Test device and probe assembly therefor

Abstract

This invention discloses a testing device and its probe assembly. The testing device includes a circuit board, multiple probe assemblies, a first housing, and a second housing. The multiple probe assemblies are independent of each other and arranged at fixed intervals. Each probe assembly includes a body, a first contact segment, and a second contact segment. The body has multiple strip-shaped through holes and includes a first side and a second side opposite to each other. The first contact segment is connected to the first side, and the second contact segment is connected to the second side. The extension direction of the first contact segment relative to the body is different from the extension direction of the second contact segment relative to the body. A first end of the first contact segment abuts against a test object. A second end of the second contact segment abuts against the circuit board.

Description

Technical Field

[0001] This invention relates to a testing device and its probe assembly, and more particularly to a testing device and its probe assembly that increases the elasticity of the overall structure by creating strip-shaped perforations. Background Technology

[0002] Currently, the probe assembly of the testing device contacts the object under test (e.g., an IC) and the circuit board (e.g., a test substrate) at both ends, respectively, to electrically connect the circuit board to the object under test and perform related tests. Existing probe assemblies mainly use two elastic plastic rods abutting against the upper and lower sides of the probe assembly to ensure stable contact between the probe assembly and the circuit board and the object under test. However, the stability of the elasticity of the plastic rods is difficult to predict and control. For example, the elasticity of the plastic rods may change under high temperatures, and the elasticity of the plastic rods on different probe assemblies is not easily controlled precisely when they are close together. Therefore, during testing, this technique can easily cause the probe assembly to scratch the circuit board or result in poor electrical contact between the probe assembly and the object under test.

[0003] Therefore, how to overcome the above-mentioned defects through structural design improvements has become one of the important issues to be addressed in this field. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a testing device and its probe assembly to address the shortcomings of the prior art.

[0005] To solve the aforementioned technical problems, one technical solution adopted by the present invention is to provide a testing device, which includes a circuit board, a plurality of probe assemblies, a first housing, and a second housing. The plurality of probe assemblies are independent of each other and arranged at fixed intervals. Each probe assembly includes a body, a first contact segment, and a second contact segment. At least one of the body, the first contact segment, and the second contact segment has a plurality of strip-shaped through holes, and the body includes a first side and a second side opposite to each other. The first contact segment is connected to the first side, and the second contact segment is connected to the second side. The extension direction of the first contact segment relative to the body and the extension direction of the second contact segment relative to the body are different from each other. A first end of the first contact segment abuts against a test object. A second end of the second contact segment abuts against the circuit board. The first housing is disposed above each probe assembly and abuts against the first side of each probe assembly. The second housing is disposed below each probe assembly and abuts against the second side of each probe assembly.

[0006] Preferably, at least two strip-shaped perforations have the same size and shape.

[0007] Preferably, at least two strip-shaped perforations are arranged side by side, one above the other.

[0008] Preferably, the elastic coefficient of the probe assembly is changed by adjusting the number, spacing, size, and / or shape of the strip perforations.

[0009] Preferably, the thickness of each probe assembly is between 40 micrometers and 50 micrometers.

[0010] Preferably, the body of each probe assembly has a segmental structure formed on the first side and the second side, so that the first housing and the second housing abut against the body respectively.

[0011] Preferably, each probe assembly abuts against each contact point of the object to be tested.

[0012] Preferably, at least two probe assemblies abut against each contact point of the object to be tested.

[0013] Preferably, at least two probe assemblies are integrated into one unit.

[0014] To address the aforementioned technical problems, another technical solution adopted by the present invention is to provide a probe assembly, which includes a body, a first contact segment, and a second contact segment. The body includes a first side and a second side opposite to each other, and the body has a plurality of strip-shaped through holes. The first contact segment is connected to the first side and includes a first end that abuts against a test object. The second contact segment is connected to the second side and includes a second end that abuts against a circuit board, and the extension direction of the second contact segment relative to the body is different from the extension direction of the first contact segment relative to the body.

[0015] Preferably, at least two strip-shaped perforations have the same size and shape.

[0016] Preferably, at least two strip-shaped perforations are arranged side by side, one above the other.

[0017] Preferably, the elastic coefficient of the probe assembly is changed by adjusting the number, spacing, size, and / or shape of the strip perforations.

[0018] Preferably, the thickness of the probe assembly is between 40 micrometers and 50 micrometers.

[0019] Preferably, the body of the probe assembly forms a segment structure on the first side and the second side respectively.

[0020] One of the beneficial effects of the present invention is that the testing device and its probe assembly provided by the present invention can increase the elasticity of the overall structure and improve the stability of the structure by means of the technical solutions of "multiple strip-shaped perforations in the body" and "multiple probe assemblies being independent of each other and arranged at fixed intervals". Attached Figure Description

[0021] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

[0022] Figure 1 This is a three-dimensional schematic diagram of a probe assembly according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of one embodiment of the testing device and its probe assembly of the present invention.

[0024] Figure 3 This is a schematic diagram of another embodiment of the testing device and its probe assembly of the present invention.

[0025] Figure 4 and Figure 5 This is a partial structural diagram of the multiple probe components of the present invention contacting the object to be tested. Detailed Implementation

[0026] The following specific embodiments illustrate the implementation of the "testing device and its probe assembly" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated beforehand. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0027] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components, these components should not be limited by these terms. These terms are primarily used to distinguish one component from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more related listed items.

[0028] Example

[0029] See Figure 1 As shown, Figure 1 This is a perspective view of the probe assembly of the present invention. The present invention provides a probe assembly 1. The probe assembly 1 is a one-piece needle structure, comprising: a body 10, a first contact segment 11, and a second contact segment 12. The body 10 includes a first side 101 and a second side 102 opposite to each other. The first contact segment 11 is connected to the first side 101. The second contact segment 12 is connected to the second side 102. The extension direction of the second contact segment 12 relative to the body 10 is different from the extension direction of the first contact segment 11 relative to the body 10. Specifically, the first contact segment 11 extends relative to the body 10 in the positive Z-axis direction, while the second contact segment 12 extends relative to the body 10 in the negative Z-axis direction, and the first contact segment 11 and the second contact segment 12 are respectively disposed in diagonal regions of the body 10. In addition, the body 10 has a plurality of strip-shaped perforations 100. At least a portion of the plurality of strip-shaped perforations 100 have the same size and shape. At least a portion of the multiple strip-shaped perforations 100 are arranged side-by-side, one above the other. It should be noted that the present invention does not limit the specific shape, size, or number of the strip-shaped perforations 100. Additionally, for example, the thickness T of the probe assembly 1 is between 40 micrometers and 50 micrometers.

[0030] It is worth mentioning that, Figure 1 The probe assembly 1 shown is for illustrative purposes only and is not intended to limit the specific shape of the probe assembly 1. For example, see [link to documentation]. Figure 2 and Figure 3 As can be seen from the probe component 1 in the figure, the probe component 1 of the present invention can have various implementation forms.

[0031] Furthermore, such as Figure 2 and Figure 3 As shown, Figure 2 and Figure 3 These are schematic diagrams illustrating two embodiments of the testing device and its probe assembly 1 of the present invention. It should be noted that... Figure 2 and Figure 3 This example uses a combination of multiple probe components 1 arranged side by side, or more precisely, a combination of three probe components 1 arranged side by side. However, Figure 2 and Figure 3 This is shown from the perspective of the X-axis direction. To facilitate showing the overall structure, it can be included together. Figure 4 or Figure 5 As shown, Figure 4 and Figure 5 This is shown from the perspective of the Y-axis direction.

[0032] As described above, the testing device D includes: a circuit board S, multiple probe assemblies 1, a first housing 2, and a second housing 3. The multiple probe assemblies 1 are independent of each other and arranged at fixed intervals (see [reference]). Figure 4 or Figure 5 Each probe assembly 1 includes a body 10, a first contact segment 11, and a second contact segment 12 (see...). Figure 2 or Figure 3 At least one of the body 10, the first contact segment 11, and the second contact segment 12 has a plurality of strip-shaped through holes 100. The body 10 includes opposing first side 101 and second side 102. The first contact segment 11 is connected to the first side 101, and the second contact segment 12 is connected to the second side 102. The extension direction of the first contact segment 11 relative to the body 10 is different from the extension direction of the second contact segment 12 relative to the body 10. A first end 111 of the first contact segment 11 abuts against a test object M, and a second end 121 of the second contact segment 12 abuts against a circuit board S. For example, the test object M is, for example, but not limited to, an IC chip, and the circuit board S can be a printed circuit board (PCB) or a flexible printed circuit board (FPCB), which is not limited to this invention. The first housing 2 is disposed above the plurality of probe assemblies 1 and abuts against the first side 101 of the plurality of probe assemblies 1. The second housing 3 is disposed below the plurality of probe assemblies 1 and abuts against the second side 102 of the plurality of probe assemblies 1. In other embodiments of the present invention, the plurality of probe assemblies 1, the first housing 2 and the second housing 3 may be integrated into a module or a socket.

[0033] Continue reading Figure 2 As shown, Figure 2 The probe assembly 1 of the test device D is basically irregularly shaped, and multiple strip-shaped perforations 100 are distributed approximately evenly on the first contact section 11 and the second contact section 12. The first end 111 of the first contact section 11 abuts against the object under test M, and the second end 121 of the second contact section 12 abuts against the circuit board S. The body 10 forms a step structure 101A and 102A on the first side 101 and the second side 102, respectively. Specifically, the first housing 2 abuts against the step structure 101A on the first side 101, and the second housing 3 abuts against the step structure 102A on the second side 102. Therefore, when the probe assembly 1 contacts the object under test M and the circuit board S, the probe assembly 1 increases its own structural elasticity through the gaps formed by the multiple strip-shaped perforations 100, without the need for additional elastomer components. Since the first housing 2 and the second housing 3 securely fix the probe assembly 1 in the horizontal direction, the probe assembly 1 is only subjected to vertical force, causing the first contact segment 11 to move up and down, without horizontal sliding. This reduces scratches on the circuit board S and maintains a stable contact between the probe assembly 1 and the object under test M.

[0034] Continue reading Figure 3 As shown, Figure 3 The probe assembly 1 of the testing device D is generally polygonal, and multiple strip-shaped through-holes 100 are distributed approximately evenly on the body 10. The first end 111 of the first contact segment 11 abuts against a contact point on the test object M, i.e., a solder ball M1, and the second end 121 of the second contact segment 12 abuts against the circuit board S. Thus, the test object M and the circuit board S are electrically connected through the probe assembly 1. It should be noted that the test object M may have one or more contact points (solder balls M1), while... Figure 3 In this embodiment, each probe assembly 1 abuts against each contact point (solder ball M1) of the object under test M. The first housing 2 abuts against the step structure 101A on the first side 101, and the second housing 3 abuts against the step structure 102A on the second side 102. When the probe assembly 1 contacts the object under test M and the circuit board S, the probe assembly 1 passes through the gaps formed by the multiple strip-shaped perforations 100 to increase the structural elasticity of the probe assembly 1 itself, without the need for additional elastomer components. Since the first housing 2 and the second housing 3 securely fix the probe assembly 1 in the horizontal direction, the probe assembly 1 is only subjected to vertical force, causing the first contact segment 11 to move up and down, without horizontal sliding. Therefore, scratches on the circuit board S can be reduced, and a stable contact can be maintained between the probe assembly 1 and the object under test M.

[0035] In this invention, the elastic coefficient of the probe assembly 1 is changed by adjusting the number, spacing, size, and / or shape of the plurality of strip-shaped perforations 100. However, compared Figure 2 and Figure 3 It can be known that Figure 2 and Figure 3 The shapes of probe components 1 vary greatly, and Figure 2 Multiple strip-shaped perforations 100 in probe assembly 1 and Figure 3 The probe assembly 1 and the multiple strip-shaped perforations 100 differ in shape, size, and distribution. In other words, the present invention does not limit the specific shape of the probe assembly 1, nor does it limit the specific shape, size, or number of the strip-shaped perforations 100.

[0036] In addition, please continue to refer to Figure 4 and Figure 5 As shown, Figure 4 and Figure 5 This is a partial structural diagram of multiple probe components 1 contacting the target object according to the present invention. The multiple probe components 1 are independent of each other and arranged at fixed intervals, with the thickness T of each probe component 1 ranging from 40 micrometers to 50 micrometers. Specifically, Figure 4 and Figure 5The image only shows the first contact segment 11 of multiple probe assemblies 1 abutting against a contact point of the object under test M, which is shown as a solder ball M1. Specifically, in Figure 4 and Figure 5 In the embodiments, at least two of the plurality of probe assemblies 1 abut against each contact point (solder ball M1) of the object under test M, and further, at least two probe assemblies 1 can be integrated into one unit. More preferably, the object under test can be a packaged IC or a packaged module. The contact point can be a pin or a pad. The probe assembly, the first housing, and the second housing can be integrated into a module or a socket. The plurality of probe assemblies 1 of the present invention, through a structural design that is independent of each other and arranged at fixed intervals, enables the plurality of probe assemblies 1 to maintain good electrical contact with the solder ball M1 of the object under test M through their own elastic structure (i.e., strip-shaped through-holes 100), and the elastic coefficient of the plurality of probe assemblies 1 can be changed by adjusting their number, spacing, size, and / or shape. Specifically, as Figure 4 As shown, Figure 4 The solder ball M1 is positioned directly above the center of the three probe assemblies 1. Therefore, the first contact segment 11 of the middle probe assembly 1 experiences a significant vertical force, causing it to displace downwards. This ensures that the solder ball M1 contacts the first contact segments 11 of all three probe assemblies 1. Furthermore, the three probe assemblies 1 can also be integrated into a single unit. Further... Figure 5 As shown, Figure 5 The solder ball M1 is positioned above and to the right of the three probe assemblies 1. Therefore, the first contact segments 11 of the middle and right probe assemblies 1 are subjected to a greater vertical force, resulting in downward displacement and ensuring that the solder ball M1 makes contact with the first contact segments 11 of all three probe assemblies 1. In other words, through the structural design of the multiple probe assemblies 1 arranged independently and at fixed intervals, there will be no situation where a probe assembly 1 fails to contact the solder ball M1. This ensures that the contact area between the three probe assemblies 1 and the solder ball M1 remains consistent, thereby maintaining stable signal transmission between the object under test M and the circuit board S.

[0037] Beneficial effects of the embodiments

[0038] One of the beneficial effects of the present invention is that the test device D and its probe assembly 1 provided by the present invention can increase the elasticity of the overall structure and improve the stability of the structure by means of the technical solutions of "the body 10 having multiple strip-shaped perforations 100" and "multiple probe assemblies 1 being independent of each other and arranged at fixed intervals".

[0039] Furthermore, the probe assembly 1 increases its own structural elasticity through the gaps formed by multiple strip-shaped perforations 100, without the need for additional elastomer components. Since the first housing 2 and the second housing 3 securely fix the probe assembly 1 in the horizontal direction, the probe assembly 1 will only be subjected to vertical force and will not slide in the horizontal direction. Therefore, scratches on the circuit board S can be reduced, and the probe assembly 1 and the object under test M can be kept in stable contact.

[0040] Furthermore, the multiple probe components 1 of the present invention, through their independent and fixedly spaced arrangement, enable the multiple probe components 1 to maintain a consistent contact area and good electrical contact with the solder balls M1 of the test object M through their own elastic structure (i.e., strip-shaped perforations 100), thereby ensuring stable signal transmission between the test object M and the circuit board S.

[0041] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A probe assembly, characterized in that, The probe assembly includes: A body includes a first side and a second side opposite to each other, and the body has a plurality of strip-shaped perforations; A first contact segment, connected to the first side; and A second contact segment is connected to the second side, and the extension direction of the second contact segment relative to the body is different from the extension direction of the first contact segment relative to the body. The first side forms a first step structure; The second side forms a second segment structure.

2. The probe assembly according to claim 1, characterized in that, At least two of the strip-shaped perforations have the same size and shape.

3. The probe assembly according to claim 1, characterized in that, At least two of the strip-shaped perforations are arranged side by side, one above the other.

4. The probe assembly according to claim 1, characterized in that, The elastic coefficient of the probe assembly can be changed by adjusting the number, spacing, size, and / or shape of the strip-shaped perforations.

5. The probe assembly according to claim 1, characterized in that, The thickness of the probe assembly is between 40 micrometers and 50 micrometers.

6. A testing apparatus, characterized in that, The testing apparatus includes: A circuit board; The probe assembly according to any one of claims 1 to 5 is independent of each other and arranged at fixed intervals, wherein a first end of the first contact segment abuts against a test object, and a second end of the second contact segment abuts against the circuit board; A first housing is disposed above each of the probe assemblies and abuts against the first side of each of the probe assemblies; and A second housing is disposed below each of the probe assemblies and abuts against the second side of each of the probe assemblies; The first step structure is used to be abutted against by the first shell; The second step structure is used to be abutted against by the second housing.

7. The testing apparatus according to claim 6, characterized in that, The object under test has multiple contact points, and each probe assembly abuts against each of the contact points of the object under test.

8. The testing apparatus according to claim 7, characterized in that, At least two of the plurality of probe assemblies abut against each of the contact points of the object under test.

9. The testing apparatus according to claim 7, characterized in that, At least two of the probe assemblies are combined into one unit.

10. The testing apparatus according to claim 6, characterized in that, The multiple probe assemblies, the first housing, and the second housing can be integrated into a module or a support.

Images