Antenna module

Abstract

The invention discloses an antenna module, comprising a circuit board, an antenna and a metal part, wherein the circuit board is provided with a no-wiring zone, which is a three-dimensional area. The antenna is arranged on the circuit board and is located in the no-wiring zone. The metal part is arranged on the circuit board and is located in the no-wiring zone, and the metal part is electrically insulated from the antenna.

Description

Technical Field

[0001] The present invention relates to an antenna structure, and in particular to an antenna structure capable of improving the problem of frequency band drift. Background Art

[0002] As modern people pay more and more attention to the quality of life and the population is gradually aging, many wearable physiological sensing devices have emerged. They can be used for medical care and physiological monitoring of the elderly, or to monitor the breathing, heart rate, exercise posture or calorie consumption of young people during exercise. Since the detected physiological data must be transmitted wirelessly, wearable physiological sensing devices need to use antennas.

[0003] Traditional rigid printed circuit board (PCB) antenna modules are very rigid and difficult to bend. If worn on the body, they are likely to protrude from clothing, causing many inconveniences in use. Therefore, antenna modules currently used in wearable physiological sensing devices are often integrated on flexible circuit boards or fabrics to facilitate users to wear. However, when the antenna module is bent by external forces, it often causes the antenna band to drift, thereby reducing the transmission efficiency of the antenna.

[0004] In view of this, there is a need for an improved antenna module to improve the above-mentioned deficiencies. Summary of the invention

[0005] The invention provides an antenna module, which can improve the frequency band drift caused by antenna bending, thereby improving the transmission efficiency of the antenna.

[0006] According to one embodiment of the present invention, an antenna module is provided, including a circuit board, an antenna, and a metal component, wherein the circuit board is provided with a keep-out wiring area, and the keep-out wiring area is a three-dimensional area. The antenna is arranged on the circuit board and is located in the keep-out wiring area. The metal component is arranged on the circuit board and is located in the keep-out wiring area, and the metal component is electrically insulated from the antenna.

[0007] When an antenna is bent by an external force, a frequency band drift may occur, causing the antenna module to be unable to transmit and receive signals normally. An antenna module provided by an embodiment of the present invention provides a metal piece in a forbidden wiring area without changing the antenna pattern. By adjusting the size of the metal piece in the forbidden wiring area, the frequency band drift can be improved, so that the antenna can transmit and receive signals normally, thereby improving the transmission efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a top schematic diagram of an antenna module according to a first embodiment of the present invention;

[0009] Figure 2 is a bottom schematic diagram of an antenna module according to a first embodiment of the present invention;

[0010] Figure 3 for Figure 1 A cross-sectional view of the antenna module along line 3-3;

[0011] Figure 4 is a cross-sectional view of an antenna module according to a second embodiment of the present invention;

[0012] Figure 5 is a cross-sectional view of an antenna module according to a third embodiment of the present invention;

[0013] Figure 6 is a cross-sectional view of an antenna module according to a fourth embodiment of the present invention;

[0014] Figure 7 is a cross-sectional view of an antenna module according to a fifth embodiment of the present invention;

[0015] Figure 8 is a cross-sectional view of an antenna module according to a sixth embodiment of the present invention;

[0016] Fig. 9 FIG. 4 is a diagram comparing transmission performances of an antenna module according to an embodiment of the present invention and a conventional antenna module.

[0017] Explanation of symbols

[0018] 1,2,3,4,5,6 Antenna Module

[0019] 10,20,30,40,50,60 circuit boards

[0020] 11,21,31,41,51,61 antenna

[0021] 12,22,32,42,52,62 metal parts

[0022] 13,23,33,43,53,63 driver chips

[0023] 101,201,301,401,501,601 upper surface

[0024] 102,202,302,402,502,602 bottom surface

[0025] 103,203,303,403,503,603 power layer

[0026] 104,204,304,404,504,604 signal line layer

[0027] 105,205,305,405,505,605 ground plane

[0028] 106,206,306,406,506,606 insulation layer

[0029] 107,207,307,407,507,607 No Wiring Area

[0030] H piercing DETAILED DESCRIPTION

[0031] The following multiple embodiments of the antenna module provided by the present invention can be applied to various wearable devices, such as a headband or a bracelet, or combined with the user's clothes, pants or shoes.

[0032] Figure 1 is a top view of the antenna module according to the first embodiment of the present invention, Figure 2 is a bottom schematic diagram of the antenna module of the first embodiment of the present invention, and Figure 3 for Figure 1 The cross-sectional view of the antenna module along line 3-3. Figure 1 to Figure 3 The antenna module 1 includes a circuit board 10, an antenna 11, a metal part 12 and a driving chip 13. The circuit board 10 is a flexible multi-layer printed circuit board, wherein the circuit board 10 includes an upper surface 101, a lower surface 102, a power layer 103, a signal circuit layer 104 and a ground layer 105. The upper surface 101 and the lower surface 102 are spaced apart from each other along a direction perpendicular to the upper surface 101. The power layer 103, the signal circuit layer 104 and the ground layer 105 are located between the upper surface 101 and the lower surface 102 and are respectively located at different layers of the circuit board 10, and an insulating layer 106 is provided between adjacent different layers of the circuit board 10. The driving chip 13 is provided on the upper surface 101 of the circuit board 10, and the power layer 103, the signal circuit layer 104 and the ground layer 105 are respectively electrically connected to different pins of the driving chip 13 through through holes H provided with metal materials. The circuit board 10 further has a keep out area 107, which extends from the upper surface 101 to the lower surface 102 along a direction perpendicular to the upper surface 101. Figure 3As shown, the keep-out area 107 is a three-dimensional area, wherein the three-dimensional area means a three-dimensional area having three dimensions of length, width and height. In the present embodiment, the antenna 11 is a printed circuit antenna, the antenna 11 is disposed on the upper surface 101 of the circuit board 10 and is electrically connected to the driver chip 13, and the antenna 11 is located in the keep-out area 107. Since no circuits for introducing current can be arranged in the keep-out area 107 except the antenna 11, the range of the keep-out area 107 is adaptively adjusted according to the area of ​​the antenna 11, so that the part of the circuit board 10 except the keep-out area 107 can be fully arranged for circuit layout. Specifically, when the area of ​​the antenna 11 is larger, the volume of the keep-out area 107 is also larger. When the area of ​​the antenna 11 is smaller, the volume of the keep-out area 107 is also smaller. Generally speaking, the shape of the projection of the keep-out area 107 on the upper surface 101 or the lower surface 102 is a rectangle slightly larger than the antenna 11, that is, the keep-out area 107 is a cuboid. However, the shape of the projection of the keep-out area 107 on the upper surface 101 or the lower surface 102 is not limited to a rectangle, and may also be other shapes, so that the antenna 11 is completely located in the keep-out area 107 .

[0033] also, Figure 1 The antenna 11 shown is only an embodiment. The antenna module 1 of the present invention may also use other types of antennas, and is not limited to the antenna 11 of the present invention. Figure 1 The antenna 11 is shown. In addition, the circuit shape of the printed circuit antenna in the antenna module 1 can be a meandering line, but is not limited to this shape.

[0034] like Figure 2 and Figure 3 As shown, the metal part 12 is a rectangular parallelepiped and is located in the prohibited wiring area 107. In addition, the metal part 12 is arranged on the lower surface 101 of the circuit board 10 and is electrically insulated from the antenna 11. Furthermore, any current cannot be introduced into the metal part 12, and the metal part 12 located in the prohibited wiring area 107 is electrically insulated from any circuit outside the prohibited wiring area 107 for introducing current. That is, the metal part is electrically insulated from any conductive circuit outside the prohibited wiring area. In the present embodiment, the multiple circuits outside the prohibited wiring area 107 for introducing current are respectively the power layer 103, the signal circuit layer 104 and the ground layer 105, so the metal part 12 is further electrically insulated from the power layer 103, the signal circuit layer 104 and the ground layer 105, and the projection of the antenna 11 along the direction perpendicular to the upper surface 101 partially overlaps with the metal part 12. In addition, as Figure 3 The circuit board shown in the embodiment has six layers, but the number of circuit board layers is not limited to six.

[0035] also, Figure 2 and Figure 3The metal member 12 shown is an embodiment. The antenna module of the present invention may also use metal members 12 of other shapes, and is not limited to the metal member 12 of the present invention. Figure 2 and Figure 3 The metal member 12 is shown.

[0036] Figure 4 FIG. 2 is a cross-sectional view of an antenna module according to a second embodiment of the present invention. Figure 4 As shown, the antenna module 2 includes a circuit board 20, an antenna 21, a metal part 22 and a driving chip 23. The circuit board 20 includes an upper surface 201, a lower surface 202, a power layer 203, a signal line layer 204, a ground layer 205, a plurality of insulating layers 206 and a keep-out area 207. Specifically, the antenna module 2 of the second embodiment is similar to the antenna module 1 of the first embodiment, except that the projection of the antenna 21 along the direction perpendicular to the upper surface 201 does not overlap the metal part 22, that is, the projection of the antenna 21 along the direction perpendicular to the upper surface 201 is offset from the metal part 22, and the detailed structure of the antenna module 2 is as follows. The upper surface 201 and the lower surface 202 are spaced apart from each other along the direction perpendicular to the upper surface 201, and the power layer 203, the signal line layer 204 and the ground layer 205 are located between the upper surface 201 and the lower surface 202. The power layer 203, the signal circuit layer 204 and the ground layer 205 are respectively located at different layers of the circuit board 20, and the insulating layers 206 are respectively arranged between the different layers of the circuit board 20. The keep-out area 207 extends from the upper surface 201 to the lower surface 202 along a direction perpendicular to the upper surface 201, and a portion of the circuit board 20 is located in the keep-out area 207. The antenna 21 is arranged on the upper surface 201 of the circuit board 20 and is located in the keep-out area 207, and the antenna 21 is electrically connected to the driving chip 23. The metal member 22 is arranged on the lower surface 201 of the circuit board 20 and is located in the keep-out area 207, and the metal member 22 is electrically insulated from the antenna 21 and any current cannot be introduced into the metal member 22. In addition, the metal member 22 located in the keep-out area 207 is electrically insulated from any circuit for introducing current outside the keep-out area 207. In this embodiment, the multiple lines for introducing current outside the keep-out area 207 are the power layer 203 , the signal line layer 204 and the ground layer 205 , so the metal member 22 is further electrically insulated from the power layer 203 , the signal line layer 204 and the ground layer 205 .

[0037] Figure 5 FIG. 4 is a cross-sectional view of an antenna module according to a third embodiment of the present invention. Figure 5As shown, the antenna module 3 includes a circuit board 30, an antenna 31, a metal part 32 and a driving chip 33. The circuit board 30 includes an upper surface 301, a lower surface 302, a power layer 303, a signal circuit layer 304, a ground layer 305, a plurality of insulating layers 306 and a forbidden wiring area 307. The upper surface 301 and the lower surface 302 are spaced apart from each other along a direction perpendicular to the upper surface 301, and the power layer 303, the signal circuit layer 304 and the ground layer 305 are located between the upper surface 301 and the lower surface 302. The power layer 303, the signal circuit layer 304 and the ground layer 305 are respectively located at different layers of the circuit board 30, and the insulating layers 306 are respectively arranged between the different layers of the circuit board 30. The forbidden wiring area 307 extends from the upper surface 301 to the lower surface 302 along a direction perpendicular to the upper surface 301, and a portion of the circuit board 30 is located in the forbidden wiring area 307. The antenna 31 is disposed on the circuit board 30 and is located between the upper surface 301 of the circuit board 30 and the lower surface 302 of the circuit board 30. In addition, the antenna 31 is located in the no-wiring area 307 and is electrically connected to the driver chip 33. The metal piece 32 is disposed on the upper surface 301 of the circuit board 30 and is located in the no-wiring area 307. The metal piece 32 is electrically insulated from the antenna 31 and any current cannot be introduced into the metal piece 32. In addition, the metal piece 32 located in the no-wiring area 307 is electrically insulated from any circuit for introducing current outside the no-wiring area 307. In this embodiment, the multiple circuits for introducing current outside the no-wiring area 307 are respectively the power layer 303, the signal circuit layer 304 and the ground layer 305, so the metal piece 32 is further electrically insulated from the power layer 303, the signal circuit layer 304 and the ground layer 305, and the projection of the antenna 31 along the direction perpendicular to the upper surface 301 partially overlaps with the metal piece 32.

[0038] Figure 6 FIG. 4 is a cross-sectional view of an antenna module according to a fourth embodiment of the present invention. Figure 6As shown, the antenna module 4 includes a circuit board 40, an antenna 41, a metal part 42 and a driving chip 43. The circuit board 40 includes an upper surface 401, a lower surface 402, a power layer 403, a signal line layer 404, a ground layer 405, a plurality of insulating layers 406 and a keep-out area 407. Specifically, the antenna module 4 of the fourth embodiment is similar to the antenna module 3 of the third embodiment, except that the projection of the antenna 41 along the direction perpendicular to the upper surface 401 does not overlap the metal part 42, that is, the projection of the antenna 41 along the direction perpendicular to the upper surface 401 is offset from the metal part 42, and the detailed structure of the antenna module 4 is as follows. The upper surface 401 and the lower surface 402 are spaced apart from each other along the direction perpendicular to the upper surface 401, and the power layer 403, the signal line layer 404 and the ground layer 405 are located between the upper surface 401 and the lower surface 402. The power layer 403, the signal circuit layer 404 and the ground layer 405 are respectively located at different layers of the circuit board 40, and the insulating layers 406 are respectively arranged between the different layers of the circuit board 40. The keep-out area 407 extends from the upper surface 401 to the lower surface 402 along a direction perpendicular to the upper surface 401, and a portion of the circuit board 40 is located in the keep-out area 407. The antenna 41 is arranged on the circuit board 40 and is located between the upper surface 401 of the circuit board 40 and the lower surface 402 of the circuit board 40. In addition, the antenna 41 is located in the keep-out area 407 and is electrically connected to the driving chip 43. The metal sheet 42 is arranged on the upper surface 401 of the circuit board 40 and is located in the keep-out area 407. The metal piece 42 is electrically insulated from the antenna 41 and any current cannot be introduced into the metal piece 42. In addition, the metal piece 42 located in the keep-out area 407 is electrically insulated from any circuit for introducing current outside the keep-out area 407. In this embodiment, the multiple lines for introducing current outside the prohibited wiring area 407 are respectively the power layer 403, the signal line layer 404 and the ground layer 405, so the metal member 42 is also electrically insulated from the power layer 403, the signal line layer 404 and the ground layer 405.

[0039] Figure 7 FIG. 5 is a cross-sectional view of an antenna module according to a fifth embodiment of the present invention. Figure 7As shown, the antenna module 5 includes a circuit board 50, an antenna 51, a metal part 52 and a driving chip 53. The circuit board 50 includes an upper surface 501, a lower surface 502, a power layer 503, a signal line layer 504, a ground layer 505, a plurality of insulating layers 506 and a forbidden wiring area 507. The upper surface 501 and the lower surface 502 are spaced apart from each other along a direction perpendicular to the upper surface 501, and the power layer 503, the signal line layer 504 and the ground layer 505 are located between the upper surface 501 and the lower surface 502. The power layer 503, the signal line layer 504 and the ground layer 505 are respectively located at different layers of the circuit board 50, and the insulating layers 506 are respectively arranged between the different layers of the circuit board 50. The forbidden wiring area 507 extends from the upper surface 501 to the lower surface 502 along a direction perpendicular to the upper surface 501, and a portion of the circuit board 50 is located in the forbidden wiring area 507. The antenna 51 is disposed on the circuit board 50 and is located between the upper surface 501 of the circuit board 50 and the lower surface 502 of the circuit board 50. In addition, the antenna 51 is located in the no-wiring area 507 and is electrically connected to the driver chip 53. The metal piece 52 is disposed on the lower surface 502 of the circuit board 50 and is located in the no-wiring area 507. The metal piece 52 is electrically insulated from the antenna 51 and any current cannot be introduced into the metal piece 52. In addition, the metal piece 52 located in the no-wiring area 507 is electrically insulated from any circuit for introducing current outside the no-wiring area 507. In this embodiment, the multiple circuits for introducing current outside the no-wiring area 507 are respectively the power layer 503, the signal circuit layer 504 and the ground layer 505, so the metal piece 52 is further electrically insulated from the power layer 503, the signal circuit layer 504 and the ground layer 505, and the projection of the antenna 51 along the direction perpendicular to the upper surface 501 overlaps with the metal piece 52.

[0040] Figure 8 FIG. 4 is a cross-sectional view of an antenna module according to a sixth embodiment of the present invention. Figure 8As shown, the antenna module 6 includes a circuit board 60, an antenna 61, a metal part 62 and an antenna driving chip 63. The circuit board 60 includes an upper surface 601, a lower surface 602, a power layer 603, a signal line layer 604, a ground layer 605, a plurality of insulating layers 606 and a keep-out area 607. Specifically, the antenna module 6 of the sixth embodiment is similar to the antenna module 5 of the fifth embodiment, except that the projection of the antenna 61 along the direction perpendicular to the upper surface 601 does not overlap the metal part 62, that is, the projection of the antenna 61 along the direction perpendicular to the upper surface 601 is misaligned with the metal part 62, and the detailed structure of the antenna module 6 is as follows. The upper surface 601 and the lower surface 602 are spaced apart from each other along the direction perpendicular to the upper surface 601, and the power layer 603, the signal line layer 604 and the ground layer 605 are located between the upper surface 601 and the lower surface 602. The power layer 603, the signal circuit layer 604 and the ground layer 605 are respectively located on different layers of the circuit board 60, and the insulating layers 606 are respectively arranged between the different layers of the circuit board 60. The keep-out area 607 extends from the upper surface 601 to the lower surface 602 along a direction perpendicular to the upper surface 601, and a portion of the circuit board 60 is located in the keep-out area 607. The antenna 61 is arranged on the circuit board 60 and is located between the upper surface 601 of the circuit board 60 and the lower surface 602 of the circuit board 60. In addition, the antenna 61 is located in the keep-out area 607 and is electrically connected to the driving chip 63. The metal sheet 62 is arranged on the lower surface 602 of the circuit board 60 and is located in the keep-out area 607. The metal piece 62 is electrically insulated from the antenna 61 and any current cannot be introduced into the metal piece 62. In addition, the metal piece 62 located in the keep-out area 607 is electrically insulated from any circuit for introducing current outside the keep-out area 607. In this embodiment, the multiple lines for introducing current outside the keep-out area 607 are the power layer 603 , the signal line layer 604 and the ground layer 605 , so the metal member 62 is further electrically insulated from the power layer 603 , the signal line layer 604 and the ground layer 605 .

[0041] In other embodiments, the metal component located in the keep-out zone may also be disposed between the upper surface and the lower surface of the circuit board, as long as the antenna and the metal component are located on different layers of the circuit board.

[0042] Fig. 9 FIG. 4 is a diagram comparing the transmission performance of an antenna module according to an embodiment of the present invention and a conventional antenna module. Fig. 9As shown, curve S1 is related to the transmission performance of the existing antenna module, and curve S2 is related to the transmission performance of the antenna module of an embodiment of the present invention, and the two different antenna modules are Bluetooth antenna modules. The vertical axis is defined as the return loss, the horizontal axis is defined as the frequency (GHz), and the region R is the frequency band that can be used for Bluetooth. Since the Bluetooth antenna module can normally transmit and receive signals, the return loss in the frequency band that can be used for Bluetooth must be lower than a critical value, such as -2.5db. The existing antenna module has a frequency band drift due to bending, so the return loss of curve S1 in region R is higher than -2.5db, so it cannot transmit and receive signals normally. The antenna module of an embodiment of the present invention can adjust the size of the metal part, such as adjusting the length / width of the metal part, so that the return loss of curve S2 in region R is lower than -2.5db, which significantly improves the frequency band drift, so that the Bluetooth antenna module can transmit and receive signals normally.

[0043] When the antenna module is bent by external force, frequency band drift is likely to occur. In the past, the way to improve frequency band drift is to redesign the antenna pattern. However, since the degree of bending of different users' body parts is different, it is impossible to redesign the antenna pattern for each person. In view of the above problems. The antenna module provided by the present invention can effectively improve the problem of frequency band drift by adjusting the length / width of the metal parts set in the prohibited wiring area without changing the antenna pattern, so that the antenna module can transmit and receive signals normally, thereby improving the transmission efficiency of the antenna module.

Claims

1. An antenna module, comprising: A circuit board is provided with a prohibited wiring area, the prohibited wiring area is a three-dimensional area, the three-dimensional area is the area in the upper and lower directions of the circuit board, that is, the area in the normal direction of the circuit board, and the circuit board has an upper surface and a lower surface; A metal member is directly attached to the lower surface of the circuit board and is located in the keep-out area, wherein the metal member is electrically insulated from any conductive circuit outside the keep-out area; as well as An antenna is located only in the prohibited wiring area, the antenna is directly attached to the upper surface of the circuit board, or is arranged between the upper surface and the lower surface, and the antenna is a printed circuit antenna; The metal piece is electrically insulated from the antenna, and no circuit for introducing current is arranged in the prohibited wiring area except the antenna. 2 . The antenna module as claimed in claim 1 , wherein the keep-out zone extends from the upper surface to the lower surface along a direction perpendicular to the upper surface, and the antenna and the metal member are disposed on the upper surface and the lower surface respectively. The antenna module as claimed in claim 1 , wherein the circuit board is a flexible printed circuit board. 4 . The antenna module as claimed in claim 1 , wherein a projection of the keep-out zone on the upper surface or the lower surface of the circuit board is in a rectangular shape.

5. The antenna module as claimed in claim 1, wherein the antenna is located between the upper surface and the lower surface, the keep-out zone extends from the upper surface to the lower surface along a direction perpendicular to the upper surface, and the metal member is disposed on the upper surface or the lower surface. 6 . The antenna module as claimed in claim 1 , wherein a projection of the antenna along a direction perpendicular to the upper surface of the circuit board at least partially overlaps the metal member. 7 . The antenna module as claimed in claim 1 , wherein a projection of the antenna along a direction perpendicular to the upper surface of the circuit board does not overlap with the metal member.

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