Semiconductor Chip Encapsulation Mounter

Abstract

The present invention discloses a semiconductor chip packaging and mounter. Among them, the semiconductor chip packaging and mounter includes a frame, two fixture storage modules and a transfer module; the frame is provided with a chip loading station, a correction station and a chip mounting station. The chip loading station is used for placing semiconductor chips, the correction station is used for adjusting the position and angle of the semiconductor chips, and the chip mounting station is used for mounting the semiconductor chips; the two fixture storage modules are installed on the frame at intervals from each other. The fixture storage module is used for storing fixtures, and one fixture is used for placing a plurality of socket bases; the transfer module is installed on the frame and located between the two fixture storage modules. The transfer module is used for moving the fixture located in the fixture storage module to the chip mounting station, and the chip mounting station is used for mounting the semiconductor chips on the socket bases; the technical solution of the present invention can improve the efficiency of the semiconductor chip packaging and mounter in completing the mounting process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip mounting, and particularly relates to a semiconductor chip packaging and mounting machine. Background Art

[0002] Nowadays, due to the development and progress of technology, the assembly of laser diodes can be carried out by automated equipment. It is necessary to move the jig carrying the socket to the dispensing module for dispensing, and then move the jig to the chip mounting station to mount the chip on the socket on the jig. After the chip is mounted, the jig is output to complete one mounting process. However, the feeding and discharging efficiency of the jig of the current semiconductor chip packaging and mounting machine on the market is relatively low, resulting in a reduction in the overall efficiency of the semiconductor chip packaging and mounting machine to complete the mounting process. Summary of the Invention

[0003] The main object of the present invention is to provide a semiconductor chip packaging and mounting machine, aiming to increase the efficiency of the semiconductor chip packaging and mounting machine to complete the mounting process.

[0004] To achieve the above object, the semiconductor chip packaging and mounting machine proposed by the present invention includes:

[0005] A frame, provided with a chip loading station, a correction station and a chip mounting station. The chip loading station is used to place semiconductor chips, the correction station is used to adjust the position and angle of the semiconductor chips, and the chip mounting station is used to mount the semiconductor chips;

[0006] Two jig storage modules, installed on the frame at intervals. The jig storage module is used to store jigs, and one jig is used to place a plurality of sockets;

[0007] A transfer module, installed on the frame and located between the two jig storage modules. The transfer module is used to move the jig located in the jig storage module to the chip mounting station, and the chip mounting station is used to mount the semiconductor chip on the socket; and

[0008] The moving process of the transfer module includes: when the transfer module moves the jig from the chip mounting station to the jig storage module at the left end, it moves the jig in the jig storage module at the right end to the chip mounting station, and when the transfer module moves the jig from the chip mounting station to the jig storage module at the right end, it moves the jig in the jig storage module at the left end to the chip mounting station.

[0009] Optionally, the transfer module includes:

[0010] Transfer platform, track body, the track body includes a first side plate and a second side plate arranged oppositely, the first side plate is installed on the transfer platform, the second side plate is detachably connected to the first side plate, and a through groove is provided between the first side plate and the second side plate for the fixture to move through, and a plurality of socket holders for placing chips are arranged on the fixture;

[0011] Drive assembly, installed on the transfer platform and spaced from the track body; and

[0012] First cylinder, fixing member, the first cylinder is drivingly connected to the drive assembly, the push rod of the first cylinder is connected to the fixing member, the fixing member is arranged above the through groove, and the fixing member is used to connect the fixture entering the through groove, and the drive assembly is used to drive the fixing member to move along the length direction of the through groove.

[0013] Optionally, the semiconductor chip packaging and mounter further includes:

[0014] Chip loading module, installed at the chip loading station;

[0015] Correction module, installed at the correction station, the chip loading module is used to place the semiconductor chip onto the correction module, and the correction module is used to correct the position and angle of the semiconductor chip;

[0016] Soldering head module, installed at the chip mounting station, the soldering head module is used to mount the semiconductor chip located on the correction module onto the socket holder;

[0017] Two dispensing modules, installed on the frame at intervals, the dispensing module is used to dispense glue onto a plurality of socket holders on the fixture; and

[0018] Vacuum assembly, installed on the frame, the vacuum assembly is respectively connected to the chip loading module, the correction module and the soldering head module, and the vacuum assembly is used to provide a vacuum air source;

[0019] The dispensing module can detect all the socket holders on the fixture. When the transfer module moves the fixture below the dispensing module, the dispensing module performs a dispensing operation every time it detects a socket holder. After all the socket holders on the fixture have completed the dispensing operation, the transfer module moves the fixture to the chip mounting station.

[0020] Optionally, the correction module includes a correction platform, a first motor, a rotating shaft, a first moving component, and a first vision component. The correction platform is installed on the first moving component, and the first moving component is installed on the frame. The moving component is used to control the movement of the correction platform in the horizontal direction. The first motor is installed on the correction platform. The rotating shaft is rotatably installed on the correction platform and is drivingly connected to the first motor. The upper end of the rotating shaft is used to place the semiconductor chip. The first vision component is installed on the frame and is located above the rotating shaft.

[0021] Optionally, the correction module further includes an air intake pipe. One end of the air intake pipe is sleeved on the lower end of the rotating shaft. The end of the rotating shaft is provided with a first adsorption hole, and the first adsorption hole penetrates through the rotating shaft. The air intake pipe is communicated with the first adsorption hole, and the other end of the air intake pipe is connected to the vacuum component. The first adsorption hole is used to adsorb the semiconductor chip;

[0022] The first vision component obtains the position information of the rotating shaft. A semiconductor chip is placed on the upper end of the rotating shaft. The correction platform is moved to below the first vision component through the first moving component so that the axis of the rotating shaft is collinear with the axis of the first vision component, so that the semiconductor chip, and then the first vision component obtains the angle of the semiconductor chip on the rotating shaft. The rotating shaft is controlled to rotate a certain angle through the first motor so that the placement angle of the semiconductor chip is consistent with the preset angle.

[0023] Optionally, the soldering head module includes a first base, a flat motor, a second moving component, a suction head, and a second vision component. The first base is installed at the chip mounting station. The second moving component is installed on the first base. The flat motor is installed on the second moving component. The second component is used to control the movement of the flat motor in the horizontal direction and the height direction. The suction head is installed on the mover of the flat motor. The suction head is provided with a second adsorption hole, and the second adsorption hole is communicated with the vacuum component. The second adsorption hole is used to adsorb the semiconductor chip. The second vision component is installed on the frame and is located above the chip mounting station. The second vision component is used to detect whether the semiconductor chip is normally mounted on the socket.

[0024] Optionally, the soldering head module further includes a reverse detection component. The reverse detection component includes a detection lens and a second base. The second base is installed on the frame, and the detection lens is installed on the second base and is arranged upward;

[0025] After the semiconductor chip is corrected in position and angle by the correction module, the second moving component controls the flat motor to move above the semiconductor chip. The flat motor extends the push rod, sucks the semiconductor chip through the suction head, and then translates the semiconductor chip to above the detection lens through the second moving component. The detection lens is used to detect whether the correction module corrects the semiconductor chip to a preset angle;

[0026] If the correction is successful, the semiconductor chip is moved to above the socket after dispensing through the second moving component for mounting;

[0027] If the correction fails, the semiconductor chip is moved to above the correction module through the second moving component. The flat motor places the semiconductor chip back on the correction module for correction again until the detection lens detects that the semiconductor chip is corrected to the preset angle, and then the semiconductor chip is mounted on the socket after dispensing.

[0028] Optionally, the fixture storage module includes a cartridge rack, a plurality of cartridges, a loading component, and an unloading component. A plurality of the fixtures are evenly spaced along the height direction of the cartridge and placed in the cartridge. A plurality of the cartridges are installed on the cartridge rack and are distributed in sequence along the height direction of the cartridge rack. The loading component is installed on the cartridge rack and is used to move the fixture in the cartridge to the transfer module. The unloading component is used to output the cartridge located in the cartridge rack outward.

[0029] Optionally, the loading component includes a lead screw, a nut seat, a second cylinder, and a second motor. The cartridge rack is provided with a loading portion. The lead screw is rotatably installed on the cartridge rack and extends along the length direction of the cartridge rack. The second motor is installed on the cartridge rack and is drivingly connected to the lead screw. The nut seat is rotatably sleeved on the lead screw. A convex plate is provided on the nut seat. The cartridge is provided with a clamping groove. The convex plate extends into the clamping groove to fix the nut seat to the cartridge. The second cylinder is installed on the cartridge rack, and the push rod of the second cylinder abuts against the fixture in the cartridge;

[0030] The nut seat inserts the cartridge located in the loading portion through the convex plate, and the second cylinder pushes the lowermost fixture in the cartridge to the transfer module. After the sockets on the fixture are all mounted with the semiconductor chips, they are moved back into the cartridge through the transfer module. When the cartridge recovers one fixture, the second motor drives the cartridge to move downward a preset distance until all the sockets on the fixtures in the cartridge are mounted with the semiconductor chips. The second motor moves the cartridge to the unloading component and then outputs the cartridge outward.

[0031] Optionally, the blanking component includes a carrier plate, a third motor, and a driving plate. The driving plate is movably mounted on the carrier plate. The third motor is mounted on the carrier plate, and the third motor is used to drive the driving plate to move along the length direction of the carrier plate. A plurality of insertion parts are provided on the driving plate, and the plurality of insertion parts are evenly spaced along the length direction of the driving plate. The insertion parts are used to place the material boxes.

[0032] After all the tube sockets on all the fixtures in the material box are mounted with the semiconductor chips, the second motor moves the material box to the insertion part. Whenever a material box is placed on an insertion part, the third motor drives the driving plate to move a preset distance, so as to move the insertion part with the material box to the lower part of the loading part.

[0033] In the technical solution of the present invention, fixture storage modules are respectively provided at both ends of the transfer module. The two fixture storage modules are used to load the fixtures onto the transfer module and to recover the fixtures from the transfer module. In an embodiment with one fixture storage module, the transfer module moves the fixture in the fixture storage module to the chip mounting station, and then moves the fixture back from the chip mounting station to the fixture storage module. During the process of the fixture returning to the fixture storage module, the transfer module cannot simultaneously load another fixture onto the chip mounting station. As a result, no fixture can be loaded during the time when the fixture returns to the fixture storage module. With such a setting, the fixtures are loaded and unloaded alternately from both ends of the transfer module, so that the flow efficiency of the fixtures in the transfer module can be increased, the waste of loading and unloading time during the processing can be reduced, and thus the efficiency of the semiconductor chip packaging and mounting machine in completing the mounting process can be increased. Description of the Drawings

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without creative efforts.

[0035] Figure 1 It is a schematic structural diagram of an embodiment of the semiconductor chip packaging and mounting machine of the present invention;

[0036] Figure 2 It is Figure 1 a schematic structural diagram of the solder head module in;

[0037] Figure 3 It is Figure 1 a schematic structural diagram of the fixture storage module in;

[0038] Figure 4 It is Figure 1 a schematic structural view of another angle of the jig storage module in the

[0039] Explanation of the reference numerals in the drawings:

[0040]

[0041]

[0042] The realization, functional characteristics and advantages of the object of the present invention will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments

[0043] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0044] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0045] In the present invention, unless otherwise clearly defined and limited, the terms "connection", "fixation", etc. shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0046] In addition, if the embodiments of the present invention involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] The present invention provides a semiconductor chip packaging and mounting machine.

[0048] In an embodiment of the present invention, as Figures 1 to 4 shown, the semiconductor chip packaging and mounting machine includes a frame, two fixture storage modules 10, and a transfer module 11; the frame is provided with a semiconductor chip loading station, a correction station, and a semiconductor chip mounting station. The semiconductor chip loading station is used to place semiconductor chips, the correction station is used to adjust the position and angle of the semiconductor chips, and the semiconductor chip mounting station is used to mount the semiconductor chips; the two fixture storage modules 10 are installed on the frame at intervals. The fixture storage module 10 is used to store fixtures, and one fixture is used to place a plurality of socket bases;

[0049] The transfer module 11 is installed on the frame and is located between the two fixture storage modules 10. The transfer module 11 is used to move the fixture located in the fixture storage module 10 to the semiconductor chip mounting station, and the semiconductor chip mounting station is used to mount the semiconductor chips on the socket bases; the moving process of the transfer module 11 includes: when the transfer module 11 moves the fixture from the semiconductor chip mounting station to the fixture storage module 10 at the left end, it moves the fixture in the fixture storage module 10 at the right end to the semiconductor chip mounting station, and when the transfer module 11 moves the fixture from the semiconductor chip mounting station to the fixture storage module 10 at the right end, it moves the fixture in the fixture storage module 10 at the left end to the semiconductor chip mounting station.

[0050] In the technical solution of the present invention, fixture storage modules 10 are respectively provided at both ends of the transfer module 11. The two fixture storage modules 10 are used to load fixtures onto the transfer module 11 and to recover fixtures from the transfer module 11. In an embodiment with one fixture storage module 10, the transfer module 11 moves the fixture in the fixture storage module 10 to the semiconductor chip mounting station, and then moves the fixture back from the semiconductor chip mounting station to the fixture storage module 10. During the process of the fixture returning to the fixture storage module 10, the transfer module 11 cannot simultaneously load another fixture onto the semiconductor chip mounting station. As a result, no fixture can be loaded during the time when the fixture returns to the fixture storage module 10. With such a setting, fixtures are loaded and unloaded alternately from both ends of the transfer module 11, which can increase the flow efficiency of the fixtures in the transfer module 11, reduce the waste of loading and unloading time during the processing, and thus increase the efficiency of the semiconductor chip packaging and mounter in completing the mounting process.

[0051] In one embodiment, the transfer module 11 includes a transfer platform, a track body, a driving component, a first cylinder, and a fixing member; the track body includes a first side plate and a second side plate arranged oppositely. The first side plate is installed on the transfer platform, and the second side plate is detachably connected to the first side plate. A through groove is provided between the first side plate and the second side plate for the fixture to move through. Multiple socket holders for placing semiconductor chips are arranged on the fixture; the driving component is installed on the transfer platform and is spaced from the track body; the first cylinder is drivingly connected to the driving component, and the push rod of the first cylinder is connected to the fixing member. The fixing member is arranged above the through groove and is used to connect the fixture entering the through groove. The driving component is used to drive the fixing member to move along the length direction of the through groove.

[0052] Specifically, a driving component is installed on one side of the track body. The driving component is drivingly connected to the first cylinder, and the push rod of the first cylinder is connected to the fixing member. The fixing member is arranged above the fixture. The first cylinder can control the up and down movement of the fixing member, so as to press the fixing member tightly on the fixture, and the fixing member can be connected to the fixture; when the fixture enters the through groove, the first cylinder drives the fixing member to press tightly on the fixture, and then the driving component drives the first cylinder to move in the length direction of the through groove, that is, the driving component drives the fixture to move in the through groove through the fixing member. With such a setting, the first side plate and the second side plate can play a limiting role to prevent the fixture from shifting to the side during the movement. The fixing member is connected to the fixture, so that the fixture moves with the fixing member, which can increase the movement stability of the fixture and prevent the fixture from slipping when moving in the through groove. The movement distance of the fixture is controlled by controlling the movement distance of the fixing member, which is convenient for the fixture to be accurately positioned and moved to the corresponding position. In some other embodiments, the first side plate is provided with an avoidance groove, the fixing member is arranged on the side of the fixture, and the first cylinder can push the fixing member into the avoidance groove to fix the fixture with the fixing member.

[0053] In one embodiment, the semiconductor chip packaging and mounter further includes a semiconductor chip loading module 13, a correction module 14, a soldering head module 12, a two-component dispensing module 15, and a vacuum assembly; the semiconductor chip loading module 13 is installed at the semiconductor chip loading station; the correction module 14 is installed at the correction station, and the semiconductor chip loading module 13 is used to place the semiconductor chip onto the correction module 14, and the correction module 14 is used to correct the position and angle of the semiconductor chip; the soldering head module 12 is installed at the semiconductor chip mounting station, and the soldering head module 12 is used to mount the semiconductor chip located on the correction module 14 onto the socket; the two-component dispensing modules 15 are installed on the frame at intervals, and the dispensing module 15 is used to dispense glue onto multiple sockets on the fixture; the vacuum assembly is installed on the frame, and the vacuum assembly is respectively connected to the semiconductor chip loading module 13, the correction module 14, and the soldering head module 12, and the vacuum assembly is used to provide a vacuum air source; the dispensing module 15 can detect all the sockets on the fixture. When the transfer module 11 moves the fixture below the dispensing module 15, the dispensing module 15 performs a glue dispensing operation every time it detects a socket. After all the sockets on the fixture have completed the glue dispensing operation, the transfer module 11 moves the fixture to the semiconductor chip mounting station.

[0054] Specifically, the dispensing modules 15 on both sides will dispense glue onto the sockets on the fixture after detecting the input of the fixture. After the fixture has completed the glue dispensing, it will flow to the semiconductor chip mounting station. The semiconductor chip moves from the semiconductor chip loading module 13 to the correction module 14 for position and angle correction, so that the position and angle of the semiconductor chip on the correction module 14 are adapted to the sockets on the fixture, facilitating the soldering head module 12 to mount the semiconductor chip onto the sockets. Such a setting can increase the loading efficiency of the glue-dispensed fixture, making the mounting rhythm more compact, and thus can improve the efficiency of the semiconductor chip packaging and mounter in mounting semiconductor chips.

[0055] In one embodiment, the correction module 14 includes a correction platform, a first motor, a rotating shaft, a first moving component, and a first vision component 141. The correction platform is installed on the first moving component, and the first moving component is installed on the frame. The moving component is used to control the horizontal movement of the correction platform. The first motor is installed on the correction platform, the rotating shaft is rotatably installed on the correction platform and is drivingly connected to the first motor. The upper end of the rotating shaft is used to place the semiconductor chip, and the first vision component 141 is installed on the frame and is located above the rotating shaft.

[0056] Specifically, the position of the correction platform is first adjusted by the first moving component so that the upper end face of the rotating shaft is disposed opposite to the first vision component 141. At this time, the semiconductor chip located on the end face of the rotating shaft is positioned and photographed by the first vision component 141. By comparing the shape of the frame of the socket with that of the semiconductor chip, the angle by which the semiconductor chip needs to be adjusted can be obtained. If adjustment is required, the first motor is started to rotate the rotating shaft so that the semiconductor chip rotates to a suitable position before proceeding with the next installation. In this embodiment, the correction module 14 further includes a first synchronous pulley, a second synchronous pulley, and a first synchronous belt. The first synchronous pulley is sleeved on the rotating shaft of the first motor, the second synchronous pulley is sleeved on the rotating shaft, and the first synchronous pulley is connected to the second synchronous pulley through the first synchronous belt. The first motor drives the first synchronous pulley to drive the rotating shaft to rotate. With such a setting, the semiconductor chip can be exactly placed into the socket, thereby reducing the situation where the semiconductor chip is not placed in the socket frame, and thus increasing the mounting accuracy of the semiconductor chip mounter for mounting the semiconductor chip. In some other embodiments, the correction module 14 further includes a first bevel gear and a second bevel gear that mesh with each other. The first bevel gear is sleeved on the rotating shaft of the first motor, and the second bevel gear is sleeved on the rotating shaft.

[0057] In one embodiment, the correction module 14 further includes an air intake pipe. One end of the air intake pipe is sleeved on the lower end of the rotating shaft. A first adsorption hole is provided at the end of the rotating shaft. The first adsorption hole penetrates through the rotating shaft. The air intake pipe is communicated with the first adsorption hole. The other end of the air intake pipe is connected to a vacuum component. The first adsorption hole is used for adsorbing the semiconductor chip. The first vision component 141 obtains the position information of the rotating shaft. A semiconductor chip is placed on the upper end of the rotating shaft. The correction platform is moved below the first vision component 141 by the first moving component so that the axis of the rotating shaft is collinear with the axis of the first vision component 141, so that for the semiconductor chip, the first vision component 141 then obtains the angle of the semiconductor chip on the rotating shaft, and the rotating shaft is controlled to rotate a certain angle by the first motor so that the placement angle of the semiconductor chip is consistent with the preset angle.

[0058] Specifically, a plurality of first adsorption holes are provided at the end of the rotating shaft. The plurality of first adsorption holes are evenly spaced along the circumferential direction of the rotating shaft. An air intake pipe is sleeved on the lower end of the rotating shaft. The air intake pipe is communicated with the plurality of first adsorption holes. When the semiconductor chip feeding module 13 feeds the semiconductor chip onto the rotating shaft, the semiconductor chip is adsorbed through the first adsorption holes. With such a setting, the stability of the semiconductor chip placed on the rotating shaft can be increased, and the semiconductor chip will not be displaced when the angle of the semiconductor chip is corrected. In some other embodiments, the plurality of first adsorption holes are arranged in a circular array at the end of the rotating shaft.

[0059] In one embodiment, the bonding head module 12 includes a first base 121, a planar motor 122, a second moving assembly 123, a suction head 124, and a second vision assembly 125. The first base 121 is installed at the semiconductor chip mounting station. The second moving assembly 123 is installed on the first base 121. The planar motor 122 is installed on the second moving assembly 123. The second assembly is used to control the planar motor 122 to move in the horizontal and height directions. The suction head 124 is installed on the mover of the planar motor 122. The suction head 124 is provided with a second suction hole, and the second suction hole is communicated with a vacuum assembly. The second suction hole is used to adsorb the semiconductor chip. The second vision assembly 125 is installed on the frame and is located above the semiconductor chip mounting station. The second vision assembly 125 is used to detect whether the semiconductor chip is properly mounted on the socket.

[0060] Specifically, the structure of the planar motor 122 is simple, and the movement of the mover of the planar motor 122 has good stability. In this embodiment, the second vision assembly 125 is used to obtain information of the socket, so that the correction module 14 adjusts the position and angle of the semiconductor chip. Such a setting can ensure a relatively high stability when the planar motor 122 drives the suction head 124 to adsorb the semiconductor chip, and avoid changing the position or angle of the semiconductor chip when the suction head 124 adsorbs the semiconductor chip. In some other embodiments, the bonding head module 12 includes a third cylinder. The third cylinder is installed on the first base 121, and the suction head 124 is installed on the push rod of the third cylinder.

[0061] In one embodiment, the bonding head module 12 further includes a reverse detection assembly. The reverse detection assembly includes a detection lens 126 and a second base 127. The second base 127 is installed on the frame, the detection lens 126 is installed on the second base 127, and the detection lens 126 is arranged facing upward. After the position and angle of the semiconductor chip are corrected by the correction module, the second moving assembly 123 controls the planar motor 122 to move above the semiconductor chip. The planar motor 122 controls the suction head 124 to suck the semiconductor chip, and then the second moving assembly 123 translates the semiconductor chip to above the detection lens 126. The detection lens 126 is used to detect whether the correction module corrects the semiconductor chip to a preset angle.

[0062] If the correction is successful, the semiconductor chip is moved to above the socket after dispensing is completed through the second moving assembly 123 for mounting.

[0063] If the correction fails, the semiconductor chip is moved to above the correction module through the second moving assembly 123, and the planar motor 122 places the semiconductor chip back on the correction module for correction again until the detection lens 126 detects that the semiconductor chip is corrected to the preset angle, and then the semiconductor chip is mounted on the socket after dispensing is completed.

[0064] Specifically, such a setting can make the position and angle of the semiconductor chip before loading conform to the socket, ensuring the mounting efficiency of the semiconductor chip and improving the yield rate of the product. In some other embodiments, the detection lens 126 is mounted on the first base 121, and the detection lens 126 is arranged in the direction of the suction head 124.

[0065] In one embodiment, the fixture storage module 10 includes a cartridge rack 101, a plurality of cartridges 102, a loading assembly 103, and an unloading assembly 104. A plurality of fixtures are evenly spaced along the height direction of the cartridge 102 and placed in the cartridge 102. The plurality of cartridges 102 are mounted on the cartridge rack 101, and the plurality of cartridges 102 are distributed in sequence along the height direction of the cartridge rack 101. The loading assembly 103 is mounted on the cartridge rack 101 and is used to move the fixtures in the cartridge 102 to the transfer module 11. The unloading assembly 104 is used to output the cartridge 102 located in the cartridge rack 101 outward.

[0066] Specifically, such a setting can ensure that a plurality of fixtures are placed in one cartridge 102, and the way of placing a plurality of cartridges 102 in the height direction of the cartridge rack 101 can reduce the floor area of the semiconductor chip packaging and mounting machine compared with the way of placing a plurality of cartridges 102 in the width or length direction of the cartridge rack 101. In some other embodiments, the plurality of cartridges 102 are distributed in sequence along the width direction of the cartridge rack 101.

[0067] In one embodiment, the loading assembly 103 includes a lead screw 1031, a nut seat 1032, a second cylinder 1033, and a second motor 1035. The cartridge rack 101 is provided with a loading portion. The lead screw 1031 is rotatably mounted on the cartridge rack 101 and extends along the length direction of the cartridge rack 101. The second motor 1035 is mounted on the cartridge rack 101 and is drivingly connected to the lead screw. The nut seat 1032 is rotatably sleeved on the lead screw 1031. A convex plate 1036 is provided on the nut seat 1032. The cartridge 102 is provided with a clamping groove. The convex plate 1036 extends into the clamping groove to fix the nut seat 1032 to the cartridge 102. The second cylinder 1033 is mounted on the cartridge rack 101, and the push rod of the second cylinder 1033 abuts against the fixture in the cartridge 102. The nut seat 1032 inserts the cartridge 102 located in the loading portion through the convex plate 1036, and the lowermost fixture in the cartridge 102 is pushed out to the transfer module 11 through the second cylinder 1033. After the sockets on all the fixtures are mounted with semiconductor chips, they are moved back into the cartridge 102 through the transfer module 11. When each fixture is recycled in the cartridge 102, the second motor 1035 drives the cartridge 102 to move downward by a preset distance until all the sockets on the fixtures in the cartridge 102 are mounted with semiconductor chips. Then the second motor 1035 moves the cartridge 102 to the unloading assembly 104 and outputs the cartridge 102 outward.

[0068] Specifically, in this embodiment, both sides of the magazine 102 are communicatively arranged. The second air cylinder 1033 extends into the magazine 102 from the left side to push out the fixture. The transfer module 11 pushes the fixture into the magazine 102 from the right side. The loading assembly 103 further includes a fourth air cylinder 1034. The fourth air cylinder 1034 is installed on the magazine rack 101 and is located above the loading part, and is used to press the magazine 102 that is outputting the fixture. When the fixture is output from the magazine 102 at the loading part, the fourth air cylinder 1034 presses on the magazine 102 at the loading part. When a fixture flows back into the magazine 102, the push rod of the fourth air cylinder 1034 retracts. At this time, the second motor 1035 drives the magazine 102 to move downward so that the push rod of the second air cylinder 1033 is aligned with the next fixture to be pushed out. With this setting, it can be ensured that all the fixtures in the same magazine 102 can be stably pushed out, and the movement accuracy of the lead screw is relatively high, that is, the second motor 1035 can precisely control the movement of the magazine 102 in the length direction of the lead screw to prevent the magazine 102 from moving too far, resulting in a certain fixture not being pushed out. In some other embodiments, the loading assembly 103 includes a first linear motor and a second air cylinder 1033. The first linear motor is installed on the magazine rack 101 and extends along the height of the magazine rack 101. The mover of the first linear motor can move in the height direction of the magazine rack 101. A clamping plate is provided on the mover of the first linear motor, and the clamping plate is used to clamp the magazine 102 at the loading part.

[0069] In one embodiment, the unloading assembly 104 includes a bearing plate 1041, a third motor 1042, and a driving plate 1043. The driving plate 1043 is movably installed on the bearing plate 1041. The third motor 1042 is installed on the bearing plate 1041, and the third motor 1042 is used to drive the driving plate 1043 to move along the length direction of the bearing plate 1041. A plurality of plug-in parts are provided on the driving plate 1043, and the plurality of plug-in parts are evenly spaced along the length direction of the driving plate 1043. The plug-in parts are used to place the magazine 102. After semiconductor chips are attached to the tube sockets of all the fixtures in the magazine 102, the second motor 1035 moves the magazine 102 to the plug-in part. Whenever a plug-in part has a magazine 102 placed on it, the third motor 1042 drives the driving plate 1043 to move a preset distance to move the plug-in part with the magazine 102 placed on it below the loading part.

[0070] Specifically, when the socket on all the jigs in the cartridge 102 has completed the mounting of the semiconductor chips, the push rod of the fourth cylinder 1034 retracts, and the second motor 1035 drives the cartridge 102 to move downward. When the cartridge 102 enters a plug-in portion, the second motor 1035 returns to the loading portion. Whenever a cartridge 102 drops to a plug-in portion, the third motor 1042 controls the driving plate 1043 to move forward a certain distance, so as to move the next plug-in portion below the cartridge 102 located in the loading portion. The blanking assembly 104 further includes a third synchronous pulley, a fourth synchronous pulley and a second synchronous belt. The driving plate 1043 is mounted on the second synchronous belt, and the second synchronous belt is used to connect the third synchronous pulley and the fourth synchronous pulley. The fourth synchronous pulley is rotatably mounted on the bearing plate 1041, and the third synchronous pulley is sleeved on the rotating shaft of the third motor 1042. The third motor 1042 is used to drive the third synchronous pulley to rotate, so as to drive the second synchronous belt to move, so as to achieve the purpose of controlling the movement of the driving plate 1043. Such a setting can accurately control the moving distance of the driving plate 1043 to ensure that the cartridge 102 is blanked to the plug-in portion. In some other embodiments, the blanking assembly 104 includes a second linear motor. The second linear motor is mounted below the bearing plate 1041, and the mover of the second linear motor is connected to the driving plate 1043, and is used to drive the driving plate 1043 to move along the length direction of the bearing plate 1041.

[0071] Further, in this embodiment, the semiconductor chip packaging and mounter further includes a thimble module 16 and a swing arm module 17. The thimble module 16 is mounted on the frame and is used to eject the semiconductor chips on the chip loading module 13. The swing arm module 17 is mounted on the frame and is used to transfer the semiconductor chips ejected by the thimble module 16 to the correction module 14.

[0072] The above are only the optional embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A semiconductor chip packaging and pasting machine, characterized in that, Including: A frame provided with a chip loading station, a correction station, and a chip mounting station. The chip loading station is used to place semiconductor chips, the correction station is used to adjust the position and angle of the semiconductor chips, and the chip mounting station is used to mount the semiconductor chips; Two fixture storage modules are installed on the frame at intervals. The fixture storage module is used to store fixtures. The fixture storage module includes a cartridge rack, a plurality of cartridges, a loading component, and an unloading component. A plurality of the fixtures are evenly spaced along the height direction of the cartridge and placed in the cartridge. A plurality of the cartridges are installed on the cartridge rack, and the plurality of cartridges are distributed in sequence along the height direction of the cartridge rack. The loading component is installed on the cartridge rack and is used to move the fixtures in the cartridge to the transfer module. The unloading component is used to output the cartridge located inside the cartridge rack outward. One of the fixtures is used to place a plurality of socket bases; A transfer module is installed on the frame and located between the two fixture storage modules. The transfer module is used to move the fixtures located in the fixture storage module to the chip mounting station, and the chip mounting station is used to mount the semiconductor chips on the socket bases; And The moving process of the transfer module includes: when the transfer module moves the fixture from the chip mounting station to the fixture storage module at the left end, it moves the fixture of the fixture storage module at the right end to the chip mounting station, and when the transfer module moves the fixture from the chip mounting station to the fixture storage module at the right end, it moves the fixture inside the fixture storage module at the left end to the chip mounting station; Among them, the loading component includes a lead screw, a nut seat, a second cylinder, and a second motor. The cartridge rack is provided with a loading part. The lead screw is rotatably installed on the cartridge rack and extends along the length direction of the cartridge rack. The second motor is installed on the cartridge rack and is drivingly connected to the lead screw. The nut seat is rotatably sleeved on the lead screw. A convex plate is provided on the nut seat. The cartridge is provided with a clamping groove. The convex plate extends into the clamping groove to fix the nut seat and the cartridge. The second cylinder is installed on the cartridge rack, and the push rod of the second cylinder abuts against the fixture inside the cartridge; The nut seat inserts the cartridge located in the loading part through the convex plate, and the second cylinder pushes the lowermost fixture in the cartridge out to the transfer module. After all the socket bases on the fixture are mounted with the semiconductor chips, they are moved back into the cartridge through the transfer module. When the cartridge recovers each fixture, the second motor drives the cartridge to move downward a preset distance until all the socket bases on the fixtures in the cartridge are mounted with the semiconductor chips. The second motor moves the cartridge to the unloading component and then outputs the cartridge outward.

2. The semiconductor chip packaging and pasting machine according to claim 1, wherein, The transfer module includes: Transfer platform, track body. The track body includes a first side plate and a second side plate arranged oppositely. The first side plate is installed on the transfer platform, and the second side plate is detachably connected to the first side plate. A through groove is provided between the first side plate and the second side plate, and the through groove is used for the fixture to move. A plurality of socket holders for placing chips are arranged on the fixture; Drive assembly, installed on the transfer platform and spaced from the track body; and First cylinder, fixing member. The first cylinder is drivingly connected to the drive assembly, the push rod of the first cylinder is connected to the fixing member, the fixing member is arranged above the through groove, and the fixing member is used for connecting the fixture entering the through groove. The drive assembly is used for driving the fixing member to move along the length direction of the through groove.

3. The semiconductor chip packaging and pasting machine according to claim 1, characterized in that, The semiconductor chip packaging and mounter further includes: Chip loading module, installed at the chip loading station; Correction module, installed at the correction station. The chip loading module is used for placing the semiconductor chip onto the correction module, and the correction module is used for correcting the position and angle of the semiconductor chip; Soldering head module, installed at the chip mounting station. The soldering head module is used for mounting the semiconductor chip located on the correction module onto the socket holder; Two dispensing modules, installed on the frame at intervals. The dispensing module is used for dispensing glue to a plurality of socket holders on the fixture; and Vacuum assembly, installed on the frame. The vacuum assembly is respectively connected to the chip loading module, the correction module and the soldering head module, and the vacuum assembly is used for providing a vacuum air source; The dispensing module can detect all the socket holders on the fixture. When the transfer module moves the fixture below the dispensing module, the dispensing module performs a dispensing operation every time it detects a socket holder. After all the socket holders on the fixture have completed the dispensing operation, the transfer module moves the fixture to the chip mounting station.

4. The semiconductor chip packaging and pasting machine according to claim 3, characterized in that, The correction module includes a correction platform, a first motor, a rotating shaft, a first moving component and a first vision component. The correction platform is installed on the first moving component, the first moving component is installed on the frame, and the moving component is used for controlling the horizontal movement of the correction platform. The first motor is installed on the correction platform, the rotating shaft is rotatably installed on the correction platform and is drivingly connected to the first motor. The upper end of the rotating shaft is used for placing the semiconductor chip, and the first vision component is installed on the frame and is located above the rotating shaft.

5. The semiconductor chip packaging and pasting machine according to claim 4, wherein, The correction module further includes an air intake pipe. One end of the air intake pipe is sleeved on the lower end of the rotating shaft. The end of the rotating shaft is provided with a first adsorption hole, and the first adsorption hole penetrates through the rotating shaft. The air intake pipe is communicated with the first adsorption hole, and the other end of the air intake pipe is connected to the vacuum assembly. The first adsorption hole is used for adsorbing the semiconductor chip; The first vision component acquires the position information of the rotating shaft. A semiconductor chip is placed at the upper end of the rotating shaft. The correction platform is moved to below the first vision component by the first moving component, so that the axis of the rotating shaft is collinear with the axis of the first vision component, so that for the semiconductor chip, the first vision component then acquires the angle of the semiconductor chip on the rotating shaft, and the rotating shaft is controlled by the first motor to rotate a certain angle, so that the placement angle of the semiconductor chip is consistent with the preset angle.

6. The semiconductor chip packaging and pasting machine according to claim 3, wherein, The bonding head module includes a first base, a flat motor, a second moving component, a suction head and a second vision component. The first base is installed at the chip mounting station. The second moving component is installed on the first base. The flat motor is installed on the second moving component. The second moving component is used to control the flat motor to move in the horizontal direction and the height direction. The suction head is installed on the mover of the flat motor. The suction head is provided with a second suction hole, and the second suction hole is communicated with the vacuum component. The second suction hole is used to suck the semiconductor chip. The second vision component is installed on the frame and is located above the chip mounting station. The second vision component is used to detect whether the semiconductor chip is normally mounted on the socket.

7. The semiconductor chip packaging and pasting machine according to claim 6, wherein, The bonding head module further includes a reverse detection component. The reverse detection component includes a detection lens and a second base. The second base is installed on the frame, and the detection lens is installed on the second base, and the detection lens is arranged upward. After the position and angle of the semiconductor chip are corrected by the correction module, the second moving component controls the flat motor to move above the semiconductor chip. The flat motor extends out a push rod, sucks the semiconductor chip through the suction head, and then translates the semiconductor chip to above the detection lens through the second moving component. The detection lens is used to detect whether the correction module corrects the semiconductor chip to the preset angle. If the correction is successful, the semiconductor chip is moved to above the socket after dispensing is completed by the second moving component for mounting. If the correction fails, the semiconductor chip is moved to above the correction module by the second moving component, and the flat motor returns the semiconductor chip to the correction module for correction again until the detection lens detects that the semiconductor chip is corrected to the preset angle, and then the semiconductor chip is mounted on the socket after dispensing is completed.

8. The semiconductor chip packaging and pasting machine according to claim 1, wherein The blanking component includes a carrier plate, a third motor and a driving plate. The driving plate is movably installed on the carrier plate. The third motor is installed on the carrier plate, and the third motor is used to drive the driving plate to move along the length direction of the carrier plate. A plurality of insertion parts are arranged on the driving plate, and the plurality of insertion parts are evenly spaced along the length direction of the driving plate. The insertion parts are used to place the material box. After the socket bases on all the jigs in the cartridge are mounted with the semiconductor chips, the second motor moves the cartridge to the insertion part. Whenever a cartridge is placed in an insertion part, the third motor drives the drive plate to move a preset distance, so as to move the insertion part without a cartridge below the loading part.

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