Electronic devices and heat dissipation components
By designing a condenser of multi-layer thermal conduction plates in electronic devices, a condenser space and liquid-cooled space are formed, which solves the problem of excessive thermal resistance in the open thermosiphon heat dissipation system, and effectively dissipates the heat source for high heat dissipation needs.
CN115443025BActive Publication Date: 2025-06-06INVENTEC PUDONG TECH CORPOARTION +1
Patent Information
- Application Number
- CN202110614779.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-06-02
- Publication Date
- 2025-06-06
- Estimated Expiration
- 2041-06-02
Smart Images
Figure CN115443025B_ABST
Abstract
The present invention discloses an electronic device and a heat dissipation component. The electronic device is used to connect to an external heat dissipation device and includes a housing, a heat source and a heat dissipation component. The heat source is arranged in the housing. The heat dissipation component includes an evaporator and a condenser. The evaporator is in thermal contact with the heat source. The condenser is arranged in the housing and includes a first heat conduction plate, a second heat conduction plate and a third heat conduction plate stacked in sequence. A condensation space is formed between the first heat conduction plate and the second heat conduction plate. A first liquid cooling space is formed between the second heat conduction plate and the third heat conduction plate. The condensation space is connected to the evaporator. The first liquid cooling space is not connected to the condensation space and is used to connect to the external heat dissipation device.
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Citation Information
Patent Citations
Combined condensor and evaporator
CN105008850A
Water-cooling type condenser
CN112513543A
Computer system and composite heat dissipation system
CN112822906A