welded. For mass production, directly proceed with the welding work of the next board sample. If the specification of the circuit board to be welded is changed, just rescan according to this method.

[0033] In this embodiment, compare the size of the circuit board to be welded and the effective solder spraying length of the soldering furnace in the first direction, and adjust the number of nozzles. For example, if the circuit board is a two - panel board with a length of a in the first direction, and the effective length of the soldering furnace cannot completely cover it, then adjust it to half of a, and repeat the welding process 2 times to complete the welding. When the length is increased, and so on.

[0034] In this embodiment, when scanning the circuit board to be welded, obtain the welding range of all solder joints to be welded; select the corresponding target nozzle in the soldering furnace according to the welding range; when the welding range enters the solder spraying range of the target nozzle, the target nozzle enters the solder spraying state. It should be further noted that since there are differences in the welding ranges required for each solder joint to be welded on the circuit board, and these solder joints to be welded are not completely regularly distributed on the circuit board, with different spacing distances, there are cases of complete coverage and incomplete coverage for the regularly arranged nozzles. For the case of complete coverage, directly enable the nozzle to spray solder.

[0035] In a more specific embodiment, after obtaining the solder spraying range of the nozzle, when the scanning path of the solder spraying range of the nozzle in the second direction completely covers the welding range, it is selected as the target nozzle. Because for each individual nozzle, the path in the second direction is the path passed on the circuit board. When passing the solder joint to be welded on this path, welding is performed.

[0036] In a specific embodiment, the tin spraying range of the nozzle is obtained. When the scanning path of the tin spraying range of the nozzle in the second direction does not completely cover the range to be welded, at least one adjacent nozzle is selected to form a target nozzle group composed of at least two nozzles, and the tin spraying range formed by the target nozzle group completely covers the range to be welded. When the solder joints to be welded enter the tin spraying range of the target nozzle group, the target nozzle group is simultaneously configured to be in the tin spraying state. Since the working range of a single nozzle cannot completely cover some solder joints with a relatively large range to be welded, adjacent nozzles need to operate synchronously to complete the welding action of the solder joints to be welded.

[0037] In one embodiment, according to the range to be welded and the coordinate positions of the solder joints to be welded, the solder joints to be welded are grouped according to the solder joints to be welded in the same first direction. When the tin furnace drives the nozzle to move in the second direction, all the solder joints to be welded in the same first direction are welded. Since after the circuit board to be welded can be divided into a two-dimensional coordinate system formed by the XY axis coordinate system, all the solder joints to be welded can be position-confirmed according to their ranges to be welded, so according to the distribution of all the solder joints to be welded on the X-axis, they can be classified on the ray of a certain X-axis point position, that is, in the first direction. Therefore, when the tin furnace moves in the second direction, all the nozzles in the first direction can operate independently to complete the welding work of the solder joints to be welded.

[0038] It also includes a fast sequential soldering system with multiple nozzles, adopting the above method, including a control module, a scanning unit, and a tin furnace with multiple nozzles.

[0039] The nozzles are arranged side by side in the first direction, and the tin furnace moves in the second direction. The control module independently controls each nozzle to start and close independently.

[0040] A circuit board to be welded is provided. The scanning unit is used to scan the circuit board to be welded to obtain the distribution of the solder joints to be welded with the circuit board to be welded as a two-dimensional coordinate system, and form the coordinate positions of the solder joints to be welded. The Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction.

[0041] The control module is used to select the corresponding target nozzle in the tin furnace according to the coordinate position of each solder joint to be welded. When the tin furnace moves in the second direction and the solder joint to be welded enters the tin spraying range of the target nozzle, the target nozzle is configured to be in the tin spraying state.

[0042] In this embodiment, when the circuit board to be welded enters the flux spraying module, the scanning unit completes the scanning and puzzle assembly of the circuit board to be welded.

[0043] In this embodiment, each nozzle has the same specification, and adjacent two nozzles are arranged in contact with each other.

[0044] It further includes a rapid soldering device with multiple nozzles, including a solder pot which has multiple nozzles and operates the above-mentioned system. Embodiment

[0045] Please refer to Figure 2 ; Provide a circuit board c to be soldered, scan the circuit board to be soldered to obtain a two-dimensional XY coordinate system, and scan to obtain 22 solder joints d to be soldered. After comparing the width of the circuit board to be soldered and the length of the solder pot, it is known that 18 nozzles can cover the entire board surface. The specification of a single nozzle e is 5 mm, the wall thickness between two nozzles is 2 mm, and each nozzle is equipped with a power system; as can be seen from the figure, the nozzles are arranged at intervals in the first direction (Y-axis direction) and move as a whole in the second direction (X-axis direction);

[0046] The soldering ranges of the solder joints 1, 2, 3, and 4 to be soldered respectively fall within the tin spraying ranges of nozzles 1, 2, 10, and 11. The programming software sets that the solder joint 1 to be soldered enables nozzle 1 as the soldering nozzle, the solder joint 2 to be soldered enables nozzle 2 as the soldering nozzle, the solder joint 3 to be soldered enables nozzle 10 as the soldering nozzle, and the solder joint 4 to be soldered enables nozzle 11 as the soldering nozzle.

[0047] The soldering ranges of the solder joints 5, 6, and 7 to be soldered respectively fall within the tin spraying ranges of nozzles 4, 5, and 6. The programming software sets that the solder joints 5, 6, and 7 to be soldered respectively enable nozzles 4, 5, and 6 as the soldering nozzles;

[0048] The soldering ranges of the solder joints 8, 9, and 10 to be soldered respectively fall within the tin spraying ranges of nozzles 13, 14, and 15. The programming software sets that the solder joints 8, 9, and 10 to be soldered respectively enable nozzles 13, 14, and 15 as the soldering nozzles.

[0049] The soldering range of the solder joint 11 to be soldered falls on the edge of the tin spraying range of nozzle 4 near nozzle 3. The programming software sets that the solder joint 11 to be soldered enables both nozzles 3 and 4 as the soldering nozzles; the Y-axis coordinate of the solder joint 12 to be soldered falls on the edge of the tin spraying range of nozzle 5 near nozzle 4. The programming software sets that the solder joint 12 to be soldered enables both nozzles 4 and 5 as the soldering nozzles;

[0050] The soldering range of the solder joint 13 to be soldered falls on the edge of the tin spraying range of nozzle 13 near nozzle 12. The programming software sets that the solder joint 13 to be soldered enables both nozzles 12 and 13 as the soldering nozzles; the Y-axis coordinate of the solder joint 14 to be soldered falls on the edge of the tin spraying range of nozzle 14 near nozzle 13. The programming software sets that the solder joint 14 to be soldered enables both nozzles 13 and 14 as the soldering nozzles;

[0051] The areas to be welded of the solder joints 15 and 16 to be welded respectively fall on the edges of the solder spraying ranges of nozzles 8 and 17. The programming software sets that nozzle 8 and 9 are enabled as the welding nozzles for the solder joint 15 to be welded, and nozzle 17 and 18 are enabled as the welding nozzles for the solder joint 16 to be welded.

[0052] The areas to be welded of the solder joints 17, 19, and 21 to be welded all fall within the solder spraying range of nozzle 2. The programming software sets that nozzle 2 is enabled as the welding nozzle for the solder joints 17, 19, and 21 to be welded.

[0053] The areas to be welded of the solder joints 18, 20, and 22 to be welded all fall within the solder spraying range of nozzle 11. The programming software sets that nozzle 11 is enabled as the welding nozzle for the solder joints 18, 20, and 22 to be welded.

[0054] The programming software sets the welding start and end times of the solder joints to be welded according to the X coordinate parameters of each solder joint to be welded obtained. All the solder joints on the same X coordinate line on the same circuit board can start the corresponding nozzles for welding simultaneously. Summarizing, when the nozzle reaches the X1 coordinate position driven by the X axis, the solder joints 1, 2, 3, and 4 at the X1 coordinate position can start the nozzles 1, 2, 10, and 11 for welding simultaneously according to the set program. After the solder joints at the X1 coordinate are completed, the nozzle continues to move forward driven by the X axis to reach the X2 coordinate position, and according to the welding program setting, the nozzles 4, 5, 6, 13, 14, and 15 are simultaneously opened to complete the welding of the six solder joints from 5 to 10. And so on, the nozzle driven by the X axis welds the solder joints at each X coordinate position of X3, X4, X5, X6... one by one until the whole board is welded. The tin furnace returns to the original position and repeats to start welding the second circuit board.

[0055] The advantages of the present invention are as follows:

[0056] Multiple points can be welded simultaneously. During welding, the nozzle does not need to move and position repeatedly. The whole circuit board can move horizontally in sequence to weld all the solder joints. The welding efficiency is high. The configured nozzles can adapt to all circuit boards, and the equipment utilization rate is high.

[0057] The above discloses only several specific embodiments of the present invention, but the present invention is not limited thereto. Any changes that can be thought of by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A rapid butt welding method with multiple nozzles, characterized in that, Including the following steps: Providing a soldering furnace with multiple nozzles; the nozzles are arranged side by side in a first direction, and the soldering furnace moves in a second direction, and each of the nozzles is independently started and closed; Scanning the circuit board to be soldered to obtain the distribution of solder joints to be soldered with the circuit board to be soldered as a two-dimensional coordinate system, and forming the coordinate positions of the solder joints to be soldered; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction; Selecting the corresponding target nozzle in the soldering furnace according to the coordinate position of each solder joint to be soldered. When the soldering furnace moves in the second direction and the solder joint to be soldered enters the tin spraying range of the target nozzle, the target nozzle is configured to be in the tin spraying state; When scanning the circuit board to be soldered, obtaining the soldering ranges of all the solder joints to be soldered; selecting the corresponding target nozzle in the soldering furnace according to the soldering range; When the soldering range enters the tin spraying range of the target nozzle, the target nozzle enters the tin spraying state; Obtaining the tin spraying range of the nozzle. When the scanning path of the tin spraying range of the nozzle in the second direction completely covers the soldering range, it is selected as the target nozzle; According to the soldering range and the coordinate positions of the solder joints to be soldered, grouping the solder joints to be soldered according to the solder joints to be soldered in the same first direction. When the soldering furnace drives the nozzle to move in the second direction, welding all the solder joints to be soldered in the same first direction.

2. The rapid butt welding method with multiple nozzles according to claim 1, characterized in that, Comparing the size of the circuit board to be soldered and the effective tin spraying length of the soldering furnace in the first direction, and adjusting the number of nozzles.

3. The rapid welding method with multiple nozzles according to claim 1, characterized in that, Obtaining the tin spraying range of the nozzle. When the scanning path of the tin spraying range of the nozzle in the second direction does not completely cover the soldering range, selecting at least one adjacent nozzle to form a target nozzle group composed of at least two nozzles, and the tin spraying range formed by the target nozzle group completely covers the soldering range; when the solder joint to be soldered enters the tin spraying range of the target nozzle group, the target nozzle group is simultaneously configured to be in the tin spraying state.

4. A rapid discharge welding system with multiple nozzles, characterized in that, Adopting the method according to any one of claims 1-3, including a control module, a scanning unit and a soldering furnace with multiple nozzles, The nozzles are arranged side by side in a first direction, and the soldering furnace moves in a second direction. The control module independently controls each of the nozzles to be independently started and closed; Providing a circuit board to be soldered, and the scanning unit is used to scan the circuit board to be soldered to obtain the distribution of solder joints to be soldered with the circuit board to be soldered as a two-dimensional coordinate system, and form the coordinate positions of the solder joints to be soldered; the Y-axis direction of the two-dimensional coordinate system is the first direction, and the X-axis direction is the second direction; The control module is used to select the corresponding target nozzle in the soldering furnace according to the coordinate position of each solder joint to be soldered. When the soldering furnace moves in the second direction and the solder joint to be soldered enters the tin spraying range of the target nozzle, the target nozzle is configured to be in the tin spraying state.

5. The rapid welding system with multiple nozzles according to claim 4, characterized in that, After the circuit board to be soldered enters the flux spraying module, the scanning unit completes the scanning and piecing together of the circuit board to be soldered.

6. The rapid welding system with multiple nozzles according to claim 4, characterized in that, Each of the nozzles has the same specification, and adjacent two nozzles are arranged in contact with each other.

7. A rapid discharge welding device with multiple nozzles, characterized in that, It includes a tin furnace which has a plurality of nozzles, and the tin furnace operates the system according to any one of claims 4-6.

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