Packaging structure and packaging method thereof

Abstract

The present invention provides a packaging structure and a packaging method, the packaging structure comprising: a packaging base, the packaging base comprising a first interconnection structure; an elastic support member, the elastic support member is covered on one side of the packaging base, the elastic support member comprises a plurality of through holes, and the first interconnection structure is exposed from the plurality of through holes; a photosensitive chip, the photosensitive chip is arranged on a side of the elastic support member away from the packaging base, the photosensitive chip is electrically connected to the first interconnection structure through the plurality of through holes; and an external plastic sealing layer, the external plastic sealing layer plastic seals the photosensitive chip and the elastic support member onto the packaging base, the external plastic sealing layer comprises a hollow area, and the photosensitive area of ​​the photosensitive chip is exposed from the hollow area. The elastic support member is used to elastically support the photosensitive chip to disperse the external force applied to the photosensitive chip in the injection molding packaging process of the photosensitive chip, thereby overcoming the problem of crushing.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a packaging structure and a packaging method thereof. Background Art

[0002] A light-sensing chip is an electronic device that can sense external light and convert it into electrical signals. Taking CMOS (CMOS Image Sensor, CIS) chips as an example, they are widely used in smartphones, security, car autonomous driving and other photo and video recording systems. CIS chips are usually made using semiconductor manufacturing processes, and then a series of packaging processes are performed on the CIS chips to form a packaging structure.

[0003] However, most existing CIS chips are packaged by injection molding during the processing and production process. Since the ejector pin of the plastic molding mold is in direct contact with the chip, the ejector pin can easily cause the glass sheet to break under pressure and the plastic molding compound to overflow, which leads to the disadvantages of low chip yield and high packaging cost. Therefore, the packaging effect of the CIS chip is poor.

[0004] In addition, the packaging structure of the existing CIS chip is relatively large, which does not conform to the trend of lightweight and thin design of electronic devices.

[0005] In view of this, there is a need to optimize and improve the above packaging process to overcome the problems of easy breakage, low yield and poor packaging effect caused by existing injection molding packaging. Summary of the invention

[0006] The problem solved by the present invention is how to improve the problems of easy breakage of photosensitive chips and overflow of plastic packaging materials in the existing injection molding packaging process, resulting in low packaging yield and poor packaging effect, while meeting the trend of small-volume packaging of photosensitive chips.

[0007] To solve the above problems, the technical solution of the present invention provides a packaging structure, which includes: a packaging base, the packaging base includes a first interconnection structure; an elastic support member, the elastic support member is covered on one side of the packaging base, the elastic support member includes a plurality of through holes, and the first interconnection structure is exposed from the plurality of through holes; a photosensitive chip, the photosensitive chip is mounted on a side of the elastic support member away from the packaging base, the photosensitive chip is electrically connected to the first interconnection structure via the plurality of through holes; and an external plastic sealing layer, the external plastic sealing layer seals the photosensitive chip and the elastic support member onto the packaging base, the external plastic sealing layer includes a hollow area, and the photosensitive area of ​​the photosensitive chip is exposed from the hollow area.

[0008] As an optional technical solution, the packaging base includes: a substrate; an active chip, which is arranged on a surface of one side of the substrate and electrically connected to the substrate; a transfer layer, which is arranged between the first interconnection structure and the active chip, and the transfer layer includes a plurality of conductive columns, and opposite ends of each conductive column are electrically connected to the first interconnection structure and the active chip respectively.

[0009] As an optional technical solution, the first interconnect structure is a rewiring layer, and the rewiring layer includes a plurality of first connection pads, and the plurality of first connection pads correspond to the plurality of through holes in a one-to-one manner.

[0010] As an optional technical solution, the packaging base also includes an internal plastic encapsulation layer, which encapsulates the active chip and the transfer layer onto the substrate; wherein the rewiring layer is arranged on the internal plastic encapsulation layer, and a plurality of second connection pads on the rewiring layer are electrically connected to an end of each conductive column exposed from the internal plastic encapsulation layer, and the plurality of second connection pads and the plurality of first connection pads are located on the opposite side surfaces of the rewiring layer.

[0011] As an optional technical solution, the packaging base also includes an intermediate plastic encapsulation layer, which encapsulates the rewiring layer and the internal plastic encapsulation layer onto the substrate; wherein the plurality of first connection pads are exposed from a side of the intermediate plastic encapsulation layer away from the substrate.

[0012] As an optional technical solution, the elastic support member is arranged above the middle plastic sealing layer, and at least a partial area of ​​the elastic support member is not in direct contact with the middle plastic sealing layer.

[0013] As an optional technical solution, the elastic support member includes a side wall extending toward the substrate, the side wall is located outside the middle plastic packaging layer, and the edge of the side wall is fixedly connected to the substrate.

[0014] As an optional technical solution, a second interconnect structure is provided on a surface of the active chip facing the transfer layer, and the second interconnect structure is electrically connected to the other end of each conductive column.

[0015] As an optional technical solution, a transparent isolation layer is also included, and the transparent isolation layer at least covers the photosensitive area.

[0016] The present invention also provides a packaging method for photosensitive chip packaging, the packaging method comprising:

[0017] preparing a package base, the package base comprising a first interconnect structure;

[0018] Assembling an elastic support member to one side of the packaging base, wherein the elastic support member includes a plurality of through holes;

[0019] Mounting a photosensitive chip to a side of the elastic support member away from the packaging base, and bonding the photosensitive chip to the first interconnection structure;

[0020] Forming a transparent isolation layer on one side of the photosensitive area of ​​the photosensitive chip to obtain a unit to be plastic-sealed;

[0021] A plastic encapsulation mold is provided, wherein the plastic encapsulation mold comprises an upper mold, a lower mold and an ejector pin adapted to each other, wherein the upper mold and the lower mold jointly define a plastic encapsulation cavity, and the ejector pin is at least partially located in the plastic encapsulation cavity;

[0022] The unit to be encapsulated is loaded into the encapsulation cavity, wherein the ejector rod contacts the transparent isolation layer and faces the photosensitive area;

[0023] Providing a plastic encapsulation material and injecting it into the plastic encapsulation cavity to form an external plastic encapsulation layer that encapsulates the photosensitive chip and the elastic support frame onto the packaging base;

[0024] The plastic encapsulation mold is removed, and the external plastic encapsulation layer forms a hollow portion on one side of the photosensitive area, and the photosensitive area is located in the hollow portion, thereby obtaining the packaging structure of the photosensitive chip.

[0025] As an optional technical solution, it also includes: coating a transparent adhesive layer on one side of the photosensitive area to form the transparent isolation layer.

[0026] As an optional technical solution, the step of preparing the packaging base also includes: providing a substrate and an active chip; mounting the active chip on the substrate, bonding the active chip and the substrate to electrically connect; forming a second interconnect structure on the active chip; providing a transfer layer, the transfer layer being flip-chip bonded to the second interconnect structure; providing a molding compound to form an internal molding layer that molds the active chip, the second interconnect structure and the transfer layer onto the substrate; making the first interconnect structure on the internal molding layer, the first interconnect structure and the transfer layer being electrically connected; providing a molding compound to form an intermediate molding layer that molds the first interconnect structure onto the substrate to obtain the packaging base; wherein the transfer layer includes a plurality of conductive pillars, and opposite ends of each conductive pillar are electrically connected to the second interconnect structure and the first interconnect structure, respectively.

[0027] Compared with the prior art, the present invention provides a packaging structure and a packaging method, in which an elastic support member is provided on the packaging base, the elastic support member is used to provide a mounting area for a photosensitive chip, and the through hole design on the elastic support member is used to realize the electrical connection between the packaging base and the photosensitive chip. Among them, the elastic support member's elastic support for the photosensitive chip is used to disperse the external force applied to the photosensitive chip in the injection molding packaging process of the photosensitive chip, overcome the problems of crushing and fragmentation, and has a significant beneficial effect on improving the packaging yield. In addition, the components in the packaging base are stacked on the substrate, so the packaging volume of the packaging structure can be effectively reduced, which is in line with the packaging trend of miniaturization and integration.

[0028] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic side view of a packaging structure provided in one embodiment of the present invention.

[0030] Figure 2 for Figure 1 A side view schematic diagram of the manufacturing process of the packaging base.

[0031] Figure 3 for Figure 1 Schematic side view of the connection between the elastic support member and the packaging base.

[0032] Figure 4 for Figure 1 A side view schematic diagram of the photosensitive chip mounted on the elastic support.

[0033] Figure 5 for Figure 1 A side view schematic diagram of the plastic-encapsulated photosensitive chip and the elastic support member to the packaging base.

[0034] Figure 6 The present invention is a flowchart of a packaging method provided in another embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments and drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0036] like Figure 1As shown, one of the objects of the present invention is to provide a packaging structure 100, which includes a packaging base, an elastic support member 20, a photosensitive chip 30 and an external plastic sealing layer 40, wherein the packaging base includes a first interconnection structure 11; the elastic support member 20 is covered on one side of the packaging base, the elastic support member includes a plurality of through holes 21, and the first interconnection structure 11 is exposed from the plurality of through holes 21; the photosensitive chip is arranged on the side of the elastic support member 20 away from the packaging base, and the photosensitive chip 20 is electrically connected to the first interconnection structure 11 through the plurality of through holes 21; the external plastic sealing layer 40 plastic seals the photosensitive chip 30 and the elastic support member 20 onto the packaging base, the external plastic sealing layer 40 includes a hollow area 41, and the photosensitive area 31 of the photosensitive chip 30 is exposed from the hollow area 41.

[0037] In the packaging structure 100 provided by the present invention, during the molding process of the external molding layer 40, the elastic support member 20 elastically supports the photosensitive chip 30 to offset the pressure applied by the molding mold on the photosensitive chip 30, thereby effectively avoiding crushing of the photosensitive chip 30.

[0038] like Figure 1 As shown, a gap S is provided between the elastic support member 20 and the packaging base, and the gap S is used to buffer the pressure exerted by the plastic packaging mold on the photosensitive chip 30, thereby effectively overcoming the compression of the photosensitive chip 30 and avoiding chip rupture.

[0039] In a preferred embodiment, the elastic support member 20 is, for example, a plastic cover or the like.

[0040] In a preferred embodiment, at least a portion of the elastic support member 20 is not in contact with the package base, so that a gap for providing a buffering effect is defined between the elastic support member 20 and the package base.

[0041] like Figure 1 and Figure 2 As shown, the package base includes a stacked substrate 10, an active chip 12, a transfer layer 13 and a first interconnection structure 11. The active chip 12 is mounted on a surface of one side of the substrate 10 through a mounting material and is electrically connected to the substrate 10 through a metal wire 122. The transfer layer 13 is arranged between the first interconnection structure 11 and the active chip 12. The transfer layer 13 includes a plurality of conductive pillars 131. The opposite ends of each conductive pillar 131 are electrically connected to the first interconnection structure 11 and the active chip 12 respectively.

[0042] In this embodiment, a second interconnect structure 121 is provided on the surface of the active chip 12 on the side close to the transfer layer 13. The second interconnect structure 121 is, for example, a plurality of tin pillars formed by screen printing, and each tin pillar is electrically connected to the other end opposite to each corresponding conductive pillar 131. Preferably, the size of the plurality of tin pillars is, for example, 60-80 microns.

[0043] In addition, in other embodiments of the present invention, the second interconnect structure may also be a rewiring layer formed on the active chip, and electrical connection is achieved between the rewiring layer and the transfer layer.

[0044] Furthermore, the transfer layer 13 is, for example, a TSV (Through-Silicon Via) silicon transfer board, and the plurality of conductive pillars 131 are, for example, metal pillars embedded in the silicon substrate. The metal pillars are preferably copper pillars, and the opposite ends of the copper pillars are exposed from the two opposite surfaces of the silicon substrate for electrical connection with the first interconnection structure 11 and the second interconnection structure 121, and input the photoelectric signal in the photosensitive chip 30 into the active chip 12, and output it to the outside through the substrate 10 after processing.

[0045] In this embodiment, the silicon transfer plate is flip-chip bonded to the second interconnect structure 121 .

[0046] In a preferred embodiment, the photosensitive chip 30 may be a CIS chip for converting the sensed light signal into an electrical signal. The active chip 12 may include a digital signal processing (DSP) chip for processing the electrical signal converted by the photosensitive chip 30.

[0047] Continue to refer to Figure 1 and Figure 2 The first interconnect structure 11 of the package base is, for example, a rewiring layer, which is stacked on top of the transfer layer 13. The rewiring layer includes, for example, multiple layers of alternately arranged metal layers and interlayer dielectric layers, and any adjacent metal layers are electrically connected through vias on the interlayer dielectric layer.

[0048] In this embodiment, the two opposite surfaces of the redistribution layer respectively include a plurality of first connection pads 111 and a plurality of second connection pads 112, wherein the plurality of first connection pads 111 correspond to the plurality of through holes 21 and are exposed from the plurality of through holes 21; and the plurality of second connection pads 112 correspond to one end of the plurality of conductive pillars 131. The first connection pads 111 and the second connection pads 112 are metal pads such as copper pads, solder balls, and solder pillars.

[0049] The rewiring layer is formed on the surface of the inner plastic layer 14 of the package base away from the substrate 10. The inner plastic layer 14 is used to plasticize the transfer layer 13 and the active chip 12 to the substrate 10. The inner plastic layer 14 provides a platform for the production of the rewiring layer. The inner plastic layer 14 includes an opening 141 corresponding to the conductive column 131 of the transfer layer 13. The conductive column 131 is exposed from the opening 141 and is electrically connected to the second connection pad 112 in the rewiring layer.

[0050] In addition, the substrate 10, the active chip 12, the transfer layer 13 and the first interconnection structure in the package base are stacked in sequence, which can be used to reduce the package volume, thereby meeting the requirements of miniaturization and integration of the package.

[0051] Continue to refer to Figure 1 and Figure 2 An intermediate plastic encapsulation layer 15 is also included above the rewiring layer. The intermediate plastic encapsulation layer 15 is used to encapsulate the rewiring layer onto the internal plastic encapsulation layer 14, thereby improving the stability of the package base and improving the electrical connection stability between the rewiring layer and the transfer layer 13.

[0052] like Figure 3 As shown, the elastic support member 20 is fixedly connected to the substrate 10, including: reserving a groove 101 on the substrate 10, and applying adhesive in the groove 101; inserting the edge portion of the side wall 22 of the elastic support member 20 extending toward the substrate 10 into the groove 101, and curing the adhesive to achieve fixed connection between the elastic support member 20 and the substrate 10.

[0053] The side wall 22 of the elastic support member 20 is disposed outside the middle plastic encapsulation layer 15 and does not contact the middle plastic encapsulation layer 15; the top wall 23 of the elastic support member 20 is suspended above the rewiring layer and does not contact the rewiring layer; thus, a gap S is formed between the elastic support member and the package base. The side wall 22 is disposed around the periphery of the top wall 23, and the top wall 23 is opposite to the rewiring layer.

[0054] In other embodiments of the present invention, it is preferred to form a gap between the top wall of the elastic support and the rewiring layer. The main reason is that the photosensitive chip 30 (such as Figure 4 As shown in FIG. 1 ), during the injection molding process, the ejector pin 600 of the molding mold directly acts on the photosensitive area 31 of the photosensitive chip 30 (as shown in FIG. 1 ). Figure 5 As shown), when the gap is located below the corresponding photosensitive area 31, the force of the ejector rod 600 can be better buffered to avoid crushing and fragmentation problems.

[0055] Continue to refer to Figure 3 The edge of the top wall 23 and the side wall 22 are connected with a protruding shoulder, the surface of the shoulder is higher than the surface of the top wall 23, and the shoulder and the top wall 23 jointly define the mounting area of ​​the photosensitive chip 30. Among them, a plurality of through holes 21 are formed on the top wall 23, located in the above-mentioned mounting area.

[0056] like Figure 4As shown, the photosensitive chip 30 is loaded into the above-mentioned loading area, including: the photosensitive chip 30 is loaded on the top wall 23 via mounting materials, and the photosensitive chip 30 is connected to the first interconnection structure 11 via metal wires 33, wherein one end of the metal wire 33 is electrically connected to the pin on the photosensitive chip 30, and the other end of the metal wire 33 passes through the corresponding through hole 21 and is electrically connected to the first connection pad 111 on the first interconnection structure.

[0057] It should be noted that in other embodiments of the present invention, the photosensitive chip can also be electrically connected to the first interconnection structure through other structures. For example, another rewiring layer is formed between the photosensitive chip and the top wall, and the rewiring layer includes a plurality of tin pillars for the through holes. The plurality of tin pillars pass through the through holes and are electrically connected to the first interconnection structure, and the other side of the rewiring layer is electrically connected to the photosensitive chip.

[0058] Continue to refer to Figure 4 The photosensitive chip 30 includes a photosensitive area 31 on the side away from the substrate 10. The photosensitive area 31 is covered with a transparent isolation layer 32. The transparent isolation layer 32 is used to prevent the photosensitive area 31 from being directly exposed to the external environment, which affects the product life. The transparent isolation layer 32 can be transparent glue or other transparent films.

[0059] like Figure 1 , Figure 4 and Figure 5 As shown, forming an external plastic encapsulation layer 40 outside the photosensitive chip 30 and the elastic support member 20 includes:

[0060] The unit to be encapsulated, including the packaging base, the elastic support member 20 and the photosensitive chip 30, is placed in the encapsulation cavity 500 of the encapsulation mold, wherein the encapsulation cavity 500 is located between the upper mold 300 and the lower mold 200, and the unit to be encapsulated is, for example, carried on one side of the lower mold 200, and the push rod 600 is used to provide a pushing force to the encapsulation cavity 500, push the encapsulation material 400 into the encapsulation cavity 500, and cover the elastic support member 20 and the photosensitive chip 30, wherein the push rod 600 contacts the transparent isolation layer 32 above the photosensitive chip 30, and is used to prepare a hollow portion 41 in the external encapsulation layer 40 formed by curing the encapsulation material 400, and the photosensitive area 31 is located in the hollow portion 41 and exposed to receive external light.

[0061] Depend on Figure 5 It can be known that in the process of the push rod 600 pushing the plastic encapsulation material 400 to move toward the plastic encapsulation cavity 500, the force exerted by the movement of the plastic encapsulation material 400 on the photosensitive chip 30 and the force exerted by the push rod 600 when contacting the photosensitive chip 30 can be buffered by the deformation of the elastic support member 20 thereunder. Preferably, the gap S between the elastic support member 20 and the packaging base is used for buffering and absorption, thereby effectively alleviating the external force on the photosensitive chip 30, overcoming the problems of crushing and fragmentation, and having a significant beneficial effect on improving the packaging yield.

[0062] like Figure 6 As shown, the present invention also provides a packaging method 1000, which is suitable for packaging of photosensitive chips, and is used to effectively reduce chip crush damage while achieving the technical effect of small-volume packaging.

[0063] The packaging method 1000 includes:

[0064] preparing a package base, the package base comprising a first interconnect structure;

[0065] Assembling an elastic support member to one side of the packaging base, wherein the elastic support member includes a plurality of through holes;

[0066] Mounting the photosensitive chip to the side of the elastic support member away from the package base, bonding the photosensitive chip and the first interconnection structure;

[0067] Forming a transparent isolation layer on one side of the photosensitive area of ​​the photosensitive chip to obtain a unit to be sealed;

[0068] A plastic encapsulation mold is provided, the plastic encapsulation mold comprises an upper mold, a lower mold and an ejector pin adapted to each other, the upper mold and the lower mold jointly define a plastic encapsulation cavity, and the ejector pin is at least partially located in the plastic encapsulation cavity;

[0069] The unit to be encapsulated is loaded into the encapsulation cavity, wherein the ejector rod contacts the transparent isolation layer and faces the photosensitive area;

[0070] Providing a molding compound and injecting it into the molding cavity to form an external molding layer that molds the photosensitive chip and the elastic support frame onto the packaging base; and

[0071] The plastic encapsulation mold is removed, and the external plastic encapsulation layer forms a hollow portion on one side of the photosensitive area, and the photosensitive area is located in the hollow portion, thereby obtaining the packaging structure of the photosensitive chip.

[0072] In a preferred embodiment, a transparent adhesive layer is coated on one side of the photosensitive area to form the transparent isolation layer.

[0073] In a preferred embodiment, the step of preparing the packaging base also includes: providing a substrate and an active chip; mounting the active chip on the substrate, bonding the active chip and the substrate to electrically connect; forming a second interconnection structure on the active chip; providing a transfer layer, flip-chip bonding the transfer layer on the second interconnection structure; providing a molding compound to form an internal molding layer on the substrate that molds the active chip, the second interconnection structure and the transfer layer; making a first interconnection structure on the internal molding layer, the first interconnection structure and the transfer layer are electrically connected; providing a molding compound to form an intermediate molding layer on the substrate that molds the first interconnection structure to obtain the packaging base; wherein the transfer layer includes a plurality of conductive pillars, and the opposite ends of each conductive pillar are electrically connected to the second interconnection structure and the first interconnection structure, respectively.

[0074] In summary, the present invention provides a packaging structure and a packaging method, wherein an elastic support is provided on the packaging base, the elastic support is used to provide a mounting area for a photosensitive chip, and the through hole design on the elastic support is used to realize the electrical connection between the packaging base and the photosensitive chip. Among them, the elastic support of the photosensitive chip by the elastic support is used to disperse the external force applied to the photosensitive chip in the injection molding packaging process of the photosensitive chip, overcome the problems of crushing and fragmentation, and have a significant beneficial effect on the improvement of the packaging yield. In addition, the components in the packaging base are stacked on the substrate, so the packaging volume of the packaging structure can be effectively reduced, which is in line with the packaging trend of miniaturization and integration. The present invention has been described by the above-mentioned relevant embodiments, but the above-mentioned embodiments are only examples of implementing the present invention. In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other. It must be pointed out that the present invention may also have other various embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should all belong to the scope of protection of the claims attached to the present invention.

Claims

1. A packaging structure, characterized in that: The packaging structure comprises: A package base, the package base comprising a first interconnect structure; An elastic support member, the elastic support member is covered on one side of the packaging base, the elastic support member includes a plurality of through holes, and the first interconnection structure is exposed from the plurality of through holes; A photosensitive chip, wherein the photosensitive chip is disposed on a side of the elastic support away from the packaging base, the photosensitive chip is electrically connected to the first interconnection structure through the plurality of through holes, the first interconnection structure is a rewiring layer, the rewiring layer includes a plurality of first connection pads, and the plurality of first connection pads correspond to the plurality of through holes one by one; and An external plastic sealing layer, wherein the external plastic sealing layer seals the photosensitive chip and the elastic support member onto the packaging base, wherein the external plastic sealing layer comprises a hollow area, and the photosensitive area of ​​the photosensitive chip is exposed from the hollow area; the packaging base comprises: substrate; An active chip, the active chip is disposed on a surface of one side of the substrate and is electrically connected to the substrate; A transfer layer is arranged between the first interconnection structure and the active chip, and the transfer layer includes a plurality of conductive pillars, and opposite ends of each conductive pillar are electrically connected to the first interconnection structure and the active chip respectively.

2. The packaging structure according to claim 1, characterized in that: The packaging base further comprises an internal plastic sealing layer, wherein the internal plastic sealing layer plastic seals the active chip and the transfer layer onto the substrate; Among them, the rewiring layer is arranged on the internal plastic packaging layer, and the several second connection pads on the rewiring layer are electrically connected to the end of each conductive column exposed from the internal plastic packaging layer, and the several second connection pads and the several first connection pads are located on the opposite side surfaces of the rewiring layer.

3. The packaging structure according to claim 2, characterized in that: The packaging base further comprises an intermediate plastic sealing layer, wherein the intermediate plastic sealing layer plastic seals the rewiring layer and the internal plastic sealing layer onto the substrate; Wherein, the plurality of first connection pads are exposed from a side of the middle plastic packaging layer away from the substrate.

4. The packaging structure according to claim 3, characterized in that: The elastic support member is disposed above the middle plastic sealing layer, and at least a partial area of ​​the elastic support member is not in direct contact with the middle plastic sealing layer.

5. The packaging structure according to claim 4, characterized in that: The elastic supporting member comprises a side wall extending toward the substrate, the side wall is located outside the middle plastic packaging layer, and the edge of the side wall is fixedly connected to the substrate.

6. The packaging structure according to claim 1, characterized in that: A second interconnection structure is disposed on a surface of the active chip facing the transfer layer, and the second interconnection structure is electrically connected to the other end of each conducting column.

7. The packaging structure according to claim 1, characterized in that: It also includes a transparent isolation layer, which at least covers the photosensitive area.

8. A packaging method for photosensitive chip packaging, characterized in that: The packaging method comprises: preparing a package base, the package base comprising a first interconnect structure; Assembling an elastic support member to one side of the packaging base, wherein the elastic support member includes a plurality of through holes; Mounting a photosensitive chip to a side of the elastic support member away from the packaging base, bonding the photosensitive chip and the first interconnection structure, and electrically connecting the photosensitive chip to the first interconnection structure via a plurality of through holes; Forming a transparent isolation layer on one side of the photosensitive area of ​​the photosensitive chip to obtain a unit to be sealed; A plastic encapsulation mold is provided, wherein the plastic encapsulation mold comprises an upper mold, a lower mold and an ejector pin adapted to each other, wherein the upper mold and the lower mold jointly define a plastic encapsulation cavity, and the ejector pin is at least partially located in the plastic encapsulation cavity; The unit to be encapsulated is loaded into the encapsulation cavity, wherein the ejector rod contacts the transparent isolation layer and faces the photosensitive area; Providing a plastic encapsulation material and injecting it into the plastic encapsulation cavity to form an external plastic encapsulation layer that encapsulates the photosensitive chip and the elastic support frame onto the packaging base, wherein the ejector rod is used to provide a pushing force to the plastic encapsulation cavity to push the plastic encapsulation material into the plastic encapsulation cavity and cover the elastic support member and the photosensitive chip; The plastic encapsulation mold is removed, and the external plastic encapsulation layer forms a hollow portion on one side of the photosensitive area, and the photosensitive area is located in the hollow portion, thereby obtaining the packaging structure of the photosensitive chip.

9. The packaging method according to claim 8, characterized in that: Also includes: A transparent adhesive layer is applied to one side of the photosensitive area to form the transparent isolation layer.

10. The packaging method according to claim 8, characterized in that: The step of preparing the packaging base also includes: Provide substrates and active chips; Mounting the active chip on the substrate, bonding the active chip and the substrate to electrically connect them; forming a second interconnect structure on the active chip; Providing a transfer layer, and flip-chip bonding the transfer layer to the second interconnect structure; Providing a molding compound to form an internal molding layer that molds the active chip, the second interconnect structure, and the transfer layer onto the substrate; The first interconnection structure is manufactured on the internal plastic packaging layer, and the first interconnection structure is electrically connected to the transfer layer; Providing a molding compound to form an intermediate molding layer for molding the first interconnect structure onto the substrate, thereby obtaining the packaging base; The transfer layer includes a plurality of conductive pillars, and two opposite ends of each conductive pillar are electrically connected to the second interconnect structure and the first interconnect structure respectively.

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