Electronic atomization device, atomizer and heating component thereof

Abstract

The present application discloses an electronic atomization device, an atomizer and a heating component thereof. The heating component comprises: a substrate, the substrate is provided with a microgroove portion, the microgroove portion is provided with a plurality of liquid-collecting microgrooves; a heating element, the heating element is arranged in the microgroove portion, the liquid-collecting microgroove is used to lock the liquid to form a liquid film on the surface of the heating element; wherein the microgroove portion is at least partially higher than the heating element. By providing a microgroove portion on the substrate, the microgroove portion is provided with a plurality of liquid-collecting microgrooves, so as to effectively increase the surface area of ​​the atomization zone in the substrate, and gather more liquid matrix by capillary force and surface tension, the microgroove portion is at least partially higher than the heating element, so as to increase the thickness of the liquid film on the substrate. The heating component provided in the present application can increase the thickness of the liquid film on the substrate, so as to increase the liquid supply to the heating element, avoid dry burning during the atomization process, and increase the content of large droplets in the aerosol generated by atomization, thereby improving the taste of the inhalable atomized gas.

Description

Technical Field

[0001] The present application relates to the field of atomization technology, and in particular to an electronic atomization device, an atomizer and a heating component thereof. Background Art

[0002] Electronic atomization device is also known as aerosol generating device or electronic atomizer. Electronic atomization device is mainly composed of atomizer and power supply. Atomizer is the core device for generating atomized gas in electronic atomization device. Its atomization effect determines the quality and taste of atomized gas. The existing ceramic atomization core adopts the method of porous ceramic plus heating film. The heating film is formed on the surface of porous ceramic by screen printing and other processes.

[0003] During the atomization process, the liquid in the liquid storage device is adsorbed on the porous ceramic through the porous ceramic, and then heated by the heating film on the surface to be atomized. However, due to the limited storage capacity of liquid near the heating film, the electronic atomization device with this structure is prone to insufficient liquid supply in the second half of the atomization process, resulting in dry burning and a burnt smell.

[0004] Therefore, during the atomization process, increasing the height of the liquid film on the atomization surface and ensuring sufficient liquid supply have positive significance for reducing the burnt smell during the suction process of the electronic atomization device.

[0005] Relevant studies have shown that the perception of fragrance and sweetness in electronic atomization devices mainly comes from people's taste perception. The perception of taste is mainly positively correlated with the number and proportion of large droplets in the aerosol. The formation of large droplets is highly correlated with the liquid film. When the oil supply is sufficient, large droplets are easy to form; when the oil supply is insufficient, small droplets are more likely to form. Therefore, under the premise of ensuring that the atomization amount remains unchanged, increasing the number of large aerosol droplets generated during the atomization process of the electronic atomization device has obvious positive significance for improving taste-related indicators such as the fragrance and sweetness of the electronic atomization device. Summary of the invention

[0006] The present application mainly provides an electronic atomization device, an atomizer and a heating component thereof to solve the problem of dry burning caused by insufficient liquid supply during the atomization process.

[0007] In order to solve the above technical problems, a technical solution adopted by the present application is to provide a heating component. The heating component comprises: a substrate, the substrate is provided with a microgroove portion, the microgroove portion is provided with a plurality of liquid collecting microgrooves; a heating element, the heating element is arranged on the microgroove portion, the liquid collecting microgroove is used to lock the liquid to form a liquid film on the surface of the heating element; wherein the microgroove portion is at least partially higher than the heating element.

[0008] In some embodiments, the microgroove portion is further provided with a sinking groove, and the sinking groove spans across the plurality of liquid collecting microgrooves; and the heating element is arranged on the bottom wall of the sinking groove.

[0009] In some embodiments, the sink has a notch formed on the surface of the microgroove portion, the heating element is disposed on the bottom wall of the sink through the notch, and the surface of the heating element away from the bottom wall of the sink is lower than the notch of the sink.

[0010] In some embodiments, the distance between the surface of the heating element away from the bottom wall of the sink and the notch of the sink is in the range of 0.1 mm to 0.2 mm.

[0011] In some embodiments, at least part of the plurality of liquid collecting microgrooves are in communication with the sedimentation tank.

[0012] In some embodiments, the depth of the sink is in the range of 0.2 mm to 0.3 mm.

[0013] In some embodiments, the depth of the liquid-collecting microgrooves is less than or equal to the depth of the sedimentation grooves.

[0014] In some embodiments, the depth of the liquid-collecting microgrooves is in the range of 0.15 mm to 0.3 mm.

[0015] In some embodiments, the plurality of liquid-collecting microgrooves are arranged in an array, the width of the liquid-collecting microgrooves gradually decreases with increasing groove depth, and the spacing between the liquid-collecting microgrooves is in the range of 0.2 mm to 0.5 mm.

[0016] In some embodiments, the substrate is a porous substrate, the heating element is a heating film, and the heating film is mounted on the bottom wall of the sink by bonding with a resistor paste.

[0017] In some embodiments, the substrate is further provided with an electrode groove and an electrode disposed in the electrode groove, the electrode groove is disposed at the end of the sink, and the electrode groove is communicated with the sink, and the electrode is electrically connected to the heating element.

[0018] In some embodiments, two electrode grooves are provided on the substrate, and the two electrode grooves are respectively arranged at the two ends of the sink, and the bottom surface of the sink is flush with the bottom surface of the electrode groove, and the two electrodes are respectively arranged in the corresponding electrode grooves, one of the two electrodes is electrically connected to one end of the heating element, and the other is electrically connected to the other end of the heating element.

[0019] In some embodiments, the sink includes a first connecting segment, a first arc segment, a second arc segment, and a second connecting segment connected in sequence, the opening of the first arc segment and the opening of the second arc segment are in opposite directions, the first connecting segment is connected to one of the electrode slots, and the second connecting segment is connected to another of the electrode slots.

[0020] In some embodiments, the sink further includes a straight line segment, the first arc segment and the second arc segment are connected by the straight line segment, and the first connecting segment, the straight line segment and the second connecting segment are sequentially arranged in parallel.

[0021] In some embodiments, the substrate has a surface, and at least a portion of the microgrooves protrude from the surface; or

[0022] The microgrooves are flush with the surface; or

[0023] The micro groove portion is disposed sunken relative to the surface.

[0024] In order to solve the above technical problem, another technical solution adopted by the present application is to provide an atomizer. The atomizer includes the heating component as described above.

[0025] To solve the above technical problems, another technical solution adopted by the present application is to provide an electronic atomization device. The electronic atomization device comprises a power supply and the atomizer as described above, wherein the power supply is connected to the atomizer and supplies power to the atomizer.

[0026] Different from the prior art, the present application discloses an electronic atomization device, an atomizer and a heating component thereof. By providing a microgroove portion on the substrate, and the microgroove portion is provided with a plurality of liquid-collecting microgrooves, the surface area of ​​the atomization zone in the substrate can be effectively increased, so that more liquid matrix can be gathered in the atomization zone by capillary force and surface tension, thereby increasing the thickness of the liquid film on one side of the microgroove portion, and the heating element is arranged in the microgroove portion, and the microgroove portion is at least partially higher than the heating element, so that the heating element can be covered by the liquid film, and the liquid supply to the heating element can be increased, so that the heating element does not contact the air during atomization, avoiding the phenomenon of dry burning during the atomization process, and because the heating element can be covered by the liquid film, the energy utilization rate during the atomization process can also be improved, so the heating component provided by the present application can increase the liquid supply to the heating element installed thereon, so as to avoid the dry burning condition during the atomization process, and can increase the content of large droplets in the aerosol generated by atomization, thereby improving the taste of the inhalable flavor atomized gas. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0028] Figure 1 It is a structural schematic diagram of an embodiment of a heating component provided by the present application;

[0029] Figure 2 yes Figure 1 A schematic diagram of the axial structure of the base body in the heat generating component shown;

[0030] Figure 3 yes Figure 2 A schematic diagram of the top view of the substrate shown;

[0031] Figure 4 yes Figure 3 The schematic diagram of the cross-section structure of the substrate along the AA viewing direction is shown;

[0032] Figure 5 This is a comparison chart of the liquid film height on the traditional and various sunken heating components;

[0033] Figure 6 This is a comparison of the large droplet content in the aerosols produced by the traditional and sinking heating components;

[0034] Figure 7 This is a comparison of the taste of aerosols produced by traditional and sinking heating components;

[0035] Figure 8 It is a structural schematic diagram of an embodiment of an atomizer provided by the present application;

[0036] Fig. 9 yes Figure 8 A schematic cross-sectional view of the atomizer shown;

[0037] Fig.10 yes Fig. 9 A partial enlarged view of area A in the atomizer shown;

[0038] Fig.11 It is a structural schematic diagram of an embodiment of the electronic atomization device provided in the present application. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0040] The terms "first", "second", "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0041] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0042] The present application provides a heating component 100, referring to Figure 1 to Figure 2 , Figure 1 is a structural schematic diagram of an embodiment of a heating component provided by the present application, Figure 2 yes Figure 1 Schematic diagram of the axial structure of the substrate in the heating component shown.

[0043] The heating component 100 includes a substrate 10 and a heating element 20 . The heating element 20 is disposed on the substrate 10 . The heating element 20 is used to generate heat to atomize the liquid matrix gathered on one side of the substrate 10 .

[0044] The substrate 10 may be a porous substrate, which can introduce a liquid matrix such as a liquid or a medicine containing nicotine or flavoring ingredients from one side of itself to the other side. The porous substrate may be a porous ceramic substrate or a porous glass substrate. In the present embodiment, the substrate 10 is a porous ceramic substrate. The porous ceramic material is generally a ceramic material sintered at high temperature by components such as aggregates, binders and pore-forming agents. The porous ceramic material has a large number of pore structures that are interconnected with each other and with the surface of the material, so that the liquid matrix can be introduced from the liquid absorption surface to the atomization surface. Since the porous ceramic material has excellent properties such as high porosity, stable chemical properties, large specific surface area, low volume density, low thermal conductivity, and high temperature and corrosion resistance, it has many applications in the fields of metallurgy, biology, energy, environmental protection, etc.

[0045] The substrate 10 may also be a dense body, which is not used for guiding liquid. The liquid matrix is ​​sprayed toward one side of the substrate 10 through a nozzle, and the heating element 20 may also atomize the liquid matrix. The substrate 10 may be a glass substrate or a ceramic substrate.

[0046] In this embodiment, the substrate 10 is a porous substrate having a liquid absorption surface and an atomization surface. The porous substrate is used to introduce a liquid matrix such as a liquid or a liquid medicine containing nicotine or flavoring ingredients from the liquid absorption surface to the atomization surface, and the heating element 20 is arranged on the atomization surface of the porous substrate. Among them, a groove can also be arranged on the side where the liquid absorption surface is located to increase the liquid absorption area and improve the liquid absorption efficiency. Alternatively, the liquid absorption surface can also be a plane, and this application does not make specific restrictions on this.

[0047] The heating element 20 may be a heating film or a heating resistor, etc., and the present application does not limit its specific material.

[0048] In the present application, the substrate 10 is provided with a microgroove portion 12, the microgroove portion 12 is provided with a plurality of liquid collecting microgrooves 122, and the heating element 20 is disposed in the microgroove portion 12. The liquid collecting microgroove 122 is used to lock the liquid on the surface of the heating element 20 to form a liquid film, and the microgroove portion 12 is at least partially higher than the heating element 20.

[0049] Optionally, see Figure 1 The substrate 10 has a surface 11, and at least part of the microgrooves 12 protrude from the surface 11. The microgrooves 12 may partially protrude from the surface 11, so that the liquid collecting microgrooves 122 may be partially located below the surface 11; the microgrooves 12 may also completely protrude from the surface 11, that is, the bottom surface of the microgrooves 12 is coplanar with the surface 11.

[0050] Optionally, see Figure 1 The microgroove portion 12 is sunken relative to the surface 11 , so that a sinking groove can be formed above the microgroove portion 12 . The sinking groove can be used to gather liquid and prevent the gathered liquid matrix from flowing around, which is beneficial to increasing the liquid film thickness on the surface of the heating element 20 .

[0051] In this embodiment, Figure 1 As shown, the micro groove portion 12 is flush with the surface 11 , that is, the top surface of the micro groove portion 12 is flush with the surface 11 .

[0052] In this embodiment, the microgroove portion 12 is further provided with a sinking groove 124, which spans across multiple liquid collecting microgrooves 122. The sinking groove 124 is configured to install the heating element 20. In other words, the heating element 20 is arranged on the bottom wall of the sinking groove 124, and the microgroove portion 12 is at least partially higher than the heating element 20.

[0053] The heating element 20 has a first surface and a second surface opposite to each other. The first surface faces the bottom wall of the groove 124 and is used to be fixed to the bottom wall of the groove 124 . The second surface is disposed opposite to the first surface, that is, the second surface is away from the bottom wall of the groove 124 .

[0054] In this embodiment, the sink 124 has a notch formed on the surface of the micro-groove portion 12, and the heating element 20 is arranged on the bottom wall of the sink 124 through the notch, that is, the heating element 20 is arranged in the sink 124, and the second surface of the heating element 20 is lower than the notch of the sink 124, so that the liquid film formed by the liquid matrix on the micro-groove portion 12 covers the entire heating element 20, thereby ensuring that the second surface of the heating element 20 does not contact the air when working, but is covered by the liquid film, and the thickness of the liquid film on one side of the second surface can be relatively increased to avoid dry burning during the atomization process.

[0055] Optionally, the heating element 20 is disposed in the sink 124 , and the second surface of the heating element 20 can also be flush with the notch of the sink 124 so that the heating element 20 does not protrude from the top surface of the micro-groove portion 12 , and the liquid film on the micro-groove portion 12 can also cover the entire heating element 20 .

[0056] Optionally, the heating element 20 may also partially protrude from the sink groove 124, that is, the second surface of the heating element 20 is higher than the notch of the sink groove 124. Compared with the solution of directly fixing the heating element 20 to the surface of the atomizing surface 13, by partially accommodating the heating element 20 in the sink groove 124, the distance between the second surface and the top surface of the micro-groove portion 12 can be reduced, so that the liquid film on the micro-groove portion 12 can cover the second surface, thereby avoiding the dry burning phenomenon caused by the heating element 20 contacting the air when working.

[0057] In other embodiments, a through groove is provided on the micro-groove portion 12 , and the through groove of the micro-groove portion 12 cooperates with the surface 11 of the substrate 10 to form a recessed groove for accommodating the heating element 20 . The heating element 20 is arranged on the surface 11 , and the micro-groove portion 12 is at least partially higher than the heating element 20 .

[0058] In this embodiment, the heating element 20 is a heating film, which is installed in the sink 124 by bonding with a resistor paste. The resistor paste has the characteristics of good fluidity, strong adhesion, high leveling, and strong film-base bonding, so that the heating film can be firmly bonded to the bottom wall of the sink 124, avoiding the inability to use the current screen printing method to form the heating film due to the design of the sunken sink 124 of the base 10.

[0059] The depth of the groove 124 is in the range of 0.2 mm to 0.3 mm. For example, the depth of the groove 124 may be 0.2 mm, 0.25 mm, or 0.3 mm.

[0060] The thickness of the heating element 20 is approximately 0.1 mm, wherein the thickness of the heating element 20 refers to the dimension of the heating element 20 in the depth direction of the groove 124; the heating element 20 is accommodated in the groove 124, and the distance between the second surface of the heating element 20 and the notch of the groove 124 is in the range of 0.1 mm to 0.2 mm, that is, the second surface is located in the groove 124 and the distance between the second surface and the notch of the groove 124 can be 0.1 mm, 0.15 mm or 0.2 mm, etc.

[0061] Through experimental verification and simulation analysis, when the groove depth of the sinking groove 124 is in the range of 0.2 mm to 0.3 mm, more specifically, when the distance that the second surface sinks relative to the top surface of the micro-groove portion 12 is in the range of 0.1 mm to 0.2 mm, the liquid matrix stored on one side of the second surface can just meet the atomization amount during each puff atomization.

[0062] When the groove depth of the sink groove 124 exceeds the upper limit of 0.3 mm, or the distance that the second surface sinks relative to the top surface of the micro-groove portion 12 exceeds 0.2 mm, the liquid film on one side of the second surface will be too thick, resulting in a slow rate at which the atomized gas generated by atomization passes through the liquid film, and further resulting in isolation between the second surface and the liquid matrix, thereby reducing the amount of atomization generated by atomization and slowing down the atomization rate. If the groove depth of the sink groove 124 is less than the lower limit of 0.2 mm, or the distance that the second surface sinks relative to the top surface of the micro-groove portion 12 is less than 0.1 mm, there is a risk of dry burning. Therefore, after experimental verification and simulation analysis, when the groove depth of the sinking groove 124 is in the range of 0.2mm to 0.3mm and the distance that the second surface sinks relative to the top surface of the micro-groove portion 12 is in the range of 0.1mm to 0.2mm, the dry burning phenomenon caused by insufficient liquid supply can be effectively avoided, and the thickness of the liquid film can be significantly increased, thereby ensuring sufficient liquid supply and significantly increasing the proportion of large droplets in the aerosol generated by atomization, which has obvious positive significance for improving the flavor and sweetness of the atomized gas.

[0063] See also Figures 2 to 4 ,in Figure 3 yes Figure 2 The schematic diagram of the top view of the substrate is shown in FIG. Figure 4 yes Figure 3 The cross-sectional structure schematic diagram of the substrate along the AA viewing direction is shown.

[0064] The microgrooves 122 are also provided on the microgrooves 12 . The microgrooves 122 are distributed around the troughs 124 . The extension path of the troughs 124 at least passes through a portion of the microgrooves 122 . At least a portion of the microgrooves 122 are connected to the troughs 124 .

[0065] Optionally, a plurality of liquid collecting microgrooves 122 are arranged in a ring shape on the microgrooved portion 12 , and the extension path of the sedimentation groove 124 can pass through part of the liquid collecting microgrooves 122 and communicate with part of the liquid collecting microgrooves 122 , so that the liquid matrix enriched in the liquid collecting microgrooves 122 can be supplied to the heating element 20 .

[0066] In this embodiment, a plurality of liquid collecting microgrooves 122 are arranged in parallel and at intervals and have the same length, and both ends of the sedimentation groove 124 are respectively located on both sides of the plurality of liquid collecting microgrooves 122 in an extension direction perpendicular to the arrangement of the plurality of liquid collecting microgrooves 122 , and an extension path of the sedimentation groove 124 passes through the plurality of liquid collecting microgrooves 122 , so that each liquid collecting microgrooves 122 is connected to the sedimentation groove 124 .

[0067] By arranging a plurality of liquid collecting microgrooves 122 in the microgroove portion 12, the surface area of ​​the atomization zone in the base 10 is increased, thereby increasing the reserve amount of the liquid matrix in the atomization zone, thereby alleviating or even avoiding the dry burning phenomenon caused by insufficient liquid supply in the second half of the working process of the heating component 100, and avoiding the generation of burnt smell during the second half of atomization.

[0068] For example, during the atomization process, the storage amount of the liquid matrix on the liquid absorption surface side of the porous matrix gradually decreases, which may lead to insufficient liquid supply on the atomization surface side in the second half of the atomization. By providing a microgroove portion 12, and a plurality of liquid collecting microgrooves 122 are provided on the microgroove portion 12, the liquid matrix can be stored in the liquid collecting microgrooves 122, and the liquid collecting microgrooves 122 are also connected to the sedimentation tank 124. The liquid matrix stored in the liquid collecting microgrooves 122 can be replenished to the sedimentation tank 124 in time for the heating element 20 to be atomized, thereby avoiding dry burning and the generation of burnt smell.

[0069] Specifically, the liquid storage method of the atomization zone in the substrate 10 mainly relies on capillary force and surface tension, and by providing a microgroove portion 12, and a plurality of liquid collecting microgrooves 122 are provided on the microgroove portion 12, so that the surface area of ​​the atomization zone in the substrate 10 includes the top surface of the microgroove portion 12 and the surface area of ​​the liquid collecting microgroove 122, the surface area of ​​the atomization zone can be relatively increased by 30% to 60%, so that more liquid can be collected by capillary force and surface tension, which is beneficial to increase the liquid film thickness on one side of the top surface of the microgroove portion 12, and further by improving By changing the groove depth and groove width of the liquid-collecting microgroove 122, the liquid matrix can be enriched in the liquid-collecting microgroove 122, and the storage capacity of the liquid matrix in the atomization area can be further increased, which can increase the storage capacity of the liquid matrix in the atomization area by 30% to 60%, thereby avoiding dry burning and burnt smell caused by insufficient liquid supply in the second half of atomization. In addition, by changing the groove depth and groove width of the liquid-collecting microgroove 122, different amounts of liquid matrix can be stored, thereby satisfying the selection of different types of liquid matrix and different atomization powers to avoid dry burning and burnt smell.

[0070] like Figure 4 As shown, the depth of the liquid collecting microgroove 122 is less than or equal to the depth of the sinking groove 124, so as to reduce the difficulty of processing the liquid collecting microgroove 122 and the sinking groove 124, and also help to reduce the residual amount of liquid matrix in the liquid collecting microgroove 122, so that the liquid matrix can be fully atomized.

[0071] The depth of the liquid collecting microgroove 122 is in the range of 0.15 mm to 0.3 mm. For example, the depth of the liquid collecting microgroove 122 may be 0.15 mm, 0.2 mm, 0.25 mm or 0.3 mm.

[0072] In this embodiment, the depth of the liquid gathering microgroove 122 is equal to the depth of the sedimentation groove 124, and the multiple liquid gathering microgrooves 122 are arranged in an array. The width of the liquid gathering microgroove 122 gradually decreases with the increase of the groove depth, and the width of the groove mouth of the liquid gathering microgroove 122 is in the range of 0.2mm to 0.6mm, and the width can be 0.2mm, 0.3mm or 0.6mm. The spacing between the liquid gathering microgrooves 122 is in the range of 0.2mm to 0.5mm, and the spacing can be 0.2mm, 0.3mm or 0.5mm.

[0073] Optionally, the cross-section of the liquid gathering microgroove 122 can be V-shaped, arc-shaped or U-shaped, so that the groove width of the liquid gathering microgroove 122 gradually decreases with the increase of the groove depth, which is beneficial to increase the strength of the matrix between the liquid gathering microgrooves 122 and avoid the matrix between the liquid gathering microgrooves 122 being easily damaged due to insufficient strength.

[0074] In this embodiment, a plurality of liquid collecting microgrooves 122 are evenly arranged along the length direction of the substrate 10, and the spacing between the liquid collecting microgrooves 122 is in the range of 0.2 mm to 0.5 mm, so that a larger number of liquid collecting microgrooves 122 can be distributed on the microgroove portion 12, the strength of the substrate between the liquid collecting microgrooves 122 is sufficient, and the storage capacity of the liquid matrix in the atomization area can be increased.

[0075] The plurality of liquid collecting microgrooves 122 may also be arranged obliquely along the length direction of the substrate 10; or the plurality of liquid collecting microgrooves 122 may be arranged in multiple rows, and the liquid collecting microgrooves 122 in the same row are interconnected; or the liquid collecting microgrooves 122 may also be interconnected, and the present application does not impose any specific limitation on this.

[0076] The heating component 100 further includes two electrodes 30 . The two electrodes 30 can be disposed on the surface 11 of the substrate 10 . Two ends of the heating element 20 are respectively connected to one electrode 30 .

[0077] In this embodiment, the substrate 10 is further provided with an electrode groove 134, which is disposed at the end of the sink 124 and is communicated with the sink 124. By providing the electrode groove 134 to install the electrode 30, the electrode 30 is also sunk accordingly, and the electrode groove 134 is communicated with the sink 124, so that the heating element 20 and the electrode 30 can be electrically connected, reducing or even avoiding the connection difficulty caused by the height difference when the heating element 20 and the electrode 30 are connected.

[0078] Generally speaking, the heating element 20 is a heating film, etc. For example, the heating element 20 is installed in the groove 124, and the electrode 30 is installed on the surface 11. Because there is a height difference between the bottom wall of the groove 124 and the surface 11, when making the heating element 20, the connection between the heating element 20 and the electrode 30 is difficult and there is a risk of breakage at the connection. By providing the electrode groove 134 to reduce or even eliminate the height difference, the difficulty of connecting the heating element 20 and the electrode 30 can be simplified, and the risk of breakage at the connection can be eliminated.

[0079] In this embodiment, two electrode grooves 134 are provided on the surface 11, and the two electrode grooves 134 are respectively provided at the two ends of the sink 124, and the bottom wall of the sink 124 is flush with the bottom wall of the electrode groove 134, so that the heating element 20 is connected to the electrode 30 located in the electrode groove 134. The two electrodes 30 are respectively provided in the corresponding electrode grooves 134, one of the two electrodes 30 is electrically connected to one end of the heating element 20, and the other is electrically connected to the other end of the heating element 20.

[0080] In other embodiments, an electrode groove 134 is provided on the atomizing surface 13, and two electrodes 30 are installed in the electrode groove 134 and are insulated from each other, while the heating element 20 is rotatably arranged in the sink 124, and the two ends of the heating element 20 are respectively connected to an electrode 30.

[0081] In this embodiment, Figure 3 As shown, the sink 124 includes a first connecting segment 1241, a first arc segment 1242, a second arc segment 1244 and a second connecting segment 1245 connected in sequence, the opening of the first arc segment 1242 and the opening of the second arc segment 1244 are in opposite directions, the opening of the first arc segment 1242 and the opening of the second arc segment 1244 are oriented towards different electrode grooves 134, the first connecting segment 1241 is connected to one electrode groove 134, and the second connecting segment 1245 is connected to another electrode groove 134.

[0082] The trough 124 also includes a straight segment 1243, the first arc segment 1242 and the second arc segment 1244 are connected by the straight segment 1243, and the first connecting segment 1241, the straight segment 1243 and the second connecting segment 1245 are arranged in parallel in sequence, so that the first connecting segment 1241, the straight segment 1243 and the second connecting segment 1245 can pass through the same part of the liquid collecting microgroove 122 multiple times, so as to be more conducive to guiding the stored liquid matrix into the trough 124.

[0083] The first connecting segment 1241, the straight segment 1243 and the second connecting segment 1245 are arranged in parallel and are evenly distributed on the top surface of the micro-groove portion 12, so that the heating element 20 can be more efficiently and reasonably atomized in the liquid matrix when it is arranged in the sink 124. The opening of the first arc segment 1242 is opposite to the opening of the second arc segment 1244, so that it occupies the middle area of ​​the atomization surface 13 as much as possible, thereby improving the atomization efficiency of the middle area when the heating element 20 is installed thereon.

[0084] In other embodiments, the sink 124 may not include the straight segment 1243, and the first arc segment 1242 and the second arc segment 1244 are directly connected. Alternatively, the first connecting segment 1241 and the second connecting segment 1245 may also be arc segments, which is not specifically limited in the present application.

[0085] Various data are compared between the conventional heating component and the sinking heating component 100 provided in the present application. In the conventional heating component, the atomization surface of the porous substrate is not provided with sinking grooves and liquid guiding micro grooves, and the heating element is provided on the atomization surface.

[0086] See also Figure 5 , Figure 5 This is a comparison of the height of the liquid film on the traditional and sunken heating components. Among them, the height difference of the heating element relative to the atomization surface is the height difference of its second surface relative to the atomization surface. In the traditional heating component, the first surface of the heating element is set on the atomization surface, and its height is usually 0.1mm. The measured thickness of the liquid film is about 0.05mm, that is, the thickness of the liquid film is about half of the height of the heating element.

[0087] The sinking heating component 100 provided in the present application can achieve different height differences of the second surface of the heating element 20 relative to the atomizing surface 13 by adjusting the sinking groove depth of the sinking groove 124 and the height of the heating element 20 through the process. Among them, when the groove depth of the sinking groove 124 is 0.1mm, the second surface of the heating element is flush with the atomizing surface 13, and the liquid film thickness is 0.08mm; when the groove depth of the sinking groove 124 is 0.15mm, the height difference between the second surface and the atomizing surface 13 is 0.05mm, and the liquid film thickness is 0.12mm; when the groove depth of the sinking groove 124 is 0.2mm, the height difference between the second surface and the atomizing surface 13 is 0.1mm, and the liquid film thickness is 0.15mm; when the groove depth of the sinking groove 124 is 0.3mm, the height difference between the second surface and the atomizing surface 13 is 0.2mm, and the liquid film thickness is 0.23mm. It can be seen that the sinking heating component 100 provided in the present application can significantly improve the thickness of the liquid film.

[0088] Specifically, increasing the height difference between the second surface of the heating element 20 and the atomizing surface 13 is equivalent to increasing the space available for the liquid matrix to climb and store by capillary action, thereby increasing the thickness of the liquid film.

[0089] See also Figure 6 , Figure 6 It is a comparison chart of the large droplet content in the aerosol generated by the traditional heating component and the sinking heating component 100. The large droplet content in the aerosol generated by the traditional heating component and the large droplet content in the aerosol generated by the sinking heating component 100 are detected under the same working conditions; the groove depth of the sinking groove 124 in the heating component 100 is 0.3mm, and the height difference between the heating element 20 and the atomizing surface 13 is 0.2mm.

[0090] like Figure 6 As shown, the content of large droplets in the aerosol generated by the conventional heating component is 0.13 mg / puff, while the content of large droplets in the aerosol generated by the sinking heating component 100 provided in the present application is 0.45 mg / puff. Compared with the conventional heating component, the content of large droplets in the aerosol generated by the sinking heating component 100 is increased by 3.4 times. It can be seen that the significant increase in the thickness of the liquid film ensures sufficient liquid supply to the heating element 20 and makes it easier to form large droplets, thereby improving the fragrance and sweetness of the generated aerosol.

[0091] Further, see Figure 7 , Figure 7 This is a comparison of the taste of aerosols produced by traditional and sinking heating components. Figure 7 is based on Figure 6The taste comparison diagram of the aerosol produced by the traditional and sinking heating components 100 in FIG. It can be seen that the aroma layering, coordination, aroma restoration and sweetness of the sinking heating component 100 are significantly improved compared with the traditional heating component.

[0092] Based on this, the present application also provides an atomizer 200, see Figures 8 to 10 , Figure 8 It is a structural schematic diagram of an embodiment of an atomizer provided by the present application; Fig. 9 yes Figure 8 A schematic cross-sectional view of the atomizer shown; Fig.10 yes Fig. 9 A partial enlarged view of area A in the atomizer shown.

[0093] The atomizer 200 includes a shell 210, an atomizer seat 220, a base 230 and the heating component 100 as described above, wherein the shell 210 is provided with a liquid storage chamber 212, the atomizer seat 220 is embedded in the shell 210 from the open end of the shell 210, the atomizer seat 220 is provided with an atomizer chamber 221, the heating component 100 is arranged in the atomizer chamber 221, and the atomizer seat 220 and the base 230 cooperate to fix the heating component 100, and the base 230 is also sealed on the open end of the shell 210.

[0094] A vent 214 is provided inside the shell 210, and the atomizer seat 220 is provided with a liquid inlet hole 223 and an atomized gas outlet 224. The liquid matrix stored in the liquid storage chamber 212 is guided to the liquid absorption surface 11 of the porous matrix 10 through the liquid inlet hole 223. The porous matrix 10 guides the liquid matrix in the liquid storage chamber 212 from the liquid absorption surface 11 to the atomization surface 13. The heating element 20 atomizes the liquid matrix in the atomization chamber 221 to form atomized gas. The electrode 30 is used to receive power supply, the atomized gas outlet 224 is connected to the atomization chamber 221, and the vent 214 is connected to the atomized gas outlet 224 to guide the atomized gas to the user's mouth through the vent 214.

[0095] Based on this, the present application also provides an electronic atomization device 300. Fig.11 , Fig.11 1 is a schematic diagram of the structure of an embodiment of the electronic atomization device provided by the present application. The electronic atomization device 300 includes a power supply 310 and the atomizer 200 as described above, and the power supply 310 is connected to the atomizer 200 and supplies power to the atomizer 200.

[0096] Different from the prior art, the present application discloses an electronic atomization device, an atomizer and a heating component thereof. By providing a microgroove portion on the substrate, and the microgroove portion is provided with a plurality of liquid-collecting microgrooves, the surface area of ​​the atomization zone in the substrate can be effectively increased, so that more liquid matrix can be gathered in the atomization zone by capillary force and surface tension, thereby increasing the thickness of the liquid film on one side of the microgroove portion, and the heating element is arranged in the microgroove portion, and the microgroove portion is at least partially higher than the heating element, so that the heating element can be covered by the liquid film, and the liquid supply to the heating element can be increased, so that the heating element does not contact the air during atomization, avoiding the phenomenon of dry burning during the atomization process, and because the heating element can be covered by the liquid film, the energy utilization rate during the atomization process can also be improved, so the heating component provided by the present application can increase the liquid supply to the heating element installed thereon, so as to avoid the dry burning condition during the atomization process, and can increase the content of large droplets in the aerosol generated by atomization, thereby improving the taste of the inhalable flavor atomized gas.

[0097] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating component used in an electronic atomization device, characterized in that: The heating component comprises: A substrate, wherein the substrate is a porous ceramic substrate, a porous glass substrate or a dense body; the substrate is provided with a microgroove portion, and the microgroove portion is provided with a plurality of liquid-collecting microgrooves; A heating element, the heating element is arranged in the microgroove portion, and the liquid-collecting microgroove is used to lock the liquid to form a liquid film on the surface of the heating element; wherein the microgroove portion is at least partially higher than the heating element; Wherein, the microgroove portion is further provided with a sinking groove, and the sinking groove spans across the plurality of liquid collecting microgrooves; the heating element is arranged on the bottom wall of the sinking groove; The sink has a notch formed on the surface of the microgroove portion, the heating element is arranged on the bottom wall of the sink through the notch, and the surface of the heating element away from the bottom wall of the sink is lower than the notch of the sink.

2. The heating component according to claim 1, characterized in that: The distance between the surface of the heating element away from the bottom wall of the sink and the notch of the sink is in the range of 0.1 mm to 0.2 mm.

3. The heating component according to claim 1, characterized in that: At least part of the plurality of liquid collecting microgrooves is communicated with the sedimentation tank.

4. The heating component according to claim 1, characterized in that: The depth of the sink groove is in the range of 0.2 mm to 0.3 mm.

5. The heating component according to claim 4, characterized in that: The groove depth of the liquid collecting micro groove is less than or equal to the groove depth of the sedimentation groove.

6. The heating component according to claim 5, characterized in that: The depth of the liquid collecting microgrooves is in the range of 0.15 mm to 0.3 mm.

7. The heating component according to claim 1, characterized in that: The plurality of liquid-collecting microgrooves are arranged in an array, the groove width of the liquid-collecting microgrooves gradually decreases with the increase of groove depth, and the spacing between the liquid-collecting microgrooves is in the range of 0.2 mm to 0.5 mm.

8. The heating component according to claim 1, characterized in that: The substrate is a porous substrate, the heating element is a heating film, and the heating film is mounted on the bottom wall of the sink by bonding with a resistor paste.

9. The heating component according to claim 1, characterized in that: The substrate is further provided with an electrode groove and an electrode arranged in the electrode groove. The electrode groove is arranged at the end of the sinking groove, and the electrode groove is communicated with the sinking groove. The electrode is electrically connected to the heating element.

10. The heating component according to claim 9, characterized in that: Two electrode grooves are provided on the substrate, and the two electrode grooves are respectively arranged at the two ends of the sink, and the bottom wall of the sink is flush with the bottom wall of the electrode groove. The two electrodes are respectively arranged in the corresponding electrode grooves, one of the two electrodes is electrically connected to one end of the heating element, and the other is electrically connected to the other end of the heating element.

11. The heating component according to claim 10, characterized in that: The sink includes a first connecting segment, a first arc segment, a second arc segment and a second connecting segment connected in sequence, the opening of the first arc segment and the opening of the second arc segment are in opposite directions, the first connecting segment is connected to one of the electrode slots, and the second connecting segment is connected to another of the electrode slots.

12. The heating component according to claim 11, characterized in that: The sink further includes a straight line segment, the first arc segment and the second arc segment are connected by the straight line segment, and the first connecting segment, the straight line segment and the second connecting segment are sequentially arranged in parallel.

13. The heating component according to claim 1, characterized in that: The substrate has a surface, and at least part of the micro-grooves protrude from the surface; or The microgrooves are flush with the surface; or The micro groove portion is disposed sunken relative to the surface.

14. An atomizer, characterized in that: The atomizer comprises a heat generating assembly as claimed in any one of claims 1 to 13.

15. An electronic atomization device, characterized in that: The electronic atomization device comprises a power supply and the atomizer as claimed in claim 14, wherein the power supply is connected to the atomizer and supplies power to the atomizer.

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