Device and method for detecting temperature of an electrically coupled element

Abstract

The invention relates to a device for detecting the temperature of an electrically coupled element, comprising an electrical contact element (100) designed to deliver an electrical current to the electrical element and a component carrier (103) arranged on the contact element (100) and comprising a thermally conductive region (106) in direct contact with the contact element (100), wherein a printed circuit board (104) is arranged on the component carrier (103), the printed circuit board (104) comprising at least one temperature sensor (105) for detecting the temperature of the electrically coupled element.

Description

Technical Field

[0001] This invention relates to an apparatus for detecting the temperature of an electrical coupling element. This invention also relates to a method for detecting the temperature of an electrical coupling element. Background Technology

[0002] During the charging process of electric vehicles, heat is generated within the electrical coupling components (such as the charging socket and charging plug) due to the transfer of current and voltage. The heat generated during current flow can cause the charging socket and charging plug to overheat. To ensure the safe operation of the charging process, the temperature of the current-carrying and voltage-carrying components of the charging socket and charging plug must be measured. This can be achieved using temperature sensors connected to the current-carrying and voltage-carrying components via cables. This requires significant installation work and a long heat conduction path. Alternatively, temperature can be measured using temperature sensors mounted on a printed circuit board.

[0003] DE 10 2019 114 229 A1 relates to a charging plug, particularly for electric vehicles, wherein the charging plug has circuitry on a printed circuit board, a component carrier, and at least one contact element transverse to the printed circuit board, wherein the circuitry for the contact element has a temperature sensor and the component carrier is composed of an electrically insulating, thermally conductive material, wherein the temperature sensor is disposed in an edge region of the printed circuit board on the front side of the printed circuit board oriented transversely relative to the contact element, and the component carrier is disposed between the contact element and the temperature sensor as both an electrically insulating and thermally conductive material, wherein the component carrier is in contact with the contact element at least in the region of the temperature sensor, and the temperature sensor is disposed in a recess in the component carrier. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to perform effective temperature measurement of current-carrying and voltage-carrying components during charging using the simplest possible means in terms of structure.

[0005] This technical problem is solved by the subject matter of the independent claims. Advantageous further embodiments of the invention are pointed out in the dependent claims, the description, and the drawings.

[0006] One aspect of the invention relates to an apparatus for detecting the temperature of an electrically coupled element, the apparatus comprising an electrical contact element designed to deliver current to an electrical element and a component carrier disposed on the contact element, the component carrier including a thermally conductive region in direct contact with the contact element, wherein a printed circuit board is disposed on the component carrier, the printed circuit board including at least one temperature sensor that detects the temperature of the contact element, thereby detecting the temperature of the electrically coupled element.

[0007] Electrical coupling elements can be charging sockets or charging plugs required during the charging process, especially in electric vehicles. To charge an electric vehicle, an electrical coupling element (e.g., a charging socket) is coupled to another electrical coupling element (e.g., a charging plug). For example, a contact element is a high-voltage pin located inside the electrical coupling element. This contact element can, in particular, be made of a metallic material. An electrical coupling element can have multiple contact elements. During charging, high voltage and charging current flow through the contact elements.

[0008] A component carrier is arranged on the contact element, comprising a thermally conductive region in direct contact with the contact element. This component carrier preferably comprises a rigid component, such as a thermoplastic, and a flexible component serving as the thermally conductive region. The thermally conductive region, as the flexible component, is used to directionally transfer heat from the contact element to the temperature sensor. Rigid components are required to facilitate highly automated assembly. Furthermore, the geometry of the rigid component is configured to exceed the required minimum air gap and creepage distance between the contact element and the temperature sensor. The rigid component has a very low thermal conductivity (e.g., 0.15 W / (m·K)), thus minimizing heat flow to the surrounding air and adjacent components. The component carrier can be threaded onto the contact element. The thermally conductive region provides electrical isolation between the contact element and the temperature sensor. Heat flow from the contact element is conducted to the temperature sensor through the thermally conductive region. For example, an elastomer can be designed as the thermally conductive region. Similarly, the thermally conductive region can comprise a ceramic or mineral element that provides a higher thermal conductivity. For example, the thermal conductivity of the thermally conductive region can be 1.5 W / (m·K). However, it should be noted that excessively high filler levels can cause the elastomer to harden, making it difficult to bond with contact elements and printed circuit boards. Therefore, a compromise must be made between thermal conductivity and hardness in the thermally conductive areas.

[0009] The component carrier may include another region composed of rigid components, such as thermoplastic. This region is designed to withstand mechanical stress and facilitates assembly of the component carrier onto the contact element. The mechanical requirements of the component carrier may vary depending on the manufacturing and assembly processes. Furthermore, this other region achieves only low thermal conductivity, allowing heat flow to be conducted to the temperature sensor via the thermally conductive area. The shape of the component carrier ensures adequate air gaps and creepage distances for high-voltage / low-voltage isolation. A collar is provided for this purpose, parallel to the surface of the contact element and electrically insulating the contact element from the printed circuit board. The temperature sensor is positioned on the side of the printed circuit board furthest from the component carrier to protect it from mechanical stress.

[0010] The component carrier can be placed on the shoulder of the contact element. The shoulder can be a protrusion of the contact element. The shoulder can be circumferentially surrounding the contact element.

[0011] A printed circuit board (PCB) is arranged on a component carrier. The PCB can be attached to the component carrier via clamping components. The PCB is referred to as a PCB. A temperature sensor is arranged on the PCB, positioned as close as possible to the heat-conducting area and contact components. The temperature sensor can be soldered onto the PCB. The temperature sensor can operate at low voltage levels (e.g., up to 12 volts). By placing the temperature sensor directly in the heat-conducting area, heat loss is minimized, ensuring the accuracy of the temperature sensor's readings.

[0012] Temperature sensors detect the temperature of electrically coupled components and map it into an electrical signal. The temperature sensor is electrically insulated from the contact element and is positioned outside the high-voltage area of ​​the contact element.

[0013] The device may include a housing composed of multiple parts. The housing may be made of an electrically insulating material. The housing may have receiving portions for multiple contact elements. The contact elements may be pressed into a rear housing element. Component carriers, printed circuit boards, and temperature sensors may be arranged between the rear and front housing elements, and these are enclosed within the housing when the housings are assembled. For example, the housings may be plugged together.

[0014] A resilient gasket can be positioned between the front housing component and the printed circuit board. The gasket may have bumps in the area of ​​the temperature sensor. These bumps can serve as stop surfaces for the printed circuit board. The bumps can also be resilient. The bumps can compensate for component tolerances. Contact elements can be fixed within the rear housing component. For example, the contact elements can be press-fitted into the rear housing component. The front and rear housing components can be joined together to enclose the component carrier and circuit board within the housing.

[0015] Furthermore, the printed circuit board is placed directly on the thermally conductive area. To protect the temperature sensor from mechanical stress, the temperature sensor is placed on the side of the printed circuit board away from the thermally conductive area.

[0016] Furthermore, thermal paste can be inserted between the contact element and the component carrier and / or between the component carrier and the printed circuit board to increase thermal conductivity. The temperature sensor can then be thermally coupled to the printed circuit board and the component carrier using thermally conductive materials. The increased thermal conductivity ensures the accuracy of the detected temperature values.

[0017] In a preferred embodiment, the circuit board includes thermally conductive elements to increase its thermal conductivity. For example, copper elements can be embedded in the printed circuit board as thermally conductive elements. To this end, elements with high thermal conductivity, such as thermal vias made of copper, are embedded in the printed circuit board precisely in the area of ​​the temperature sensor. The printed circuit board may have thermally conductive elements directly at the temperature sensor location.

[0018] Furthermore, at least one other printed circuit board is arranged on the component carrier, which includes at least one other temperature sensor. Through this additional printed circuit board and temperature sensor, the temperature of the contact element can be detected at multiple measuring points. By detecting the temperature at multiple measuring points of the contact element, temperature deviations of the contact element can be taken into account. To detect the total temperature, the detected values ​​can be averaged.

[0019] The present invention also relates to a method for detecting the temperature of an electrically coupled element, comprising providing an electrical contact element configured to deliver current to an electrical element, arranging a component carrier on the contact element, the component carrier including a thermally conductive region in direct contact with the electrically coupled element, and arranging a printed circuit board on the component carrier, the printed circuit board including at least one temperature sensor, wherein the temperature of the electrically coupled element is detected by the temperature sensor.

[0020] The temperature is measured on the side of the printed circuit board away from the heat-conducting area.

[0021] In addition, thermal paste is introduced between the contact element and the component carrier and / or between the component carrier and the printed circuit board to increase thermal conductivity. The thermal paste can be elastic or malleably deformable.

[0022] In another embodiment, the arrangement of the component carrier on the contact element involves injection molding plastic onto the contact element. Therefore, the component carrier can be directly injection molded onto the contact element as an injection molded part. This enables a high degree of automation during the assembly of the electrical coupling components.

[0023] In addition, at least one other printed circuit board, which includes at least one other temperature sensor, is arranged on the component carrier. Attached Figure Description

[0024] A preferred embodiment of the present invention will now be explained with reference to the accompanying drawings. In the drawings:

[0025] Figure 1 A cross-sectional view of an electrical contact element according to a first embodiment is shown.

[0026] Figure 2 A cross-sectional view of an electrical contact element according to a second embodiment is shown.

[0027] Figure 3 A cross-sectional view of an electrical contact element according to a third embodiment is shown.

[0028] The accompanying drawings are merely illustrative and are used only to explain the invention. Identical or similar elements are labeled using the same reference numerals throughout. Detailed Implementation

[0029] Figure 1 A cross-sectional view of an electrical contact element 100 according to a first embodiment is shown.

[0030] Electrical contact element 100 is part of an electrical coupling element. For example, the electrical coupling element may be a charging plug or charging socket, particularly for electric vehicles. In a first embodiment, electrical contact element 100 is a pin 100. The pin 100 is inserted into and mechanically connected to the rear housing element 101 of a two-piece housing. For example, the rear housing element 101 may be interconnected with the front housing element 102 via threaded connections, clamps, or welding. A component carrier 103 and a printed circuit board 104 are arranged between the rear housing element 101 and the front housing element 102.

[0031] The printed circuit board 104 rests against and is fixed to the component carrier 103. A temperature sensor 105 is located on the side of the printed circuit board 104 opposite to the component carrier 103. The temperature sensor 105 is used to detect the temperature of the electronic component, particularly the temperature of the pin 100.

[0032] Furthermore, the component carrier 103 includes a thermally conductive region 106. The temperature sensor 105 is arranged as close as possible to the contact point between the pin 100 and the thermally conductive region 106. The thermally conductive region 106 may include a thermally conductive elastomer. Therefore, heat from the pin 100 flows through the thermally conductive region 106 of the component carrier 103, through the printed circuit board 104, and reaches the temperature sensor 105. To improve the thermal conductivity of the printed circuit board 104, the printed circuit board 104 may have a thermally conductive element within the region of the temperature sensor 105.

[0033] The component carrier 103 isolates the temperature sensor 105 from the high voltage applied to the pin 100 during operation. In addition to the thermally conductive region 106, the component carrier 103 also includes a hard component region 107 with low thermal conductivity. For example, the hard component region 107 may have a thermal conductivity of 0.15 W / (m·K). Furthermore, the hard component region 107 is mechanically resistant.

[0034] The component carrier 103 is arranged on the protrusion 109 of the contact element 100 such that the heat-conducting region 106 directly abuts against the protrusion 109 of the contact element 100. Therefore, heat flow is directly conducted from the contact element 100 to the temperature sensor 105 through the heat-conducting region 106.

[0035] An elastic sealing gasket 108 is arranged on the pin 100, which seals the pin 100, for example, in a fluid-tight manner. The sealing gasket 108 is inserted into the front housing element 102.

[0036] Figure 2A cross-sectional view of an electrical contact element 100 according to a second embodiment is shown.

[0037] According to a second embodiment, the rigid component region 107 is composed of thermoplastic. The thermally conductive region 106 is made of ceramic. The ceramic, together with the thermoplastic, exhibits structural mechanical properties, thus withstanding mechanical stress and ensuring thermal conductivity. Thermal paste 110 is applied between the pin 100 and the component carrier 103, and between the component carrier 103 and the printed circuit board 104. According to another embodiment, the thermal paste 110 is applied between the component carrier 103 and the printed circuit board 104, or between the pin 100 and the component carrier 103.

[0038] Figure 3 A cross-sectional view through the electrical contact element 100 according to the third embodiment is shown.

[0039] According to the third embodiment, a component carrier 103 is wrapped around the pin 100. Here, the component carrier 103 is made of plastic, particularly an elastomer. In the region between the front housing element 102 and the rear housing element 101, the elastomer is injection-molded onto the protrusion 109 of the pin 100. The printed circuit board 104 rests directly against the component carrier 103 and is secured to it, for example, by a clamping element. An elastic sealing gasket 108 has a protrusion 111 on the side facing the temperature sensor 105. The protrusion 111 abuts against the surface of the printed circuit board 104 where the temperature sensor 105 is arranged and protects the temperature sensor 105 from mechanical stress, particularly when the front housing element 102 and the rear housing element 101 are mated together. Furthermore, the protrusion 111 can compensate for component tolerances. The protrusion 111 can also be elastic.

[0040] For ease of assembly, pin 100 is secured in rear housing element 101. For example, pin 100 can be pressed into rear housing element 101. Thermal paste 110 can be applied to component carrier 103. Alternatively, thermal paste 110 can also be applied to contact element 100. Subsequently, printed circuit board 104 is attached to the surface of component carrier 103 coated with thermal paste 110. Sealing gasket 108 is disposed on front housing element 102. Front housing element 102 slides on pin 100, thereby simultaneously pressing component carrier 103 and printed circuit board 104 together against pin 100.

[0041] The proposed method is low-cost and simple in structure. Thermal coupling of the temperature sensor to the contact element via the thermally conductive areas of the printed circuit board and component carrier simplifies temperature detection and ensures improved measurement accuracy. The component carrier can be manufactured as a plastic injection-molded part and directly injection-molded onto the contact element. Assembly of the electrical coupling elements can be automated through plug-in assembly.

[0042] List of reference numerals

[0043] 100 contact elements

[0044] 101 Rear Housing Component

[0045] 102 Front housing component

[0046] 103 Component Carrier

[0047] 104 Printed Circuit Board

[0048] 105 Temperature Sensor

[0049] 106 Thermal Conductive Area

[0050] 107 Hardware Components Area

[0051] 108 Sealing Gasket

[0052] 109 protrusions

[0053] 110 Thermal paste

[0054] 111 bumps

Claims

1. A device for detecting the temperature of an electrically coupled element, the device comprising: An electrical contact element (100) is designed to deliver current to an electrical component; A component carrier (103) is provided, which can be disposed on the electrical contact element (100), and the component carrier (103) includes a thermally conductive region (106) in direct contact with the electrical contact element (100), wherein, A printed circuit board (104) is arranged on the component carrier (103), the printed circuit board (104) including at least one temperature sensor (105) that detects the temperature of the electrical contact element (100) and thereby detects the temperature of the electrical coupling element; The printed circuit board (104) is directly disposed on the heat-conducting area (106) of the component carrier (103), and the temperature sensor (105) is disposed on the side of the printed circuit board (104) away from the heat-conducting area (106).

2. The apparatus according to claim 1, characterized in that, Thermal paste (110) for increasing thermal conductivity is introduced between the electrical contact element (100) and the component carrier (103) and / or between the component carrier (103) and the printed circuit board (104).

3. The apparatus according to any one of the preceding claims, wherein, The printed circuit board (104) includes a thermally conductive element for increasing the thermal conductivity of the printed circuit board (104).

4. The apparatus according to any one of the preceding claims, characterized in that, At least one other printed circuit board (104) is arranged on the component carrier (103), the at least one other printed circuit board including at least one other temperature sensor (105).

5. A method for detecting the temperature of an electrically coupled element, the method comprising: An electrical contact element (100) is provided, the electrical contact element being designed to conduct current to an electrical component. A component carrier (103) is arranged on the electrical contact element (100), wherein, The component carrier (103) includes a heat-conducting region (106) in direct contact with the electrical contact element (100), and A printed circuit board (104) is arranged on a component carrier (103), the printed circuit board (104) including at least one temperature sensor (105), wherein the temperature of the electrical contact element (100) is detected by the temperature sensor (105) and thereby the temperature of the electrical coupling element; The printed circuit board (104) is directly disposed on the heat-conducting area (106), and the temperature sensor (105) is disposed on the side of the printed circuit board (104) away from the heat-conducting area (106).

6. The method according to claim 5, characterized in that, The temperature is measured on the side of the printed circuit board (104) away from the heat-conducting area (106).

7. The method according to claim 5 or 6, characterized in that, Thermal paste (110) for increasing thermal conductivity is introduced between the electrical contact element (100) and the component carrier (103) and / or between the component carrier (103) and the printed circuit board (104).

8. The method according to any one of claims 5 to 7, wherein, Arranging the component carrier (103) on the electrical contact element (100) includes directly injection molding the component carrier (103) onto the electrical contact element (100) as an injection molded part.

9. The method according to any one of claims 5 to 8, characterized in that, At least one other printed circuit board (104) is arranged on the component carrier (103), which includes at least one other temperature sensor (105).

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