Substrate processing equipment and substrate processing system

Abstract

A substrate processing device is disclosed. The substrate processing device includes: an indexing component having a loading port; and a process execution component that receives a substrate from the indexing component and processes the substrate, wherein the loading port includes: a housing having an internal space; a base component that is disposed on an upper side of the housing and on which a container for receiving a substrate-type sensor is placed; and a charging unit that charges a power supply device installed in the container in a wireless charging manner.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing system. Background Art

[0002] Plasma refers to an ionized gas state including ions, free radicals and electrons. Plasma is generated by very high temperature, strong electric field or radio frequency (RF) electromagnetic field. Semiconductor device manufacturing process may include an etching process for removing a thin film formed on a substrate such as a wafer by using plasma. When ions and / or free radicals of the plasma collide with or react with the thin film on the substrate, the etching process is performed.

[0003] An apparatus for treating a substrate by using plasma includes a process chamber, a support chuck (e.g., ESC) that supports the substrate in the process chamber and is connected to an RF power source, and a focus ring around the outer periphery of the substrate placed on the support chuck. The focus ring is installed so that the plasma is distributed with high uniformity, and the plasma is used to etch the substrate together with the substrate. When the substrate is repeatedly etched, the focus ring is also etched, so that the shape of the focus ring gradually changes. The direction in which ions and / or radicals are input into the substrate changes according to the change in the shape of the focus ring, and thus the etching characteristics of the substrate change. Therefore, when etching a specific number or more of substrates or changing the shape of the focus ring to deviate from the allowable range, the focus ring needs to be replaced.

[0004] Typically, an operator replaces a focus ring by opening a process chamber, taking out a used focus ring from the opened process chamber, and installing an unused focus ring in the process chamber. However, in the replacement scheme, a large amount of work time is consumed, and there is a high possibility of introducing particles into the process chamber. Therefore, in recent years, a replacement scheme has been used in which a transfer robot of a substrate processing apparatus takes out a used focus ring from a process chamber and loads a ring box therein, and then the transfer robot takes out a new focus ring from the ring box and loads the focus ring into the process chamber.

[0005] At the same time, the focus ring is transferred by a transfer robot that transfers the substrate. The transfer robot transfers the focus ring to a specific position in the process chamber. In addition, in order to identify whether the focus ring is transferred to a specific position, the focus ring is photographed by a vision chip having a shape similar to that of the substrate. The vision chip is driven while consuming electrical energy. A power supply device such as a battery is installed in the vision chip, and it is necessary to charge the power supply device in the vision chip. In addition, the power supply device in the vision chip may be located in a container that accommodates the vision chip, such as a FOUP. The battery may be arranged in the container so that the vision chip is charged. That is, the battery provided in the FOUP needs to be charged to charge the vision chip.

[0006] The battery provided in the FOUP is connected to the charging unit provided in the loading port for charging. Usually, the power source is directly connected through a connector. In the power connection scheme, it is necessary to implement a safety device and a protection circuit to prevent a connector short circuit that may be generated when the FOUP is not located in the loading port or the FOUP is separated from the loading port. In addition, the connector must be exposed to the outside to be directly connected to the battery provided in the FOUP. However, various components for adjusting the situation in the FOUP and opening and closing the door of the FOUP are installed in the loading port, in which the FOUP is located. That is, the position of the connector that must be exposed to the outside is relatively limited by the components installed in the loading port. In addition, the position of the battery provided in the FOUP may be changed depending on the occasion. The connector is installed to be exposed to the outside, so it is difficult to change the position of the connector so that the connector corresponds to the battery. Summary of the invention

[0007] Embodiments of the present disclosure provide a substrate processing apparatus and a substrate processing system, the substrate processing apparatus can effectively charge a power supply device installed in a container.

[0008] Embodiments of the present disclosure also provide a substrate processing apparatus and a substrate processing system which can minimize the occurrence of a short circuit when a power supply device installed in a container is charged.

[0009] Embodiments of the present disclosure also provide a substrate processing apparatus and a substrate processing system, which can improve the degree of freedom of the installation position of the signal transmission member of the charging unit.

[0010] Aspects of the present disclosure are not limited thereto, and other unmentioned aspects of the present disclosure can be clearly understood by those skilled in the art from the following description.

[0011] The present disclosure provides a substrate processing device. The substrate processing device includes: an indexing component having a loading port; and a process execution component that receives a substrate from the indexing component and processes the substrate, the loading port including: a housing having an internal space; a base component that is disposed on the upper side of the housing and on which a container for accommodating a substrate-type sensor is placed; and a charging unit that charges a power supply device installed in the container in a wireless charging manner.

[0012] According to an embodiment, the charging unit may include: a signal transmission component, which is arranged in a base part and transmits power to a power supply device; a conversion component, which is arranged in an internal space and is arranged between an external power line and the signal transmission component; and a switch component, which selectively transmits power from the external power line to the signal transmission component.

[0013] According to an embodiment, the conversion member may convert AC power transmitted by the external power line into DC power.

[0014] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member detects that the container is placed on the base component, the switch member may be turned on so that power of the external power line is delivered to the signal transmission member.

[0015] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member does not detect that the container is placed on the base component, the switch member may be disconnected so that the power of the external power line supplied to the signal transmission member is interrupted.

[0016] According to an embodiment, the base component may include one or more locating pins for aligning the position of the container on the base component, and the signal transmission member may be installed at a position where the signal transmission member does not overlap the locating pins when viewed from the top.

[0017] The present disclosure provides a substrate processing system. The substrate processing system includes: an indexing part having a loading port; a process execution part receiving a substrate from the indexing part and processing the substrate; and a container located in the loading port and accommodating a substrate-type sensor transported to the process execution part, the container also includes: a main body having a receiving space, one side of which is open; a door that selectively opens and closes the receiving space; a shelf part supporting the substrate-type sensor in the receiving space; and a power supply device that delivers power for charging the substrate-type sensor, and the loading port includes: a housing having an internal space; a base part disposed on the upper side of the housing, and a container accommodating the substrate-type sensor is positioned on the base part; and a charging unit that charges the power supply device installed in the container in a wireless charging manner.

[0018] According to an embodiment, the charging unit may include: a signal transmission component, which is arranged in a base part and transmits power to a power supply device; a conversion component, which is arranged in an internal space and is arranged between an external power line and the signal transmission component; and a switch component, which selectively transmits power from the external power line to the signal transmission component.

[0019] According to an embodiment, the conversion member may convert AC power transmitted by the external power line into DC power.

[0020] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member detects that the container is placed on the base component, the switch member may be turned on so that power of the external power line is delivered to the signal transmission member.

[0021] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member does not detect that the container is placed on the base component, the switch member may be disconnected so that the power of the external power line supplied to the signal transmission member is interrupted.

[0022] According to an embodiment, the container may further include a charging module which charges the substrate type sensor supported by the shelf part, and the charging module may charge the substrate type sensor supported by the shelf part by a wireless charging method.

[0023] According to an embodiment, the charging module may charge the substrate type sensor supported by the shelf part through an electromagnetic induction method.

[0024] According to an embodiment, a plurality of shelf parts and a plurality of charging modules may be provided.

[0025] According to an embodiment, the substrate processing system may further include a preserving unit, which preserves a container, and the preserving unit may include: a base frame, on which the container is positioned; a signal transmission device, which is installed in the base frame and transmits power to the power supply device; a conversion device, which is arranged between the external power line and the signal transmission device; and a switching device, which selectively transmits power from the external power line to the signal transmission device.

[0026] In addition, a substrate processing system includes: an indexing chamber, the interior of which is maintained at atmospheric pressure and is provided with a first transfer robot; an indexing part having a loading port connected to the indexing chamber; a loading lock chamber, which is connected to the indexing chamber and the interior of the loading lock chamber is converted between vacuum pressure and atmospheric pressure; a transfer chamber, which is connected to the loading lock chamber and is provided with a second transfer robot; a process chamber, which is connected to the transfer chamber and processes the substrate; and a container, which is located in the loading port and accommodates a substrate-type sensor, which collects the transfer position of a consumable component transferred to the process chamber, and the loading port includes: a shell having an internal space; a base part, which is arranged on the upper side of the shell and the container is placed on the base part; and a charging unit, which charges a power supply device installed in the container in a wireless charging manner.

[0027] According to an embodiment, the charging unit may further include: a signal transmission component, which is arranged in the base part and transmits power to the power supply device; a conversion component, which is arranged in the internal space and is arranged between the external power line and the signal transmission component; and a switch component, which selectively transmits power from the external power line to the signal transmission component.

[0028] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member detects that the container is placed on the base component, the switch member may be turned on so that power of the external power line is delivered to the signal transmission member.

[0029] According to an embodiment, the charging unit may further include a detection member that detects whether the container is placed on the base component, and when the detection member does not detect that the container is placed on the base component, the switch member may be disconnected so that the power of the external power line supplied to the signal transmission member is interrupted.

[0030] According to an embodiment, the consumable component can be an annular member set in a process chamber, and the system can also include a controller, wherein the controller can control the first transfer robot and the second transfer robot so that the consumable component is transferred to the process chamber, and can control the first transfer robot and the second transfer robot so that the substrate-type sensor is transferred to the process chamber, the substrate-type sensor can obtain an image including the consumable component and a chuck set in the process chamber to support the substrate, and transmit the image to the controller, and the controller can measure the interval between the consumable component and the chuck in the image, and determine whether the consumable component is aligned by the measured interval. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0032] Figure 1 is a plan view schematically showing a substrate processing system according to an embodiment of the present disclosure;

[0033] Figure 2 It is shown Figure 1 A perspective view of the appearance of the first container;

[0034] Figure 3 It is shown Figure 2 An appearance diagram of a substrate contained in a first container;

[0035] Figure 4 It is shown Figure 1 A plan cross-sectional view of the appearance of the second container;

[0036] Figure 5 It is shown Figure 4 The appearance of the support slot;

[0037] Figure 6 It is shown Figure 4 An appearance diagram of an annular member contained in a second container;

[0038] Figure 7is a perspective view showing an example of an annular carriage for conveying annular members;

[0039] Figure 8 yes Figure 7 A plan view of the annular bracket;

[0040] Fig. 9 It is shown Figure 8 an enlarged view of a portion of the annular bracket;

[0041] Fig.10 It is schematically shown Figure 1 The appearance of the first teleporter;

[0042] Fig.11 is a view showing the appearance, in which the substrate is located Fig.10 The first transmission hand;

[0043] Fig.12 is a view showing the appearance, in which the annular member and the annular bracket are located Fig.10 The first transmission hand;

[0044] Fig.13 It is shown Figure 1 Appearance diagram of the alignment unit provided in the middle alignment room;

[0045] Fig.14 and Fig.15 is a view showing the appearance, wherein Fig.13 The alignment unit aligns the annular bracket;

[0046] Fig.16 It is shown Figure 1 A plan cross-sectional view of the exterior of a load lock chamber;

[0047] Fig.17 is a view showing the appearance, in which the substrate is located Fig.16 On the supporting shelf;

[0048] Fig.18 is a view showing the appearance, in which the annular member is located Fig.16 On the supporting shelf;

[0049] Fig.19 is a view showing the appearance, wherein Fig.18 The ring carrier is removed from the load lock chamber;

[0050] Fig. 20 It is shown Figure 1 The appearance of the second teleporter;

[0051] Fig.21 is a view showing the appearance, in which the substrate is located Fig. 20 The second teleporter on hand;

[0052] Fig. 22 is a view showing the appearance, in which the annular member is located Fig. 20 The second teleporter on hand;

[0053] Fig.23 It shows that the setting Figure 1 View of substrate handling equipment in a process chamber.

[0054] Fig.24 is a flow chart showing a sequence for aligning the position of an annular member according to an embodiment of the present disclosure;

[0055] Fig.25 and Fig.26 is a view showing an appearance in which the center position of the ring member is detected by an image acquired by a substrate type sensor;

[0056] Fig. 27 It is shown Figure 1 a cross-sectional view of a third container;

[0057] Fig.28 When viewed from the top Fig. 27 A view of the charging module;

[0058] Fig.29 It shows that the setting Figure 1 a view of the housing, base assembly, and charging unit in a load port of FIG.

[0059] Fig.30 When viewed from the top Fig.29 A view of the loading port;

[0060] Fig.31 is a diagram showing a holding unit that may be included in the substrate processing system of the present disclosure; and

[0061] Fig.32 is an external view showing that a third container is transferred by a transfer device, which may be included in the substrate processing system of the present disclosure. DETAILED DESCRIPTION

[0062] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure belongs can easily implement the present disclosure. However, the present disclosure can be implemented in various different forms and is not limited to the embodiments to be described below. In addition, when describing the preferred embodiments of the present disclosure in detail, the detailed description of related known functions or configurations may be omitted when it may unnecessarily obscure the essence of the present disclosure. In addition, throughout the accompanying drawings, the same reference numerals are used for parts that perform similar functions and operations.

[0063] The expression "comprising" some elements may mean that another element may be further included without being excluded, unless there is a particularly contradictory description. In detail, the terms "comprising" and "having" are used to indicate that the features, quantities, steps, operations, elements, parts or combinations thereof described in the specification are present, and it can be understood that one or more other features, quantities, steps, operations, elements, parts or combinations thereof may be added.

[0064] Unless otherwise specified, terms in the singular may include plural forms. Furthermore, in the drawings, the shapes and sizes of elements may be exaggerated for clearer description.

[0065] Terms such as first and second can be used to describe various elements, but these elements are not limited by the terms. These terms can only be used to distinguish the purpose of one element from another element. For example, without departing from the scope of the present disclosure, a first element can be referred to as a second element, and similarly, a second element can be referred to as a first element.

[0066] When referring to an element being "connected to" or "electrically connected to" another element, it should be understood that the first element can be directly connected or electrically connected to the second element, but a third element can be provided therebetween. On the other hand, when referring to an element being "directly connected to" or "directly electrically connected to" another element, it should be understood that there is no third element therebetween. It should be understood that other expressions describing the relationship between elements, such as "between", "directly between", "adjacent", and "directly adjacent", can have the same purpose.

[0067] In addition, unless otherwise defined, all terms (including technical or scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. Terms defined in general dictionaries should be understood to have a meaning consistent with the context of the relevant technology, and should not be understood as an ideal or overly formal meaning unless explicitly defined in the specification of the present disclosure.

[0068] In the following, reference will be made to Figures 1 to 25 Embodiments of the present disclosure are described in detail.

[0069] Figure 1 Schematically illustrates a substrate processing system according to an embodiment of the present disclosure. Figure 1 , a substrate processing system according to an embodiment of the present disclosure may include a substrate processing apparatus 10 , a container 20 , and a ring-shaped bracket 30 .

[0070] The container 20 according to an embodiment of the present disclosure may be located on the load port 110 of the substrate processing device 10. The container 20 may be positioned on the load port 110 of the substrate processing device 10 by an overhead transport (OHT) device. Various items may be contained in the container 20. The container 20 may include various containers according to the types of items contained. The container 20 may be referred to as a FOUP or a POD.

[0071] For example, Figure 2 As shown, the object to be processed by the substrate processing apparatus 10 can be contained in a first container 21, which is any one of the containers 20. The object to be processed can be a substrate "W", such as Figure 3 The wafer shown. In addition, a notch "N" may be formed in the substrate "W". In order to properly process the substrate "W" with the substrate processing apparatus 10, it is necessary to accurately transfer the substrate "W" to a desired position of the substrate processing apparatus 10. The notch "N" formed in the substrate "W" is used to align the substrate "W" so as to accurately transfer it. The alignment of the substrate "W" may be performed by the alignment unit 200, which will be described later.

[0072] In addition, if Figure 4 As shown, a consumable component installed on the substrate processing device 10 and replaceable can be accommodated in the second container 22, which is another container in the container 20. The consumable component can be an annular member "R", such as a focus ring or a dielectric ring. The outer peripheral diameter of the annular member "R" can be larger than the outer peripheral diameter of the substrate "W". Therefore, the volume of the space in the second container 22 can be much larger than the volume of the space in the first container 21. In addition, when viewed from the top, a plurality of support grooves 22a and 22c for supporting the annular member "R" in the second container 22 can be set at different positions. In addition, the support grooves 22a and 22c can be set at positions corresponding to the openings 32 formed in the annular bracket 30, which will be described below. This is because when the annular member "R" is taken out of the second container 22 by using the annular bracket 30, the annular bracket 30 can be prevented from interfering with the support grooves 22a and 22c.

[0073] In addition, if Figure 5 As shown, the positioning pin 22b can be formed in one or more (e.g., multiple) of the supporting grooves 22a and 22c. The positioning pin 22b can be inserted into the support grooves 22a and 22c. Figure 6The ring member "R" is shown in the positioning recess "G" on the lower surface of the ring member "R". It is important to transfer the ring member "R" to an accurate position to correctly install the ring member "R" to a desired position of the substrate processing device 10. It is important to position the ring member "R" at the same position as the first transfer hand 152, which will be described below, to transfer the ring member "R" to an accurate position. By limiting the change in the lateral position of the ring member "R", the positioning pin 22b can allow the ring member "R" to be positioned at the same position as the first transfer hand 152.

[0074] In addition, the operator can simply insert the locating pin 22b into the alignment recess "G" formed on the lower surface of the annular member "R" to accommodate the annular member "R" at an accurate position in the second container 22. The position where the annular member "R" is accommodated in the second container 22 can be changed according to the operator's proficiency, but the locating pin 22b can minimize the problem. In addition, the directions of the annular members "R" aligned by the locating pin 22b can be aligned in the same direction. For example, the flat areas of the annular members "R" aligned by the locating pin 22b can be aligned in the same direction. For example, because the annular members "R" are aligned in the same direction by the locating pin 22b, it is not necessary to align the directions of the annular members "R" separately to position the annular member "R" on the annular bracket 30.

[0075] The annular bracket 30 according to an embodiment of the present disclosure can be used to transfer the annular member "R". For example, the annular bracket 30 can be used to transfer the annular member "R" between the indexing chamber 130, the alignment chamber 170 and the loading lock chamber 310, which will be described below. The annular bracket 30 can be accommodated in the above-mentioned container 20. For example, the annular bracket 30 can be accommodated in the above-mentioned second container 22. The annular bracket 30 can be accommodated below the annular member "R", and the annular member is accommodated in the second container 22. The annular bracket 30 accommodated in the second container 22 can be accommodated in the second container 22 while its direction is aligned. The annular bracket 30 can be used to enable the first transfer robot 150 to be described below to transfer the annular member "R".

[0076] Figure 7 is a perspective view showing an example of an endless carriage for conveying an endless member. Figure 8 yes Figure 7 A plan view of the ring bracket. Fig. 9 It is shown Figure 8 An enlarged view of a portion of the ring bracket. Figures 7 to 9 , the annular bracket 30 according to an embodiment of the present disclosure may include a body 31 and a guide member 34 .

[0077] The body 31 may have a seating surface on which a ring-shaped member "R" is positioned. The ring-shaped member "R" may be positioned on an upper surface of the body 31. The body 31 may have a plate shape. The body 31 may have a disc shape. The body 31 has a disc shape so that the operation of aligning the direction of the ring-shaped bracket 30 by the alignment unit 200 is the same as or at least similar to the operation of aligning the direction of the substrate "W".

[0078] The central area of ​​the body 31 may be provided with a baffle that does not contain a hole. In addition, one or more openings 32 may be formed in the peripheral area of ​​the body 31. A plurality of openings 32 may be formed in the peripheral area of ​​the body 31. The openings 32 may extend from the upper surface of the body 31 to the lower surface. That is, the openings 32 may pass through the body 31. The openings 32 may be formed in the peripheral area of ​​the body 31, and may be formed in the peripheral area of ​​the body 31 including the outer periphery of the body 31. That is, the openings 32 may extend to the outer periphery of the body 31. In addition, when the openings 32 are viewed from the top, they may be formed at a position overlapping with the support shelf 320 provided in the load lock chamber 310. In addition, when the openings 32 are viewed from the top, they may be formed at a position overlapping with the support grooves 22a and 22c of the second container 22. This is because when the annular member "R" is conveyed by using the annular bracket 30, the annular bracket 30 may be prevented from overlapping with the support shelf 320 or the support grooves 22a and 22c.

[0079] An alignment hole 33 may be formed on the body 31. When viewed from the top, the alignment hole 33 may be formed between the first guide member 35 and the second guide member 36. The alignment hole 33 may be a hole used when the alignment unit 200, which will be described below, aligns the annular bracket 30. The alignment hole 33 may extend from the upper surface of the body 31 to the lower surface. That is, the alignment hole 33 may pass through the body 31. In addition, the alignment hole 33 may be formed at a position overlapping with the recess "N" formed in the substrate "W". For example, the distance from the center of the body 31 to the center of the alignment hole 33 may be the same as the distance from the center of the substrate "W" to the center of the recess "N". This is to make the operation of aligning the direction of the annular bracket 30 by the alignment unit 200 the same as or at least similar to the operation of aligning the direction of the substrate "W".

[0080] When the annular member "R" is located on the annular bracket 30 and the annular bracket 30 is transferred by the first transfer hand 152, the annular member "R" may slide by the linear motion of the first transfer hand 152, or the mounting position of the annular member "R" may be deformed by the rotation of the first transfer hand 152. The guide part 34 may prevent the annular member "R" from sliding or deforming. The guide part 34 may also be referred to as a guide boss.

[0081] The guide part 34 may protrude from the upper surface of the body 31. The guide part 34 may protrude upward from the upper surface of the body 31. The inner periphery of the annular member "R" positioned on the annular bracket 30 may have a flat area FZ and a circular area RZ, and the guide part 34 may be formed at a position facing the inner periphery of the flat area FZ of the annular member "R". The guide part 34 may have a shape corresponding to the inner periphery of the annular member "R". The guide part 34 may have a shape corresponding to the inner periphery of the annular member "R" including the flat area FZ.

[0082] The guide member 34 may include a first guide member 35 (first guide boss) and a second guide member 36 (second guide boss). The first guide member 35 and the second guide member 36 may have symmetrical shapes. For example, the first guide member 35 and the second guide member 36 may have shapes symmetrical to each other with respect to the alignment hole 33 formed therebetween.

[0083] The first guide member 35 may include a first flat portion 35F and a first circular portion 35R. The second guide member 36 may include a second flat portion 36F and a second circular portion 36R. The first flat portion 35F may have a shape corresponding to the inner periphery of the flat area FZ. The first circular portion 35Z may be curved and extend from the first flat portion 35F, and may have a shape corresponding to the inner periphery of the circular area RZ of the annular member "R". The first flat portion 35F and the first circular portion 35Z have shapes symmetrical to the second flat portion 36F and the second circular portion 36Z, and repeated description thereof will be omitted.

[0084] The guide member 34 helps the flat region FZ of the annular member "R" to be aligned in a specific direction on the annular bracket 30. In addition, an alignment hole 33 is formed between the first guide member 35 and the second guide member 36. Therefore, when the annular bracket 30 is aligned by using the alignment unit 200 to be described below, the direction of the flat region FZ of the annular member "R" located on the annular bracket 30 can also be aligned in a desired direction. In addition, the outer peripheries of the first circular portion 35Z and the second circular portion 36Z and the inner periphery of the circular region RZ may have the same radius of curvature. In addition, the outer peripheries of the first circular portion 35Z and the second circular portion 36Z and the outer periphery of the substrate "W" may have the same radius of curvature.

[0085] Reference again Figure 1, the substrate processing device 10 according to an embodiment of the present disclosure may include an indexing component 100, a process execution component 300, and a controller 700. When viewed from the top, the indexing component 100 and the process execution component 300 may be arranged along a first direction "X". Hereinafter, a direction perpendicular to the first direction "X" when viewed from the top is defined as a second direction "Y". In addition, a direction perpendicular to the first direction "X" and the second direction "Y" is defined as a third direction "Z". Here, the third direction "Z" may refer to a direction perpendicular to the ground.

[0086] The index part 100 may include a load port 110 , an index chamber 130 , a first transfer robot 150 , and an alignment chamber 170 .

[0087] The container 20 may be located in the load port 110. As described above, the container 20 may be transferred to the load port 110 by the OHT device to be loaded into or unloaded from the load port 110, and may be transferred. However, the present disclosure is not limited thereto, and the container 20 may be transferred by various devices for transferring the container 20. In addition, the operator may directly load the container 20 in the load port 110, or unload the container 20 located in the load port 110 from the load port 110.

[0088] The index chamber 130 may be disposed between the load port 110 and the process performing part 300. That is, the load port 110 may be connected to the index chamber 130. The inside of the index chamber 130 may be maintained at atmospheric pressure.

[0089] In addition, a first transfer robot 150 may be disposed in the index chamber 130. The first transfer robot 150 may transfer the substrate "W" and the ring member "R" between the container 20 disposed in the load port 110, the load lock chamber 310 (to be described below), and the alignment chamber 170. In addition, the first transfer robot 150 may have a first transfer hand 152. Fig.10 As shown, a plurality of first support pads 153 may be provided on the upper surface of the first conveying hand 152. For example, three first support pads 153 may be provided, and the conveying target object located on the first conveying hand 152 may be supported at three points. The first support pads 153 may prevent the substrate "W" or the annular bracket 30 located on the first conveying hand 152 from sliding. When viewed from the top, the first support pads 153 may be arranged along the circumferential direction of an imaginary circle having a radius. In addition, the first conveying hand 152 may have a size by which it can easily enter the above-mentioned container 20. In addition, as Fig.11 As shown, the substrate "W" can be positioned on the first transfer hand 152, and as shown in FIG. Fig.12 As shown, an annular bracket 30 supporting an annular member "R" may be positioned.

[0090] An alignment chamber 170 (to be described below) provided with an alignment unit 200 may be installed at one side and / or an opposite side of the index chamber 130. The substrate "W" or the ring bracket 30 may be aligned in the alignment chamber 170. Fig.13 It shows that the setting Figure 1 The alignment unit in the alignment chamber is shown in Figure 1. Fig.13 , the alignment unit 200 disposed in the alignment chamber 170 may align the substrate "W". For example, the alignment unit 200 may align the direction of the notch "N" formed in the substrate "W". In addition, the alignment unit 200 may align the direction of the alignment hole 33 formed in the annular bracket 30.

[0091] The alignment unit 200 may include a chuck 210, a support mechanism 220, an irradiation part 230, and a light receiving part 240. The chuck 210 may support the central area of ​​the substrate "W". The chuck 210 may support the substrate "W" in a vacuum adsorption manner. Different from this, a pad to prevent the target support object from sliding may be provided on the upper surface of the chuck 210. The chuck 210 may rotate the substrate "W".

[0092] The supporting mechanism 220 may support the irradiation component 230 and the light receiving component 240. The irradiation component 230 may irradiate light "L" in a direction from the upper side to the lower side of the substrate "W" supported by the chuck 210. The light "L" may be a laser beam having a specific width. The light receiving component 240 may be disposed to face the irradiation component 230. For example, the light receiving component 240 may be disposed on an irradiation path of the light "L" irradiated by the irradiation component 230. The chuck 210 may rotate the substrate "W" until the light "L" irradiated by the irradiation component 230 reaches the light receiving component 240 through the notch "N" formed in the substrate "W". When the light receiving component 240 receives the light "L", the chuck 210 stops the rotation of the substrate "W" and the alignment of the substrate "W" may be completed.

[0093] like Fig.14 As shown, the alignment unit 200 can align the annular bracket 30, similar to the above-mentioned scheme of aligning the substrate "W". As described above, the alignment hole 33 is formed in the annular bracket 30. When the annular bracket 30 is positioned on the chuck 210, the chuck 210 can rotate the annular bracket 30 until the light "L" irradiated by the irradiation part 230 reaches the light receiving part 240 through the alignment hole 33 formed in the annular bracket 30. When the light receiving part 240 receives the light "L", the chuck 210 stops the rotation of the annular bracket 30, and the alignment of the annular bracket 30 can be completed. As described above, because the position where the alignment hole 33 is formed may overlap with the position where the notch "N" is formed, the annular bracket 30 and the substrate "W" can be aligned by using the same alignment unit 200.

[0094] Fig.14 The annular bracket 30 is shown as an example of an aligned state in which the annular member "R" is located on the annular bracket 30, but the present disclosure is not limited thereto. If necessary, the annular bracket 30 may be aligned to a state in which the annular member "R" is not located on the annular bracket 30, such as Fig.15 shown.

[0095] Reference again Figure 1 , the process performing part 300 may include a load lock chamber 310 , a transfer chamber 330 , a second transfer robot 350 , and a process chamber 370 .

[0096] The load lock chamber 310 may be disposed between the index chamber 130 and the transfer chamber 330. As described above, the internal air pressure of the index chamber 130 may be maintained at atmospheric pressure. As will be described later, the internal air pressure of the transfer chamber 330 may be maintained at vacuum pressure. The load lock chamber 310 may be disposed between the index chamber 130 and the transfer chamber 330, and its internal air pressure may be varied between atmospheric pressure and vacuum pressure.

[0097] Fig.16 It is shown Figure 1 A plan view of the load lock chamber. Fig.16 , the load lock chamber 310 may include a housing 311 and a support shelf 320 .

[0098] The housing 311 may have an internal space 312. The housing 311 may have an internal space 312, in which the substrate "W" or the annular member "R" is located. The housing 311 may be disposed between the indexing chamber 130 and the transfer chamber 330 described above. In addition, the housing 311 may have an opening. A plurality of openings may be disposed in the housing 311. For example, a first opening 311a in the opening may be selectively communicated with the indexing chamber 130 through a gate valve (not shown). In addition, a second opening 311b in the opening may be selectively communicated with the transfer chamber 330 through a gate valve (not shown).

[0099] In addition, the housing 311 may be provided with a vent 313 through which exhaust gas is supplied to the internal space 312 of the housing 311. In addition, the housing 311 may have a pressure relief hole that reduces the pressure in the internal space 312 of the housing 311. The exhaust gas may be an inert gas. For example, the exhaust gas may be a gas including nitrogen, argon, etc. However, the present disclosure is not limited thereto, and the exhaust gas may be various known inert gases. In addition, the pressure relief hole 314 may be connected to a pressure relief member (not shown). The pressure relief member may be a pump. However, the present disclosure is not limited thereto, and the pressure relief member may be variously modified to a known device that reduces the pressure of the internal space 312. Since the vent 313 and the pressure relief hole 314 are formed in the housing 311, the pressure of the internal space of the housing 311 may be freely varied between atmospheric pressure and vacuum pressure.

[0100] The support shelf 320 may be disposed in the inner space 312. The support shelf 320 may support the substrate "W" or the ring-shaped member "R" in the inner space 312. In addition, the diameter of the ring-shaped member "R" may be greater than the diameter of the substrate "W".

[0101] One or more support shelves 320 may be provided. For example, a plurality of support shelves 320 may be provided. Three support shelves 320 may be provided. When viewed from the top, the support shelves 320 may be arranged to be spaced apart from each other. When viewed from the top, the support shelves 320 may be arranged at a position overlapping with the opening 32 formed in the above-mentioned annular bracket 30. For example, when viewed from the top, the support shelf 320 may be arranged at a position overlapping with the opening 32 formed in the annular bracket 30, and the direction of the annular bracket 30 is aligned by the alignment unit 200. In addition, when viewed from a cross section of the support shelf 320, the support shelf 320 may have a substantially inverted "L" shape.

[0102] In addition, the support shelf 320 may include a first pad 324 and a second pad 326. The first pad 324 and the second pad 326 may be formed of a material having anti-friction properties against the substrate "W" or the annular member "R". For example, the first pad 324 and the second pad 326 may be formed of polyetheretherketone (PEEK) filled with carbon. However, the embodiment in which PEEK filled with carbon is used as the material of the first pad 324 and the second pad 326 is merely an example, and various modifications may be made using other known materials having similar properties.

[0103] When viewed from the top, the first pad 324 may have a substantially arc shape. The first pad 324 may be disposed closer to the pressure relief hole 314 than the second pad 326. When viewed from the top, the first pad 324 may be disposed on the inner side of the outer periphery of the substrate "W". That is, as Fig.17As shown, among the substrate “W” and the ring member “R”, the first pad 324 may support the substrate “W”.

[0104] When viewed from the top, the second pad 326 may have a substantially arc shape. The second pad 326 may be disposed further away from the pressure relief hole 314 than the first pad 324. When viewed from the top, the second pad 326 may be disposed outside the outer periphery of the substrate "W" and the inner periphery of the annular member "R", and may be disposed inside the outer periphery of the annular member "R". That is, in the substrate "W" and the annular member "R", the second pad 326 may support the annular member "R".

[0105] In addition, when viewed from the top, the support shelf 320 may be disposed at a position overlapping the opening 32 formed in the above-mentioned annular bracket 30. Fig.18 As shown, when the first transfer hand 152 carries the annular bracket 30 with the annular member "R" placed thereon into the load lock chamber 310 and the first transfer hand 152 moves downward, the annular member "R" is positioned on the support shelf 320, and the annular bracket 30 can move downward while being placed on the first transfer hand 152. Thereafter, as shown in FIG. Fig.19 As shown, when the first transfer hand 152 is retracted, the annular bracket 30 may be separated from the annular member “R” and taken out of the load lock chamber 310 .

[0106] Reference again Figure 1 , the transfer chamber 330 may be disposed between the load lock chamber 310 and the process chamber 370. The internal air pressure of the transfer chamber 330 may be maintained in a vacuum pressure. The second transfer robot 350 may be disposed in the transfer chamber 330. The second transfer robot 350 may transfer the substrate "W" and the ring member "R" between the load lock chamber 310 and the process chamber 370. In addition, the second transfer robot 350 may have a second transfer hand 352.

[0107] Fig. 20 It is shown Figure 1 The appearance of the second teleporter. Fig. 20 , the size of the second transfer hand 352 of the second transfer robot 350 can be larger than the size of the first transfer hand 152. A pair of first transfer pads 353, a pair of second transfer pads 354, a pair of third transfer pads 355, and a pair of fourth transfer pads 356 can be set on the second transfer hand 352. The second transfer pad 354 and the third transfer pad 355 can be set between the first transfer pad 353 and the fourth transfer pad 356. When viewed from the top, the second transfer pad 354 and the third transfer pad 355 can be set on the inner side of the outer periphery of the substrate "W". That is, as Fig.21As shown, in the substrate "W" and the annular member "R", the second transfer pad 354 and the third transfer pad 355 can support the substrate "W". When viewed from the top, the first transfer pad 353 and the fourth transfer pad 356 can be disposed outside the outer periphery of the substrate "W" and the inner periphery of the annular member "R", and can be disposed inside the outer periphery of the annular member "R". That is, in the substrate "W" and the annular member "R", the second pad 326 can support the annular member "R".

[0108] Reference again Figure 1 , one or more process chambers 370 may be connected to the transfer chamber 330. The process chamber 370 may be a chamber that performs a process on the substrate "W". The process chamber 370 may be a liquid processing chamber that processes the substrate "W" by supplying a processing liquid to the substrate "W". In addition, the process chamber 370 may be a plasma chamber that processes the substrate "W" by using plasma. In addition, some process chambers 370 may be liquid processing chambers that process the substrate "W" by supplying a processing liquid to the substrate "W", and some process chambers 370 may be plasma chambers that process the substrate "W" by using plasma. However, the present disclosure is not limited thereto, and the substrate processing process performed in the process chamber 370 may be modified variously to a known substrate processing process. In addition, when the process chamber 370 is a plasma chamber that processes the substrate "W" by using plasma, the plasma chamber may be a chamber that performs an etching or ashing process that removes a thin film on the substrate "W" by using plasma. However, the present disclosure is not limited thereto, and the plasma processing process performed in the process chamber 370 may be modified variously to a known plasma processing process.

[0109] Fig.23 It shows that the setting Figure 1 A view of a substrate handling device in a process chamber. Fig.23 , the substrate processing apparatus 500 disposed in the process chamber 370 will be described in detail. The substrate processing apparatus 500 may process the substrate "W" by transferring plasma to the substrate "W".

[0110] The substrate processing apparatus 500 may include a processing container 510 , a gate valve 520 , an exhaust line 530 , a power supply unit 540 , a support unit 550 , a first lift pin module 560 , a second lift pin module 570 , a baffle 580 , and a gas supply unit 590 .

[0111] The processing container 510 may have a processing space. The processing container 510 may be grounded. The processing container 510 may provide a processing space in which a substrate "W" is processed. When the substrate "W" is processed, the processing space of the processing container 510 may be substantially maintained at a vacuum pressure. An inlet 512 may be formed on one side of the processing container 510, through which a substrate "W" or an annular member "R" is brought in and taken out. The gate valve 520 may selectively open and close the inlet 512.

[0112] The exhaust hole 514 may be formed on the bottom surface of the processing container 510. An exhaust line 530 may be connected to the exhaust hole 514. The exhaust line 530 may discharge the process gas, process byproducts, etc. supplied to the processing space of the processing container 510 to the outside of the processing container 510 through the exhaust hole 514. In addition, an exhaust plate 532 that allows the processing space to be exhausted more uniformly may be provided at the upper portion of the exhaust hole 514. The exhaust plate 532 may substantially have an annular shape when viewed from the top. In addition, at least one exhaust hole may be formed in the exhaust plate 532. The operator may select an exhaust plate 532 that can exhaust the processing space uniformly from a plurality of exhaust plates 532 having various shapes and sizes and install the exhaust plate 532 at the upper portion of the exhaust hole 514.

[0113] In addition, the processing container 510 may further include a support member 516. The support member 516 may support at least a portion of a susceptor included in a support unit 550, which will be described below. For example, the support member 516 may be configured to support a lower portion of an isolation plate 554 included in the support unit 550.

[0114] The power supply unit 540 may generate RF power, which excites the process gas supplied by the gas supply unit 590 into a plasma state, which will be described below. The power supply unit 540 may include a power supply 542 and a matcher 544. The power supply 542 and the matcher 544 may be installed on a power transmission line. In addition, the power transmission line may be connected to the chuck 552.

[0115] The support unit 550 supports the substrate “W” in the processing space of the processing container 510. The support unit 550 may include a chuck 552, an isolation plate 554, and a quartz ring 556.

[0116] The chuck 552 may have a supporting surface that supports the substrate "W". The chuck 552 may support the substrate "W" and may suck the supported substrate "W". For example, an electrostatic plate (not shown) may be provided in the chuck 552, and the chuck 552 may be an electrostatic chuck that sucks the substrate "W" by using an electrostatic force. For example, the chuck 552 may be an electrode electrostatic chuck (ESC). However, the present disclosure is not limited thereto, and the chuck 552 may suck the substrate "W" in a vacuum suction scheme.

[0117] When viewed from the top, the isolation plate 554 may have a circular shape. The above-mentioned chuck 552 and a quartz ring 556 to be described below may be positioned on the isolation plate 554. The isolation plate 554 may be a dielectric body. For example, the isolation plate 554 may be formed of a material including ceramics.

[0118] The quartz ring 556 may be formed of a material including quartz. When viewed from the top, the quartz ring 556 may substantially have an annular shape. When viewed from the top, the quartz ring 556 may substantially have a shape surrounding the chuck 552. When viewed from the top, the quartz ring 556 may have a shape surrounding the substrate "W" supported by the chuck 552. In addition, an annular member "R" (e.g., a focus ring) may be positioned on an upper surface of the inner side of the quartz ring 556.

[0119] When viewed from the top, the annular member "R" located on the upper surface of the quartz ring 556 may have an annular shape. The annular member "R" may have a shape in which the height of the upper surface on the inner side is lower than the height of the upper surface on the outer side. The lower surface of the peripheral area of ​​the substrate "W" may be located on the upper surface on the inner side of the annular member "R". In addition, the annular member "R" may have an inclined surface that is inclined upward from the center of the substrate "W" between the inner upper surface and the outer upper surface of the substrate "W" in a direction facing the outer side of the substrate "W". Therefore, even when the substrate "W" is positioned on the upper surface on the inner side of the annular member "R", the position of the substrate "W" is quite inaccurate, while the substrate "W" slides along the inclined surface of the annular member "R", the substrate "W" can also be properly positioned on the upper surface or inner side of the annular member "R".

[0120] The first lifting pin module 560 may lift the annular member "R" located on the upper surface of the quartz ring 556. The first lifting pin module 560 may include a first lifting pin 562 and a first pin driving part 564. A plurality of first lifting pins 562 may be provided, and a plurality of first pin driving parts 564 that move the first lifting pins 562 upward and downward may be provided. In addition, when viewed from the top, the first lifting pins 562 may be provided so as not to overlap with the chuck 552. The lifting pins 562 may move upward and downward along the pin holes formed in the isolation plate 554 and / or the quartz ring 556. In addition, the pin driving part 564 may be a cylinder using air pressure or hydraulic pressure, or a motor.

[0121] The second lifting pin module 570 may lift the substrate "W". The second lifting pin module 570 may include a second lifting pin 572, an elevating plate 574, and a second pin driving member 576. The second lifting pin 572 may be coupled to the elevating plate 574. The elevating plate 574 may be moved upward and downward by the second pin driving member 576.

[0122] The baffle plate 580 may be disposed at an upper portion of the support unit 550. The baffle plate 580 may be formed of an electrode material. At least one baffle hole 582 may be formed in the baffle plate 580. For example, a plurality of baffle holes 582 may be formed and may be uniformly formed in the entire region of the baffle plate 580 when viewed from the top. The baffle plate 580 allows the process gas supplied by the gas supply unit 590 to be uniformly delivered to the substrate "W", which will be described below.

[0123] The gas supply unit 590 may supply a process gas into a processing space of the processing container 510. The process gas may be a gas excited into a plasma state by a power supply unit 540 to be described below. The gas supply unit 590 may include a gas supply source 592 and a gas supply line 594. One end of the gas supply line 594 may be connected to the gas supply source 592, and the opposite end of the gas supply line 594 may be connected to an upper portion of the processing container 510. Therefore, the process gas delivered by the gas supply source 592 may be supplied to an upper region of the baffle 580 through the gas supply line 594. The process gas supplied to the upper region of the baffle 580 may be introduced into the processing space of the processing container 510 through the baffle hole 582.

[0124] Reference again Figure 1, the controller 700 may control the substrate processing apparatus 10. The controller 700 may control the indexing part 100 and the process execution unit 300. The controller 700 may control the first transfer robot 150 and the second transfer robot 350. The controller 700 may control the substrate processing apparatus 500 disposed in the process chamber 370 so that the substrate "W" may be processed in the process chamber 370 by using plasma. In addition, the controller 700 may control the configuration of the substrate processing apparatus 10 so that the substrate processing apparatus 10 may perform a transfer method for transferring the ring member "R" which will be described below.

[0125] In addition, the controller 700 may include a process controller, which includes a microprocessor (computer) that performs control of the substrate processing device 10, a keyboard for inputting commands to allow an operator to manage the substrate processing device 10, a user interface including a display that visualizes and displays the operation of the substrate processing device 10, and a memory unit for storing a control program for a process performed by the substrate processing device 10 under the control of the process controller or a program for executing a process (i.e., a process recipe in an element according to various data and processing conditions). In addition, the user interface and the storage unit may be connected to the process controller. The process recipe may be stored in a memory medium of the memory unit, and the memory medium may be a hard disk, and may be a removable disk such as a CD-ROM, a DVD, or a semiconductor memory such as a flash memory.

[0126] Hereinafter, a method for transferring the ring member "R" according to an embodiment of the present disclosure will be described. In detail, a transfer sequence of transferring an unused ring member "R" to the process chamber 370 will be described.

[0127] When the replacement cycle of the ring member "R" mounted on the process chamber 370 is reached, the OHT equipment may transfer the second container 22 to the loading port 110. When the second container 22 is transferred to the loading port 110, the first transfer robot 150 may take the ring-shaped bracket 30 accommodated in the second container 22 out of the second container 22 by using the first transfer hand 152. Then, the direction of the ring-shaped bracket 30 may be accommodated in the second container 22 while being aligned. When it is necessary to align the direction of the ring-shaped bracket 30, the first transfer robot 150 may transfer the ring-shaped bracket 30 to the alignment chamber 170, and the alignment unit 200 may align the ring-shaped bracket 30 in a state in which the ring member "R" is not located on the ring-shaped bracket 3.

[0128] Thereafter, the first conveying hand 152 may enter the second container 22 in a state in which the first conveying hand 152 supports the annular bracket 30. When the first hand 152 completely enters the second container 22, the first conveying hand 152 may move upward to position the unused annular member "R" contained in the second container 22 on the annular bracket 30. Then, the annular member "R" may be in a state in which the direction of the annular member is aligned by the positioning pin 22b in the second container. Therefore, the annular member "R" may be positioned on the annular bracket 30 in a state in which the direction of the annular member is aligned.

[0129] When the annular member “R” is located on the annular bracket 30, the annular bracket 30 may be transferred to the alignment chamber 170, and the direction of the annular bracket may be aligned by the alignment unit 200. After the direction of the annular bracket 30 in a state in which the annular member “R” is positioned is aligned by the alignment unit 200, the first transfer robot 150 may transfer the annular bracket 30 in a state in which the annular member “R” is positioned on the annular bracket to the load lock chamber 310.

[0130] When the first transfer hand 152 completely enters the load lock chamber 310, the first transfer hand 152 may move downward. Therefore, the annular member "R" on the annular bracket 30 may be located on the support shelf 320, and the annular bracket 30 may be separated from the annular member "R". When the annular bracket 30 is separated from the annular member "R", it may be taken out of the load lock chamber 310. The annular member "R" located on the support shelf 320 of the load lock chamber 310 may be taken out by the second transfer hand 352 of the second transfer robot 350 and transferred to the process chamber 370.

[0131] The used ring members “R” in the process chamber 370 are taken out in the reverse order to the above-described carrying-in order of the unused ring members “R”, and a repeated description thereof will be omitted.

[0132] Hereinafter, a sequence of aligning the ring member "R" according to an embodiment of the present disclosure will be described. Fig.24 is a flowchart showing the sequence of aligning the position of the ring member according to an embodiment of the present disclosure. As described above, when the ring member "R" has been completely transferred into the process chamber 370, a substrate-type sensor (e.g., a visual wafer VW with an image acquisition module, such as a camera) contained in a third container 23 may be transferred into the process chamber, and the third container is any one of the containers 20. The third container 23 may be transferred to the load port 110 by an overhead transport (OHT) device.

[0133] When the substrate type sensor VW is transferred to the process chamber 370, the substrate type sensor VW may capture an image including the annular member "R" and the chuck 552 disposed in the process chamber 370. The captured image may be transferred to the controller 700. When the image is transferred to the controller 700, the substrate type sensor VW may be taken out from the process chamber 370. Thereafter, the controller 700 may measure the interval between the annular member "R" and the chuck 552 based on the image received from the substrate type sensor VW. For example, Fig.25 As shown, when the interval "G" between the ring member "R" and the chuck 552 is constant, the controller 700 determines that the ring member "R" has been transferred to the preset position. In this case, the substrate "W" is started to be processed in the process chamber 370. Fig.26 As shown, when the interval between the annular member "R" and the chuck 552 includes a first interval G1 and a second interval G2 different from the first interval G1, it can be determined that the annular member "R" is not correctly transferred to the preset position, and the second transfer robot 350 can perform the alignment (centering) of the annular member "R" again. If necessary, based on the deformation value obtained by the first interval G1 and the second interval G2, the transfer operation of the first transfer robot 150 and the second transfer robot 350 can be taught. When the alignment is correctly performed, the substrate "W" is started to be processed in the process chamber 370. Different from this, when the alignment is not correctly performed, the substrate type sensor VW can be transferred to the process chamber 370 again. Thereafter, the controller 700 can determine whether the position of the annular member "R" is the preset position through the image acquired again by the substrate type sensor VW. When the position of the annular member "R" deviates from the preset range, the controller 700 can generate an alarm so that the operator can recognize it.

[0134] A container according to an embodiment of the present disclosure that can charge a substrate type sensor VW will be described below. The container 20 that can charge a substrate type sensor VW (to be described below) may be a third container 23 in the container 20 that accommodates the substrate type sensor VW.

[0135] Fig. 27 It is shown Figure 1 A cross-sectional view of a third container. Fig.28 When viewed from the top Fig. 27 A view of the charging module. Fig. 27 and Fig.28 The third container 23 according to the embodiment of the present disclosure may accommodate the substrate type sensor VW. The third container 23 may accommodate the substrate type sensor VW and may charge the accommodated substrate type sensor VW.

[0136] The third container 23 may include a main body 610, a door 620, a head 630, a shelf component 640, a charging module 650, and a battery component 660. The third container 23 may be grasped by a conveying device (such as an OHT device) by the head 630 mounted on the upper side of the main body 610. The main body 610 may have a receiving space 612, one side of which is open. The main body 610 may have a vessel shape, one side of which is open. The above-mentioned substrate type sensor VW may be accommodated in the receiving space 612 of the main body 610. The receiving space 612 of the main body 610 may be opened and closed by the door 620 that selectively closes one side of the main body 610. In addition, an open / close sensor 611 that detects whether the door 620 opens and closes the receiving space 612 may be provided in the main body 610. The open / close sensor 611 may be a magnetic sensor that determines whether the door 620 and the main body 610 are in contact with each other by using magnetism.

[0137] However, the present disclosure is not limited thereto, and the open / close sensor 611 may include an irradiation component that irradiates light and a light receiving component that receives light. In this case, it is possible to detect whether the receiving space 612 is open or closed, depending on whether the light irradiated by the irradiation component is received by the light receiving component. In addition, the type of the open / close sensor 611 is not limited thereto, and it may be variously modified to a known device that can detect whether the door 620 is closed.

[0138] A plurality of shelf members 640 may be disposed in the receiving space 612. Each of the shelf members 640 forms a pair. For example, when the shelf members 640 are viewed from the top, they may support one side and an opposite side of the substrate type sensor VW.

[0139] In addition, a first position sensor 641 may be provided in the shelf member 640 for detecting whether the substrate type sensor VW is located on the shelf member 640. The first position sensor 641 may be a weight sensing sensor. Alternatively, the first position sensor 641 may be an optical sensor. Alternatively, the first position sensor 641 may be a distance sensing sensor. The type of the first position sensor 641 is not limited thereto, and may be variously modified to a known device that can detect whether the substrate type sensor VW is located on the shelf member 640.

[0140] In addition, a second position sensor 642 that can detect the position of the charging component 651 of the charging module 650 can be provided in the shelf part 640. The second position sensor 642 can detect whether the charging component 651, which will be described below, is correctly located at the charging position. The second position sensor 642 can be an optical sensor, a distance sensing sensor, or a magnetic sensor. The type of the second position sensor 642 is not limited thereto, and can be variously modified to a known device that can detect the position of the charging component 651, which will be described below.

[0141] The charging module 650 can receive power from the battery component 660 (an example of a power supply device) and can charge the substrate type sensor VW placed on the shelf component 640. The charging module 650 can charge the substrate type sensor VW in a wireless charging manner. A plurality of charging modules 650 can be provided. For example, the number of charging modules 650 can be the same as the maximum number of substrate type sensors VW that can be accommodated in the receiving space 612. The number of charging modules 650 can be the same as the number of the plurality of shelf components 640. That is, because a plurality of charging modules 650 are provided, a plurality of substrate type sensors VW can be charged at the same time.

[0142] Each of the charging modules 650 may include a charging component 651, a supporting component 652, a guiding component 653, and a driving component 654. The charging component 651 is a component that directly delivers power to a power supply device (e.g., a battery) of the substrate-type sensor VW. For example, the charging component 651 may have a wireless charging coil. The charging component 651 may charge the substrate-type sensor VW in a wireless charging manner, such as in an electromagnetic induction manner. When the charging component 651 charges the substrate-type sensor VW in an electromagnetic induction manner, the substrate-type sensor VW may be quickly charged, and due to the characteristics of the electromagnetic induction manner, the charging component 651 may become smaller, whereby the standard of the signal transmission / reception coil may be different.

[0143] The charging component 651 can be moved between a standby position (an example of a first position) and a charging position (an example of a second position) by a supporting component 652, a guiding component 653, and a driving component 654. The standby position may be a position away from one side of the main body 610, which is opened and closed by the door 620. For example, when one side of the main body 610 is the front side and one side corresponding to one side of the main body 610 is the rear side, the standby position may be a position closer to the rear side than the front side of the main body 610. When the charging component 651 is in the standby position, even when the first conveying hand 152 enters the receiving space 612, the first conveying hand 152 does not collide with the charging component 651. The charging position may be a position closer to the front side of the main body 610 than the standby position. The charging position may be a position suitable for charging the substrate type sensor VW. The charging position may be a position where the charging component 651 can start charging the substrate type sensor VW.

[0144] In the inner wall of the body 610, a guide member 653 may be provided on a side wall of the body 610. The guide member 653 may be a guide rail that may guide the movement of the charging member 651 in one direction parallel to the upper surface or the lower surface of the substrate type sensor VW supported by the shelf member 640. The supporting member 652 may be coupled to the charging member 651 and may have a bar shape, whereby the supporting member 652 may move along the guide member 653. The driving member 654 may generate a driving force for moving the charging member 651 coupled to the supporting member 652 in one direction along the guide member 653.

[0145] The driving component 654 may include a driving source 654a, a driving transfer source 654b and an arm 654c. The driving source 654a may generate a driving force. The driving source 654a may be a motor. The arm 654a may receive a driving force from the driving source 654a. The arm 654a may be a pantograph. The arm 654a may have a structure that can expand and contract. The arm 654a may be connected to the charging component 651. The arm may receive a driving force generated by the driving transfer source 654b through the medium of the driving transfer source 654c. The driving transfer source 654b may be a lead screw. The type of the driving transfer source 654c that transmits the driving force generated by the driving transfer source 654b to the arm 654a is not limited to a lead screw, and may be modified differently to a known device that can transmit a driving force.

[0146] Fig.29 It shows that the setting Figure 1 View of the housing, base assembly, and charging unit in the loading port of FIG. Fig.30 When viewed from the top Fig.29 View of the loading port in the . Fig.29 and Fig.30, the loading port 110 may include a base part 111 and a shell 116. The base part 111 may be provided on the upper side of the shell 116. The container 20 may be positioned on the base part 111. The above-mentioned third container 23 may be located on the base part 111. The base part 111 may be provided with a positioning pin 112. The positioning pin 112 may align the position of the third container 23 located in the loading port 110. For example, three positioning pins 112 may be provided so that the position of the third container 23 may be aligned at three points. In addition, the alignment pin 112 may be inserted into an alignment recess, which may be formed in the body 610 of the third container 23. When viewed from the top, the alignment recess formed in the body 610 may be formed at a position corresponding to the alignment pin 112. The shell 116 may have an internal space 117. Components that may be included in the charging unit may be provided in the internal space 117.

[0147] The charging unit can charge the battery component 660 in a wireless charging manner, and the battery component is a power supply device installed in the third container 23. The charging unit may include a signal transmission member 113, a conversion member 114, a switch member 115, and a detection member 118. The signal transmission member 113 may be provided on the base member 111. The signal transmission member 113 may be provided to the base member 111 to transmit power to the battery component 660. The conversion member 114 may be provided between the external power line PL and the signal transmission member 113. The conversion member 114 may be a power supply device provided between the signal transmission member 113 and the external power line PL to convert the AC power delivered by the external power line PL into DC power. For example, the conversion member 114 may be a converter.

[0148] The switch member 115 may be provided between the conversion member 114 and the signal transmission member 113. The switch member 115 may allow power transmitted by the external power line PL to be selectively transmitted to the signal transmission member 113. For example, the switch member 115 may allow power obtained by converting AC power into DC power using the conversion member to be selectively transmitted to the signal transmission member 113. The switch member 115 may be a relay device.

[0149] The detection member 118 may be provided to the base part 111. The detection member 118 may be provided to the base part 111 to detect whether the container 20 (e.g., the third container 23) is placed on the base part 111. The detection member 118 may be in the form of a weight sensor. However, the present disclosure is not limited thereto, and the detection member 118 may be an optical sensor using light. In addition, the detection member 118 may be a distance sensing sensor using a magnet. In addition, the detection member 118 may be variously modified to a known device that can detect whether the container 20 is placed on the base part 111.

[0150] When the detection member 118 detects that the third container 23 is placed on the base part 111, the switch member 115 may be turned on so that the power of the external power line PL is delivered to the signal transmission member 113. The controller 700 may generate a control signal for turning on the switch member 115. In contrast, when the detection member 118 does not detect that the third container 23 is placed on the base part 111, the switch member 115 may be turned off so that the power of the external power line PL delivered to the signal transmission member 113 is interrupted. The controller 700 may generate a control signal for turning off the switch member 115.

[0151] As described above, the signal transmission member 113 can charge the battery component 660 as a power supply device set in the third container 23 in a wireless charging manner. The battery component 660 can deliver power to the charging module 650 to charge the substrate type sensor VW. Because the signal transmission member 113 charges the battery component 660 in a non-contact manner, the problem of generating a connector short circuit as described above can be minimized. Therefore, it may not be necessary to implement a safety device and / or a protection circuit for preventing a connector short circuit. In addition, in a contact charging method using a connector, the battery component 660 is only started to be charged when the third container 23 must be located in a proper position of the loading port 110 and the battery component 660 of the third container 23 must also be connected to the connector. In this case, even when the position of the third container 23 is slightly misplaced, the charging of the battery component 660 will not start. However, in the present disclosure, because the signal transmission member 113 charges the battery component 660 in a non-contact manner, the battery component 660 can be started to be charged even when the position of the third container 23 is slightly misplaced. Furthermore, since the signal transmission member 113 charges the battery part 660 in a non-contact manner, the degree of freedom of the installation position of the signal transmission member 113 can also be improved.

[0152] Although the battery component 660 of the third container 23 is described in the above example as being charged in the loading port 110, the present disclosure is not limited thereto. Fig.31As shown, the battery component 660 of the third container 23 can be charged in the preservation unit 1000, which can be included in the substrate processing system of the present disclosure. The preservation unit 1000 may include: a base frame 1010, on which the third container 23 can be placed; a signal transmission device 1020, which is installed in the base frame 1010 to transmit power to the battery component 660; a conversion device 1040, which is connected to the external power line PL and is arranged between the signal transmission device 1020 and the external power line PL; and a switch device 1030, which selectively transmits the power of the external power line PL to the signal transmission device 1020. The signal transmission device 1020 may perform the same or similar function as the above-mentioned signal transmission member 113. The conversion device 1040 may perform the same or similar function as the above-mentioned conversion member 114. The switch device 1030 may perform the same or similar function as the above-mentioned switch member 115. Similar to the above-mentioned loading port 110, the preservation unit 1000 can also charge the battery component 660 set in the third container 23 in a non-contact manner.

[0153] Although it has been described in the above example that the substrate type sensor VW is charged while the third container 23 is located in the loading port 110, the present disclosure is not limited thereto. Fig.32 As shown, when the third container 23 is transferred by the transfer device 1100 that may be included in the substrate processing system, the substrate type sensor VW may be charged.

[0154] According to the embodiments of the present disclosure, the power supply device installed in the container can be efficiently charged.

[0155] According to an embodiment of the present disclosure, when a power supply device installed in a container is charged, the occurrence of a short circuit can be minimized.

[0156] The present disclosure can improve the degree of freedom of the installation position of the signal transmission member of the charging unit.

[0157] The effects of the present disclosure are not limited to the above-mentioned effects, and those skilled in the art to which the present disclosure pertains can clearly understand unmentioned effects from the specification and the accompanying drawings.

[0158] The above detailed description illustrates the present disclosure. In addition, the above-mentioned contents describe exemplary embodiments of the present disclosure, and the present disclosure can be used in various other combinations, changes and environments. That is, the present disclosure can be modified and corrected without departing from the scope of the present disclosure disclosed in the specification, the equivalent scope of the written disclosure and / or the technical or knowledge scope of those skilled in the art. The written embodiments describe the best state for implementing the technical spirit of the present disclosure, and various changes required for the detailed application fields and purposes of the present disclosure can be made. Therefore, the detailed description of the present disclosure is not intended to limit the present disclosure in the disclosed embodiment state. In addition, it should be understood that the attached claims include other embodiments.

Claims

1. A substrate processing device, comprising: an indexing component having a load port; as well as a process execution component configured to receive a substrate from the index component and process the substrate, The loading port comprises: a housing having an inner space; a base member provided on an upper side of the housing and on which a container accommodating a substrate type sensor is positioned; and a charging unit configured to charge a power supply device installed in the container in a wireless charging manner, The charging unit further comprises: a signal transmission member disposed in the base member and configured to deliver power to the power supply device, The base component comprises: one or more locating pins configured to align the position of the container positioned on the base member, and wherein the signal transmission member is installed at a position where the signal transmission member does not overlap the positioning pin when viewed from the top, The container further comprises: a main body having a receiving space, one side of the receiving space being open; a door configured to selectively open and close the receiving space; a shelf member configured to support the substrate-type sensor in the receiving space; a power supply device configured to deliver power for charging the substrate-type sensor; and a charging module configured to charge the substrate-type sensor supported by the shelf member, and The charging module charges the substrate-type sensor supported by the shelf member in an electromagnetic induction manner.

2. The substrate processing apparatus according to claim 1, wherein the charging unit further comprises: a conversion member disposed in the internal space and disposed between an external power line and the signal transmission member; as well as A switch member is configured to selectively transmit power from the external power line to the signal transmission member. 3 . The substrate processing apparatus according to claim 2 , wherein the conversion member converts AC power transmitted by the external power line into DC power.

4. The substrate processing apparatus according to claim 2, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member detects that the container is placed on the base component, the switch member is turned on so that the power of the external power line is transmitted to the signal transmission member.

5. The substrate processing apparatus according to claim 2, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member does not detect that the container is placed on the base component, the switch member is turned off, so that the power of the external power line supplied to the signal transmission member is interrupted.

6. A substrate processing system, comprising: an indexing component having a load port; a process execution component configured to receive a substrate from the index component and process the substrate; as well as a container located in the load port and configured to receive a substrate type sensor transported to the process execution component, The container further comprises: a main body having a receiving space, one side of the receiving space being open; a door configured to selectively open and close the receiving space; a shelf member configured to support the substrate-type sensor in the receiving space; a power supply device configured to deliver power for charging the substrate-type sensor, and a charging module configured to charge the substrate-type sensor supported by the shelf member, and The loading port comprises: a housing having an inner space; a base member provided on an upper side of the housing and on which a container accommodating a substrate type sensor is positioned; and a charging unit configured to charge a power supply device installed in the container in a wireless charging manner, The charging module charges the substrate-type sensor supported by the shelf member in an electromagnetic induction manner.

7. The substrate processing system according to claim 6, wherein the charging unit comprises: a signal transmission member disposed in the base member and configured to deliver power to the power supply device; a conversion member disposed in the internal space and disposed between an external power line and the signal transmission member; as well as A switch member is configured to selectively transmit power from the external power line to the signal transmission member. 8 . The substrate processing system according to claim 7 , wherein the converting member converts AC power transmitted by the external power line into DC power.

9. The substrate processing system according to claim 7, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member detects that the container is placed on the base component, the switch member is turned on so that the power of the external power line is transmitted to the signal transmission member.

10. The substrate processing system according to claim 7, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member does not detect that the container is placed on the base component, the switch member is turned off, so that the power of the external power line supplied to the signal transmission member is interrupted.

11. The substrate processing system according to claim 6, wherein a plurality of shelf assemblies and a plurality of charging modules are provided.

12. The substrate processing system according to claim 7, further comprising: a storage unit configured to store the container, The storage unit comprises: a base frame on which the container is positioned; a signal transmission device mounted in the base frame and configured to deliver power to the power supply device; a conversion device, the conversion device being disposed between the external power line and the signal transmission device; and A switch device is configured to selectively transmit power from the external power line to the signal transmission device.

13. A substrate processing system, comprising: an indexing chamber, the interior of which is maintained at atmospheric pressure and is provided with a first transfer robot; an indexing component having a load port connected to the indexing chamber; a load lock chamber connected to the index chamber, the interior of the load lock chamber being switched between a vacuum pressure and the atmospheric pressure; a transfer chamber connected to the load lock chamber and provided with a second transfer robot; a process chamber connected to the transfer chamber and configured to process a substrate; and a container located in the load port and configured to receive a substrate-type sensor that collects a transfer position of a consumable component transferred to the process chamber, and The loading port comprises: a housing having an inner space; a base member disposed on an upper side of the housing and on which the container is positioned; and a charging unit configured to charge a power supply device installed in the container in a wireless charging manner, The container further comprises: a main body having a receiving space, one side of the receiving space being open; a door configured to selectively open and close the receiving space; a shelf member configured to support the substrate-type sensor in the receiving space; a power supply device configured to deliver power for charging the substrate-type sensor; and a charging module configured to charge the substrate-type sensor supported by the shelf member, and The charging module charges the substrate-type sensor supported by the shelf member in an electromagnetic induction manner.

14. The substrate processing system according to claim 13, wherein the charging unit further comprises: a signal transmission member disposed in the base member and configured to deliver power to the power supply device; a conversion member disposed in the internal space and disposed between an external power line and the signal transmission member; as well as A switch member is configured to selectively transmit power from the external power line to the signal transmission member.

15. The substrate processing system according to claim 14, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member detects that the container is placed on the base component, the switch member is turned on so that the power of the external power line is transmitted to the signal transmission member.

16. The substrate processing system according to claim 14, wherein the charging unit further comprises: a detection member configured to detect whether the container is placed on the base member, and When the detection member does not detect that the container is placed on the base component, the switch member is turned off, so that the power of the external power line supplied to the signal transmission member is interrupted.

17. The substrate processing system according to any one of claims 13 to 16, wherein the consumable component is an annular member disposed in the process chamber, The system further comprises: Controller, The controller is configured as follows: controlling the first transfer robot and the second transfer robot so that the consumable component is transferred into the process chamber; as well as controlling the first transfer robot and the second transfer robot so that the substrate-type sensor is transferred into the process chamber, wherein the substrate-type sensor acquires an image including the consumable component and a chuck disposed in the process chamber to support the substrate, and transmits the image to the controller, and The controller measures a spacing between the consumable component and the chuck in the image and determines whether the consumable component is aligned by the measured spacing.

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