Circuit Module

Abstract

The present invention provides a circuit module capable of suppressing contact between solder and bonding adhesive. The circuit module comprises: a substrate module having an upper main surface with a normal extending in the vertical direction; an electronic component disposed on the substrate module; and bonding adhesive for securing the electronic component to the upper main surface. The electronic component includes a first electrode. The substrate module includes a second electrode disposed to the right of the bonding adhesive. The first electrode is electrically connected to the second electrode via solder. A first recessed portion having a bottom and a downwardly concave shape is provided on the upper main surface. The upper end of the second electrode is disposed above the bottom. The first recessed portion has a first region that overlaps with the second electrode when viewed in the left-right direction and to the left of the first electrode. The material forming the portion forming the first recessed portion is the same as the material forming the portion forming the upper main surface.

Description

Technical Field

[0001] The present invention relates to a circuit module in which electronic components are mounted on a substrate module. Background Art

[0002] As a previous invention regarding a circuit module, for example, the circuit module described in Patent Document 1 is known. This circuit module includes a semiconductor package body, an energy storage element, and a shielding layer. The semiconductor package body includes an upper surface and a conductive element. The conductive element is arranged on the upper surface of the semiconductor package body. The energy storage element is arranged on the upper surface of the semiconductor package body. The energy storage element and the conductive element of the semiconductor package body are electrically connected via solder. The shielding layer is arranged between the semiconductor package body and the energy storage element. At this time, the shielding layer is fixed to the semiconductor package body by a bonding adhesive. In addition, the shielding layer is fixed to the energy storage element by a bonding adhesive.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: U.S. Patent Application Publication No. 2013 / 0001756 ( Figure 2 )

[0006] However, in the circuit module described in Patent Document 1, there is a case where the solder and the bonding adhesive come into contact. More specifically, after the shielding layer, the semiconductor package body, and the energy storage element are fixed by the bonding adhesive, the solder is heated and cooled, whereby the energy storage element and the conductive element of the semiconductor package body are electrically connected via the solder. At this time, there is a case where the molten solder spreads to the upper surface of the semiconductor package body. As a result, there is a case where the molten solder comes into contact with the bonding adhesive. If the bonding adhesive is conductive, the contact between the solder and the bonding adhesive may cause malfunction of the circuit module. If the bonding adhesive is insulating, when the hot solder comes into contact with the bonding adhesive, the bonding adhesive may melt due to the heat of the solder. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] Therefore, an object of the present invention is to provide a circuit module capable of suppressing contact between solder and bonding adhesive.

[0009] Means for solving problems

[0010] A circuit module according to one embodiment of the present invention includes:

[0011] A substrate module having an upper main surface, wherein the upper main surface has a normal line extending in the up-down direction;

[0012] electronic components, arranged on the substrate module; and

[0013] A bonding adhesive is used to fix the electronic component to the upper main surface.

[0014] The electronic component includes a first electrode,

[0015] The substrate module includes a second electrode disposed on the right side of the bonding adhesive.

[0016] The first electrode is electrically connected to the second electrode via solder,

[0017] A first recessed portion having a bottom and a shape that is concave downward is provided on the upper main surface.

[0018] The upper end of the second electrode is arranged above the bottom,

[0019] The first recess has a first region.

[0020] When viewed in the vertical direction, the first region is located between the second electrode and the bonding adhesive.

[0021] The material of the portion forming the first recess is the same as the material of the portion forming the upper main surface.

[0022] Effects of the Invention

[0023] According to the present invention, it is possible to provide a circuit module capable of suppressing contact between solder and bonding adhesive. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a plan view of the circuit module 100 according to the first embodiment.

[0025] Figure 2 It is a cross-sectional view taken along line AA of the circuit module 100 according to the first embodiment.

[0026] Figure 3 It is a cross-sectional view taken along line BB of the circuit module 100 according to the first embodiment.

[0027] Figure 4 It is a plan view of a circuit module 100 a according to a first modification.

[0028] Figure 5 It is a cross-sectional view taken along line AA of the circuit module 100 a according to the first modification.

[0029] Figure 6 BB is a cross-sectional view of the circuit module 100 a according to the first modification.

[0030] Figure 7 It is a plan view of a circuit module 100 b according to a second modification.

[0031] Figure 8 It is a cross-sectional view taken along line AA of a circuit module 100 b according to a second modification.

[0032] Figure 9 BB is a cross-sectional view of a circuit module 100 b according to a second modification.

[0033] Figure 10 It is a plan view of a circuit module 100 c according to a third modification.

[0034] Figure 11 It is a cross-sectional view taken along line AA of a circuit module 100 c according to a third modification.

[0035] Figure 12 BB is a cross-sectional view of a circuit module 100 c according to a third modification.

[0036] Figure 13 It is a plan view of a circuit module 100d according to a fourth modification.

[0037] Figure 14 It is a cross-sectional view taken along line AA of a circuit module 100d according to a fourth modification.

[0038] Figure 15 BB is a cross-sectional view of a circuit module 100d according to a fourth modification.

[0039] Figure 16 It is a plan view of a circuit module 100 e according to a fifth modification.

[0040] Figure 17 4 is a cross-sectional view taken along line AA of a circuit module 100 e according to a fifth modification.

[0041] Figure 18 BB is a cross-sectional view of a circuit module 100 e according to a fifth modification.

[0042] Figure 19 It is a cross-sectional view taken along line AA of a circuit module 100 f according to a sixth modification.

[0043] Figure 20 DD and EE are cross-sectional views of a circuit module 100 f according to a sixth modification.

[0044] Figure 21 It is a plan view of a circuit module 100g according to a seventh modification.

[0045] Figure 224 is a cross-sectional view taken along line AA of a circuit module 100g according to a seventh modification.

[0046] Figure 23 BB is a cross-sectional view of a circuit module 100g according to a seventh modification.

[0047] Figure 24 4 is a cross-sectional view taken along line AA of a circuit module 100h according to an eighth modification.

[0048] Figure 25 4 is a cross-sectional view taken along line AA of a circuit module 100i according to a ninth modification.

[0049] Figure 26 4 is a cross-sectional view taken along line AA of a circuit module 100 j according to a tenth modification.

[0050] Description of Reference Numerals

[0051] 10: Electronic components;

[0052] 10a: electronic component body;

[0053] 11L, 11R: first electrode;

[0054] 20: baseboard module;

[0055] 21L, 21R: second electrode;

[0056] 22: Insulating sealing material;

[0057] 23L, 23R, 23Ra: 1st concave part;

[0058] 23R1: Region 1;

[0059] 23R2: Region 2;

[0060] 23R3: Part 1;

[0061] 23R4: Part 2;

[0062] 23Rb: 2nd recess;

[0063] 30L, 30R: solder;

[0064] 40: bonding adhesive;

[0065] 50: substrate;

[0066] 51: first conductor;

[0067] 52L, 52R: second conductor;

[0068] 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j: circuit modules;

[0069] 251: Electrode

[0070] S10: bottom surface;

[0071] S20: upper main face;

[0072] S23R, S23Rb: bottom. DETAILED DESCRIPTION

[0073] [First embodiment]

[0074] Hereinafter, a circuit module 100 according to a first embodiment of the present invention will be described with reference to the drawings. Figure 1 It is a plan view of the circuit module 100 according to the first embodiment. Figure 2 It is a cross-sectional view taken along line AA of the circuit module 100 according to the first embodiment. Figure 3 It is a cross-sectional view taken along line BB of the circuit module 100 according to the first embodiment.

[0075] In this specification, directions are defined as follows. The direction in which the normal to the upper main surface S20 of the substrate module 20 extends is defined as the up-down direction. The up-down direction coincides with the direction in which the electronic component 10 and the substrate module 20 are arranged. Furthermore, the direction in which the second electrodes 21R and 21L of the substrate module 20 are arranged is defined as the left-right direction. The direction perpendicular to the up-down and left-right directions is defined as the front-back direction. The up-down, left-right, and front-back directions are mutually orthogonal.

[0076] In this specification, when any two components are defined as a first component and a second component, the phrase "the first component is disposed on the second component" refers to the following state: at least a portion of the first component is located directly above the second component. Therefore, when viewed in the vertical direction, the first component and the second component overlap. This definition also applies to directions other than the vertical direction.

[0077] In this specification, the phrase "a first member is positioned above a second member" includes both situations where at least a portion of the first member is positioned directly above the second member and situations where the entire first member is positioned obliquely above the second member. At least a portion or the entire first member is positioned directly above the second member. "Obliquely above" includes, for example, the upper left or upper right direction. This definition also applies to directions other than up and down.

[0078] In this specification, unless otherwise stated, the various parts of the first member are defined as follows. The front portion of the first member means the front half of the first member. The rear portion of the first member means the rear half of the first member. The left portion of the first member means the left half of the first member. The right portion of the first member means the right half of the first member. The upper portion of the first member means the upper half of the first member. The lower portion of the first member means the lower half of the first member. The front end of the first member means the front end of the first member. The rear end of the first member means the rear end of the first member. The left end of the first member means the left end of the first member. The right end of the first member means the right end of the first member. The upper end of the first member means the upper end of the first member. The lower end of the first member means the lower end of the first member. The front end portion of the first member means the front end of the first member and its vicinity. The rear end portion of the first member means the rear end of the first member and its vicinity. The left end portion of the first member means the left end of the first member and its vicinity. The right end portion of the first member means the right end of the first member and its vicinity. The upper end portion of the first member means the upper end of the first member and its vicinity. The lower end portion of the first member means the lower end of the first member and its vicinity.

[0079] In this specification, the phrase "the first member and the second member are electrically connected" means that there is electrical conduction between the first and second members. Therefore, the first and second members may or may not be in contact. In the case where the first and second members are not in contact, a third member having electrical conductivity is disposed between the first and second members.

[0080] like Figure 1 as well as Figure 2 As shown, the circuit module 100 includes an electronic component 10 , a substrate module 20 , a plurality of solders 30R, a plurality of solders 30L, and a bonding adhesive 40 .

[0081] like Figure 2 as well as Figure 3 As shown, the substrate module 20 includes a plurality of second electrodes 21R, a plurality of second electrodes 21L, an insulating sealing material 22 , an IC 25 , and a substrate 50 .

[0082] The substrate 50 has a plate shape having an upper main surface and a lower main surface. An electrical circuit is formed by a conductor layer inside the substrate 50. Figure 2 As shown in FIG. 5 , the substrate 50 includes a plurality of first conductors 51, a plurality of second conductors 52R, and a plurality of second conductors 52L. Figure 2In FIG. 1 , only representative first conductors 51 among the plurality of first conductors 51 are denoted by reference numerals. Each of the plurality of first conductors 51 , the plurality of second conductors 52R, and the plurality of second conductors 52L has conductivity.

[0083] like Figure 2 As shown, a plurality of first conductive bodies 51 are arranged near the center of the upper main surface of the substrate 50 when viewed in the front-to-back direction. The plurality of first conductive bodies 51 are electrodes for mounting an IC (Intagrated Circuit) 25, described later. A plurality of second conductive bodies 52R are arranged in a row along the front-to-back direction on the right portion of the upper main surface of the substrate 50. A plurality of second conductive bodies 52L are arranged in a row along the front-to-back direction on the left portion of the upper main surface of the substrate 50.

[0084] like Figure 2 As shown, IC25 contacts the substrate 50 and is arranged on the substrate 50. In this embodiment, IC25 is, for example, a power supply IC. IC25 has an electrode 251. Figure 2 In the figure, only representative electrodes 251 among the plurality of electrodes 251 are denoted by reference numerals. The electrodes 251 are conductive. The bottom surface of the electrodes 251 is fixed to the upper surface of the first conductor 51 by solder.

[0085] like Figure 2 As shown, the insulating sealing material 22 is disposed on the substrate 50. In this embodiment, the insulating sealing material 22 is, for example, a resin. The insulating sealing material 22 contacts the substrate 50 and covers the lower portions of the plurality of second electrodes 21R, the lower portions of the plurality of second electrodes 21L, and the IC 25. In this embodiment, the insulating sealing material 22 has an upper main surface S20. In other words, the substrate module 20 has an upper main surface S20.

[0086] like Figure 2 as well as Figure 3 As shown, the upper main surface S20 has a normal line extending in the vertical direction. In this embodiment, the bottom surface S10 of the electronic component body 10a and the upper main surface S20 of the substrate module 20 are arranged in the vertical direction. Figure 2 As shown, the bottom surface S10 of the electronic component body 10a and the upper main surface S20 of the substrate module 20 face each other. In this embodiment, the material forming the portion of the upper main surface S20 is an insulating sealing material 22.

[0087] like Figure 3As shown, the upper main surface S20 is provided with a plurality of first recesses 23R and a plurality of first recesses 23L. More specifically, the plurality of first recesses 23R are arranged in a row from front to back. The plurality of first recesses 23L each have a structure that is bilaterally symmetrical with the plurality of first recesses 23R. Therefore, the description of the plurality of first recesses 23L is omitted. The following description focuses on one first recess 23R among the plurality of first recesses 23R.

[0088] The first recess 23R is arranged on the right side of the upper main surface S20. Figure 2 As shown, the first recess 23R is arranged on the right side of the bonding adhesive 40 described later. In addition, the first recess 23R has a shape that is recessed in the downward direction. In the present embodiment, the first recess 23R has a height difference in the vertical direction relative to the upper main surface S20. In the present embodiment, the material of the portion forming the first recess 23R is an insulating sealing material 22, which is the same material as the portion forming the upper main surface S20. In addition, the first recess 23R has a bottom S23R. In more detail, the bottom S23R is the lowest portion of the first recess 23R in the vertical direction. In the present embodiment, the bottom S23R is a surface.

[0089] like Figure 3 As shown, the first recess 23R has a first region 23R1 that overlaps with the second electrode 21R when viewed in the left-right direction, and a second region 23R2. More specifically, the first region 23R1 is located to the left of the second electrode 21R, where the first recess 23R and the second electrode 21R overlap when viewed in the left-right direction. When viewed in the vertical direction, the first region 23R1 is located between the second electrode 21R and the bonding adhesive 40 (described later). The second region 23R2 is located to the right of the second electrode 21R, where the first recess 23R and the second electrode 21R overlap when viewed in the left-right direction. When viewed in the vertical direction, the second region 23R2 is located to the right of the second electrode 21R. In this embodiment, the first region 23R1 has a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. That is, the first recess 23R contacts the left portion of the second electrode 21R. Furthermore, the second region 23R2 has a second portion 23R4 that contacts the second electrode 21R when viewed in the vertical direction. That is, the first recess 23R contacts the right portion of the second electrode 21R. In this embodiment, Figure 2 As shown, the position of the first portion 23R3 in the vertical direction is the same as the position of the second portion 23R4 in the vertical direction.

[0090] The plurality of second electrodes 21R are arranged on the right side of the insulating sealing material 22. Figure 2As shown in FIG. 1 , the plurality of second electrodes 21R are respectively arranged on the right side of the bonding adhesive 40 described later. More specifically, the plurality of second electrodes 21R each have a shape extending in the vertical direction and have conductivity. Figure 3 As shown, the plurality of second electrodes 21R are arranged in a row from front to back. The plurality of second electrodes 21L each have a structure that is bilaterally symmetrical with the plurality of second electrodes 21R. Therefore, the description of the plurality of second electrodes 21L is omitted. In addition, the following description focuses on one second electrode 21R among the plurality of second electrodes 21R.

[0091] like Figure 2 As shown, the upper end of the second electrode 21R is positioned above the bottom S23R. In this embodiment, the second electrode 21R is positioned within the first recess 23R when viewed in the vertical direction. More specifically, the second electrode 21R contacts the first recess 23R. Furthermore, the upper end of the second electrode 21R contacts the solder 30R, described later. The bottom surface of the second electrode 21R contacts the upper surface of the substrate 50. The bottom surface of the second electrode 21R is secured to the second conductor 52R via solder.

[0092] like Figure 1 As shown in FIG. 1 , the electronic component 10 includes an electronic component body 10a, a plurality of first electrodes 11R, and a plurality of first electrodes 11L. In this embodiment, the electronic component 10 is, for example, an inductor. Figure 2 As shown, the electronic component 10 is arranged on a substrate module 20 .

[0093] like Figure 2 As shown, the electronic component body 10a has a bottom surface S10. In this embodiment, the electronic component body 10a has a rectangular parallelepiped shape. However, as long as the electronic component body 10a has the bottom surface S10, the electronic component body 10a may have a shape other than a rectangular parallelepiped shape.

[0094] like Figure 2 As shown, the plurality of first electrodes 11R are respectively provided at the right end portion of the electronic component body 10a. More specifically, the plurality of first electrodes 11R are metal terminals having a shape extending from the right side of the electronic component body 10a to the lower right direction. In other words, the plurality of first electrodes 11R are conductive. The right ends of the plurality of first electrodes 11R are respectively arranged below the bottom surface S10. Figure 3 As shown in FIG. 1 , the plurality of first electrodes 11R are arranged in a row from front to back. The plurality of first electrodes 11L each have a structure that is bilaterally symmetrical with the plurality of first electrodes 11R. Therefore, the description of the plurality of first electrodes 11L is omitted.

[0095] The electronic component 10 as described above is mounted on the substrate module 20 by means of the bonding adhesive 40, the plurality of solders 30R, and the plurality of solders 30L. Figure 2As shown, when viewed in the front-to-back direction, the bonding adhesive 40 is provided between the bottom surface S10 of the electronic component body 10a and the upper main surface S20 of the substrate module 20. The bonding adhesive 40 secures the electronic component 10 to the upper main surface S20 of the substrate module 20. The bonding adhesive 40 may be conductive or insulating.

[0096] like Figure 1 As shown, multiple solders 30R are arranged in a row from front to back. Each of the multiple solders 30R and the multiple solders 30L has the property of melting when heated. Each of the multiple solders 30L has a structure that is bilaterally symmetrical with the multiple solders 30R. Therefore, the description of the multiple solders 30L is omitted. The following description focuses on one of the multiple solders 30R.

[0097] like Figure 2 As shown, the solder 30R is disposed at the lower end of the first electrode 11R and the upper end of the second electrode 21R. The solder 30R contacts the lower end of the first electrode 11R and the upper end of the second electrode 21R. That is, the first electrode 11R is electrically connected to the second electrode 21R via the solder 30R.

[0098] [Effect]

[0099] According to the circuit module 100, contact between the solder 30R and the bonding adhesive 40 can be suppressed. More specifically, the bonding adhesive 40 fixes the electronic component 10 to the upper main surface S20. The upper main surface S20 is provided with a first recess 23R, which is arranged to the right of the bonding adhesive 40. The first recess 23R has a shape that is recessed downward and has a bottom S23R. The upper end of the second electrode 21R is arranged above the bottom S23R of the first recess 23R. The first recess 23R has a first region 23R1 located between the second electrode 21R and the bonding adhesive 40 when viewed in the vertical direction. Therefore, even if the solder 30R arranged at the upper end of the second electrode 21R melts and spreads to the upper main surface S20, the molten solder 30R will flow into the first region 23R1 of the first recess 23R. Therefore, according to the circuit module 100 , it is possible to suppress the solder 30R from spreading to the left side of the first recess 23R. Consequently, according to the circuit module 100 , it is possible to suppress the solder 30R from coming into contact with the bonding adhesive 40 .

[0100] Furthermore, the material of the portion forming the first recess 23R is the same as the material of the portion forming the upper main surface S20 , so that the first recess 23R can be prevented from being damaged by melting or the like due to the molten solder 30R.

[0101] Furthermore, the circuit module 100 can increase the creepage distance between the second electrode 21R and the second electrode 21L. The creepage distance is the shortest distance between the second electrode 21R and the second electrode 21L along the upper main surface S20. As a result, it becomes easier to ensure the insulation performance of the circuit module 100.

[0102] Furthermore, according to the circuit module 100 , the first recess 23R includes the second region 23R2 located to the right of the second electrode 21R when viewed in the vertical direction. As a result, it is possible to suppress the solder 30R from spreading to the left of the second electrode 21R.

[0103] [First Modification]

[0104] Hereinafter, a circuit module 100 a according to a first modified example of the present invention will be described with reference to the drawings. Figure 4 It is a plan view of a circuit module 100 a according to a first modification. Figure 5 It is a cross-sectional view taken along line AA of the circuit module 100 a according to the first modification. Figure 6 1 is a cross-sectional view of the circuit module 100a according to the first modification example taken along line BB. Regarding the circuit module 100a according to the first modification example, only the parts that differ from the circuit module 100 according to the first embodiment will be described, and the rest will be omitted.

[0105] The circuit module 100 a differs from the circuit module 100 in the shape of the first recess 23R, the arrangement of the electronic component 10 , and the shape of the first electrode 11R.

[0106] like Figures 4 to 6 As shown, the right end portion of the first recess 23R reaches the right side of the upper main surface S20.

[0107] like Figure 5 As shown, the electronic component 10 is arranged on the substrate module 20. The electronic component body 10a has a portion overlapping the second electrode 21R when viewed in the vertical direction.

[0108] like Figure 5 As shown, the first electrode 11R is provided at the right end of the electronic component body 10a. More specifically, the first electrode 11R is a metal terminal extending from the right side of the electronic component body 10a along the bottom surface S10 of the electronic component body 10a. Furthermore, the first electrode 11R contacts the right side of the electronic component body 10a and the bottom surface S10 of the electronic component body 10a.

[0109] The circuit module 100a described above also achieves the same effects as those of the circuit module 100. Furthermore, according to the circuit module 100a, the adhesion state of the solder 30R can be visually inspected when viewed from the right.

[0110] [Second Modification]

[0111] Hereinafter, a circuit module 100b according to a second modified example of the present invention will be described with reference to the drawings. Figure 7 It is a plan view of a circuit module 100 b according to a second modification. Figure 8 It is a cross-sectional view taken along line AA of a circuit module 100 b according to a second modification. Figure 9 1 is a cross-sectional view of a circuit module 100b according to the second modification example taken along line BB. Regarding the circuit module 100b according to the second modification example, only the portions that differ from the circuit module 100 according to the first embodiment will be described, and the remaining portions will be omitted.

[0112] The circuit module 100b is different from the circuit module 100 in the shape of the first recess 23R. Figures 7 to 9 As shown in FIG. 1 , the first recess 23R is arranged on the left side of the second electrode 21R. As a result, Figure 9 As shown, the first recess 23R does not have the second region 23R2.

[0113] In the circuit module 100b described above, it is also possible to suppress contact between the solder 30R and the bonding adhesive 40. Furthermore, it is possible to increase the creepage distance between the second electrode 21R and the second electrode 25R.

[0114] [Third Modification]

[0115] Hereinafter, a circuit module 100c according to a third modified example of the present invention will be described with reference to the drawings. Figure 10 It is a plan view of a circuit module 100 c according to a third modification. Figure 11 It is a cross-sectional view taken along line AA of a circuit module 100 c according to a third modification. Figure 12 1 is a cross-sectional view of a circuit module 100c according to the third modification example taken along line BB. Regarding the circuit module 100c according to the third modification example, only the parts that differ from the circuit module 100 according to the first embodiment will be described, and the rest will be omitted.

[0116] The circuit module 100c is different from the circuit module 100 in the arrangement of the first recess 23R. Figures 10 to 12 As shown in FIG. 2 , the second electrode 21R does not contact the first recess 23R. That is, the first region 23R1 does not have a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. As a result, as shown in FIG. Figure 12As shown, the first region 23R1 is spaced apart from the second electrode 21R in the horizontal direction. Furthermore, the second region 23R2 does not include a second portion 23R4 that contacts the second electrode 21R when viewed in the vertical direction. Consequently, the second region 23R2 is spaced apart from the second electrode 21R in the horizontal direction.

[0117] In the circuit module 100c described above, it is also possible to suppress contact between the solder 30R and the bonding adhesive 40. Furthermore, it is possible to increase the creepage distance between the second electrode 21R and the second electrode 21L.

[0118] [Fourth Modification]

[0119] Hereinafter, a circuit module 100d according to a fourth modified example of the present invention will be described with reference to the drawings. Figure 13 It is a plan view of a circuit module 100d according to a fourth modification. Figure 14 It is a cross-sectional view taken along line AA of a circuit module 100d according to a fourth modification. Figure 15 1 is a cross-sectional view of a circuit module 100d according to a fourth modification example taken along line BB. Regarding the circuit module 100d according to the fourth modification example, only the portions that differ from the circuit module 100 according to the first embodiment will be described, and the remaining portions will be omitted.

[0120] The circuit module 100d is different from the circuit module 100 in the arrangement of the first recess 23R. Figures 13 to 15 As shown in FIG. 1 , the first recess 23R is arranged on the left side of the second electrode 21R. As a result, Figure 15 As shown in FIG. 1 , the first recess 23R does not have the second region 23R2. In addition, the second electrode 21R does not contact the first recess 23R. That is, the first region 23R1 does not have the first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. As a result, as shown in FIG. Figure 15 As shown, the first region 23R1 is arranged at a distance from the second electrode 21R in the left-right direction.

[0121] In the circuit module 100d as described above, it is also possible to suppress contact between the solder 30R and the bonding adhesive 40. Furthermore, it is possible to increase the creepage distance between the second electrode 21R and the second electrode 21L.

[0122] [Fifth Modification]

[0123] Hereinafter, a circuit module 100e according to a fifth modification of the present invention will be described with reference to the drawings. Figure 16 It is a plan view of a circuit module 100 e according to a fifth modification. Figure 17 4 is a cross-sectional view taken along line AA of a circuit module 100 e according to a fifth modification. Figure 181 is a cross-sectional view of a circuit module 100e according to the fifth modification example taken along line BB. Regarding the circuit module 100e according to the fifth modification example, only the portions that differ from the circuit module 100 according to the first embodiment will be described, and the remaining portions will be omitted.

[0124] The circuit module 100e is different from the circuit module 100 in that the first recess 23R is divided into a first recess 23Ra and a second recess 23Rb. Figures 16 to 18 As shown in FIG. 1 , the first recess 23Ra is arranged on the left side of the second electrode 21R. As a result, Figure 18 As shown, the first concave portion 23Ra has a first region 23R1. In addition, in this modification, the second electrode 21R does not contact the first concave portion 23Ra. That is, the first region 23R1 does not have a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. As a result, Figure 18 As shown, the first region 23R1 is arranged at a distance from the second electrode 21R in the left-right direction.

[0125] like Figures 16 to 18 As shown in FIG. 1 , the second recess 23Rb is provided on the right side of the upper main surface S20. Figure 17 As shown, the second recess 23Rb has a shape that is concave in the downward direction. In this modification, the second recess 23Rb has a height difference in the vertical direction relative to the upper main surface S20. In this modification, the material forming the portion of the second recess 23Rb is the insulating sealing material 22, which is the same as the material forming the portion of the upper main surface S20. In addition, as shown in FIG. Figure 17 As shown, the second recess 23Rb has a bottom S23Rb. More specifically, the bottom S23Rb is the lowest portion of the second recess 23Rb in the vertical direction. In this modification, the bottom S23Rb is a surface. The second recess 23Rb is arranged on the right side of the second electrode 21R. As a result, as shown in FIG. Figure 18 As shown, the second recess 23Rb has a second region 23R2. In this modification, the second region 23R2 is located to the right of the second electrode 21R, and is an area where the second recess 23Rb and the second electrode 21R overlap when viewed in the left-right direction. When viewed in the up-down direction, the second region 23R2 is located to the right of the second electrode 21R. In this modification, the second electrode 21R does not contact the second recess 23Rb. That is, the second region 23R2 does not have a second portion 23R4 that contacts the second electrode 21R when viewed in the up-down direction. As a result, as Figure 18 As shown, the second region 23R2 is arranged at a distance from the second electrode 21R in the left-right direction.

[0126] The circuit module 100e described above also achieves the same effects as those of the circuit module 100c.

[0127] [Sixth Modification]

[0128] Hereinafter, a circuit module 100f according to a sixth modified example of the present invention will be described with reference to the drawings. Figure 19 It is a cross-sectional view taken along line AA of a circuit module 100 f according to a sixth modification. Figure 20 DD and EE are cross-sectional views of a circuit module 100f according to the sixth modification. In the circuit module 100f according to the sixth modification, only the parts that differ from the circuit module 100 according to the first embodiment will be described, and the rest will be omitted.

[0129] The circuit module 100f is different from the circuit module 100 in the shape of the first recess 23R. Figure 19 As shown in FIG. 1 , the vertical position of the first portion 23R3 is higher than the vertical position of the second portion 23R4. Figure 20 As shown, the vertical position of the first portion 23R3 and the vertical position of the second portion 23R4 are equal, but they may be unequal. In the case where the vertical height of the first portion 23R3 and the vertical height of the second portion 23R4 are unequal, the vertical position of the upper end of the first portion 23R3 may be higher than the vertical position of the upper end of the second portion 23R4, or the vertical position of the first portion 23R3 may be higher than the vertical position of the second portion 23R4.

[0130] The circuit module 100f described above also achieves the same effects as those of the circuit module 100. Furthermore, according to the circuit module 100f, it is easier to suppress the solder 30R from spreading to the left side of the second electrode 21R.

[0131] [7th Modification]

[0132] Hereinafter, a circuit module 100g according to a seventh modification of the present invention will be described with reference to the drawings. Figure 21 It is a plan view of a circuit module 100g according to a seventh modification. Figure 22 4 is a cross-sectional view taken along line AA of a circuit module 100g according to a seventh modification. Figure 23 1 is a cross-sectional view taken along line BB of a circuit module 100g according to a seventh modification. In the circuit module 100g according to the seventh modification, only the parts that differ from the circuit module 100c according to the third modification will be described, and the rest will be omitted.

[0133] The circuit module 100g is different from the circuit module 100c in the arrangement of the first recess 23R. Figures 21 to 23As shown, the distance between the first region 23R1 and the second electrode 21R in the left-right direction is longer than the distance between the second region 23R2 and the second electrode 21R in the left-right direction. Figure 23 As shown, the left-right distance between the first region 23R1 and the second electrode 21R and the left-right distance between the second region 23R2 and the second electrode 21R are not equal. In this case, the shortest left-right distance between the first region 23R1 and the second electrode 21R is longer than the shortest left-right distance between the second region 23R2 and the second electrode 21R. Alternatively, the left-right distance between the first region 23R1 and the second electrode 21R may be longer than the left-right distance between the second region 23R2 and the second electrode 21R.

[0134] The circuit module 100g described above also achieves the same effects as the circuit module 100c. Furthermore, the circuit module 100g can more easily suppress the solder 30R from spreading to the left of the second electrode 21R.

[0135] [Variation 8]

[0136] Hereinafter, a circuit module 100h according to an eighth modification of the present invention will be described with reference to the drawings. Figure 24 1 is a cross-sectional view taken along line AA of a circuit module 100h according to the eighth modification. In the circuit module 100h according to the eighth modification, only the parts that differ from the circuit module 100 according to the first embodiment will be described, and the rest will be omitted.

[0137] The circuit module 100h differs from the circuit module 100 in the shape of the first recess 23R, the arrangement and shape of the electronic component 10 , the arrangement and shape of the first electrode 11R, and the shape of the second electrode 21R.

[0138] like Figure 24 As shown, the right end portion of the first recess 23R reaches the right side of the upper main surface S20.

[0139] like Figure 24 As shown, the electronic component 10 is arranged on the substrate module 20. The electronic component body 10a has a portion overlapping the second electrode 21R when viewed in the vertical direction. In this modification, the electronic component 10 is, for example, a substrate.

[0140] like Figure 24As shown, the first electrode 11R is provided below the bottom surface S10 of the electronic component body 10a. Furthermore, the first electrode 11R is in contact with the bottom surface S10 of the electronic component body 10a. Alternatively, the first electrode 11R may be disposed below the electronic component body 10a and in contact with the bottom surface S10 of the electronic component body 10a.

[0141] like Figure 24 As shown, the upper end of the second electrode 21R has a tapered shape. That is, the cross-sectional area of the second electrode 21R, perpendicular to the vertical direction, decreases upward. Furthermore, when viewed in the vertical direction, the vertical cross-section of the second electrode 21R, of which the vertical cross-section of the upper portion of the second electrode 21R and the vertical cross-section of the lower portion of the second electrode 21R completely overlap.

[0142] The circuit module 100h described above also achieves the same effects as the circuit module 100. Furthermore, with the circuit module 100h, the adhesion of the solder 30R can be visually inspected when viewed from the right. Furthermore, with the circuit module 100h, it is easier to prevent the solder 30R from spreading to the left of the second electrode 21R. Furthermore, with the circuit module 100h, even if there are variations in the vertical positions of the lower ends of the plurality of first electrodes 11R and the lower ends of the plurality of first electrodes 11L, and in the vertical positions of the upper ends of the plurality of second electrodes 21R and the upper ends of the plurality of second electrodes 21L, it is easier to arrange the electronic component 10 horizontally using the plurality of solders 30R and 30L.

[0143] [9th Modification]

[0144] Hereinafter, a circuit module 100i according to a ninth modification of the present invention will be described with reference to the drawings. Figure 25 1 is a cross-sectional view of a circuit module 100i according to a ninth modification example taken along line AA. In the circuit module 100i according to the ninth modification example, only the parts that differ from the circuit module 100a according to the first modification example will be described, and the rest will be omitted.

[0145] The circuit module 100i is different from the circuit module 100a in the shape of the first recess 23R. Figure 25As shown, the insulating sealing material 22 is present at the upper end of the second electrode 21R. As a result, the second electrode 21R does not contact the first recess 23R. That is, the first region 23R1 does not have a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. As a result, the first region 23R1 is arranged with a gap between it and the second electrode 21R in the left-right direction. In addition, the second region 23R2 does not have a second portion 23R4 that contacts the second electrode 21R when viewed in the vertical direction. As a result, the second region 23R2 is arranged with a gap between it and the second electrode 21R in the left-right direction.

[0146] In the circuit module 100i as described above, the same effect as that of the circuit module 100a is achieved. In addition, according to the circuit module 100i, the adhesion state of the solder 30R can be more easily inspected from the outside when viewed from the right. More specifically, in the case of the circuit module 100a, Figure 5 As shown in FIG. 1 , when observing from the position C, if the difference between the color of the solder 30R and the color of the second electrode 21R is small, it is difficult to perform appearance inspection. Figure 25 As shown, when observed at position C, the difference between the color of the solder 30R and the color of the insulating sealing material 22 is large, so the appearance inspection can be easily performed.

[0147] [10th Modification]

[0148] Hereinafter, a circuit module 100j according to a tenth modification of the present invention will be described with reference to the drawings. Figure 26 10 is a cross-sectional view of a circuit module 100j according to a tenth modification example taken along line AA. In the circuit module 100j according to the tenth modification example, only the parts that differ from the circuit module 100i according to the ninth modification example will be described, and the rest will be omitted.

[0149] The circuit module 100j is different from the circuit module 100i in the shape of the first recess 23R. Figure 26 As shown, the insulating sealing material 22 is not present at the upper end of the second electrode 21R. Therefore, in this modified example, the first region 23R1 includes a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. That is, the first recess 23R contacts the left portion of the second electrode 21R. Furthermore, the second region 23R2 includes a second portion 23R4 that contacts the second electrode 21R when viewed in the vertical direction. That is, the first recess 23R contacts the right portion of the second electrode 21R.

[0150] The circuit module 100j described above also achieves the same effects as those of the circuit module 100i.

[0151] [Other embodiments]

[0152] The circuit module according to the present invention is not limited to the circuit modules 100 and 100a to 100j, and can be modified within the scope of the present invention. In addition, the structures of the circuit modules 100 and 100a to 100j can be arbitrarily combined.

[0153] The electronic component 10 is not limited to an inductor, and may be, for example, a capacitor or a substrate.

[0154] Alternatively, there may be only one first electrode 11R.

[0155] In addition, the number of each of the first recessed portion 23R, 23Ra and the second recessed portion 23Rb may be one.

[0156] Furthermore, the bottoms S23R, S23Ra, and S23Rb are not limited to being planes, but may be lines or points.

[0157] The position of the upper end of the second electrode 21R may be above, below, or the same as the upper end of the upper main surface S20 or the average position of the upper main surface S20 in the vertical direction.

[0158] In addition, the electronic component body 10 a may have a portion overlapping with the second electrode 21R when viewed in the up-down direction, or may overlap with the entire second electrode 21R when viewed in the up-down direction.

[0159] In addition, the first recessed portions 23R, 23Ra and the second recessed portion 23Rb may have portions overlapping with the bonding adhesive 40 when viewed in the up-down direction.

[0160] Alternatively, the second electrode 21R may contact the first recess 23Ra and the second recess 23Rb. In this case, the first region 23R1 includes a first portion 23R3 that contacts the second electrode 21R when viewed in the vertical direction. Furthermore, the second region 23R2 includes a second portion 23R4 that contacts the second electrode 21R when viewed in the vertical direction. The vertical position of the first portion 23R3 may be higher than the vertical position of the second portion 23R4. Alternatively, the vertical position of the upper end of the first portion 23R3 may be higher than the vertical position of the upper end of the second portion 23R4, or the vertical position of the first portion 23R3 may be higher than the vertical position of the second portion 23R4. In this case, the same effects as those of the circuit module 100f are achieved.

[0161] Furthermore, the left-right distance between the first region 23R1 of the first recess 23Ra and the second electrode 21R may be longer than the left-right distance between the second region 23R2 of the second recess 23Rb and the second electrode 21R. Alternatively, the shortest left-right distance between the first region 23R1 and the second electrode 21R may be longer than the shortest left-right distance between the second region 23R2 and the second electrode 21R. Alternatively, the left-right distance between the first region 23R1 and the second electrode 21R may be longer than the left-right distance between the second region 23R2 and the second electrode 21R. In this case, the same effects as those of the circuit module 100g are achieved.

[0162] In addition, the insulating sealing material 22 , the IC 25 , the solder 30R, and the substrate 50 are not essential.

[0163] Furthermore, the insulating sealing material 22 is not limited to resin. The insulating sealing material 22 may also be, for example, ceramic. The substrate module 20 need not be a combination of the substrate 50 and the insulating sealing material 22. Therefore, the substrate module 20 may include the substrate 50 without the insulating sealing material 22. The substrate 50 may be, for example, a ceramic substrate or a glass epoxy resin substrate. In this case, the upper principal surface of the substrate 50 is the upper principal surface S20.

[0164] In addition, the first conductor 51 may be in contact with the second conductor 52R. That is, the IC 25 may be electrically connected to the first electrode 11R and the second electrode 21R via the first conductor 51 and the second conductor 52R.

[0165] The IC 25 is not limited to a power supply IC, but may be a control IC, or an electronic component such as a resistor, a capacitor, or a diode.

[0166] Furthermore, the plurality of second conductive bodies 52R do not necessarily need to be arranged in a row along the front-rear direction on the right portion of the upper main surface of the substrate 50 .

[0167] Furthermore, the first region 23R1 and the second region 23R2 do not necessarily need to be the region where the first recess 23R and the second electrode 21R overlap when viewed in the horizontal direction. It suffices that the bonding adhesive 40, the first region 23R1, and the second electrode 21R are arranged in a straight line when viewed in the vertical direction. Furthermore, it suffices that the bonding adhesive 40, the second electrode 21R, and the second region 23R2 are arranged in a straight line when viewed in the vertical direction.

Claims

1. A circuit module comprising: A substrate module having an upper main surface, wherein the upper main surface has a normal line extending in the up-down direction; electronic components, arranged on the substrate module; as well as A bonding adhesive is used to fix the electronic component to the upper main surface. The electronic component includes a first electrode, The substrate module includes a second electrode disposed on the right side of the bonding adhesive. The first electrode is electrically connected to the second electrode via solder, A first recessed portion having a bottom and a shape that is concave downward is provided on the upper main surface. The upper end of the second electrode is arranged above the bottom, The first recess has a first region and a second region, When viewed in the vertical direction, the first region is located between the second electrode and the bonding adhesive. The material of the portion forming the first recess is the same as the material of the portion forming the upper main surface. The second region is located on the right side of the second electrode and reaches the right side of the upper main surface when viewed in the up-down direction.

2. The circuit module according to claim 1, wherein: The first region is arranged at a distance from the second electrode in the left-right direction.

3. The circuit module according to claim 1 or 2, wherein: The second region is arranged at a distance from the second electrode in the left-right direction.

4. The circuit module according to claim 1, wherein: The first region has a first portion that contacts the second electrode when viewed in the vertical direction. The second region has a second portion that contacts the second electrode when viewed in the vertical direction. The vertical position of the first portion is above the vertical position of the second portion.

5. The circuit module according to claim 2, wherein: The second region is arranged at a distance from the second electrode in the left-right direction. A distance between the first region and the second electrode in the left-right direction is longer than a distance between the second region and the second electrode in the left-right direction.

6. The circuit module according to claim 1 or 2, wherein: The substrate module includes an insulating sealing material, The insulating sealing material is present at an upper end portion of the second electrode.

7. The circuit module according to claim 1 or 2, wherein: The upper end portion of the second electrode has a tapered shape.

8. The circuit module according to claim 1 or 2, wherein: The electronic component includes an electronic component body, The electronic component body has a portion overlapping with the second electrode when viewed in the vertical direction.

9. The circuit module according to claim 1 or 2, wherein: The substrate module further comprises a substrate, The bottom surface of the second electrode is in contact with the upper surface of the substrate.

10. The circuit module according to claim 1 or 2, wherein: The substrate module also includes resin and IC, The resin covers the lower portion of the second electrode and the IC, The resin has the upper main surface.

11. A circuit module comprising: A substrate module having an upper main surface, wherein the upper main surface has a normal line extending in the up-down direction; electronic components, arranged on the substrate module; as well as A bonding adhesive is used to fix the electronic component to the upper main surface. The electronic component includes a first electrode, The substrate module includes a second electrode disposed on the right side of the bonding adhesive. The first electrode is electrically connected to the second electrode via solder, The upper main surface is provided with a first concave portion having a shape concave downward and having a bottom, and a second concave portion having a shape concave downward and having a bottom, The upper end of the second electrode is arranged above the bottom of the first recess. The first recess has a first region. When viewed in the vertical direction, the first region is located between the second electrode and the bonding adhesive. The material of the portion forming the first recess is the same as the material of the portion forming the upper main surface. The second recess has a second region, The second region is located on the right side of the second electrode and reaches the right side of the upper main surface when viewed in the up-down direction.

12. The circuit module according to claim 11, wherein: The material of the portion forming the second recess is the same as the material of the portion forming the upper main surface.

13. The circuit module according to claim 11 or 12, wherein: The first region is arranged at a distance from the second electrode in the left-right direction.

14. The circuit module according to claim 11 or 12, wherein: The second region is arranged at a distance from the second electrode in the left-right direction.

15. The circuit module according to claim 11 or 12, wherein: The first region has a first portion that contacts the second electrode when viewed in the vertical direction. The second region has a second portion that contacts the second electrode when viewed in the vertical direction. The vertical position of the first portion is above the vertical position of the second portion.

16. The circuit module according to claim 13, wherein: The second region is arranged at a distance from the second electrode in the left-right direction. A distance between the first region and the second electrode in the left-right direction is longer than a distance between the second region and the second electrode in the left-right direction.

17. The circuit module according to claim 11 or 12, wherein: The substrate module includes an insulating sealing material, The insulating sealing material is present at an upper end portion of the second electrode.

18. The circuit module according to claim 11 or 12, wherein: The upper end portion of the second electrode has a tapered shape.

19. The circuit module according to claim 11 or 12, wherein: The electronic component includes an electronic component body, The electronic component body has a portion overlapping with the second electrode when viewed in the vertical direction.

20. The circuit module according to claim 11 or 12, wherein: The substrate module further comprises a substrate, The bottom surface of the second electrode is in contact with the upper surface of the substrate.

21. The circuit module according to claim 11 or 12, wherein: The substrate module also includes resin and IC, The resin covers the lower portion of the second electrode and the IC, The resin has the upper main surface.

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