A semiconductor circuit and an electronic control board integrating two inverter modules

Abstract

The present invention relates to a semiconductor circuit and an electronic control board integrating two inverter modules. There are two inverter circuits inside the semiconductor circuit. The semiconductor circuit is square. A first heat dissipation surface, a second heat dissipation surface opposite to the first one, a third heat dissipation surface connecting these two heat dissipation surfaces, and a sealing surface where the sealing layer is located are provided outside the semiconductor circuit. The pins of the semiconductor circuit include a first pin group and a second pin group arranged oppositely. The first pin group and the second pin group are respectively led out from opposite first sealing surface and second sealing surface in the sealing surface. Compared with the flat-shaped semiconductor circuit in the prior art, the semiconductor circuit of the present invention is square and has three mutually connected heat dissipation surfaces, so that when the semiconductor circuit is installed in a controller, the surface area it occupies on the PCB board is greatly reduced, which is beneficial to the miniaturization of the controller. Moreover, the total area of the three heat dissipation surfaces can be larger than the area of a single existing heat dissipation surface, thereby improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present invention relates to a semiconductor circuit and an electronic control board integrating two inverter modules, and belongs to the technical field of semiconductor circuit applications. Background Art

[0002] A semiconductor circuit is a power drive product that combines power electronics and integrated circuit technologies. Generally, the exterior of a semiconductor circuit is encapsulated with a resin material formed by injection molding to form a sealing layer, which seals a circuit board and electronic components formed on a substrate, and pins extend from one side or both sides of the sealing layer. Existing semiconductor circuits generally only integrate a single inverter module, and a small number integrate multiple inverter modules, all in the form of a planar structure with only one heat dissipation surface. For a semiconductor circuit integrating multiple inverter modules, due to a sudden increase in heat generation, this planar internal structure increases the area of the semiconductor circuit and has low heat dissipation efficiency, and the large heat generation during operation brings reliability problems. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to solve the problems of excessive area and large heat generation of existing semiconductor circuits integrating multiple inverter modules.

[0004] Specifically, the present invention discloses a semiconductor circuit integrating two inverter modules. There are two inverter circuits inside the semiconductor circuit. The semiconductor circuit is square. There are a first heat dissipation surface, a third heat dissipation surface opposite to each other, a second heat dissipation surface connecting these two heat dissipation surfaces, and a sealing surface where the sealing layer is located outside the semiconductor circuit.

[0005] The pins of the semiconductor circuit include a first pin group and a second pin group arranged oppositely. Among them, the first pin group and the second pin group respectively include the control and output pins of the two inverter circuits, and the first pin group and the second pin group respectively extend from the first sealing surface and the second sealing surface opposite to each other in the sealing surface.

[0006] Optionally, the semiconductor circuit is provided with a frame body and a circuit board assembly, where:

[0007] The frame body includes a first frame, a second frame, and a third frame connected in sequence. The first frame and the third frame are arranged oppositely. The first frame, the second frame, and the third frame are respectively provided with a first mounting hole, a second mounting hole, and a third mounting hole. The circuit board assembly includes a first to a third circuit board respectively installed in the first to the third mounting holes. The outer sides of the first circuit board, the second circuit board, and the third circuit board respectively form a first heat dissipation surface, a second heat dissipation surface, and a third heat dissipation surface.

[0008] Optionally, at least the opposite inner sides of the first to third frames are respectively provided with frame grooves penetrating in the thickness direction thereof, and buckling grooves recessed from the outer surface thereof are respectively provided at the relative positions of the sides of the first to third circuit boards with respect to the frame grooves.

[0009] Optionally, two inverter circuits are respectively provided on the first circuit board and the second circuit board, and a rectifier circuit and a PFC circuit are provided on the third circuit board.

[0010] Optionally, the first pin group is connected to the first circuit board, a part of the pins in the second pin group are connected to the second circuit board, the remaining pins in the second pin group are connected to the third circuit board, a drive circuit is further provided on the third circuit board, and the operating current and voltage of the inverter circuit provided on the first circuit board are higher than those of the inverter circuit provided on the third circuit board.

[0011] Optionally, the pins in the first pin group and the second pin group are both bent, the bent portions of these pins are arranged in the sealing layer, and the extending ends of these pins are located in the middle of the sealing surface.

[0012] Optionally, the first circuit board, the second circuit board, and the third circuit board respectively include a metal base material, an insulating layer, a circuit wiring layer, and electronic components mounted on the circuit wiring layer, which are sequentially connected, and bonding wires connected between the electronic components.

[0013] Optionally, an auxiliary heat sink is further provided between the circuit wiring layer and the electronic components.

[0014] The present invention also provides an electronic control board, which includes an upper electronic control board and a lower electronic control board arranged up and down, and a semiconductor circuit according to any one of claims 1 to 8 arranged between the upper electronic control board and the lower electronic control board. The first pin group and the second pin group are respectively connected to the upper electronic control board and the lower electronic control board. The electronic control board further includes a heat sink arranged between the upper electronic control board and the lower electronic control board. A heat dissipation opening is provided in the middle of the heat sink, and three wall surfaces of the heat dissipation opening are attached to the first to third heat dissipation surfaces.

[0015] Optionally, the heat sink includes a heat dissipation body and heat dissipation fins connected to the heat dissipation body, and the bent connection surface of the heat dissipation body is an arc surface.

[0016] The semiconductor circuit of the present invention has two inverter circuits inside. The semiconductor circuit is square. There are a first heat dissipation surface, a second heat dissipation surface opposite to each other, a third heat dissipation surface connecting these two heat dissipation surfaces, and a sealing surface where the sealing layer is located on the outside of the semiconductor circuit. The pins of the semiconductor circuit include a first pin group and a second pin group arranged oppositely. Among them, the first pin group and the second pin group respectively include the control and output pins of the two inverter circuits, and the first pin group and the second pin group are respectively led out from the first sealing surface and the second sealing surface opposite to each other in the sealing surface. Compared with the flat semiconductor circuit in the prior art which has only one heat dissipation surface, the semiconductor circuit of the present invention is square and has three mutually connected heat dissipation surfaces, so that when the semiconductor circuit is installed in the controller, the surface area it occupies on the PCB board is greatly reduced, which is beneficial to the miniaturization of the controller. Moreover, the total area of the three heat dissipation surfaces can be larger than the area of the existing single heat dissipation surface, so as to improve the heat dissipation efficiency and meet the higher heat dissipation requirements of the semiconductor circuit integrating two inverters of the present invention. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of the frame body of the embodiment of the present invention;

[0018] Figure 2 It is a schematic structural diagram of the frame body of the embodiment of the present invention for installing the circuit board and pins;

[0019] Figure 3 It is Figure 2 a perspective view in another viewing direction of;

[0020] Figure 4 It is Figure 2 a perspective view in yet another viewing direction of;

[0021] Figure 5 It is Figure 2 a perspective view in still another viewing direction of;

[0022] Figure 6 It is a schematic three-dimensional structure diagram of the semiconductor circuit of the embodiment of the present invention;

[0023] Figure 7 It is an enlarged view of the top view and a partial cross-sectional view in the thickness direction of the semiconductor circuit of the embodiment of the present invention;

[0024] Figure 8 It is a cross-sectional view in the thickness direction of the semiconductor circuit of the embodiment of the present invention;

[0025] Figure 9 It is a schematic three-dimensional structure diagram of the radiator of the embodiment of the present invention;

[0026] Figure 10 It is a top view of the radiator of the embodiment of the present invention;

[0027] Figure 11 Structural schematic diagram of the electronic control board according to an embodiment of the present invention;

[0028] Figure 12 Structural schematic diagram of the electronic control board after installing a radiator according to an embodiment of the present invention.

[0029] Reference numerals:

[0030] Semiconductor circuit 100, frame body 110, first frame 111, second frame 112, third frame 113, frame groove 114, first circuit board 121, first heat dissipation surface 1211, second circuit board 122, second heat dissipation surface 1221, third circuit board 123, third heat dissipation surface 1231, buckle groove 124, first pin group 131, second pin group 132, power device 141, metal substrate 142, insulating layer 143, circuit wiring layer 144, green oil layer 145, auxiliary radiator 146, bonding wire 147, sealing layer 150, first sealing surface 151, second sealing surface 152, radiator 200, heat dissipation body 210, heat dissipation fins 220, upper electronic control board 300, lower electronic control board 400, MCU 410. Detailed implementation manners

[0031] It should be noted that, without conflict in structure or function, the embodiments in the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to examples.

[0032] The semiconductor circuit mentioned in the present invention is a circuit module that integrates power switching devices, high-voltage drive circuits, etc. and is hermetically packaged on the outside. It is widely used in the field of power electronics, such as frequency converters for driving motors, various inverter voltages, variable frequency speed regulation, metallurgical machinery, electric traction, variable frequency household appliances and other fields. There are also various other names for this semiconductor circuit, such as Modular Intelligent Power System (MIPS), Intelligent Power Module (IPM), or it can also be called hybrid integrated circuit, power semiconductor module, power module, etc.

[0033] The present invention proposes a semiconductor circuit integrating two inverter modules, such as Figures 1 to 8As shown, there are two inverter circuits inside the semiconductor circuit 100. The semiconductor circuit 100 is square. Outside the semiconductor circuit 100, there are opposite first heat dissipation surfaces 1211, third heat dissipation surfaces 1231, a second heat dissipation surface 1221 connecting these two heat dissipation surfaces, and a sealing surface where the sealing layer 150 is located. The pins of the semiconductor circuit 100 include opposite first pin groups 131 and second pin groups 132. Among them, the first pin groups 131 and the second pin groups 132 respectively include the control and output pins of the two inverter circuits, and the first pin groups 131 and the second pin groups 132 are respectively led out from opposite first sealing surfaces 151 and second sealing surfaces 152 in the sealing surface.

[0034] Different from the prior art where the heat dissipation surface of the semiconductor circuit 100 is arranged on one of its surfaces, the heat dissipation surfaces of the semiconductor circuit 100 in the present invention are arranged on three sequentially connected surfaces, and the semiconductor circuit 100 is a three-dimensional square rather than the existing flat shape. Therefore, the areas of these three heat dissipation surfaces are quite equal. Among them, the areas of the two opposite heat dissipation surfaces, namely the first and third heat dissipation surfaces, are the same, and the area of the second heat dissipation surface connecting these two heat dissipation surfaces in the middle is slightly smaller than that of the first and third heat dissipation surfaces. As a result, compared with the planar heat dissipation surface in the prior art, the three-dimensional heat dissipation surface makes the surface area of one surface of the semiconductor circuit 100 greatly reduced. That is, when the semiconductor circuit 100 is installed in the controller, the surface area it occupies on the PCB board is greatly reduced, which is beneficial to the miniaturization of the controller. Moreover, the total area of the three heat dissipation surfaces can be larger than the area of one existing heat dissipation surface, so as to improve the heat dissipation efficiency and meet the higher heat dissipation requirements of the semiconductor circuit 100 integrating two inverters in the present invention.

[0035] The pins of the semiconductor circuit 100 in the present invention are divided into two opposite groups, and the control and output pins of the two inverter circuits are respectively arranged in these two groups of pins. As a result, when the semiconductor circuit 100 is installed in the controller, the control circuits and power circuits related to the two inverter circuits can be isolated, such as being respectively arranged on two opposite PCB boards, which is beneficial to the isolation of the circuits related to the two inverter circuits and enhances the anti-interference ability of the controller.

[0036] In some embodiments of the present invention, such as Figures 1 to 5As shown, the semiconductor circuit 100 is provided with a frame body 110 and a circuit board assembly, wherein: the frame body 110 includes a first frame 111, a second frame 112, and a third frame 113 that are sequentially connected. The first frame 111 and the third frame 113 are oppositely arranged. The first frame 111, the second frame 112, and the third frame 113 are respectively provided with a first mounting hole, a second mounting hole, and a third mounting hole; the circuit board assembly includes first to third circuit boards respectively mounted in the first to third mounting holes. First heat dissipation surfaces 1211, second heat dissipation surfaces 1221, and third heat dissipation surfaces 1231 are respectively formed on the outer sides of the first circuit board 121, the second circuit board 122, and the third circuit board 123.

[0037] The semiconductor circuit 100 of the present invention includes three circuit boards, which is different from the semiconductor circuit 100 in the prior art that generally only has one circuit board. In order to install these three circuit boards into the square semiconductor circuit 100, a "U"-shaped frame body 110 is provided. The frame body 110 is formed by three first to third frames connected to each other. The second frame 112 connecting the first and third frames is perpendicular to the other two frames. The first to third circuit boards are respectively installed in the first to third frames, so as to realize the independent installation of the first to third circuit boards, and then fixed by a plastic-sealed sealing body material. By using the frame body 110 to independently install the three circuit boards, electrical and heat dissipation isolation of the circuits provided on different circuit boards can be achieved. For example, two inverter circuits can be respectively provided on the relatively installed first and third circuit boards, so that they are separated by a certain distance to achieve mutual isolation and reduce interference with each other. Further, a rectifier circuit and a PFC circuit can also be provided on the second circuit board 122, so that the semiconductor circuit 100 includes multiple electric control functions.

[0038] In some embodiments of the present invention, as Figures 1 to 7 shown, at least the opposite inner sides of the first to third frames 113 are respectively provided with frame grooves 114 penetrating in the thickness direction thereof. Buckle grooves 124 recessed from the outer surface are respectively provided at the relative positions of the sides of the first to third circuit boards 123 with respect to the frame grooves 114. The frame groove 114 is a through groove penetrating the thickness direction of the frame, and the buckle groove 124 is a non-through groove provided on the side of the circuit board and not penetrating its thickness direction. The opening direction of the groove is inward from the outer surface of the circuit board, that is, from the heat dissipation surface direction. When the circuit board is installed in the frame, the frame grooves 114 and the buckle grooves 124 are arranged corresponding to each other, so that a through hole is formed at the joint of the circuit board and the frame, and the opening of the through hole near the heat dissipation surface of the circuit board is larger than the opening away from the heat dissipation surface. Thus, when the sealing layer 150 is formed, the thermoplastic resin material overflows from the frame body 110 into the through hole, as Figure 7As shown, the sealing layer 150 in the through-hole forms a bent buckling structure near the heat dissipation surface to fix the circuit board. Although the inner side of the circuit board and the thermoplastic resin can be tightly bonded to achieve fixation, when the semiconductor circuit 100 is impacted by an external force, there may be gaps at these bonding points, affecting the connection stability between the electronic components on the circuit board and the electronic circuit layer on the surface of the circuit board, and even causing the electronic components to separate from the electronic circuit layer, resulting in a failure of the semiconductor circuit 100. By forming a buckling structure of the sealing layer 150 in the through-hole, it plays a role in strengthening the fixation of the circuit board. To further achieve a reliable connection and fixation between the circuit board and the sealing layer 150, frame grooves 114 and buckling grooves 124 can be respectively provided on the four inner sides of the frame and the four sides of the corresponding circuit board, so as to form buckling structures on the four sides of the circuit board, realizing a reliable and stable fixation of the circuit board.

[0039] In some embodiments of the present invention, as Figures 1 to 7 shown, the first pin group 131 is connected to the first circuit board 121, a part of the pins in the second pin group 132 are connected to the second circuit board 122, and the remaining pins in the second pins are connected to the third circuit board 123. A drive circuit is also provided on the third circuit board 123. As can be seen from the above embodiments, the first circuit board 121 and the third circuit board 123 are respectively provided with independent inverter circuits. A drive circuit is also provided on the third circuit board 123, and some of the internal circuits operate in a low-voltage environment. The second circuit board 122 is provided with a PFC and a rectifier circuit, and the operating current and voltage of the inverter circuit provided on the first circuit board 121 are higher than those of the inverter circuit provided on the third circuit board 123. Specifically, the inverter circuit provided on the first circuit board 121 can be an industrial-grade high-voltage inverter circuit, while the inverter circuit provided on the third circuit board 123 is an ordinary household-grade inverter circuit. The operating voltage and current of the industrial-grade inverter circuit are much larger than those of the household-grade inverter circuit. Therefore, the power output by the PFC and rectifier circuit provided on the second circuit board 122 is for the inverter circuit provided on the third circuit board 123 to provide the power required for its operation, so their operating voltage and current are equivalent. Therefore, by connecting the relatively protruding first pin group 131 and the second pin group 132 to the first capacitor board, the second and third circuit boards 123 respectively, when the semiconductor circuit 100 is applied to the controller, the relevant circuits of its industrial-grade inverter circuit on the controller and the relevant circuits of the household-grade inverter circuit on the controller are completely isolated, and it also avoids the interference of the large current and high voltage during the operation of the first circuit board 121 on the relatively low current and voltage on the third circuit board 123 and the drive circuit. Thereby improving the operating stability of the controller.

[0040] In some embodiments of the present invention, the pins in the first pin group 131 and the second pin group 132 are both bent, and the bent portions of these pins are disposed within the sealing layer 150, and the protruding ends of these pins are located in the middle of the sealing surface. Specifically, as Figures 1 to 7 shown, the pins in these pin groups are independently manufactured during fabrication, that is, each pin is independent. Different from the pins in the prior art that are horizontally connected by connecting ribs during fabrication, each pin is bent. After the pins are soldered to the circuit board, the bent portions are located within the frame body 110, so that after the sealing layer 150 is formed, the bent portions are sealed by the sealing layer 150, and only the protruding ends of the pins are exposed. As can be seen from the figure, the protruding ends of the pins connecting the first and third circuit boards are arranged in parallel, and the surface formed by the arrangement is parallel to the surfaces of the first and third circuit boards. The protruding ends of the pins connecting the second circuit board 122 are arranged in parallel, and the surface formed by the arrangement is parallel to the surface of the second circuit board 122. Moreover, the plane formed by the protruding ends is located in the middle of the frame body 110, that is, the sealing layer 150, thus facilitating the routing of the PCB of the controller when it is installed on the controller.

[0041] In some embodiments of the present invention, specifically, the first to third circuit boards may sequentially include a metal substrate 142, an insulating layer 143, a circuit wiring layer 144, electronic components mounted on the circuit wiring layer 144, and bonding wires 147 connected between the electronic components from the outside to the inside. The metal substrate 142 may be a rectangular plate made of aluminum. The insulating layer 143 is used to achieve electrical insulation between the metal aluminum material and the circuit wiring layer 144. The insulating layer 143 may be made of a resin material such as epoxy resin, and fillers such as aluminum oxide and aluminum carbide are filled inside the resin material to improve the thermal conductivity. To improve the thermal conductivity, the shape of these fillers may be angular. To avoid the risk of damaging the contact surface of the electronic components disposed on their surfaces, the fillers may be spherical, angular, or a hybrid of angular and spherical. The circuit wiring layer 144 may be formed by copper foil etching or printed with a paste-like conductive medium. The conductive medium may be a conductive material such as graphene, solder paste, or silver paste. A plurality of component mounting positions are provided on the surface of the circuit wiring layer 144 to mount a plurality of electronic components. The electronic components include components with high heat generation, such as power devices 141. The power devices 141 include switching tubes such as IGBT tubes (Insulated Gate Bipolar Transistor) or MOS tubes (metal oxide semiconductor), and also include fast recovery diodes and rectifier diodes, which consume a large amount of power and generate a large amount of heat during operation. It also includes components with relatively small heat generation, such as driver chips, resistors, and capacitors. It should be noted that the components provided on the first circuit board 121 are mainly power devices 141 because mainly one inverter is provided on the first capacitor board, and the components provided on the second circuit board 122 include a PFC and a rectifier circuit composed of switching tubes and rectifier diodes. The components provided on the third circuit board 123 include another inverter composed of switching tubes and also include a drive circuit mainly composed of driver chips. The bonding wires 147 are usually gold wires, copper wires, gold-copper hybrid wires, fine bonding wires 147 of 38 μm or less, or thick bonding wires 147 of 100 μm or more. In addition to connecting electronic components to electronic components, they can also be connected between the electronic components and the circuit wiring layer 144, and between the electronic components and the pins, etc. The thickness of the bonding wire 147 is selected appropriately according to the magnitude of the current passing through it.

[0042] Further, an auxiliary heat sink 146 may be provided between the circuit wiring layer 144 and the electronic components. For the power devices 141 with high heat generation, in order to achieve better heat transfer of these electronic components to the metal substrate 142, the auxiliary heat sink 146 made of metal is provided. Specifically, the auxiliary heat sink 146 may adopt a copper material with a silver plating process, which can achieve better fitting between the surface of the electronic component and the heat sink and improve the heat dissipation ability.

[0043] Further, on the surface of the circuit wiring layer 144 where no electronic components are provided, a solder mask layer 145 can also be coated to prevent the circuit wiring layer 144 from being contaminated and oxidized, and at the same time, it can also enhance the withstand voltage between the traces of these circuit wiring layers 144.

[0044] In some embodiments of the present invention, the pins in the first pin group 131 and the second pin group 132 are generally made of metals such as copper. A nickel-tin alloy layer is formed on the copper surface through electroless plating and electroplating. The thickness of the alloy layer is generally 5 μm. The plating layer can protect the copper from corrosion and oxidation, and can also improve the solderability. The material can be C194 (-1 / 2H) (chemical composition: Cu (≧97.0), Fe: 2.4, P: 0.03, Zn: 0.12) or KFC (-1 / 2H) (chemical composition: Cu (≧99.6), Fe: 0.1(0.05 - 0.15), P: 0.03(0.025 - 0.04)). The 0.5mm copper sheet is stamped by machining to form the required shape, and then nickel is plated on the surface with a thickness of 0.1 - 0.5 μm and then tin is plated with a thickness of 2 - 5 μm to complete the processing of the pins.

[0045] In some embodiments of the present invention, the sealing layer 150 can be a powdered molding compound mixed with epoxy resin as the matrix resin, high-performance phenolic resin as the curing agent, silicon micropowder as the filler, and various additives. It is extruded into the mold cavity by a heat transfer molding method to embed the electronic components inside the semiconductor circuit 100, and at the same time, it is cross-linked and cured to form a device with a certain external structure.

[0046] The present invention also provides an electronic control board, as Figure 11 and Figure 12 shown. The electronic control board includes an upper electronic control board 300 and a lower electronic control board 400 arranged up and down, and the semiconductor circuit 100 mentioned in the above embodiments arranged between the upper electronic control board 300 and the lower electronic control board 400. The first pin group 131 and the second pin group 132 are respectively connected to the upper electronic control board 300 and the lower electronic control board 400. It also includes a radiator 200 arranged between the upper electronic control board 300 and the lower electronic control board 400. A heat dissipation opening is provided in the middle of the radiator 200, and three wall surfaces of the heat dissipation opening are attached to the first to third heat dissipation surfaces 1231.

[0047] Specifically, as Figures 9 to 12As shown, the first pin group 131 provided at one end of the semiconductor circuit 100 is electrically connected to the PCB board of the upper electronic control board 300, and the second pin group 132 provided at the other end of the semiconductor circuit 100 is electrically connected to the PCB board of the lower electronic control board 400. Among them, the electronic components on the upper electronic control board 300 are combined with an industrial-grade high-voltage inverter circuit in the semiconductor circuit 100, such as forming an industrial-grade motor control electronic control board, which has a high working voltage and a large current. The lower electronic control board 400 is combined with another relatively low-voltage inverter circuit provided in the semiconductor circuit 100 to form a household-level control circuit board, such as a control circuit board for driving an air conditioner compressor. Through such a structure, the control circuit boards with two completely different working voltages and currents are arranged at intervals through the lead-out pins at both ends of the semiconductor circuit 100, thereby reducing the mutual interference between the two. Moreover, since the semiconductor electronic control in the lower electronic control board 400 is also provided with a driving circuit, an MCU 410 chip operating in a low-voltage environment (such as 5V) is generally provided on the lower electronic control board 400, so that the interference of the upper electronic control board 300 operating in a high-voltage environment can be effectively reduced.

[0048] In some embodiments of the present invention, such as Figure 9 and Figure 10As shown, the heat sink 200 includes a heat dissipation body 210 and heat dissipation fins 220 connected to the heat dissipation body 210. The bent connection surface of the heat dissipation body 210 is an arc surface. The heat sink 200 is for three heat dissipation surfaces connected in sequence to cooperate with the semiconductor circuit 100, and its shape is set as a "concave" structure. It includes a heat dissipation body 210 with an opening in the middle and heat dissipation fins 220 connected to the outer surface of the heat dissipation body 210. The opening of the heat dissipation body 210 cooperates with the heat dissipation surface of the semiconductor circuit 100 to achieve close fitting of the inner wall surface of the opening and the corresponding heat dissipation surface, thereby realizing the heat conduction of the heat sink 200 to these three heat dissipation surfaces. The heat sink 200 can be fixed by connecting the upper and lower side surfaces to the upper and lower electronic control boards 400 through fixing parts such as screws. When the electronic control board assembly composed of the upper electronic control board 300, the lower electronic control board 400, and the semiconductor electronic control and the heat sink 200 is installed in the electronic control box, an air inlet and an air outlet will be opened in the electronic control box to form a heat dissipation air duct for the heat dissipation air flow in the electronic control box, thereby performing heat transfer on the electronic control board and the heat sink 200. From the structure of the heat dissipation ceramic sheet and the structure of the electronic control board, the heat dissipation air duct generally flows to the middle opening of the heat sink 200, then passes through the heat dissipation fins 220, exchanges heat with them, and then is discharged from the air outlet. Therefore, at the position where the rear end of the heat sink 200, that is, the second heat dissipation surface 1221 of the semiconductor circuit 100, contacts the heat sink body 210, it is difficult for the heat dissipation air flow to reach and completely exchange heat with it. To solve this problem, the bent connection surface at the corresponding position of the rear surface of the heat sink body 210, that is, the bottom of the opening, is set as an arc surface. Compared with the right-angle transition, the air flow can reach the rear area of the body more through the arc surface, that is, the area of the corresponding heat dissipation fins 220 in contact with the second heat dissipation surface 1221, thereby performing effective heat exchange on these areas and improving the heat dissipation efficiency. Further, the joint surface between the heat sink body 210 and the heat dissipation fins 220 can also be set as an arc surface, such as Figure 10 shown by the dashed line L in

[0049] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present invention.

[0051] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0052] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0053] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0054] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as a limitation on the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A semiconductor circuit integrating two inverter modules, characterized in that, there are two inverter circuits provided inside the semiconductor circuit, the semiconductor circuit is square, and there are a first heat dissipation surface, a third heat dissipation surface opposite to each other outside the semiconductor circuit, a second heat dissipation surface connecting these two heat dissipation surfaces, and a sealing surface where the sealing layer is located; the pins of the semiconductor circuit include a first pin group and a second pin group arranged relatively, wherein the first pin group and the second pin group respectively include the control and output pins of the two inverter circuits, and the first pin group and the second pin group are respectively led out from the first sealing surface and the second sealing surface opposite to each other in the sealing surface; the semiconductor circuit is provided with a frame body and a circuit board assembly, wherein: the frame body includes a first frame, a second frame and a third frame connected in sequence, the first frame and the third frame are arranged relatively, and the first frame, the second frame and the third frame are respectively provided with a first mounting hole, a second mounting hole and a third mounting hole; the circuit board assembly includes first to third circuit boards respectively mounted in the first to third mounting holes, and the outer sides of the first circuit board, the second circuit board and the third circuit board respectively form the first heat dissipation surface, the second heat dissipation surface and the third heat dissipation surface.

2. The semiconductor circuit according to claim 1, characterized in that, at least the relatively inner sides of the first to third frames are respectively provided with frame grooves penetrating through their thickness directions, and buckling grooves recessed from their outer surfaces are respectively arranged at the relative positions of the sides of the first to third circuit boards and the frame grooves.

3. The semiconductor circuit according to claim 1, characterized in that, the first circuit board and the second circuit board are respectively provided with the two inverter circuits, and the third circuit board is provided with a rectifier circuit and a PFC circuit.

4. The semiconductor circuit according to claim 3, characterized in that, the first pin group is connected to the first circuit board, a part of the pins in the second pin group are connected to the second circuit board, the remaining pins in the second pins are connected to the third circuit board, a drive circuit is also provided on the third circuit board, and the working current and voltage of the inverter circuit provided on the first circuit board are higher than the working current and voltage of the inverter circuit provided on the third circuit board.

5. The semiconductor circuit according to claim 1, characterized in that, the pins of the first pin group and the pins in the second pin group are all bent, the bent parts of these pins are arranged in the sealing layer, and the extending ends of these pins are located in the middle of the sealing surface.

6. The semiconductor circuit according to claim 1, characterized in that, the first circuit board, the second circuit board and the third circuit board respectively include a metal base material, an insulating layer, a circuit wiring layer connected in sequence, and electronic components mounted on the circuit wiring layer, and bonding wires connected between the electronic components.

7. The semiconductor circuit according to claim 6, characterized in that, an auxiliary heat radiator is also provided between the circuit wiring layer and the electronic components.

8. An electronic control board, characterized in that, The electronic control board includes an upper electronic control board and a lower electronic control board arranged up and down, and a semiconductor circuit as described in any one of claims 1 to 7 disposed between the upper electronic control board and the lower electronic control board. The first pin group and the second pin group are respectively connected to the upper electronic control board and the lower electronic control board. It further includes a radiator disposed between the upper electronic control board and the lower electronic control board. A heat dissipation opening is provided in the middle of the radiator, and three wall surfaces of the heat dissipation opening are attached to the first to third heat dissipation surfaces.

9. The electronic control board according to claim 8, wherein, the radiator includes a heat dissipation body and heat dissipation fins connected to the heat dissipation body, and the bent connection surface of the heat dissipation body is an arc surface.

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