Display panel and manufacturing method thereof

Abstract

The application discloses a display panel and a manufacturing method thereof. The display panel comprises a substrate and a packaging cover arranged oppositely, a driving circuit layer and a light-emitting device layer arranged in sequence on a side of the substrate close to the packaging cover, and a dam arranged between the substrate and the packaging cover. The display panel has a display area and a non-display area arranged around the display area. The light-emitting device layer is located in the display area, the driving circuit layer is located in the display area and the non-display area, the dam is located in the non-display area and arranged around the display area, the dam is arranged in close contact with the substrate and the packaging cover, and the dam partially overlaps with the driving circuit layer in the non-display area. The dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer. The application can effectively isolate water and oxygen, ensure the normal function of the driving circuit layer, improve the bonding effect of the dam, and avoid damage to the driving circuit layer caused by expansion stress.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its manufacturing method. Background Technology

[0002] OLED (Organic Light Emitting Diode) is a display device that has attracted much attention due to its self-emissive nature, high contrast, fast response speed, thinness, and ability to form flexible displays. The light-emitting materials, functional materials, and cathode materials in OLED devices are extremely sensitive to water and oxygen, so encapsulation is required to protect the OLED devices.

[0003] To address market demand for narrow bezels, OLED panels can achieve bezel reduction through GOA (Gate Driver on Array) design and extremely narrow packaging structures. For example... Figure 1 As shown, the rigid encapsulation structure of the top-emitting GOA type OLED panel 1' currently consists of a dam 2', a getter 3', a filler 4', and an encapsulation layer 5'. The purpose of the dam 2' is to bond the substrate 6' to the encapsulation cover 7' and to prevent the intrusion of moisture and oxygen from the surrounding area. The getter 3' can absorb a large amount of infiltrated moisture to improve the encapsulation effect. The filler 4' is used to support the encapsulation cover 7' and prevent the encapsulation layer 5' from being split during vibration. The filler 4' also has high transmittance and will not affect the light emission of the OLED device layer 8'. The encapsulation layer 5' can block the infiltrated small amount of water and oxygen, while also isolating the organic impurity gas (outgas) released by the filler 4', thus preventing damage to the cathode and light-emitting materials of the OLED device layer 8'.

[0004] Currently, to further reduce the bezel of GOA-type OLED panels, hygroscopic agents can be added to the dam, which can reduce the encapsulation area while maintaining barrier performance. Additionally, overlapping the dam with the GOA circuit can also reduce the panel bezel. However, hygroscopic agents typically use alkali metal oxides, such as calcium oxide (CaO). During high-temperature and high-humidity storage (RA) testing, the hygroscopic agent doped with alkali metal in the dam absorbs moisture, causing a negative drift in the threshold voltage (Vth) of the TFTs in the GOA circuit, leading to GOA failure. Furthermore, the hygroscopic agent doped with alkali metal in the dam significantly increases the coefficient of thermal expansion, affecting the adhesion of the dam to the substrate and encapsulation cover. Summary of the Invention

[0005] The application provides a display panel and a manufacturing method thereof, which can effectively isolate water and oxygen, ensure the normal function of a driving circuit layer located in a non-display area, improve the bonding effect of a dam and a substrate and a packaging cover, and avoid damage to the driving circuit layer in the non-display area caused by expansion stress while narrowing the frame of the display panel.

[0006] The application provides a display panel, which comprises a substrate and a packaging cover arranged oppositely, a driving circuit layer and a light-emitting device layer arranged in sequence on one side of the substrate close to the packaging cover, and a dam arranged between the substrate and the packaging cover.

[0007] The display panel has a display area and a non-display area arranged around the display area; the light-emitting device layer is located in the display area, and the driving circuit layer is located in the display area and the non-display area; the dam is located in the non-display area and arranged around the display area.

[0008] The dam is arranged in close contact with the substrate and the packaging cover on two sides thereof in a direction perpendicular to the display panel, and the dam partially overlaps the driving circuit layer located in the non-display area; the dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer.

[0009] Optionally, the material of the first zeolite nanoparticles comprises any one of a crystalline porous aluminosilicate, a crystalline porous aluminophosphate and a crystalline porous silicoaluminophosphate.

[0010] The particle size of the first zeolite nanoparticles is greater than 10 nm and less than or equal to 150 nm; and the mass fraction of the first zeolite nanoparticles in the dam is greater than 0 and less than or equal to 50%.

[0011] Optionally, the driving circuit layer comprises a GOA circuit located in the non-display area; and the dam partially overlaps the GOA circuit.

[0012] Optionally, the display panel further comprises a packaging layer covering the light-emitting device layer; the packaging layer also covers the driving circuit layer located at least partially in the non-display area; and the dam partially covers the packaging layer.

[0013] Optionally, the packaging layer comprises at least one inorganic packaging layer; or the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer arranged in stack.

[0014] Optionally, the display panel further comprises an air absorption isolation layer located on the packaging layer and a filling adhesive filled between the air absorption isolation layer and the packaging cover; and the dam is arranged around the air absorption isolation layer and the filling adhesive.

[0015] The getter barrier layer comprises a second organic resin layer and second zeolite nanoparticles doped in the second organic resin layer.

[0016] Optionally, the thickness of the getter barrier layer is less than 5um; the particle size of the second zeolite nanoparticles is less than the wavelength of any visible light; and the mass fraction of the second zeolite nanoparticles in the getter barrier layer is greater than 0 and less than or equal to 20%.

[0017] Optionally, the mass fraction of the second zeolite nanoparticles in the getter barrier layer is greater than 0 and less than or equal to 10%.

[0018] The application also provides a manufacturing method of a display panel, comprising the following steps:

[0019] A substrate is provided, which comprises a display area and a non-display area arranged around the display area;

[0020] A driving circuit layer, a light-emitting device layer and an encapsulation layer are sequentially formed on the substrate; wherein the driving circuit layer is located in the display area and the non-display area, the light-emitting device layer is located in the display area, and the encapsulation layer covers the light-emitting device layer and at least part of the driving circuit layer located in the non-display area;

[0021] An encapsulation cover plate is provided, and an annular dam is formed on the encapsulation cover plate; wherein the dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer; and

[0022] The substrate and the encapsulation cover plate are arranged in register, and part of the non-display area of the substrate is arranged in contact with the side of the dam away from the encapsulation cover plate, so as to fix and connect the substrate and the encapsulation cover plate; wherein the dam is partially overlapped with the driving circuit layer located in the non-display area.

[0023] Optionally, before the substrate and the encapsulation cover plate are fixed and connected, the manufacturing method further comprises the following steps:

[0024] A getter barrier layer and a filling glue are sequentially formed on the encapsulation layer; wherein the getter barrier layer comprises a second organic resin layer and second zeolite nanoparticles doped in the second organic resin layer;

[0025] After the substrate and the encapsulation cover plate are fixed and connected, the dam is arranged around the getter barrier layer and the filling glue.

[0026] The display panel and the manufacturing method thereof provided in the application, the dam is composed of a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer, and the dam is partially overlapped with the driving circuit layer in the non-display area; since the zeolite has a porous structure and is connected by multiple composite units, the first zeolite nanoparticles have regular tubular pore channels and cavity structures; on one hand, the dam is partially overlapped with the driving circuit layer in the non-display area, which can narrow the frame of the display panel; on the other hand, the first zeolite nanoparticles absorb water and oxygen through a physical reaction, and no new substance is generated to damage the encapsulation layer, so that the function of the driving circuit layer in the non-display area can be avoided; on the other hand, the first zeolite nanoparticles can be filled in the resin molecular chain gap of the first organic resin layer, and the isolation performance of water and oxygen is improved from two aspects of blocking and absorption; on the other hand, the first zeolite nanoparticles have stable cavity structures, which can reduce the thermal expansion coefficient and the hygroscopic expansion rate of the dam, improve the adhesion effect of the dam with the substrate and the encapsulation cover plate, and avoid the damage of the expansion stress to the driving circuit layer in the non-display area. BRIEF DESCRIPTION OF DRAWINGS

[0027] The technical solutions and other beneficial effects of the application will be apparent from the following detailed description of the specific embodiments of the application, combined with the accompanying drawings.

[0028] Figure 1 It is a sectional structure schematic diagram of a display panel in the prior art.

[0029] Figure 2 It is a sectional structure schematic diagram of a display panel provided in the embodiments of the application.

[0030] Figure 3 It is another sectional structure schematic diagram of a display panel provided in the embodiments of the application.

[0031] Figure 4 It is a flowchart schematic diagram of a manufacturing method of a display panel provided in the embodiments of the application. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the application.

[0033] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0037] The inventor found that the reason for the negative shift of the threshold voltage Vth of the TFT in the GOA circuit during the RA test is that the hygroscopic agent in the dam reacts with water to generate a strong base, which chemically damages SiN or SiON in the packaging layer, specifically causing Si-N bond breakage, generating Si-O, and releasing NH3, H + and NH4 + , causing H atom migration, thereby causing the threshold voltage Vth of the TFT in the GOA circuit located below the packaging layer to negatively shift. In addition, the hygroscopic agent doped with alkali metal material in the dam greatly increases the expansion coefficient, affecting the adhesion of the dam to the substrate.

[0038] In order to solve the above technical problems, the present application improves the existing GOA type OLED display panel, please refer to the following several embodiments.

[0039] As shown in Figure 2 , the present application provides a display panel 1, which includes a substrate 2 and a packaging cover plate 3 arranged opposite to each other, a driving circuit layer 4 and a light emitting device layer 5 arranged in sequence on the side of the substrate 2 close to the packaging cover plate 3, and a dam 6 sandwiched between the substrate 2 and the packaging cover plate 3.

[0040] In a specific embodiment, the substrate 2 includes a glass substrate, but is not limited to this; the packaging cover plate 3 is a protective layer, for example, a glass cover plate, but is not limited to this. In a specific embodiment, the side of the packaging cover plate close to the substrate 2 can also be provided with a color filter layer.

[0041] Specifically, the display panel 1 has a display area 7 and a non-display area 8 arranged around the display area 7; the light emitting device layer 5 is located in the display area 7, and the driving circuit layer 4 is located in the display area 7 and the non-display area 8; the dam 6 is located in the non-display area 8 and arranged around the display area 7. It can be understood that the substrate 2 and the packaging cover plate 3 are located in the display area 7 and the non-display area 8.

[0042] Specifically, the dam 6 is arranged to adhere to the substrate 2 and the encapsulation cover plate 3 on two sides in a direction perpendicular to the display panel 1, and the dam 6 partially overlaps the driving circuit layer 4 in the non-display area 8. The dam 6 comprises a first organic resin layer 9 and first zeolite nano-particles 10 doped in the first organic resin layer 9.

[0043] It should be noted that the partial overlap arrangement described in the present application refers to a normal projection partial overlap arrangement, and does not require substantial contact. For example, the normal projection of the dam 6 on the substrate 2 partially overlaps the normal projection of the driving circuit layer 4 in the non-display area 8 on the substrate 2, and the dam 6 does not necessarily directly contact the driving circuit layer 4 in the non-display area 8.

[0044] In a specific embodiment, the driving circuit layer 4 comprises a GOA circuit 11 in the non-display area 8 and a driving circuit (not shown in the figure) in the display area 7, and the dam 6 partially overlaps the GOA circuit 11. The partial overlap of the dam 6 and the GOA circuit 11 can narrow the frame of the display panel 1. It can be understood that the GOA circuit 11 comprises at least one thin film transistor (TFT) and a bus line.

[0045] Specifically, the material of the first organic resin layer 9 comprises any one of acrylic resin and epoxy resin, but is not limited thereto.

[0046] Specifically, the material of the first zeolite nano-particles 10 comprises any one of crystalline porous aluminosilicate, crystalline porous aluminophosphate and crystalline porous silicoaluminophosphate, but is not limited thereto.

[0047] Specifically, the particle size of the first zeolite nano-particles 10 is greater than 10 nm and less than or equal to 150 nm, and the mass fraction of the first zeolite nano-particles 10 in the dam 6 is greater than 0 and less than or equal to 50%, which will not cause pressure injury to the GOA circuit 11.

[0048] In a specific embodiment, the particle size of the first zeolite nano-particles 10 is 100 nm, and the mass fraction of the first zeolite nano-particles 10 in the dam 6 is 40%. In addition, the particle size of the first zeolite nano-particles 10 can also be 150 nm, and the mass fraction of the first zeolite nano-particles 10 in the dam 6 can also be 50%.

[0049] It can be understood that the first organic resin layer 9 in the dam 6 is used to bond the substrate 2 and the encapsulation cover plate 3 and to block the invasion of water vapor and oxygen around the display panel 1, and the first zeolite nano-particles 10 doped in the first organic resin layer 9 are used to absorb a large amount of permeated water vapor to improve the encapsulation effect.

[0050] It should be noted that, since zeolite has a porous structure and is composed of multiple composite units, the first zeolite nanoparticles 10 in this application have regular tubular channels and cavity structures. On the one hand, the absorption of water and oxygen by the first zeolite nanoparticles 10 is a physical reaction and will not generate new substances that could damage the encapsulation layer 12 of the display panel 1, thus not affecting the threshold voltage Vth of the TFT in the GOA circuit 11, i.e., not affecting the normal function of the GOA circuit 11. On the other hand, the first zeolite nanoparticles 10 can fill the gaps between the resin molecular chains in the first organic resin layer 9, thus doubly improving the barrier performance against water and oxygen from both the barrier and absorption aspects. Furthermore, the first zeolite nanoparticles 10 have a stable cavity structure, which can reduce the thermal expansion coefficient and hygroscopic expansion rate of the dam 6, improve the adhesion between the dam 6 and the substrate 2 and the encapsulation cover 3, and avoid damage to the TFT devices in the GOA circuit 11 by expansion stress.

[0051] Specifically, the display panel 1 also includes an encapsulation layer 12 covering the light-emitting device layer 5; the encapsulation layer 12 also covers at least part of the driving circuit layer 4 located in the non-display area 8; and the dam 6 partially covers the encapsulation layer 12.

[0052] Understandably, the encapsulation layer 12 can partially cover the driving circuit layer 4 located in the non-display area 8, for example, covering part of the GOA circuit 11; the encapsulation layer 12 can also completely cover the driving circuit layer 4 located in the non-display area 8, for example, covering the entire GOA circuit 11. When the encapsulation layer 12 partially covers the driving circuit layer 4 located in the non-display area 8, the dam 6 partially covers both the driving circuit layer 4 and the encapsulation layer 12 located in the non-display area 8. When the encapsulation layer 12 completely covers the driving circuit layer 4 located in the non-display area 8, the dam 6 only partially covers the encapsulation layer 12. (Appendix) Figure 2 The example shown only illustrates the case where the portion of the encapsulation layer 12 covered by the drive circuit layer 4 in the non-display area 8, but is not limited to this.

[0053] Specifically, the encapsulation layer 12 includes at least one inorganic encapsulation layer, such as a single inorganic encapsulation layer or a stacked structure composed of multiple inorganic encapsulation layers; or, the encapsulation layer 12 includes a stacked structure composed of a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked sequentially. When the encapsulation layer 12 is a single inorganic encapsulation layer, both encapsulation performance and cost can be balanced; when the encapsulation layer 12 is a stacked structure, the coverage capability of process foreign matter can be improved.

[0054] Specifically, the inorganic encapsulation layers in encapsulation layer 12 (e.g., the first inorganic encapsulation layer and the second inorganic encapsulation layer) can be prepared by plasma-enhanced chemical vapor deposition or atomic layer deposition. The materials of the inorganic encapsulation layers include SiON. x and SiN x At least one of the following. The organic encapsulation layer can be applied to the inorganic encapsulation layer by spin coating or inkjet printing.

[0055] Specifically, the display panel 1 also includes a filler adhesive 13 filled between the encapsulation layer 12 and the encapsulation cover plate 3; in one specific embodiment, the material of the filler adhesive 13 includes epoxy resin with high light transmittance and olefin, but is not limited thereto.

[0056] Specifically, the dam 6 is set around the filler 13 to prevent the filler 13 from overflowing. Furthermore, the porous structure of the first zeolite nanoparticles 10 in the dam 6 can absorb the organic impurity gas (outgas) released by the resin material in the first organic resin layer 9 and the filler 13, thus improving the black spot problem after RA.

[0057] Specifically, the light-emitting device layer 5 includes multiple light-emitting devices (not shown in the figure); the light-emitting devices can be OLED devices or LED devices, but are not limited to these.

[0058] In this embodiment, the dam 6 is composed of a first organic resin layer 9 and first zeolite nanoparticles 10 doped in the first organic resin layer 9, and the dam 6 overlaps with the driving circuit layer 4 located in the non-display area 8; since zeolite is a porous structure and is composed of multiple composite units, the first zeolite nanoparticles 10 have regular tubular pore channels and cavity structures. On the one hand, the overlapping arrangement of the dam 6 and the driving circuit layer 4 located in the non-display area 8 can narrow the bezel of the display panel 1; on the other hand, the absorption of water and oxygen by the first zeolite nanoparticles 10 is a physical reaction and will not generate new substances that damage the SiN or SiON of the encapsulation layer 12, thus not affecting the threshold voltage Vth of the TFT in the GOA circuit 11 located in the non-display area 8, that is, it will not affect the normal function of the GOA circuit 11; on the other hand, the first zeolite nanoparticles 10 can fill the gaps between the resin molecular chains of the first organic resin layer 9, thus doubly improving the isolation performance against water and oxygen from both the barrier and absorption aspects; on the other hand, the first zeolite nanoparticles 10 have a stable cavity structure, which can reduce the thermal expansion coefficient and moisture absorption expansion rate of the dam 6, improve the adhesion effect between the dam 6 and the substrate 2 and the encapsulation cover 3, and avoid the expansion stress damaging the TFT devices in the GOA circuit 11 located in the non-display area 8.

[0059] like Figure 3 As shown, this application embodiment also provides a display panel 1”, which differs from the previous embodiment in that the display panel 1” further includes an air intake barrier layer 14 located on the encapsulation layer 12; the filler adhesive 13 is filled between the air intake barrier layer 14 and the encapsulation cover plate 3, and the dam 6 is provided around the air intake barrier layer 14 and the filler adhesive 13.

[0060] Specifically, the gettering barrier layer 14 includes a second organic resin layer 15 and second zeolite nanoparticles 16 doped in the second organic resin layer 15. The gettering barrier layer 14 is used to absorb the organic outgas released by the filling glue 13.

[0061] Specifically, the material of the second organic resin layer 15 and the first organic resin can be the same, but are not limited thereto. The material of the second zeolite nanoparticles 16 and the first zeolite nanoparticles 10 can be the same, but are not limited thereto.

[0062] Specifically, the thickness of the gettering barrier layer 14 is less than 5 um; and the particle size of the second zeolite nanoparticles 16 is less than the wavelength of any visible light.

[0063] Specifically, when the mass fraction of the second zeolite nanoparticles 16 in the gettering barrier layer 14 is greater than 0 and less than or equal to 20%, the light transmittance of the gettering barrier layer 14 is greater than 80%; and when the mass fraction of the second zeolite nanoparticles 16 in the gettering barrier layer 14 is greater than 0 and less than or equal to 10%, the light transmittance of the gettering barrier layer 14 is greater than 90%. Therefore, the setting of the gettering barrier layer 14 will not affect the light output effect of the top emission device.

[0064] In a specific embodiment, the mass fraction of the second zeolite nanoparticles 16 in the gettering barrier layer 14 can be 5%, 10% or 20%.

[0065] Specifically, the gettering barrier layer 14 can be prepared by the same process as the organic encapsulation layer 12, for example, the surface of the second zeolite nanoparticles 16 is modified and dispersed in a resin material to form ink, and an inkjet printing method is used to form a film on the encapsulation layer 12 to form the gettering barrier layer 14.

[0066] Specifically, the dam 6 is made after the gettering barrier layer 14 is formed, and can be precisely coated on the non-display area 8 of the substrate 2 by using a Dispenser (coating machine); in addition, the filling glue 13 is made above the gettering barrier layer 14 by using an ODF (One Drop Filling, drop filling) method or an inkjet printing method; the filling glue 13 is UV cured, and then a vacuum alignment pressing process is used to fill the filling glue 13 in the closed space formed by the gettering barrier layer 14 and the encapsulation cover plate 3, of course, the order of UV curing and vacuum alignment pressing process can be adjusted; finally, the dam 6 and the filling glue 13 are heat cured.

[0067] In addition to the advantages of the foregoing embodiments, the gettering barrier layer 14 can effectively absorb the organic outgas released by the filling glue 13 through the porous structure of the second zeolite nanoparticles 16 without affecting the light transmittance, and can further isolate water and oxygen from the light emitting side.

[0068] AsFigure 4 As shown, the embodiment of the present application further provides a manufacturing method for manufacturing the display panel in the foregoing embodiment, and the manufacturing method comprises steps S401 to S404.

[0069] Step S401: providing a substrate substrate, the substrate substrate comprising a display area and a non-display area arranged around the display area.

[0070] Specifically, the description of the substrate substrate can refer to the foregoing embodiment, which will not be repeated here.

[0071] It should be noted that the display area and the non-display area of the substrate substrate in the embodiment of the present application correspond to the display area and the non-display area of the display panel in the foregoing embodiment, respectively.

[0072] Step S402: sequentially forming a driving circuit layer, a light emitting device layer and an encapsulation layer on the substrate substrate; wherein the driving circuit layer is located in the display area and the non-display area, the light emitting device layer is located in the display area, and the encapsulation layer covers the light emitting device layer and at least part of the driving circuit layer located in the non-display area.

[0073] In a specific embodiment, step S402 further comprises the following steps:

[0074] forming an air absorption isolation layer and a filling glue on the encapsulation layer in sequence; wherein the air absorption isolation layer comprises a second organic resin layer and second zeolite nanoparticles doped in the second organic resin layer.

[0075] Specifically, the description of the driving circuit layer, the light emitting device layer, the encapsulation layer, the air absorption isolation layer and the filling glue can refer to the foregoing embodiment, which will not be repeated here.

[0076] Specifically, the driving circuit layer located in the non-display area comprises a GOA circuit.

[0077] Specifically, the inorganic encapsulation layer in the encapsulation layer can be manufactured by plasma enhanced chemical vapor deposition or atomic layer deposition; the material of the inorganic encapsulation layer comprises at least one of SiON x and SiN x ; the inorganic encapsulation layer covers all or part of the GOA circuit. When the encapsulation layer is composed of a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer, the organic encapsulation layer in the encapsulation layer can be formed on the first inorganic encapsulation layer by spin coating or inkjet printing.

[0078] Specifically, the air absorption isolation layer can be manufactured by the same process as the organic encapsulation layer; for example, the surface of the second zeolite nanoparticles is modified and dispersed in the organic resin material to form an ink material, and a film is formed on the inorganic encapsulation layer (such as the second inorganic encapsulation layer) to form the air absorption isolation layer.

[0079] Specifically, the filling glue is made on the getter barrier layer by using an ODF (One Drop Filling) method or an inkjet printing method, and the filling glue is subjected to UV (ultraviolet) curing treatment. Of course, in other embodiments, the making and curing operations of the filling glue can be performed in step S403, that is, formed on the packaging cover plate.

[0080] Step S403: providing a packaging cover plate, and forming an annular dam on the packaging cover plate; wherein the dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer.

[0081] Specifically, the dam is precisely coated by a dispenser, and can also be subjected to UV curing treatment.

[0082] Specifically, the description of the dam can refer to the foregoing embodiments, which will not be repeated here.

[0083] Step S404: aligning and disposing the substrate and the packaging cover plate, and disposing the side of the dam away from the packaging cover plate and the part of the non-display area of the substrate to be attached, so as to fix the connection between the substrate and the packaging cover plate; wherein the dam is partially overlapped with the driving circuit layer located in the non-display area.

[0084] Specifically, in step S404, a vacuum alignment and pressing process is used, so that the filling glue is filled in the closed space formed by the getter barrier layer and the packaging cover plate, and the dam is arranged around the getter barrier layer and the filling glue.

[0085] Specifically, step S404 further comprises the following steps:

[0086] The dam and the filling layer are subjected to heat curing treatment.

[0087] Specifically, the positional relationship between the dam and other film layer structures can refer to the foregoing embodiments, which will not be repeated here.

[0088] The display panel manufactured by the manufacturing method has the following advantages: on the one hand, the dam is partially overlapped with the driving circuit layer in the non-display area, which can narrow the frame of the display panel; on the other hand, the first zeolite nanoparticles absorb water and oxygen by physical reaction, without generating new substances to damage the SiN or SiON of the encapsulation layer, so as to not affect the threshold voltage Vth of the TFT in the GOA circuit in the non-display area, that is, not affect the normal function of the GOA circuit; on the other hand, the first zeolite nanoparticles can be filled in the resin molecular chain gap of the first organic resin layer, which can improve the isolation performance of water and oxygen from two aspects of blocking and absorbing; on the other hand, the first zeolite nanoparticles have a stable cavity structure, which can reduce the thermal expansion coefficient and hygroscopic expansion rate of the dam, improve the adhesion effect of the dam with the substrate and the encapsulation cover plate, and avoid damage to the TFT device in the GOA circuit in the non-display area; on the other hand, the gettering isolation layer can effectively absorb the organic impurity gas released by the filling glue through the porous structure of the second zeolite nanoparticles without affecting the light transmission performance, and can further isolate water and oxygen from the light-emitting side.

[0089] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0090] The above describes in detail a display panel and a manufacturing method thereof provided by the embodiments of the present application. The principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the technical solutions and core ideas of the present application. Those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized by, The display panel comprises a substrate and a packaging cover arranged oppositely, a driving circuit layer and a light emitting device layer arranged in sequence on a side of the substrate close to the packaging cover, and a dam arranged between the substrate and the packaging cover; The display panel has a display area and a non-display area arranged around the display area; the light emitting device layer is located in the display area, and the driving circuit layer is located in the display area and the non-display area; the dam is located in the non-display area and arranged around the display area; The dam is arranged in close contact with the substrate and the packaging cover on two sides in a direction perpendicular to the display panel, and the dam partially overlaps the driving circuit layer located in the non-display area; the dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer; The display panel further comprises a packaging layer covering the light emitting device layer, an air-adsorbing isolation layer located on the packaging layer, and a filling glue filled between the air-adsorbing isolation layer and the packaging cover; the dam partially covers the packaging layer; the packaging layer further covers the driving circuit layer located at least partially in the non-display area; the air-adsorbing isolation layer comprises a second organic resin layer and second zeolite nanoparticles doped in the second organic resin layer, the particle size of the second zeolite nanoparticles is smaller than the wavelength of any visible light; and the dam is arranged around the air-adsorbing isolation layer and the filling glue.

2. The display panel of claim 1, wherein, The material of the first zeolite nanoparticles comprises any one of crystalline porous aluminosilicate, crystalline porous aluminophosphate and crystalline porous silicon aluminophosphate; The particle size of the first zeolite nanoparticles is greater than 10 nm and less than or equal to 150 nm; and the mass fraction of the first zeolite nanoparticles in the dam is greater than 0 and less than or equal to 50%.

3. The display panel of claim 1, wherein, The driving circuit layer comprises a GOA circuit located in the non-display area; and the dam partially overlaps the GOA circuit.

4. The display panel of claim 1, wherein, The packaging layer comprises at least one inorganic packaging layer; or the packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer arranged in stack.

5. The display panel of claim 1, wherein, The thickness of the air-adsorbing isolation layer is less than 5 um; the particle size of the second zeolite nanoparticles is smaller than the wavelength of any visible light; and the mass fraction of the second zeolite nanoparticles in the air-adsorbing isolation layer is greater than 0 and less than or equal to 20%.

6. The display panel of claim 5, wherein, The mass fraction of the second zeolite nanoparticles in the air-adsorbing isolation layer is greater than 0 and less than or equal to 10%.

7. A manufacturing method of a display panel, comprising: The method comprises the following steps: providing a substrate comprising a display area and a non-display area arranged around the display area; forming a driving circuit layer, a light emitting device layer and a packaging layer in sequence on the substrate; wherein the driving circuit layer is located in the display area and the non-display area, the light emitting device layer is located in the display area, and the packaging layer covers the light emitting device layer and the driving circuit layer located at least partially in the non-display area; The application provides a packaging cover plate and a ring-shaped dam is formed on the packaging cover plate; wherein the dam comprises a first organic resin layer and first zeolite nanoparticles doped in the first organic resin layer; and The substrate and the packaging cover plate are arranged in alignment, and a part of the non-display area of the substrate is arranged in contact with the side of the dam away from the packaging cover plate, so that the substrate and the packaging cover plate are fixedly connected; wherein the dam is arranged in partial overlap with the driving circuit layer in the non-display area, and the dam partially covers the packaging layer; Before the substrate and the packaging cover plate are fixedly connected, the manufacturing method further comprises the following steps: An air-adsorbing isolation layer and a filling glue are sequentially formed on the packaging layer; wherein the air-adsorbing isolation layer comprises a second organic resin layer and second zeolite nanoparticles doped in the second organic resin layer, and the particle size of the second zeolite nanoparticles is smaller than the wavelength of any kind of visible light; After the substrate and the packaging cover plate are fixedly connected, the dam is arranged around the air-adsorbing isolation layer and the filling glue.

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