Universal clamping assembly for wave soldering of printed circuit board components

Abstract

The present application provides a universal clamping assembly for wave soldering of printed circuit board assemblies, comprising: a frame, a limiting plate, and a support rod; the frame having a first inner wall; the limiting plate being parallel to the first inner wall and slidably mounted within the frame along a first direction; the first direction being perpendicular to the first inner wall, so that an adjustable clamping space for clamping the printed circuit board assembly is formed between the limiting plate and the first inner wall; the support rod having a mounting portion and a supporting portion connected to the mounting portion; the mounting portion being detachably mounted on the frame; the supporting portion extending into the frame, the supporting portion having a first supporting surface for supporting the printed circuit board assembly; a soldering space for wave soldering the printed circuit board assembly is formed between the support rod, the frame, and the limiting plate. Through the above structure, a clamping function adaptable to printed circuit board assemblies of different sizes or structures is achieved, reducing processing costs and improving work efficiency.

Description

Technical Field

[0001] The present disclosure generally relates to wave soldering of printed circuit board assemblies, and more particularly to a universal clamping assembly for wave soldering of printed circuit board assemblies. Background Art

[0002] At present, the more advanced welding method for through-hole devices in printed circuit board assemblies of military products is: using selective wave soldering equipment for welding;

[0003] However, printed circuit board assemblies have various shapes, and the arrangement positions of components in the printed circuit board assemblies also need to be set according to actual needs; this requires the use of different clamping tools for clamping in actual production. For some special-shaped printed circuit board assemblies, clamping tools need to be customized separately, which affects processing efficiency and increases production costs. Summary of the Invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, it is desired to provide a universal clamping assembly for wave soldering of printed circuit board assemblies that can solve the above-mentioned technical problems.

[0005] The present application provides a universal clamping assembly for wave soldering of a printed circuit board assembly, comprising:

[0006] frame;

[0007] a limiting plate, the limiting plate being parallel to the first inner wall of the frame and being slidably mounted in the frame along a first direction; the first direction being perpendicular to the first inner wall, so that an adjustable clamping space for clamping the printed circuit board assembly is formed between the limiting plate and the first inner wall;

[0008] A support rod, the support rod having a mounting portion and a supporting portion connected to the mounting portion; the mounting portion is detachably mounted on the frame; the supporting portion extends into the frame, and the supporting portion has a first supporting surface for supporting the printed circuit board assembly;

[0009] A soldering space for wave soldering the printed circuit board assembly is formed between the support rods, the frame and the limiting plate.

[0010] According to the technical solution provided in the embodiment of the present application, a support plate is provided on the side of the limiting plate close to the first inner wall, the support plate is perpendicular to the limiting plate, and the support plate has a second support surface for supporting the printed circuit board assembly.

[0011] According to the technical solution provided in the embodiment of the present application, a slide groove is provided on the frame along the first direction, and a slider inserted into the slide groove is provided on the support plate; a locking device is provided on the frame, and the locking device has a first state and a second state; when the locking device is in the first state, the slider is locked with the slide groove, and when the locking device is in the second state, the slider is unlocked from the slide groove.

[0012] According to the technical solution provided in the embodiment of the present application, the mounting portion is adsorbed on the frame by magnetic force.

[0013] According to the technical solution provided in the embodiment of the present application, a telescopic mechanism is installed between the mounting portion and the supporting portion, and the telescopic mechanism is used to adjust the position of the supporting portion relative to the frame.

[0014] According to the technical solution provided in the embodiment of the present application, it also includes a limiting component, which is installed on the frame and is used to limit the components of the printed circuit board assembly.

[0015] According to the technical solution provided in the embodiment of the present application, the limiting assembly includes: an anti-static cloth bag and a plurality of beads arranged in the anti-static cloth bag; the anti-static cloth bag is placed on the frame and cooperates with the component on the side close to the printed circuit board assembly to form a compacted curved surface to limit the component.

[0016] According to the technical solution provided in the embodiment of the present application, it also includes a protective component, which is used to be detachably arranged on the non-welding area of ​​the printed circuit board assembly to isolate the non-welding area from welding heat.

[0017] According to the technical solution provided in the embodiment of the present application, the protective component includes a shielding cover, which is filled with blue tack, and the blue tack is used to be attached to the non-welding area of ​​the printed circuit board assembly.

[0018] According to the technical solution provided in the embodiment of the present application, the frame is a rectangular frame, and the first inner wall is located on any side of the inner wall of the rectangular frame.

[0019] The beneficial effects of the present application are as follows: when in use, the printed circuit board is placed into the adjustable clamping space, and the position of the limiting plate is adjusted so that it moves along the first direction, thereby causing the limiting plate and the first inner wall to clamp the printed circuit board assembly; at this time, according to the position of the printed circuit board assembly, the support rod is installed on the frame so that the first support surface is supported on the non-welding area of ​​the printed circuit board assembly. At this time, since a welding space for wave soldering the printed circuit board assembly is formed between the support rod, the frame, and the limiting plate, the components on the printed circuit board can be soldered using selective wave soldering equipment. Through the above structure, a clamping function that adapts to printed circuit board assemblies of different sizes or structures is achieved, which reduces processing costs and improves work efficiency. By providing a detachable support rod, the installation position of the first support surface can be adapted and adjusted according to the position of the printed circuit board assembly and the position of the non-welding area thereon, thereby avoiding the welding area being affected by the support structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features, objects and advantages of the present application will become more apparent upon reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0021] Figure 1 A schematic diagram of a top view of a universal clamping assembly for wave soldering of a printed circuit board assembly provided in this application;

[0022] Figure 2 for Figure 1 Schematic diagram of the limiting plate 2 sliding along the first direction;

[0023] Figure 3 A bottom-up structural schematic diagram of a universal clamping assembly for wave soldering of a printed circuit board assembly provided in this application;

[0024] Figure 4 for Figure 1 A schematic structural diagram of the support rod 3 is shown;

[0025] Figure 5 for Figure 1 The structural diagram of the limiting plate 2 is shown;

[0026] Figure 6 for Figure 1 The frame 1 is provided with a schematic structural diagram of a limit assembly;

[0027] Figure 7 for Figure 5 A schematic diagram of the structure of a protective component installed on the printed circuit board assembly 4 shown;

[0028] Numbers in the figure:

[0029] 1. Frame; 11. First inner wall; 12. Slide; 2. Limit plate; 3. Support rod; 31. Mounting portion; 32. Support portion; 4. Printed circuit board assembly; 41. Components; 5. Support plate; 51. Slider; 61. Anti-static bag; 62. Bead; 63. Compacted curved surface; 71. Shielding cover; 72. Blu-tack adhesive. DETAILED DESCRIPTION

[0030] The present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely for the purpose of explaining the relevant invention and are not intended to limit the invention. It should also be noted that, for ease of description, only portions relevant to the invention are shown in the accompanying drawings.

[0031] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0032] Please refer to Figure 1-Figure 3 A universal clamping assembly for wave soldering of a printed circuit board assembly provided in this application comprises:

[0033] Frame 1;

[0034] a limiting plate 2, the limiting plate 2 being parallel to the first inner wall 11 of the frame 1 and slidably mounted within the frame 1 along a first direction; the first direction being perpendicular to the first inner wall 11, so that an adjustable clamping space for clamping the printed circuit board assembly 4 is formed between the limiting plate 2 and the first inner wall 11;

[0035] A support rod 3, the support rod 3 having a mounting portion 31 and a support portion 32 connected to the mounting portion 31; the mounting portion 31 is detachably mounted on the frame 1; the support portion 32 extends into the frame 1, and the support portion 32 has a first support surface for supporting the printed circuit board assembly 4;

[0036] A soldering space for wave soldering the printed circuit board assembly 4 is formed between the support rod 3 , the frame 1 and the limiting plate 2 .

[0037] Specifically, the support rods 3 are provided in a number, that is, one, two or more can be selected according to actual needs; at the same time, it should be further explained that the support rods 3 can be detachably mounted on the frame 1, that is, different installation positions can be selected for installation so that the first supporting surface on the support rods 3 is located in the non-welding area of ​​the printed circuit board assembly.

[0038] Specifically, the limiting plate 2 is connected to a locking device, and the locking device is used to fix the relative position of the limiting plate 2 and the frame 1 after the position of the limiting plate 2 is adjusted.

[0039] Furthermore, the frame 1 is a rectangular frame, and the first inner wall 11 is located on any side of the inner wall of the rectangular frame.

[0040] Further, such as Figure 4 As shown, the support rod 3 is an L-shaped structure, that is, the mounting portion 31 and the support portion 32 are arranged perpendicular to each other;

[0041] Furthermore, the width of the first inner wall 11 and the width of the limiting plate 2 can be set according to actual needs.

[0042] Working Principle: During use, a printed circuit board (PCB) is placed within the adjustable clamping space. The position of the limiting plate 2 is adjusted to move in the first direction, thereby causing the limiting plate 2 and the first inner wall 11 to clamp the PCB assembly. Based on the position of the PCB assembly, the support rod 3 is mounted on the frame 1, so that the first support surface rests on the non-soldering area of ​​the PCB assembly. At this point, a soldering space for wave soldering the PCB assembly 4 is formed between the support rod 3, the frame 1, and the limiting plate 2, enabling components on the PCB to be soldered using selective wave soldering equipment.

[0043] The above structure allows for clamping of printed circuit board assemblies of varying sizes and structures, reducing processing costs and improving work efficiency. The provision of a detachable support rod 3 allows the mounting position of the first support surface to be adjusted to the position of the printed circuit board assembly and the non-welding area thereon, thereby preventing the welding area from being affected by the support structure.

[0044] In some embodiments, a support plate 5 is provided on the side of the limiting plate 2 close to the first inner wall 11 . The support plate 5 is perpendicular to the limiting plate 2 . The support plate 5 has a second support surface for supporting the printed circuit board assembly 4 .

[0045] Specifically, the limiting plate 2 and the support plate 5 can be an integrated structure or a separate structure. The support plate 5 is provided so that the edge of the printed circuit board assembly can be supported, thereby further improving the stability of the support structure.

[0046] In some embodiments, the frame 1 is provided with a slide groove 12 along the first direction, and the support plate 5 is provided with a slider 51 inserted into the slide groove 12. Figure 5 As shown; a locking device is provided on the frame 1, and the locking device has a first state and a second state; when the locking device is in the first state, the slider 51 is locked with the slide groove 12, and when the locking device is in the second state, the slider 51 is unlocked with the slide groove 12.

[0047] Specifically, the locking device includes threaded holes and screws arranged along a first direction on the side walls of the slide groove 12; when in use, the position of the support plate 5 in the first direction is adjusted. After the adjustment is completed, the screw is inserted into the threaded hole corresponding to the position of the support plate 5 and abuts against the side wall of the slider 51 to fix the relative position of the slider 51 and the slide groove 12.

[0048] In some embodiments, the mounting portion 31 is attached to the frame 1 by magnetic force.

[0049] Specifically, the frame 1 can be adsorbed by a magnet, such as an iron material or a stainless steel material; the mounting portion 31 is a strong magnetic component, so that the mounting portion can be adsorbed on the stainless steel frame by magnetic force.

[0050] In some embodiments, a telescopic mechanism is installed between the mounting portion 31 and the supporting portion 32 , and the telescopic mechanism is used to adjust the position of the supporting portion 32 relative to the frame 1 .

[0051] Specifically, the telescopic mechanism may be, for example, a telescopic rod;

[0052] In some embodiments, the universal clamping assembly for wave soldering of a printed circuit board assembly further includes a position limiting assembly mounted on the frame 1 for limiting the position of components 41 of the printed circuit board assembly 4. By limiting the position of the components 41, the position of the components 41 is prevented from changing during soldering, thereby preventing the normal soldering process from being affected.

[0053] In some embodiments, as Figure 6 As shown, the limiting component includes: an anti-static bag 61 and a plurality of beads 62 arranged in the anti-static bag 61; the anti-static bag 61 is placed on the frame 1, and cooperates with the component 41 on the side close to the printed circuit board assembly 4 to form a compacted curved surface 63 to limit the component 41.

[0054] Specifically, the beads 62 are made of glass or other high-temperature resistant materials with comparable density.

[0055] Specifically, due to the beads 62 within the anti-static bag 61, when the bag is placed on the printed circuit board assembly 4, one side of the bag 61 contacts the component 41, forming a compacted curved surface under the action of gravity. This compacts and limits the position of the component 41, preventing it from shifting during processing.

[0056] In some embodiments, the universal wave soldering clamp assembly for printed circuit board assembly further includes a protective assembly that is removably attached to a non-soldering area of ​​the printed circuit board assembly 4 to isolate the non-soldering area from soldering heat. The protective assembly ensures the quality of the non-soldering area of ​​the printed circuit board assembly 4.

[0057] In some embodiments, as Figure 7 As shown, the protection assembly includes a shielding cover 71 , and the shielding cover 71 is filled with blue glue 72 . The blue glue 72 is used to be attached to the non-welding area of ​​the printed circuit board assembly 4 .

[0058] Specifically, the shielding cover 71 is a metal sheet structure, one end of the shielding cover 71 is open, and a filling space for filling the blue glue 72 is provided in the opening.

[0059] Specifically, the molding thickness of the shielding cover 71 does not exceed 2 mm; by setting the protective component, solder and heat cannot reach non-wave soldering points, ensuring the quality of non-welding areas. At the same time, the protective component is easy to remove after selective wave soldering and can be used again without residual glue.

[0060] The above description is merely a preferred embodiment of the present application and an illustration of the technical principles employed. Those skilled in the art should understand that the scope of the invention herein is not limited to the technical solutions formed by the specific combination of the above-mentioned technical features, but also encompasses other technical solutions formed by any combination of the above-mentioned technical features or their equivalents without departing from the inventive concept. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features having similar functions disclosed in this application.

Claims

1. A universal clamping assembly for wave soldering of printed circuit board components, characterized in that: include: Frame (1); a limiting plate (2), the limiting plate (2) being parallel to a first inner wall (11) of the frame (1) and being slidably mounted in the frame (1) along a first direction; the first direction being perpendicular to the first inner wall (11), so that an adjustable clamping space for clamping the printed circuit board assembly (4) is formed between the limiting plate (2) and the first inner wall (11); A support rod (3), the support rod (3) having a mounting portion (31) and a support portion (32) connected to the mounting portion (31); the mounting portion (31) is detachably mounted on the frame (1); the support portion (32) extends into the frame (1), and the support portion (32) has a first support surface for supporting the printed circuit board assembly (4); Wherein, a welding space for wave soldering the printed circuit board assembly (4) is formed between the support rod (3), the frame (1), and the limit plate (2); Also includes a limit assembly, the limit assembly is mounted on the frame (1), for limiting the components (41) of the printed circuit board assembly (4); The limiting assembly comprises: an antistatic cloth bag (61) and a plurality of beads (62) arranged in the antistatic cloth bag (61); the antistatic cloth bag (61) is placed on the frame (1), and forms a compacted curved surface (63) with the component (41) on a side close to the printed circuit board assembly (4) to limit the component (41); the beads (62) are made of glass or other high-temperature resistant materials with equivalent density.

2. The universal clamping assembly for wave soldering of a printed circuit board assembly according to claim 1, characterized in that: A support plate (5) is provided on one side of the limiting plate (2) close to the first inner wall (11), the support plate (5) being perpendicular to the limiting plate (2), and the support plate (5) having a second support surface for supporting the printed circuit board assembly (4).

3. The universal clamping assembly for wave soldering of a printed circuit board assembly according to claim 2, characterized in that: The frame (1) is provided with a slide groove (12) along the first direction, and the support plate (5) is provided with a slider (51) inserted into the slide groove (12); the frame (1) is provided with a locking device, and the locking device has a first state and a second state; when the locking device is in the first state, the slider (51) is locked with the slide groove (12), and when the locking device is in the second state, the slider (51) is unlocked from the slide groove (12).

4. The universal clamping assembly for wave soldering of a printed circuit board assembly according to claim 1, characterized in that: The mounting portion (31) is adsorbed on the frame (1) by magnetic force.

5. The universal clamping assembly for wave soldering of a printed circuit board assembly according to claim 1, characterized in that: A telescopic mechanism is installed between the mounting portion (31) and the supporting portion (32), and the telescopic mechanism is used to adjust the position of the supporting portion (32) relative to the frame (1).

6. The universal clamping assembly for wave soldering of a printed circuit board assembly according to any one of claims 1 to 5, characterized in that: It also includes a protection component, which is used to be detachably arranged on the non-welding area of ​​the printed circuit board component (4) to isolate the non-welding area from welding heat.

7. The universal clamping assembly for wave soldering of a printed circuit board assembly according to claim 6, characterized in that: The protective assembly comprises a shielding cover (71), wherein the shielding cover (71) is filled with blue glue (72), and the blue glue (72) is used for being attached to the non-welding area of ​​the printed circuit board assembly (4).

8. The universal clamping assembly for wave soldering of a printed circuit board assembly according to any one of claims 1 to 5, characterized in that: The frame (1) is a rectangular frame, and the first inner wall (11) is located on any one side of the inner wall of the rectangular frame.

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