Wiring structure, manufacturing method of wiring structure, display panel, and electronic device

By introducing a compensation structure into the wiring structure of the stretchable display, the problem of increased resistance caused by the thinning of metal wiring is solved, thus achieving resistance stability and signal transmission reliability.

CN115425032BActive Publication Date: 2026-05-01KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
Filing Date
2022-09-15
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

In stretchable displays, the metal traces become thinner due to stretching, causing the resistance to increase and affecting the stability of the display's power supply or signal transmission.

Method used

Design a trace structure including a trace body and a compensation structure. The compensation structure consists of a first contact part, an extension part, a connecting part and a second contact part. By setting these components in parallel when the trace body is stretched, the increase in resistance is offset.

Benefits of technology

The design of the compensation structure maintains the resistance stability of the wiring structure during the stretching process, ensuring the stability of power supply and signal transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The wiring structure, manufacturing method of the wiring structure, display panel, and electronic device provided in this application include a wiring body and a compensation structure. The compensation structure includes a first contact portion, an extension portion, a connecting portion, and a second contact portion. The extension portion is connected to the wiring body through the connecting portion. The first contact portion protrudes from the wiring body toward the extension portion but does not contact the extension portion. The second contact portion protrudes from the extension portion toward the wiring body but does not contact the wiring body. In a first direction, the orthographic projection of the first contact portion on the wiring body is located between the orthographic projections of the second contact portion and the connecting portion on the wiring body. By providing the compensation structure, the compensation structure can conduct when the wiring body is stretched to a certain extent, thereby connecting in parallel with the wiring body. In this way, the increased resistance of the wiring body due to stretching can be offset, thereby maintaining the overall resistance value of the entire wiring structure and ensuring the stability of power supply or signal transmission of the wiring structure.
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Description

Technical Field

[0001] This application relates to the field of display device technology, and more specifically, to a wiring structure, a method for manufacturing the wiring structure, a display panel, and an electronic device. Background Technology

[0002] Stretchable displays are a technology that uses flexible displays to extend and change size, allowing the display to be stretched partially or entirely. Stretchable displays typically employ designs such as pixel island spacing stretching or hidden pixels popping out during stretching. In these designs, the metal traces between pixels may be stretched as the screen is stretched, causing the traces to elongate and thin, leading to increased resistance and affecting the stability of the display's power supply or signal transmission. Summary of the Invention

[0003] To overcome one of the technical problems mentioned in the above background, embodiments of this application provide a wiring structure, the wiring structure comprising:

[0004] A wiring body, the wiring body extending along a first direction;

[0005] The compensation structure includes a first contact portion, an extension portion, a connecting portion, and a second contact portion;

[0006] The extension extends parallel to the main body of the wiring, and the extension is spaced apart from the main body of the wiring. The extension is connected to the main body of the wiring through the connecting part.

[0007] The first contact portion protrudes from the trace body toward the extension portion but does not contact the extension portion;

[0008] The second contact portion protrudes from the extension portion toward the trace body but does not contact the trace body; in the first direction, the orthographic projection of the first contact portion on the trace body is located between the orthographic projections of the second contact portion and the connection portion on the trace body.

[0009] In one possible implementation,

[0010] The compensation structure includes at least two contact groups, each contact group including a first contact and a second contact correspondingly disposed; the orthographic projection of the first contact in the same contact group on the trace body is located between the orthographic projection of the second contact and the connection portion on the trace body;

[0011] At least two of the contact portion groups are arranged sequentially along the first direction.

[0012] In one possible implementation,

[0013] The routing structure includes at least two compensation structures, each compensation structure including a first contact portion and a second contact portion respectively. The orthographic projection of the first contact portion in the same compensation structure on the routing body is located between the orthographic projection of the second contact portion and the connection portion on the routing body; at least two compensation structures are arranged along the first direction.

[0014] In one possible implementation, a first gap exists between the first contact portion and the second contact portion in any of the compensation structures, and the first gap is different in at least two of the compensation structures.

[0015] In one possible implementation, the first contact portion includes a first inclined surface that is inclined toward the second contact portion, and the second contact portion includes a second inclined surface that is inclined toward the first contact portion;

[0016] Preferably, the slopes of the first inclined plane and the second inclined plane are the same.

[0017] In one possible implementation, the routing structure further includes:

[0018] An insulating layer covering the trace body, the insulating layer including an opening exposing the extension, the thickness of the insulating layer being greater than the distance from the side of the extension away from the trace body to the trace body;

[0019] Preferably, the wiring structure further includes a protective layer located on the side of the insulation layer away from the wiring body, the protective layer covering the opening.

[0020] This application also provides a method for manufacturing a wiring structure, the method comprising:

[0021] A first metal layer is formed on a carrier layer, and the first metal layer is etched to form a trace body extending along a first direction and a first contact portion, wherein the first contact portion protrudes from the trace body toward a direction away from the carrier layer;

[0022] A sacrificial layer is formed on the side of the trace body away from the carrier layer, and a trench is formed on the sacrificial layer; the sacrificial layer covers the first contact portion and the trace body surrounding the first contact portion along the first direction; along the first direction, the sacrificial layer includes a first end and a second end, and in the first direction, the trench is closer to the second end relative to the trace body; the depth of the trench is less than the thickness of the sacrificial layer;

[0023] A second metal layer is formed on the side of the sacrificial layer away from the trace body, such that the second metal layer forms an extension covering the sacrificial layer, a second contact portion filling the trench, and a connection portion extending from the first end and the second end of the sacrificial layer to make electrical contact with the trace body;

[0024] Remove the connecting portion on one side of the second end of the sacrificial layer;

[0025] Remove the sacrificial layer.

[0026] In one possible implementation, prior to the step of removing the sacrificial layer, the method further includes:

[0027] An insulating layer is formed on the side of the trace body away from the carrier layer. The insulating layer includes an opening that exposes the extension. The thickness of the insulating layer is greater than the distance from the side of the extension away from the trace body to the trace body.

[0028] A protective layer is formed on the side of the insulation layer away from the trace body, and the protective layer covers the opening.

[0029] Another objective of this application is to provide a display panel, the display panel including pixel islands and the wiring structure provided in this application, wherein adjacent pixel islands are connected by at least one of the wiring structures.

[0030] Another object of this application is to provide an electronic device including the display panel provided in this application.

[0031] Compared with the prior art, this application has the following beneficial effects:

[0032] This application provides a wiring structure, a method for manufacturing the wiring structure, a display panel, and an electronic device. By setting a compensation structure, the compensation structure can conduct when the wiring body is stretched to a certain extent, thereby connecting in parallel with the wiring body. In this way, the increased resistance of the wiring body due to stretching can be offset, thereby maintaining the overall resistance value of the entire wiring structure and ensuring the stability of power supply or signal transmission of the wiring structure. Attached Figure Description

[0033] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1This is one of the schematic diagrams of the wiring structure provided in this embodiment;

[0035] Figure 2 This is the second schematic diagram of the wiring structure provided in this embodiment;

[0036] Figure 3 This is the third schematic diagram of the wiring structure provided in this embodiment;

[0037] Figure 4 This is the fourth schematic diagram of the wiring structure provided in this embodiment;

[0038] Figure 5 This is the fifth schematic diagram of the wiring structure provided in this embodiment;

[0039] Figure 6 This is the sixth schematic diagram of the wiring structure provided in this embodiment;

[0040] Figure 7 This is the seventh schematic diagram of the wiring structure provided in this embodiment;

[0041] Figure 8 This is the eighth schematic diagram of the wiring structure provided in this embodiment;

[0042] Figure 9 This is the ninth schematic diagram of the wiring structure provided in this embodiment;

[0043] Figure 10 This is a flowchart illustrating the manufacturing method of the wiring structure provided in this embodiment;

[0044] Figure 11 This is one of the schematic diagrams illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0045] Figure 12 This is the second schematic diagram of the manufacturing process of the wiring structure provided in this embodiment;

[0046] Figure 13 This is the third schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0047] Figure 14 This is the fourth schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0048] Figure 15 This is the fifth schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0049] Figure 16 This is the sixth schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0050] Figure 17 This is the seventh schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0051] Figure 18 This is the eighth schematic diagram illustrating the manufacturing process of the wiring structure provided in this embodiment;

[0052] Figure 19 This is the ninth schematic diagram of the manufacturing process of the wiring structure provided in this embodiment. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0054] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0055] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0056] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0057] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0058] Please refer to Figure 1 , Figure 1 The wiring structure provided in this embodiment includes a wiring body 110 and a compensation structure 120.

[0059] The trace body 110 is the main body of a metal trace primarily used for transmitting electrical energy or signals, and the trace body 110 extends along a first direction. It should be noted that, in this embodiment, the first direction is the direction in which the trace body 110 extends, and different trace bodies 110 may have different first directions due to their different placement positions.

[0060] The compensation structure 120 includes a first contact portion 121, an extension portion 123, a connecting portion 122, and a second contact portion 124. The extension portion 123 extends parallel to the trace body 110 and is spaced apart from the trace body 110. The extension portion 123 is connected to the trace body 110 via the connecting portion 122. The first contact portion 121 protrudes from the trace body 110 toward the extension portion 123 but does not contact the extension portion 123. The second contact portion 124 protrudes from the extension portion 123 toward the trace body 110 but does not contact the trace body 110. In the first direction, the orthographic projection of the first contact portion 121 on the trace body 110 lies between the orthographic projections of the second contact portion 124 and the connecting portion 122 on the trace body 110.

[0061] For example, please refer to again Figure 1 The first contact portion 121 can extend from the trace body 110 in a second direction perpendicular to the first direction. The connecting portion 122 can extend from the trace body 110 in a second direction perpendicular to the first direction, and its extension length can be greater than the extension length of the first contact portion 121. The extension portion 123 can extend from one end of the connecting portion 122 away from the trace body 110 along the first direction and beyond the first contact portion 121, so that the first contact portion 121 is located between the trace body 110 and the extension portion 123, and the first contact portion 121 does not contact the extension portion 123. The second contact portion 124 can extend from one end of the extension portion 123 away from the connecting portion 122 toward the trace body 110, that is, in the opposite direction of the second direction, and its extension length is less than the extension length of the connecting portion 122, that is, the second contact portion 124 will not extend to contact the trace body 110.

[0062] Based on the above design, please refer to Figure 2When the trace body 110 is stretched in its first extension direction, the resistance of the trace body 110 increases. During this process, since the extension portion 123 is only connected to the trace body 110 via the connecting portion 122, the extension portion 123 is not stretched along with the trace body 110. Simultaneously, during the stretching process, the trace body 110 elongates as a whole, increasing the distance between the connecting portion 122 and the first contact portion 121. This causes the first contact portion 121 and the second contact portion 124 to gradually approach each other until they contact. At this point, the entire compensation structure 120 is essentially connected in parallel with the trace body 110, thereby reducing the overall resistance of the trace structure, offsetting the increased resistance of the trace body 110 due to elongation, and ensuring the stability of power supply or signal transmission in the trace structure.

[0063] Furthermore, given that the trace body 110 possesses a certain degree of elasticity, after the tension on the trace body 110 is released, it can shorten and recover, resulting in a decrease in its resistance value. In this case, the distance between the connecting portion 122 and the first contact portion 121 can decrease as the trace body 110 shortens and recovers, thereby separating the first contact portion 121 from the second contact portion 124, breaking the conductive path of the compensation structure 120, and restoring it to its original position. Figure 1 The structure shown is such that the overall resistance of the wiring structure is not too low.

[0064] For some possible implementations, please refer to Figure 3 The compensation structure 120 includes at least two contact groups (such as...) Figure 3 (As shown in the dashed box), each contact group includes a corresponding first contact 121 and a second contact 124. Within the same contact group, the orthographic projection of the first contact 121 onto the trace body 110 lies between the orthographic projections of the second contact 124 and the connecting portion 122 onto the trace body 110. At least two contact groups are arranged sequentially along the first direction. For example, the first contact 121 and the second contact 124 in multiple contact groups are alternately spaced along the first direction. In the first direction, each second contact 124 is located on the side of a first contact 121 away from the connecting portion 122. This improves the contact effectiveness between the first contact 121 and the second contact 124, preventing poor contact between a particular first contact 121 and second contact 124 from affecting the compensation effect of the compensation structure 120.

[0065] For some possible implementations, please refer to Figure 4The routing structure may further include at least two compensation structures 120. Each compensation structure 120 includes a corresponding first contact portion 121 and a second contact portion 124. The orthographic projection of the first contact portion 121 in the same compensation structure 120 onto the routing body 110 lies between the orthographic projections of the second contact portion 124 and the connecting portion 122 onto the routing body 110. At least two compensation structures 120 are arranged along the first direction. This improves the effectiveness of the compensation structure 120 in achieving its compensation function and avoids poor contact in one compensation structure 120 affecting the compensation effect.

[0066] Furthermore, in some possible implementations, please refer to... Figure 5 In any of the compensation structures, there is a first distance W between the first contact portion 121 and the second contact portion 124, and the first distance W is different in at least two of the compensation structures 120.

[0067] Therefore, please refer to Figure 6 When the trace body 110 is stretched to a certain extent, the compensation structure 120 with the smaller first spacing W is turned on first, offsetting part of the increased resistance of the trace body 110. At this time, the compensation structure 120 with the larger first spacing W is not yet turned on.

[0068] Please refer to the following: Figure 7 As the trace body 110 continues to be stretched, its resistance continues to increase until the compensation structure 120 with a larger first spacing W is turned on, thereby offsetting the continued increase in resistance of the trace body 110.

[0069] In this way, the multiple compensation units can be turned on in stages when the trace body 110 is stretched to different lengths, thereby compensating for and offsetting the increased resistance of the trace body 110 more smoothly and improving the uniformity of the overall resistance of the trace structure when stretched to different lengths.

[0070] For some possible implementations, please refer to Figure 8 The first contact portion 121 includes a first inclined surface that slopes toward the second contact portion 124, and the second contact portion 124 includes a second inclined surface that slopes toward the first contact portion 121. Preferably, the first inclined surface and the second inclined surface have the same slope. In this way, the contact area between the first contact portion 121 and the second contact portion 124 can be increased, thereby improving the contact effectiveness of the first contact portion 121 and the second contact portion 124.

[0071] For some possible implementations, please refer to Figure 9The wiring structure further includes an insulating layer 130. The insulating layer 130 covers the wiring body 110, and the insulating layer 130 includes an opening exposing the extension 123. The thickness of the insulating layer 130 is greater than the distance from the side of the extension 123 away from the wiring body 110 to the wiring body 110.

[0072] Preferably, the wiring structure further includes a protective layer 140. The protective layer 140 is located on the side of the insulating layer 130 away from the wiring body 110 and covers the opening. In this way, the insulating layer 130 and the protective layer 140 can form a protective space to accommodate the compensation structure 120, thereby preventing other components from pressing on the extension 123, causing the extension 123 to contact the first contact portion 121 or the second contact portion 124 to contact the wiring body 110.

[0073] Please refer to Figure 10 This embodiment also provides a method for manufacturing a wiring structure. The method for manufacturing a wiring structure can be used to manufacture the wiring structure provided in this embodiment. The steps of the method for manufacturing a wiring structure are described in detail below.

[0074] In step S110, a first metal layer is formed on a carrier layer 100, and the first metal layer is etched to form a trace body 110 extending along a first direction and a first contact portion 121. The first contact portion 121 protrudes from the trace body 110 toward a direction away from the carrier layer 100.

[0075] In this embodiment, the wiring structure can be formed on a carrier layer 100. In one possible implementation, the wiring structure can be formed in a thin film transistor (TFT) array substrate, and the carrier layer 100 can be a substrate layer, buffer layer, insulating layer 130, or planarization layer of the TFT array substrate.

[0076] Please refer to Figure 11 In this embodiment, after the first metal layer is formed on the carrier layer 100, the first metal layer can be etched to form the trace body 110 and the first contact portion 121.

[0077] In step S120, a sacrificial layer 210 is formed on the side of the wiring body 110 away from the bearing layer 100, and a groove is formed on the sacrificial layer 210.

[0078] Please refer to Figure 12The sacrificial layer 210 covers the first contact portion 121 and the surrounding trace body 110 along the first direction. Along the first direction, the sacrificial layer 210 includes a first end 211 and a second end 212, and in the first direction, the trench is located relative to the trace body 110 near the second end 212. The depth of the trench is less than the thickness of the sacrificial layer 210. For example, a sacrificial layer 210 that integrally covers the trace body 110 and the first contact portion 121 can be formed first, such as... Figure 13 As shown, the sacrificial layer 210 is then etched, retaining a portion of the sacrificial layer 210 and forming the trench, as shown. Figure 12 As shown.

[0079] In step S130, a second metal layer is formed on the side of the sacrificial layer 210 away from the trace body 110, such that the second metal layer forms an extension 123 covering the sacrificial layer 210, a second contact portion 124 filling the trench, and a connection portion 122 extending from the first end 211 and the second end 212 of the sacrificial layer 210 to make electrical contact with the trace body 110.

[0080] Please refer to Figure 14 In this embodiment, the second metal layer can be formed on the sacrificial layer 210 using the same material as the first metal layer. The second metal layer filling the trench can form the second contact portion 124, the second metal layer covering the sacrificial layer 210 can form the extension portion 123, and the second metal layer extending from the first end 211 and the second end 212 of the sacrificial layer 210 to the trace body 110 can form the connection portion 122.

[0081] Step S140: Remove the connecting portion 122 on one side of the second end 212 of the sacrificial layer 210.

[0082] In this embodiment, the second metal layer can be etched to remove at least the second metal layer on the side of the second end 212 of the sacrificial layer 210, so that the extension 123 does not contact the trace body 110, leaving only the second metal layer on the side of the first end 211 of the sacrificial layer 210. Simultaneously, the second metal layer covering the first metal layer can also be removed to form a shape such as... Figure 15 The structure shown.

[0083] Step S150: Remove the sacrificial layer 210.

[0084] In this embodiment, after step S140, the sacrificial layer 210 can be removed to obtain the desired result. Figure 1 The structure shown.

[0085] It should be noted that in this embodiment, the sacrificial layer 210 and the second metal layer need to be made of different materials, and the sacrificial layer 210 and the second metal layer need to react with different etching solutions. That is, the etching solution used to etch the metal of the sacrificial layer 210 will not react with the first metal layer and the second metal layer, and the etching solution used to etch the second metal layer will not react with the sacrificial layer 210. In one example, the material of the sacrificial layer 210 can be silver or silicon carbide, and the materials of the first metal layer and the second metal layer can be copper or aluminum.

[0086] In one possible implementation, the method for manufacturing the wiring structure may further include step S210 before step S150.

[0087] In step S210, an insulating layer 130 is formed on the side of the trace body 110 away from the carrier layer 100. The insulating layer 130 includes an opening that exposes the extension 123. The thickness of the insulating layer 130 is greater than the distance from the side of the extension 123 away from the trace body 110 to the trace body 110.

[0088] In this embodiment, please refer to Figure 16 The insulating layer 130 can be formed by using a mask and vapor deposition. The insulating layer 130 can cover part of the trace body 110 but expose the compensation structure 120.

[0089] After step S210, step S150 can be executed to remove the sacrificial layer 210, obtaining the desired result. Figure 17 The structure shown.

[0090] After step S150, the method for manufacturing the wiring structure may further include step S220.

[0091] In step S220, a protective layer 140 is formed on the side of the insulating layer 130 away from the trace body 110, and the protective layer 140 covers the opening.

[0092] Please refer to Figure 18 After removing the sacrificial layer 210, a protective layer 140 can be formed on the side of the insulating layer 130 away from the trace body 110, thereby preventing other components from pressing on the extension 123, causing the extension 123 to contact the first contact portion 121 or the second contact portion 124 to contact the trace body 110.

[0093] Based on the same inventive concept, this embodiment also provides a display panel, which includes a pixel island 20 and the wiring structure 10 provided in this embodiment. Please refer to... Figure 19 The pixel island 20 may include one or more sub-pixels 21, and adjacent pixel islands 20 are connected by at least one of the wiring structures 10. Thus, when adjacent pixel islands 20 are stretched and the spacing increases, the compensation structure 120 in the wiring structure 10 can offset the increased resistance of the wiring body 110.

[0094] This embodiment also provides an electronic device, which includes the display panel provided in this embodiment.

[0095] In summary, the wiring structure, the manufacturing method of the wiring structure, the display panel, and the electronic device provided in this application embodiment, by setting a compensation structure, can conduct when the wiring body is stretched to a certain extent, thereby connecting in parallel with the wiring body. In this way, the increased resistance of the wiring body due to stretching can be offset, thereby maintaining the overall resistance value of the entire wiring structure and ensuring the stability of power supply or signal transmission of the wiring structure.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes pixel islands and wiring structures, with adjacent pixel islands connected by at least one of the wiring structures; the wiring structure includes: A wiring body, the wiring body extending along a first direction; The compensation structure includes a first contact portion, an extension portion, a connecting portion, and a second contact portion; The extension extends parallel to the main body of the wiring, and the extension is spaced apart from the main body of the wiring. The extension is connected to the main body of the wiring through the connecting part. The first contact portion protrudes from the trace body toward the extension portion but does not contact the extension portion; The second contact portion protrudes from the extension portion toward the trace body but does not contact the trace body; in the first direction, the orthographic projection of the first contact portion on the trace body is located between the orthographic projections of the second contact portion and the connection portion on the trace body.

2. The display panel according to claim 1, characterized in that, The compensation structure includes at least two contact portion groups, each contact portion group including a first contact portion and a second contact portion respectively disposed thereon; in the same contact portion group, the orthographic projection of the first contact portion on the trace body is located between the orthographic projection of the second contact portion and the orthographic projection of the connecting portion on the trace body; At least two of the contact portion groups are arranged sequentially along the first direction.

3. The display panel according to claim 1, characterized in that, The routing structure includes at least two compensation structures, each compensation structure including a first contact portion and a second contact portion respectively. The orthographic projection of the first contact portion in the same compensation structure on the routing body is located between the orthographic projection of the second contact portion and the connection portion on the routing body; at least two compensation structures are arranged along the first direction.

4. The display panel according to claim 3, characterized in that, In any one of the compensation structures, there is a first distance between the first contact portion and the second contact portion, and the first distance is different in at least two of the compensation structures.

5. The display panel according to claim 1, characterized in that, The first contact portion includes a first inclined surface that is inclined toward the second contact portion, and the second contact portion includes a second inclined surface that is inclined toward the first contact portion.

6. The display panel according to claim 5, characterized in that, The first inclined plane and the second inclined plane have the same slope.

7. The display panel according to claim 1, characterized in that, The wiring structure also includes: An insulating layer covering the trace body, the insulating layer including an opening exposing the extension, the thickness of the insulating layer being greater than the distance from the side of the extension away from the trace body to the trace body.

8. The display panel according to claim 7, characterized in that, The wiring structure also includes a protective layer located on the side of the insulation layer away from the wiring body, the protective layer covering the opening.

9. A method for manufacturing a display panel, characterized in that, The method includes: A first metal layer is formed on a carrier layer, and the first metal layer is etched to form a trace body extending along a first direction and a first contact portion, wherein the first contact portion protrudes from the trace body toward a direction away from the carrier layer; A sacrificial layer is formed on the side of the trace body away from the carrier layer, and a trench is formed on the sacrificial layer; the sacrificial layer covers the first contact portion and the trace body surrounding the first contact portion along the first direction; along the first direction, the sacrificial layer includes a first end and a second end, and in the first direction, the trench is closer to the second end relative to the trace body; the depth of the trench is less than the thickness of the sacrificial layer; A second metal layer is formed on the side of the sacrificial layer away from the trace body, such that the second metal layer forms an extension covering the sacrificial layer, a second contact portion filling the trench, and a connection portion extending from the first end and the second end of the sacrificial layer to make electrical contact with the trace body; Remove the connecting portion on one side of the second end of the sacrificial layer; Remove the sacrificial layer; The method further includes: Create pixel islands, with adjacent pixel islands connected by at least one wiring structure.

10. The method according to claim 9, characterized in that, Prior to the step of removing the sacrificial layer, the method further includes: An insulating layer is formed on the side of the trace body away from the carrier layer. The insulating layer includes an opening that exposes the extension. The thickness of the insulating layer is greater than the distance from the side of the extension away from the trace body to the trace body. A protective layer is formed on the side of the insulation layer away from the trace body, and the protective layer covers the opening.

11. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1-8.

Citation Information

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