An apparatus for cleaning semiconductor wafers

Abstract

The present invention discloses a device for cleaning semiconductor silicon wafers, specifically relating to the technical field of semiconductor silicon wafer cleaning, comprising an installation top frame and a supporting bottom frame, wherein a partition mechanism is fixedly installed on the top end of the supporting bottom frame, and a first transport mechanism is fixedly installed on the bottom end of the installation top frame. The present invention, by arranging a partition mechanism, a placement mechanism and a cleaning component and using the first transport mechanism in conjunction with the above, can synchronously and automatically move multiple semiconductor silicon wafers to separate cleaning spaces, perform high-speed rotation cleaning on each semiconductor silicon wafer individually, prevent cross contamination between each semiconductor silicon wafer, thereby improving the cleaning quality of the semiconductor silicon wafers, and by arranging a second transport mechanism and using the cleaning component in conjunction with the above, perform automatic physical wiping and cleaning on the automatically driven semiconductor silicon wafers, further improving the cleaning effect of the semiconductor silicon wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor silicon wafer cleaning, in particular to a device for cleaning semiconductor silicon wafers. Background Art

[0002] Silicon wafers, also known as silicon wafers, are an important material for making integrated circuits. Through photolithography, ion implantation, and other methods, silicon wafers can be made into integrated circuits and various semiconductor devices. Silicon wafers are sheet-like objects made of silicon. In the production of semiconductor devices, silicon wafers must be strictly cleaned. Even trace contamination can cause device failure. The purpose of cleaning is to remove surface contaminants, including organic and inorganic matter. These impurities may exist in atomic or ionic form, or in the form of thin films or particles on the surface of the silicon wafer, which can cause various defects. There are two methods to remove contamination: physical cleaning and chemical cleaning.

[0003] The traditional semiconductor silicon wafer cleaning process mostly involves arranging multiple semiconductor silicon wafers neatly on a rack in sequence. Subsequently, the multiple semiconductor silicon wafers are placed in a cleaning machine with cleaning fluid for centralized cleaning. Although this can improve cleaning efficiency, since multiple semiconductor silicon wafers are cleaned together, cross-infection is prone to occur during cleaning, which in turn affects the cleaning quality of the semiconductor silicon wafers. Therefore, we propose a device for cleaning semiconductor silicon wafers to solve the above problem. Summary of the Invention

[0004] The object of the present invention is to provide a device for cleaning semiconductor silicon wafers to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: A device for cleaning semiconductor silicon wafers, comprising an installation top frame and a supporting bottom frame, a partition mechanism is fixedly installed on the top end of the supporting bottom frame, a first transport mechanism is fixedly installed on the bottom end of the installation top frame, a placement mechanism used in conjunction with the partition mechanism is fixedly installed on the bottom end of the first transport mechanism, a first lifting rod is fixedly installed at the middle position of one side of the bottom end of the installation top frame close to the supporting bottom frame, a cleaning component used in conjunction with the partition mechanism and the placement mechanism is fixedly installed on the driving end of the first lifting rod, a second transport mechanism is fixedly installed on one side of the supporting bottom frame, and a cleaning component is installed on the top end of the second transport mechanism.

[0006] Preferably, the partition mechanism includes a partition card rack, which is fixedly mounted on the top of the supporting bottom frame, and four partition members distributed at equal distances are fixedly provided on the partition card rack, and the partition members include a liquid-repellent bottom frame, which is fixedly connected to the partition card rack, and two symmetrically distributed first partition side frames are fixedly mounted on the top of the liquid-repellent bottom frame, and a first support frame is fixedly mounted on the bottom of the opposite sides of the two first partition side frames, and the opposite sides of the two first support frames are integrally formed with a card strip, and a storage chassis is rotatably provided between the two first support frames, and the storage chassis is rotatably connected to the card strip, and a protective gasket is fixedly connected to the upper surface of the storage chassis, and the tops of the two partition card racks are fixedly provided with a first telescopic rod set obliquely, and the driving ends of the first telescopic rods are fixedly provided with positioning blocks, and the bottom ends of the positioning blocks are rollingly provided with rubber balls.

[0007] Preferably, a drive shaft is fixedly installed in the middle of the bottom end of the storage chassis, and the drive shaft is rotatably installed in the middle of the liquid-absorbing bottom frame through a sealing rotating part. The bottom of the drive shaft passes through the lower surface of the liquid-absorbing bottom frame, and the outer sides of multiple drive shafts are fixedly sleeved with a pulley transmission group. A drive motor is fixedly installed on the lower wall of the support bottom frame, and the driving end of the drive motor and the bottom end of one of the drive shafts are fixedly installed.

[0008] Preferably, a drainage trough is provided on one side of the bottom end of the liquid buffer bottom frame, and drainage branches are fixedly installed in the drainage troughs. A drainage main pipe is fixedly installed at the ends of multiple drainage branches, and the end of the drainage main pipe passes through the supporting bottom frame.

[0009] Preferably, the first transport mechanism includes two horizontally arranged linear electric cylinders, the two linear electric cylinders are fixedly mounted on the bottom end of the mounting top frame, the driving ends of the linear electric cylinders are fixedly mounted with a connecting frame, and the bottom ends of the connecting frames are fixedly mounted with a second lifting rod on both sides; the storage mechanism includes two symmetrically distributed storage side frames, the storage side frames are fixedly mounted on the driving ends of the corresponding second lifting rods, and a number of storage pieces corresponding to the number of partition pieces are fixedly mounted between the two storage side frames, and the storage pieces include two symmetrically distributed second partition side frames, and the second partition side frames are respectively fixedly mounted on the corresponding storage side frames. The second partition side frames are movably connected between the two first partition side frames, and the first partition side frames and the second partition side frames are combined into a complete annular partition frame. The bottoms of the opposite sides of the two second partition side frames are each provided with a second support frame, and the second support frames are movably connected between the two first support frames, and the first support frame and the second support frame are combined into a complete annular support frame. A second telescopic rod is fixedly provided at the bottom of the second partition side frame, and the driving end of the second telescopic rod is fixedly installed to the middle part of the corresponding second support frame, and the bottoms of the opposite sides of the two second partition side frames are each provided with a storage groove corresponding to the second support frame.

[0010] Preferably, the cleaning assembly includes a cleaning bracket, which is fixedly mounted on the driving end of the first lifting rod, and the cleaning bracket is fixedly provided with a number of cleaning parts corresponding to the partition parts, and the cleaning parts include a cleaning outer cover, the cleaning outer cover is fixedly clamped on the cleaning bracket, the middle part of the cleaning outer cover is provided with an observation window, the bottom end of the cleaning outer cover is fixedly installed with a sealing ring, the top of the annular partition frame is provided with a sealing groove corresponding to the cleaning outer cover, the bottom of the cleaning outer cover is movably clamped in the sealing groove, and the sealing ring is in contact with the inner wall of the sealing groove; the middle part of the cleaning outer cover is fixedly clamped with a liquid inlet pipe, the bottom of the liquid inlet pipe extends into the cleaning outer cover and is provided with a wide-surface nozzle, the top of the liquid inlet pipe is fixedly clamped with a connector, and one side of multiple connectors is fixedly mounted with a first main pipe and a second main pipe.

[0011] The lifting mechanism comprises two pieces of symmetrically distributed transport side frames, each of the two transport side frames being fixedly mounted on one side of the supporting bottom frame, and a plurality of evenly distributed transport electric rollers are provided between the transport side frames, and a transport belt is movably sleeved on the outer sides of the plurality of transport electric rollers; the cleaning assembly comprises a U-shaped frame, the U-shaped frame being fixedly clamped in the middle of the top end of one of the transport side frames, a feeding electric roller and a receiving electric roller are respectively provided on both sides of the top of the U-shaped frame, the outer sides of the feeding electric roller are detachably sleeved with a cylindrical cleaning cloth, the outer sides of the receiving electric roller are detachably sleeved with a receiving drum, both sides of the bottom of the U-shaped frame are rotatably mounted with guide rollers, and a cleaning bracket is fixedly mounted in the middle position of the U-shaped frame, a high-frequency telescopic rod is fixedly mounted in the middle of the cleaning bracket, the driving end of the high-frequency telescopic rod passes through the cleaning bracket and is fixedly mounted on the mounting plate, and a pressing plate is fixedly mounted on the bottom end of the mounting plate, and guide shafts are installed at the four corners of the top end of the mounting plate, and the guide shafts movably pass through the cleaning bracket.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] By setting up a partition mechanism, a placement mechanism and a cleaning component and using the first transport mechanism in conjunction with them, multiple semiconductor silicon wafers can be automatically moved to separate cleaning spaces simultaneously, and each semiconductor silicon wafer can be cleaned individually at high speed to prevent cross-contamination between each semiconductor silicon wafer, thereby improving the cleaning quality of the semiconductor silicon wafers. By setting up a second transport mechanism and using the cleaning component in conjunction with them, the automatically transmitted semiconductor silicon wafers can be automatically physically wiped and cleaned, further improving the cleaning effect of the semiconductor silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 It is a structural schematic diagram of the present invention.

[0016] Figure 2 It is a schematic diagram of the structural connection of the partition mechanism, the storage mechanism and the cleaning component in the present invention.

[0017] Figure 3 It is a schematic diagram of the partial structural connection of the partition mechanism, the storage mechanism and the cleaning component in the present invention.

[0018] Figure 4 For the present invention Figure 3 Enlarged view of point A in the middle.

[0019] Figure 5 For the present invention Figure 3 Enlarged view of point B in the middle.

[0020] Figure 6 For the present invention Figure 3 Enlarged view of point C in the middle.

[0021] Figure 7 It is a partial structural connection diagram of the partition mechanism in the present invention.

[0022] Figure 8 For the present invention Figure 7 Enlarged view of point D in the middle.

[0023] Figure 9 It is a structural schematic diagram of the cleaning component in the present invention.

[0024] Figure 10 It is a schematic diagram of the structural connection between the second transport mechanism and the cleaning component in the present invention.

[0025] In the figure: 1-mounting top frame; 2-supporting bottom frame; 3-partitioning mechanism; 4-first transporting mechanism; 5-placement mechanism; 6-first lifting rod; 7-cleaning assembly; 8-second transporting mechanism; 9-cleaning assembly; 10-driving motor; 31-partitioning bracket; 32-partitioning element; 33-liquid buffer bottom frame; 34-first partitioning side frame; 35-first supporting frame; 351-card strip; 36-placement bottom plate; 361-protective gasket; 37-drive shaft; 371-pulley transmission group; 38-first telescopic rod; 39-positioning block; 391-rubber ball; 331-drainage trough; 310-drainage branch pipe; 311-drainage main pipe; 51-placement side frame; 52-placement element; 53 -Second partition side frame; 54-Second support frame; 541-Storage slot; 55-Second telescopic rod; 71-Cleaning card rack; 72-Cleaning parts; 73-Cleaning outer cover; 732-Sealing ring; 731-Sealing slot; 74-Observation window; 75-Liquid inlet pipe; 76-Wide surface nozzle; 77-Connecting head; 78-First main pipe; 79-Second main pipe; 81-Transport side frame; 82-Transport electric roller; 83-Transport belt; 91-U-shaped frame; 92-Feeding electric roller; 921-Cylindrical cleaning cloth; 93-Receiving electric roller; 931-Receiving drum; 94-Guiding roller; 95-Cleaning bracket; 96-High-frequency telescopic rod; 97-Mounting plate; 98-Pressing plate; 971-Guide shaft. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] Example 1: Figure 1-10 As shown, the present invention provides a device for cleaning semiconductor silicon wafers, including an installation top frame 1 and a supporting bottom frame 2, a partition mechanism 3 is fixedly installed on the top of the supporting bottom frame 2, a first transport mechanism 4 is fixedly installed on the bottom end of the installation top frame 1, a placement mechanism 5 used in conjunction with the partition mechanism 3 is fixedly installed on the bottom end of the first transport mechanism 4, two first lifting rods 6 are fixedly installed at the middle position of one side of the bottom end of the installation top frame 1 close to the supporting bottom frame 2, a cleaning assembly 7 used in conjunction with the partition mechanism 3 and the placement mechanism 5 is fixedly installed on the driving ends of the two first lifting rods 6, a second transport mechanism 8 is fixedly installed on one side of the supporting bottom frame 2, and a cleaning assembly 9 is installed on the top of the second transport mechanism 8.

[0028] The partition mechanism 3 includes a partition card frame 31, which is fixedly mounted on the top of the supporting bottom frame 2. Four partition members 32 distributed at equal distances are fixedly mounted on the partition card frame 31. The partition members 32 include a liquid buffer bottom frame 33. The liquid buffer bottom frame 33 is fixedly connected to the partition card frame 31. Two symmetrically distributed first partition side frames 34 are fixedly mounted on the top of the liquid buffer bottom frame 33. First support frames 35 are fixedly mounted on the bottom of the opposite sides of the two first partition side frames 34. The opposite sides of the two first support frames 35 are integrally formed with a clamping strip 351. A storage chassis 36 is rotatably mounted between the two first support frames 35. The storage chassis 36 is rotatably connected to the clamping strip 351. By setting the clamping strip 351, the storage chassis 36 can be stably and quickly rotated between the two first support frames 35. A driving shaft 37 is fixedly mounted on the middle part of the bottom end of the storage chassis 36. The driving shaft 37 is rotatably mounted on the middle part of the liquid-slowing bottom frame 33 through a sealed rotating member. The bottoms of the driving shafts 37 pass through the lower surface of the liquid-slowing bottom frame 33. The outer sides of the multiple driving shafts 37 are fixedly sleeved with a pulley transmission group 371, wherein the pulley transmission group 371 includes multiple pulleys and a transmission belt movably sleeved on the outer sides of the multiple pulleys, and the multiple pulleys are fixedly sleeved on the bottom of the driving shaft 37 respectively. The driving motor 10 is fixedly mounted on the lower wall of the supporting bottom frame 2, and the driving end of the driving motor 10 is fixedly mounted on the bottom end of one of the driving shafts 37. When in use, the driving motor 10 is controlled and turned on to drive one of the driving shafts 37 to rotate stably and at high speed. In conjunction with the use of the pulley transmission group 371, the multiple driving shafts 37 are driven to rotate synchronously and stably at high speed, thereby driving the storage chassis 36 to rotate stably and at high speed between the corresponding two first support frames 35;

[0029] A protective gasket 361 is fixedly connected to the upper surface of the storage chassis 36. When multiple semiconductor silicon wafers are placed on the corresponding storage chassis 36, the lower surface of the semiconductor silicon wafer contacts the protective gasket 361, supporting the lower surface of the semiconductor silicon wafer. The top of the two spacer brackets 31 is fixedly clamped with an inclined first telescopic rod 38, and the driving end of the first telescopic rod 38 is fixedly installed with a positioning block 39. The bottom end of the positioning block 39 is rollingly clamped with a rubber ball 391. When multiple semiconductor silicon wafers are placed on the corresponding storage chassis 36, the multiple first telescopic rods 38 are opened to drive the positioning block 39 and the rubber ball 391 to move toward the upper surface of the semiconductor silicon wafer until the surface of the rubber ball 391 contacts the upper surface of the semiconductor silicon wafer, performing ball-type positioning on the upper surface of the semiconductor silicon wafer, thereby improving the stability of the semiconductor silicon wafer without affecting the high-speed rotation of the semiconductor silicon wafer. When the storage chassis 36 rotates stably and at high speed, the semiconductor silicon wafer is driven to rotate synchronously and stably at high speed.

[0030] Example 2: Figure 1-8As shown, the first transport mechanism 4 includes two horizontally arranged linear electric cylinders, which are fixedly installed at the bottom end of the mounting top frame 1. The driving ends of the linear electric cylinders are fixedly installed with connecting frames, and the two sides of the bottom end of the connecting frames are fixedly installed with second lifting rods; the storage mechanism 5 includes two symmetrically distributed storage side frames 51, which are fixedly installed at the driving ends of the corresponding second lifting rods. When in use, the linear electric cylinders are turned on to drive the storage mechanism 5 to move horizontally, and the second lifting rods are turned on to drive the storage mechanism 5 to move vertically. The storage pieces 52 corresponding to the number of the partition pieces 32 are fixedly installed between the storage side frames 51. The storage pieces 52 include two symmetrically distributed second partition side frames 53. The second partition side frames 53 are respectively fixedly installed on the corresponding storage side frames 51. The second partition side frames 53 are respectively movably connected between the two first partition side frames 34. The first partition side frames 34 and the second partition side frames 53 are combined into a complete annular partition frame. The bottom of the opposite sides of the two second partition side frames 53 are each provided with a second support frame 54. The second support frame 5 4 are movably connected between the two first support frames 35, and the first support frame 35 and the second support frame 54 are combined to form a complete annular support frame. When the semiconductor silicon wafers need to be cleaned, multiple semiconductor silicon wafers are placed between the corresponding two second spacer side frames 53, and the lower surfaces of the semiconductor silicon wafers are in contact with the second support frames 54. The second support frames 54 support the semiconductor silicon wafers. By driving the placement mechanism 5 to move horizontally and vertically, the four semiconductor silicon wafers are simultaneously driven to move horizontally and vertically, and the four semiconductor silicon wafers are respectively moved above the four spacers 32. Then, the four semiconductor silicon wafers are moved downward. At this time, the second spacer side frames 53 are movably connected between the two first spacer side frames 34, and the first spacer side frames 34 and the second spacer side frames 53 are combined to form a complete annular spacer frame. At the same time, the second support frames 54 are movably connected between the two first support frames 35, and the first support frames 35 and the second support frames 54 are combined to form a complete annular support frame. At this time, the four semiconductor silicon wafers are respectively placed on the corresponding placement base 36.

[0031] The cleaning assembly 7 includes a cleaning card frame 71, which is fixedly mounted on the driving end of the first lifting rod 6. The cleaning card frame 71 is fixedly provided with a number of cleaning members 72 corresponding to the number of the partition members 32. The cleaning members 72 include a cleaning outer cover 73, which is fixedly connected to the cleaning card frame 71. An observation window 74 is provided in the middle of the cleaning outer cover 73. A sealing ring 732 is fixedly installed at the bottom end of the cleaning outer cover 73. A sealing groove 731 corresponding to the cleaning outer cover 73 is opened at the top of the annular partition frame. The bottom of the cleaning cover 73 is movably connected to the sealing groove 731. The sealing ring 732 And it contacts the inner wall of the sealing groove 731. During use, after the four semiconductor silicon wafers are placed on the corresponding storage chassis 36 respectively, the first lifting rod 6 is turned on to drive the cleaning card rack 71 and the cleaning part 72 to move downward. At this time, the bottom of the cleaning outer cover 73 is movably connected to the sealing groove 731, and the sealing ring 732 contacts the inner wall of the sealing groove 731 to isolate and seal the external space of each semiconductor silicon wafer by the cleaning outer cover 73. During subsequent cleaning, each semiconductor silicon wafer can be cleaned separately to prevent cross contamination between each semiconductor silicon wafer, thereby improving the cleaning quality of the semiconductor silicon wafer.

[0032] A liquid inlet pipe 75 is fixedly provided at the middle of the cleaning cover 73. The bottom of the liquid inlet pipe 75 extends into the cleaning cover 73 and is provided with a wide-surface nozzle 76. A connector 77 is fixedly provided at the top of each of the liquid inlet pipes 75. A first main pipe 78 and a second main pipe 79 are fixedly installed on one side of the multiple connectors 77. The ends of the first main pipe 78 and the second main pipe 79 are respectively connected to the output end of the cleaning liquid input mechanism and the output end of the clean water input mechanism. When in use, the cleaning liquid input mechanism is first opened, and the cleaning liquid enters the multiple connectors through the first main pipe 78. The water flows through the connector 77 and then enters the liquid inlet pipe 75, and is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-surface nozzle 76 to clean each semiconductor silicon wafer separately. After cleaning, the clean water input mechanism is turned on, and the clean water enters the multiple connectors 77 through the first main pipe 78, and then enters the liquid inlet pipe 75, and is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-surface nozzle 76 to remove the cleaning liquid on the upper surface of the semiconductor silicon wafer. The waste cleaning liquid and clean water flow into the corresponding liquid buffer bottom frame 33 through the storage chassis 36 for centralized collection and buffering.

[0033] A drainage trough 331 is provided on one side of the bottom end of the liquid buffering bottom frame 33, and a drainage branch pipe 310 is fixedly installed in the drainage trough 331. The ends of multiple drainage branch pipes 310 are fixedly installed with a drainage main pipe 311. The end of the drainage main pipe 311 passes through the supporting bottom frame 2, and the cached waste cleaning liquid and clean water are collected and discharged through multiple drainage branch pipes 310 and the drainage main pipe 311 for disposal.

[0034] A second telescopic rod 55 is fixedly provided at the bottom of the second partition side frame 53, and the driving end of the second telescopic rod 55 is fixedly installed to the middle of the corresponding second support frame 54. The bottoms of the opposite sides of the two second partition side frames 53 are provided with storage grooves 541 corresponding to the second support frame 54. When the four semiconductor silicon wafers are cleaned, the multiple cleaning parts 72 are moved up and reset, and the multiple placement parts 52 are moved up and reset. At this time, each semiconductor silicon wafer is supported on the corresponding second support frame 54 again and separated from the corresponding partition part 32. Subsequently, the four cleaned semiconductor silicon wafers are moved to the second transport mechanism 8.

[0035] Example 3: Figure 9-10 As shown, the second transport mechanism 8 includes two symmetrically distributed transport side frames 81, and the two transport side frames 81 are fixedly installed on one side of the supporting bottom frame 2. A plurality of evenly distributed transport electric rollers 82 are provided between the transport side frames 81, and a plurality of outer movable sleeves of the plurality of transport electric rollers 82 are provided with a transport belt 83. The four semiconductor silicon wafers moved to the second transport mechanism 8 are moved to the upper surface of the transport belt 83. Subsequently, the second telescopic rod 55 is opened, and the second support frame 54 is moved and stored in the corresponding storage groove 541. The four semiconductor silicon wafers are separated from the support and evenly fall on the upper surface of the transport belt 83. The plurality of transport electric rollers 82 are opened to drive the transport belt 83, thereby driving the four semiconductor silicon wafers to drive.

[0036] The cleaning assembly 9 includes a U-shaped frame 91, which is fixedly connected to the middle of the top of one of the transport side frames 81. A feeding electric roller 92 and a receiving electric roller 93 are respectively provided on both sides of the top of the U-shaped frame 91. The outer side of the feeding electric roller 92 is detachably sleeved with a cylindrical cleaning cloth 921, and the outer side of the receiving electric roller 93 is detachably sleeved with a receiving drum 931. Guide rollers 94 are rotatably installed on both sides of the bottom of the U-shaped frame 91. When in use, the cleaning cloth belt at the end of the cylindrical cleaning cloth 921 is placed under the two guide rollers 94 and wrapped around the receiving drum 931. The feeding electric roller 92 and the receiving electric roller 93 are turned on and guided by the two guide rollers 94. There is a clean cleaning cloth belt under the two guide rollers 94. A cleaning bracket is fixedly installed in the middle position of the U-shaped frame 91. 95. A high-frequency telescopic rod 96 is fixedly installed in the middle of the cleaning bracket 95. The driving end of the high-frequency telescopic rod 96 passes through the cleaning bracket 95 and is fixedly installed with a mounting plate 97. A pressing plate 98 is fixedly installed at the bottom end of the mounting plate 97. The pressing plate 98 is located above the cleaning cloth belt. Guide shafts 971 are installed at the four corners of the top of the mounting plate 97. The guide shafts 971 are movable through the cleaning bracket 95. When in use, the semiconductor silicon wafer is driven to be transported in turn under the two guide rollers 94. The high-frequency telescopic rod 96 is turned on to drive the mounting plate 97 and the pressing plate 98 to rise and fall at high frequency, driving the clean cleaning cloth belts under the two guide rollers 94 to continuously contact the upper surface of the driven semiconductor silicon wafer, automatically physically wiping and cleaning the semiconductor silicon wafer, and further improving the cleaning effect of the semiconductor silicon wafer.

[0037] Working principle: Before use, place the cleaning cloth belt at the end of the cylindrical cleaning cloth 921 under the two guide rollers 94 and wrap it around the receiving drum 931. Turn on the feeding motorized roller 92 and the receiving motorized roller 93 and guide the cloth through the two guide rollers 94. Clean cleaning cloth belts will continuously flow under the two guide rollers 94.

[0038] When the semiconductor silicon wafers need to be cleaned, multiple semiconductor silicon wafers are placed between the corresponding two second spacer side frames 53, with the lower surfaces of the semiconductor silicon wafers in contact with the second support frame 54, and the second support frame 54 supports the semiconductor silicon wafers;

[0039] The linear electric cylinder is turned on to drive the placement mechanism 5 to move horizontally, and the second lifting rod is turned on to drive the placement mechanism 5 to move vertically, driving the four semiconductor silicon wafers to move horizontally and vertically, and the four semiconductor silicon wafers are respectively moved above the four spacers 32. Subsequently, the four semiconductor silicon wafers are moved downward. At this time, the second spacer side frames 53 are respectively movably connected between the two first spacer side frames 34, and the first spacer side frames 34 and the second spacer side frames 53 are combined into a complete annular spacer frame. At the same time, the second support frame 54 is respectively movably connected between the two first support frames 35, and the first support frame 35 and the second support frame 54 are combined into a complete annular support frame. At this time, the four semiconductor silicon wafers are respectively placed on the corresponding placement chassis 36;

[0040] Subsequently, the plurality of first telescopic rods 38 are opened to drive the positioning blocks 39 and the rubber balls 391 to move toward the upper surface of the semiconductor silicon wafer until the surface of the rubber balls 391 contacts the upper surface of the semiconductor silicon wafer, thereby performing ball-type positioning on the upper surface of the semiconductor silicon wafer, thereby improving the stability of the semiconductor silicon wafer without affecting the high-speed rotation of the semiconductor silicon wafer.

[0041] Subsequently, the first lifting rod 6 is opened to drive the cleaning bracket 71 and the cleaning member 72 downward. At this time, the bottom of the cleaning cover 73 is movably engaged with the sealing groove 731, and the sealing ring 732 contacts the inner wall of the sealing groove 731, thereby isolating and sealing the external space of each semiconductor silicon wafer with the cleaning cover 73.

[0042] Subsequently, the drive motor 10 is controlled and turned on to drive one of the drive shafts 37 to rotate stably and at high speed. The pulley transmission assembly 371 is used in conjunction with the multiple drive shafts 37 to rotate synchronously and stably at high speed, thereby driving the storage chassis 36 to rotate stably and at high speed between the corresponding two first support frames 35, and driving the semiconductor silicon wafer to rotate synchronously and stably at high speed.

[0043] At the same time, the cleaning liquid input mechanism is turned on, and the cleaning liquid enters the multiple connectors 77 through the first main pipe 78, and then enters the liquid inlet pipe 75. It is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-surface nozzle 76, and each semiconductor silicon wafer is individually cleaned with high-speed rotation. After cleaning, the clean water input mechanism is turned on, and the clean water enters the multiple connectors 77 through the first main pipe 78, and then enters the liquid inlet pipe 75. It is sprayed on the upper surface of the corresponding semiconductor silicon wafer through the corresponding wide-surface nozzle 76 to remove the cleaning liquid on the upper surface of the semiconductor silicon wafer. The waste cleaning liquid and clean water flow into the corresponding buffer bottom frame 33 through the storage bottom tray 36 for centralized collection and buffering. The centralized collected and buffered waste cleaning liquid and clean water are discharged through the multiple drainage branches 310 and the drainage main pipe 311 for centralized disposal.

[0044] After the four semiconductor silicon wafers are cleaned, the cleaning members 72 are moved upward and reset, and the placement members 52 are also moved upward and reset. At this time, each semiconductor silicon wafer is again supported on the corresponding second support frame 54 and separated from the corresponding spacer 32. Subsequently, the four cleaned semiconductor silicon wafers are moved to the second transport mechanism 8. The four semiconductor silicon wafers moved to the second transport mechanism 8 are moved to the upper surface of the transport belt 83.

[0045] Subsequently, the second telescopic rod 55 is opened, and the second support frame 54 is moved and stored in the corresponding storage groove 541. The four semiconductor silicon wafers are released from the support and evenly fall on the upper surface of the conveyor belt 83. The multiple conveyor motorized rollers 82 are opened, driving the conveyor belt 83 to drive, thereby driving the four semiconductor silicon wafers to drive;

[0046] It is transported in sequence under the two guide rollers 94, and the high-frequency telescopic rod 96 is turned on to drive the installation plate 97 and the pressing plate 98 to rise and fall at high frequency, driving the clean cleaning cloth belts under the two guide rollers 94 to continuously contact the upper surface of the driven semiconductor silicon wafer, automatically wiping and cleaning the semiconductor silicon wafer physically, further improving the cleaning effect of the semiconductor silicon wafer.

[0047] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A device for cleaning semiconductor silicon wafers, comprising a mounting top frame (1) and a supporting bottom frame (2), characterized in that: The top end of the supporting bottom frame (2) is fixedly mounted with a partition mechanism (3), the bottom end of the mounting top frame (1) is fixedly mounted with a first transport mechanism (4), the bottom end of the first transport mechanism (4) is fixedly mounted with a placement mechanism (5) used in conjunction with the partition mechanism (3), the bottom end of the mounting top frame (1) is fixedly mounted with a first lifting rod (6) at a middle position on one side close to the supporting bottom frame (2), the driving end of the first lifting rod (6) is fixedly mounted with a cleaning assembly (7) used in conjunction with the partition mechanism (3) and the placement mechanism (5), the side of the supporting bottom frame (2) is fixedly mounted with a second transport mechanism (8), the top end of the second transport mechanism (8) is mounted with a cleaning assembly (9); The partition mechanism (3) includes a partition card frame (31), the partition card frame (31) is fixedly mounted on the top of the supporting bottom frame (2), and four partition members (32) are fixedly mounted on the partition card frame (31) and are distributed at equal distances. The partition members (32) include a liquid buffer bottom frame (33), the liquid buffer bottom frame (33) is fixedly mounted on the partition card frame (31), and two first partition side frames (34) are fixedly mounted on the top of the liquid buffer bottom frame (33) and are symmetrically distributed. The bottoms of the opposite sides of the two first partition side frames (34) are fixedly mounted with a first support frame (35), and the two first partition side frames (34) are fixedly mounted with a first support frame (35). A clamping strip (351) is integrally formed on opposite sides of a support frame (35), a storage chassis (36) is rotatably clamped between the two first support frames (35), the storage chassis (36) is rotatably clamped on the clamping strip (351), and a protective gasket (361) is fixedly connected to the upper surface of the storage chassis (36), and a first telescopic rod (38) arranged obliquely is fixedly clamped on the top of the two partitioning clamping frames (31), a positioning block (39) is fixedly installed on the driving end of the first telescopic rod (38), and a rubber ball (391) is rollingly clamped on the bottom end of the positioning block (39).

2. The device for cleaning semiconductor silicon wafers according to claim 1, wherein: A driving shaft (37) is fixedly installed at the middle of the bottom end of the storage chassis (36), and the driving shaft (37) is rotatably installed in the middle of the slow-liquid bottom frame (33) through a sealing rotating member. The bottoms of the driving shafts (37) all pass through the lower surface of the slow-liquid bottom frame (33), and the outer sides of multiple driving shafts (37) are fixedly sleeved with a pulley transmission group (371). A driving motor (10) is fixedly installed on the lower wall of the supporting bottom frame (2), and the driving end of the driving motor (10) and the bottom end of one of the driving shafts (37) are fixedly installed.

3. The device for cleaning semiconductor silicon wafers according to claim 1, wherein: A drainage groove (331) is provided on one side of the bottom end of each of the liquid-slowing bottom frames (33). A drainage branch pipe (310) is fixedly mounted in each of the drainage grooves (331). A drainage main pipe (311) is fixedly mounted at the ends of the plurality of drainage branch pipes (310). The end of the drainage main pipe (311) passes through the supporting bottom frame (2).

4. The device for cleaning semiconductor silicon wafers according to claim 1, wherein: The first transport mechanism (4) comprises two horizontally arranged linear electric cylinders, the two linear electric cylinders being fixedly mounted on the bottom end of the mounting top frame (1), the driving ends of the linear electric cylinders being fixedly mounted with connecting frames, and the bottom ends of the connecting frames being fixedly mounted with second lifting rods on both sides.

5. The device for cleaning semiconductor silicon wafers according to claim 4, wherein: The storage mechanism (5) includes two symmetrically distributed storage side frames (51), the storage side frames (51) are fixedly mounted on the driving ends of the corresponding second lifting rods, and a storage element (52) corresponding in number to the partition element (32) is fixedly mounted between the two storage side frames (51). The storage element (52) includes two symmetrically distributed second partition side frames (53), the second partition side frames (53) are respectively fixedly mounted on the corresponding storage side frames (51), and the second partition side frames (53) are respectively movably connected between the two first partition side frames (34). The first partition side frame (34) and the second partition side frame (53) are combined to form a complete storage mechanism. The invention relates to a complete annular partition frame, wherein the bottoms of the opposite sides of the two second partition side frames (53) are each provided with a second support frame (54), the second support frame (54) is respectively movably connected between the two first support frames (35), the first support frame (35) and the second support frame (54) are combined into a complete annular support frame, the bottom of the second partition side frame (53) is fixedly provided with a second telescopic rod (55), the driving end of the second telescopic rod (55) and the corresponding middle part of the second support frame (54) are fixedly installed, and the bottoms of the opposite sides of the two second partition side frames (53) are each provided with a storage groove (541) corresponding to the second support frame (54).

6. The device for cleaning semiconductor silicon wafers according to claim 5, wherein: The cleaning assembly (7) includes a cleaning card frame (71), the cleaning card frame (71) is fixedly mounted on the driving end of the first lifting rod (6), the cleaning card frame (71) is fixedly provided with a number of cleaning parts (72) corresponding to the number of the partition parts (32), the cleaning parts (72) include a cleaning outer cover (73), the cleaning outer cover (73) is fixedly connected to the cleaning card frame (71), an observation window (74) is provided in the middle of the cleaning outer cover (73), a sealing ring (732) is fixedly mounted on the bottom end of the cleaning outer cover (73), a sealing groove (731) corresponding to the cleaning outer cover (73) is provided at the top end of the annular partition frame, the bottom of the cleaning outer cover (73) is movably connected to the sealing groove (731), and the sealing ring (732) is in contact with the inner wall of the sealing groove (731).

7. The device for cleaning semiconductor silicon wafers according to claim 6, wherein: A liquid inlet pipe (75) is fixedly provided at the middle of the cleaning outer cover (73). The bottom of the liquid inlet pipe (75) extends into the cleaning outer cover (73) and is provided with a wide-surface spray nozzle (76). The top of each of the liquid inlet pipes (75) is fixedly provided with a connector (77). A first main pipe (78) and a second main pipe (79) are fixedly installed on one side of the plurality of connectors (77).

8. The device for cleaning semiconductor silicon wafers according to claim 1, wherein: The second transport mechanism (8) comprises two symmetrically distributed transport side frames (81), the two transport side frames (81) being fixedly mounted on one side of the supporting bottom frame (2), a plurality of evenly distributed transport electric rollers (82) being provided between the transport side frames (81), and a transport belt (83) being provided on the outer movable sleeves of the plurality of transport electric rollers (82).

9. The device for cleaning semiconductor silicon wafers according to claim 8, wherein: The cleaning assembly (9) includes a U-shaped frame (91), the U-shaped frame (91) is fixedly connected to the middle of the top of one of the transport side frames (81), and a feeding electric roller (92) and a receiving electric roller (93) are respectively provided on both sides of the top of the U-shaped frame (91), the outer side of the feeding electric roller (92) is detachably provided with a cylindrical cleaning cloth (921), the outer side of the receiving electric roller (93) is detachably provided with a receiving cylinder (931), and both sides of the bottom of the U-shaped frame (91) are rotatably provided with guide rollers. (94), a cleaning bracket (95) is fixedly installed in the middle position of the U-shaped frame (91), a high-frequency telescopic rod (96) is fixedly installed in the middle of the cleaning bracket (95), the driving end of the high-frequency telescopic rod (96) passes through the cleaning bracket (95) and is fixedly installed on the mounting plate (97), a pressing plate (98) is fixedly installed on the bottom end of the mounting plate (97), and guide shafts (971) are installed at the four corners of the top end of the mounting plate (97), and the guide shafts (971) are movable through the cleaning bracket (95).

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