Wafer carrier

Abstract

This invention relates to the field of semiconductor technology and discloses a wafer carrier device. The wafer carrier device includes a tray, an anti-disk assembly, and a driving component. The tray has a placement groove for accommodating the wafer, and an annular boss is provided on the side of the tray opposite to the placement groove. A groove is provided on the inner side of the annular boss. The anti-disk assembly is disposed on the side of the tray opposite to the placement groove. A fluid channel is provided within the anti-disk assembly, and at least three locking members are movably disposed within the fluid channel, evenly spaced around the placement groove. The driving component drives the anti-disk assembly and the tray to rotate. When the anti-disk assembly and the tray rotate, the locking members can move to the end of the fluid channel and engage with the groove. The anti-disk assembly of this invention effectively prevents the tray from detaching from the anti-disk assembly during rotation, while ensuring the concentricity of the tray relative to the anti-disk assembly, resulting in more reliable and precise wafer carrier support.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a wafer carrier device. Background Technology

[0002] For wafer processing, wafers are typically placed on wafer trays, then transferred to a reaction chamber and placed on a tray support cylinder before subsequent processing steps. Some processes require high-speed wafer rotation (600 RPM-1000 RPM). However, during rotation, the wafer tray is prone to "flying disc" phenomena due to centrifugal force, problems with the rotating mechanism, etc., resulting in inverted fragments, losses, and production disruptions. Furthermore, high-speed rotation can also cause wafer eccentricity, affecting positioning in subsequent processing.

[0003] Therefore, there is an urgent need for a wafer carrier device to solve the above problems. Summary of the Invention

[0004] Based on the above, the purpose of this invention is to provide a wafer carrier device that provides more reliable and precise wafer carrying.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] Wafer carrier device, including:

[0007] A tray is provided with a placement groove for accommodating wafers. An annular boss is provided on the side of the tray opposite to the placement groove, and a groove is provided on the inner side of the annular boss.

[0008] An anti-flying disc assembly is disposed on the side of the tray opposite to the placement groove. The anti-flying disc assembly is provided with a fluid channel, and at least three snap-fit ​​members are movably disposed in the fluid channel. The at least three snap-fit ​​members are evenly spaced around the circumference of the placement groove.

[0009] A driving component is used to drive the anti-flying disc assembly and the tray to rotate;

[0010] When the anti-flying disc assembly and the tray rotate, the snap-fit ​​can move to the end of the fluid channel and snap into the groove.

[0011] As a preferred embodiment of a wafer carrier device, the anti-flying disc assembly includes a support cylinder connected to the tray, the support cylinder having a first flow channel and a second flow channel that are interconnected, and the snap-fit ​​component being disposed within the first flow channel.

[0012] As a preferred embodiment of a wafer carrier device, the first flow channel is inclined upward toward the circumferential outer side of the support cylinder.

[0013] As a preferred embodiment of a wafer carrier device, the first flow channel penetrates the inner wall of the support cylinder, and the anti-flying disc assembly further includes a blind plug that can block the first flow channel from the inner side of the support cylinder.

[0014] As a preferred embodiment of a wafer carrier device, the anti-flying disc assembly further includes a carrier disk and a rotating shaft. One side of the carrier disk is connected to the support cylinder, and the other side is connected to the rotating shaft. The carrier disk is provided with a third flow channel communicating with the second flow channel, and the rotating shaft is provided with a fourth flow channel communicating with the third flow channel.

[0015] As a preferred embodiment of the wafer carrier device, the wafer carrier device further includes a mounting base assembly, the mounting base assembly comprising:

[0016] The housing has a rotating shaft passing through it, and the tray, support cylinder, and carrier plate are all disposed within the housing.

[0017] A base is fitted onto the outside of the rotating shaft, and one end of the base can be connected to the housing;

[0018] A cover is disposed at one end of the base away from the housing, and the cover is provided with an air hole communicating with the fourth flow channel.

[0019] As a preferred embodiment of a wafer carrier device, the housing is provided with a first through hole, the carrier tray is provided with a second through hole communicating with the first through hole, the second through hole communicating with the cavity enclosed by the support cylinder and the tray, and the side wall of the support cylinder is provided with a third through hole communicating with the cavity.

[0020] As a preferred embodiment of a wafer carrier device, a first magnetohydrodynamic seal is provided between the rotating shaft and the cover.

[0021] As a preferred embodiment of a wafer carrier device, the wafer carrier device further includes a gas supply component, which is connected to the fluid channel and can drive the snap-fit ​​component to move.

[0022] As a preferred embodiment of a wafer carrier device, the anti-flying disc assembly is hollow, and a heating element is provided on the inner side of the hollow anti-flying disc assembly.

[0023] The beneficial effects of this invention are as follows:

[0024] This invention utilizes a placement groove on a tray to support the wafer; a driving component to rotate the tray and the anti-flying disc assembly; and the anti-flying disc assembly, during rotation, effectively prevents the tray from detaching from the assembly and ensures concentricity between the tray and the assembly. Specifically, a groove is provided inside the annular boss of the tray, and at least three locking elements are evenly spaced around the circumference of the tray within the fluid channel of the anti-flying disc. These locking elements engage with the groove during rotation of the anti-flying disc assembly and the tray, making the support more reliable and effectively preventing tray breakage due to detachment from the anti-flying disc assembly, reducing losses and ensuring production. Simultaneously, the three locking elements effectively reduce tray eccentricity caused by rotation, further ensuring concentricity between the tray and the anti-flying disc assembly and resulting in more precise support. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0026] Figure 1 This is a cross-sectional view of the wafer carrier device provided in a specific embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the tray of the wafer carrier device provided in a specific embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of the support cylinder of the anti-flying disk assembly of the wafer carrier device provided in a specific embodiment of the present invention. Figure 1 ;

[0029] Figure 4 This is a schematic diagram of the support cylinder of the anti-flying disk assembly of the wafer carrier device provided in a specific embodiment of the present invention. Figure 2 ;

[0030] Figure 5 This is a schematic diagram of the carrier disk of the anti-flying disk assembly of the wafer carrier device provided in a specific embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram showing the connection between the anti-flying disk component and the gas supply component of the wafer carrier device provided in a specific embodiment of the present invention.

[0032] In the picture:

[0033] 100. Wafer;

[0034] 1. Tray; 11. Placement groove; 12. Annular boss; 13. Groove;

[0035] 2. Anti-flying disc assembly; 21. Snap-fit ​​component; 22. Support cylinder; 221. First flow channel; 222. Second flow channel; 223. Third through hole; 23. Blind plug; 24. Carrier plate; 241. Third flow channel; 242. Second through hole; 243. Toothed structure; 25. Rotating shaft; 251. Fourth flow channel;

[0036] 3. Fixing base assembly; 31. Housing; 311. First through hole; 312. Cavity; 32. Seat body; 33. Cover body; 331. Vent; 34. Protective cylinder;

[0037] 41. First magnetohydrodynamic seal; 42. Second magnetohydrodynamic seal;

[0038] 5. Heating element;

[0039] 6. Gas supply unit; 61. First switching valve; 62. Second switching valve; 63. Third switching valve; 64. First pressure gauge; 65. Second pressure gauge; 66. Third pressure gauge. Detailed Implementation

[0040] Embodiments of the present invention are described in detail below. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0041] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0042] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to fixed connections or detachable connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and connections within two components or interactions between two components. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0043] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0044] like Figures 1-6 As shown, this embodiment provides a wafer carrier device, which includes a tray 1, an anti-flying disc assembly 2, and a driving component. The tray 1 is provided with a placement groove 11 for accommodating a wafer 100. An annular boss 12 is provided on the side of the tray 1 away from the placement groove 11, and a groove 13 is provided on the inner side of the annular boss 12. The anti-flying disc assembly 2 is disposed on the side of the tray 1 away from the placement groove 11. A fluid channel is provided in the anti-flying disc assembly 2, and at least three snap-fit ​​members 21 are movably disposed in the fluid channel. The at least three snap-fit ​​members 21 are evenly spaced around the placement groove 11. The driving component is used to drive the anti-flying disc assembly 2 and the tray 1 to rotate. When the anti-flying disc assembly 2 and the tray 1 rotate, the snap-fit ​​members 21 can move to the end of the fluid channel and engage with the groove 13.

[0045] A groove 11 is provided on the tray 1 to support the wafer 100; a drive component is provided to rotate the tray 1 and the anti-flying disc assembly 2; the anti-flying disc assembly 2 effectively prevents the tray 1 from detaching from the anti-flying disc assembly 2 during rotation, and also helps to ensure the concentricity of the tray 1 and the anti-flying disc assembly 2. Specifically, a groove 13 is provided on the inner side of the annular boss 12 of the tray 1, and at least three locking members 21 are provided in the fluid channel of the anti-flying disc, evenly spaced relative to the circumference of the tray 1. The locking members 21 can engage with the groove 13 when the anti-flying disc assembly 2 and the tray 1 rotate, making the support more reliable and effectively preventing the tray 1 from detaching from the anti-flying disc assembly 2 and causing the tray to break, reducing losses and ensuring production; at the same time, the three locking members 21 can effectively reduce the eccentricity of the tray 1 caused by rotation, thereby ensuring the concentricity of the tray 1 and the anti-flying disc assembly 2, making the support more accurate.

[0046] It is worth noting that, such as Figure 2As shown, the placement groove 11, tray 1, and anti-flying disc assembly 2 are all coaxially arranged, and the shape of the placement groove 11 is adapted to the wafer 100, so that the tray 1 and anti-flying disc assembly 2 will not be eccentric during rotation, making the rotation more stable. In this embodiment, six locking members 21 are provided to ensure stable locking of the tray 1 and to ensure the concentricity of the tray 1 and the anti-flying disc assembly 2.

[0047] As an alternative solution for wafer carrier devices, such as Figure 1 and Figure 3 As shown, the anti-flying disc assembly 2 includes a support cylinder 22 connected to the lower part of the tray 1. The support cylinder 22 is a hollow cylinder, and the inner wall of the support cylinder 22 is provided with a first flow channel 221 and a second flow channel 222 that are interconnected. The first flow channel 221 and the second flow channel 222 together form a fluid channel. The second flow channel 222 extends along the axial direction of the support cylinder 22, with one end extending to the end face of the support cylinder 22 away from the tray 1, and the other end communicating with the first flow channel 221. The first flow channel 221 and the second flow channel 222 are set at an angle and extend to the outer wall of the support cylinder 22. The end of the first flow channel 221 away from the second flow channel 222 communicates with the groove 13. A snap-fit ​​member 21 is disposed in the first flow channel 221 and can move along the first flow channel 221, so that when the anti-flying disc assembly 2 rotates, the snap-fit ​​member 21 can move along the first flow channel 221 to the position of snapping with the groove 13 to achieve snapping with the tray 1.

[0048] It is worth noting that the snap-fit ​​component 21 can be configured as a sphere, and correspondingly, the groove 13 is configured as an arc shape adapted to the radius of the sphere. Regarding the snap-fit ​​component 21 being able to move along the first flow channel 221 to the position where it snaps into the groove 13 when the anti-flying disc assembly 2 rotates, the driving force of the snap-fit ​​component 21 can be centrifugal force, or it can be driven by pressure through the injection of fluid into the fluid channel, or a combination of centrifugal force and pressure can be used simultaneously.

[0049] When pressure is required to drive the connector 21, the wafer carrier also includes a gas supply unit 6, which is connected to a fluid channel. The gas supply unit 6 can inject gas with a certain pressure into the fluid channel to drive the connector 21 to move.

[0050] Preferably, such as Figure 4 As shown, the first flow channel 221 is inclined upwards towards the circumferential outer side of the support cylinder 22. This arrangement serves two purposes: firstly, it guides the snap-fit ​​member 21 as it moves towards the groove 13 under centrifugal force; secondly, it facilitates the snap-fit ​​member 21's disengagement from the groove 13 by gravity when the anti-flying disc assembly 2 stops rotating. For example, the angle between the outer sides of the first flow channel 221 and the second flow channel 222 is α, which can be between 100° and 130°.

[0051] Of course, in order to ensure that the snap-fit ​​21 can more reliably disengage from the groove 13, the gas supply unit 6 can also extract gas from the fluid channel to drive the snap-fit ​​21 to move to the position where it is disengaged from the groove 13, so as to facilitate the picking and placing of the tray 1.

[0052] In this embodiment, to facilitate the processing of the first flow channel 221, the first flow channel 221 penetrates the inner wall of the support cylinder 22. To ensure the reliability and stability of the pressure of the gas supply component 6 on the snap-fit ​​component 21, the anti-flying disc assembly 2 also includes a blind plug 23. The blind plug 23 can block the first flow channel 221 and the inner side of the support cylinder 22, effectively preventing the gas in the first flow channel 221 from entering the inner side of the support cylinder 22 through the inner wall of the support cylinder 22, thus preventing the drive of the snap-fit ​​component 21 from being achieved.

[0053] Furthermore, if Figure 1 and Figure 5 As shown, the anti-flying disc assembly 2 also includes a carrier plate 24 and a rotating shaft 25. One side of the carrier plate 24 is connected to the support cylinder 22, and the other side is connected to the rotating shaft 25. A drive unit can drive the rotating shaft 25 to rotate. The carrier plate 24 is provided with a third flow channel 241 communicating with the second flow channel 222, and the rotating shaft 25 is provided with a fourth flow channel 251 communicating with the third flow channel 241. The carrier plate 24 and the rotating shaft 25 are sealed to ensure the airtightness of the fluid between the second flow channel 222 and the third flow channel 241. Gas supplied by the gas supply unit 6 can sequentially pass through the fourth flow channel 251, the third flow channel 241, the second flow channel 222, and the first flow channel 221 to drive the snap-fit ​​component 21.

[0054] As an alternative solution for wafer carrier devices, such as Figure 1 As shown, to achieve the installation and fixation of tray 1 and anti-flying disc assembly 2, the wafer carrier device includes a fixing base assembly 3, on which tray 1 and anti-flying disc assembly 2 are disposed. The fixing base assembly 3 includes a housing 31, a seat 32, and a cover 33 arranged sequentially from top to bottom. The rotating shaft 25 passes through the housing 31, and tray 1, support cylinder 22, and carrier plate 24 are all disposed inside the housing 31. The seat 32 is sleeved on the outside of the rotating shaft 25, and one end of the seat 32 can be connected to the housing 31. The cover 33 is disposed at the end of the seat 32 away from the housing 31, and the cover 33 is provided with a vent 331 communicating with the fourth flow channel 251. The gas supply unit 6 can realize the extraction and gas supply of the fluid channel through the vent 331.

[0055] Furthermore, a toothed structure 243 is provided on the side of the carrier disk 24 connected to the housing 31, and correspondingly, a toothed structure 243 is also provided on the side of the housing 31 connected to the carrier disk 24. By providing the toothed structure 243, the gas flow resistance between the carrier disk 24 and the housing 31 is increased, ensuring the seal between the carrier disk 24 and the housing 31.

[0056] Preferably, a first magnetohydrodynamic seal 41 is provided between the rotating shaft 25 and the cover 33. By providing the first magnetohydrodynamic seal 41, the seal between the vent 331 and the fourth flow channel 251 can be effectively ensured when the rotating shaft 25 rotates relative to the cover 33.

[0057] Specifically, to ensure the balance of internal pressure when the anti-flying disc assembly 2 rotates, a first through hole 311 is provided on the housing 31, and a second through hole 242 communicating with the first through hole 311 is provided on the carrier plate 24. The second through hole 242 communicates with the cavity 312 enclosed by the support cylinder 22 and the tray 1. A third through hole 223 communicating with the cavity 312 is provided on the side wall of the support cylinder 22. Exemplarily, the second through hole 242 extends axially along the carrier plate 24, and the third through hole 223 extends radially along the support cylinder 22 and penetrates the side wall of the support cylinder 22.

[0058] It is worth noting that the first through hole 311, the second through hole 242, the third through hole 223 and the cavity 312 are filled with a slightly positive pressure inert gas, which can effectively reduce the reaction with the process gas of wafer 100 processing.

[0059] In this embodiment, the fixing base assembly 3 further includes a protective cylinder 34, which is sleeved on the outside of the support cylinder 22 and positioned outside the annular boss 12 of the tray 1. One end of the protective cylinder 34 is connected to the housing 31, and the other end is spaced apart from the tray 1. Gas can enter between the protective cylinder 34 and the support cylinder 22 through the third through hole 223. Correspondingly, an air extraction device can also be provided above the housing 31 to extract the gas between the protective cylinder 34 and the support cylinder 22 in a timely manner.

[0060] Preferably, gas passing through the first through hole 311 can enter between the rotating shaft 25 and the seat 32, preventing gas leakage through the seat 32. A second magnetohydrodynamic seal 42 is provided between the rotating shaft 25 and the seat 32, so that gas passing through the first through hole 311 can only enter the second through hole 242 of the carrier 24, ensuring the sealing between the relatively rotating rotating shaft 25 and the seat 32.

[0061] As an optional solution for the wafer carrier device, the anti-flying disc assembly 2 is hollow, and a heating element 5 is provided on the inner side of the hollow anti-flying disc assembly 2 to ensure that the wafer carrier device can have a suitable temperature for wafer 100 processing. Accordingly, the heating element 5 is T-shaped, and the lower end of the T-shaped heating element 5 passes through the cover 33.

[0062] Furthermore, such as Figure 6As shown, a first switching valve 61, a second switching valve 62, and a third switching valve 63 are also provided between the wafer carrier device and the gas supply unit 6. Correspondingly, a first pressure gauge 64 is provided for the first switching valve 61, a second pressure gauge 65 is provided for the second switching valve 62, and a third pressure gauge 66 is provided for the third switching valve 63. The first switching valve 61 is used to control the fluid channel to be connected to the atmosphere, the second switching valve 62 is used to keep the fluid channel under negative pressure, and the third switching valve 63 is used to keep the fluid channel under positive pressure.

[0063] The above-mentioned wafer carrier device is used as follows: Before the tray 1 is placed on the anti-flying disc assembly 2, the pressure in the fluid channel and the cavity 312 is the same. Due to gravity, the snap-fit ​​component 21 is positioned at the lowest point of the first flow channel 221 and disengages from the groove 13. At this time, the first switch valve 61 is open, and the second switch valve 62 and the third switch valve 63 are closed. The pressure value can be observed through the first pressure gauge 64. After the tray 1 is placed on the anti-flying disc assembly 2, the first switch valve 61 is closed, the third switch valve 63 is opened, a small amount of gas is introduced into the fluid channel, and the positive pressure value is observed through the third pressure gauge 66. The pressure in the fluid channel can be calculated according to F1 = Δps, where Δp represents the pressure difference; s represents the cross-sectional area of ​​the snap-fit ​​component 21 to ensure that the snap-fit ​​component 21 can move within the first flow channel 221 to snap into the groove 13. The driving component drives the tray 1 and the anti-flying disc assembly 2 to begin accelerating rotation. During rotation, the locking component 21 is subjected to centrifugal force (ignoring the friction between the locking component 21 and the first flow channel 221). The centrifugal force of the locking component 21 is: F2 = mw2 rcos(a-90°), where m represents the mass of the locking component 21. Centrifugal force can increase the pressure of the positive pressure gas to a certain extent. At this time, the force formula of the locking component 21 is: F 总 =F1+F2-mgcos(180°-a) to ensure that the snap fastener 21 can contact or have a slight gap with the groove 13 arc surface of the tray 1. At this time, the position of the snap fastener 21 can not only limit the tray 1 from flying out, but also, because at least three snap fasteners 21 are evenly arranged in the circumference of the tray 1, the concentricity of the tray 1 and the anti-flying disc assembly 2 can be limited, ensuring that the tray 1 still has a good concentricity with the anti-flying disc assembly 2 during rotation.

[0064] After wafer 100 is processed, the drive unit begins to decelerate. As the speed decreases, the positive pressure in the fluid channel is gradually reduced. When tray 1 and anti-flying disc assembly 2 stop rotating, the positive pressure value is the same as the pressure in cavity 312 at this time. The third switch valve 63 is closed, the first switch valve 61 remains closed, and the second switch valve 62 is opened to begin evacuating air from the fluid channel until the negative pressure value in the fluid channel is slightly lower than the pressure in cavity 312. This ensures that the latching member 21 moves to the lowest point of the first flow channel 221 due to the pressure difference on both sides. When the pressure on the second pressure gauge 65 increases, the second switch valve 62 is closed, and the first switch valve 61 is opened. At this time, the pressure in the fluid channel is the same as the pressure in cavity 312, and the latching member 21 is at the lowest point of the first flow channel 221, allowing tray 1 to be removed, completing the entire wafer 100 processing procedure.

[0065] The above description is only a preferred embodiment of the present invention. For those skilled in the art, there will be changes in the specific implementation and application scope based on the ideas of the present invention. The content of this specification should not be construed as a limitation of the present invention.

Claims

1. A wafer carrier device, characterized in that, include: A tray (1) is provided with a placement groove (11) for accommodating a wafer (100). An annular boss (12) is provided on the side of the tray (1) away from the placement groove (11). A groove (13) is provided on the inner side of the annular boss (12). An anti-flying disc assembly (2) is disposed on the side of the tray (1) away from the placement groove (11). The anti-flying disc assembly (2) includes a support cylinder (22) connected to the tray (1). The support cylinder (22) is provided with a first flow channel (221) and a second flow channel (222) that are interconnected. The first flow channel (221) and the second flow channel (222) form a fluid channel. The second flow channel (222) extends along the axial direction of the support cylinder (22), with one end extending to the end face of the support cylinder (22) away from the tray, and the other end communicating with the first flow channel (221). At least three snap-fit ​​pieces (21) are movably disposed in the fluid channel. The at least three snap-fit ​​pieces (21) are evenly spaced in the circumferential direction of the placement groove (11). The snap-fit ​​pieces (21) are disposed in the first flow channel (221). The first flow channel (221) is inclined upward toward the circumferential outer side of the support cylinder (22). A driving component for driving the anti-flying disc assembly (2) and the tray (1) to rotate; When the anti-flying disc assembly (2) and the tray (1) rotate, the snap-fit ​​(21) can move to the end of the fluid channel and snap into the groove (13).

2. The wafer carrier device according to claim 1, characterized in that, The first flow channel (221) penetrates the inner wall of the support cylinder (22), and the anti-flying disc assembly (2) also includes a blind plug (23), which can block the first flow channel (221) and the inner side of the support cylinder (22).

3. The wafer carrier device according to claim 1, characterized in that, The anti-flying disc assembly (2) further includes a carrier plate (24) and a rotating shaft (25). One side of the carrier plate (24) is connected to the support cylinder (22), and the other side is connected to the rotating shaft (25). The carrier plate (24) is provided with a third flow channel (241) communicating with the second flow channel (222). The rotating shaft (25) is provided with a fourth flow channel (251) communicating with the third flow channel (241).

4. The wafer carrier device according to claim 3, characterized in that, The wafer carrier further includes a mounting base assembly (3), which comprises: The housing (31) has the rotating shaft (25) passing through it, and the tray (1), the support cylinder (22) and the carrier plate (24) are all disposed inside the housing (31). A seat (32) is fitted onto the outside of the rotating shaft (25), and one end of the seat (32) can be connected to the housing (31); A cover (33) is disposed at one end of the base (32) away from the housing (31), and the cover (33) is provided with an air hole (331) communicating with the fourth flow channel (251).

5. The wafer carrier device according to claim 4, characterized in that, The housing (31) is provided with a first through hole (311), the carrier plate (24) is provided with a second through hole (242) communicating with the first through hole (311), the second through hole (242) communicating with the cavity (312) enclosed by the support cylinder (22) and the tray (1), and the side wall of the support cylinder (22) is provided with a third through hole (223) communicating with the cavity (312).

6. The wafer carrier device according to claim 4, characterized in that, A first magnetohydrodynamic seal (41) is provided between the rotating shaft (25) and the cover (33).

7. The wafer carrier device according to any one of claims 1-6, characterized in that, The wafer carrier device further includes a gas supply unit (6), which is connected to the fluid channel and can drive the snap-fit ​​member (21) to move.

8. The wafer carrier device according to any one of claims 1-6, characterized in that, The anti-flying disc assembly (2) is hollow, and a heating element (5) is provided on the inner side of the hollow anti-flying disc assembly (2).

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