Waterproof circuit and mobile electronic device

Abstract

The present invention discloses a waterproof circuit and a mobile electronic device. The waterproof circuit includes: a circuit board, the circuit board includes at least one waterproof area, and the electronic components in the at least one waterproof area have a first physical characteristic parameter; at least one encapsulation module, the encapsulation module includes a second physical characteristic parameter that matches the first physical characteristic parameter; the at least one encapsulation module is used to encapsulate the electronic components in the at least one waterproof area for waterproofing; the first physical characteristic parameter and the second physical characteristic parameter include one or more of the height, shape, and heat dissipation parameter of the electronic components. The technical solution provided by the embodiments of the present invention realizes the surface protection of the electronic components of the circuit board, improves the waterproof and compressive resistance of the circuit board, and enhances the protection level of the circuit board.

Description

Technical Field

[0001] Embodiments of the present invention relate to packaging technology, and in particular, to a waterproof circuit and a mobile electronic device. Background Art

[0002] With the development of science and technology, mobile electronic devices need to complete detection or other corresponding work in relatively harsh environments. Therefore, in order to ensure the stability of the devices, high requirements are put forward for the protection level of the circuit boards in the devices.

[0003] Common mobile electronic devices are developed and designed in a "hole-blocking" manner, which results in the exposure of electronic components and cannot meet the requirements of waterproofness and compressive resistance. Summary of the Invention

[0004] The present invention provides a waterproof circuit and a mobile electronic device to solve the defects in the prior art, realize the surface protection of the electronic components on the circuit board, improve the waterproofness and compressive resistance of the circuit board, and enhance the protection level of the circuit board.

[0005] In a first aspect, embodiments of the present invention provide a waterproof circuit, including:

[0006] A circuit board, the circuit board includes at least one waterproof area, and the electronic components in the at least one waterproof area include first physical characteristic parameters;

[0007] At least one encapsulation module, the encapsulation module includes second physical characteristic parameters that match the first physical characteristic parameters;

[0008] The at least one encapsulation module is used to encapsulate the electronic components in the at least one waterproof area for waterproofness;

[0009] The first physical characteristic parameters and the second physical characteristic parameters include one or more of the height, shape, and heat dissipation parameters of the electronic components.

[0010] Optionally, the encapsulation module includes: an encapsulation base and an encapsulation cover;

[0011] The encapsulation base is welded to the ground terminal of the circuit board and surrounds the waterproof area;

[0012] The encapsulation cover covers and is electrically connected to the encapsulation base to form a first accommodation space for accommodating the electronic components.

[0013] Optionally, the first accommodation space includes at least one filling inlet and at least one filling outlet that communicate with the outside.

[0014] Optionally, the at least one filling inlet includes a first through hole provided on the encapsulation cover, and the at least one filling outlet includes a second through hole provided on the side of the encapsulation base and the encapsulation cover;

[0015] Among them, the second through-hole includes a notch structure provided at the connection of adjacent side edges of the encapsulation base and the encapsulation cover.

[0016] Optionally, it further includes a waterproof filler filled into the first accommodation space through the at least one filling inlet.

[0017] Optionally, the waterproof filler includes AB-type silica gel and heat dissipation paste.

[0018] Optionally, it further includes:

[0019] A signal shielding module, which is placed on the top of the encapsulation cover; the signal shielding module is used to ground the signal and set a signal shielding area according to the component layout of the circuit board.

[0020] Optionally, the signal shielding module includes:

[0021] A fixing member for fixing and electrically connecting the signal shielding module to the encapsulation cover;

[0022] An elastic shielding member, one end of the elastic shielding member is connected to the fixing member, and the other end extends freely to form a semi-closed second accommodation space, and the semi-closed second accommodation space is used to provide a signal shielding area.

[0023] Optionally, the elastic shielding member is in a shape of a quasi-circular ring or a quasi-arch, the convex surface of the quasi-circular ring or the quasi-arch is away from the encapsulation cover, and the second accommodation space is in a semi-cylindrical shape or an arch shape.

[0024] In a second aspect, an embodiment of the present invention provides a mobile electronic device, including any one of the waterproof circuits provided by the embodiments of the present invention.

[0025] The technical solution provided by the embodiment of the present invention divides the electronic components in the circuit board into at least one waterproof area according to the first physical characteristic parameters, and uses at least one encapsulation module to perform waterproof encapsulation on the electronic components in the at least one waterproof area. Through the encapsulation module, the surface protection of the electronic components on the circuit board is realized, the exposure of the electronic components on the circuit board is avoided, and the waterproof performance of the circuit board is improved. And generally, the encapsulation module uses a hard material, which further improves the compressive resistance and enhances the protection level of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a top view of a circuit board provided by an embodiment of the present invention.

[0027] Figure 2 It is a schematic structural diagram of an encapsulation base provided by an embodiment of the present invention.

[0028] Figure 3 A schematic structural diagram of a packaging cover provided by an embodiment of the present invention.

[0029] Figure 4 A schematic diagram of a packaging module structure provided by an embodiment of the present invention.

[0030] Figure 5 A schematic diagram of another packaging module structure provided by an embodiment of the present invention.

[0031] Figure 6 A schematic diagram of the structure of a signal shielding module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The embodiment of the present invention provides a waterproof circuit. Figure 1 A top view of a circuit board provided by an embodiment of the present invention. Figure 1 , waterproof circuit includes:

[0034] A circuit board 110, wherein the circuit board 110 includes at least one waterproof area 120, and the electronic components in the at least one waterproof area 120 include a first physical characteristic parameter;

[0035] at least one packaging module, the packaging module including a second physical characteristic parameter matching the first physical characteristic parameter;

[0036] At least one packaging module is used to waterproofly package the electronic components in at least one waterproof area 120;

[0037] The first physical characteristic parameter and the second physical characteristic parameter include one or more of a height, a shape, and a heat dissipation parameter of the electronic component.

[0038] Specific, exemplary Figure 1The waterproof area 120 where the circuit board 110 is disposed is shown. The waterproof area 120 is exemplarily set as a rectangular structure, and can also be set as a square structure. The embodiments of the present invention do not limit this. The electronic components of the circuit board are regionally arranged in the waterproof area 120 according to the first physical characteristic parameters. Among them, the first physical characteristic parameters can be one or more parameters such as the height, shape, and heat generation amount of the electronic components. The encapsulation module can match the corresponding encapsulation module with the second physical characteristic parameters according to the regional layout of the circuit board and the parameters such as the height, shape, and heat generation amount of the electronic components. For example, if the height of the electronic component is relatively high, a taller encapsulation module is adapted in the waterproof area 120. If the height of the electronic component is relatively high and the shape is relatively large, a taller and larger encapsulation module is adapted in the waterproof area 120. If the heat generation amount of the electronic component is relatively large, a heat-dissipating encapsulation module is adapted in the waterproof area 120.

[0039] The technical solution provided by the embodiments of the present invention divides the electronic components in the circuit board into at least one waterproof area according to the first physical characteristic parameters, and uses at least one encapsulation module to perform waterproof encapsulation on the electronic components in at least one waterproof area. The surface protection of the electronic components of the circuit board is realized through the encapsulation module, avoiding the bare placement of the electronic components of the circuit board and improving the waterproofness of the circuit board. And the encapsulation module generally uses a hard material, which further improves the compressive resistance and enhances the protection level of the circuit board.

[0040] Figure 2 It is a schematic structural diagram of an encapsulation base provided by an embodiment of the present invention. Figure 3 It is a schematic structural diagram of an encapsulation cover body provided by an embodiment of the present invention. Combining Figure 1 See Figure 2 and Figure 3 , the encapsulation module includes: an encapsulation base 210 and an encapsulation cover body 310;

[0041] The encapsulation base 210 is welded to the ground end of the circuit board 110 and surrounds the waterproof area 120;

[0042] The encapsulation cover body 310 covers and is electrically connected to the encapsulation base 210 to form a first accommodation space for accommodating electronic components.

[0043] Specifically, the encapsulation base 210 and the encapsulation cover body 310 can adopt metal sheet materials. The ground end of the circuit board 110 can be welded to the encapsulation base 210, and the encapsulation base 210 and the covered encapsulation cover body 310 are used as the ground signal of the electronic components of the circuit board 110. The encapsulation base 210 is set as a frame structure according to the shape of the waterproof area 120, and this frame structure surrounds the waterproof area 120. Figure 2Exemplarily, it is shown as a rectangular box structure. The encapsulation cover 310 is set according to the shape and size of the encapsulation base 210, and the encapsulation cover 310 can fitly cover the encapsulation base 210. Therefore, a first accommodation space is formed between the encapsulation cover 310 and the encapsulation base 210, which can accommodate the electronic components of the circuit board 110.

[0044] Based on the above embodiments, Figure 4 is a schematic structural diagram of an encapsulation module provided by an embodiment of the present invention. Combining Figure 2 and Figure 3 Referring to Figure 4 , the first accommodation space includes at least one filling inlet 410 and at least one filling outlet 420 that communicate with the outside.

[0045] It further includes a waterproof filling material filled into the first accommodation space through at least one filling inlet 410.

[0046] Specifically, Figure 4 is shown as the encapsulation cover has covered the encapsulation base. The encapsulation module can include a plurality of filling inlets 410 and filling outlets 420. The waterproof filling material can be filled into the first accommodation space through the filling inlet 410. When the waterproof filling material is input through the filling inlet 410, the air in the first accommodation space can be discharged through the filling outlet 420 and the unused filling inlets 410, thus avoiding blockage of the waterproof filling material. When the first accommodation space is filled with the waterproof filling material, it can avoid the problem of short circuit of the electronic components when they encounter water.

[0047] Continuing to refer to Figure 4 , based on the above embodiments, at least one filling inlet 410 includes a first through hole 510 provided on the encapsulation cover, and at least one filling outlet includes a second through hole 520 provided on the side of the encapsulation base and the encapsulation cover;

[0048] Among them, the second through hole 520 includes a notch structure provided at the connection of the adjacent sides of the encapsulation base and the encapsulation cover.

[0049] Specifically, a first through hole 510 can be provided on the covering surface of the encapsulation cover as the filling inlet. Among them, the first through hole 510 can be circular or square, etc. The embodiments of the present invention do not limit this. Figures 2 to 4 In

[0050] Exemplarily, in the frame structure of the encapsulation base and the side of the encapsulation cover, a second through hole 520 may be provided as a filling outlet for exhausting air when filling the waterproof material. Preferably, a notch structure is provided at the connection of adjacent sides in the frame structure of the encapsulation base, and the encapsulation cover is matched with the encapsulation base to provide the same notch structure at the connection of adjacent sides of the encapsulation cover. This notch structure serves as the filling outlet, which is the second through hole 520. The notch structure can not only serve as an exhaust outlet during filling, but also release the deformation stress of the encapsulation module through the notch structure when the encapsulation module is subjected to extrusion or impact stress.

[0051] Optionally, the waterproof filler includes AB-type silicone and heat dissipation paste.

[0052] Specifically, according to actual engineering requirements, AB-type silicone can be filled in the first accommodation space. During filling, the two components are mixed by a potting machine and then injected to achieve protection of the electronic components. When the electronic components generate a large amount of heat, heat dissipation paste can be filled. While providing protection, the heat generated by the electronic components is transferred to the encapsulation module through the heat dissipation paste, and the encapsulation base and the encapsulation cover increase the heat dissipation area to improve the heat dissipation performance of the electronic components.

[0053] Figure 5 Another structural schematic diagram of the encapsulation module provided by an embodiment of the present invention. Refer to Figure 5 , the waterproof circuit further includes: a signal shielding module 610, which is placed on the top of the encapsulation cover 310; the signal shielding module 610 is used to ground the signal and set the signal shielding area according to the component layout of the circuit board.

[0054] Specifically, the signal shielding module 610 can be made of a metal material. Exemplarily, copper material is used. During the circuit board design process for the area where signal shielding is required, the signal is grounded through the signal shielding module 610 via the encapsulation cover 310, which can reduce the use of conductive fiber cloth. And the signal shielding effect can be enhanced by covering the filling inlet.

[0055] Figure 6 A structural schematic diagram of a signal shielding module provided by an embodiment of the present invention. Refer to Figure 6 , the signal shielding module includes: a fixing member 710, which is used to fix and electrically connect the signal shielding module to the encapsulation cover;

[0056] An elastic shielding member 720, one end of the elastic shielding member 720 is connected to the fixing member 710, and the other end extends freely to form a semi-closed second accommodation space 730. The semi-closed second accommodation space 730 is used to provide a signal shielding area.

[0057] Specifically, the fixing member 710 can be made of conductive adhesive tape and pasted on the outer surface of the encapsulation cover body. Fixing with adhesive tape facilitates the user to install the signal shielding module according to the shielding area. The elastic shielding member 720 is connected to the fixing member 710. Among them, the elastic shielding member 720 and the fixing member 710 can be prepared by an integral part, and only the functional division of the fixing area and the elastic shielding area needs to be made. The elastic shielding member 720 can freely extend to form a second receiving space 730 with the surface of the encapsulation cover body. The second receiving space 730 provides a signal shielding area, and when being extruded in the external vertical direction, due to the existence of the second receiving space 730, the elastic shielding member can release the extrusion stress through its own elasticity and play a buffering role.

[0058] Continue to refer to Figure 6 , on the basis of the above embodiments, the elastic shielding member 720 is in a quasi-circular ring or quasi-arch bridge structure, the convex surface of the quasi-circular ring or quasi-arch bridge structure is away from the encapsulation cover body, and the second receiving space 730 is semi-cylindrical or arch-shaped.

[0059] Specifically, the quasi-circular ring or quasi-arch bridge structure of the elastic shielding member 720 and the encapsulation cover body form a semi-cylindrical or arch-shaped shape, which can form a good shielding space and also increase the stress-bearing area when being extruded in the external vertical direction, and utilize the elastic performance of the elastic shielding member 720 to release the extrusion stress and further play a buffering role.

[0060] The embodiment of the present invention provides a mobile electronic device, including the waterproof circuit provided in any one of the embodiments of the present invention. Specifically, the mobile electronic device includes an electronic device that performs functions by combining electronic components on a circuit board, such as a detector, a computer, or a mobile phone, etc. Because it includes the waterproof circuit provided in any one of the embodiments of the present invention, it also has the same beneficial effects and will not be elaborated here.

[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A waterproof circuit, characterized in that, Comprising: A circuit board, the circuit board including at least one waterproof area, and electronic components within the at least one waterproof area having a first physical characteristic parameter; At least one encapsulation module, the encapsulation module including a second physical characteristic parameter matching the first physical characteristic parameter, the encapsulation module including an encapsulation base and an encapsulation cover, the encapsulation base being welded to the ground terminal of the circuit board and surrounding the waterproof area, the encapsulation cover covering and electrically connecting to the encapsulation base to form a first accommodation space for accommodating the electronic components, the first accommodation space including at least one filling inlet and at least one filling outlet communicating with the outside, the at least one filling inlet including a first through hole provided on the encapsulation cover, and the at least one filling outlet including a second through hole provided on the side of the encapsulation base and the encapsulation cover; The at least one encapsulation module is used for waterproof encapsulation of the electronic components within the at least one waterproof area; The first physical characteristic parameter and the second physical characteristic parameter include one or more of the height, shape, and heat dissipation parameter of the electronic components; A signal shielding module, the signal shielding module being disposed on the top of the encapsulation cover; the signal shielding module is used for grounding signals and setting signal shielding areas according to the component layout of the circuit board; A fixing member for fixing and electrically connecting the signal shielding module to the encapsulation cover; An elastic shielding member, one end of the elastic shielding member is connected to the fixing member, and the other end extends freely to form a semi-closed second accommodation space, the semi-closed second accommodation space being used for providing a signal shielding area, the elastic shielding member being a circular ring-like or arch-like structure, the convex surface of the circular ring-like or arch-like structure being away from the encapsulation cover, and the second accommodation space being semi-cylindrical or arch-shaped.

2. The waterproof circuit according to claim 1, wherein, The second through hole includes a notch structure provided at the connection of the adjacent side edges of the encapsulation base and the encapsulation cover.

3. The waterproof circuit according to claim 1, wherein Further comprising a waterproof filling material filled into the first accommodation space through the at least one filling inlet.

4. The waterproof circuit according to claim 3, wherein The waterproof filling material includes AB-type silica gel and heat dissipation paste.

5. A mobile electronic device, characterized in that, Including the waterproof circuit according to any one of claims 1-4.

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