Method and device for adding tinning pad to PCB file

Abstract

The present invention provides a method and device for adding a tinning pad to a PCB file. The method comprises: receiving a direction instruction of a PCB passing through wave soldering; according to the direction instruction of the PCB passing through wave soldering, determining from a first coordinate set a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance less than or equal to a safety distance from other solder mask windows as a pending solder mask window, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file; placing the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file. The present invention can more accurately locate the risk point of tinning, and solve the risk point by automatically adding a tinning pad, thereby improving work efficiency and accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB design, and in particular to a method and device for adding a tinning pad to a PCB file. Background Art

[0002] At present, the components on PCBA (Printed Circuit Board Assembly) are divided into SMT (surface mount) and DIP (dual in-line package). Two different methods are used for the welding of the two components: SMT welding uses steel mesh tin brushing heating reflow soldering, and there will be no redundant solder paste overflow. DIP welding uses wave soldering. The wave soldering is to form a specific welding wave on the surface of the solder tank with the help of a pump or nitrogen injection. The PCB with the components inserted is placed on the conveyor chain, adjusted to a specific angle and immersed in a certain depth to pass through the solder wave to realize the welding process of the solder joints. When the distance between the solder joints is too close, the phenomenon of tin short circuit will occur.

[0003] As PCB designs become more and more complex and precise, and pin spacing becomes closer and closer, the risk of bridging tin and short circuit is getting higher and higher. In production, to avoid this risk, it is necessary to add tinning points near risky pads to pull the molten tin and avoid bridging tin.

[0004] At present, in order to determine whether the soldering is short-circuited due to the DIP pads openings being too close together on the PCB, it is necessary to manually measure the pad spacing one by one, determine the location where the soldering pads need to be added, and manually add the pads one by one. This method is prone to omissions due to negligence and is time-consuming and laborious. While checking one by one, it is also necessary to manually add soldering points to the pads that are too close, and the operation is repeated, which is not fast and simple enough. Summary of the invention

[0005] The method and device for adding tinning pads to a PCB file provided by the present invention can more accurately locate tinning risk points, and solve the risk points by automatically adding tinning pads, thereby improving work efficiency and accuracy.

[0006] In a first aspect, the present invention provides a method for adding a tinning pad to a PCB file, comprising:

[0007] Receive direction instructions for PCB passing through wave soldering;

[0008] According to the direction instruction of the PCB passing through the wave soldering, determine from the first coordinate set the solder mask window with the same horizontal coordinate / vertical coordinate as other solder mask windows and the distance between the solder mask windows and other solder mask windows is less than or equal to the safety distance as the pending solder mask window, and determine the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file;

[0009] Place the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file.

[0010] Optionally, according to the direction instruction of the PCB passing through the wave soldering, determining from the first coordinate set a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows being less than or equal to the safety distance as a pending solder mask window, and determining the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask window includes:

[0011] If the PCB passes through the wave soldering direction instruction to pass through the positive direction of the X axis first, then determine from the first coordinate set that the PCB has the same vertical coordinate y as other solder mask openings and the distance between the PCB and other solder mask openings is less than or equal to the safety distance d. m The solder mask opening is taken as the pending solder mask opening, and [min(x n )-d m , y] is determined as the position coordinate of adding the tinning pad, where x n It is the horizontal coordinate of the window for the pending solder mask layer.

[0012] Optionally, according to the direction instruction of the PCB passing through the wave soldering, determining from the first coordinate set a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows being less than or equal to the safety distance as a pending solder mask window, and determining the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask window includes:

[0013] If the PCB passes through the wave soldering direction instruction to pass through the negative direction of the X axis first, then determine from the first coordinate set that the PCB has the same vertical coordinate y as other solder mask openings and the distance between the PCB and other solder mask openings is less than or equal to the safety distance d. m The solder mask opening is taken as the pending solder mask opening, and [max(x n )+d m , y] is determined as the position coordinate of adding the tinning pad, where x n It is the horizontal coordinate of the window for the pending solder mask layer.

[0014] Optionally, according to the direction instruction of the PCB passing through the wave soldering, determining from the first coordinate set a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows being less than or equal to the safety distance as a pending solder mask window, and determining the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask window includes:

[0015] If the PCB passes through the wave soldering direction instruction to pass through the positive direction of the Y axis first, then determine from the first coordinate set that the PCB has the same horizontal coordinate x as other solder mask openings and the distance between the PCB and other solder mask openings is less than or equal to the safety distance d. m The solder mask layer opening is taken as the pending solder mask layer opening, and [x, min(y n )-d m ] Determine the position coordinates for adding the solder pad, where y n It is the vertical coordinate of the window for the pending solder mask layer.

[0016] Optionally, according to the direction instruction of the PCB passing through the wave soldering, determining from the first coordinate set a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows being less than or equal to the safety distance as a pending solder mask window, and determining the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask window includes:

[0017] If the PCB passes through the wave soldering direction instruction to pass through the negative direction of the Y axis first, then determine from the first coordinate set that the PCB has the same horizontal coordinate x as other solder mask openings and the distance between the PCB and other solder mask openings is less than or equal to the safety distance d. m The solder mask window is used as the pending solder mask window, and [x, max(y n )+d m ] Determine the position coordinates for adding the solder pad, where y n It is the vertical coordinate of the window for the pending solder mask layer.

[0018] In a second aspect, the present invention provides a device for adding a tinning pad to a PCB file, comprising:

[0019] A receiving unit, used for receiving a direction instruction of the PCB passing through wave soldering;

[0020] A determination unit is used to determine, from the first coordinate set, a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows less than or equal to a safety distance as a pending solder mask window according to a direction instruction of the PCB passing through wave soldering, and determine the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file;

[0021] The placement unit is used to place the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file.

[0022] In a third aspect, the present invention provides a PCB manufacturing method, which uses the above-mentioned method of adding a tinning pad to a PCB file to assist in designing a PCB file to obtain a PCB design file;

[0023] Make PCB based on PCB design files.

[0024] In a fourth aspect, the present invention provides a PCB obtained by using the above-mentioned PCB manufacturing method.

[0025] In a fifth aspect, the present invention provides an electronic device including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the method for adding a tinning pad to a PCB file when executing the computer program.

[0026] In a sixth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the method for adding a tinning pad to a PCB file.

[0027] The method for adding tinning pads to a PCB file provided by an embodiment of the present invention, during the PCB file design stage, the user only needs to input the direction of the PCB passing through wave soldering, and the risk of tinning short circuit can be automatically detected, the position where the tinning pad needs to be added can be determined, and the tinning pad can be automatically added, so that the tinning risk point can be located more accurately, and the risk point can be solved by automatically adding the tinning pad, thereby improving work efficiency and the accuracy of adding the tinning pad. Furthermore, the PCB board manufactured based on the PCB file designed according to this solution can fundamentally avoid the risk of tinning short circuit caused by the DIP pad solder mask opening being too close, and the reliability and safety are high. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A flow chart of a method for adding a tinning pad to a PCB file according to an embodiment of the present invention;

[0029] Figure 2 A schematic diagram of the wave soldering direction of a PCB board and the direction of adding tin-drag pads provided by an embodiment of the present invention;

[0030] Figure 3 A schematic diagram of the structure of a device for adding a tinning pad to a PCB file according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] An embodiment of the present invention provides a method for adding a tinning pad to a PCB file.

[0033] Before realizing automatic detection of tinning short circuit risk and adding tinning pads, you must first write a skill script, specifically: set the command entry shortcut key to add the target value, such as setting the safety distance to Dm, calling and initializing the underlying function of the application in allegro; initializing various global variables; obtaining the DIP pad solder mask layer window coordinates in the entire PCB drawing interface, and writing them into set A; setting the direction of the PCB through wave soldering to "up", "down", "left", and "right" to realize the subroutine for automatically detecting the risk of tinning short circuit and adding tinning pads.

[0034] Among them, setting the command entry shortcut key may include: setting the sub-command entry shortcut key axlCmdRegister("→"'right) of [check risk points when running to the right]; setting the sub-command entry shortcut key axlCmdRegister("←"'left) of [check risk points when running to the left]; setting the sub-command entry shortcut key axlCmdRegister("↑"'up) of [check risk points when running upward]; setting the sub-command entry shortcut key axlCmdRegister("↓"'down) of [check risk points when running downward].

[0035] Then, modify the interface file and connect the skill script. After the skill script is written, you need to rewrite the system interface file to call the skill script before you can use it in Cadence. Specifically: encapsulate the program into a .il file; check the computer's environment variable value and find the folder pointed to by the variable value; put the .il program file that implements this function into the folder pointed to by the environment variable value; find the allegro.ilinit file in the file, which is the interface file; use Notepad to open the allegro.ilinit file; use the load function to call the .il program file according to the folder path pointed to by the environment variable.

[0036] Finally, activate and call the skill script. Specifically: After completing the above steps, restart allegro; enter the set program call entry shortcut key in the command box and press Enter to end, and the skill can be activated; according to the actual production situation, type "↑" or "↓" or "←" or "→" to use the script to automatically add tinning pads at risk locations, and activation is complete.

[0037] like Figure 1 As shown, the method for adding a tinning pad to a PCB file provided by an embodiment of the present invention includes:

[0038] S11, receiving the direction instruction of the PCB undergoing wave soldering.

[0039] The direction of the PCB through wave soldering includes four situations: "up", "down", "left" and "right". The user can indicate the direction of the PCB through wave soldering by typing "↑", "↓", "←" or "→".

[0040] S12. According to the direction instruction of the PCB passing through wave soldering, determine from the first coordinate set the solder mask layer opening that has the same horizontal coordinate / vertical coordinate as other solder mask layer openings and the distance between it and other solder mask layer openings is less than or equal to the safety distance as the pending solder mask layer opening, and determine the position coordinates of adding the tinning pad according to the coordinates of the pending solder mask layer opening, wherein the first coordinate set includes the coordinates of the solder mask layer openings of all DIP pads on the PCB file.

[0041] Specifically, according to the different direction instructions of the PCB through wave soldering input by the user, it can be divided into the following four situations:

[0042] (1) If the PCB passes through the wave soldering process in the positive direction of the X axis (right side) first, extract the solder mask window V in set A one by one n The coordinate information (x n ,y n ), check its opening V with other solder mask layers of set A n+1 (x n+1 ,y n+1 ) are equal. If the ordinates are equal and are y, write them into set B, and extract the solder mask window coordinates B from set B in sequence n , calculate the distance d between it and other solder mask openings in set B n , d n =|x n -x n-1 |, if d n ≤d m , it means that the distance between the two vias is less than the safe distance, and there is a risk of solder short circuit. Take the coordinates [min(x n )-d m, y] and store it in set C.

[0043] Clear set B, continue to extract the solder mask window coordinate information from set A and compare it with other coordinates in set A, repeat the above steps until all solder mask windows in set A are extracted.

[0044] (2) If the PCB passes through the wave soldering process in the negative direction of the X axis (left side) first, extract the solder mask window V in set A one by one. n The coordinate information (x n ,y n ), check its opening V with other solder mask layers of set A n+1 (x n+1 ,y n+1 ) are equal. If the ordinates are equal and are y, write them into set B, and extract the solder mask window coordinates B from set B in sequence n , calculate the distance d between it and other solder mask openings in set B n , d n =|x n -x n-1 |, if d n ≤d m , it means that the distance between the two vias is less than the safe distance, and there is a risk of solder short circuit. Take the coordinates [max(x n )+d m , y] and store it in set C.

[0045] Clear set B, continue to extract the solder mask window coordinate information from set A and compare it with other coordinates in set A, repeat the above steps until all solder mask windows in A are extracted.

[0046] (3) If the PCB passes through the wave soldering process in the positive direction of the Y axis (upper side) first, extract the solder mask window V in set A in sequence. n The coordinate information (x n ,y n ), check its opening V with other solder mask layers of set A n+1 (x n+1 ,y n+1 ) are equal. If the horizontal coordinates are equal to x, write the coordinates into set B, and extract the solder mask window coordinates B from set B in sequence n , calculate the distance d between it and other solder mask openings in set B n , d n =|y n -y n-1 |, if d n ≤d m , it means that the distance between the two vias is less than the safe distance, and there is a risk of solder short circuit. Take the coordinates [x, min (y n)-d m ] and store it in set C.

[0047] Clear set B, continue to extract the solder mask window coordinate information from set A and compare it with other coordinates in set A, repeat the above steps until all solder mask windows in set A are extracted.

[0048] (4) If the PCB passes through the wave soldering in the negative direction of the Y axis (lower side) first, extract the solder mask window V in set A in sequence. n The coordinate information (x n ,y n ), check its opening V with other solder mask layers of set A n+1 (x n+1 ,y n+1 ) are equal. If the horizontal coordinates are equal to x, write the coordinates into set B, and extract the solder mask window coordinates B from set B in sequence n , calculate the distance d between it and other solder mask openings in set B n , d n =|y n -y n-1 |, if d n ≤d m , it means that the distance between the two vias is less than the safe distance, and there is a risk of solder short circuit. Take the coordinates [x, max(y n )+d m ] and store it in set C.

[0049] Clear set B, continue to extract the solder mask window coordinate information from set A and compare it with other coordinates in set A, repeat the above steps until all solder mask windows in set A are extracted.

[0050] S13. Place the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file.

[0051] Read the coordinate information in set C, which is the location where the tin-drag pad needs to be added. Extract the coordinates from set C in turn and place a solder mask copper sheet with a width of 1mm at the corresponding position, that is, the tin-drag pad, until all the coordinates in set C are traversed and the tin-drag pad is placed.

[0052] Among them, the direction of adding the tin pad is related to the direction of the PCB through the wave soldering, for example Figure 2 As shown in the figure, the PCB board passes through the wave soldering direction from the right side first. Due to the effect of inertia, the excess solder paste tends to accumulate on the leftmost pad. The risk position is as follows Figure 2As shown in . Therefore, it is necessary to add a tinning pad to the left of the leftmost pad to drain the excess solder paste, that is, add it in the negative direction of the X axis. Similarly, if the left side passes first, it needs to be added in the positive direction of the X axis; if the top side passes first, it needs to be added in the negative direction of the Y axis; if the bottom side passes first, it needs to be added in the positive direction of the Y axis.

[0053] The method for adding tinning pads to a PCB file provided by an embodiment of the present invention, during the PCB file design stage, the user only needs to input the direction of the PCB passing through wave soldering, and the risk of tinning short circuit can be automatically detected, the position where the tinning pad needs to be added can be determined, and the tinning pad can be automatically added, so that the tinning risk point can be located more accurately, and the risk point can be solved by automatically adding the tinning pad, thereby improving work efficiency and the accuracy of adding the tinning pad.

[0054] The embodiment of the present invention also provides a device for adding a tinning pad to a PCB file, such as Figure 3 As shown, including:

[0055] A receiving unit 11 is used to receive a direction instruction of a PCB undergoing wave soldering;

[0056] The determination unit 12 is used to determine, from the first coordinate set, a solder mask window having the same horizontal coordinate / vertical coordinate as other solder mask windows and a distance between the solder mask windows and other solder mask windows less than or equal to the safety distance as the pending solder mask window according to the direction instruction of the PCB passing through the wave soldering, and determine the position coordinates of adding the drag solder pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file;

[0057] The placement unit 13 is used to place the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file.

[0058] The device for adding tinning pads to a PCB file provided by an embodiment of the present invention, during the PCB file design stage, the user only needs to input the direction of the PCB passing through wave soldering, and the risk of tinning short circuit can be automatically detected, the position where the tinning pad needs to be added can be determined, and the tinning pad can be automatically added, so that the tinning risk point can be located more accurately, and the risk point can be solved by automatically adding the tinning pad, thereby improving work efficiency and the accuracy of adding the tinning pad.

[0059] Optionally, the determination unit 12 is specifically used to determine from the first coordinate set that if the direction instruction of the PCB passing through the wave soldering is to first pass through the positive direction of the X axis, the openings of the solder mask layer have the same vertical coordinate y as other solder mask openings, and the distance between the openings of the solder mask layer and other solder mask openings is less than or equal to the safety distance d m The solder mask opening is taken as the pending solder mask opening, and [min(x n )-d m, y] is determined as the position coordinate of adding the tinning pad, where x n It is the horizontal coordinate of the window for the pending solder mask layer.

[0060] Optionally, the determination unit 12 is specifically used to determine from the first coordinate set that if the direction instruction of the PCB passing through the wave soldering is to first pass through the negative direction of the X axis, the openings of the solder mask layer have the same vertical coordinate y as other solder mask openings, and the distance between the openings of the solder mask layer and other solder mask openings is less than or equal to the safety distance d m The solder mask opening is taken as the pending solder mask opening, and [max(x n )+d m , y] is determined as the position coordinate of adding the tinning pad, where x n It is the horizontal coordinate of the window for the pending solder mask layer.

[0061] Optionally, the determination unit 12 is specifically used to determine from the first coordinate set that if the direction instruction of the PCB passing through the wave soldering is to first pass through the positive direction of the Y axis, the openings of the solder mask layer have the same horizontal coordinate x as other solder mask openings, and the distance between the openings of the solder mask layer and other solder mask openings is less than or equal to the safety distance d m The solder mask layer opening is taken as the pending solder mask layer opening, and [x, min(y n )-d m ] Determine the position coordinates for adding the solder pad, where y n It is the vertical coordinate of the window for the pending solder mask layer.

[0062] Optionally, the determination unit 12 is specifically used to determine from the first coordinate set that if the direction instruction of the PCB passing through the wave soldering is to first pass through the negative direction of the Y axis, the openings of the solder mask layer have the same horizontal coordinate x as other solder mask openings, and the distance between the openings of the solder mask layer and other solder mask openings is less than or equal to the safety distance d m The solder mask window is used as the pending solder mask window, and [x, max(y n )+d m ] Determine the position coordinates for adding the solder pad, where y n It is the vertical coordinate of the window for the pending solder mask layer.

[0063] The device of this embodiment can be used to execute the technical solution of the above method embodiment. Its implementation principle and technical effect are similar and will not be repeated here.

[0064] The embodiment of the present invention further provides a PCB manufacturing method, which uses the above-mentioned method of adding tinning pads to the PCB file to assist in designing the PCB file, thereby obtaining a PCB design file;

[0065] Make PCB based on PCB design files.

[0066] An embodiment of the present invention further provides a PCB, which is obtained by using the above PCB manufacturing method.

[0067] Since the PCB manufacturing method adopted in manufacturing the PCB is implemented based on the PCB file designed by the method of adding tinning pads to the above-mentioned PCB file, as described above, the method of adding tinning pads using the above-mentioned PCB file can more accurately locate the risk point of tinning, and solve the risk point by automatically adding tinning pads, thereby improving work efficiency and the accuracy of adding tinning pads. Furthermore, the PCB board manufactured based on the PCB file designed by the method of adding tinning pads to the above-mentioned PCB file can fundamentally avoid the risk of tinning short circuit caused by the DIP pad solder mask opening being too close, and has high reliability and safety.

[0068] An embodiment of the present invention further provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the steps of the method for adding a tinning pad to a PCB file are implemented.

[0069] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps of the method for adding a tinning pad to a PCB file are implemented.

[0070] Those skilled in the art can understand that all or part of the processes in the above method embodiments can be implemented by instructing related hardware through a computer program, and the computer program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes in the above method embodiments. The storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM).

[0071] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for adding a tinning pad to a PCB file, characterized in that: The method comprises: Receive direction instructions for PCB passing through wave soldering; According to the direction instruction of the PCB passing through the wave soldering, determine from the first coordinate set a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows is less than or equal to the safety distance as a pending solder mask window, and determine the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file; The tinning pad is placed according to the position coordinates of the added tinning pad to assist in designing the PCB file.

2. The method according to claim 1, characterized in that The step of determining, from the first coordinate set according to the direction instruction of the PCB passing through the wave soldering, a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows being less than or equal to a safety distance as a pending solder mask window, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window comprises: If the PCB passes through the wave soldering direction instruction to pass through the positive direction of the X axis first, then determine from the first coordinate set that the PCB has the same vertical coordinate y as the other solder mask layer openings and the distance between the PCB and the other solder mask layer openings is less than or equal to the safety distance d. m The solder mask opening is taken as the pending solder mask opening, and [min(x n )-d m , y] is determined as the position coordinate of the added tinning pad, where x n It is the horizontal coordinate of the undetermined solder mask layer window.

3. The method according to claim 1, characterized in that The step of determining, from the first coordinate set according to the direction instruction of the PCB passing through the wave soldering, a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows being less than or equal to a safety distance as a pending solder mask window, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window comprises: If the PCB passes through the wave soldering direction instruction to pass through the negative direction of the X axis first, then determine from the first coordinate set that the PCB has the same vertical coordinate y as the other solder mask layer openings and the distance between the PCB and the other solder mask layer openings is less than or equal to the safety distance d. m The solder mask opening is taken as the undetermined solder mask opening, and [max(x n )+d m , y] is determined as the position coordinate of the added tinning pad, where x n It is the horizontal coordinate of the undetermined solder mask layer window.

4. The method according to claim 1, characterized in that: The step of determining, from the first coordinate set according to the direction instruction of the PCB passing through the wave soldering, a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows being less than or equal to a safety distance as a pending solder mask window, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window comprises: If the PCB passes through the wave soldering direction instruction to pass through the positive direction of the Y axis first, then determine from the first coordinate set that the PCB has the same horizontal coordinate x as the other solder mask layer openings and the distance between the PCB and the other solder mask layer openings is less than or equal to the safety distance d. m The solder mask layer opening is used as the pending solder mask layer opening, and [x, min (y n )-d m ] is determined as the position coordinate of the added tinning pad, where y n It is the ordinate of the window of the undetermined solder mask layer.

5. The method according to claim 1, characterized in that The step of determining, from the first coordinate set according to the direction instruction of the PCB passing through the wave soldering, a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows being less than or equal to a safety distance as a pending solder mask window, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window comprises: If the PCB passes through the wave soldering direction instruction to pass through the negative direction of the Y axis first, then determine from the first coordinate set that the PCB has the same horizontal coordinate x as the other solder mask layer openings and the distance between the PCB and the other solder mask layer openings is less than or equal to the safety distance d. m The solder mask window is used as the pending solder mask window, and [x, max(y n )+d m ] is determined as the position coordinate of the added tinning pad, where y n It is the ordinate of the window of the undetermined solder mask layer.

6. A device for adding a tinning pad to a PCB file, characterized in that: The device comprises: A receiving unit, used for receiving a direction instruction of the PCB passing through wave soldering; A determination unit, for determining, from a first coordinate set, a solder mask window having the same horizontal coordinate or vertical coordinate as other solder mask windows and a distance between the solder mask windows and the other solder mask windows being less than or equal to a safety distance as a pending solder mask window according to a direction instruction of the PCB passing through wave soldering, and determining the position coordinates of adding a tinning pad according to the coordinates of the pending solder mask window, wherein the first coordinate set includes the coordinates of the solder mask windows of all DIP pads on the PCB file; The placement unit is used to place the tinning pad according to the position coordinates of the added tinning pad to assist in designing the PCB file.

7. A PCB manufacturing method, characterized in that: The method for adding tinning pads to a PCB file according to any one of claims 1 to 5 is used to assist in designing a PCB file, thereby obtaining a PCB design file; A PCB is manufactured based on the PCB design file.

8. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 5 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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