Liquid-cooled heat exchange module

Abstract

The application provides a liquid cooling heat exchange module, which comprises an interlayer isolation plate assembly, a sinusoidal heat exchange assembly, a channel connecting pipe, a first liquid inlet and a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the sinusoidal heat exchange assembly is arranged in the interlayer isolation plate assembly to form a sinusoidal flow channel. A first temperature working medium enters from the first liquid inlet and flows out from the first liquid outlet to form a first channel, and the first channel comprises the sinusoidal flow channel through which the first temperature working medium flows. A second temperature working medium enters from the second liquid inlet and flows out from the second liquid outlet to form a second channel, and the second channel comprises the sinusoidal flow channel through which the second temperature working medium flows. The sinusoidal flow channel in the first channel is adjacent to the sinusoidal flow channel in the second channel in the up-down direction and in the left-right direction, so that the heat exchange of the first temperature working medium and the second temperature working medium is realized. The application greatly improves the heat exchange rate, reduces the uniformity requirement of process materials and working medium, and simultaneously realizes the flow self-regulation in different subsystem circulating cooling circuits.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation systems, in particular to a liquid cooling heat exchange module. BACKGROUND

[0002] The heat sink is an important component of electronic equipment, and the heat exchange device of the circulating cooling loop generally adopts liquid-liquid exchange or gas-liquid exchange principle in the electronic load equipment carried on the aerospace vehicle. In a large-scale integrated electronic system, multiple subsystems are usually connected in the same circulating cooling loop, and the flow channel process and material in multiple subsystems must meet the same standard, the heat dissipation working medium must be the same model and the same batch, and the flow regulation must be controlled by the circulating cooling loop controller, which will bring the following problems:

[0003] First, the flow regulation of the parallel liquid cooling loop is related to each other, and changing the liquid cooling flow of any subsystem will cause the liquid cooling loop flow of other subsystems connected in parallel to change. The more the number of parallel subsystems, the more difficult it is to control the flow of each branch of the system, and even the circulating cooling loop controller cannot control a set of flow parameters that meet the needs of all subsystems. The more obvious the difference between the subsystems, the more prominent the contradiction.

[0004] Second, the flow channel process and material must meet the same standard, which means that all the heat dissipation components of the subsystems must be completed by the same production unit. The production capacity of the heat dissipation component production unit is limited, and it may not be able to simultaneously meet the demand of the heat dissipation components of multiple subsystem units, resulting in that individual subsystems cannot be debugged and tested in time due to lack of heat dissipation components, and the development cycle is prolonged.

[0005] Third, the working medium must be strictly unified, which leads to multiple subsystems ordering from the same production unit at the same time, and the production capacity of the working medium production unit is limited, which may not be able to simultaneously meet the demand of the working medium of multiple subsystem units, resulting in that individual subsystems cannot carry out joint test in time due to lack of heat dissipation working medium, and the development cycle is prolonged.

[0006] Fourth, for some special electronic equipment, the design and production process of the heat dissipation cold plate may be inconsistent with other process flow of the equipment. In order to meet the process consistency of the subsystem heat dissipation component and the circulating cooling loop heat dissipation component, the original process flow of the subsystem may need to be changed, which may lead to the reduction of other excellent performance of the subsystem equipment itself. SUMMARY

[0007] The present application aims at solving the problems of flow regulation difficulty and strict uniformity of process materials and working medium in multiple parallel circulation cooling circuits in a comprehensive electronic system. The present application provides a liquid cooling heat exchange module, which adopts interlayer isolation plates, sinusoidal heat exchange plates, flow channel isolation plates and channel connecting pipes to form a double-layer flow channel, and makes the working medium of different temperatures flow reversely, so as to reduce the uniformity requirement of process materials and working medium, greatly improve the heat exchange rate, and realize flow self-regulation in different subsystem circulation cooling circuits.

[0008] The present application provides a liquid cooling heat exchange module, which comprises an interlayer isolation plate assembly, a sinusoidal heat exchange assembly, a channel connecting pipe, a first liquid inlet and a first liquid outlet, a second liquid inlet and a second liquid outlet, wherein the sinusoidal heat exchange assembly is arranged in the interlayer isolation plate assembly to form a sinusoidal flow channel, and comprises a first layer sinusoidal flow channel and a second layer sinusoidal flow channel; the channel connecting pipe connects the first layer sinusoidal flow channel and the second layer sinusoidal flow channel, so that the first temperature working medium or the second temperature working medium flows in the first layer sinusoidal flow channel and the second layer sinusoidal flow channel; the first temperature working medium enters from the first liquid inlet and flows out from the first liquid outlet to form a first channel, and the first channel comprises the sinusoidal flow channel through which the first temperature working medium flows; the second temperature working medium enters from the second liquid inlet and flows out from the second liquid outlet to form a second channel, and the second channel comprises the sinusoidal flow channel through which the second temperature working medium flows. The sinusoidal flow channels in the first channel and the sinusoidal flow channels in the second channel are adjacent to each other in the up-down direction and in the left-right direction, so as to realize heat exchange of the first temperature working medium and the second temperature working medium.

[0009] According to some embodiments of the present application, the interlayer isolation plate assembly comprises a first interlayer isolation plate, a second interlayer isolation plate and a third interlayer isolation plate arranged in parallel, and the first interlayer isolation plate and the second interlayer isolation plate define a first space, and the second interlayer isolation plate and the third interlayer isolation plate define a second space.

[0010] According to some embodiments of the present application, the sinusoidal heat exchange assembly comprises a first layer sinusoidal heat exchange assembly and a second layer sinusoidal heat exchange assembly, wherein the first layer sinusoidal heat exchange assembly comprises a plurality of first sinusoidal heat exchange plates connected to the first interlayer isolation plate and the second interlayer isolation plate, so as to form a plurality of first layer sinusoidal flow channels in the shape of a sine wave in the first space; and the second layer sinusoidal heat exchange assembly comprises a plurality of second sinusoidal heat exchange plates connected to the second interlayer isolation plate and the third interlayer isolation plate, so as to form a plurality of second layer sinusoidal flow channels in the shape of a sine wave in the second space.

[0011] According to some embodiments of the present application, the sinusoidal flow channels are provided with a plurality of flow channel isolation plates, including a plurality of first layer flow channel isolation plates in the first layer sinusoidal flow channels, and a plurality of second layer flow channel isolation plates in the second layer sinusoidal flow channels. The plurality of first layer flow channel isolation plates are arranged between two adjacent first layer sinusoidal heat exchange plates to separate the first layer sinusoidal flow channels into first layer separated flow channels. The plurality of second layer flow channel isolation plates are arranged between two adjacent second layer sinusoidal heat exchange plates to separate the second layer sinusoidal flow channels into second layer separated flow channels.

[0012] According to some embodiments of the present application, the channel connecting pipes include first side channel connecting pipes and second side channel connecting pipes. The first side channel connecting pipes are arranged in the first cross section of the liquid cooling heat exchange module and sequentially connect the first layer sinusoidal flow channels at odd positions and the second layer sinusoidal flow channels at adjacent even positions greater than the odd positions. The second side channel connecting pipes are arranged in the second cross section of the liquid cooling heat exchange module and sequentially connect the second layer sinusoidal flow channels at odd positions and the first layer sinusoidal flow channels at adjacent even positions greater than the odd positions.

[0013] According to some embodiments of the present application, the first liquid inlet and the first liquid outlet are respectively arranged in the second layer sinusoidal flow channels at the smallest odd position and the first layer sinusoidal flow channels at the largest position in the first cross section of the liquid cooling heat exchange module. The second liquid inlet and the second liquid outlet are respectively arranged in the first layer sinusoidal flow channels at the smallest odd position and the second layer sinusoidal flow channels at the largest position in the second cross section of the liquid cooling heat exchange module.

[0014] According to some embodiments of the present application, the first liquid inlet is arranged in the second layer sinusoidal flow channels at the smallest odd position outside the first cross section of the liquid cooling heat exchange module, the second liquid inlet is arranged in the second layer sinusoidal flow channels at the largest position outside the second cross section of the liquid cooling heat exchange module, or the first liquid inlet is arranged in the first layer sinusoidal flow channels at the largest position outside the first cross section of the liquid cooling heat exchange module, and the second liquid inlet is arranged in the first layer sinusoidal flow channels at the smallest odd position outside the second cross section of the liquid cooling heat exchange module. The first temperature working medium entering the first channel from the first liquid inlet and the second temperature working medium entering the second channel from the second liquid inlet flow in opposite directions in the adjacent first layer sinusoidal flow channels or the adjacent second layer sinusoidal flow channels.

[0015] According to some embodiments of the present application, the materials used in the interlayer isolation plate assembly, the sinusoidal heat exchange plate assembly, the flow channel isolation plate and the channel connecting pipe do not chemically react with the working medium.

[0016] According to some embodiments of the present application, the thickness of the first interlayer isolation plate is equal to the thickness of the third interlayer isolation plate, and is greater than or equal to the thickness of the second interlayer isolation plate. The thicknesses of the plurality of sinusoidal heat exchange plates are equal, and are greater than or equal to the thickness of the flow channel isolation plate.

[0017] The liquid cooling heat exchange module provided by the application can realize efficient heat exchange between low-temperature fluid and high-temperature fluid under limited space constraints, and is suitable for aerospace vehicle load heat dissipation equipment. The liquid cooling heat exchange module adopts standardized design, the number of sinusoidal heat exchange components can be selected according to the load heat dissipation power demand, the heat exchange equipment is realized standardized and modular design and manufacturing, and is not dependent on order technical requirements; the high-temperature flow channel and the low-temperature flow channel of the heat exchange module are physically isolated, different heat dissipation working fluids can be used, and the problems of unified working fluid type and unified flow regulation constraint are effectively solved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is an overall structural diagram of the liquid cooling heat exchange module according to the embodiment of the application.

[0019] Figure 2 It is an internal structure schematic diagram of the liquid cooling heat exchange module according to the embodiment of the application.

[0020] Figure 3 It is a single-layer structure schematic diagram of the liquid cooling heat exchange module according to the embodiment of the application.

[0021] Figure 4 It is a flow schematic diagram of the first temperature working fluid and the second temperature working fluid of the liquid cooling heat exchange module according to the embodiment of the application.

[0022] Figure 5 It is a flow schematic diagram of the first temperature working fluid and the second temperature working fluid of the liquid cooling heat exchange module according to the embodiment of the application.

[0023] Figure 6 It is a spacing schematic diagram of the sinusoidal heat dissipation plate and the flow channel isolation plate of the liquid cooling heat exchange module according to the embodiment of the application.

[0024] Figure 7 It is an end surface schematic diagram of the liquid cooling heat exchange module according to the embodiment of the application.

[0025] Figure 8 It is a flow schematic diagram of the first temperature working fluid and the second temperature working fluid of the liquid cooling heat exchange module after two liquid cooling heat exchange modules are connected in series according to the embodiment of the application.

[0026] Reference signs

[0027] The liquid cooling heat exchange module 1000,

[0028] The interlayer isolation plate 100, the first interlayer isolation plate 110, the second interlayer isolation plate 120, and the third interlayer isolation plate 130,

[0029] The sinusoidal heat exchange plate 200, the first layer sinusoidal heat exchange plate 210, and the second layer sinusoidal heat exchange plate 220,

[0030] Flow channel isolation plate 300, first layer flow channel isolation plate 310, second layer flow channel isolation plate 320.

[0031] Channel connecting pipe 400, first-side channel connecting pipe 410, second-side channel connecting pipe 420.

[0032] First inlet: 500 mm; First outlet: 600 mm; Second inlet: 700 mm; Second outlet: 800 mm.

[0033] First channel T100, second channel T200

[0034] Sinusoidal flow channel S100. Detailed Implementation

[0035] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0036] like Figure 1 As shown, the present invention provides a liquid-cooled heat exchange module, comprising: an interlayer isolation plate assembly, a sinusoidal heat exchange assembly, a channel connecting pipe, a first liquid inlet and a first liquid outlet, a second liquid inlet and a second liquid outlet. The sinusoidal heat exchange assembly is disposed within the interlayer isolation plate assembly, forming a sinusoidal flow channel, including a first layer of sinusoidal flow channels and a second layer of sinusoidal flow channels. The channel connecting pipe connects the first layer of sinusoidal flow channels and the second layer of sinusoidal flow channels, allowing a first temperature working fluid or a second temperature working fluid to flow within the first layer of sinusoidal flow channels and the second layer of sinusoidal flow channels.

[0037] The first working fluid at a first temperature enters through the first inlet and flows out through the first outlet, forming a first channel, which includes a sinusoidal flow path through which the first working fluid flows. The second working fluid at a second temperature enters through the second inlet and flows out through the second outlet, forming a second channel, which also includes a sinusoidal flow path through which the second working fluid flows. The sinusoidal flow paths in the first and second channels are adjacent vertically and horizontally, enabling heat exchange between the first and second working fluids.

[0038] In practice, the first liquid inlet and the first liquid outlet of the liquid cooling heat exchange module are connected to the load liquid cooling circuit, and the second liquid inlet and the second liquid outlet of the liquid cooling heat exchange module are connected to the circulating cooling circuit; or the first liquid inlet and the first liquid outlet are connected to the circulating cooling circuit, and the second liquid inlet and the second liquid outlet are connected to the load liquid cooling circuit. The temperature of the working medium flowing in the load liquid cooling circuit is higher than the temperature of the working medium flowing in the circulating cooling circuit. When the working medium at two different temperatures flows in the first channel and the second channel of the liquid cooling heat exchange module respectively, because the first channel and the second channel are independent of each other, the types of the working medium at two different temperatures do not have to be the same, thereby avoiding the constraint of uniform working medium type on the development and production of the load. For example, the first temperature working medium and the second temperature working medium can both be a 35% volume ratio ethylene glycol water solution, or different working media can be selected according to actual needs.

[0039] Moreover, when multiple sub-systems composed of liquid cooling heat exchange modules and load liquid cooling circuits are connected in parallel in a unified circulating cooling circuit, because the high-temperature working medium and the low-temperature working medium are isolated from each other, the low-temperature working medium flow channel is connected to the circulating cooling circuit, and the low-temperature working medium flow channels of different liquid cooling heat exchange modules use a uniform type of working medium, but the high-temperature working medium flow channels of different liquid cooling heat exchange modules do not have to use a uniform type of working medium. During testing and debugging, alternative working media can be used and are not limited by the uniform type of working medium used in the circulating cooling circuit.

[0040] Generally, in parallel liquid cooling circuits, the flow regulation of the liquid cooling circuits is related to each other. Changing the liquid cooling flow of any sub-system causes the adjustment of the liquid cooling flow of other sub-systems connected in parallel to change accordingly. The more the number of sub-systems connected in parallel, the more difficult it is to regulate the flow of each branch of the system. Even the circulating cooling circuit controller cannot regulate a certain set of flow parameters to meet the needs of all sub-systems. The more obvious the difference between the sub-systems, the more prominent the contradiction. However, according to the liquid cooling heat exchange module of the present application, any number of liquid cooling heat exchange modules can be selected according to the heat dissipation power requirement of the load. The branches of the circulating cooling circuit adopt a specific flow mode or several flow modes, and the independent load liquid cooling circuit adopts a variable flow mode. When the heat dissipation power of the load increases, the flow of the load liquid cooling circuit increases accordingly. When the heat dissipation power of the load decreases, the flow of the load liquid cooling circuit decreases accordingly. The change of the heat dissipation power of the load liquid cooling circuit affects the flow of the load liquid cooling circuit but does not affect the flow of the circulating cooling branch, thereby solving the problem of difficult regulation of the flow of the circulating cooling circuit branch. The flow of the low-temperature working medium basically does not need to be regulated and remains constant, so the parallel sub-systems are not constrained by the uniform regulation of the flow.

[0041] The liquid cooling heat exchange module provided by the application can use the same liquid cooling heat exchange module for all loads, adopt unified standards and specifications for processes and materials, and can be produced in batches in advance without separate technical requirements for production sites, thereby forming a shelf product and solving the problem of long development cycle caused by order-driven production.

[0042] According to some embodiments of the application, the interlayer insulation plate assembly includes a first interlayer insulation plate, a second interlayer insulation plate, and a third interlayer insulation plate arranged in parallel, the first interlayer insulation plate and the second interlayer insulation plate define a first space, and the second interlayer insulation plate and the third interlayer insulation plate define a second space. Figure 7 As shown in the figure, the interlayer spacing of the first interlayer insulation plate and the second interlayer insulation plate is the height of the first space, that is, the height of the first layer of sinusoidal heat exchange plates or the first layer of flow channel insulation plates, which is h1; the interlayer spacing of the second interlayer insulation plate and the third interlayer insulation plate is the height of the second space, that is, the height of the second layer of sinusoidal heat exchange plates or the second layer of flow channel insulation plates, which is h2. The value of h1 can be equal to the value of h2.

[0043] According to some embodiments of the application, the sinusoidal heat exchange assembly includes a first layer of sinusoidal heat exchange components and a second layer of sinusoidal heat exchange components, wherein the first layer of sinusoidal heat exchange components includes a plurality of first sinusoidal heat exchange plates connected to the first interlayer insulation plate and the second interlayer insulation plate to form a plurality of sinusoidal first layer flow channels in the first space; and the second layer of sinusoidal heat exchange components includes a plurality of second sinusoidal heat exchange plates connected to the second interlayer insulation plate and the third interlayer insulation plate to form a plurality of sinusoidal second layer flow channels in the second space.

[0044] In the above sinusoidal heat exchange assembly, each first sinusoidal heat exchange plate can be fixedly connected between the first interlayer insulation plate and the second interlayer insulation plate by welding, and a sinusoidal first layer flow channel is formed between adjacent two first sinusoidal heat exchange plates, and the spacing between adjacent first sinusoidal heat exchange plates is set to be equal. Similarly, each second sinusoidal heat exchange plate can be fixedly connected between the second interlayer insulation plate and the third interlayer insulation plate by welding, and a sinusoidal second layer flow channel is formed between adjacent two second sinusoidal heat exchange plates, and the spacing between adjacent second sinusoidal heat exchange plates is set to be equal. The first sinusoidal heat exchange plate and the second sinusoidal heat exchange plate are symmetrical about the second interlayer insulation plate.

[0045] The sinusoidal heat exchange plate has a sinusoidal curve along the flow channel direction, and the curve shape where the sinusoidal heat exchange plate intersects with the interlayer insulation plate follows the curve formula: wherein x represents an arbitrary position along the flow channel direction (unit: mm); y represents the amplitude of the sinusoidal heat exchange plate fluctuation corresponding to the x position perpendicular to the flow channel direction (unit: mm); a represents the maximum value of the sinusoidal heat exchange plate fluctuation; and k represents the ratio of the flow channel length corresponding to one fluctuation period of the sinusoidal heat exchange plate to a / 2.

[0046] This invention uses a sinusoidal heat exchange plate with a sinusoidal curve shape to exchange heat between working fluids at different temperatures. The flow velocity of the two working fluids at different temperatures changes periodically in their respective channels. Under the condition of equal flow rate, it has a higher heat exchange rate than the working fluid with equal velocity at all points in the prior art. The efficient heat exchange is more suitable for heat dissipation of loads with limited space volume, especially for heat dissipation circuits of aerospace vehicles.

[0047] According to some embodiments of the present invention, the sinusoidal flow channel is provided with a plurality of flow channel isolation plates, including a plurality of first-layer flow channel isolation plates in a first-layer sinusoidal flow channel and a plurality of second-layer flow channel isolation plates in a second sinusoidal flow channel, wherein the plurality of first-layer flow channel isolation plates are placed between two adjacent first-layer sinusoidal heat exchange plates to separate the first-layer sinusoidal flow channel into a first-layer separated flow channel; and the plurality of second-layer flow channel isolation plates are placed between two adjacent second-layer sinusoidal heat exchange plates to separate the second-layer sinusoidal flow channel into a second-layer separated flow channel.

[0048] The aforementioned first-layer flow channel isolation plate can be welded to the first-layer inter-isolation plate and the second-layer inter-isolation plate, and is arranged between two adjacent first-layer sinusoidal heat exchange plates and parallel to the first-layer sinusoidal heat exchange plates. Similarly, the second-layer flow channel isolation plate can be welded to the second-layer inter-isolation plate and the third-layer inter-isolation plate, and is arranged between two adjacent second-layer sinusoidal heat exchange plates and parallel to the second-layer sinusoidal heat exchange plates.

[0049] like Figure 6 As shown, the maximum value of the undulation of the sinusoidal heat exchanger plate is denoted as 'a', which can be between 10mm and 20mm. The distance between the sinusoidal heat exchanger plate and the flow channel isolation plate is denoted as 'b', and the minimum distance between the sinusoidal heat exchanger plate and the flow channel isolation plate is denoted as 'b0'. Then the value of 'b' is between 'b0' and 'b0+a', where 'b0' can be between 5mm and 10mm. The height of the first or second space should be 1 to 10 times the value of 'b0'. Assuming the maximum value of the undulation of the sinusoidal heat exchanger plate is 'a' = 10mm, the thickness of the flow channel isolation plate is 'c' = 1mm, the minimum distance between the sinusoidal heat exchanger plate and the flow channel isolation plate is 'b0' = 5mm, and the height of the first or second space is 6mm, then the height of the first or second space is 1.2 times the value of 'b0'. The distance between two adjacent sinusoidal heat exchanger plates is: a + 2b0 + c = (10 + 10 + 1)mm = 21mm.

[0050] The liquid cooling heat exchange module provided by the application realizes heat exchange through adjacent sinusoidal heat exchange plates, and the low-temperature working medium and the high-temperature working medium for exchanging heat are both divided into two parts by the flow channel isolation plate in the sinusoidal flow channel, and the flow speed alternately changes according to the sinusoidal shape, and according to the Bernoulli equation principle, the flow speed of the working medium is larger at the position close to the flow channel isolation plate of the sinusoidal heat exchange plate, and the flow speed of the working medium is smaller at the position far from the flow channel isolation plate of the sinusoidal heat exchange plate, local turbulent flow is generated at the position where the flow speed changes from large to small, the effect of efficient heat exchange is achieved, compared with the heat pipe heat exchange technology with fixed flow speed, the heat exchange module provided by the application has higher heat exchange efficiency, is easier to realize small-size heat exchange equipment, and is more suitable for a heat dissipation device of an aerospace vehicle.

[0051] According to some embodiments of the application, the channel connecting pipe comprises: a first side channel connecting pipe and a second side channel connecting pipe, wherein the first side channel connecting pipe is arranged at the first cross section of the liquid cooling heat exchange module, sequentially connects the first layer sinusoidal flow channel at the odd number position and the second layer sinusoidal flow channel at the adjacent even number position larger than the odd number position, and the second side channel connecting pipe is arranged at the second cross section of the liquid cooling heat exchange module, sequentially connects the second layer sinusoidal flow channel at the odd number position and the first layer sinusoidal flow channel at the adjacent even number position larger than the odd number position. The first cross section of the liquid cooling heat exchange module and the second cross section of the liquid cooling heat exchange module refer to two rectangular cross sections perpendicular to the sinusoidal flow channel formed after the layer isolation plate assembly is combined in the liquid cooling heat exchange module.

[0052] The port part of the first layer sinusoidal flow channel and the first layer isolation plate and the second layer isolation plate form a plurality of rectangular holes in the first cross section and the second cross section of the liquid cooling heat exchange module, and the port part of the second layer sinusoidal flow channel and the second layer isolation plate and the third layer isolation plate also form a plurality of rectangular holes in the first cross section and the second cross section of the liquid cooling heat exchange module. Two rectangular holes are arranged inside each channel connecting pipe, and the size of the rectangular holes on the first cross section or the second cross section is consistent, so that the working medium in the sinusoidal flow channel can pass through the channel connecting pipe better.

[0053] The first temperature working medium or the second temperature working medium flows to the channel connecting pipe in the two separated flow channels formed by the flow channel isolation plate and the two adjacent sinusoidal heat exchange plates, and then converges at the channel connecting pipe and flows to the next sinusoidal flow channel. The working medium in the first channel or the second channel is separated and mixed multiple times when flowing, so as to better uniform heat and further improve the heat exchange efficiency.

[0054] According to some embodiments of the present application, the first liquid inlet and the first liquid outlet are respectively located at the second layer sinusoidal flow channel of the smallest odd number position and the first layer sinusoidal flow channel of the largest number position of the first cross section of the liquid cooling heat exchange module; the second liquid inlet and the second liquid outlet are respectively located at the first layer sinusoidal flow channel of the smallest odd number position and the second layer sinusoidal flow channel of the largest number position of the second cross section of the liquid cooling heat exchange module. As shown in Figure 1 or Figure 4 .

[0055] According to some embodiments of the present application, the first liquid inlet is arranged at the second layer sinusoidal flow channel of the smallest odd number position outside the first cross section of the liquid cooling heat exchange module, the second liquid inlet is arranged at the second layer sinusoidal flow channel of the largest number position outside the second cross section of the liquid cooling heat exchange module, or the first liquid inlet is arranged at the first layer sinusoidal flow channel of the largest number position outside the first cross section of the liquid cooling heat exchange module, and the second liquid inlet is arranged at the first layer sinusoidal flow channel of the smallest odd number position outside the second cross section of the liquid cooling heat exchange module. The first temperature working medium entering the first channel from the first liquid inlet and the second temperature working medium entering the second channel from the second liquid inlet flow in opposite directions in the adjacent first layer sinusoidal flow channel or the adjacent second layer sinusoidal flow channel. As shown in Figure 4 , the low temperature working medium and the high temperature working medium used for heat exchange can realize efficient heat exchange in the reverse injection mode

[0056] According to some embodiments of the present application, the materials used for the interlayer isolation plate assembly, the sinusoidal heat exchange plate assembly, the flow channel isolation plate and the channel connecting pipe do not chemically react with the working medium. For example, the materials of the interlayer isolation plate, the flow channel isolation plate and the channel connecting pipe can be selected as aluminum alloy with a thermal conductivity coefficient less than or equal to 200 W / m.K, and the sinusoidal heat exchange plate is selected as a material with a thermal conductivity coefficient greater than or equal to 200 W / m.K, such as 1060 type aluminum alloy with a thermal conductivity coefficient of 237 W / m.K.

[0057] According to some embodiments of the present application, the thickness of the first interlayer isolation plate is equal to the thickness of the third interlayer isolation plate, and is greater than or equal to the thickness of the second interlayer isolation plate; the thickness of the plurality of sinusoidal heat exchange plates is equal, and is greater than or equal to the thickness of the flow channel isolation plate. As shown in Figure 7 For example, the thickness of the first interlayer isolation plate or the third interlayer isolation plate is set as T f1 , and the value range of T f1 is 2mm-5mm; the thickness of the second interlayer isolation plate is T f2 , and the value range of T f2 is 2mm-4mm; the thickness of the sinusoidal heat exchange plate is T s , and the range of T s is 1mm-3mm; the thickness of the flow channel isolation plate is c, and the range of c is 1mm-2mm.

[0058] According to some embodiments of the present application, a plurality of liquid cooling heat exchange modules are connected in series to realize heat dissipation of the load. As shown in Figure 8As shown, 2 identical liquid cooling heat exchange modules are configured, the outlet of the first temperature working medium of the first liquid cooling heat exchange module is connected with the inlet of the first temperature working medium of the second liquid cooling heat exchange module, that is, A12-1 connects A1-2, and the outlet of the second temperature working medium of the second liquid cooling heat exchange module is connected with the inlet of the first temperature working medium of the first liquid cooling heat exchange module, that is, B12-2 connects B1-1. The complete flow path of the first temperature working medium in the first channel is A1-1→B6-1→B11-1→A8-1→A3-1→B4-1→B9-1→A10-1→A5-1→B2-1→B7-1→A12-1→A1-2→B6-2→B11-2→A8-2→A3-2→B4-2→B9-2→A10-2→A5-2→B2-2→B7-2→A12-2, and the complete flow path of the second temperature working medium in the second channel is B1-2→A6-2→A11-2→B8-2→B3-2→A4-2→A9-2→B10-2→B5-2→A2-2→A7-2→B12-2→B1-1→A6-1→A11-1→B8-1→B3-1→A4-1→A9-1→B10-1→B5-1→A2-1→A7-1→B12-1.

[0059] The liquid cooling heat exchange module provided by the application can be connected in series in any number, facilitating standardized and serialized production, being easier to form a universal product, facilitating integrated design, and being not constrained by order technical requirements.

[0060] Based on the above-mentioned embodiments, a specific embodiment is introduced. As shown in Figure 1 As shown, in the liquid cooling heat exchange module, there are 7 first-layer sinusoidal heat exchange plates and 6 first-layer flow channel isolation plates in the first space, forming 6 first-layer sinusoidal flow channels and 12 first-layer separated flow channels; there are 7 second-layer sinusoidal heat exchange plates and 6 first-layer flow channel isolation plates symmetrically distributed in the second space, forming 6 second-layer sinusoidal flow channels and 12 second-layer separated flow channels. Correspondingly, the first side channel connecting pipe and the second side channel connecting pipe are both 5.

[0061] The port part of the above-mentioned first-layer sinusoidal flow channel and the first-layer and second-layer interval isolation plates form 6 rectangular holes in the first cross section and the second cross section of the liquid cooling heat exchange module respectively, and the port part of the above-mentioned second-layer sinusoidal flow channel and the second-layer and third-layer interval isolation plates also form 6 rectangular holes in the first cross section and the second cross section of the liquid cooling heat exchange module respectively. As shown in Figure 4 As shown, the 12 rectangular holes at the first cross section are sequentially numbered as A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, and the 12 rectangular holes at the second cross section are sequentially numbered as B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11, B12.

[0062] The first temperature working medium is set as high temperature working medium, enters from the first liquid inlet, and flows out from the first liquid outlet. The flow direction of the high temperature working medium in the first channel is A1→B6→B11→A8→A3→B4→B9→A10→A5→B2→B7→A12. The first liquid inlet and the first liquid outlet are connected with the load liquid cooling circuit. The water outlet of the load liquid cooling circuit corresponds to the first liquid inlet, and the water inlet of the load liquid cooling circuit corresponds to the first liquid outlet.

[0063] The second temperature working medium is set as low temperature working medium, enters from the second liquid inlet, and flows out from the second liquid outlet. The flow direction of the low temperature working medium in the second channel is B1→A6→A11→B8→B3→A4→A9→B10→B5→A2→A7→B12. The second liquid inlet and the second liquid outlet are connected with the circulating cooling circuit. The water outlet of the circulating cooling circuit corresponds to the second liquid inlet, and the water inlet of the circulating cooling circuit corresponds to the second liquid outlet.

[0064] It can be seen that, in the liquid cooling heat exchange module provided by the application, the sinusoidal flow channels in the first channel and the sinusoidal flow channels in the second channel are adjacent to each other in the left and right directions and in the up and down directions, and the high temperature working medium flowing in the first channel and the low temperature working medium flowing in the second channel belong to reverse flow in the flow process, so that efficient heat exchange is obtained.

[0065] Further, since a flow channel isolation plate is arranged between any adjacent sinusoidal heat exchange plates, each sinusoidal flow channel is divided into two independent flow channels. Taking two adjacent sinusoidal flow channels A3→B4 and B5→A2 as examples, the sinusoidal flow channel in which A3→B4 is located is divided into two separated flow channels A3→B4left and A3→B4right by the flow channel isolation plate, and the high temperature working medium flows in the two flow channels; the sinusoidal flow channel in which B5→A2 is located is divided into two separated flow channels B5→A2left and B5→A2right by the flow channel isolation plate, and the low temperature working medium flows in the two flow channels. As shown in FIG. 4, the high temperature working medium in F3→B4left and the low temperature working medium in B5→F2left exchange heat through the sinusoidal heat exchange plate. The high temperature working medium or the low temperature working medium is in a straight line flow channel near the flow channel isolation plate and in a curved flow near the sinusoidal heat exchange plate. Figure 5

[0066] ​The initial velocity of the high-temperature working medium in the flow channel A3→B4 is va0, and the initial velocity of the low-temperature working medium in the flow channel B5→A2 is vb0. In the flow channel A3→B4left, the flow velocity of the high-temperature working medium close to the flow channel isolation plate is close to va0. According to Bernoulli's principle, the flow velocity of the high-temperature working medium close to the sinusoidal heat exchange plate periodically varies between va0 and va1, and va0>va1. Similarly, in the flow channel B5→A2left, the working medium close to the flow channel isolation plate is close to vb0. According to Bernoulli's principle, the flow velocity of the working medium close to the sinusoidal heat exchange plate periodically varies between vb0 and vb1, and vb0>vb1. In the process of changing the flow velocity of the high-temperature working medium from va0 to va1 and the flow velocity of the low-temperature working medium from vb0 to vb1, local turbulent flow is formed near the surface of the sinusoidal heat exchange plate, which stirs and mixes the internal high-temperature working medium or the internal low-temperature working medium, increases the internal heat conduction coefficient, and accelerates heat transfer. At the outlet of the flow channel A3→B4left, the flow velocity of the working medium returns to va0, and at the outlet of the flow channel B5→A2left, the flow velocity of the working medium returns to vb0. Therefore, under the condition of constant flow velocity, the heat exchange efficiency of the liquid cooling heat exchange module provided by the application is higher.

[0067] Through the description of the specific embodiments, the technical means and effects taken by the application to achieve the predetermined purposes can be more deeply and specifically understood. However, the accompanying drawings are only provided for reference and illustration, and are not used to limit the application.

Claims

1. A liquid-cooled heat exchange module, characterized in that, The liquid-cooled heat exchange module includes: Interlayer partition assembly; A sinusoidal heat exchange component is disposed within the interlayer isolation plate component to form a sinusoidal flow channel, including a first sinusoidal flow channel and a second sinusoidal flow channel; The channel connecting pipe connects the first layer sinusoidal flow channel and the second layer sinusoidal flow channel, so that the first temperature working fluid or the second temperature working fluid flows in the first layer sinusoidal flow channel and the second layer sinusoidal flow channel; A first inlet and a first outlet, a first temperature working fluid enters from the first inlet and flows out from the first outlet to form a first channel, the first channel including the sinusoidal flow channel through which the first temperature working fluid flows; The second inlet and the second outlet are provided. The second working fluid enters through the second inlet and flows out through the second outlet to form a second channel. The second channel includes the sinusoidal flow path through which the second working fluid flows. The sinusoidal flow channel in the first channel is adjacent to the sinusoidal flow channel in the second channel, both vertically and horizontally, to achieve heat exchange between the first temperature working fluid and the second temperature working fluid. The sinusoidal flow channel is provided with multiple flow channel isolation plates, including: a first-layer sinusoidal flow channel with multiple first-layer flow channel isolation plates, and a second-layer sinusoidal flow channel with multiple second-layer flow channel isolation plates. Multiple first-layer flow channel isolation plates are placed between two adjacent first-layer sinusoidal heat exchange plates to separate the first-layer sinusoidal flow channel into a first-layer separated flow channel; Multiple second-layer flow channel isolation plates are placed between two adjacent second-layer sinusoidal heat exchange plates to separate the second-layer sinusoidal flow channel into a second-layer separated flow channel; The channel connecting pipe includes: The first side channel connecting pipe is disposed in the first cross section of the liquid-cooled heat exchange module and sequentially connects the first layer sinusoidal flow channel located at the odd-numbered position and the second layer sinusoidal flow channel located at the adjacent even-numbered position greater than the odd-numbered position. The second side channel connecting pipe is disposed in the second cross section of the liquid-cooled heat exchange module, and sequentially connects the second layer sinusoidal flow channel located at the odd-numbered position and the first layer sinusoidal flow channel located at the adjacent even-numbered position greater than the odd-numbered position.

2. The liquid-cooled heat exchange module according to claim 1, characterized in that, The interlayer partition assembly includes a first interlayer partition, a second interlayer partition, and a third interlayer partition placed in parallel. The first interlayer partition and the second interlayer partition define a first space, and the second interlayer partition and the third interlayer partition define a second space.

3. The liquid-cooled heat exchange module according to claim 2, characterized in that, The sinusoidal heat exchanger assembly includes: The first layer sinusoidal heat exchange assembly includes a plurality of first sinusoidal heat exchange plates connecting the first interlayer isolation plate and the second interlayer isolation plate, so as to form a plurality of sinusoidal first layer sinusoidal flow channels in the first space; The second-layer sinusoidal heat exchange assembly includes multiple second sinusoidal heat exchange plates connecting the second interlayer isolation plate and the third interlayer isolation plate to form multiple sinusoidal second-layer sinusoidal flow channels in the second space.

4. A liquid-cooled heat exchange module according to claim 3, characterized in that, The first liquid inlet and the first liquid outlet are respectively located in the second layer sinusoidal flow channel with the smallest odd number of positions in the first cross-section of the liquid-cooled heat exchange module and the first layer sinusoidal flow channel with the largest number of positions. The second liquid inlet and the second liquid outlet are respectively located in the first sinusoidal flow channel with the smallest odd number of the second cross-section of the liquid-cooled heat exchange module and the second sinusoidal flow channel with the largest number of the second cross-section.

5. A liquid-cooled heat exchange module according to any one of claims 4, characterized in that, The first liquid inlet is located at the smallest odd-numbered position of the second layer sinusoidal flow channel outside the first cross-section of the liquid-cooled heat exchange module, and the second liquid inlet is located at the largest odd-numbered position of the second layer sinusoidal flow channel outside the second cross-section of the liquid-cooled heat exchange module. Alternatively, the first liquid inlet may be located in the first sinusoidal flow channel at the largest position outside the first cross-section of the liquid-cooled heat exchange module, and the second liquid inlet may be located in the first sinusoidal flow channel at the smallest odd position outside the second cross-section of the liquid-cooled heat exchange module. The first temperature working medium entering the first channel from the first inlet and the second temperature working medium entering the second channel from the second inlet flow in opposite directions in the adjacent first layer sinusoidal flow channel or the adjacent second layer sinusoidal flow channel.

6. The liquid-cooled heat exchange module according to any one of claims 1-5, characterized in that, The materials used in the interlayer isolation plate assembly, the sinusoidal heat exchange plate assembly, the flow channel isolation plate, and the channel connecting pipe do not chemically react with either the first or second temperature working fluid.

7. The liquid-cooled heat exchange module according to claim 1, characterized in that, The thickness of the first interlayer isolation plate is equal to the thickness of the third interlayer isolation plate, and is greater than or equal to the thickness of the second interlayer isolation plate; the thickness of the plurality of sinusoidal heat exchange plates is equal to the thickness of the flow channel isolation plate; the maximum value of the undulation of the sinusoidal heat exchange plate is between 10mm and 20mm.

8. The liquid-cooled heat exchange module according to any one of claims 1-7, characterized in that, Multiple liquid-cooled heat exchange modules are connected in series to dissipate heat from the load.

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